CN1209693C - Cooling module components for notebook computers - Google Patents

Abstract

A heat dissipation module assembly of a notebook computer is used for reducing the surface temperature of a chip in the notebook computer, and comprises: the heat conduction structure is configured in the notebook computer, is contacted with the chip and is used for conducting the heat of the chip; the fan is arranged in the notebook computer and comprises an air inlet and an air outlet for causing air to flow; and a heat sink disposed at the fan and coupled to the heat conductive structure, the heat sink further comprising: the air outlet heat dissipation part is arranged at the air outlet; and an air inlet heat dissipation part configured at the air inlet.

Description

Cooling module components for notebook computers

Technical field

The invention relates to a heat dissipation module assembly of a notebook computer, in particular to a heat dissipation module assembly which utilizes secondary heat exchange to improve heat dissipation efficiency.

Background technique

With the development of electronic industry technology, the transistor density of various chips (especially the central processing unit) is increasing day by day. Although the speed of data processing is getting faster and faster, the power consumption and heat generation are also increasing. In order for the central processing unit to operate stably, a high-efficiency radiator has become an inevitable requirement. In order to maintain a high-efficiency heat dissipation function, the volume and weight of the radiator have to be larger and heavier. However, in the design of notebook computers, limited space has always been the biggest problem (bottleneck) in design. Among the existing technologies, the most common and effective method is to use a fan to drive the air to exchange heat with the heat-collecting fins to take away the heat from the fins to achieve the purpose of cooling. At this time, the air volume of the fan and the heat exchange area of the fins determine the efficiency of the radiator. The larger the heat exchange area of the fins, the better the heat dissipation effect, but it is not as light, thin, short, and small as a notebook computer. Contrary to the spirit of the design. Therefore, how to effectively improve the efficiency of the radiator without increasing the volume of the radiator as much as possible has become the direction of many engineers.

Please refer to FIG. 1 , which shows the design of a heat dissipation module in a traditional notebook computer. As shown in the figure, a traditional cooling module assembly includes a heat pipe 110 , a fan 120 and a radiator 130 . The heat pipe 110 is configured in the notebook computer and is made of a material with high thermal conductivity, and one end forms a contact end 111 for contacting with the central processing unit 100 (or other types of chips) and performing heat exchange; the fan 120 is also configured In the notebook computer, it is used to cause air flow; the heat sink 130 is coupled with the heat pipe 110, and is arranged at the air outlet of the fan 120, wherein the operation of the fan 120 allows air to enter the fan 120 along the air inlet direction I, and Then leave the fan 120 from the air outlet along the direction O of the air outlet.

When the notebook computer is in operation, the central processing unit 100 generates high heat due to calculation, and the generated heat is brought to the radiator 130 through the contact end 111 made of a material with high thermal conductivity and the heat pipe 110. The radiator 130 is equipped with many fins The fins 140 allow the air flowing along the air outlet direction O from the air outlet to pass through, and dissipate excess heat as the fins 140 exchange heat with the air. The effectiveness of the heat dissipation module assembly is mainly determined by the contact area between the fins 140 and the air and the air volume of the fan 120. On the premise of not changing the design of the fan 120, the heat exchange area of the fins 140 can be increased to improve the performance of the heat dissipation module assembly. efficacy.

Traditionally, increasing the number of fins 140 or increasing the length L of the fins can be used to increase the heat exchange area of the fins 140 . However, increasing the number of fins 140 may cause unsmooth air flow, resulting in noise or wind-cutting sound; increasing the length L of the fins will increase the volume of the cooling module assembly, and increase the friction between the air and the fins 140 Impedance increases the speed of the fan 120 or causes a boundary effect of heat dissipation, which reduces the efficiency of heat dissipation. Therefore, the above two methods are not very good practices.

Contents of the invention

The object of the present invention is to provide a heat dissipation module assembly for a notebook computer, which uses secondary heat exchange to increase the heat exchange area of the heat sink, thereby improving heat dissipation efficiency.

The object of the present invention is achieved by providing a heat dissipation module assembly for a notebook computer. The heat dissipation module assembly for a notebook computer is used to reduce the surface temperature of the chip in the notebook computer, and includes: a heat conduction structure configured on The notebook computer is in contact with the chip to conduct the heat of the chip; the fan is arranged in the notebook computer and includes an air inlet and an air outlet to cause air flow; and a radiator is arranged with the fan and coupled with the heat conduction structure Then, the radiator also includes: an air outlet cooling part configured at the air outlet of the fan; and an air inlet cooling part configured at the air inlet of the fan.

Description of drawings

Fig. 1 is the design drawing of cooling module assembly in existing notebook computer;

Figure 2A is a schematic diagram of the fan in Figure 1;

FIG. 2B is a schematic diagram of a heat dissipation mold assembly provided by a preferred embodiment of the present invention.

Detailed ways

Please refer to FIG. 2A , which shows a schematic diagram of the fan in FIG. 1 . As shown in the figure, the fan 120 includes an air inlet 221 and an air outlet 222. When the fan 120 is running, the air will enter the fan 120 from the air inlet 221 along the air inlet direction I, and then flow out from the air outlet 222 along the air outlet direction O. Leave the fan 120.

Next, please refer to FIG. 2B , which is a schematic diagram of a heat dissipation mold assembly provided according to a preferred embodiment of the present invention. As shown in the figure, the heat dissipation module assembly includes a fan 120 and a heat sink 230 , and uses a heat pipe 210 as a heat conduction structure. The heat pipe 210 is arranged in the notebook computer and is made of a material with high thermal conductivity, and one end forms a contact end 211 for contacting with the central processing unit 100 (or other types of chips) and performing heat exchange; the fan 120 is arranged in the The notebook computer has an air inlet 221 and an air outlet 222 for causing air flow; the heat sink 230 is coupled with the heat pipe 210 and disposed at the fan 120 . The biggest difference from the traditional method is that the radiator 230 includes two parts: the air inlet heat dissipation part 231 and the air outlet heat dissipation part 232. A plurality of fins 240 are arranged on the top to allow air to pass through, and as the fins 240 exchange heat with the passing air, excess heat is dissipated.

When the notebook computer is in operation, the central processing unit 100 generates high heat due to computation, and the generated heat is carried to the radiator 230 through the contact end 211 made of a material with high thermal conductivity and the heat pipe 210 . The air that flows in from the air inlet 121 along the air inlet direction I will pass through the air inlet heat sink 231 and perform heat exchange with the air along with the fins 240, and then the air that flows along the air outlet direction O from the air outlet 222 , the excess heat will also be dissipated through the air outlet radiating portion 232 and with the heat exchange between the fins 240 and the air.

As can be seen from the above description, the first heat exchange will be performed with the fins 240 when the air flows through the air-inlet heat dissipation part 231, and the second heat exchange will be performed with the fins 240 when the air flows through the air-outlet heat dissipation part 232. Increase the heat dissipation area by increasing the number of heat exchanges, so that the space can be used more effectively and noise and heat dissipation boundary effects can be avoided.

The cooling module assembly for notebook computers disclosed in the above embodiments of the present invention has the following advantages:

1. Through one more heat exchange, the efficiency of heat dissipation is greatly improved.

2. Make more effective use of the limited space in the notebook computer, and improve the heat dissipation efficiency without adding too much volume as much as possible.

3. Compared with the design of increasing the fin length or the fin density, the present invention is less likely to generate noise and the boundary effect of heat dissipation.

In summary, although the present invention has been disclosed in conjunction with the above preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.

Claims (7)

1. A heat dissipation module assembly of a notebook computer, in order to reduce the surface temperature of a chip in the notebook computer, the heat dissipation module assembly includes: a heat conduction structure configured in the notebook computer and in contact with the chip for conducting the heat of the chip; A fan is arranged in the computer notebook and includes an air inlet and an air outlet, the fan is used to cause air flow; and A radiator, configured with the fan and coupled to the heat conduction structure, the radiator includes: an air outlet heat dissipation part is arranged at the air outlet of the fan; and An air inlet and heat dissipation part is arranged at the air inlet of the fan. 2. The heat dissipation module assembly as claimed in claim 1, wherein the heat conduction structure is made of a material with high thermal conductivity. 3. The heat dissipation module assembly as claimed in claim 1, wherein the heat conducting structure comprises a contact end and a heat pipe (heat pipe). 4. The heat dissipation module assembly as claimed in claim 3, wherein the contact end is used for contacting the chip and exchanging heat. 5. The heat dissipation module assembly according to claim 3, wherein one end of the heat pipe is coupled to the contact end, and the other end is coupled to the radiator, and the heat pipe is used to transfer heat from the contact end to the heat sink. at the radiator. 6 . The heat dissipation module assembly according to claim 1 , wherein a plurality of fins are disposed on the air outlet and heat dissipation portion of the radiator and the air inlet and heat dissipation portion of the radiator. 6 . 7. The thermal module assembly as claimed in claim 1, wherein the chip is a central processing unit (CPU).

Images