CN1244147C - Socket for semiconductor package - Google Patents
Socket for semiconductor package Download PDFInfo
- Publication number
- CN1244147C CN1244147C CN 02812054 CN02812054A CN1244147C CN 1244147 C CN1244147 C CN 1244147C CN 02812054 CN02812054 CN 02812054 CN 02812054 A CN02812054 A CN 02812054A CN 1244147 C CN1244147 C CN 1244147C
- Authority
- CN
- China
- Prior art keywords
- socket
- semiconductor package
- mounting panel
- main body
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Abstract
A socket (10) for a semiconductor package having a plurality of solder balls (S) at its bottom surface. The socket (10) includes a socket body having a plurality of contacts (11) arranged in a shape to correspond in arrangement to the solder balls (S) of the semiconductor package. Each of the contacts (11) has a first and second contact piece contactable with the corresponding solder ball (S) while clamping the corresponding solder ball (S) from both side. The socket (10) includes a placing plate (13) capable of moving between a first position and a second position. The first, or semiconductor placing, position is where the semiconductor package is placed on the placing plate (13) without contact of the solder balls (S) of the semiconductor package with the first and second contact pieces, and the second, or contact, position is where the solder balls (S) of the placed semiconductor package are contactable with the corresponding first and second contact pieces.
Description
Technical field
The present invention relates to a kind of socket that uses with semiconductor package, specifically, relate to and a kind ofly can test and assess semi-conductive socket fast with a plurality of soldered balls.
Background technology
As correlation technique, the semi-conductive socket of the soldered ball with a plurality of grid that shows among Figure 13 is available.This testing evaluation has a plurality of terminals 301 that are arranged in grid shape with socket 300, the layout of the soldered ball S of the corresponding semiconductor package 350 of these terminals; A socket main body 302 that is equipped with each terminal 301; And a mounting panel 303, place semiconductor package 350 on it.The front end of each terminal 301 has first and second contact chips 304,305, is used for contacting with soldered ball S when clamping soldered ball S from the two sides.
In the socket 300 of as above constructing, first and second contact chips 304,305 front end extends on the upper surface (encapsulation plane) of mounting panel 303, therefore when semiconductor package 350 is inserted into, soldered ball S may be by first and second contact chips 304,305 or analog clamp, this causes soldered ball S is placed in difficulty between first contact chip 304 and second contact chip 305.This problem occurs continually, and particularly in the situation of integrated circuit encapsulation, this moment, the arrangement of soldered ball occupied whole grid, and pitch is again little, so not only has been difficult to operation but also has easily caused the terminals of adjacent short circuit.
The problems referred to above can be by joining soldered ball S to first and second contact chips 304 exactly when plug-in unit 350 is inserted into, 305 and be resolved, but accurately engaging, this needs time-consuming operation, can cause other problem, for example be the difficulty that semiconductor package is implemented test and assessment with the immediate mode.
Summary of the invention
The objective of the invention is to, a kind of socket that is used for semiconductor packages is provided, can test fast and assess for semiconductor packages.
Another object of the present invention is to, a kind of socket that is used for semiconductor packages is provided, when semiconductor package is inserted into, can settles soldered ball fast between first contact chip and second contact chip, and can test fast and assess for semiconductor packages.
Briefly, according to as mentioned above, the present invention refers to a socket that is used for semiconductor packages and uses with semiconductor package, and the bottom surface of described semiconductor package has a plurality of soldered balls.Described socket comprises a jack body with a plurality of terminals, and the arrangement of terminal is corresponding to the arrangement of the soldered ball of semiconductor package.Each terminal has one first contact chip and second contact chip, when contacting with corresponding soldered ball when corresponding soldered ball is clamped on the two sides.Described socket comprises a mounting panel, can move between a primary importance and a second place.Described primary importance, perhaps semiconductor installation site is exactly that semiconductor is placed on position on the mounting panel, and this moment, first and second contact chips did not have the soldered ball of contact semiconductor plug-in unit; The described second place, perhaps contact position, the soldered ball of the semiconductor package that places exactly and the corresponding first and second contact chip position contacting.
Adopt as above and arrange, in the semiconductor package installation site, semi-conductive soldered ball does not contact with first and second contact chips, and such layout is possible.Therefore, when semiconductor package is inserted into, soldered ball can be located between corresponding first contact chip and corresponding second contact chip apace, and does not need to be clamped by first and second contact chips, thereby the test of semiconductor package and assessment can be implemented with immediate mode.
Described semiconductor package installation site is set to leave the first and second contact chip certain distances on socket main body (for example semiconductor package socket) short transverse, and this distance is the diameter length corresponding to described soldered ball at least.This arrangement guarantees that when semiconductor package was placed on the mounting panel, soldered ball can not contact first and second contact chips.
The semiconductor package socket can have a socket cover, and this socket cover can move relative to socket main body on the short transverse of socket main body (for example semiconductor package socket); And mobile device, be used for that the short transverse to socket main body (for example semiconductor package socket) moves mounting panel in the mobile mode that is bound up with socket cover between the installation site of semiconductor package and contact position.Adopt as above and arrange, socket cover can use an effective mechanical device or analog to move, thereby the test of semiconductor package and assessment can realize automation.
The semiconductor package socket can have fixture, is used for semiconductor package is fixed on mounting panel, and gets in touch with the mobile phase of socket cover.Adopt such installation,, thereby can reach stable contact owing to floating of semiconductor package can be eliminated.
The semiconductor package socket can have displacement, the socket cover that is used to link move dislocation first and second contact chips.With such installation, use an effective mechanical device or analog to come the mobile socket cover so that first and second contact chips dislocation between the contact position of soldered ball and non-contacting position becomes possibility, so the test of semiconductor package and assessment can realize automation.
Description of drawings
Fig. 1 is the front view that is used for the socket of semiconductor packages of the present invention;
Fig. 2 is the end view that is used for the socket of semiconductor packages of the present invention;
Fig. 3 is the front view that is used for the socket of semiconductor packages of the present invention;
Fig. 4 is the front view that is used for the socket of semiconductor packages of the present invention;
Fig. 5 is the end view that is used for the socket of semiconductor packages of the present invention;
Fig. 6 is the end view that is used for the socket of semiconductor packages of the present invention;
Fig. 7 is used to explain one at the mounting panel 13 of semiconductor packages installation site and the schematic diagram of the relation of the position between each terminal 11;
Fig. 8 is used to explain one at the mounting panel 13 of semiconductor package contact position and the schematic diagram of the relation of the position between each terminal 11;
Fig. 9 is used to explain that semiconductor package is inserted into the process schematic diagram of semiconductor package socket according to the present invention;
Figure 10 is used to explain that semiconductor combinations is inserted into the process schematic diagram of semiconductor package socket according to the present invention;
Figure 11 is used to explain that semiconductor combinations is inserted into the process schematic diagram of semiconductor package socket according to the present invention;
Figure 12 is used to explain that semiconductor combinations is inserted into the process schematic diagram of semiconductor package socket according to the present invention;
Figure 13 is the schematic diagram that is used for explaining the problem that is taken place with the relevant technology of semiconductor package socket of the present invention.
Embodiment
Though the present invention can make multi-form embodiment as shown in drawings, and be described in detail at this, but current announcement for specific embodiment should be understood that it is the illustration of the principle of the invention, and the institute's situation explaining and describe of not really wanting to limit the invention to here.
As illustrated in fig. 1 and 2, socket 10 is configured to a socket that is used for the test and the assessment of semiconductor package 50, and described semiconductor package 50 has a plurality of soldered ball S that are arranged in grid shape at its lower surface.Socket 10 comprises a plurality of terminals 11; A socket main body 12 that is equipped with these terminals 11; A mounting panel (being also referred to as connector) 13 is settled semiconductor package 50 on it; And slide 14.
When slide 14 the short transverse of socket 10 (among Fig. 7 upward to, that mentions later makes progress) move up, the sloping portion 11d of each terminal 11,11c is near the sloping portion 14a of slide 14,14b, thus make win contact portion 11a and the second contact portion 11b move (as shown in Figure 8) to direction near each other.This makes the first and second contact chip 11a and 11b contact soldered ball S in the mode of the soldered ball S that clamps the semiconductor package 50 that is positioned on the mounting panel 13 from the two sides.
Because terminal 11 has spring performance, if slide 14 moves down the syntople of removing with terminal 11, the first and second contact chip 11a and 11b return to their original shapes (as shown in Figure 7).Under this reset condition, the diameter of soldered ball S is arranged to be slightly larger than in the gap between the first contact chip 11a and the second contact chip 11b.
The setting of semiconductor package installation site is upwards left the first and second contact chip 11a, the front end of 11b as shown in Figure 7.The distance of leaving is a length dimension H1 preferably, is equivalent to the minimum diameter dimension of soldered ball S that is.Yet as long as contact chip 11a, 11b does not extend, will still can work less than the size of H1, like this, and when semiconductor is placed on the mounting panel, when socket is positioned at the installation site of semiconductor package, the soldered ball S of semiconductor package and contact chip 11a, 11b contacts.This make to settle semiconductor package 50 and does not need the first and second contact chip 11a of soldered ball S and terminal 11, and 11b contacts becomes possibility.
Between mounting panel 13 and socket main body 12, be provided with one and be in the axially spring that does not illustrate in the drawings of (vertical direction among Fig. 1) compressive state.Mounting panel 13 is pushed upwardly and moves by the power that spring returns to its reset condition.If mounting panel 13 is moved upward a scheduled volume, jointing nail 13b abuts to form the upper end face of the groove 12a in socket main body 12 respectively, further moves up with constraint mounting panel 13, and mounting panel has just stopped like this.This stop position is exactly the semiconductor package installation site.
Four bights of the upper surface of mounting panel 13 are furnished with semiconductor package leader 13c respectively and guide semiconductor package 50 to be inserted into installation surface 13a from the top of socket 10.Semiconductor package leader 13c has an inclined surface 13d who tilts to the installation surface 13a of mounting panel 13, to reach guiding semiconductor package 50 to a precalculated position that encapsulates on the plane.
Be trapped among along with semiconductor package 50 outer under the guiding of at least one inclined surface 13d, the semiconductor package 50 that is inserted into slides to encapsulation plane 13a downwards.In this way, semiconductor package 50 is positioned in the precalculated position of installation surface 13a.
As shown in Figure 7, mounting panel 13 forms a soldered ball embedded hole 13e, and this hole extends through lower surface from installation surface 13a, is left and right directions in the drawings.
As depicted in figs. 1 and 2, slide hoisting mechanism 20 is mainly by socket cover 21, laterally connect 22 and spring 23 constitute.Socket cover 21 is placed to socket main body 12, can move with respect to socket main body 12 in vertical direction.Laterally connection 22 is set at the both sides of mounting panel 14.
Laterally connect 22 and have one group of lever 22a that crosses one another, 22b.Have rotating shaft 22c about center line C1 symmetry at the near-end of lever 22a and 22b, rotating shaft 22C is inserted into the dead eye (not shown) of socket main body 12, each lever 22a like this, and 22b can rotate around corresponding rotating shaft 22c.
The near-end of lever 22a and 22b has slide main body press portion 22d, and is outstanding from side separately in the flange mode, and mutually about center line C1 symmetry.Each slide main body press portion 22d is in abutting connection with the upper surface of slide 14, and with constraint lever 22a, 22b more rotatablely moves.Lever 22a, the front end of 22b have the slide plate part 22e of arc, along the inside upper surface 21a slip of socket cover 21, and mutually about center line C1 symmetry.
Under the state of the slide plate part 22e of lever 22a and 22b, socket cover 21 is added on the socket main body 12 at inside upper surface 21a.
Next, the operation of slide hoisting mechanism 20 is described with reference to Fig. 1 to Fig. 6.
Fig. 1 and Fig. 2 have shown that slide 14 and socket cover 21 are positioned at the situation of their extreme higher position.Leave its extreme higher position when socket cover 21 uses a mechanical device or analog, when moving down in Fig. 1 and Fig. 2, the slipper 22e of lever 22a and 22b slides along the inside upper surface 21a of socket cover 21.Combination therewith, lever 22a and 22b be around rotating shaft 22c rotation, and slide plate main body press portion 22d depresses slide 14 and moves down extreme lower position in the slide 14 to Fig. 1 like this.Fig. 3 and Fig. 5 have shown that slide 14 and socket cover 21 are positioned at the situation of their extreme lower position.Fig. 4 and Fig. 6 have shown that slide 14 and socket cover 21 are in their extreme lower position and the situation between the extreme higher position.
The shifting axle of slide 14 from the extreme higher position to the extreme lower position is to (vertical direction among Fig. 1) compression spring 23, and described spring 23 is arranged between slide 14 and the socket main body 12.If the power of compression socket cover 21 is eliminated, slide 14 is just returned to the upwards promotion of power of its reset condition by spring 23, thereby moves to the extreme higher position.
As depicted in figs. 1 and 2, fixed mechanism 30 mainly is made of 31, one push element 32 of a propeller and a spring 33.
In addition, as mentioned above, since the front end 31c of propeller 31 in abutting connection with the upper surface of mounting panel 13 (if semiconductor package 50 has been mounted, just be meant the upper surface of semiconductor package 50), and attempt makes at equidirectional further rotates, mounting panel 13 moves down in the short transverse of socket 10 (downward direction among Fig. 7, back indication are down) with regard to being pushed down.
If mounting panel 13 is moved downward a scheduled volume, the lower surface of mounting panel 13 has so just retrained mounting panel 13 and has further moved down in abutting connection with a unshowned protuberance that is formed in the socket main body 12, and mounting panel 13 just stops to move down.This stop position is exactly a contact position.Mounting panel 13 downward mobile axially contacts are arranged on unshowned spring between mounting panel 13 and the socket main body 12.
Next, the operation of fixed mechanism 30 is described with reference to Fig. 1 to Fig. 6.
Fig. 1 and Fig. 2 have shown that mounting panel 13 is positioned at contact position (extreme lower position), and socket cover 21 is positioned at the situation of extreme higher position.Leave its extreme higher position when socket cover 21 uses mechanical devices or analog, when moving down in Fig. 1 and Fig. 2, the front end of the push element 32 of extending downwards from the inside upper surface 21a of socket cover 21 is in abutting connection with the near-end 31c of propeller 31.If socket cover 21 is pressed fartherly under aforesaid state, propeller 31 rotates around rotating shaft 31a.
Removed the fixing of mounting panel 13 by propeller 31 like this, thereby be arranged between mounting panel 13 and the socket main body 12, unshowned spring returns to the moving mounting panel 13 of trying hard to recommend of its reset condition upwards, whereby, mounting panel 13 moves to the installation site (extreme higher position) of semiconductor package.By rotatablely moving of propeller 31, the axial contact spring 33 of the near-end 31b of propeller 31.Fig. 3 and Fig. 5 have shown that mounting panel 14 is positioned at the situation of semiconductor package installation site (extreme higher position).Fig. 4 and Fig. 6 have shown that mounting panel 13 is positioned at the situation between contact position (extreme lower position) and semiconductor package installation site (extreme higher position).
When offering when promoting socket cover 21 downward power and eliminating, the power that spring 33 returns to its reset condition makes propeller 31 turn to the home position in the opposite direction with the aforementioned side of pivoting.
Next, insert the operation that semiconductor package 50 arrives in the socket 10 with discussing.Fig. 9 to Figure 12 explains that semiconductor package is inserted into the schematic diagram of the technology of semiconductor package socket according to the present invention.
As Fig. 3 and shown in Figure 5, if socket cover is pushed downwards extreme lower position, slide 14 is just pushed away downwards by slide hoisting mechanism 20 and moves to extreme lower position, thereby has removed the adjacency state of slide 14 and terminal 11.Therefore, the first and second contact chip 11a of each terminal 11,11b is compressed to their reset condition, and the gap is slightly larger than the diameter that is formed at the soldered ball S between first contact chip and second contact chip.
When socket cover 21 is pushed downwards to extreme lower position, the mechanism 30 that fixedly is fixed between mounting panel 13 and the propeller 31 discharges, like this, mounting panel 13 just is set at upwards promotion of unshowned spring between mounting panel 13 and the socket main body 12, and moves to semiconductor package installation site (extreme higher position) along the gathering sill 12a of socket main body 12.
Be positioned at the state of semiconductor package installation site at mounting panel 13, if semiconductor package 50 is inserted into from the top of socket 10, the periphery of semiconductor package 50 slides to installation surface 13a as shown in Fig. 9 to Figure 11 along inclined surface 13d, and inclined surface 13d has constituted semiconductor package targeting part 13c.This makes the soldered ball S of semiconductor package 50 be inserted into to be formed at the soldered ball patchhole 13e in the mounting panel 13, and whereby, semiconductor package 50 is positioned in the precalculated position (as shown in figure 12) of mounting panel 13.
The semiconductor package installation site is arranged on leaves the first and second contact chip 11a and 11b one segment length is the distance of H1, and H1 is equivalent to the minimum diameter length of soldered ball S that is.Thus, when semiconductor package 50 is inserted into, prevented contacting of soldered ball S and the first and second contact chip 11a and 11b.
Next, when offering when promoting socket cover 21 downward power and eliminating, propeller 31 turns to mounting panel 13 sides under the effect of the spring 33 that constitutes fixed mechanism 30.Because semiconductor package 50 is placed in installation surface 13a, so semiconductor package 50 is sandwiched between the front end 31c and mounting panel 13 of propeller 31.By this way, semiconductor package 50 is fixed on the mounting panel 13.
Because behind the upper surface of the front end 31a of propeller 31 adjacent semiconductor plug-in unit 50, propeller 31 is impelled at equidirectional to be rotated further, and mounting panel 13 is pushed down along the groove 12a of socket main body 12 and arrives contact position (extreme lower position) (as shown in Figure 8).At contact position, the soldered ball that is placed on the semiconductor package 50 on the mounting panel 13 is placed between the first contact chip 11a and the second contact chip 11b.Because the gap between first contact chip and second contact chip is set to be slightly larger than the diameter of soldered ball S, soldered ball is embedded relatively reposefully.
Be right after thereafter, slide hoisting mechanism 20 promotes slide 14 and is moved upwards up to the extreme higher position, thus contact terminal 11.At length, the sloping portion 14a of slide 14 and 14b move the first contact chip 11a and the second contact chip 11b mutually close (as shown in Figure 8) in abutting connection with the sloping portion 11d and the 11e of terminal 11.
Correspondingly, the first and second contact chip 11a contact the soldered ball S of the semiconductor package 50 on the mounting panel 13 that is held in place contact position with 11b, clamp soldered ball S from the two sides in this kind mode.
Though specific embodiments of the invention are described in detail for explanation, do not break away from the spirit and scope of the present invention and can also make different changes and improvement.Therefore, the present invention only limits with claim.
Claims (13)
1, a kind of socket connector that is used for semiconductor packages and uses with semiconductor package has a plurality of soldered balls at the lower surface of described semiconductor package, and described socket connector comprises:
A plurality of terminals are arranged in and the corresponding shape of the layout of described soldered ball, and each terminal has one first contact chip and one second contact chip, and described first and second contact chips can contact with corresponding soldered ball;
A socket main body that is equipped with described terminal; And
A mounting panel moves between a semiconductor package installation site and a contact position, and in described installation site, semiconductor package is placed on the mounting panel, and the soldered ball of described semiconductor package does not contact with described first and second contact chips; At described contact position, the soldered ball of the semiconductor package that places contacts with described first and second contact chips.
2, as claimed in claim 1ly be used for semiconductor packages and, it is characterized in that the soldered ball of described semiconductor package is with grid with the socket connector that semiconductor package uses, described a plurality of terminals are aligned to corresponding grid shape.
3, the socket connector that is used for semiconductor packages and uses with semiconductor package as claimed in claim 1, it is characterized in that, the installation site of described semiconductor package is set to depart from first and second contact chips, one segment length distance on the short transverse of socket main body, this length distance is equivalent to the diameter dimension of soldered ball at least.
4, as claimed in claim 1ly be used for semiconductor packages and, it is characterized in that also comprise a socket cover, it can move with respect to socket main body with the socket connector that semiconductor package uses on the short transverse of socket main body.
5, the socket connector that is used for semiconductor packages and uses with semiconductor package as claimed in claim 4, it is characterized in that, also comprise a mobile device, be used between the installation site of semiconductor package and contact position, moving mounting panel to the short transverse of socket main body in the mobile mode that is bound up with socket cover.
6, as claimed in claim 4ly be used for semiconductor packages and, it is characterized in that, also comprise a fixture, be used for semiconductor package is fixed on mounting panel, and link with socket cover with the socket connector that semiconductor package uses.
7, as claimed in claim 4ly be used for semiconductor packages and, it is characterized in that also comprise a displacement, it comes dislocation first and second contact chips in the mobile mode that combines socket cover with the socket connector that semiconductor package uses.
8, as claimed in claim 1ly be used for semiconductor packages and, it is characterized in that also comprise a socket cover, this socket cover moves relative to socket main body with the socket connector that semiconductor package uses on the short transverse of socket main body; One mobile device is used for moving mounting panel in the mobile mode that combines with socket cover to the short transverse of socket main body at semiconductor package between installation site and contact position; And a fixture, be used for semiconductor package is fixed on mounting panel, and with the mobile connection of socket cover.
9, as claimed in claim 1ly be used for semiconductor packages and, it is characterized in that also comprise a socket cover, this socket cover moves relative to socket main body with the socket connector that semiconductor package uses on the short transverse of socket main body; One mobile device is used for moving mounting panel in semiconductor package short transverse to socket main body between installation site and contact position, and connects with the mobile phase of socket cover; And a displacement, the motion that is used for the connection socket cover comes dislocation first and second contact chips.
10, as claimed in claim 1ly be used for semiconductor packages and, it is characterized in that also comprise a socket cover, this socket cover moves relative to socket main body with the socket connector that semiconductor package uses on the short transverse of socket main body; One mobile device is used for moving mounting panel in semiconductor package short transverse to socket main body between installation site and contact position, and connects with the mobile phase of socket cover; A fixture is used for semiconductor package is fixed on mounting panel, and connects with the mobile phase of socket cover; And a displacement, what be used for the respective socket cover moves dislocation first and second contact chips.
11, the socket connector that is used for semiconductor packages and uses with semiconductor package as claimed in claim 1, it is characterized in that, also comprise a mobile device, in order to short transverse to socket main body, mobile mounting panel between semiconductor package installation site and contact position.
12, as claimed in claim 1ly be used for semiconductor packages and, it is characterized in that, also comprise a fixture, be used for semiconductor package is fixed on mounting panel with the socket connector that semiconductor package uses.
13, as claimed in claim 1ly be used for semiconductor packages and, it is characterized in that, also comprise a displacement, in order to described first and second contact chips of dislocation with the socket connector that semiconductor package uses.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001185322A JP4615151B2 (en) | 2001-06-19 | 2001-06-19 | Socket for semiconductor package |
| JP185322/2001 | 2001-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1529817A CN1529817A (en) | 2004-09-15 |
| CN1244147C true CN1244147C (en) | 2006-03-01 |
Family
ID=19024922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02812054 Expired - Fee Related CN1244147C (en) | 2001-06-19 | 2002-06-13 | Socket for semiconductor package |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4615151B2 (en) |
| CN (1) | CN1244147C (en) |
| TW (1) | TW551712U (en) |
| WO (1) | WO2002103372A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3942936B2 (en) * | 2002-04-09 | 2007-07-11 | 株式会社エンプラス | Socket for electrical parts |
| CN100427225C (en) * | 2005-04-07 | 2008-10-22 | 力成科技股份有限公司 | Universal change kit for ball grid array package test classifier |
| US7172450B1 (en) * | 2006-01-11 | 2007-02-06 | Qualitau, Inc. | High temperature open ended zero insertion force (ZIF) test socket |
| JP2012109081A (en) * | 2010-11-16 | 2012-06-07 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
| US8808010B2 (en) * | 2011-06-06 | 2014-08-19 | Interconnect Devices, Inc. | Insulated metal socket |
| KR101585182B1 (en) * | 2014-04-28 | 2016-01-14 | 황동원 | Socket device for testing an IC |
| US9832899B1 (en) * | 2016-04-27 | 2017-11-28 | Alcatel Lucent | Side clamping BGA socket |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419710A (en) * | 1994-06-10 | 1995-05-30 | Pfaff; Wayne K. | Mounting apparatus for ball grid array device |
| KR987001149A (en) * | 1995-10-31 | 1998-04-30 | 오오우라 히로시 | Ball, Grid, and Array Semiconductor Sockets |
| JP3745060B2 (en) * | 1996-12-09 | 2006-02-15 | 日本テキサス・インスツルメンツ株式会社 | socket |
| JPH10293158A (en) * | 1997-04-18 | 1998-11-04 | Advantest Corp | Ic testing device |
| TW421333U (en) * | 1999-02-24 | 2001-02-01 | Hung Rung Fang | IC socket |
| JP3257994B2 (en) * | 1999-08-30 | 2002-02-18 | 日本テキサス・インスツルメンツ株式会社 | socket |
| JP3619413B2 (en) * | 2000-01-18 | 2005-02-09 | 株式会社エンプラス | Socket for electrical parts |
-
2001
- 2001-06-19 JP JP2001185322A patent/JP4615151B2/en not_active Expired - Fee Related
-
2002
- 2002-06-13 WO PCT/US2002/018815 patent/WO2002103372A1/en active Application Filing
- 2002-06-13 CN CN 02812054 patent/CN1244147C/en not_active Expired - Fee Related
- 2002-06-18 TW TW91209098U patent/TW551712U/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1529817A (en) | 2004-09-15 |
| JP2003007415A (en) | 2003-01-10 |
| JP4615151B2 (en) | 2011-01-19 |
| TW551712U (en) | 2003-09-01 |
| WO2002103372A1 (en) | 2002-12-27 |
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