CN121054556A - Electrostatic chuck for large-size display panel and simulation method - Google Patents
Electrostatic chuck for large-size display panel and simulation methodInfo
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- CN121054556A CN121054556A CN202511582328.3A CN202511582328A CN121054556A CN 121054556 A CN121054556 A CN 121054556A CN 202511582328 A CN202511582328 A CN 202511582328A CN 121054556 A CN121054556 A CN 121054556A
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Abstract
The application relates to the technical field of electrostatic chucks, in particular to an electrostatic chuck for a large-size display panel and a simulation method, wherein the electrostatic chuck comprises a chuck body, a chuck body and a chuck body, wherein the center of the bottom surface of the chuck body is provided with an air inlet; the chuck comprises a chuck body, two main air flow channels which are perpendicular to each other, wherein the centers of the two main air flow channels are communicated with an air inlet, the two main air flow channels are used for dividing the chuck body into four temperature control areas, each temperature control area is internally provided with an air outlet hole array which is communicated with the main air flow channels, all the air outlet hole arrays are symmetrically arranged, each air outlet hole array comprises a plurality of air outlet holes of rectangular arrays, the density of the air outlet holes in the area close to the air inlet is higher than that of the air outlet holes in the area far away from the air inlet, and the chuck can effectively simplify the structure of the electrostatic chuck and the helium distribution flow according to requirements.
Description
Technical Field
The application relates to the technical field of electrostatic chucks, in particular to an electrostatic chuck for a large-size display panel and a simulation method.
Background
In the manufacturing process of the display panel, when the G8.6 generation large-size glass substrate is placed on an electrostatic chuck for film deposition or etching, the temperature of the substrate is increased sharply due to continuous bombardment of plasma, and the surface temperature of the substrate is required to be controlled within a set value in precision processing. At present, heat dissipation is mainly carried out by means of an electrostatic chuck, but the heat conductivity is extremely low due to the fact that a vacuum gap exists between the glass substrate and the surface of the electrostatic chuck, and the glass substrate is cooled by means of helium cooling in the prior art. Specifically, the prior art heat exchanges helium gas with the glass substrate by delivering the helium gas from the gas holes on the top surface of the electrostatic chuck to the gap between the glass substrate and the surface of the electrostatic chuck through the annular distribution gas channel.
However, the conventional design has the defects that in the conventional electrostatic chuck design, a plurality of air outlet holes arranged at intervals share a distribution air channel, helium enters the distribution air channel and is redistributed to the air outlet holes, each air outlet hole is uniformly distributed on the electrostatic chuck, and as the plasma heat load of the central area of the glass substrate is larger than that of the edge area of the glass substrate, the related art needs to arrange flow regulating components at each air outlet hole and independently regulate each flow regulating component so as to enable the air outlet amount of the air outlet hole close to the central area of the glass substrate to be larger than that of the air outlet amount close to the edge area of the glass substrate to meet the heat dissipation requirement of different areas of the glass substrate, and therefore, the related electrostatic chuck has the problems of complex structure and the requirement of complex active control to realize the on-demand distribution of the helium.
In view of the above problems, no effective technical solution is currently available. It should be noted that the above information disclosed in this section is only for understanding the background of the inventive concept, and thus may contain information that does not constitute prior art.
Disclosure of Invention
The application aims to provide an electrostatic chuck for a large-size display panel and a simulation method, which can effectively simplify the structure of the electrostatic chuck and the helium distribution flow according to requirements.
In a first aspect, the present application provides an electrostatic chuck for a large-sized display panel, comprising:
the chuck body, its bottom center has air inlets;
The two main air flow channels are perpendicular to each other and are arranged in the chuck body, the centers of the two main air flow channels are communicated with the air inlet, the two main air flow channels are used for dividing the chuck body into four temperature control areas, each temperature control area is internally provided with an air outlet hole array communicated with the main air flow channel, and all the air outlet hole arrays are symmetrically arranged;
The air outlet hole array comprises a plurality of air outlet holes of a rectangular array, and the density of the air outlet holes in the area close to the air inlet is higher than that in the area far away from the air inlet.
According to the electrostatic chuck for the large-size display panel, the dense air outlet holes are arranged in the area close to the center area of the glass substrate and the sparse air outlet holes are arranged in the area close to the edge area of the glass substrate in a mode that the density degree of the air outlet holes in the area close to the air inlet is higher than that in the area far from the air inlet, so that the flow resistance of cooling gas in the area close to the center area of the glass substrate is reduced, and the flow resistance of cooling gas in the area close to the edge area of the glass substrate is increased.
Optionally, a plurality of gas communication holes and secondary gas flow channels are further arranged in the chuck body, the gas communication holes are equidistantly arranged along the extending direction of the main gas flow channel, two ends of the gas communication holes are respectively communicated with one ends of the main gas flow channel and the secondary gas flow channel, and the gas outlet hole array is communicated with the other ends of the secondary gas flow channels.
According to the technical scheme, the conditions of pressure fluctuation and uneven flow caused by the fact that gas directly enters the air outlet hole array from the main air flow channel can be effectively avoided through the buffering and redistribution effects of the gas communication holes and the secondary air flow channels, so that the temperature distribution of the working face of the electrostatic chuck is more uniform, the risk of uneven heating of the panel in the plasma process is reduced, and a more stable and uniform cooling effect is provided for a large-size display panel.
Optionally, the depth of the gas communication holes is smaller than the depth of the gas outlet hole array.
The shallower gas communication holes can be used as a preset throttle point to primarily equalize the flow rate and pressure of the gas before the gas enters the deeper gas outlet hole arrays, and this depth difference helps to establish a more uniform pressure field in the whole gas flow path, so as to ensure that the cooling gas can be distributed to each gas outlet hole array at a more uniform flow rate, and avoid excessively large or excessively small local flow rate caused by the path length or the structural difference, thereby improving the overall distribution uniformity of the cooling gas in the chuck body.
Optionally, the air inlet has a rounded transition.
According to the technical scheme, the cooling gas can be guided to smoothly change the direction and flow separation and vortex flow can be effectively eliminated by enabling the air inlet to have a rounded transition, so that the fluid resistance and pressure loss of the cooling gas can be effectively reduced, and the pressure of the cooling gas entering the main air flow channel can be quickly balanced.
Alternatively, the cross-sectional shape of the main air flow passage is rectangular, the length of the long side of the rectangle is 2mm, and the length of the short side of the rectangle is 1.5mm.
In a second aspect, the present application provides an electrostatic chuck simulation method for a large-sized display panel, for simulating the electrostatic chuck for a large-sized display panel provided in the first aspect, the method comprising the steps of:
S1, constructing an electrostatic chuck digital twin model according to structural characteristics of an electrostatic chuck for a large-size display panel;
s2, setting simulation parameters for a digital twin model of the electrostatic chuck according to the self materials of the electrostatic chuck for the large-size display panel and parameters of cooling gas;
S3, adding a solid heat transfer field, a fluid heat transfer field and a laminar flow physical field into the electrostatic chuck digital twin model, wherein the solid heat transfer field and the fluid heat transfer field are used for describing the heat transfer condition of the electrostatic chuck digital twin model;
S4, carrying out structural grid division on the electrostatic chuck digital twin model;
s5, carrying out instantaneous coupling solution on the digital twin model of the electrostatic chuck to obtain a simulation result of the digital twin model of the electrostatic chuck under a plasma process, wherein the simulation result comprises a surface temperature distribution result, a helium flow field distribution result and an isotherm distribution result of the electrostatic chuck;
And S6, optimizing the layout and the size of the gas communication holes according to the helium flow field distribution result, optimizing the layout and the size of the gas outlet holes according to the surface temperature distribution result, and optimizing the material and the thickness of the electrostatic chuck according to the isotherm distribution result.
Optionally, step S3 includes:
S31, setting the heat conductivity and density of a digital twin model of the electrostatic chuck according to the parameters of the self material of the electrostatic chuck for the large-size display panel so as to obtain a solid heat transfer field;
s32, setting a plasma heat flow density load of a working surface of the digital twin model of the electrostatic chuck and a convection heat exchange boundary of the bottom surface and the side surface of the digital twin model of the electrostatic chuck according to a power density range of a large-size panel manufacturing process so as to obtain a fluid heat transfer field;
S33, setting the quality condition of an air inlet and the outlet pressure of an air outlet hole array according to the parameters of cooling gas used by an electrostatic chuck for a large-size display panel so as to obtain a laminar flow physical field;
s34, adding a solid heat transfer field, a fluid heat transfer field and a laminar flow physical field into the electrostatic chuck digital twin model.
Optionally, the self material of the electrostatic chuck for the large-size display panel is aluminum nitride ceramic material, the cooling gas is helium, the thermal conductivity is 180W/m.K, the density 3300kg/m 3, the plasma heat flow density load is 0-12W/cm 2, the convective heat transfer boundary of the bottom surface of the digital twin model of the electrostatic chuck is 85W/m 2.K, the mass condition is 0.12kg/s, and the outlet pressure is 10 -3 Torr.
Optionally, step S4 includes:
S41, dividing the electrostatic chuck digital twin model into multiple layers of boundary layer grids based on an unstructured grid division strategy.
As can be seen from the above, according to the electrostatic chuck and the simulation method for a large-sized display panel provided by the application, dense air outlet holes are arranged in the area close to the central area of the glass substrate and sparse air outlet holes are arranged in the area close to the edge area of the glass substrate in a manner that the density degree of the air outlet holes in the area close to the air inlet is higher than that in the area far from the air inlet, so that the flow resistance of cooling gas in the area close to the central area of the glass substrate is reduced and the flow resistance of cooling gas in the area close to the edge area of the glass substrate is increased.
Drawings
Fig. 1 is a schematic structural diagram of an electrostatic chuck for a large-sized display panel according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of an electrostatic chuck and a glass substrate for a large-sized display panel according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of an electrostatic chuck for a large-sized display panel according to a first embodiment of the present application.
Fig. 4 is a schematic cross-sectional view of an electrostatic chuck for a large-sized display panel according to a second embodiment of the present application.
Fig. 5 is a schematic cross-sectional view illustrating a gas communication hole, an air outlet hole array and a secondary gas flow path according to an embodiment of the present application.
Fig. 6 is a flowchart of an electrostatic chuck simulation method for a large-sized display panel according to an embodiment of the present application.
Reference numeral 1, chuck body, 2, gas inlet, 3, gas outlet hole array, 4, gas communication hole, 5, glass substrate, 6, main gas flow channel, 7, secondary gas flow channel.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
In a first aspect, as shown in fig. 1 to 5, the present application provides an electrostatic chuck for a large-sized display panel, comprising:
The chuck body 1 is provided with an air inlet 2 at the center of the bottom surface;
two mutually perpendicular main air flow channels 6 are arranged in the chuck body 1, the centers of the two main air flow channels 6 are communicated with the air inlet 2, the two main air flow channels 6 are used for dividing the chuck body 1 into four temperature control areas, each temperature control area is internally provided with an air outlet hole array 3 communicated with the main air flow channel 6, and all the air outlet hole arrays 3 are symmetrically arranged;
The array of gas outlet holes 3 comprises a plurality of rectangular arrays of gas outlet holes, the density of the gas outlet holes in the region close to the gas inlet 2 being greater than the density of the gas outlet holes in the region remote from the gas inlet 2.
The large-size display panel of this embodiment is preferably a G8.6 or more generation display panel, and the application divides the chuck body 1 into four temperature control areas by arranging two mutually perpendicular main air flow channels 6 in the chuck body 1 and communicating the center of the main air flow channels 6 with the air inlet 2, each temperature control area is provided with an air outlet hole array 3 communicated with the main air flow channels 6, and all the air outlet hole arrays 3 are symmetrically arranged to improve the flow distribution uniformity of cooling air, thereby improving the processing precision of the large-size display panel, namely the application is equivalent to realizing uniform cooling of the large-size display panel by optimizing the flow channel design of the cooling air. the chuck body 1 of this embodiment refers to a main structure of an electrostatic chuck, the chuck body 1 is generally made of a ceramic material, and the chuck body 1 is capable of adsorbing a glass substrate 5 with a uniform adsorption force generated by a high-voltage electrostatic magnetic field. The gas inlet 2 of this embodiment refers to the inlet of the cooling gas into the chuck body 1, the gas inlet 2 being located at the center of the bottom surface of the chuck body 1. The main gas flow channel 6 of this embodiment refers to a main channel for guiding cooling gas inside the chuck body 1, and it should be understood that, since the center of the main gas flow channel 6 of this embodiment is communicated with the gas inlet 2, the gas inlet 2 of this embodiment is located at the center of the bottom surface of the chuck body 1, so this embodiment is equivalent to making cooling gas enter the electrostatic chuck from the center of the electrostatic chuck and making cooling gas simultaneously distribute cooling gas to the gas outlet hole arrays 3 in four temperature control areas after entering the electrostatic chuck, i.e. the gas inlet 2 of this embodiment is equivalent to a natural pressure balance cavity, so that cooling gas is quickly mixed and uniformly spread around here, so as to effectively reduce the inlet pressure difference of each gas outlet hole array 3. The temperature control region of this embodiment refers to a region of the chuck body 1 divided by the main gas flow channel 6, preferably, each temperature control region is provided with a proportional valve for adjusting the flow rate of the cooling gas flowing into its corresponding temperature control region, and it should be understood that since this embodiment can achieve the divided adjustment of the intake flow rate of the cooling gas by configuring the proportional valve for each temperature control region, even if a slight pressure difference due to a machining error occurs, this embodiment can make the intake pressure of each temperature control region the same by adjusting the opening of the proportional valve corresponding to each temperature control region in real time, that is, this embodiment can effectively compensate for the slight pressure difference due to a machining error, and this embodiment can also simultaneously satisfy the cooling requirements of all temperature control regions in the case of different cooling requirements of different temperature control regions based on the cooling requirements of the temperature control regions by adjusting the opening of the corresponding proportional valve. The control logic of the proportional valve in this embodiment is to obtain the actual temperature of each temperature control region by using an infrared thermometer, and for each temperature control region, adjust the opening of the proportional valve corresponding to the temperature control region based on a PID control algorithm according to the corresponding actual temperature and a preset target temperature to adjust the flow rate of the cooling gas flowing into the temperature control region, for example, when the actual temperature of the temperature control region is greater than the target temperature, increase the opening of the proportional valve corresponding to the temperature control region to increase the flow rate of the cooling gas flowing into the temperature control region, so that the actual temperature of the temperature control region is reduced to the target temperature, or when the actual temperature of the temperature control region is less than the target temperature, decrease the opening of the proportional valve corresponding to the temperature control region, so that the actual temperature of the temperature control region is increased to the target temperature. Since the plasma heat load of the central region of the glass substrate 5 is greater than that of the edge region of the glass substrate 5, this embodiment can achieve the arrangement of dense gas outlets in the region near the central region of the glass substrate 5 and the arrangement of sparse gas outlets in the region near the edge region of the glass substrate 5 by making the gas outlets denser in the region near the gas inlet 2 than that in the region far from the gas inlet 2 (i.e., the gas outlets of the present application are not uniformly distributed on the electrostatic chuck) so as to reduce the flow resistance of the cooling gas in the region near the central region of the glass substrate 5 and increase the flow resistance thereof in the region near the edge region of the glass substrate 5, so that the flow distribution trend of the cooling gas is highly matched with the heat load distribution trend of the glass substrate 5, thereby achieving the on-demand distribution of the cooling gas and maintaining the high temperature uniformity of the large-sized display panel without complex active control. It should be understood that since the center of the main gas flow path 6 of the embodiment communicates with the gas inlet 2, the gas inlet 2 of the embodiment is located at the center of the bottom surface of the chuck body 1, and one end of the main gas flow path 6 of the related art communicates with the gas inlet 2, the embodiment can effectively shorten the distance of the cooling gas flowing from the gas inlet 2 to the most distal gas outlet hole, and since the pressure loss along the way of the cooling gas is positively correlated with the flowing distance of the cooling gas, the embodiment can effectively reduce the pressure loss along the way of the cooling gas. The gas outlet hole array 3 of this embodiment refers to a collection of a plurality of gas outlet holes communicating with the main gas flow channel 6 in each temperature control region, through which the cooling gas enters the gap between the glass substrate 5 and the electrostatic chuck, and the cooling gas entering the gap between the glass substrate 5 and the electrostatic chuck exchanges heat with the glass substrate 5.
Specifically, the electrostatic chuck of the present application comprises a chuck body 1, wherein an air inlet 2 is arranged at the center of the bottom surface of the chuck body 1, and the air inlet 2 can be designed into various shapes, such as a round shape, a square shape or an oval shape, so as to adapt to different air introduction requirements. Two main air flow channels 6 perpendicular to each other are arranged in the chuck body 1, and the centers of the two main air flow channels 6 are communicated with the air inlet 2. The cross-sectional shape of the main gas flow channel 6 may be rectangular, circular or oval, and the two main gas flow channels 6 divide the chuck body 1 into four independent temperature controlled areas in such a way that the cooling gas can be more finely distributed to the respective areas. In each temperature controlled zone there is an array of gas outlet holes 3 communicating with the main gas flow channel 6, which gas outlet hole arrays 3 may consist of a plurality of circular, square or rectangular gas outlet holes, for example, the gas outlet hole arrays 3 may comprise a plurality of rectangular array of gas outlet holes, all gas outlet hole arrays 3 being symmetrically arranged to ensure that the cooling gas is evenly distributed to the respective temperature controlled zone.
According to the electrostatic chuck for the large-size display panel, provided by the application, the cooling gas is uniformly distributed in the chuck body 1 through the exquisite air flow channel design, and the heat dissipation requirements of different areas of a glass substrate are met, so that the problem of uneven temperature of the large-size display panel in the processing process is effectively solved. Specifically, this embodiment allows the main gas flow path 6 to function as a means for delivering the cooling gas and dividing the entire chuck body 1 into four independent temperature controlled areas by adopting the design of two main gas flow paths 6 perpendicular to each other, so that the cooling gas can be distributed as uniformly as possible to the respective temperature controlled areas. The application can reduce the pressure loss along the way and uniformly distribute the cooling gas to each air outlet array 3 as much as possible through the matching of the air inlet 2, the main air flow channel 6 and the air outlet arrays 3, thereby effectively avoiding the condition that the air outlet distribution condition of each air outlet array 3 is inconsistent, and further effectively avoiding the condition that vortex is generated at the bottom of the glass substrate 5, electrostatic adsorption force fluctuation is caused, and the glass substrate 5 micro-displacement and the artifact alignment accuracy are influenced due to the fact that the air outlet condition of each air outlet array 3 is inconsistent. Therefore, the application forms a cooling air flow distribution system which is high-efficient and ensures the uniform air outlet condition of each temperature control area by optimizing the layout and the communication relation of the air inlet 2, the main air flow channel 6 and the air outlet hole array 3, and ensures that the surface of the glass substrate 5 of the large-size display panel can maintain uniform temperature, thereby obviously improving the processing precision and the product quality of the large-size display panel. Preferably, the working surface of the electrostatic chuck (the surface of the electrostatic chuck close to the glass substrate 5) of the embodiment is processed by adopting a nano grinding process, so that the planeness of the working surface of the electrostatic chuck is smaller than 0.01mm/m 2, and therefore, the gap between the electrostatic chuck and the glass substrate 5 is effectively reduced.
In some preferred embodiments, a plurality of gas communication holes 4 and secondary gas flow channels 7 are further provided in the chuck body 1, the gas communication holes 4 are equidistantly arranged along the extending direction of the primary gas flow channel 6, two ends of the gas communication holes 4 are respectively communicated with the gas inlet ends of the primary gas flow channel 6 and the secondary gas flow channel 7, and the gas outlet hole array 3 is communicated with the gas outlet ends of the secondary gas flow channel 7. The gas communication holes 4 of this embodiment may be understood as passages for establishing connection between the main gas flow passage 6 and the sub gas flow passages 7, which function to guide the cooling gas in the main gas flow passage 6 to the sub gas flow passages 7, and the gas communication holes 4 of this embodiment are disposed equidistantly along the extending direction of the main gas flow passage 6 to ensure that the cooling gas can be split from the main gas flow passage 6 to the respective sub gas flow passages 7 as uniformly as possible and to avoid the occurrence of insufficient or excessive supply of the cooling gas to the local sub gas flow passages 7, and it should be understood that the maximum vertical distance between the gas communication holes 4 and the gas inlet 2 of this embodiment is smaller than the maximum vertical distance between the gas outlet hole array 3 and the gas inlet 2, i.e., the gas communication holes 4 of this embodiment are located above the gas outlet hole array 3, and the gas communication holes 4 of this embodiment can function to guide the cooling gas in the main gas flow passage 6 vertically into the sub gas flow passages 7 and to reduce pressure and stabilize flow. The secondary gas flow channel 7 of this embodiment can be understood as an intermediate channel connecting the gas communication holes 4 and the gas outlet hole array 3, and serves to further refine the distribution path of the cooling gas so as to deliver the gas received from the gas communication holes 4 to the gas outlet hole array 3 to which it is connected as uniformly as possible, and can effectively avoid the occurrence of the pressure fluctuation and the flow non-uniformity phenomenon due to the gas directly entering the gas outlet hole array 3 from the main gas flow channel 6 through the buffering and redistribution of the gas communication holes 4 and the secondary gas flow channel 7, so that the temperature distribution of the working surface of the electrostatic chuck is more uniform and the risk of the panel being heated non-uniformly during the plasma process is reduced, thereby providing a more stable and uniform cooling effect for the large-sized display panel. This embodiment effectively solves the problem of uneven distribution of the cooling gas by introducing the gas communication holes 4 and the secondary gas flow channels 7 in the conventional scheme, specifically, the main gas flow channel 6 serves as a main gas supply main channel, the cooling gas inside of which is first uniformly split by the plurality of gas communication holes 4 arranged equidistantly along the extending direction thereof, and such an equidistant splitting mechanism ensures that the cooling gas can enter the secondary distribution network at a similar flow rate at each position of the main gas flow channel 6. These split cooling gases then enter the secondary gas flow channels 7, and the secondary gas flow channels 7 act as intermediate buffer and redistribution layers to further equalize the pressure and flow of the gases to effectively increase the uniformity of the gas pressure and flow before reaching the gas outlet array 3. Finally, the secondary air flow channel 7 delivers the homogenized cooling air to the air outlet hole array 3, thereby ensuring that the cooling air sprayed from the air outlet hole array 3 has high consistency in the whole temperature control area. It is this multi-stage, fine gas distribution structure that allows the cooling gas to achieve more uniform coverage and heat exchange within the various temperature controlled areas of a large-sized display panel.
In some preferred embodiments, the depth of the gas communication holes 4 is smaller than the depth of the gas outlet hole array 3. The depth of the gas communication holes 4 in this embodiment is preferably 0.3mm smaller than the depth of the gas outlet hole array 3. This embodiment corresponds to the fact that by designing the depth of the gas communication holes 4 to be smaller than the depth of the gas outlet hole array 3, a specific distribution of the flow resistance is introduced during the flow of the cooling gas from the main gas flow channel 6 to the gas outlet hole array 3 via the gas communication holes 4 and the sub-gas flow channels 7, and in particular, the shallower gas communication holes 4 may serve as a preset throttle point to primarily equalize the flow velocity and pressure of the gas before the gas enters the deeper gas outlet hole array 3, and this depth difference helps to establish a more uniform pressure field in the whole gas flow path, thereby ensuring a more uniform flow distribution of the cooling gas to the respective gas outlet hole arrays 3 and avoiding excessive or insufficient local flow due to the path length or structure difference, thereby improving the overall distribution uniformity of the cooling gas in the chuck body 1, i.e., this embodiment can improve the flow distribution and reduce the flow resistance by making the depth of the gas communication holes 4 smaller than the depth of the gas outlet hole array 3.
In some preferred embodiments, the air inlet 2 has a rounded transition. The rounded transition of this embodiment means that the edge of the inlet opening 2 is designed as a smooth arc instead of a sharp right angle, which rounded transition is preferably an arc with a radius of 0.3 mm. This embodiment is capable of guiding the cooling gas to smoothly change direction and effectively eliminating flow separation and vortex flow by making the gas inlet 2 have a rounded transition, thereby effectively reducing the flow resistance and pressure loss of the cooling gas to rapidly balance the pressure of the cooling gas entering the main gas flow passage 6.
In some preferred embodiments, the main air flow channel 6 has a rectangular cross-sectional shape, the long sides of the rectangle being 2mm in length and the short sides of the rectangle being 1.5mm in length. This embodiment is capable of providing a regular and easy-to-process channel structure and facilitating a stable flow of the cooling gas within the main gas flow channel 6 by designing the cross-sectional shape of the main gas flow channel 6 as a rectangle, and designing the long side length of the rectangle as 2mm and the short side length as 1.5mm is based on the limitation of the inner space of the electrostatic chuck for a large-sized display panel and the cooling gas flow rate requirement, i.e., this embodiment corresponds to the space required to reduce the main gas flow channel 6 while ensuring sufficient cooling gas to satisfy the heat dissipation requirement of the glass substrate 5.
As is apparent from the above, according to the electrostatic chuck for a large-sized display panel provided by the present application, by arranging dense air outlets in a region near the center region of the glass substrate 5 and arranging sparse air outlets in a region near the edge region of the glass substrate 5 in such a manner that the density of the air outlets in a region near the air inlet 2 is greater than that in a region far from the air inlet 2, the flow resistance of the cooling gas in a region near the center region of the glass substrate 5 is reduced and the flow resistance of the cooling gas in a region near the edge region of the glass substrate 5 is increased, so that the embodiment can obtain a larger flow rate of the cooling gas in a region near the center region of the glass substrate 5, so that the flow distribution trend of the cooling gas is highly matched with the thermal load distribution trend of the glass substrate 5, thereby achieving on-demand distribution of the cooling gas without complex active control and without providing a flow regulating member on each air outlet, i.e., the present application can effectively simplify the structure of the electrostatic chuck and the flow rate on-demand distribution flow.
In a second aspect, as shown in fig. 6, the present application provides an electrostatic chuck simulation method for a large-sized display panel, for simulating the electrostatic chuck for a large-sized display panel provided in the first aspect, the method comprising the steps of:
S1, constructing an electrostatic chuck digital twin model according to structural characteristics of an electrostatic chuck for a large-size display panel;
s2, setting simulation parameters for a digital twin model of the electrostatic chuck according to the self materials of the electrostatic chuck for the large-size display panel and parameters of cooling gas;
S3, adding a solid heat transfer field, a fluid heat transfer field and a laminar flow physical field into the electrostatic chuck digital twin model, wherein the solid heat transfer field and the fluid heat transfer field are used for describing the heat transfer condition of the electrostatic chuck digital twin model;
S4, carrying out structural grid division on the electrostatic chuck digital twin model;
s5, carrying out instantaneous coupling solution on the digital twin model of the electrostatic chuck to obtain a simulation result of the digital twin model of the electrostatic chuck under a plasma process, wherein the simulation result comprises a surface temperature distribution result, a helium flow field distribution result and an isotherm distribution result of the electrostatic chuck;
And S6, optimizing the layout and the size of the gas communication holes according to the helium flow field distribution result, optimizing the layout and the size of the gas outlet holes according to the surface temperature distribution result, and optimizing the material and the thickness of the electrostatic chuck according to the isotherm distribution result.
Step S1 may construct an electrostatic chuck digital twin model according to structural features of an electrostatic chuck for a large-sized display panel, which are features of the geometry, the internal structure (e.g., chuck body 1, air inlet 2, main air flow channel 6, air outlet hole array 3, etc.), and material properties of the electrostatic chuck for a large-sized display panel provided in the above first aspect, by using existing parametric modeling techniques, and the electrostatic chuck digital twin model is a basis for all subsequent simulation analyses. Setting simulation parameters for the electrostatic chuck digital twin model in step S2 refers to inputting and configuring in simulation software (preferably finite element simulation software) according to the thermal physical parameters such as thermal conductivity, density, specific heat capacity, and the like of the actual material (e.g., aluminum nitride ceramic) of the electrostatic chuck body 1 and the fluid parameters such as density, viscosity, thermal conductivity, specific heat capacity, and the like of the cooling gas (e.g., helium gas) used. Step S3 captures the multi-physical-field coupling behavior of the electrostatic chuck in the working state comprehensively by adding a solid heat transfer field, a fluid heat transfer field and a laminar flow physical field in the electrostatic chuck digital twin model, specifically, the solid heat transfer field and the fluid heat transfer field are used for describing the heat transfer conditions inside and outside the electrostatic chuck digital twin model, the heat transfer conditions comprise the heat conduction inside the solid material and the convection heat exchange between the cooling gas and the chuck wall surface, and the laminar flow physical field is used for describing the flow condition of the cooling gas in the complex channel inside the electrostatic chuck digital twin model, the flow condition comprises flow velocity distribution, pressure distribution and the like, which are critical for evaluating the cooling efficiency. Step S4 of performing structural meshing on the electrostatic chuck digital twin model refers to discretizing a continuous geometric model into a series of interconnected mesh units with a regular topological structure, so as to effectively reduce numerical value diffusion and improve calculation accuracy and convergence. The step S5 of performing transient coupling solution on the electrostatic chuck digital twin model means that solid heat transfer, fluid heat transfer and laminar flow physical field equations are simultaneously solved within a set time step, and interaction among the solid heat transfer, the fluid heat transfer and the laminar flow physical field equations is considered to capture temperature and flow field changes of the chuck in dynamic processes such as starting, running and stopping of a plasma process, so as to obtain simulation results of the electrostatic chuck digital twin model under the plasma process, and it should be understood that the step S5 of performing transient coupling solution on the electrostatic chuck digital twin model is preferably in the prior art, and the working principle and the working procedure thereof are not discussed in detail herein. Step S6 corresponds to optimizing design parameters of the electrostatic chuck for the large-sized display panel according to simulation results, and step S6 can be implemented manually or by using a pre-trained simulation optimization model, it should be understood that optimizing design parameters of the electrostatic chuck based on simulation results of a digital twin model of the electrostatic chuck belongs to the prior art, and the working principle and working flow thereof are not discussed in detail herein, and step S6 can further improve flow distribution of cooling gas in the electrostatic chuck for the large-sized display panel, thereby effectively improving machining accuracy of the large-sized display panel.
According to the scheme, a physical entity is converted into a computable virtual model in a mode of constructing the digital twin model of the electrostatic chuck, so that the limitations of a traditional physical experiment in the aspects of acquiring internal detailed data and performing multi-station testing are overcome, the simulation results can truly reflect the performance of the electrostatic chuck in an actual working environment in a mode of comprehensively setting simulation parameters such as material parameters, cooling gas parameters, plasma heat flow density load and the like in the digital twin model, and the flow behaviors of a heat transfer path and cooling gas in the chuck can be accurately described in a mode of adding a solid heat transfer field, a fluid heat transfer field and a laminar flow physical field in the digital twin model of the electrostatic chuck, so that the fine simulation of the heat transfer and fluid flow processes is realized. On the basis, the structural grid division strategy is adopted in the scheme, so that the accuracy and the efficiency of numerical calculation are guaranteed, and finally, the transient response of the electrostatic chuck under a plasma process is dynamically captured through transient coupling solution, so that the cooling performance and the temperature uniformity of the electrostatic chuck are comprehensively and accurately evaluated, and solid data support is provided for design optimization.
Through the technical scheme, the application provides the efficient and accurate electrostatic chuck simulation method, so that the research and development cost and period of the electrostatic chuck for the large-size display panel are remarkably reduced, and the method can virtually test chuck performances under different design parameters and operation conditions and avoid expensive physical prototype fabrication and repeated experiments. Specifically, the detailed temperature field and flow field distribution inside the chuck can be obtained by coupling solution of solid heat transfer, fluid heat transfer and laminar flow physical fields, which is very difficult or impossible to realize in physical experiments, so that a designer can deeply understand the cooling mechanism and temperature uniformity of the chuck, thereby pertinently optimizing the cooling structures of the main air flow channel 6, the air outlet hole array 3 and the like, further effectively improving the temperature control precision and stability of the electrostatic chuck under the plasma process and improving the production yield of a large-size display panel.
In some preferred embodiments, step S3 comprises:
S31, setting the heat conductivity and density of a digital twin model of the electrostatic chuck according to the parameters of the self material of the electrostatic chuck for the large-size display panel so as to obtain a solid heat transfer field;
s32, setting a plasma heat flow density load of a working surface of the digital twin model of the electrostatic chuck and a convection heat exchange boundary of the bottom surface and the side surface of the digital twin model of the electrostatic chuck according to a power density range of a large-size panel manufacturing process so as to obtain a fluid heat transfer field;
s33, setting the quality condition of the air inlet 2 and the outlet pressure of the air outlet hole array 3 according to the parameters of cooling gas used by the electrostatic chuck for the large-size display panel so as to obtain a laminar flow physical field;
s34, adding a solid heat transfer field, a fluid heat transfer field and a laminar flow physical field into the electrostatic chuck digital twin model.
The parameters of the self material of the electrostatic chuck for the large-sized display panel of step S31 are key physical quantities (such as thermal conductivity and density) describing the inherent heat transfer performance of the material, and since this embodiment sets the thermal conductivity and density of the electrostatic chuck digital twin model according to the parameters of the self material of the electrostatic chuck for the large-sized display panel, it enables the electrostatic chuck digital twin model to accurately reflect the heat transfer characteristics of the electrostatic chuck entity when heated, thereby providing basic data for the subsequent heat transfer analysis. The plasma heat flux density load of step S32 simulates the heat input to the chuck working surface during the plasma process, while the convective heat transfer boundary describes the heat exchange between the chuck bottom and side surfaces and the surrounding environment or cooling medium, and step S32 can truly simulate the heat load distribution of the electrostatic chuck in the actual working environment by setting the plasma heat flux density load of the electrostatic chuck digital twin model working surface and the convective heat transfer boundary of the electrostatic chuck digital twin model bottom and side surfaces in the power density range of the large-size panel manufacturing process (preferably, the preset typical power density range of the large-size display panel manufacturing process). The parameters of the cooling gas directly affect the flowing state and cooling efficiency of the cooling gas in the flow channel of the inside of the chuck, and the step S33 can accurately simulate the laminar flow behavior of the cooling gas in the inside of the electrostatic chuck by setting the quality condition of the air inlet 2 and the outlet pressure of the air outlet hole array 3 according to the parameters of the cooling gas used for the electrostatic chuck of the large-sized display panel, so as to evaluate the cooling effect of the cooling gas on the electrostatic chuck. According to the embodiment, the working state of the electrostatic chuck under a complex plasma process can be more truly simulated by accurately setting the material parameters, the plasma heat flux density load, the convection heat exchange boundary, the air inlet 2 quality condition and the outlet pressure of the air outlet hole array 3 of the digital twin model of the electrostatic chuck, so that a simulation result which is closer to the actual situation is obtained, an engineer can be helped to evaluate the cooling performance and the temperature uniformity of the electrostatic chuck more accurately, the design of the chuck is optimized, the performance of the electrostatic chuck under different process conditions is effectively predicted, and the yield and the production efficiency of manufacturing a large-size display panel are improved.
In some preferred embodiments, the self material of the electrostatic chuck for the large-sized display panel is aluminum nitride ceramic material, the cooling gas is helium gas, the thermal conductivity is 180W/m.K, the density 3300kg/m 3, the plasma heat flow density load is 0-12W/cm 2, the convective heat transfer boundary of the bottom surface of the digital twin model of the electrostatic chuck is 85W/m 2.K, the mass condition is 0.12kg/s, and the outlet pressure is 10 -3 Torr. Since the aluminum nitride ceramic material has excellent heat conductive property, good electrical insulation and high mechanical strength, the embodiment can ensure stability and thermal management efficiency of the electrostatic chuck under the plasma process by selecting the aluminum nitride ceramic material as the material of the electrostatic chuck, and since helium has advantages of high heat conductivity and low viscosity, the embodiment can efficiently carry away heat of the glass substrate 5 and reduce gas flow resistance by selecting helium as the cooling gas. Preferably, the electrostatic chuck of this embodiment employs a TaC coating, and the simulation parameters of this embodiment include a material thermal conductivity, a material specific heat capacity, a material flexural strength, a material thermal expansion coefficient, a aerodynamic viscosity, a gas thermal conductivity, a coating thickness, a coating hardness, a coating thermal conductivity, and a coating thermal emissivity, the material thermal conductivity is 180W/m.K, the material specific heat capacity is 780J/kg.K, the material flexural strength is 400MPa, the material thermal expansion coefficient is 4.6X10 -5/°C, the aerodynamic viscosity is 1.96X10 -5 Pa.s, the gas thermal conductivity is 0.152W/m.K, the coating thickness is 50 μm, the coating hardness is 2800HV, the coating thermal conductivity is 85W/m.K, and the coating thermal emissivity is 0.85.
In some preferred embodiments, step S4 comprises:
S41, dividing the electrostatic chuck digital twin model into multiple layers of boundary layer grids based on an unstructured grid division strategy.
The unstructured grid division strategy refers to a grid generation method which does not depend on a regular topological structure, can flexibly adapt to various complex geometric shapes, and is particularly suitable for areas with irregular characteristics such as airflow channels in an electrostatic chuck. The embodiment can avoid the problems of grid distortion or excessive refinement which can occur when the grid division is performed on the complex area by adopting an unstructured grid division strategy, thereby improving the efficiency and quality of grid generation. Wherein, the multi-layer boundary layer grid is a grid unit which generates multi-layer high aspect ratio along the normal direction of the wall surface in the area close to the wall surface of the solid body. The size of these boundary layer grids gradually decreases in the normal direction to accurately capture the abrupt changes in physical quantities such as fluid velocity, temperature, etc. near the wall surface, i.e., boundary layer effects. In the cooling gas flow and heat transfer simulation of the electrostatic chuck, the convective heat transfer between the cooling gas and the wall surface of the chuck body 1 is a key link, and the introduction of boundary layer grids is important for accurately simulating the wall surface shear stress, the heat transfer coefficient and the temperature gradient of the near-wall surface area. Preferably, this embodiment divides the electrostatic chuck digital twin model into 5 layers of boundary layer grids, with a total of 1256736 grids.
As can be seen from the above, according to the electrostatic chuck and the simulation method for a large-sized display panel provided by the present application, by arranging dense air outlets in a region near the center region of the glass substrate 5 and arranging sparse air outlets in a region near the edge region of the glass substrate 5 in such a manner that the density of the air outlets in a region near the air inlet 2 is greater than that in a region far from the air inlet 2, the flow resistance of the cooling gas in a region near the center region of the glass substrate 5 is reduced and the flow resistance of the cooling gas in a region near the edge region of the glass substrate 5 is increased, so that the embodiment can obtain a larger flow rate of the cooling gas in a region near the center region of the glass substrate 5, so that the flow distribution trend of the cooling gas is highly matched with the thermal load distribution trend of the glass substrate 5, and thus the on-demand distribution of the cooling gas is realized without complex active control and without providing a flow regulating component on each air outlet, i.e., the present application can effectively simplify the structure of the electrostatic chuck and the on-demand distribution flow.
In the embodiments provided herein, it should be understood that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The above embodiments of the present application are only examples, and are not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (9)
1. An electrostatic chuck for a large-sized display panel, the electrostatic chuck for a large-sized display panel comprising:
the chuck body, its bottom center has air inlets;
The two main air flow channels are perpendicular to each other and are arranged in the chuck body, the centers of the two main air flow channels are communicated with the air inlet, the two main air flow channels are used for dividing the chuck body into four temperature control areas, an air outlet hole array communicated with the main air flow channels is arranged in each temperature control area, and all the air outlet hole arrays are symmetrically arranged;
The air outlet hole array comprises a plurality of air outlet holes of a rectangular array, and the density of the air outlet holes in the area close to the air inlet is higher than that of the air outlet holes in the area far away from the air inlet.
2. The electrostatic chuck for large-sized display panel according to claim 1, wherein a plurality of gas communication holes and sub-gas flow channels are further provided in the chuck body, the gas communication holes are equidistantly provided along an extending direction of the main gas flow channel, both ends of the gas communication holes are respectively communicated with one ends of the main gas flow channel and the sub-gas flow channel, and the gas outlet hole array is communicated with the other end of the sub-gas flow channel.
3. The electrostatic chuck for use with a large-sized display panel according to claim 2, wherein the depth of the gas communication holes is smaller than the depth of the gas outlet hole array.
4. The electrostatic chuck for use with a large-sized display panel of claim 1, wherein said air inlet has rounded transitions.
5. The electrostatic chuck for use with a large-sized display panel according to claim 1, wherein the cross-sectional shape of the main air flow channel is rectangular, the long side length of the rectangle is 2mm, and the short side length of the rectangle is 1.5mm.
6. An electrostatic chuck simulation method for a large-sized display panel, characterized by being used for simulating the electrostatic chuck for a large-sized display panel according to any one of claims 1 to 5, comprising the steps of:
S1, constructing an electrostatic chuck digital twin model according to structural characteristics of the electrostatic chuck for the large-size display panel;
S2, setting simulation parameters for the digital twin model of the electrostatic chuck according to the self materials of the electrostatic chuck for the large-size display panel and parameters of cooling gas;
S3, adding a solid heat transfer field, a fluid heat transfer field and a laminar flow physical field into the electrostatic chuck digital twin model, wherein the solid heat transfer field and the fluid heat transfer field are used for describing the heat transfer condition of the electrostatic chuck digital twin model;
s4, carrying out structural grid division on the electrostatic chuck digital twin model;
S5, carrying out transient coupling solution on the electrostatic chuck digital twin model to obtain a simulation result of the electrostatic chuck digital twin model under a plasma process, wherein the simulation result comprises a surface temperature distribution result, a helium flow field distribution result and an isotherm distribution result of the electrostatic chuck;
and S6, optimizing the layout and the size of the gas communication holes according to the helium flow field distribution result, optimizing the layout and the size of the gas outlet holes according to the surface temperature distribution result, and optimizing the material and the thickness of the electrostatic chuck according to the isotherm distribution result.
7. The electrostatic chuck simulation method for a large-sized display panel according to claim 6, wherein the step S3 comprises:
s31, setting the heat conductivity and density of the digital twin model of the electrostatic chuck according to the parameters of the self material of the electrostatic chuck for the large-size display panel so as to obtain a solid heat transfer field;
s32, setting a plasma heat flow density load of a working surface of the digital twin model of the electrostatic chuck and a convection heat exchange boundary of the bottom surface and the side surface of the digital twin model of the electrostatic chuck according to a power density range of a large-size panel manufacturing process so as to obtain a fluid heat transfer field;
s33, setting the quality condition of the air inlet and the outlet pressure of the air outlet hole array according to the parameters of the cooling gas used by the electrostatic chuck for the large-size display panel so as to obtain a laminar flow physical field;
s34 adding the solid heat transfer field, the fluid heat transfer field, and the laminar physical field to the electrostatic chuck digital twin model.
8. The method according to claim 7, wherein the self material of the electrostatic chuck for the large-sized display panel is aluminum nitride ceramic material, the cooling gas is helium, the thermal conductivity is 180W/m·k, the density 3300kg/m 3, the plasma heat flow density load is 0-12W/cm 2, the convective heat transfer boundary of the bottom surface of the electrostatic chuck digital twin model is 85W/m 2 ·k, the mass condition is 0.12kg/s, and the outlet pressure is 10 -3 Torr.
9. The electrostatic chuck simulation method for a large-sized display panel according to claim 6, wherein the step S4 comprises:
S41, dividing the electrostatic chuck digital twin model into multiple layers of boundary layer grids based on an unstructured grid division strategy.
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| CN202511582328.3A CN121054556A (en) | 2025-10-31 | 2025-10-31 | Electrostatic chuck for large-size display panel and simulation method |
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| CN202511582328.3A CN121054556A (en) | 2025-10-31 | 2025-10-31 | Electrostatic chuck for large-size display panel and simulation method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
| CN110462812A (en) * | 2017-03-31 | 2019-11-15 | 朗姆研究公司 | Electrostatic chuck with flexible wafer temperature control |
| KR20220069341A (en) * | 2020-11-20 | 2022-05-27 | 주식회사 케이에스티이 | Electrostatic chuck and method of manufacturing the same |
| CN117672943A (en) * | 2022-08-25 | 2024-03-08 | 华为技术有限公司 | Electrostatic chuck |
| CN120199717A (en) * | 2023-12-13 | 2025-06-24 | 三星显示有限公司 | Electrostatic chuck |
-
2025
- 2025-10-31 CN CN202511582328.3A patent/CN121054556A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
| CN110462812A (en) * | 2017-03-31 | 2019-11-15 | 朗姆研究公司 | Electrostatic chuck with flexible wafer temperature control |
| KR20220069341A (en) * | 2020-11-20 | 2022-05-27 | 주식회사 케이에스티이 | Electrostatic chuck and method of manufacturing the same |
| CN117672943A (en) * | 2022-08-25 | 2024-03-08 | 华为技术有限公司 | Electrostatic chuck |
| CN120199717A (en) * | 2023-12-13 | 2025-06-24 | 三星显示有限公司 | Electrostatic chuck |
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