CN1222449C

CN1222449C - Cushioning body for glass substrate and packing body using the cushioning body

Info

Publication number: CN1222449C
Application number: CNB018215262A
Authority: CN
Inventors: 上田康; 浜田逸男
Original assignee: Asahi Kasei Kogyo KK
Current assignee: Asahi Kasei Corp
Priority date: 2000-12-27
Filing date: 2001-12-26
Publication date: 2005-10-12
Anticipated expiration: 2021-12-26
Also published as: KR100552879B1; JP4091432B2; DE10197125B3; WO2002053474A1; JPWO2002053474A1; CN1482985A; KR20030093192A

Abstract

A cushioning body for glass substrate having an L-shaped section and the thickness of the L-shaped section at the end part larger than the thickness thereof at the corner part, wherein (1) the thickness of the cushioning body is gradually decreased from the end part to the corner part of the L-shaped section with the bottom part of a fixture guide groove taken as a reference by forming the fixture guide groove so that the depth thereof is gradually increased from the end part to the corner part of the L-shaped section, (2) the cushioning device is formed so that the thickness of the cushioning body itself is gradually decreased from both end parts to the corner part of the L-shaped section without forming the fixture guide groove, and (3) a projected part is formed at both outer end parts of the L-shaped section of the cushioning body, whereby a fixture tightening force is prevented from being concentrated to the corner part when the cushioning body is tightened with a fixture.

Description

The packing articles that is used for the buffer body of glass substrate and adopts this buffer body

Technical field

The present invention relates to a kind of buffer body that the cover glass substrate can not damage owing to vibration in transportation that is used for, described glass substrate comprises a glass substrate, and described glass substrate has electronic component formed thereon, for example semiconductor devices.The present invention also designs a kind of packing articles, and wherein, a plurality of above-mentioned glass substrates are packaged in together.

Background technology

In recent years, electronics or electric device, particularly be used for the external equipment of Personal Computer and be the Liquid Crystal Display (LCD) or the plasma display of the portable terminal of representative, become the equipment that output is increased sharply along with the development of the IT industry of internet representative with the vehicular telephone as a kind of.People wish to develop and the relevant technology of buffer body that is used to pack or transport these devices solicitously.About described device, has electronic component formed thereon, the glass substrate of semiconductor devices for example, for example be used for color filter, TFT liquid crystal cell (substrate with a circuit formed thereon, in described circuit, be combined with thin film transistor) and the glass substrate of liquid crystal panel, to such an extent as to its very thin thickness is easy to be impacted or vibrate in transportation, in addition, because their very meticulous structures, so to such an extent as to be subjected to external action too easily and be difficult to they are handled.Particularly, under the semi-finished situation before glass substrate before output is handled or the formation finished product, above-mentioned electronic component is provided with thereon, and therefore they are subjected to the adverse effect of static or dust more strong, to such an extent as to can lose their function in some cases.

Therefore, having proposed many packing techniques transports safely glass substrate in order to not cause damage ground.

As an example, in the open No.319456/1993 of Japanese Patent a kind of technology is disclosed.The main points of this technology are a kind of buffer body, and this buffer body comprises the polyolefin pearl foams with particular characteristics, and have and be roughly L shaped cross section, and have a plurality of substrate insertion grooves along L shaped on inner surface.On the glass substrate of packing, thereby a plurality of glass substrates are parallel to each other with predetermined space and arrange and to form a cuboid, and each bight of each substrate all is inserted in the substrate insertion groove of buffer body, so that four limits and the substrate surface of parallel cuboid are inserted in the buffer body with meeting at right angles, subsequently, can utilize a connecting element if desired, for example bungee or belt are fixed.

Yet, adopting connecting element, for example under the situation that bungee or belt are fixed in the outside of buffer body; its seizing force concentrates on the bight of buffer body; thereby buffer body L shaped is broadened and glass substrate leaves the substrate insertion groove, therefore can not give full play to defencive function.

And in aforementioned L shaped buffer body, the width of substrate insertion groove is identical with the thickness of glass substrate or slightly narrow, and when utilizing polyolefin pearl foams by compression, as the high resiliency restoring force of bead-like body characteristic glass substrate is fixed.Therefore, produce dust although in transportation, can prevent effectively owing to the vibration and the friction of glass substrate, but the glass substrate package as essential purpose is had a negative impact with the friction drag of glass substrate, when forcibly being inserted into glass substrate in the groove, the glass substrate with about 0.4 to 1.0mm such minimal thickness is easy to bending and sustains damage easily.Therefore, produced such problem, that is,, then needed to spend long time if operate very carefully for fear of this damage.This also is the same for substrate is broken a seal.Particularly, consider, introduced automated packaging equipment and Kaifeng equipment recently, but the problems referred to above are easy to cause fault, and have pointed out that in fact L shaped buffer body is unsuitable for automation from the angle of saving labour power.

And then another problem is along with glass substrate being inserted in the substrate insertion groove, may produce trickle wear track owing to friction drag on glass baseplate surface.

Consider the problems referred to above; the purpose of this invention is to provide a kind of buffer body that is used for glass substrate; this buffer body prevents when glass substrate is packed; glass substrate leaves described groove in the L shaped end of buffer body; even and in transportation or treating process when for example vibrating or external force such as shock of a fall when applying thereon, it is the cover glass substrate safely.And then, another object of the present invention provides a kind of buffer body that is used for glass substrate, it is suitable for the packing and the Kaifeng automation of glass substrate, even also be not easy to produce dust when carrying out cliding friction with glass substrate, and has the durability that can use excellence for several times.And then, an object of the present invention is to provide a kind of packing articles that adopts described buffer body to form.

The general introduction of invention

In the first string, according to the buffer body that is used for glass substrate of the present invention, comprise polyolefin pearl foams, and have the roughly L shaped cross section consistent with the shape in glass substrate bight, go up along a plurality of substrate insertion grooves of formation on the surface within it, in order to the fixing both sides that form the glass substrate in bight, and on its outer surface along at least one connecting element guide groove of formation, wherein, the thickness based on the buffer body of the bottom of connecting element guide groove reduces to central part gradually from L shaped two ends.

As a preferred embodiment, above-mentioned first buffer body of the present invention comprises an embodiment, and wherein, the bottom of connecting element guide groove tilts in the bight.

In second scheme, according to the buffer body that is used for glass substrate of the present invention, comprise polyolefin pearl foams, and have the roughly L shaped cross section consistent with the shape in glass substrate bight, go up along a plurality of substrate insertion grooves of formation on the surface within it, in order to the fixing both sides that form the glass substrate in bight, wherein, the thickness of buffer body reduces to central part gradually from L shaped two ends.

In the 3rd scheme, according to the buffer body that is used for glass substrate of the present invention, comprise polyolefin pearl foams, and have the roughly L shaped cross section consistent with the shape in glass substrate bight, go up along a plurality of substrate insertion grooves of formation on the surface within it, in order to the fixing both sides that form the glass substrate in bight, wherein form protrusion in the outside at L shaped two ends.

As a preferred embodiment, above-mentioned second and the 3rd buffer body that is used for glass substrate according to the present invention comprises one of them external angle bevelled embodiment.

In addition, as preferred embodiment, above-mentioned buffer body of the present invention comprises: in one embodiment, the buffer body inboard is along forming a cutting with respect to the rectangular direction of substrate insertion groove; In one embodiment, buffer body has 10 to 60mm maximum ga(u)ge, and is that the ratio of basic L shaped dual-side is 1.0 to 3.0 with shorter side, and the width of substrate insertion groove is roughly 1.0 to 4.0 times of thickness of glass substrate, the degree of depth is 3 to 15mm, and the spacing of groove is 6 to 100mm; And in another embodiment, wherein, the average particle size particle size of polyolefin pearl foams is 1.5 to 5.0mm shaped particles size, has 70% or higher fusion rate, and elasticity of compression index is 3.0 to 490, and response rate is 60% or bigger.

In the first string, packing articles according to the present invention has following feature, a plurality of glass substrates are provided with in parallel to each other with predetermined interval, so that form parallel cuboid, the bight of each substrate is inserted into the first buffer body substrate insertion groove that is used for glass substrate, thereby four limits of cuboid and the surface of buffer body are inserted in the buffer body with meeting at right angles, and by the assembly binding being fixed up with the connecting element guide groove of long connecting element along buffer body.

In second scheme, packing articles according to the present invention has following feature, a plurality of glass substrates are provided with in parallel to each other with predetermined interval, so that form parallel cuboid, the bight of each substrate is inserted into the second or three buffer body substrate insertion grooves that are used for glass substrate, thereby four limits and the buffer body surface of cuboid are inserted in the buffer body with meeting at right angles, and by assembly being fixed up with of the L shaped outside binding of long connecting element along buffer body.

The simple declaration of accompanying drawing

Fig. 1 is the transparent view according to an embodiment of buffer body of the present invention.

Fig. 2 is the transparent view according to an embodiment of packing articles of the present invention.

Fig. 3 (a) is the cutaway view of representing according to the embodiment of buffer body of the present invention to Fig. 3 (e).

Fig. 4 (a) is the cutaway view of expression example of the formation of buffer body substrate insertion groove according to the present invention to Fig. 4 (c).

In addition, in the accompanying drawings, label 1 is a buffer body; The 2nd, the substrate insertion groove; The 3rd, the connecting element guide groove; The 4th, protrusion; The 21st, glass substrate; The 22nd, connecting element; The 31st, the wall surface of buffer body; The 32nd, the bottom of substrate insertion groove; The 33rd, L shaped end; 34 and 34 ' is L shaped bight; The 35th, the bottom of connecting element guide groove; The 36th, rake; The 37th, cutting; The 38th, protrusion; The 39th, recess.

The optimised form that carries out an invention

Buffer body of the present invention comprises polyolefin pearl foams, and these polyolefin pearl foams have roughly L shaped cross sectional shape, being characterized as of described buffer body, its thickness in L shaped end than thicker in its bight.Thereby; when forming the glass substrate that wires up from outside bundle component with connecting element; connecting element arrives a more outer position at L shaped place, end ratio at the place, bight; this is used to prevent that the seizing force of connecting element from concentrating on the bight; and seizing force is pressed on the whole buffer body equably, thereby cover glass substrate.

In the present invention, the concrete structure that wherein thickness of buffer body at place, L shaped end is thicker than the thickness at the place, bight is as follows.

(1) being shaped as of connecting element guide groove, its degree of depth deepens towards the bight from L shaped end, thereby the thickness based on the buffer body of connecting element guide groove bottom is reduced to the bight gradually from L shaped end;

(2) do not form the connecting element guide groove, this buffer body is molded as himself thickness and reduces gradually to the bight from L shaped end; And

(3) form projection laterally at the L shaped two ends of buffer body.

Specify buffer body and packing articles below with reference to embodiment, wherein, a plurality of glass substrates get up with the buffer body entire package.

Fig. 1 is the transparent view of an embodiment of expression buffer body of the present invention, and described buffer body has the structure described in above-mentioned (1).In Fig. 1, label 1 is a buffer body; 2 is the substrate insertion groove; 3 is the connecting element guide groove; 4 is with the adjacent separated jut of substrate insertion groove.

Fig. 2 is the transparent view of an embodiment of expression packing articles of the present invention, wherein, with four buffer bodies of the present invention a plurality of glass substrate package is got up.In Fig. 2, label 21 is a glass substrate, and label 22 is a connecting element, represents identical parts with label identical among Fig. 1.

Buffer body 1 of the present invention is used for the bight of cover glass substrate 21 and fixes a plurality of glass substrates with being integral, and adopts two or more, is preferably 4 buffer bodies and packs.

As shown in Figure 1, buffer body 1 of the present invention has the roughly L shaped cross sectional shape consistent with the bight of glass substrate, and, under by jut 4 separated states, a plurality of substrate insertion grooves 2 are set along L shaped for the fixing both sides, bight that form glass substrate.

And, in the structure described in above-mentioned (1), along formation connecting element guide groove 3.As shown in Figure 2, this connecting element guide groove 3 is used for bundling packaged glass substrate 21 by the part 22 that is fastened along this connecting element guide groove 3.In the present invention, under the situation that is provided with connecting element guide groove 3, the thickness of buffer body 1 changes, so that its thickness in the bottom reduces gradually towards the bight.Fig. 3 (a) has schematically expressed the cross section of the buffer body of Fig. 1 along connecting element guide groove 3 and substrate insertion groove 2.In Fig. 3, label 31 is the outside face of buffer body; 32 is the bottom of substrate insertion groove 2; 33 is the L shaped end of buffer body 1; 34 and 34 ' is L shaped bight; 35 is the bottom of connecting element guide groove 3; 36 is rake; 37 are cutting; 38 is jut; 39 is recess.In addition, in following explanation, the thickness that bight 34 or 34 ' is located is meant the thickness that is in the buffer body on shorter side and the longer side in L shaped inner corner portion.

Shown in Fig. 3 (a), by forming the connecting element guide groove, the buffer body thickness at 35 places, bottom of connecting element guide groove reduces to bight 34 ' gradually from L shaped end 33, thereby makes its degree of depth less at 33 places, L shaped end, and locates bigger in its bight 34 '.The result, owing to after glass substrate is packed, twine a long connecting element along the connecting element guide groove, so 33 than 34 ' locating greatly in the bight, this is used to prevent that the seizing force of connecting element from concentrating on bight 34 ' to the distance from connecting element to glass substrate in the end.

And, concentrate on for the seizing force that prevents connecting element on the bight 34 ' of connecting element guide groove bottom 35, shown in Fig. 3 (b), preferably make the oblique angle in advance, in order to form a sloping portion 36.By forming sloping portion 36, eliminated that connecting element is embedded in the buffer body and the possibility that causes damage, and distorting of having reduced that bight 34 ' is located, this is used to reduce to widen laterally the power of buffer body end 33.This sloping portion 36 can be plane or crooked.

In addition, shown in Fig. 3 (c), preferably on the buffer body inboard along forming one or more cuttings 37 with the rectangular direction of substrate insertion groove (with the rectangular direction of paper), thereby, cutting 37 absorbs owing to the distortional stress that bundlees the enlarged width end portions laterally 33 that forms with connecting element, and prevents that this stress is to end 33 expansions.In addition, shown in Fig. 3 (c), cutting 37 can be roughly U-shaped shape and roughly V-arrangement shape.

And in Fig. 3, place, 34 inboard partly cuts jut 4 in the bight on short brink, to form recess 39.This structure is used in transportation when being subjected to vibratory impulse or shock of a fall, prevents that glass substrate is being easy to impaired place, bight fracture most.In addition, in recess 39, can be used for removing jut 4 from the bottom of substrate insertion groove.In addition, from preventing the angle of glass substrate, preferably make recess form deeplyer than bottom 32 in its bight fracture.

In an example of the present invention of aforementioned structure (2), in an example of the structure (3) shown in Fig. 3 (d) and in Fig. 3 (e), 34 places make thicklyer in the bight for buffer body L shaped.In Fig. 3 (d), the thickness of buffer body itself reduces to bight 34 gradually from L shaped end 33.In this case, needn't specifically created connecting element guide groove, and the width that therefore can freely select connecting element with bundle the position.And in Fig. 3 (e), jut 38 is formed on the outside of L shaped end 33, thereby the thickness of buffer body goes out to make thicklyer than bight 34 in its end 33.This jut 38 can form one with buffer body, perhaps can be by forming by adding heatsealing or with adhesive agent an independent profiled sheeting being bonded on the buffer body.Under latter event, described sheet material can be with making with the identical or different material of buffer body.

Still in the structure of Fig. 3 (d) and Fig. 3 (e), can as shown in Fig. 3 (b) or 3 (c), suitably form sloping portion 36 or cutting 37.

Below, the preferred outside dimension of buffer body of the present invention is described.

The ratio of L shaped both sides length (with the length of glass substrate contact portion) based on the length of shorter side, is preferably 1.0 or bigger, and more preferably 3.0 or littler.When described ratio was in this scope, longer side and shorter side be balance well mutually, and can be highly stablely fixing rectangle glass.In addition, owing to the crooked possibility that causes glass substrate to sustain damage significantly reduces.This ratio is more preferably below 2.7.

The ratio of employing in above-mentioned scope, the length of shorter side be preferably glass substrate short brink length to be packaged 10% or bigger, more preferably 45% or littler.And then, more preferably 15% or bigger, and most preferably be 40% or littler.When the short brink length of buffer body is in above-mentioned scope, because the buffer body that can fully absorb impulsive force is provided, so even when being subjected to shock of a fall etc., also can avoid glass substrate to sustain damage.In addition,, (deadweight of glass substrate) be reduced, so in transportation, can suppress because therefore the generation of the dust that contact friction caused that vibration causes can reach satisfied cleanliness level because imposing on the stress of buffer body.

For the buffer body of specific dimensions, shorter side length is preferably 100mm or bigger, more preferably 500mm or littler.The length of longer side is preferably 100mm or bigger, more preferably 500mm or littler.And, though be that number with glass substrate to be packaged is a foundation,, with short brink and the rectangular direction of long side on length be preferably 150mm or bigger, 600mm or littler more preferably.

Consider the number of the size, weight of glass substrate, glass substrate to be packaged and the elasticity of compression index of buffer body, the maximum ga(u)ge of buffer body of the present invention is preferably 10mm or bigger, more preferably 60mm or littler, more preferably 15mm or bigger and/or 40mm or littler.When outside dimension and maximum ga(u)ge are in above-mentioned scope, buffer body can be used as can be stably the fixedly buffer body of all glass substrate products of various sizes and the buffer body that is used for the glass substrate before processed.In addition, they show the function that the glass substrate that adequately protects is not hit in transit.

And under the situation that forms the connecting element guide groove shown in Fig. 3 (a), 33 places are preferably 0.5mm or bigger to the degree of depth of described groove in the end, 5mm or littler more preferably, and 34 ' locate to be preferably 2mm or bigger in the bight, more preferably 15mm or littler.When the mode of the degree of depth in above-mentioned scope with the connecting element guide groove forms the connecting element guide groove, because when bundling this assembly with connecting element, seizing force is applied on the whole length of the short brink of buffer body and long side equably, so obviously can prevent the position deviation of connecting element, therefore the supporting leg that can prevent buffer body is widened distortion, four bights of fixing glass substrate stably.Therefore, buffer body can be brought into play the function of gratifying cover glass substrate.In Fig. 3 (a), the connecting element guide groove is formed up to end 33 always.Can form the connecting element guide groove near end 33, to constitute conplane mode with buffer body outer wall 31.In this case, preferred 10mm or bigger is separated in connecting element guide groove and end 33.More preferably, with the degree of depth from 33 be separated by 100mm or littler positions form the connecting element guide groove to the mode that bight 34 ' increases gradually from the end.In this scope, connecting element can not produce position deviation in transportation, in addition, by the 33 formation connecting element guide grooves from the end, can obtain identical effect.

And then, under the situation of the variation in thickness of buffer body shown in Fig. 3 (d) itself, the thickness that preferably makes 34 places, bight is than the little 1mm of thickness at 33 places, end or bigger, more preferably little 10mm or littler, more preferably little 3mm or bigger most preferably is little 8mm or littler.Equally in this case, by formation have from the end 33 towards the bight 34 up to 10mm bigger or more preferably thickness with the buffer body of uniform thickness and buffer body of 100mm or littler position 34 reduce gradually from this position towards the bight, can obtain effect as hereinbefore.

And, under the situation of Fig. 3 (e), preferably make bight 34, more preferably thin 10mm or littler than end 33 thin 1mm or bigger.When making bight 34 thinner, shown in Fig. 3 (e), near end 33, form jut 38.Along the described L shaped 10mm or bigger that is preferably, more preferably 100mm or littler is 20mm or bigger more preferably to the width of jut 38, most preferably is 80mm or littler on this direction.

And then, shown in Fig. 3 (b), forming under the situation of sloping portion 36, consider the length of elasticity of compression index, maximum ga(u)ge and the both sides of buffer body, camber line in the L shaped cross section or straight length are preferably 3mm or bigger, more preferably 60mm or littler.

When described when being tilted in this scope, bundle this assembly and when therefore whole buffer body uniform-compression is with the bight of fixing glass substrate, can avoid seizing force the concentrating on the bight of connecting element when the packing glass substrate and by the part that is fastened around it.Therefore, the function of the fixing and cover glass substrate that can obtain more to strengthen in addition, even when applying connecting element with very strong seizing force, can prevent that still connecting element is embedded in the buffer body.Therefore, buffer body can be in long time repeated usage, and obtained the durability that significantly improves.

Under the situation that forms cutting 37 shown in Fig. 3 (c), the degree of depth of cutting be preferably the buffer body thickness at the position that forms cutting 1/20 or bigger, more preferably 1/2 or littler.The width of described groove is preferably 2mm or bigger, and more preferably 10mm is littler.In addition, position and number for cutting 37 have no particular limits, but its optimum seeking site for the length (length at the position that contacts with glass substrate) of leaving bight (long side and the point of short brink) side with the glass substrate contact portion 1/8 or bigger, more preferably 4/5 or littler, and its number is preferably 1 or bigger, more preferably 3 or littler.When forming cutting 37 in above-mentioned scope, glass substrate is fully fixed on whole length of glass substrate insertion groove, and does not weaken the rigidity of buffer body.Therefore, the function of protective substrate is improved, and in addition, has obtained simultaneously further to reduce owing to producing the effect of dust with the buffer body friction.

And then, under the situation that forms recess 39 as shown in Figure 3, preferably the mode that arrives the recess 32 of substrate insertion groove with the bottom of recess 39 forms, and more preferably consider from the size of glass substrate and the maximum ga(u)ge of thickness and buffer body, recess 39 forms 1mm or bigger and the 8mm or the littler degree of depth, more preferably 2mm or bigger and the 6mm or the littler degree of depth from the bottom of substrate insertion groove 32.In these scopes, can not apply external force in the bight of the most fragile of glass substrate, even since shock of a fall just buffer body be subjected to torsional deflection, also can significantly reduce the impaired possibility of glass substrate.In addition, the structural strength of buffer body also can keep enough, even and therefore still can keep initial shape after repeated usage.Therefore, can in very long period, bring into play the function of fixing and cover glass substrate.

The width that is formed at the substrate insertion groove in the buffer body of the present invention is preferably 1.0 times to 4.0 times of glass substrate to be packaged, more preferably 1.2 times to 3.5 times.In this scope, can carry out rapidly with very high efficient by hand or with the work of automatic equipment insertion and taking-up glass substrate, and the fault of glass substrate fracture in insertion work is significantly reduced.In addition, because the fixed performance of glass substrate in the substrate insertion groove, even the friction between glass substrate and the buffer body is suppressed, therefore few generation dust and glass substrate keep clean.

And, consider that from the width of size, weight, elasticity of compression index and the substrate insertion groove of glass substrate the degree of depth of substrate insertion groove is preferably 3mm or bigger, more preferably 15mm or littler.More preferably 5mm or bigger most preferably is 10mm or littler.In this scope, even in transportation, be subjected to vibratory impulse or in handling process, be subjected to shock of a fall, glass substrate is fixing safely under can the state in being inserted into insertion groove, and therefore can prevent glass substrate leave insertion groove and with adjacent substrate contacts.And, since the part that contacts with the substrate insertion groove of glass substrate in transportation always because of vibratory impulse and buffer body wipe contact, so exist high possibility on the surface of glass substrate, to form tiny cut.Therefore, in processing with the process of producing liquid crystal panel, cut the part that substrate has contacted with the buffer body insertion groove usually in advance to the glass substrate of transportation.Yet when the degree of depth of described groove was in above-mentioned scope, the area of this part was very little, and can be that reduction in the capacity rating minimizes, and therefore realized high productivity.And then the amount of dust that produces owing to the friction between glass substrate and the buffer body is very little, thereby considers that from the angle of cleanliness level this buffer body also is gratifying.

From the kind of glass substrate (for example, glass itself, color filter, liquid crystal chunk, liquid crystal and Plasmia indicating panel), the width of the elasticity of compression index of the size of glass substrate and weight, buffer body, substrate insertion groove and the comformability that inserts and take out glass substrate automatically consider, the spacing of substrate insertion groove is preferably 6mm or bigger, more preferably 100mm or littler.In this scope, the work of inserting or taking out substrate can be easily, carry out safely, in addition, can avoid because vibratory impulse in transportation or the shock of a fall in handling process and contact the risk of the glass substrate bending that causes with adjacent substrate.

And, in buffer body of the present invention, the separated jut of adjacent substrate is had the cross sectional shape of the top flat shown in Fig. 4 (a).Yet, consider the serviceability when inserting glass substrate and the generation of dust when inserting, preferably adopt upside at jut to form a for example two-stage shape of the guide part of convex (Fig. 4 (b)) or trapezoidal (Fig. 4 (c)), be preferably trapezoidal.Even when buffer body has formed the substrate insertion groove with thin space very, also can make the metal die that is used for the molding buffer body accurately.In the accompanying drawings, t1 represents the maximum ga(u)ge of buffer body 1; T2 represents the degree of depth of substrate insertion groove; T3 represents the width of groove; T4 represents separation.

Below, the material that is used to constitute the present invention's buffering is described.

Buffer body of the present invention comprises polyolefin pearl foams.These foams are to be filled in the metal die of required form by the polyolefin pearl that can form foam, with steam foam heated and cooling, thus the moulded foam of acquisition required form.When metal die is used to molding, can adopt the metal die that obtains by casting.This casting method can be easily and is produced the metal die with labyrinth accurately, in addition, productive costs be used for injection moulding metal die cost 1/10 or littler, therefore economical and practical and be suitable for producing in enormous quantities.

The polyolefin that is used to form polyolefin pearl foams can be cross-linking type or non-crosslinked type.The specific examples of resin material is for being the poly-vinyl resin of representative with low density polyethylene (LDPE), medium density polyethylene, high density polyethylene (HDPE), linear low density polyethylene, linear ultra-low density polyethylene, with the polyethylene of metallocene catalyst and vinyl-vinyl acetate copolymer production; But the random and block polypropylene copolymer resin that between the copolymer composition of ethene, 1-butylene or 4-methyl-1-pentene and propylene, forms; By adopting metallocene catalyst to obtain atactic polypropylene copolymer resin and composite by two or more above-mentioned resin alloys are obtained.

Among them, has 0.927g/cm ³Or the poly-vinyl resin of bigger resin density is preferred, has 0.970g/cm ³Or the atactic polypropylene copolymer resin between the poly-vinyl resin of littler resin density and ethene or butene-1 and the propylene is more preferred.When the density of poly-vinyl resin is in above-mentioned scope, the buffer body that is obtained has appropriate physical properties, for example rigidity, elasticity and recovery, and have enough actual behaviors, the shape stability that for example significantly improves, the damping of shocks when falling, for reusable durability and the performance that prevents to produce dust.And in order to obtain specific elasticity of compression index, the expansion rate of buffer body can raise higherly relatively, and its effect is to reduce the weight of buffer body and manufacturing cost.In addition, because the random copolymerization acrylic resin between ethene or butene-1 and the propylene has the elasticity higher than polyethylene, so they are suitable for as the buffer body that is used for the large-size glass substrate, and has excellent shape stability, can keep their original shape for a long time at repeated usage, be preferred therefore.

First requirement for the buffer body of the present invention that comprises polyolefin pearl foams is that the foam beads that constitutes buffer body has preferred 1.5mm or bigger average particle size particle size, more preferably 5.0mm or littler.More preferably, this is of a size of 2.0mm or bigger, and most preferably is 4.5mm or littler.When average particle size particle size is in this scope, the face area of a foam beads is very little with the ratio of volume, to such an extent as to therefore very little of the reduction of intragranular gas (air) pressure, fully expand by adding thermal foam when carrying out steam heating in moulding process.The result, between the lip-deep foam beads of syntactic foam that obtains by the in-mould injection moulding, forming small gap hardly, such buffer body is used to carry under the situation of glass substrate, and koniology can not invade in this part, therefore obtains fabulous cleanliness level.And, in can forming the particles filled process in metal die of foam, therefore they can be filled in the small part of the substrate insertion groove with very narrow width equably, and can obtain to have very high-precision buffer body aspect matching in shape and size with metal die.

In addition, the average particle size particle size of foam bead-like body is by quantity of drawing three long lines of 100mm, foam beads that measurement contacts with described line on the surface of in-molded product and the value that is obtained according to following formula (A) calculating average particle size particle size C (mm).In addition, this value is the mean number of the value of described three lines acquisition.

C＝(1.626×L)/N … (A)

L wherein; Centerline length (mm);

N: numbers of particles

Be the physical property of this buffer body for second requirement of the buffer body of the present invention that comprises polyolefin pearl foams.That is, this buffer body need have preferred 70% or bigger fusion ratio, preferred 3.9 or the elasticity of compression exponential sum preferred 60% of bigger (more preferably 490 or littler) or bigger answer ratio.

In addition, above-mentioned fusion ratio is by form the otch of an about 1mm along thickness direction in buffer body, this otch is folded this buffer body so that its disconnection towards the other places, in the breaking part zone of whole length, measure the number of complete foam beads and disconnect number of particles along depth direction and about in the vertical 75mm place, therefore and will disconnect the numerical value of number of particles, and represent the value calculated with percentum divided by the number gained of complete foam beads.In the present invention, when fusion ratio is 70% or when bigger, the characteristic relevant with mechanical strength, for example intrinsic compression strength and the tensile strength of polyolefin pearl foams can fully be realized.That is, be fused into one securely owing to constitute the countless foam beads of this buffer body, so obtain a buffer body with excellent durability and recovery.Therefore, fix and pack under the situation of glass substrate adopting buffer body of the present invention, this buffer body can fully be resisted the very strong seizing force of connecting element, therefore can fix high-levelly and pack glass substrate, and the possibility of the fracture of glass substrate reduces further.And then, between the lip-deep foam beads of buffer body, there is not small gap, and clean so that carry out in the process of reprocessing after using at water, this buffer body fully shows not water absorbing characteristic, and this provides advantage excellent in drying operation.

And when the elasticity of compression index of buffer body was in above-mentioned scope, this polyolefin can show its intrinsic maximum cushioning ability, and this buffer body has good balance between rigidity and elasticity.Especially, though the large-size substrate with 500mm * 600mm or bigger glass substrate size also can with very high horizontal stable fix and protect.In addition, be enough to resist the intensity that is applied to the external force on it because buffer body has in transportation or handling process, it only stands slight distortion, and shows and enough can make buffer body reusable durability in for a long time.And the expansion ratio that is used to obtain the buffer body of specific compression elasticity indexes can be increased to higher level, in order to weight and the manufacturing cost that reduces buffer body.

And then, because elasticity of compression index is in above-mentioned scope and reply than being 60% or bigger, so this buffer body shows excellent durability for repeated usage, this is considered to the maximum characteristic of polyolefin pearl foams, even and when frequency of utilization raises, also can be with minimizing deformation.

In addition, above-mentioned elasticity of compression index is by with elasticity of compression power (N/cm ²) numerical value that obtains divided by expansion ratio.

Above-mentioned elasticity of compression power is the value of determining with a sample, the expansion ratio of described sample by following described mode according to JIS K7220, measure out with the compression speed of 10mm/min.Adopt the sample of thickness, a plurality of samples are piled up the thickness of the about 20mm of formation and measured less than 20mm.

Expansion ratio is to be that 50mm, length are that 50mm and thickness are the flat specimen of 20mm by cut next width from buffer body, measures the magnitude of the weight of sample to 10mg, utilizes width, length and the thickness of vernier caliper measurement sample, so that volume calculated (cm ³), and according to following formula (B) calculating expansion ratio E (cm ³) and obtain.

E=volume/weight (cm ³/ g) ... (B)

Recoverability is to be that 50mm, length are that 50mm and thickness are the flat specimen of 20mm by cut next width from buffer body, compression speed with 10mm/min is compressed to 50% of its thickness with compression test equipment with sample, the autograph AG-5000D that makes with Shimazu Seisaku-sho K.K. draws then, shed load with identical speed immediately then, thickness when measuring the load vanishing, and obtain than R (%) according to formula (C) the calculating answer shown in following.In addition, adopt the sample of thickness less than 20mm, the thickness of a plurality of samples being piled into about 20mm is measured.

R＝(T1/T0)×100(％) … (C)

T0 wherein: the thickness (mm) before the test;

T1: the thickness (mm) of (when the load vanishing) after the test.

Below, packing articles of the present invention is described.Packing articles of the present invention is to pack a plurality of glass substrates by use as two or more buffer bodies of the present invention of one group to form, and described buffer body is preferably quartet.Promptly, place a plurality of glass substrates on the position that is parallel to each other with predetermined space, so that form a cuboid, each bight of each substrate is inserted in the substrate insertion groove of buffer body of the present invention, so that four limits of cuboid and substrate surface at right angles are inserted in the buffer body.Then, with a long connecting element along buffer body L shaped be wrapped in cuboid around so that bundle.Have at buffer body under the situation of connecting element guide groove, this connecting element twines along the connecting element guide groove.

In addition, as outermost glass substrate, a false glass substrate can be set.

Below, another embodiment of the glass substrate package goods of the employing buffer body of the present invention that is different from above-mentioned connection with wrapping of piece is described.

A plurality of glass substrates place on the position that is parallel to each other with predetermined interval, so that form a cuboid, each bight of each substrate is inserted in the substrate insertion groove of buffer body of the present invention, so that four limits and the substrate surface of cuboid at right angles is inserted in the buffer body.Then, a long connecting element is wrapped in around the cuboid to bundle and to fix along buffer body L shaped.After forming packing articles, with a heat-shrinkable resin film this packing articles is sealed, heat-treat then so that therefore described film thermal contraction is shunk this packing articles and sealed.

In addition, sealing under the situation of this packing articles with above-mentioned heat-shrinkable resin film, this packing articles can be placed in a bag shape or the film cylindraceous, and preferred after the end heated sealant to film, can make the film thermal contraction so that tightly stick on this packing articles.

Above-mentioned packing articles has such characteristic, promptly with buffer body of the present invention a plurality of glass substrates being wired up formed packing articles with being integral is sealed by a heat-shrinkable film contraction, even this make for the packing articles of large-size glass substrate to seal operation also very convenient, and make that seal can automation.In addition, in the packing articles that this is sealed, heat-shrinkable film can not relax fully, and therefore in the packing articles outermost substrate can not contact with film and pollute this glass substrate.Therefore, do not need to adopt false substrate, and can effectively utilize buffer body.And then because the shrink stress of film, whole buffer body is from outside pressurized, and therefore buffer body and glass substrate is fixed up with being integral, and this is used to prevent that glass substrate from leaving described groove or sustain damage.In addition, because glass substrate that the vibration in transportation causes and the wipe contact between the buffer body are reduced,, keep the cleanliness level of glass substrate to such an extent as to can prevent to produce cut or dust deposit on the glass substrate.

But the thermo-contracting resin film as adopting in contraction is sealed is exemplified as polyolefin resin film and Vinyl chloride resin film.Yet Vinyl chloride resin comprises a large amount of various plasticizer and stabilizer, so that owing to its performance is given the extrusion film moulding with processability and alerting ability.As time goes on these additives can be exuded on the film surface, even perhaps also may cause the very Evaporation Phenomenon of small quantity under common temperature.Therefore, for the encapsulated glass substrate, the cleanliness level of work area may worsen, and perhaps packing articles is sealed when handling, and may cause additive adhesion to hand and then the gross pollution problem that contacts with glass substrate.In addition, although preferably film is sealed to seal described packing articles so that prevent that dust is invaded from the outside in transportation, but Vinyl chloride resin has relatively poor heat-sealing comformability and needs expensive equipment, for example ultrasonic equipment or high frequency water-tight equipment.Therefore, preferably adopt polyolefin resin film.

As polyolefin resin film, can adopt the single or multiple lift product of crosslinked or noncrosslinking acrylic resin or poly-vinyl resin.

This polyolefin resin film, at least one direction under 120 ℃ in a longitudinal and transverse direction have at least 15% or bigger, more preferably 90% or littler hot contraction ratio.More preferably, this hot contraction ratio is 20% or bigger.Further preferably, the hot contraction ratio on the vertical and horizontal both direction is 15% or bigger and 90% or littler.When experience in described scope during thermal contraction, this packing articles ground that can not get loose tightly shrinks and seals, and does not therefore exist owing to contact the risk that causes the glass substrate pollution between glass substrate and the film.In addition, hot contraction ratio is by measure the value of acquisition according to ASTM D-2732 under 120 ℃.

And at least on the direction in horizontal direction and longitudinal direction, the maximum heat shrink stress under 120 ℃ is preferably 0.15N/mm ²Or bigger, 5N/mm more preferably ²Or it is littler.More preferably, be 0.2N/mm ²Or bigger and 4.5N/mm ²Or it is littler.Further preferably, on horizontal direction and longitudinal direction both direction, be 0.15N/mm ²Or bigger and 5N/mm ²Or it is littler.

Maximum heat shrink stress in the time of 120 ℃ is in above-mentioned scope the time, and this packing articles ground that can not got loose tightly shrinks and seals, and this film is not easy to contact with glass substrate, so can keep the cleanliness level of glass substrate.In addition, because thermal shrinkage stress is on proper level,, and can carries out leak free and seal to prevent that dust from invading from the outside so film can not rupture in the bight when sealing.

In addition, the maximum heat shrink stress is a value of measuring acquisition according to ASTM D-2838 by at 120 ℃.

And then the thickness of polyolefin resin film is preferably 10 μ m or bigger, more preferably 200 μ m or littler.Further preferably, this thickness is 20 μ m or bigger, most preferably is 180 μ m or littler.When this thickness was in described scope, this film had suitable body, and the operation that therefore can seal packing articles ingenious, easily and effectively.And, can carry out heat seal with very high weld strength, and described film have enough disruption characteristic so as in transportation or when carrying opposing impact.

As the connecting element that adopts in the present invention, can use the rope or belt of any length.For example, the belt that preferably adopts polypropylene to make.

Buffer body of the present invention is one group of use with four.The shape of described four buffer bodies can be identical or shape can be different mutually.For example, under the situation of packing large-size glass substrate, can be with bigger and thicker buffer body as being positioned at the buffer body of bottom, so that bear the weight of glass substrate.

In addition, except adopting quaternate buffer body of the present invention as mentioned above, also can use buffer body of the present invention in the following manner.That is, can along relative direction two buffer bodies of the present invention be fixed on the plastic container or the bottom in the plastic ripple case with upper shed, move, and insert glass substrate to fix from upper shed to prevent buffer body with holding element.If desired, can be with a closed with covers upper shed to prevent the intrusion of dust.This can be used for glass substrate is taken care of.In this case, when being fixed on buffer body of the present invention or plastic foam plate on the described lid, this container can also be used to transport.

Example

Example 1 and reference example 1

(glass substrate)

The mother glass that is used for Liquid Crystal Display (LCD)

Size: 600mm * 720mm

Thickness: 0.7mm

(foam)

Resin material:

Expansion ratio is 20cm ³The ethylene-propylene random copolymer of/g; The mean grain size of resin foam particle: 3.6mm

Fusion ratio: 86%

Elasticity of compression index: 549N/cm ²

(buffer body)

The glass substrate number of packing: 26

Oad:

Minor face: 250mm

Long limit: 350mm

Length (meeting at right angles): 300mm with short brink and long side

Maximum ga(u)ge: 32mm

The substrate insertion groove:

Width: 2.4mm

The degree of depth: 12mm

Spacing: 20mm

The shape of jut:

Have from vertical wall and the width the flat of substrate insertion groove bottom 6.5mm and be 8mm and highly be the trapezoidal top of 5.5mm (shape is shown in Fig. 4 (c))

(connecting element guide groove)

On 1/4 spaced positions of both sides, form the connecting element guide groove of two 30mm with the above-mentioned length (300mm) of buffer body.The degree of depth of this groove is 1mm in L shaped end, and forms an arc sloping portion with the radius of 20mm, is 4mm in the bottom of groove and the degree of depth of the junction between the sloping portion.

(free drop test)

Adopt 4 above-mentioned buffer bodies as shown in Figure 2 glass substrate package to be got up, make a packing articles.In order to estimate the cushion characteristic of the buffer body in the packing articles, make this packing articles stand free drop test.In addition, as a reference example 1, employing is that other identical buffer body carries out same test 65% except fusion ratio.

Test condition:

Height of drop: 30cm

The surface, whereabouts of packing articles: only be the bottom surface of packing articles

Whereabouts number of times: 3 times

Even the packing articles of example 1 is falling the disengaging of glass substrate does not take place after 3 times yet, and keeps the packed state before the test, do not find damage.And, as for the deposition of dust on glass baseplate surface of buffer body, do not have fully to find can observable size dust.

The packing articles of reference example 1, although glass substrate does not break away from, on basal surface in having produced small fragment along the bight of the glass substrate of the long side direction of buffer body with described groove.Examine the reason that this buffer body, research fragment produce, demonstrate between the foam bead-like body and form crackle, and infer former because glass substrate is owing to descend drop impact to embed in the buffer body.In addition, also found the motion track of foam bead-like body, therefore found that the buffer body of this buffer body ratio 1 is of poor quality aspect anti-reusability.That is, because the fusion ratio of buffer body is lower than 70% or littler, so they must reduce the mechanical strength of buffer body, and imagination will produce excessive deformation when being subjected to down drop impact.

Example 2 and comparative example 1

(glass substrate)

The mother glass that is used for Liquid Crystal Display (LCD)

Size: 550mm * 650mm

Thickness: 0.7mm

(foam)

Resin material:

Expansion ratio is 20cm ³/ g and resin density are 0.930g/cm ³Crosslinked polyethylene

The average particle size particle size of resin foam particle: 2.8mm

Fusion ratio: 98%

Elasticity of compression ratio: 412N/cm ³

Elasticity of compression index: 41.2

(buffer body)

The number of the glass substrate of packing: 12

Oad:

Short brink: 210mm

Long side: 310mm

Length (meeting at right angles): 240mm with short brink and long side

Maximum ga(u)ge: 23mm

The substrate insertion groove:

Width: 1.5mm

The degree of depth: 7mm

Spacing: 20mm

The shape of jut:

Have from the vertical wall of substrate insertion groove bottom 3.5mm and highly be the lambdoid top of 3.5mm (shape is shown in Fig. 4 (b))

(connecting element guide groove)

The width of two connecting element guide grooves is 25mm, with 1/4 position of buffer body length (240mm) at interval, both sides.Forming described groove towards the bight from the position with L shaped end part interval 50mm, and form the circular rake that radius is 10mm in the bight, is 3mm in the bottom of described groove and the degree of depth of the junction between the rake.

(vibration-testing)

Adopt above-mentioned four buffer bodies as shown in Figure 2 with glass substrate package, so that make a packing articles.In order to estimate the ability of buffer body fixing glass substrate, make this packing articles stand vibration-testing.On the platform that applies vibration that packing articles is fixed to vibration measurement instrument, carry out vibration-testing according to JIS Z0232.As a comparative example 1, adopt the degree of depth except the connecting element guide groove to be on all positions that other identical buffer body carries out same test the 1mm.

Test condition:

Direction of vibration: up and down

The waveform of vibration: sinusoidal waveform

Scanning: writing scan (frequency be 5 to 100Hz)

Scanning speed: 0.5octave/min

Vibration acceleration: ± 0.75G

Time of vibration: 30 seconds

After vibration-testing is finished, the packing stationary state of visual observation glass substrate, although demonstrate and between glass substrate and buffer body, find slight becoming flexible, but in example 2, there is not glass substrate to leave the substrate insertion groove, and, about the dust of buffer body deposition to glass baseplate surface, do not have fully to find can observable size dust.

Adopt the packing articles of comparative example 1, vibration-testing begins after 8 minutes the time, glass substrate breaks away from the substrate insertion groove on two long sides of going up buffer body, and contact with adjacent glass substrate, so owing to existing impaired risk to stop to test.

The present invention is had been described in detail, it will be understood by those skilled in the art that under the situation that does not exceed the spirit and scope of the invention and can carry out various changes and distortion with reference to specific embodiment.

The application is based on the No.396934/2000 Japanese patent application of application on November 27th, 2000, and its content in this combination as a reference.

Industrial applicibility

In sum, buffer body of the present invention prevent when bundling with fixture, fixture Seizing force concentrate on the bight, even and therefore fixture also be pressed in well glass in the end On the glass substrate, thereby glass substrate can not released described groove, therefore show good protection Effect. Especially, do by the size of regulating buffer body and the foam that employing has particular characteristic For consisting of the foams of buffer body, can easily pack and take out the work of glass substrate Already, and be suitable for automatically correcting students' papers. In addition, this buffer body is in dust protection performance and durable The property aspect is very excellent, and is suitable for processing in the clean room, and can reuse. Therefore, have in the packing articles of a plurality of glass substrates in packing of the present invention, can protect safely Protect packaged glass substrate and in transportation, be not subjected to vibratory impulse or lower drop impact, and press Go out significant defective individuality.

Claims

1. A cushioning body for a glass substrate comprising polyolefin bead foam and having a substantially L-shaped cross-section conforming to the shape of a corner of a glass substrate, on an inner surface thereof a plurality of substrates are formed along the L-shape The insertion groove is used to fix both sides of the glass substrate forming the corner, and at least one fixture guide groove is formed along an L shape on its outer surface, wherein the thickness of the buffer body based on the bottom of the fixture guide groove is from Both ends of the L-shape are tapered toward the central portion, and the buffer body has grooves in a direction at right angles to the substrate insertion groove.

2. The buffer body for a glass substrate as claimed in claim 1, wherein a bottom of the guide groove of the fixing member is inclined at a corner.

3. A cushioning body for a glass substrate, comprising polyolefin bead foam, and having a substantially L-shaped cross-section conforming to the shape of a corner of a glass substrate, and forming a plurality of substrates along the L-shape on an inner surface thereof The insertion groove is used to fix both sides of the glass substrate forming the corner, wherein the thickness of the buffer body gradually decreases from the two ends of the L shape to the central part, and, in the direction at right angles to the substrate insertion groove, the buffer body has grooved.

4. A cushioning body for a glass substrate, comprising polyolefin bead foam, and having a substantially L-shaped cross-section conforming to the shape of a corner of the glass substrate, and forming a plurality of substrates along the L-shape on its inner surface Inserting grooves for fixing both sides of the glass substrate forming corners in which protrusions are formed on the outer sides of both ends of the L shape.

5. The buffer body for a glass substrate as claimed in claim 4, wherein one outer corner of the buffer body is inclined.

6. The buffer body for a glass substrate according to any one of claims 1 to 5, wherein grooves are formed on an inner side of the buffer body in a direction at right angles to the substrate insertion groove.

7. The buffer body for a glass substrate as claimed in any one of claims 1 to 5, wherein the buffer body has a maximum thickness of 10 to 60 mm, based on the short sides, forming the ratio of both sides of the L shape 1.0 to 3.0, and the substrate insertion groove has a width corresponding to 1.0 to 4.0 times the thickness of the glass substrate, and a depth of 3 to 15 mm, and a groove pitch of 6 to 100 mm.

8. The cushioning body for a glass substrate as claimed in any one of claims 1 to 5, wherein the polyolefin bead foam comprises particles with an average particle size of 1.5 to 5.0 mm, and has 70% or more Fusion ratio, compression elasticity index of 3.9 to 490, and recovery ratio of 60% or greater.

9. A packaging product, comprising:

multiple glass substrates;

The buffer body for glass substrates according to claim 1, by inserting the four corners of the glass substrates into the substrate insertion grooves, the buffer body is fixed in a state where the glass substrates are arranged parallel to each other at predetermined intervals. a glass substrate; and

Long fasteners that wrap around the fastener guide grooves of the cushioning body for strapping.

10. A packaging product, comprising:

multiple glass substrates;

The buffer body for glass substrates according to claim 3 or 4, by inserting the corners of the glass substrates into the substrate insertion grooves, the buffer body is fixed as much as possible in the state where the glass substrates are arranged parallel to each other at a predetermined pitch. a glass substrate; and