CN119698850A

CN119698850A - Electronic devices

Info

Publication number: CN119698850A
Application number: CN202380061204.3A
Authority: CN
Inventors: 柴田健士; 丸川裕也; 山口彬
Original assignee: Sony Group Corp
Current assignee: Sony Group Corp
Priority date: 2022-09-02
Filing date: 2023-08-16
Publication date: 2025-03-25
Also published as: WO2024048277A1

Abstract

The electronic device comprises a housing member, a supporting member and a component. The housing member has a bottom for arranging an audio component and an opening opposite to the bottom. The supporting member covers the opening of the housing member and forms an audio space for accommodating the audio component in the housing member. The component is arranged on the supporting member and at least partially overlaps with the audio space when viewed from above. The supporting member has an opposing surface opposite to the audio space, and the height of the opposing surface from the bottom of the housing member increases from a side overlapping with the component when viewed from above to a side opposite to the side.

Description

Electronic equipment

Technical Field

The present disclosure relates to electronic devices.

Background

An electronic device having a sound function includes an acoustic member such as a speaker. The acoustic member is generally accommodated in an acoustic space which is a closed space formed in a member constituting the electronic device.

Patent document 1 discloses a technique in which a hollow portion formed inside a hinge member of an electronic device is used as an acoustic space for accommodating an acoustic member.

Prior art literature

Patent literature

Patent document 1 Japanese patent application laid-open No. 2007-527131

Disclosure of Invention

Technical problem to be solved by the invention

In the above-described technique, there is room for improvement in terms of promoting miniaturization of electronic devices and suppressing deterioration of acoustic characteristics.

Accordingly, the present disclosure proposes an electronic device capable of promoting miniaturization of the electronic device and suppressing deterioration of acoustic characteristics.

Technical solution for solving technical problems

The electronic device of the present disclosure is provided with a housing member, a support member, and a component. The case member has a bottom portion on which the acoustic member is disposed, and an opening facing the bottom portion. The support member covers the opening of the housing member to form an acoustic space in the housing member for accommodating the acoustic component. The component is disposed on the support member and at least partially overlaps the acoustic space in a plan view. The support member has an opposing surface opposing the acoustic space, and the height of the opposing surface from the bottom of the housing member increases from a side overlapping the component in a plan view to a side opposite the side.

Drawings

Fig. 1 is a perspective view schematically showing an external appearance structure of a front side of an electronic device according to an embodiment.

Fig. 2 is a perspective view schematically showing an external appearance structure of the back side of the electronic device according to the embodiment.

Fig. 3 is a view schematically showing a cross section along the line III-III shown in fig. 1.

Fig. 4 is a plan view showing the support member of the embodiment.

Fig. 5 is a perspective view of the support member according to the embodiment as viewed from the sound space side.

Fig. 6 is a view schematically showing a cross section along the VI-VI line shown in fig. 2.

Fig. 7 is a perspective view showing the structure of the cover member of the embodiment.

Fig. 8 is a perspective view showing the structure of the cover member of the embodiment.

Fig. 9 is a plan view showing a positional relationship between the cover member and the circuit board according to the embodiment.

Fig. 10 is a diagram showing a connection state of the cover member and the circuit board according to the embodiment.

Fig. 11 is a view schematically showing a cross section along line XI-XI shown in fig. 1.

1 Electronic equipment, 6 casing member, 7 supporting member, 7a opposing surface, 7a1, 7a2 side, 7b pedestal portion, 7c recess, 8 antenna, 9 speaker, 10 buffer member, 61 bottom, 63 opening, S sound space.

Detailed Description

Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. In the following embodiments, the same reference numerals are given to the same parts, and overlapping description thereof is omitted.

In addition, the present disclosure is described in terms of the sequence of items shown below.

1. Description of the embodiments

1-1. Appearance structure of electronic device

1-2 Structure of Sound hole periphery

1-3 Structure of the cover Member periphery

1-4 Structure of display Module periphery

2. Effects of

(1. Embodiment)

[1-1. Appearance Structure of electronic device ]

Fig. 1 is a perspective view schematically showing an external appearance structure of a front side of an electronic apparatus 1 of an embodiment. Fig. 2 is a perspective view schematically showing an external appearance structure of the back side of the electronic device 1 of the embodiment. The electronic device 1 of the embodiment is a mobile phone such as a smart phone. The electronic device 1 according to the embodiment is not limited to a mobile phone, and may be a portable music device, a tablet terminal, a notebook computer, a VR (virtual reality) terminal, a controller of a game machine, or the like.

As shown in fig. 1 and 2, the electronic device 1 includes a housing 2. The housing 2 is configured by combining a display panel 21, a side frame 22, and a back cover 23.

The display panel 21 covers the display module 3 provided in the electronic device 1, and displays various images by transmitting the image displayed on the display module 3 to a display area in a central portion. That is, the display panel 21 forms a display portion of the electronic device 1 together with the display module 3. In addition, a sound hole 4 is provided at the upper end of the display panel 21. The sound hole 4 is a through hole connected to a speaker 9 (see fig. 3) provided in the electronic apparatus 1, and outputs sound emitted from the speaker 9 to the outside.

The side frame 22 is formed in, for example, a rectangular frame shape, and has an opening on the front side covered with the display panel 21 and an opening on the rear side covered with the rear cover 23, thereby forming a storage space inside together with the display panel 21 and the rear cover 23. Various components including, for example, the display module 3, the speaker 9, and the camera 11 are accommodated in the accommodation space inside the side frame 22.

The back cover 23, by being combined with the side frame 22, thereby defines the shape of the back side of the electronic device 1. The back cover 23 is provided with a cover member 5 for protecting the camera 11 provided inside the electronic device 1.

[1-2. Structure of Sound hole periphery ]

Next, a structure around the sound hole 4 according to the embodiment will be described with reference to fig. 3 to 5. Fig. 3 is a view schematically showing a cross section along the line III-III shown in fig. 1. As shown in fig. 3, the electronic apparatus 1 includes a housing member 6, a support member 7, and an antenna 8.

The case member 6 is a substantially rectangular parallelepiped case, and includes a bottom portion 61, a side wall 62 rising from the bottom portion 61, and an opening 63 facing the bottom portion 61. The side wall 62 is integrally fixed to the inner surface of the side frame 22, whereby the housing member 6 is housed in the housing space inside the side frame 22. The speaker 9 is disposed at the bottom 61. A through hole 61a is formed at a position below the speaker 9 of the bottom portion 61. The through hole 61a communicates with the sound hole 4 via a space sealed by the adhesive member 6a, and the adhesive member 6a adheres the case member 6 and the display panel 21. The sound generated from the speaker 9 is output from the sound hole 4 to the outside through the through hole 61a and the space. The speaker 9 is an example of an acoustic member.

The support member 7 is a plate-like member for supporting various antennas including the antenna 8, and covers the opening 63 of the housing member 6 to seal the housing member 6, thereby forming an acoustic space S accommodating the speaker 9 in the housing member 6.

The antenna 8 is, for example, an NFC (NEAR FIELD Communication) antenna, and is disposed on the support member 7. The thickness of the antenna 8 is greater than the thickness of the other antennas arranged on the support member 7. At least a part of the antenna 8 is located at a position overlapping the acoustic space S in a plan view. That is, the antenna 8 and the acoustic space S have overlapping portions in a plan view. This can increase the space utilization in which the antenna 8 and the case member 6 are arranged in the thickness direction of the electronic device 1, and can promote miniaturization of the electronic device 1.

Here, the structure of the support member 7 will be described more specifically. Fig. 4 is a plan view showing the support member 7 of the embodiment. Fig. 5 is a perspective view of the support member 7 according to the embodiment, viewed from the acoustic space S side.

As shown in fig. 3 to 5, the support member 7 has an opposing surface 7a opposing the acoustic space S. The facing surface 7a has a substantially rectangular shape in plan view, and has 4 sides including a side 7a1 overlapping the antenna 8 in plan view and a side 7a2 opposite to the side 7a 1. The height of the facing surface 7a from the bottom 61 of the case member 6 increases from the side 7a1 overlapping the antenna 8 in plan view to the side 7a2 opposite to the side 7a 1. For example, in the embodiment, the opposing surface 7a is a stepped surface in which the surface connected to the side 7a2 is higher from the bottom 61 of the case member 6 than the surface connected to the side 7a1 is from the bottom 61 of the case member 6.

That is, in the embodiment, the facing surface 7a has a shape in which the height of the side 7a2 that does not overlap the antenna 8 in a plan view from the bottom 61 of the case member 6 is higher than the height of the side 7a1 that overlaps the antenna 8 in a plan view from the bottom 61 of the case member 6.

If the facing surface 7a is formed to have a constant height from the bottom 61 of the housing member 6, the facing surface 7a and the bottom 61 of the housing member 6 come close to each other by an amount corresponding to the thickness of the antenna 8, and therefore the volume of the acoustic space S decreases, and the acoustic characteristics of the speaker 9 deteriorate. In contrast, in the embodiment, the height of the facing surface 7a from the bottom 61 of the case member 6 is increased from the side 7a1 overlapping the antenna 8 in a plan view to the side 7a2 facing the side 7a 1. This increases the volume of the acoustic space S compared to the case where the height of the facing surface 7a from the bottom 61 of the housing member 6 is constant. Therefore, even when the antenna 8 and the acoustic space S are positioned at a position overlapping in a plan view, downsizing of the electronic apparatus 1 can be promoted and acoustic characteristics can be improved.

The facing surface 7a may be a shape other than a stepped surface as long as the height of the side 7a2 from the bottom 61 of the case member 6 is higher than the height of the side 7a1 from the bottom 61 of the case member 6. For example, the opposing surface 7a may be a tapered surface or a curved surface. Even when the facing surface 7a is a tapered surface or a curved surface, the electronic device 1 can be reduced in size and improved in acoustic characteristics.

As shown in fig. 3 and 5, a rectangular frame-shaped pedestal portion 7b is formed around the facing surface 7 a. A rectangular frame-shaped cushioning member 10 is interposed between the pedestal portion 7b and the end surface of the case member 6 on the side of the opening 63. The cushion member 10 is made of an elastic material such as a resin, and is deformed by the pressure between the end surface of the housing member 6 surrounding the opening 63 and the pedestal portion 7b, so that the space between the housing member 6 and the support member 7 is sealed. That is, the pedestal 7b is in contact with the end surface of the case member 6 on the opening 63 side via the buffer member 10. The contact surface of the end surface of the case member 6 on the side of the opening 63, which contacts the pedestal 7b, is inclined in accordance with the change in the height of the facing surface 7 a. Accordingly, the sealing property of the sound space S is ensured by the buffer member 10, so that the sound transmitted from the speaker 9 to the sound space S does not leak to the outside of the sound space S, and the sound characteristics of the speaker 9 can be further improved.

As shown in fig. 3, the support member 7 has a recess 7c in a region partially overlapping the acoustic space S in a plan view on a surface opposite to the facing surface 7 a. An antenna 8 is disposed in the recess 7c. This makes it possible to bring the antenna 8 closer to the sound space S in the thickness direction of the electronic device 1 by an amount corresponding to the depth of the recess 7c, thereby further promoting downsizing of the electronic device 1.

[1-3. Structure of the periphery of cover Member ]

Next, the structure of the periphery of the cover member 5 according to the embodiment will be described with reference to fig. 6 to 10. Fig. 6 is a view schematically showing a cross section along the VI-VI line shown in fig. 2. As shown in fig. 6, the cover member 5 is disposed in a through hole 23a formed in the rear cover 23 of the housing 2, and is adhered to the inner wall surface of the rear cover 23 via a double-sided tape 23 b. A plurality of (3 in the example of fig. 6) cameras 11 are arranged inside the housing 2 close to the cover member 5.

Here, the structure of the cover member 5 will be described more specifically. Fig. 7 and 8 are perspective views showing the structure of the cover member 5 according to the embodiment. Fig. 7 shows a structure of the surface of the cover member 5 facing the camera 11, and fig. 8 shows a structure of the surface of the cover member 5 facing the camera 11.

As shown in fig. 6 to 8, the cover member 5 includes a main body portion 51 made of metal and covered with an insulating coating film, and a panel portion 52 made of a transparent material.

The main body 51 has a plurality of openings 51a at positions corresponding to the plurality of cameras 11. A portion of the corresponding camera 11 is located at each opening 51a. A flange 51b protruding outward is formed at the lower end of the main body 51, and the double-sided tape 23b is provided on the flange 51 b. The double-sided tape 23b adheres the main body 51 to the inner wall surface of the back cover 23.

The body 51 has a plurality (2 in this case) of protrusions 51c at the flange 51 b. A metal exposure region 51d where an insulating film is not formed is provided on an end surface of the protrusion 51c. The metal exposure region 51d is formed by performing a laser etching process on the end face of the protrusion 51c.

The main body 51 has a protective sheet 51e on the flange 51 b. The protective sheet 51e is made of an insulating material, and protects the insulating coating of the main body 51.

The panel portion 52 is located on the main body portion 51 so as to cover the plurality of openings 51 a. The panel portion 52 is adhered to the main body portion 51 by a double-sided tape 53 having through holes formed at positions corresponding to the plurality of openings 51 a.

However, in the electronic apparatus 1, since the camera 11 is disposed close to the cover member 5, when static electricity is generated outside the electronic apparatus 1, the static electricity may be transferred from the main body 51 to the camera 11 due to insulation breakdown of the main body 51. When static electricity is transferred to the camera 11, the camera 11 may malfunction.

In the embodiment, the cover member 5 is electrically connected to the circuit board provided inside the housing 2.

The electrical connection between the cover member 5 and the circuit board provided in the housing 2 will be described with reference to fig. 9 and 10. Fig. 9 is a plan view showing a positional relationship between the cover member 5 and the circuit board according to the embodiment. Fig. 10 is a diagram showing a connection state of the cover member 5 and the circuit board according to the embodiment.

As shown in fig. 9, a circuit board 12 on which various electronic components are mounted is disposed inside the housing 2. The circuit board 12 is disposed so as to surround the plurality of cameras 11. The circuit board 12 has a region overlapping the flange 51b of the cover member 5 in a plan view (hereinafter referred to as an "overlapping region") in which a plurality of contact springs 12a are arranged corresponding to the positions of the plurality of projections 51c of the cover member 5. The plurality of contact springs 12a are connected to the ground potential.

As shown in fig. 10, the metal exposure region 51d provided on the end surface of the protrusion 51c of the cover member 5 abuts against the contact spring 12a of the circuit board 12, whereby the cover member 5 is electrically connected to the circuit board 12. Accordingly, since the cover member 5 is held at the ground potential similarly to the contact spring 12a, static electricity generated outside the electronic apparatus 1 disappears in the cover member 5 and does not pass to the camera 11. Therefore, the possibility of malfunction of the camera 11 due to static electricity can be reduced.

Further, as shown in fig. 9, the protective sheet 51e of the cover member 5 is located at a position overlapping the overlapping region of the circuit substrate 12. Thus, even when the component disposed in the overlapping region of the circuit board 12 and the lid member 5 contact each other due to a collision such as a drop, damage to the insulating coating of the lid member 5 (the main body 51) is avoided. Therefore, the insulating property of the cover member 5 is maintained, and deterioration of performance of electronic components (for example, antennas and the like) in the vicinity of the cover member 5 can be suppressed.

[1-4. Structure of display Module periphery ]

Next, a structure around the display module 3 according to the embodiment will be described with reference to fig. 11. Fig. 11 is a view schematically showing a cross section along line XI-XI shown in fig. 1. As shown in fig. 11, the display panel 21, the side frame 22, and the back cover 23 (see fig. 1 and 2, not shown in fig. 11) form a storage space for various components inside the side frame 22.

The storage space surrounded by the display panel 21, the side frame 22, and the back cover 23 is partitioned into a space on the display panel 21 side and a space on the back cover 23 side by a partition wall 22a provided to the side frame 22. The space on the display panel 21 side and the space on the back cover 23 side are connected via a through hole formed in the partition wall 22 a. The display module 3 is housed in a space on the display panel 21 side.

The flexible substrate 13 having flexibility is electrically connected to the display module 3, and is led out to the space on the back cover 23 side through the through hole of the partition wall 22 a. That is, the flexible substrate 13 has a planar portion 13a connected to the display module 3. The flexible board 13 has a folded portion 13b extending from the planar portion 13a, penetrating through the through hole of the partition wall 22a, and folded back. The flexible board 13 has a planar portion 13c extending from the folded portion 13b and led out to the space on the back cover 23 side. A connector 13d is provided at the distal end of the planar portion 13c.

The other flexible substrate 14 is inserted into a space between the planar portion 13a and the planar portion 13c of the flexible substrate 13 facing each other. The other flexible board 14 is provided with a connector 14b corresponding to the position of the connector 13d of the flexible board 13, and the connector 13d of the flexible board 13 is connected to the connector 14b. In the other flexible board 14, a signal connector 14a is provided adjacent to the folded portion 13b of the flexible board 13, and a plug 15a of a signal cable 15 for transmitting a predetermined signal is connected to the signal connector 14a.

As described above, in the embodiment, the signal connector 14a is provided adjacent to the folded portion 13b on the other flexible substrate 14 inserted into the space between the planar portion 13a and the planar portion 13c of the flexible substrate 13. This can increase the space utilization of disposing the signal connector 14a in the thickness direction of the electronic device 1, and promote downsizing of the electronic device 1.

(2. Effect)

As described above, the electronic device (e.g., the electronic device 1) of the embodiment includes the housing member (e.g., the housing member 6), the support member (e.g., the support member 7), and the component (e.g., the antenna 8). The housing member has a bottom (e.g., bottom 61) on which the acoustic member (e.g., speaker 9) is disposed, and an opening (e.g., opening 63) facing the bottom. The support member covers the opening of the housing member to form an acoustic space (e.g., acoustic space S) in the housing member for accommodating the acoustic component. The component is disposed on the support member and at least partially overlaps the acoustic space in a plan view. The support member has an opposing surface (e.g., opposing surface 7 a) opposing the acoustic space, and the height of the opposing surface from the bottom of the housing member increases from a side (e.g., side 7a 1) overlapping the component in plan view to a side (e.g., side 7a 2) opposite the side. Thus, according to the electronic device of the embodiment, downsizing of the electronic device can be promoted and deterioration of acoustic characteristics can be suppressed.

In addition, the opposing surface may be a stepped surface, a tapered surface, or a curved surface. Thus, according to the electronic device of the embodiment, downsizing of the electronic device can be promoted and deterioration of acoustic characteristics can be suppressed.

The support member may have a pedestal portion (e.g., pedestal portion 7 b) formed around the facing surface and abutting the end surface of the opening side of the housing member via a buffer member (e.g., buffer member 10). The contact surface of the end surface of the opening side of the housing member with the pedestal portion may be a tapered surface inclined in accordance with a change in the height of the opposing surface. Thus, according to the electronic device of the embodiment, the acoustic characteristics of the acoustic member can be further improved.

In addition, the cushioning member may be an elastic body that is deformed by pressing. Thus, according to the electronic device of the embodiment, the case member and the support member can be sealed appropriately.

The support member may have a recess (for example, recess 7 c) in a region where a part of the support member overlaps the acoustic space in a plan view on a surface opposite to the facing surface. The member may be disposed in the recess. Thus, according to the electronic device of the embodiment, miniaturization of the electronic device can be further promoted.

The embodiments of the present disclosure have been described above, but the technical scope of the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present disclosure. In addition, the constituent elements of the different embodiments and modifications may be appropriately combined.

The effects described in the present specification are merely illustrative, not restrictive, and other effects may be also exhibited.

The present technology can also adopt the following configuration.

(1)

An electronic device is provided with:

a housing member having a bottom portion on which the acoustic member is disposed and an opening facing the bottom portion;

A support member covering the opening of the housing member to form an acoustic space accommodating the acoustic component in the housing member, and

A component arranged on the supporting member and at least partially overlapping the acoustic space in a plan view,

Wherein the support member has an opposing surface opposing the acoustic space, and a height of the opposing surface from a bottom of the housing member increases from a side overlapping the component in a plan view to a side opposite to the side.

(2)

The electronic device according to the above (1), wherein,

The opposite surface is a step surface, a conical surface or a bending surface.

(3)

The electronic device according to the item (1) or (2), wherein,

The support member has a pedestal portion formed around the facing surface and abutting against the end surface of the housing member on the opening side via a buffer member,

An abutment surface of the opening side end surface of the housing member against the pedestal portion is a tapered surface inclined in accordance with a change in the height of the opposing surface.

(4)

The electronic device according to the item (3), wherein,

The cushioning member is an elastic body that deforms by pressing.

(5)

The electronic device according to any one of the items (1) to (4), wherein,

The support member has a recess in a region partially overlapping the acoustic space in a plan view on a surface opposite to the facing surface,

The member is disposed in the recess.

Claims

1. An electronic device comprising:

A housing member having a bottom portion for arranging the audio component and an opening opposite to the bottom portion;

a supporting member that covers the opening of the housing member and forms an acoustic space in the housing member for accommodating the acoustic component; and

A component is arranged on the supporting member and at least partially overlaps with the acoustic space when viewed from above,

The supporting member has an opposing surface facing the acoustic space, and the height of the opposing surface from the bottom of the casing member increases from a side overlapping with the component in a plan view toward a side opposite to the side.

2. The electronic device according to claim 1, wherein:

The opposing surface is a step surface, a conical surface or a curved surface.

3. The electronic device according to claim 1, wherein:

The support member has a seat portion formed around the facing surface and in contact with the end surface of the opening side of the case member via a buffer member.

The contact surface between the end surface of the opening side of the case member and the seat portion is a tapered surface inclined in accordance with the change in height of the facing surface.

4. The electronic device according to claim 3, wherein:

The buffer member is an elastic body that is deformed by being pressed.

5. The electronic device according to claim 1, wherein:

The support member has a recessed portion in a region partially overlapping the acoustic space when viewed from above on a surface on the side opposite to the facing surface.

The component is disposed in the recessed portion.