CN1233036C - Assebly of seiconductor radiator - Google Patents
Assebly of seiconductor radiator Download PDFInfo
- Publication number
- CN1233036C CN1233036C CN 03153902 CN03153902A CN1233036C CN 1233036 C CN1233036 C CN 1233036C CN 03153902 CN03153902 CN 03153902 CN 03153902 A CN03153902 A CN 03153902A CN 1233036 C CN1233036 C CN 1233036C
- Authority
- CN
- China
- Prior art keywords
- power semiconductor
- cooling package
- anchor region
- semiconductor modular
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000005855 radiation Effects 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A semiconductor power module (15) with a heat-dissipating contact surface (22) comprises a cooling element (40) and a spring clamping device (10) to press the cooling element to the contact surface. The clamp has a connection region (10b) to the module and a connection (10a) to a thrust mount of the cooling element. Independent claims are also included for the following: (a) a holding clamp for the above;and (b) a connection process for the above .
Description
Technical field
The present invention is a kind of sub-assembly (subassembly), and this kind sub-assembly is to have the hold down gag that the power semiconductor modular of heat radiation contact-making surface, cooling package and contact-making surface that will dispel the heat be pressed on the cooling package by one to be constituted.
Background technology
A kind of have a no base plate formula insulating heat-conductive carrier (base material) made from suitable material (for example ceramic material) by disclosed this type of sub-assembly of patent DE 199 42 91 5A1.On the front of this base material (just so-called installed surface or element fitting surface) a plurality of power semiconductors that form a line are housed, these power semiconductors conduct electricity with the interconnection structure formation on being formed at (for example copper clad) base material front and are connected.
Base material bottom surface and the positive the same one deck coating (for example copper) that also has as the heat radiation contact-making surface.A hold down gag can be pressed on this base material bottom surface as the heat radiation contact-making surface on the radiator of sub-assembly, so that sub-assembly can be discharged via cooler with the power loss that the heat energy form produces in the running.
Hold down gag can act on the shell in principle, encases to this shell protectiveness the member that is installed on the base material.But patent DE 199 42 915 A1 not at this point the part concrete situation be further described.
In order to reach effective thermolysis or less heat transfer resistance, thereby and guarantee the running that sub-assembly can be stable, even at the operating condition that changes and through after repeatedly variations in temperature circulates, cooler all must reliably, seamlessly be adjacent on the base material bottom surface.
For reaching this purpose, but therefore the hold down gag of this known group component is made of a plurality of single conductive pressure plates.The top end face of pressure plare is connected with a printed circuit board (PCB) that other electronic building brick is installed on it.The below end face of pressure plare then is supported on the printed wire of base material.Thereby this kind hold down gag is especially complicated, and installs also very bothersome.Particularly can not carry out effectively pre-the installation.
Summary of the invention
The objective of the invention is to propose a kind of sub-assembly as illustrating previously, and this kind this be combined in secure fixation and the heat conduction that provides easy to manufacture, with low cost between power semiconductor modular and the cooling package.
Employing has the sub-assembly of claim 1 of the present invention and the geometrical clamp that has the method for claim 5 of the present invention and/or have a feature of claim 6 of the present invention can reach purpose of the present invention.The content of other dependent claims then is combination of the present invention and development.
According to the present invention, this purpose obtains in as the sub-assembly example of hold down gag as a kind of elastic fixing clip that illustrates previously, and this elastic fixing clip has an interior anchor region and the join domain that geometrical clamp is connected with power semiconductor modular of bearing that is anchored to cooling package.
First emphasis of the present invention is to realize that (in advance) of geometrical clamp on power semiconductor modular fix.For reaching this requirement, can be fixed together by the shell of a terminal that constitutes join domain with geometrical clamp and power semiconductor modular and/or power semiconductor modular.This fixedly needs not to be rigidity, and preferably a kind ofly can allow the fixed form of doing relative motion, so as to make ensuing installation steps and with other with easier the carrying out of calibration between the assembly (for example cooling package) of installation.This connection makes geometrical clamp and power semiconductor modular form one jointly and the unit that can not separate, and this has very big benefit for ensuing installation steps.
Second emphasis of the present invention is that elastic fixing clip is with simple mode free size tolerance.
The 3rd emphasis of the present invention is only can form connection between power semiconductor and the cooling package with a single geometrical clamp, thereby and only needs can finish this connection with mode simple and with low cost.
A benefit according to sub-assembly of the present invention is to keep a certain expection to install.For example, at first will link together back to the part of heat radiation contact-making surface member and/or printed circuit board (PCB) on the power semiconductor with other via a kind of known mode (as welding).Mounted in advance geometrical clamp can make next easy with the installment work transfiguration of cooling package, otherwise the printed circuit board (PCB) that previous welding is got on will make the installment work of cooling package become very difficult.
In this article, in a kind of preferred combination of the present invention, power semiconductor modular is to be connected with a printed circuit board (PCB), and this printed circuit board (PCB) has the opening of the anchor region of can leading to.
In the execution mode of the sub-assembly of a kind of advantage that has constructional advantage simultaneously and make of the present invention, anchor region be shaped as U-shaped, and having a retaining device at least one the U limit in two U limits of this anchor region, this retaining device can be fixed on anchor region in the bearing of cooling package.
The execution mode that another of sub-assembly of the present invention is favourable is that an opening by cooling package constitutes its bearing.
Content of the present invention also comprises a kind of heat radiation contact-making surface of the power semiconductor that is connected with a printed circuit board (PCB) and method that the heat conduction between the cooling package connects of being formed on.This method according to the present invention comprises the steps: to make the join domain of an elastic fixing clip to be connected with power semiconductor modular, power semiconductor modular is connected with printed circuit board (PCB), the heat radiation contact-making surface of power semiconductor modular is contacted with cooling package, the anchor region of elastic fixing clip is anchored in the bearing of cooling package, to keep contacting of heat radiation contact-making surface and cooling package, this grappling effect is to act on the anchor region via the opening that is arranged in the printed circuit board (PCB).
The operating efficiency of this method is high especially, especially can make the installation steps transfiguration that next is connected with cooling package easy.Can form one being connected between the power semiconductor modular that in Preinstallation Steps, forms in advance and the geometrical clamp jointly and the unit that can not separate, utilize this kind unit just can carry out the installment work of sub-assembly according to a kind of our particular step of demand that conforms with.Just at first will weld together back to the part of heat radiation contact-making surface member and/or printed circuit board (PCB) on the power semiconductor with other via a kind of known mode.Opening in mounted in advance geometrical clamp and the printed circuit board (PCB) can make next easy with the installment work transfiguration of cooling package.Under the simplest situation, only need to form the opening of this anchor region of can leading at aperture of printed circuit twist drill.
The geometrical clamp that method of the present invention is used has the interior anchor region and the join domain that geometrical clamp is connected with power semiconductor modular of bearing that can be anchored to cooling package.
Description of drawings
Below cooperate figure that feature of the present invention and method are further described:
Graphic 1: the scheme of installation of sub-assembly of the present invention.
Graphic 2: the enlarged drawing of geometrical clamp.
Graphic 3: show in a schematic way as graphic 1 in the order of the 3rd installation steps.
Embodiment
The other numeral 1,2,3 of arrow is represented the the 1st, the 2nd, the 3rd installation steps of sub-assembly of the present invention respectively in graphic 1.These installation steps back again describe in detail one by one.
At first (the 1st installation steps) by join domain 10a, are fixed on a geometrical clamp 10 on the front 12 of shell 14 of power semiconductor.
Enlarged drawing from graphic 2 as can be seen, the join domain 10a of geometrical clamp 10 can be that a rubber-like terminal by geometrical clamp 10 is constituted.This rubber-like terminal can apply a pressure F1 to the front 12 of shell 14 when contacting with the outer casing frontispiece 12 shown in graphic 1.Shown in graphic 2, the another one rubber-like terminal of geometrical clamp 10 is as anchor region 10b, and its shape is essentially U-shaped.A barb 10c is arranged on the inner side edge of U-shaped anchor region 10.
Shell 14 coated members (not presenting in detail), especially power semiconductor, these members are arranged on the ceramic base material and are the part of power semiconductor modular 15.These members form electricity by the interconnection (not shown) and connect, and are connected with the welding ends 16 of outside.Plate fully with layer of copper base material bottom surface 20, thereby and as heat radiation contact-making surface 22.
There is a locking hook 12a in the front 12 of shell 14.Under pre-installment state, just after shell 14 and geometrical clamp 10 formed mechanical connection, this locking hook 12a can fix the join domain 10a of geometrical clamp 10 automatically.
For purpose of the present invention, so-called fixedly being meant automatically for ensuing installation steps can be carried out smoothly, two parts with can be each other enough firmly and the mode that can not separate link together.But not getting rid of, this can not allow follow-up calibration and/or relative motion and mobile loosely connected mode.
In following step (step 2), for example, printed circuit board (PCB) is connected with power semiconductor modular 15 by being welded to connect with welding ends 16, thereby and form a unit with power semiconductor modular, this unit is used to produce the sub-assembly following step.Other element also can be placed and be combined on the printed circuit board (PCB) 30.Printed circuit board (PCB) 30 has boring or opening 30a, will be illustrated after a while about this part.The shape of geometrical clamp 10 and size preferably can allow geometrical clamp 10 with the plane that can not protrude in heat radiation contact-making surface 22 places after power semiconductor modular is connected outside.Can guarantee like this that before carrying out next installation steps the heat radiation contact-making surface can be stamped or be coated with the last layer heat-conducting cream in very simple mode where necessary automatically.
The 3rd installation steps are that the heat radiation contact-making surface 22 of the unit that this is common is pressed on the contact-making surface 40a of the correspondence on the cooling package 40 after printed circuit board (PCB) 30 and power semiconductor modular 15 are connected into a common unit.This cooling package 40 is constituted through the cooler that forms of extruding by one, on it and have a suitable opening, boring or a groove 40b.The aluminum foundry goods that has boring also can be used as cooling package.(also available a slice sheet metal is as cooling package under the simplest situation).
Graphic 3 show the order of the 3rd installation steps.Graphic 3 left-half shows that the heat radiation contact-making surface 220 of power semiconductor 15 has been placed on the cooling package 40.This moment anchor region 10b be positioned at boring 40b directly over mode aim at.Geometrical clamp 10 is owing to anchor region 10b can strain upward deflect.
Graphic 3 right half part shows the situation after the sub-assembly installation.By being preferably columned opening 30a in the printed circuit board (PCB) 30, the anchor region 10b of geometrical clamp 10 is imposed a directed force F with an instrument of in graphic, not drawing (for example probe that has the groove that can match with the thickness of geometrical clamp together).Thereby make this zone that strain take place and self push the most at last and pass boring 40b.So this boring 40b has just constituted anchor region 10b shown in graphic 2 or the bearing 50 of barb 10c.
Like this, just can prevent anchor region 10b because barb 10c skids off from boring 40b in the locking (stop) of opening lower edge.Under this state, heat radiation contact-making surface 22 will see that graphic 2 are pressed on the front of cooling package 40 because of the pressure F1 that is acted on the front 12 of power semiconductor modular 15 by join domain 10a, and a reliable conductive force is provided.
The feature of sub-assembly of the present invention is power semiconductor modular to be fixed/to be connected on the cooling package in reliable mode with simple, low cost method as from the foregoing.A kind of particularly advantageous mode is, it is fixing and be connected only need to use a single geometrical clamp can finish this kind.For can earlier power semiconductor modular being connected with printed circuit board (PCB) in the case of necessary, under the situation that can not cause the complex installation program, be connected with cooling package more then.
Before fitting printed circuit board and cooling package, preferably earlier geometrical clamp and power semiconductor modular are installed (making the two form a common unit) earlier in the mode of pre-installation, and then handle this common unit together.
Claims (5)
1. sub-assembly, it has:
--a power semiconductor modular (15) with heat radiation contact-making surface (22),
--a cooling package (40), and
--one is pressed on hold down gag on the cooling package (40) with described heat radiation contact-making surface (22),
It is characterized in that of described sub-assembly:
--hold down gag is a kind of elastic fixing clip (10),
--described hold down gag has an interior anchor region (10b) of a bearing (50) that can be anchored to cooling package (40),
--described hold down gag has a join domain (10a) that it is connected with described power semiconductor modular (15);
--described power semiconductor modular (1 5) is connected with a printed circuit board (PCB) (30) via welding ends (16), and described printed circuit board (PCB) (30) has the opening (30a) of anchor region (10b) that can lead to.
2. sub-assembly as claimed in claim 1, it is characterized in that: described anchor region (10b) be shaped as U-shaped, and at least one U type limit, having a retaining device (10c), described retaining device (10c) can be fixed on described anchor region (10b) in the described bearing (50) of described cooling package (40).
3. sub-assembly as claimed in claim 1 is characterized in that:
Described bearing (50) is a boring (40b) formation by described cooling package (40).
4. one kind forms the method that heat conduction connects between the heat radiation contact-making surface (22) of the power semiconductor (15) that is connected with printed circuit board (PCB) (30) and cooling package (40), it is characterized in that:
--by join domain (10a), elastic fixing clip (10) is connected with described power semiconductor modular (15),
--described power semiconductor modular (15) is connected with described printed circuit board (PCB) (30),
--described heat radiation contact-making surface (22) is contacted with described cooling package (40),
--the anchor region (10b) of described elastic fixing clip (10) is anchored in the bearing (50) on described cooling package (40) one sides, to keep described contact, described anchor region (10b) is to act on the anchor region (10b) via the opening (30a) that is arranged in the printed circuit board (PCB) (30).
5. a use is characterized in that at the geometrical clamp of method as claimed in claim 4:
It has the anchor region of being held by the bearing of described cooling package (40) (50) (10b) and has a join domain (10a) that described geometrical clamp (10) is connected with described power semiconductor modular (15).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002137871 DE10237871B4 (en) | 2002-08-19 | 2002-08-19 | Module system |
| DE10237871.1 | 2002-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1495890A CN1495890A (en) | 2004-05-12 |
| CN1233036C true CN1233036C (en) | 2005-12-21 |
Family
ID=31501804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03153902 Expired - Fee Related CN1233036C (en) | 2002-08-19 | 2003-08-19 | Assebly of seiconductor radiator |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN1233036C (en) |
| DE (1) | DE10237871B4 (en) |
| TW (1) | TWI295096B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006018716A1 (en) * | 2006-04-20 | 2007-10-25 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Arrangement for contacting power semiconductors on a cooling surface |
| DE102007003821A1 (en) * | 2006-12-20 | 2008-06-26 | Rohde & Schwarz Gmbh & Co. Kg | Transistor clamping device for transistor, has holding down plate that is provided between maintaining block, transistor, and spring that is fixed on transistor such that constant pressure is executed |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8618283U1 (en) * | 1986-07-09 | 1986-11-06 | Austerlitz Electronic GmbH, 8500 Nürnberg | Retaining spring for attaching semiconductors to any heat sink |
| US5466970A (en) * | 1992-08-24 | 1995-11-14 | Thermalloy, Inc. | Hooked spring clip |
| US5386338A (en) * | 1993-12-20 | 1995-01-31 | Thermalloy, Inc. | Heat sink attachment assembly |
| US5869897A (en) * | 1997-10-22 | 1999-02-09 | Ericcson, Inc. | Mounting arrangement for securing an intergrated circuit package to heat sink |
| US6181006B1 (en) * | 1998-05-28 | 2001-01-30 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
| DE19942915A1 (en) * | 1999-09-08 | 2001-03-15 | Still Gmbh | Power semiconductor module |
| US6208517B1 (en) * | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
| DE10052191C1 (en) * | 2000-10-20 | 2001-11-15 | Siemens Ag | Cooling assembly for electronic components includes spring clamps holding them against cooling plate and away from PCB connections |
-
2002
- 2002-08-19 DE DE2002137871 patent/DE10237871B4/en not_active Expired - Lifetime
-
2003
- 2003-07-29 TW TW92120726A patent/TWI295096B/en not_active IP Right Cessation
- 2003-08-19 CN CN 03153902 patent/CN1233036C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200403823A (en) | 2004-03-01 |
| DE10237871A1 (en) | 2004-03-11 |
| CN1495890A (en) | 2004-05-12 |
| DE10237871B4 (en) | 2011-05-12 |
| TWI295096B (en) | 2008-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: INFINEON TECHNOLOGIES AG Free format text: FORMER OWNER: EUPEC GMBH + CO. KG Effective date: 20130325 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: EUPEC GMBH + CO. KG Free format text: FORMER NAME: YOUPE EUROPEAN SEMICONDUCTOR INDUSTRY GMBH + CO. KG |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Germany wall Shi Taiyin Patentee after: OPEC European Power Semiconductor Co.,Ltd. Address before: Germany wall Shi Taiyin Patentee before: EUPEC GmbH & Co.KG |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130325 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: Germany wall Shi Taiyin Patentee before: OPEC European Power Semiconductor Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051221 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |