CN120749088B - A semiconductor chip and its fabrication method - Google Patents
A semiconductor chip and its fabrication methodInfo
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- CN120749088B CN120749088B CN202511220771.6A CN202511220771A CN120749088B CN 120749088 B CN120749088 B CN 120749088B CN 202511220771 A CN202511220771 A CN 202511220771A CN 120749088 B CN120749088 B CN 120749088B
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- connector
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- shaped copper
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Abstract
本发明涉及半导体芯片及其制备方法领域，本发明揭示了一种半导体芯片及其制备方法，所述半导体芯片包括基板、元器件和连接器；元器件和连接器安装在基板上；基板设有预定切割位置；连接器设置于预定切割位置上；连接器在切割后在切面形成连接触点，用于与外部电子部件连接；基板、元器件和连接器被封装层包覆形成封装结构。本发明能够解决现有技术中连接器需要二次置件或薄膜模塑精度低的问题。
This invention relates to the field of semiconductor chips and their fabrication methods. The invention discloses a semiconductor chip and its fabrication method, wherein the semiconductor chip includes a substrate, components, and connectors; the components and connectors are mounted on the substrate; the substrate has predetermined cutting positions; the connectors are disposed at the predetermined cutting positions; after cutting, the connectors form contact points on the cut surfaces for connection with external electronic components; the substrate, components, and connectors are encapsulated by an encapsulation layer to form an encapsulation structure. This invention solves the problems of secondary component placement or low film molding precision in existing technologies for connectors.
Description
Technical Field
The invention relates to the field of semiconductor chips, in particular to a semiconductor chip and a preparation method thereof.
Background
The semiconductor chip is used as a core component of a modern electronic product, and the connection technology directly influences the performance, reliability and manufacturing process of the product. At present, two main technical routes exist for mounting a connector of a semiconductor chip.
The first technical route is to attach the connector on the back side of the chip or in the selectively packaged non-packaged area. The main drawback of this approach is that the connector often needs to be mounted during the second placement process, especially in a double-sided package structure, not only greatly increases the complexity of the package design, but also significantly increases the process difficulty. The quality problems such as position deviation, poor contact and the like can be introduced in the multiple-placement process, and the yield and reliability of products are reduced.
The second technical route is to expose an interposer (interposer) by using film molding technology. Although this approach avoids secondary placement, it presents a number of technical obstacles including, firstly, the need to specially modify the standard molding machine, increasing equipment investment, and secondly, the apparent disadvantages of film molding over direct cavity molding (cavity molding) in terms of precision control, often not smooth enough forming surfaces, and furthermore, the difficulty in effective control of glue spillage problems in the process, directly affecting product yield and consistency.
In addition, when the packaged chip needs to be cut into a plurality of functional units, both of the above connection modes face the difficulty of reestablishing electrical connection after cutting. The prior art typically requires re-routing or adding additional connection structures to the cut surface, not only is the process complex, but new reliability risks may be introduced.
The problems in the prior art lead to complex process, increased cost and difficult guarantee of connection reliability in the manufacturing process of the semiconductor chip, and limit popularization and use of the chip in special application scenes, particularly application scenes requiring chip segmentation and flexible interconnection.
Disclosure of Invention
The invention aims to provide a semiconductor chip and a preparation method thereof, which can solve the problems that a connector in the prior art needs secondary placement or film molding precision is low.
The invention provides a semiconductor chip, which comprises a substrate, components and a connector, wherein the components and the connector are arranged on the substrate, the substrate is provided with a preset cutting position, the connector is arranged on the preset cutting position, the connector forms a connecting contact on a tangent plane after cutting and is used for being connected with an external electronic component, and the substrate, the components and the connector are coated by a packaging layer to form a packaging structure.
Further, the connector comprises an internal conductive circuit, wherein the end part of the internal conductive circuit forms the connecting contact, and the connector is connected with the component through the internal conductive circuit.
Further, the internal conductive circuit comprises a copper pillar structure, and a tangent plane of the copper pillar structure forms the connecting contact.
Further, the copper pillar structure comprises a plurality of U-shaped copper pillars, wherein the U-shaped copper pillars comprise first U-shaped copper pillars and second U-shaped copper pillars which are different in size, and the first U-shaped copper pillars and the second U-shaped copper pillars are alternately arranged in the connector.
The flexible circuit board is connected with the connecting contact and used for connecting the external electronic component.
Further, at least one connector is provided at each predetermined cutting position.
In addition, the invention provides a preparation method of the semiconductor chip, which is used for preparing the semiconductor chip and specifically comprises the following steps:
providing a substrate, wherein a preset cutting position is arranged on the substrate;
Mounting components on the substrate;
arranging a connector at a preset cutting position of the substrate, wherein the connector is electrically connected with the component;
Forming a packaging layer, wherein the packaging layer coats the substrate, the components and the connector to form a packaging structure;
and cutting the packaging structure along the preset cutting position to enable the connector to form a connecting contact on a tangent plane.
Further, the connector is arranged at the preset cutting position of the substrate, and specifically comprises the step of connecting the internal conductive circuit of the connector with the component by adopting a wire bonding, welding or conductive adhesive bonding mode.
Further, the cutting of the packaging structure along the preset cutting position specifically comprises the steps of enabling the packaging structure to form two independent semiconductor units along the preset cutting position, enabling the connector to be divided into two parts and respectively attached to the tangential planes of the two semiconductor units, and enabling the connection contacts on the tangential planes of the two semiconductor units to be arranged in a symmetrical mode.
Further, after the package structure is cut along the predetermined cutting position, the flexible circuit board is connected with the connection contact.
Through the technical scheme, the invention has the following beneficial effects:
The semiconductor chip of the invention does not need to attach the connector on the back or unpackaged area, thereby avoiding the secondary component placing process, simplifying the manufacturing process, simultaneously avoiding the problems of the transformation of a molding machine and the control of glue overflow because of not using thin film molding to expose an intermediate layer. In addition, the semiconductor chip can be directly connected with an external electronic component through the connecting contact on the tangent plane after being cut, an additional wiring process is not needed, the manufacturing cost is reduced, and the connection reliability is improved.
Drawings
FIG. 1 is a schematic diagram showing an overall structure of a semiconductor chip before the semiconductor chip is unpackaged according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a packaged semiconductor chip according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a semiconductor chip after dicing according to an embodiment of the invention;
FIG. 4 is a schematic diagram showing an overall structure of a semiconductor chip after dicing according to an embodiment of the invention;
Fig. 5 is a schematic diagram of a semiconductor chip after a flexible circuit board is mounted thereon according to an embodiment of the present invention.
In the figure, 1, a substrate, 2, components, 3, a connector, 4, a first U-shaped copper column, 5, a second U-shaped copper column, 6, a flexible circuit board and 7, a packaging layer.
Detailed Description
Based on the teachings of this specification, a person skilled in the art may form a new technical solution by cross-combining different embodiments without technical contradiction, and such modifications should be considered as falling within the scope of protection of this solution.
A semiconductor chip and a method of manufacturing the same of the present invention will be described in more detail below with reference to the accompanying drawings, in which preferred embodiments of the present invention are shown, it being understood that one skilled in the art can modify the invention described herein while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
The invention is more particularly described by way of example in the following paragraphs with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
As shown in fig. 1 to 5, an embodiment of the present invention proposes a semiconductor chip including a substrate 1, a component 2, and a connector 3.
Specifically, the component 2 and the connector 3 are mounted on the substrate 1, the substrate 1 is provided with a preset cutting position, the connector 3 is arranged on the preset cutting position, the connector 3 forms a connecting contact on a tangent plane after cutting and is used for being connected with an external electronic component, and the substrate 1, the component 2 and the connector 3 are coated by a packaging layer 7 to form a packaging structure.
Preferably, the connector 3 comprises an internal conductive line, the end of which forms the connection contact, and the connector 3 is connected with the component 2 through the internal conductive line. Specifically, the internal conductive circuit may be electrically connected to the component 2 by wire bonding, welding, or conductive adhesive bonding, and these connection modes may be flexibly selected according to the actual application scenario and process requirements. By such design of the internal conductive line, the reliability of the electrical connection between the connector 3 and the component 2 is enhanced, while simplifying the manufacturing process without an additional wiring step.
In one embodiment, the internal conductive trace includes a copper pillar structure, a cut surface of the copper pillar structure constituting the connection contact. Specifically, the copper column structure can be formed by adopting modes of electroplating, drilling filling and the like, and the copper material has good conductivity and processability, so that a smooth connecting contact can be formed after cutting. It will be appreciated by those skilled in the art that other conductive materials, such as aluminum, gold, silver, etc., may be used for the internal conductive lines in addition to copper, and may be configured according to practical requirements, and the materials of the internal conductive lines may include other embodiments besides the present embodiment. Through the design of copper post structure, improved the conductive performance and the mechanical strength of connecting contact, be convenient for follow-up cutting process simultaneously.
In this embodiment, the copper pillar structure includes a plurality of U-shaped copper pillars, the U-shaped copper pillars include first U-shaped copper pillars 4 and second U-shaped copper pillars 5 with different sizes, and the first U-shaped copper pillars 4 and the second U-shaped copper pillars 5 are alternately arranged inside the connector 3. Specifically, the first U-shaped copper pillars 4 are larger in size, and the second U-shaped copper pillars 5 are smaller in size, so that a comb-tooth-shaped structure is formed by alternate arrangement. Through adopting the alternating arrangement structure of the U-shaped copper columns with different sizes, the number of contact points on the unit area is increased, the tensile strength and the stability of connection are improved, and the connection failure caused by vibration or tension in the use process is effectively avoided.
In addition, the embodiment also comprises a flexible circuit board 6, wherein the flexible circuit board 6 is connected with the connecting contact and used for connecting the external electronic component. Specifically, the flexible circuit board 6 includes a T-shaped structure. The lateral portion of the T-shaped structure is aligned with and fixed to the connection contact, and the longitudinal portion of the flexible circuit board 6 extends to the outside for electrical connection. The flexible circuit board 6 may be connected to the connection contacts by means of conductive glue, soldering or crimping. Through using flexible circuit board 6 to connect, strengthened the flexibility of being connected between semiconductor chip and the external equipment, adapt to the demand of different installation space and application environment, flexible circuit board 6's T type structural design has increased the connection area simultaneously, has improved connection reliability.
In an embodiment, at least one of said connectors 3 is provided at each of said predetermined cutting positions. Specifically, the number and arrangement of the connectors 3 may be designed according to the chip function and the connection requirement, and may be single-row, double-row or matrix arrangement. In a specific example, the connectors 3 may be uniformly distributed along the predetermined cutting position, and the pitch may be set according to actual needs. By providing a plurality of connectors 3 at predetermined cut locations, the current carrying capacity of the connection is increased, different electrical performance requirements are met, and simultaneously redundant connection of signals and power is provided, enhancing system reliability.
In addition, the embodiment provides a method for manufacturing a semiconductor chip, which is used for manufacturing the semiconductor chip, and specifically comprises the following steps:
s1, providing a substrate 1, wherein a preset cutting position is arranged on the substrate 1;
S2, mounting a component 2 on the substrate 1;
S3, arranging a connector 3 at a preset cutting position of the substrate 1, wherein the connector 3 is electrically connected with the component 2;
S4, forming an encapsulation layer 7, wherein the encapsulation layer 7 encapsulates the substrate 1, the component 2 and the connector 3 to form an encapsulation structure, and
S5, cutting the packaging structure along the preset cutting position to enable the connector 3 to form a connecting contact on a tangent plane.
Preferably, the connector 3 is disposed at a predetermined cutting position of the substrate 1, and specifically includes connecting an internal conductive line of the connector 3 with the component 2 by wire bonding, soldering or conductive adhesive bonding. Those skilled in the art will appreciate that the connection means may include embodiments other than the present embodiment. By means of the connection modes, the connection firmness and conductivity between the connector 3 and the component 2 are improved, and the connector is suitable for different manufacturing environments and product requirements.
In this embodiment, the dicing the package structure along the predetermined dicing position specifically includes forming two independent semiconductor units of the package structure along the predetermined dicing position, and the connector 3 is divided into two parts and attached to the tangential surfaces of the two semiconductor units, so that the connection contacts on the tangential surfaces of the two semiconductor units are arranged in a symmetrical manner.
In one embodiment, after the package structure is cut along the predetermined cutting position, the flexible circuit board 6 is connected to the connection contacts. Specifically, the connection can be realized by means of thermal compression, conductive adhesive or micro welding. Through the process sequence of connecting the flexible circuit board 6 after cutting, the damage to the flexible circuit board 6 in the cutting process is avoided, and meanwhile, the connection firmness and reliability are enhanced.
In this embodiment, the package structure is cut to form two independent semiconductor units, and the connector 3 is cut into two parts and attached to the cut surfaces of the two semiconductor units respectively. The connection contacts on the tangential planes of the two semiconductor units are arranged in a symmetrical manner. Specifically, the cutting may be performed by precision sawing, laser cutting, or the like, and the cutting width is generally controlled within a specified range. Through cutting the packaging structure into two independent semiconductor units, the effect of one-time packaging and multiple-time use is realized, the manufacturing efficiency is improved, and meanwhile, as the connecting contact is directly formed on the tangent plane, the subsequent connecting process is simplified, and the manufacturing steps are reduced.
In the present embodiment, in the chip manufacturing process, the connector 3 is provided in advance at a predetermined dicing position of the substrate 1, and the conductive wiring inside the connector 3 is electrically connected to the chip internal component 2. After the encapsulation is completed, dicing is performed along predetermined dicing positions so that the connector 3 forms connection contacts on the cut surface. The cut individual semiconductor units may be connected to the flexible circuit board 6 via connection contacts on the cut surface to make electrical connection with external electronic components. Unlike conventional connection methods requiring secondary placement or film molding, the present embodiment simplifies the manufacturing process and improves connection reliability and manufacturing efficiency by directly forming connection contacts at the cut surfaces.
In summary, the semiconductor chip provided by the invention has the following advantages:
The semiconductor chip of the invention does not need to attach the connector on the back or unpackaged area, thereby avoiding the secondary component placing process, simplifying the manufacturing process, simultaneously avoiding the problems of the transformation of a molding machine and the control of glue overflow because of not using thin film molding to expose an intermediate layer. In addition, the semiconductor chip can be directly connected with an external electronic component through the connecting contact on the tangent plane after being cut, an additional wiring process is not needed, the manufacturing cost is reduced, and the connection reliability is improved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (7)
1. The semiconductor chip is characterized by comprising a substrate, a component and a connector, wherein the component and the connector are arranged on the substrate, the substrate is provided with a preset cutting position, the connector is arranged on the preset cutting position, the connector forms a connecting contact on a tangent plane after cutting and is used for being connected with an external electronic component, and the substrate, the component and the connector are coated by a packaging layer to form a packaging structure;
The connector comprises an internal conductive circuit, wherein the end part of the internal conductive circuit forms the connecting contact;
the internal conductive circuit comprises a copper column structure, and a tangent plane of the copper column structure forms the connecting contact;
The copper column structure comprises a plurality of U-shaped copper columns, wherein the U-shaped copper columns comprise first U-shaped copper columns and second U-shaped copper columns with different sizes, the first U-shaped copper columns and the second U-shaped copper columns are alternately arranged in the connector, the first U-shaped copper columns are larger in size, and the second U-shaped copper columns are smaller in size, and form a comb-tooth-shaped structure through alternate arrangement.
2. The semiconductor chip of claim 1, further comprising a flexible circuit board, wherein the flexible circuit board is coupled to the connection contacts for connecting the external electronic component.
3. The semiconductor chip of claim 1, wherein at least one of said connectors is disposed at each of said predetermined dicing locations.
4. A method for manufacturing a semiconductor chip according to any one of claims 1 to 3, comprising in particular:
providing a substrate, wherein a preset cutting position is arranged on the substrate;
Mounting components on the substrate;
arranging a connector at a preset cutting position of the substrate, wherein the connector is electrically connected with the component;
Forming a packaging layer, wherein the packaging layer coats the substrate, the components and the connector to form a packaging structure;
and cutting the packaging structure along the preset cutting position to enable the connector to form a connecting contact on a tangent plane.
5. The method of manufacturing a semiconductor chip according to claim 4, wherein the step of providing a connector at a predetermined dicing position of the substrate comprises connecting an internal conductive trace of the connector to the component by wire bonding, soldering or conductive adhesive bonding.
6. The method of manufacturing a semiconductor chip according to claim 4, wherein the dicing the package structure along the predetermined dicing position includes forming two independent semiconductor units of the package structure along the predetermined dicing position, the connector being divided into two parts and attached to the respective dicing faces of the two semiconductor units so that the connection contacts on the dicing faces of the two semiconductor units are arranged in a symmetrical manner.
7. The method of manufacturing a semiconductor chip according to claim 4, wherein after the package structure is diced along the predetermined dicing positions, a flexible circuit board is connected to the connection contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202511220771.6A CN120749088B (en) | 2025-08-29 | 2025-08-29 | A semiconductor chip and its fabrication method |
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| CN202511220771.6A CN120749088B (en) | 2025-08-29 | 2025-08-29 | A semiconductor chip and its fabrication method |
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| CN120749088A CN120749088A (en) | 2025-10-03 |
| CN120749088B true CN120749088B (en) | 2025-11-21 |
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Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001177051A (en) * | 1999-12-20 | 2001-06-29 | Toshiba Corp | Semiconductor device and system device |
| US6930256B1 (en) * | 2002-05-01 | 2005-08-16 | Amkor Technology, Inc. | Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
| JP2003017617A (en) * | 2001-07-04 | 2003-01-17 | Sony Corp | Flexible connection wiring board, flexible wiring board, and semiconductor device using the same |
| US20030034565A1 (en) * | 2001-08-18 | 2003-02-20 | Lan James Jaen-Don | Flip chip substrate with metal columns |
| TW200802634A (en) * | 2006-06-02 | 2008-01-01 | Siliconware Precision Industries Co Ltd | Semiconductor package and method for fabricating the same |
| CN101211792A (en) * | 2006-12-30 | 2008-07-02 | 矽品精密工业股份有限公司 | Semiconductor package and manufacturing method and stacking structure thereof |
| US10264664B1 (en) * | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
| DE102020101098B4 (en) * | 2020-01-17 | 2022-05-12 | Infineon Technologies Ag | Leadframe, encapsulated package with a stamped line and sawn side walls, and corresponding manufacturing process |
| CN112103258B (en) * | 2020-11-12 | 2021-03-09 | 珠海越亚半导体股份有限公司 | Double-sided windowing packaging structure and manufacturing method thereof |
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