CN120857387A - electronic devices - Google Patents

Abstract

The present application relates to an electronic device comprising a first housing member, a circuit board assembly, a second housing member, an electronic component, and an elastic conductive member. The first housing member comprises a plastic body and a metallized protrusion formed on the plastic body. The circuit board assembly is disposed within the first housing member and abuts the metallized protrusion. The second housing member is configured to be assembled with the first housing member. The electronic component is disposed on the second housing member. The elastic conductive member has opposing first and second ends, the first end being fixedly connected to the electronic component and the second end abutting the metallized protrusion.

Description

Electronic device

Technical Field

The present disclosure relates to an electronic device.

Background

In an electronic device, in order to make a circuit board electrically connected to other electronic components, it is common practice to mount a spring or spring pin connector (pogo pin) on the circuit board and make the spring or spring pin connector contact with the electronic components. In recent years, the design of electronic devices has become thinner and lighter, and circuit boards have been required to be reduced in size to accommodate the thinner and lighter design. However, the spring and the spring pin connector are large in size, which is not beneficial to the reduction of the size of the circuit board.

Disclosure of Invention

Accordingly, an object of the present disclosure is to provide an improved electronic device, which solves the above-mentioned problems.

According to some embodiments of the present disclosure, an electronic device includes a first housing component, a circuit board assembly, a second housing component, a first electronic assembly, and an elastic conductive member. The first housing component includes a plastic body and a first metallized bump structure formed on the plastic body. The circuit board assembly is disposed in the first housing member and abuts the first metallized bump structure. The second housing component is configured to be combined with the first housing component. The first electronic component is disposed on the second housing member. The elastic conductive piece is provided with a first end and a second end which are opposite to each other, the first end is fixedly connected with the first electronic component, and the second end is abutted against the first metalized protruding structure.

In one or more embodiments of the present disclosure, a circuit board assembly includes a substrate and a conductive portion. The substrate has an opening, and the conductive portion is disposed on an inner surface or a periphery of the opening. The first metallization protrusion structure is at least partially disposed in the opening and abuts the conductive portion.

In one or more embodiments of the present disclosure, the substrate has a surface facing the first electronic component, and the first metallized bump structure portion extends out of the opening and beyond the surface of the substrate. The second end of the elastic conductive piece is abutted against the tail end of the first metallized bump structure.

In one or more embodiments of the present disclosure, the first metallization bump structure is solder-fixed in the opening of the substrate.

In one or more embodiments of the present disclosure, the plastic body of the first housing component has a cavity in which the circuit board assembly is disposed. The first metallized bump structure is disposed at a perimeter of the cavity and is configured to support the circuit board assembly.

In one or more embodiments of the present disclosure, the electronic device further includes a second electronic component disposed in the first housing part and located at a side of the circuit board assembly away from the first electronic component. The first housing part further comprises a second metallized bump structure formed on the plastic body, the second metallized bump structure comprising a first contact portion and a second contact portion, the first contact portion abutting the circuit board assembly, the second contact portion abutting the second electronic assembly.

In one or more embodiments of the present disclosure, the second metallized bump structure further comprises a base portion that is connected to an inner wall of the plastic body. The first contact portion and the second contact portion are disposed on the base portion and protrude in opposite directions from the base portion.

In one or more embodiments of the present disclosure, the base includes a bump, and the first contact portion and the second contact portion are disposed on opposite surfaces of the bump.

In one or more embodiments of the present disclosure, the base includes a rail, and the first contact portion and the second contact portion are disposed at opposite ends of the rail.

In one or more embodiments of the present disclosure, the plastic body of the first housing component includes a support wall disposed on a side of the second electronic component remote from the second metallized bump structure. The electronic device further comprises an elastic gasket, and the elastic gasket is arranged between the second electronic component and the supporting wall.

In summary, the housing of the electronic device of the present disclosure includes a metallization protrusion structure, which can be used as a conductive structure between the circuit board and the electronic component. Therefore, the circuit board does not need to be provided with a spring piece or a spring pin connector to contact the electronic component, and the size reduction of the circuit board is facilitated.

Drawings

The foregoing and other objects, features, advantages and embodiments of the present disclosure will be more readily understood from the following description of the drawings in which:

Fig. 1 is a combination diagram of an electronic device according to an embodiment of the disclosure.

Fig. 2 is an exploded view illustrating the electronic device shown in fig. 1.

Fig. 3 is an exploded view of the electronic device shown in fig. 1 at the line 3-3' mark.

Fig. 4 is an exploded view illustrating a portion of the components of the electronic device shown in fig. 1.

Fig. 5 is a bottom view illustrating the first housing part shown in fig. 4.

Fig. 6 is an exploded view of the electronic device shown in fig. 1 at the line segment 6-6'.

Fig. 7 is a partial cross-sectional view of an electronic device according to another embodiment of the disclosure.

Symbol description:

12 electronics, 13, 20 first housing part, 21 plastic body, 22 first metallization protrusion structure, 221 base, 222 post, 23 cavity, 24 second metallization protrusion structure, 241 first contact, 242 second contact, 243 base, 243P bump, 243Q cross bar, 25 support wall, 30 second housing part, 40 circuit board assembly, 41 circuit board, 43 third electronics assembly, 44 substrate, 441 surface, 45 opening, 46 conductive portion, 51 first electronics assembly, 52 second electronics assembly, 60a elastic conductive member, 61 first end, 62 second end, 70 elastic pad.

Detailed Description

For a more complete and thorough description of the present disclosure, reference is made to the accompanying drawings and the various embodiments described below. The components in the drawings are not to scale and are provided for purposes of illustrating the present disclosure. Numerous practical details are described below to provide a thorough understanding of the present disclosure, however, one of ordinary skill in the relevant art will understand that the present disclosure may be practiced without one or more of the practical details, and thus, these details are not to be taken as limiting the present disclosure.

Please refer to fig. 1 to 3. Fig. 1 is a combination diagram of an electronic device 12 according to an embodiment of the present disclosure, fig. 2 is an exploded view of the electronic device 12 shown in fig. 1, and fig. 3 is an exploded view of the electronic device 12 shown in fig. 1 at a line segment 3-3'. As shown, the electronic device 12 includes a housing 13, and the housing 13 may be formed by combining two housing parts, a first housing part 20 and a second housing part 30. The second housing part 30 is arranged on one side of the first housing part 20. For example, the first housing member 20 may have an opening, and the second housing member 30 covers the opening of the first housing member 20. The first housing part 20 comprises a plastic body 21 and at least one first metallized protrusion structure 22 formed on the plastic body 21. The first metallized bump structure 22 can be formed by laser direct structuring (LASER DIRECT structuring, abbreviated as LDS or advanced laser etching) to form a metal layer on the surface of the original bump structure of the plastic body 21 as the first metallized bump structure 22. Laser direct structuring involves the use of a laser to activate metal particles incorporated into the plastic, so that the plastic body 21 actually comprises a plastic substrate and metal particles incorporated into the plastic substrate, but the plastic body 21 is not electrically conductive.

As shown in fig. 1 to 3, the electronic device 12 further includes a circuit board assembly 40, and the circuit board assembly 40 is disposed in the first housing component 20 and includes a circuit board 41 and at least one third electronic component 43. The circuit board 41 is, for example, a Printed Circuit Board (PCB), and conductive traces can be disposed on the surface and inside the circuit board 41. The third electronic component 43 is disposed on the circuit board 41 and electrically connected to the circuit board 41. The third electronic component 43 may comprise a chip, an electrical connector or other electronic component. The circuit board 41 of the circuit board assembly 40 abuts the first metallized bump structure 22 of the first housing component 20 such that the circuit board assembly 40 is electrically connected with the first metallized bump structure 22.

As shown in fig. 1 to 3, the electronic device 12 further includes at least one first electronic component 51 and at least one elastic conductive element 60. The first electronic component 51 is arranged on the second housing part 30, in particular on the surface of the second housing part 30 facing the first housing part 20. The elastic conductive element 60 is also disposed on the second housing member 30 and electrically connected to the first electronic component 51. The elastic conductive element 60 has a first end 61 and a second end 62 opposite to each other, wherein the first end 61 is fixedly connected to the first electronic component 51 (e.g., the first end 61 is welded and fixed on the first electronic component 51), and the second end 62 abuts against the first metallized bump structure 22 of the first housing part 20, so that the first electronic component 51 is electrically connected to the first metallized bump structure 22 and further electrically connected to the circuit board assembly 40. Thus, the electronic signals can be transmitted between the circuit board assembly 40 and the first electronic assembly 51, or one of the circuit board assembly 40 and the first electronic assembly 51 can supply power to the other, or signal transmission and power supply can be performed simultaneously. In the present embodiment, the elastic conductive element 60 includes at least one spring pin connector (pogo pin).

In the electronic device 12 of the present disclosure, the first metallized bump structure 22 formed on the plastic body 21 of the first housing part 20 is used as a conductive structure between the circuit board assembly 40 and the first electronic assembly 51, which can reduce the occupied area of the circuit board and facilitate the reduction of the size of the circuit board compared to the conventional method of mounting a spring or a spring pin connector on the circuit board to contact the electronic assembly. In addition, the first metallization protrusion 22 may abut against the surface of the circuit board 41 of the circuit board assembly 40 to support and position the circuit board assembly 40, and the first metallization protrusion 22 may be soldered (e.g., may be soldered at a low temperature to avoid melting or deforming the first metallization protrusion 22), avoid displacement of the circuit board assembly 40, and ensure good electrical communication between the first metallization protrusion 22 and the circuit board assembly 40.

As shown in fig. 1 to 3, in the present embodiment, the electronic device 12 includes two first electronic components 51, namely an antenna and a touch coil, wherein the antenna and the touch coil are respectively connected to two elastic conductive members 60, and correspondingly, the first housing member 20 includes four first metallized protrusion structures 22, each of which is abutted to a corresponding one of the elastic conductive members 60. In some embodiments, the antenna and the touch coil may be formed on the surface of the second housing member 30 by laser direct structuring. As described above, laser direct structuring involves activating metal particles incorporated into plastic using a laser, and thus, in such embodiments, the second housing part 30 comprises a plastic substrate and metal particles incorporated into the plastic substrate, but the second housing part 30 is not electrically conductive. It should be appreciated that the first electronic components 51 may be other suitable electronic components, not limited to antennas or touch coils, and that each first electronic component 51 may be connected to any suitable number of elastic conductive elements 60.

Please refer to fig. 4. Fig. 4 is an exploded view illustrating some of the components of the electronic device 12 shown in fig. 1. As shown in fig. 2-4, in some embodiments, the plastic body 21 of the first housing component 20 has a cavity 23, and the circuit board assembly 40 is disposed in the cavity 23. The first metallized bump structure 22 is disposed at the perimeter of the cavity 23 and is configured to support the circuit board assembly 40. In some embodiments, the electronic device 12 may further include at least one second electronic component 52, the second electronic component 52 also being disposed in the cavity 23 of the first housing member 20.

As shown in fig. 2 to 4, in some embodiments, the circuit board 41 of the circuit board assembly 40 includes a substrate 44, the substrate 44 has at least one opening 45, and the opening 45 may be a notch on an edge of the substrate 44 or a through hole penetrating through the substrate 44. The circuit board 41 further includes at least one conductive portion 46, and each opening 45 corresponds to one conductive portion 46. The conductive portion 46 may be disposed at the periphery of the opening 45, or disposed at the inner surface of the opening 45, or disposed at the periphery and the inner surface of the opening 45. Conductive portion 46 may comprise copper or other suitable conductive material. Each first metallization protrusion structure 22 is at least partially disposed in a corresponding one of the openings 45 and abuts the conductive portion 46.

As shown in fig. 2-4, in some embodiments, each first metallization protrusion structure 22 may include a base portion 221 and a pillar portion 222. The base 221 is connected to the inner wall of the plastic body 21 and protrudes from the inner wall of the plastic body 21. In the present embodiment, the base 221 is a bump on the inner wall of the plastic body 21. The columnar portion 222 is disposed on the base 221 and protrudes toward the first electronic component 51 and the second housing member 30. The base 221 has a width greater than that of the pillar portion 222, and the pillar portion 222 may extend across the opening 45 of the circuit board 41 and abut against the conductive portion 46, and the base 221 is located outside the opening 45 and abuts against a surface of the circuit board 41 far from the first electronic component 51 to support and position the circuit board assembly 40. The column portion 222 is, for example, but not limited to, a cylindrical shape. In some embodiments, the posts 222 of the first metallization protrusion 22 are solder-fixed in the openings 45 of the circuit board 41. In some embodiments, the substrate 44 of the circuit board 41 has a surface 441 facing the first electronic component 51 and the second housing part 30, and the pillar portion 222 of the first metallization protrusion structure 22 extends partially out of the opening 45 of the circuit board 41 and beyond the surface 441 of the substrate 44. The second end 62 of the elastic conductive element 60 abuts against the end of the pillar portion 222 of the first metallization protrusion structure 22 (i.e., the end of the pillar portion 222 protruding from the surface 441 of the substrate 44).

It should be noted that, in this document, the description of "component X is in contact with component Y" includes the case where "component X is directly bonded to or in contact with component Y" or "component X is bonded to component Y through additional conductive components (e.g., solder, conductive paste, conductive pad, etc.). Additionally, it should be appreciated that although the electronic device 12 is shown in the form of a headset, the electronic device 12 may be other types of electronic devices, such as smart glasses or smart headsets.

Please refer to fig. 5 and fig. 6 together. Fig. 5 is a bottom view of the first housing part 20 shown in fig. 4, and fig. 6 is an exploded view of the electronic device 12 shown in fig. 1 at the line 6-6'. As shown in fig. 4 to 6, the second electronic component 52 may be disposed at a side of the circuit board assembly 40 remote from the first electronic component 51, in other words, the circuit board assembly 40 is disposed between the first electronic component 51 and the second electronic component 52. The circuit board assembly 40 may also be electrically connected to the second electronic component 52, for example, through at least one second metallized bump structure 24 formed on the plastic body 21. Each second metallization protrusion structure 24 may comprise a first contact portion 241 and a second contact portion 242, the first contact portion 241 abutting the circuit board assembly 40 and the second contact portion 242 abutting the second electronic assembly 52.

Like the first metallized bump structure 22, the second metallized bump structure 24 can also be formed by laser direct structuring, so that a metal layer is formed on the surface of the original bump structure of the plastic body 21 as the second metallized bump structure 24. In addition, the second metallized bump structure 24 may also be disposed at the periphery of the cavity 23 of the plastic body 21 and support the circuit board assembly 40. In some embodiments, a plurality of first metallized bump structures 22 and a plurality of second metallized bump structures 24 may be disposed around the cavity 23.

As shown in fig. 4-6, in some embodiments, the circuit board 41 of the circuit board assembly 40 has openings 45 corresponding to the second metallization protrusion structures 24 and conductive portions 46, each second metallization protrusion structure 24 being at least partially disposed in a corresponding one of the openings 45 and abutting the conductive portion 46. In some embodiments, the second metallization protrusion structure 24 may further comprise a base 243, the first contact portion 241 and the second contact portion 242 being disposed on the base 243 and protruding in opposite directions from the base 243. The first contact portion 241 protrudes toward the circuit board assembly 40, and the second contact portion 242 protrudes toward the second electronic assembly 52. The first contact portion 241 may be a cylindrical structure (e.g., a cylinder) having a smaller width than the base portion 243 and extending into the opening 45 of the circuit board 41. The second contact portion 242 may be a bump structure with a circular arc surface, and may abut against an electrical contact of the second electronic component 52. In some embodiments, the first contact portion 241 may be solder-fixed in the opening 45 of the circuit board 41.

In some embodiments, the second metallization bump structure 24 may have two forms. As shown in fig. 4 to 6, the base 243 of the second metallization protrusion structure 24 of the first form is a bump 243P, and the first contact portion 241 and the second contact portion 242 are disposed on opposite surfaces of the bump 243P. The first contact portion 241 is disposed on a surface of the bump 243P facing the circuit board assembly 40, and the second contact portion 242 is disposed on a surface of the bump 243P facing away from the circuit board assembly 40. In some embodiments, the first contact 241 and the second contact 242 are disposed substantially in alignment in the direction of stacking of the second electronic assembly 52, the circuit board assembly 40, and the first electronic assembly 51 (or the second housing member 30).

As shown in fig. 4 to 6, the base 243 of the second metallization protrusion structure 24 of the second form is a cross bar 243Q, and the first contact portion 241 and the second contact portion 242 are disposed at opposite ends of the cross bar 243Q. The first contact portion 241 is disposed at an end of the cross bar 243Q adjacent to the inner wall of the plastic body 21, and the second contact portion 242 is disposed at an end of the cross bar 243Q remote from the inner wall of the plastic body 21, such that the first contact portion 241 and the second contact portion 242 are disposed offset from each other. The second type of the second metallized bump structure 24 is suitable for the case that the electrical contacts of the second electronic component 52 are disposed away from the inner wall of the plastic body 21, so that the second metallized bump structure 24 extends to the central position of the plastic body 21 to be connected with the electrical contacts of the second electronic component 52.

In the illustrated embodiment, the second electronic component 52 is a battery and the two second metallized bump structures 24 abut two electrodes of the battery, respectively. It should be appreciated that the second electronic component 52 may be other suitable electronic components, not limited to a battery, and that the second electronic component 52 may be coupled to any suitable number of second metallized bump structures 24.

As shown in fig. 4-6, in some embodiments, the plastic body 21 of the first housing component 20 includes a support wall 25, the support wall 25 being a stationary structure and disposed on a side of the second electronic component 52 remote from the second metallized bump structure 24. The electronic device 12 further includes an elastic pad 70, the elastic pad 70 is disposed between the second electronic component 52 and the supporting wall 25, and two sides of the elastic pad 70 tightly abut against the second electronic component 52 and the supporting wall 25, respectively, so that the second electronic component 52 and the second metallized bump structure 24 can be electrically connected stably. The elastomeric pad 70 may comprise EVA or other suitable polymeric material.

Fig. 7 is a partial cross-sectional view of an electronic device according to another embodiment of the disclosure. The difference between this embodiment and the previous embodiment is that the elastic conductive member 60A is a conductive elastic sheet. In the present embodiment, the first end 61 of the elastic conductive element 60A is a planar portion of the conductive spring and is fixedly connected to the first electronic component 51, and the second end 62 of the elastic conductive element 60A is a curved portion of the conductive spring and abuts against the first metalized protruding structure 22.

In summary, the housing of the electronic device of the present disclosure includes a metallization protrusion structure, which can be used as a conductive structure between the circuit board and the electronic component. In this way, the circuit board does not need to be provided with the spring plate or the spring pin connector to contact the electronic component, and the available area of the circuit board is increased or the size of the circuit board can be reduced under the condition that the spring plate or the spring pin connector occupies less area on the surface (one surface or the front surface and the back surface) of the circuit board. In addition, the metallized protrusion structure can be formed by carrying out metallization processing (such as LDS process) on the original circuit board supporting structure of the shell of the electronic device, so that no extra space is occupied. The above configuration contributes to the light and thin design of the electronic device.

While the present disclosure has been described with reference to the exemplary embodiments, it should be understood that the invention is not limited thereto, but may be embodied with various changes and modifications as may be made by those skilled in the art without departing from the spirit and scope of the present disclosure, and the scope of the present disclosure is therefore intended to be limited only by the appended claims.

Claims (10)

1. An electronic device, comprising:

a first housing part comprising a plastic body and a first metallized bump structure formed on the plastic body;

a circuit board assembly disposed in the first housing member and abutting the first metallized bump structure;

A second housing part configured to be combined with the first housing part;

a first electronic component disposed on the second housing member, and

The elastic conductive piece is provided with a first end and a second end which are opposite to each other, the first end is fixedly connected with the first electronic component, and the second end is abutted against the first metalized protruding structure.

2. The electronic device of claim 1, wherein the circuit board assembly comprises a substrate and a conductive portion, the substrate has an opening, the conductive portion is disposed on an inner surface or a periphery of the opening, and the first metallization protrusion is at least partially disposed in the opening and abuts against the conductive portion.

3. The electronic device of claim 2, wherein the substrate has a surface facing the first electronic component, the first metallization protrusion extends beyond the opening beyond the surface of the substrate, and the second end of the elastic conductive element abuts an end of the first metallization protrusion.

4. The electronic device of claim 2, wherein the first metallized bump structure is solder-fixed in the opening of the substrate.

5. The electronic device of claim 1, wherein the plastic body of the first housing component has a cavity in which the circuit board assembly is disposed, and the first metallized protrusion structure is disposed at a periphery of the cavity and configured to support the circuit board assembly.

6. The electronic device of claim 1, further comprising a second electronic component disposed in the first housing member and located on a side of the circuit board assembly away from the first electronic component, wherein the first housing member further comprises a second metallized bump structure formed on the plastic body, the second metallized bump structure comprising a first contact portion and a second contact portion, the first contact portion abutting the circuit board assembly, the second contact portion abutting the second electronic component.

7. The electronic device of claim 6, wherein the second metallization structure further comprises a base portion connected to an inner wall of the plastic body, the first contact portion and the second contact portion being disposed on the base portion and protruding in opposite directions from the base portion.

8. The electronic device of claim 7, wherein the base comprises a bump, and the first contact portion and the second contact portion are disposed on opposite surfaces of the bump.

9. The electronic device of claim 7, wherein the base comprises a rail, and the first contact portion and the second contact portion are disposed at opposite ends of the rail.

10. The electronic device of claim 6, wherein the plastic body of the first housing part comprises a support wall disposed on a side of the second electronic component remote from the second metallized bump structure, the electronic device further comprising a resilient gasket disposed between the second electronic component and the support wall.