CN119725263A - Copper-molybdenum-copper-copper composite material with porous core material and preparation method thereof - Google Patents
Copper-molybdenum-copper-copper composite material with porous core material and preparation method thereof Download PDFInfo
- Publication number
- CN119725263A CN119725263A CN202411899995.XA CN202411899995A CN119725263A CN 119725263 A CN119725263 A CN 119725263A CN 202411899995 A CN202411899995 A CN 202411899995A CN 119725263 A CN119725263 A CN 119725263A
- Authority
- CN
- China
- Prior art keywords
- copper
- core material
- molybdenum
- holes
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011162 core material Substances 0.000 title claims abstract description 81
- 239000002131 composite material Substances 0.000 title claims abstract description 54
- RVIFKFNYKBNOEO-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu][Cu][Mo][Cu] RVIFKFNYKBNOEO-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 238000002360 preparation method Methods 0.000 title abstract description 6
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000010949 copper Substances 0.000 claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 28
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 25
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 12
- 239000010432 diamond Substances 0.000 claims abstract description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 12
- 238000005245 sintering Methods 0.000 claims description 28
- BLNMQJJBQZSYTO-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu][Mo][Cu] BLNMQJJBQZSYTO-UHFFFAOYSA-N 0.000 claims description 25
- 238000011049 filling Methods 0.000 claims description 16
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 15
- 230000008595 infiltration Effects 0.000 claims description 10
- 238000001764 infiltration Methods 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005097 cold rolling Methods 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 238000011068 loading method Methods 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 15
- 239000000203 mixture Substances 0.000 description 8
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000003801 milling Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Abstract
The invention discloses a copper-molybdenum copper-copper composite material with a core material with holes and a preparation method thereof. The composite material comprises a molybdenum-copper alloy core material and copper materials covered on the upper surface and the lower surface of the core material, wherein a plurality of holes, namely core material holes, are formed in the core material, and silicon carbide and/or diamond are filled in the core material holes. The copper-molybdenum copper-copper composite material obtained by the invention has high thermal conductivity and low thermal expansion coefficient, can realize free assembly or selective assembly of a high-heat chip, not only improves the heat dissipation efficiency, but also enhances the reliability and stability of a system, and simultaneously, effectively reduces the thermal stress caused by temperature change and prolongs the service life of a semiconductor device.
Description
Technical Field
The invention relates to the technical field of heat sink materials, in particular to the technical field of copper-molybdenum-copper composite heat sink materials.
Background
With the high-speed development of technologies such as mobile communication, internet of things, artificial intelligence, power battery and the like, semiconductor devices are developed towards miniaturization, and under the trend, the integration level of electronic materials of microelectronic technology is higher and higher, which causes the contradiction between power density and heat dissipation of electronic equipment to be more and more prominent. If a large amount of heat generated in the use process of the device cannot be timely dissipated, the service life and stability of the device are affected, so that the requirement on the heat dissipation capacity of the heat sink material is continuously improved. On the other hand, the existing heat sink materials often have the problem of mismatch of thermal expansion coefficients with the semiconductor devices, thereby causing the devices or microelectronic circuits to fail due to thermal stress and thermal fatigue. Therefore, developing a heat sink material with high thermal conductivity and low expansion coefficient is a problem to be solved in the field of electronic packaging.
The copper-molybdenum-copper three-layer or multi-layer material is one of common heat dissipation composite materials, the copper layer on the surface of the copper-molybdenum-copper three-layer or multi-layer material has good heat conduction and dissipation effects, the core material molybdenum-copper layer can control the overall thermal expansion coefficient of the material in a lower range while guaranteeing heat conduction and dissipation, and the heat conductivity and the thermal expansion coefficient of the material can be regulated and controlled by adjusting the proportion of molybdenum and copper in the core material or the layer thickness ratio of the molybdenum-copper layer and the surface layer copper layer, so that the heat dissipation material with high heat conduction and adjustable thermal expansion coefficient can be better realized.
However, the existing copper-molybdenum copper-copper composite material is limited by the heat conductivity coefficient of molybdenum in the core material, and has a heat conductivity limit, so that in order to break through the limit, the copper content can be generally increased or the thicknesses of the surface copper layer and the core material molybdenum copper layer can be increased, but the two modes can lead to the increase of the heat expansion coefficient of the composite material, so that the composite material still cannot practically have both high heat conductivity and low expansion coefficient.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a novel copper-molybdenum-copper composite material with a core material with holes and a preparation method thereof, and compared with the existing copper-molybdenum-copper composite material, the composite material has higher local heat conductivity and lower thermal expansion coefficient, can realize free assembly or selective assembly of a high-heat chip, not only improves the heat dissipation efficiency, but also enhances the reliability and the stability of a system. Meanwhile, by accurately controlling the flow direction and speed of heat, the material effectively reduces the thermal stress caused by temperature change, prolongs the service life of a semiconductor device, and provides firm guarantee for the stable operation of high-performance electronic equipment in the information age.
The technical scheme of the invention is as follows:
the copper-molybdenum copper-copper composite material with the core material with the holes comprises a molybdenum copper alloy core material and copper materials covered on the upper surface and the lower surface of the core material, wherein the core material is provided with a plurality of holes, namely core material holes, and silicon carbide and/or diamond are filled in the core material holes.
The inventor surprisingly found that by arranging a porous structure in the core material of the copper-molybdenum-copper composite material and filling the pores with a thermal conductivity higher than copper and a thermal expansion coefficient lower than molybdenum, the porous structure can be perfectly matched with the molybdenum copper of the core material and the copper of the covering material, and the filling material does not generate obvious sensible heat stress and structural stress, namely the silicon carbide and/or the diamond selected by the technical scheme, the copper-molybdenum-copper heat dissipation material with high thermal conductivity and low expansion coefficient and stable and excellent performance can be obtained at the filling material.
The size, the number and the positions of the core holes can be flexibly adjusted according to the loading requirement of the heating element.
The copper-molybdenum-copper composite material with the core material with the holes can be used for loading chips with larger heat dissipation capacity at the positions filled with silicon carbide and/or diamond and chips with smaller heat dissipation capacity at the rest positions, and/or loading a larger number of microchips or integrated bodies thereof at the positions filled with the silicon carbide and/or diamond and loading a smaller number of chips at the rest positions when the copper-molybdenum-copper composite material with the core material with the holes is applied in particular.
According to some preferred embodiments of the invention, the holes are circular or square in shape.
According to some preferred embodiments of the present invention, the core holes are arranged in one or two rows symmetrically along the long axis direction of the core, and the diameter or length of the core holes is 1/4-1/2 of the width of the core, and the number of the core holes is 1-4.
The invention further provides a preparation method of the copper-molybdenum-copper composite material with the core material with the holes, which comprises the following steps:
forming the core material holes on a molybdenum-copper alloy plate serving as a core material to obtain a perforated core material;
Covering a first copper plate below the open-pore core material, filling the core material hole with silicon carbide and/or a diamond insert with the shape consistent with the core material hole and the thickness consistent with the open-pore core material, and covering a second copper plate above the filled open-pore core material to obtain a composite material blank;
And performing discharge plasma processing on the composite material blank to obtain the copper-molybdenum-copper composite material with the core material with the holes.
In the preparation method, the discharge plasma processing mode does not cause the filling material to deform greatly, so that a final product with basically consistent structure with the composite material blank can be obtained.
According to some preferred embodiments of the invention, the obtaining of the molybdenum-copper alloy sheet comprises:
pressing molybdenum powder into square billets;
Covering the surface of the obtained square billet with a copper plate, and then carrying out copper infiltration treatment at 1400-1500 ℃ in a hydrogen atmosphere to obtain molybdenum-copper alloy;
and carrying out multi-time warm rolling, annealing, cold rolling and annealing on the molybdenum-copper alloy until the thickness reaches the target thickness, and obtaining the molybdenum-copper alloy plate.
According to some preferred embodiments of the present invention, the thickness ratio of the first copper plate, the core material and the second copper plate is 1-2:4-1:1-2.
More preferably, the thickness ratio of the first copper plate, the core material and the second copper plate is 1:4:1, 2:3:2, 1:1 or 2:1:2.
According to some preferred embodiments of the present invention, the spark plasma processing comprises loading the composite material blank into a spark plasma sintering furnace for sintering at a temperature rise rate of 95-105 ℃ per minute, a sintering temperature of 1100-1300 ℃ and a heat preservation time of 50-70min, and a sintering pressure of 2.3-2.5 kN.
The invention has the following beneficial effects:
The copper-molybdenum-copper composite material with the core material with the holes has a lower thermal expansion coefficient and high thermal conductivity, so that the heat dissipation capacity of the material is remarkably improved, various chips can be carried at different positions according to different requirements, and the heat dissipation performance and thermodynamic stability of the whole device are optimized.
Drawings
FIG. 1 is a schematic view of a composite structure of a copper-molybdenum-copper composite material with a core material having holes according to the present invention.
Detailed Description
The technical scheme of the present invention will be further described below with reference to the embodiments of the present invention and the accompanying drawings. The embodiments described below are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Example 1
Referring to fig. 1, a copper-molybdenum-copper composite with a perforated core was prepared by:
(1) Filling 329 g molybdenum powder into a mold of 80 mm ×60 mm, and pressing the molybdenum powder into a square billet of 80 mm ×60 mm ×10 mm by using a molding press;
(2) Coating a copper plate with the mass of 184 g on the surface of a square billet, then placing the square billet in an infiltration furnace in hydrogen atmosphere for copper infiltration, preserving heat at 1400 ℃ for 2h, and milling out the surplus copper on the alloy surface to obtain molybdenum-copper alloy;
(3) Performing multi-time warm rolling, annealing and cold rolling on the molybdenum-copper alloy until the thickness of the molybdenum-copper alloy is 5mm to obtain a molybdenum-copper plate;
(4) 1 circular hole with the diameter of 1/2 of the width of the molybdenum copper plate is formed in the center of the molybdenum copper plate by utilizing a wire cutting process;
(5) Placing a copper plate with the thickness of 1.85 mm below a molybdenum copper plate of 5mm, filling the holes on the molybdenum copper plate with a silicon carbide embedded piece with the shape identical to the holes and the height identical to the molybdenum copper plate, covering the filled molybdenum copper plate with another copper plate with the thickness of 1.85 mm, and integrally fixing to obtain a composite material blank;
(6) And (3) putting the composite material blank into a discharge plasma sintering furnace for sintering to prepare the copper-molybdenum-copper composite material with the core material with the holes, wherein the temperature rising rate of sintering is 100 ℃ per minute, the sintering temperature is 1200 ℃, the sintering pressure is 2.4 kN, and the heat preservation time is 60 min.
The layer thickness ratio of the copper-molybdenum copper-copper composite material obtained in the embodiment is 1:4:1, and the core material comprises a main body material with the composition of 70 weight percent of molybdenum and 30 weight percent of copper and a filling material with the composition of silicon carbide.
Example 2
Referring to fig. 1, a copper-molybdenum-copper composite with a perforated core was prepared by:
(1) Filling 329 g molybdenum powder into a mold of 80 mm ×60mm, and pressing the molybdenum powder into a square billet of 80 mm ×60mm ×10mm by using a molding press;
(2) Coating a copper plate with the mass of 184 g on the surface of a square billet, then placing the square billet in an infiltration furnace in hydrogen atmosphere for copper infiltration, preserving heat at 1400 ℃ for 2h, and milling out the surplus copper on the alloy surface to obtain molybdenum-copper alloy;
(3) Performing multi-time warm rolling, annealing and cold rolling on the molybdenum-copper alloy until the thickness of the molybdenum-copper alloy is 4.5 mm to obtain a molybdenum-copper plate;
(4) Symmetrically opening 2 square holes with the length of 1/3 of the width of the molybdenum copper plate along the long axis direction at the center of the molybdenum copper plate by using a linear cutting process;
(5) Placing a copper plate with the thickness of 3.6 mm below a molybdenum copper plate with the thickness of 4.5 mm, filling the holes on the molybdenum copper plate with diamond embedded sheets with the shape consistent with the holes and the height equal to that of the molybdenum copper plate, covering the filled molybdenum copper plate with another copper plate with the thickness of 3.6 mm, and integrally fixing to obtain a composite material blank;
(6) And (3) putting the composite material blank into a discharge plasma sintering furnace for sintering, so as to prepare the copper-molybdenum-copper composite material with the core material with the holes, wherein the sintering temperature rising rate is 100 ℃ per minute, the sintering temperature is 1200 ℃, the sintering pressure is 2.4 kN, and the heat preservation time is 60 min.
The layer thickness ratio of the copper-molybdenum copper-copper composite material obtained in the embodiment is 2:3:2, and the core material comprises a main body material with the composition of 70 weight percent of molybdenum and 30 weight percent of copper and a filling material with the composition of diamond.
Example 3
Referring to fig. 1, a copper-molybdenum-copper composite with a perforated core was prepared by:
(1) The 279 g molybdenum powder is put into a mould of 80 mm X60 mm, and is pressed into a square billet of 80 mm X60 mm X10 mm by using a molding press;
(2) Coating a copper plate with the mass of 229 g on the surface of a square billet, then placing the square billet in an infiltration furnace in hydrogen atmosphere for copper infiltration, preserving heat at 1400 ℃ for 2: 2h, and milling out surplus copper on the surface of the alloy to obtain molybdenum-copper alloy;
(3) Performing multi-time warm rolling, annealing and cold rolling on the molybdenum-copper alloy until the thickness of the molybdenum-copper alloy is 3 mm a, and obtaining a molybdenum-copper plate;
(4) 3 circular holes with the diameter of 1/4 of the width of the molybdenum copper plate are formed in the center of the molybdenum copper plate by utilizing a wire cutting process, and the 3 holes are distributed in an equilateral triangle;
(5) Placing a copper plate with the thickness of 3.5 mm below a molybdenum copper plate with the thickness of 3mm, filling the holes on the molybdenum copper plate with a silicon carbide embedded piece with the shape identical to the holes and the height identical to the molybdenum copper plate, covering the filled molybdenum copper plate with another copper plate with the thickness of 3.5 mm, and integrally fixing to obtain a composite material blank;
(6) And (3) putting the composite material blank into a discharge plasma sintering furnace for sintering, so as to prepare the copper-molybdenum-copper composite material with the core material with the holes, wherein the sintering temperature rising rate is 100 ℃ per minute, the sintering temperature is 1200 ℃, the sintering pressure is 2.4 kN, and the heat preservation time is 60 min.
The layer thickness ratio of the copper-molybdenum copper-copper composite material obtained in the embodiment is 1:1:1, and the core material comprises a main body material with the composition of 60 weight percent of molybdenum and 40 weight percent of copper and a filling material with the composition of silicon carbide.
Example 4
Referring to fig. 1, a copper-molybdenum-copper composite with a perforated core was prepared by:
(1) The 279 g molybdenum powder is put into a mould of 80 mm X60 mm, and is pressed into a square billet of 80 mm X60 mm X10 mm by using a molding press;
(2) Coating a copper plate with the mass of 229 g on the surface of a square billet, then placing the square billet in an infiltration furnace in hydrogen atmosphere for copper infiltration, preserving heat at 1400 ℃ for 2: 2h, and milling out surplus copper on the surface of the alloy to obtain molybdenum-copper alloy;
(3) Performing multi-time warm rolling, annealing and cold rolling on the molybdenum-copper alloy until the thickness of the molybdenum-copper alloy is 2mm to obtain a molybdenum-copper plate;
(4) Symmetrically opening 4 square holes with the length of 1/4 of the width of the molybdenum copper plate at the center position of the molybdenum copper plate by utilizing a wire cutting process, wherein the 4 holes are distributed in a square shape;
(5) Placing a copper plate with the thickness of 4.5 mm below a molybdenum copper plate with the thickness of 2 mm, filling the holes on the molybdenum copper plate with diamond inserts with the shape consistent with the holes and the height equal to that of the molybdenum copper plate, covering the filled molybdenum copper plate with another copper plate with the thickness of 4.5 mm, and integrally fixing to obtain a composite material blank;
(6) And (3) putting the composite material blank into a discharge plasma sintering furnace for sintering, so as to prepare the copper-molybdenum-copper composite material with the core material with the holes, wherein the sintering temperature rising rate is 100 ℃ per minute, the sintering temperature is 1200 ℃, the sintering pressure is 2.4 kN, and the heat preservation time is 60 min.
The layer thickness ratio of the copper-molybdenum copper-copper composite material obtained in the embodiment is 2:1:2, and the core material comprises a main body material with the composition of 60wt% of molybdenum and 40wt% of copper and a filling material with the composition of diamond.
It should be noted that the foregoing is only a preferred embodiment of the present invention, and should not limit the scope of the technical solution of the present invention. Modifications of the embodiments described in the foregoing description, equivalents of the features, and so on, will be apparent to those skilled in the art without departing from the spirit and principles of the invention.
Claims (8)
1. The copper-molybdenum copper-copper composite material with the core material with the holes comprises a molybdenum copper alloy core material and copper materials covered on the upper surface and the lower surface of the core material, and is characterized in that a plurality of holes, namely core material holes, are formed in the core material, and silicon carbide and/or diamond are filled in the core material holes.
2. The copper-molybdenum-copper composite with a perforated core according to claim 1, wherein the core holes are round or square in shape.
3. The copper-molybdenum-copper composite with the core material with the holes according to claim 1, wherein the core material holes are arranged in one row or two rows symmetrically along the long axis direction of the core material, the diameter or the length of the core material holes is 1/4-1/2 of the width of the core material, and the number of the core material holes is 1-4.
4. A method of producing a copper-molybdenum-copper composite with a core having holes according to any one of claims 1 to 3, characterized in that it comprises:
forming the core material holes on a molybdenum-copper alloy plate serving as a core material to obtain a perforated core material;
Covering a first copper plate below the open-pore core material, filling the core material hole with silicon carbide and/or a diamond insert with the shape consistent with the core material hole and the thickness consistent with the open-pore core material, and covering a second copper plate above the filled open-pore core material to obtain a composite material blank;
And performing discharge plasma processing on the composite material blank to obtain the copper-molybdenum-copper composite material with the core material with the holes.
5. The method of manufacturing according to claim 4, wherein the obtaining of the molybdenum-copper alloy sheet includes:
pressing molybdenum powder into square billets;
Covering the surface of the obtained square billet with a copper plate, and then carrying out copper infiltration treatment at 1400-1500 ℃ in a hydrogen atmosphere to obtain molybdenum-copper alloy;
and carrying out multi-time warm rolling, annealing, cold rolling and annealing on the molybdenum-copper alloy until the thickness reaches the target thickness, and obtaining the molybdenum-copper alloy plate.
6. The method according to claim 4, wherein a thickness ratio of the first copper plate, the core material, and the second copper plate is 1-2:4-1:1-2.
7. The method according to claim 6, wherein the thickness ratio of the first copper plate, the core material, and the second copper plate is 1:4:1, 2:3:2, 1:1, or 2:1:2.
8. The method according to claim 4, wherein the discharge plasma processing comprises loading the composite material blank into a discharge plasma sintering furnace for sintering, wherein the sintering temperature is raised at a rate of 95-105 ℃ per minute, the sintering temperature is 1100-1300 ℃, the heat preservation time is 50-70min, and the sintering pressure is 2.3-2.5 kN.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119725263A true CN119725263A (en) | 2025-03-28 |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3900153A (en) | Formation of solder layers | |
| EP1944116B1 (en) | Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material | |
| EP0237741A2 (en) | Thermal conduction device | |
| US6583505B2 (en) | Electrically isolated power device package | |
| CN102214620A (en) | Semiconductor substrate having copper/diamond composite material and method of making same | |
| US9984951B2 (en) | Sintered multilayer heat sinks for microelectronic packages and methods for the production thereof | |
| JPH09157773A (en) | Aluminum composite material having low thermal expandability and high thermal conductivity and its production | |
| JP2003124410A (en) | Multi-layer heat sink and method for producing it | |
| KR20220165595A (en) | Composite and heat dissipation parts | |
| KR101691724B1 (en) | Heat radiation plate for high power devices | |
| JP2001105124A (en) | Heat radiation substrate for semi conductor device | |
| CN119725263A (en) | Copper-molybdenum-copper-copper composite material with porous core material and preparation method thereof | |
| CN106856180A (en) | A kind of method for welding IGBT module | |
| Zhang et al. | Reliability improvement of low-temperature sintered nano-silver as die attachment by porosity optimization | |
| CN103794571B (en) | A kind of power semiconductor novel metal-ceramic insulation substrate | |
| JPH11307701A (en) | Heat sink and manufacture therefor | |
| JP2004160549A (en) | Ceramic-metal composite and substrate for high heat conduction and heat radiation using the same | |
| CN216902911U (en) | Composite member | |
| US20090294955A1 (en) | Cooling device with a preformed compliant interface | |
| JP2000297301A (en) | Silicon carbide-based composite material, powder thereof, and production method thereof | |
| JP2007123516A (en) | Heat spreader, its manufacturing method, and semiconductor device using the same | |
| Wang et al. | Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison | |
| CN112888161B (en) | Ceramic single-module, array-type via-hole ceramic substrate, manufacturing method and application thereof | |
| CN213938418U (en) | Structure for adding heat dissipation block on ceramic circuit board | |
| CN110343927B (en) | Method for reducing thermal resistance of liquid metal alloy heat-conducting fin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication |