CN119689212A - Aging board, testing system and testing method - Google Patents
Aging board, testing system and testing method Download PDFInfo
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Abstract
本发明提供一种老化板、测试系统及测试方法，老化板包括扩展输出模块、多个第一开关模块和多个端接电阻；待测器件具有多个引脚，引脚、第一开关模块与端接电阻一一对应，第一开关模块与对应的端接电阻串联连接于第一电源与对应的引脚之间，第一开关模块还与扩展输出模块连接，扩展输出模块通过通信总线通信连接主控板。通过在老化板内设置扩展输出模块，在对待测器件进行切换测试时，无需主控板直接控制各第一开关模块，而是通过与扩展输出模块进行通信即可控制各第一开关模块，主控板只需要提供一个通信接口与老化板中的扩展输出模块进行通信连接即可实现切换不同的测试，节省主控板的引脚数量，降低结构复杂程度和成本。
The present invention provides an aging board, a test system and a test method, wherein the aging board comprises an extended output module, a plurality of first switch modules and a plurality of termination resistors; the device to be tested has a plurality of pins, the pins, the first switch module and the termination resistors correspond one to one, the first switch module and the corresponding termination resistors are connected in series between a first power supply and the corresponding pins, the first switch module is also connected to the extended output module, and the extended output module is connected to a main control board via a communication bus. By arranging the extended output module in the aging board, when switching tests are performed on the device to be tested, the main control board does not need to directly control each first switch module, but can control each first switch module by communicating with the extended output module, and the main control board only needs to provide a communication interface to communicate with the extended output module in the aging board to switch different tests, thereby saving the number of pins of the main control board and reducing the complexity and cost of the structure.
Description
Technical Field
The embodiment of the invention relates to the technical field of chip testing, in particular to an aging board, a testing system and a testing method.
Background
Burn-in boards are devices that are specially used for long-term stability and reliability testing of devices, and are particularly widely used in the field of semiconductors and electronic components.
Conventional burn-in boards are limited to burn-in testing devices under test and do not support current parameter testing. Because a large number of relays are adopted in the aging board to establish the connection between the pins of the device to be tested and the terminating resistor, in order to meet the requirement of current parameter test, the main control board is required to control the large number of relays to disconnect the connection between the pins of the device to be tested and the terminating resistor, and the main control board is required to allocate more pins to control the relays, so that the structure is complex and the cost is increased.
Disclosure of Invention
The embodiment of the invention provides an aging board, a testing system and a testing method, wherein an expansion output module is arranged in the aging board, so that the number of pins for connecting a main control board and the aging board is reduced, the structure is simplified, and the cost is reduced.
In a first aspect, an embodiment of the present invention provides an burn-in board, configured to perform burn-in testing on a device to be tested, where the burn-in board includes an extended output module, a plurality of first switch modules, and a plurality of termination resistors, the device to be tested has a plurality of pins, the first switch modules and the termination resistors are in one-to-one correspondence, the first switch modules and the corresponding termination resistors are connected in series between a first power supply and the corresponding pins, the first switch modules are further connected with the extended output module, the extended output module is connected with a main control board through a communication bus, the extended output module is configured to receive a first control signal of the main control board through the communication bus, and output a plurality of first control sub-signals to the plurality of first switch modules based on the first control signal, and output a plurality of second control sub-signals to the plurality of first switch modules based on the second control signal, respectively, the first switch modules are configured to turn on the first control sub-signals and the first switch modules and the second control sub-signals to be disconnected based on the first power supply circuit and the first termination resistors.
In some embodiments, the extended output module includes an IO extended chip, where the IO extended chip is connected to each of the first switch modules, and the IO extended chip is further connected to the main control board through the communication bus.
In some embodiments, the extended output module further comprises a first switch unit, and the first switch unit is respectively connected with the IO extended chip and the first switch module.
In some embodiments, the first switch module comprises a first optical relay, a first end of the first optical relay is connected with the extended output module, a second end of the first optical relay is grounded, a third end of the first optical relay is connected with the first power supply, a fourth end of the first optical relay is connected with the corresponding termination resistor, and the termination resistor is connected with the corresponding pin.
In some embodiments, the burn-in board further comprises a second switch module, wherein the second switch module is respectively connected with the extended output module, the pin, a second power supply and the main control board, the extended output module is further configured to output a third control sub-signal to the second switch module based on the first control signal and a fourth control sub-signal to the second switch module based on the second control signal, and the second switch module is configured to establish connection between the pin and the second power supply and disconnect connection between the pin and the main control board based on the third control sub-signal and establish connection between the pin and the main control board and disconnect connection between the pin and the second power supply based on the fourth control sub-signal.
In some embodiments, the second switch module includes a second optical relay and a third optical relay, wherein a first end of the second optical relay is connected to a third power supply, a second end of the second optical relay and a first end of the third optical relay are both connected to the extended output module, a second end of the third optical relay is grounded, a third end of the second optical relay is connected to the second power supply, a fourth end of the second optical relay and a third end of the third optical relay are connected to the pin, and a fourth end of the third optical relay is connected to the main control board.
In a second aspect, an embodiment of the present invention provides a test system, where the test system includes a device to be tested, a main control board, and an burn-in board according to any one of the embodiments of the first aspect, pins of the device to be tested are respectively connected to the burn-in board and the main control board, and an expansion output module in the burn-in board is communicatively connected to the main control board through a communication bus.
In some embodiments, the main control board comprises a control module, a DC test module, a read-write test module and a change-over switch module, wherein the control module is respectively connected with the DC test module, the read-write test module and the change-over switch module, the control module is in communication connection with the expansion output module through the communication bus, the change-over switch module is also respectively connected with the DC test module, the read-write test module and pins of the device to be tested, and the control module is configured to control the working state of the change-over switch module so as to establish connection between the pins and the DC test module, so that the device to be tested is subjected to DC test, or establish connection between the pins and the read-write test module, so that the device to be tested is subjected to read-write test.
In some embodiments, the DC test module comprises a parameter measurement unit, an AD acquisition unit and a second switch unit, wherein the parameter measurement unit is connected with the control module, and the second switch unit is also connected with the AD acquisition unit, the control module and the change-over switch module.
In some embodiments, the control module comprises a first controller and a second controller, wherein the first controller is respectively connected with the second controller, the expansion output module and the read-write test module, and the second controller is respectively connected with the DC test module and the change-over switch module.
In a third aspect, an embodiment of the present invention provides a testing method, which is applied to the testing system according to any one of the embodiments of the second aspect, and the testing method includes that the control module sends a first control signal to the extended output module, the extended output module respectively outputs a plurality of first control sub-signals to a plurality of first switch modules in response to the first control signal, the first switch module responds to the first control sub-signals to establish connection between the pins and the first power supply so that the burn-in board performs burn-in testing on the device to be tested or the master control board performs read-write testing on the device to be tested, the control module sends a second control signal to the extended output module, the extended output module responds to the second control signal to respectively output a plurality of second control sub-signals to a plurality of first switch modules, and the first switch module responds to the second control sub-signals to disconnect connection between the pins and the first power supply so that the master control board performs read-write testing on the device to be tested.
In some embodiments, the burn-in board further comprises a second switch module, the test method further comprises the steps that when the device to be tested is subjected to read-write test, the expansion output module further responds to the first control sub-signal and outputs a third control sub-signal to the second switch module, the second switch module responds to the third control sub-signal and breaks connection between the pin and the main control board and establishes connection between the pin and the second power supply, when the device to be tested is subjected to DC test, the expansion output module further responds to the second control sub-signal and outputs a fourth control sub-signal to the second switch module, and the second switch module responds to the fourth control sub-signal and establishes connection between the pin and the main control board and breaks connection between the pin and the second power supply.
In some embodiments, the main control board further comprises a change-over switch module, the test method further comprises the steps that when the device to be tested is subjected to read-write test or burn-in test, the control module sends a third control signal to the change-over switch module, the change-over switch module responds to the third control signal to establish connection between the pin and the read-write test module and disconnect connection between the pin and the DC test module, and when the device to be tested is subjected to DC test, the control module sends a fourth control signal to the change-over switch module, and the change-over switch module responds to the fourth control signal to disconnect connection between the pin and the read-write test module and establish connection between the pin and the DC test module.
The embodiment of the invention has the beneficial effects that the embodiment of the invention provides an aging board, a testing system and a testing method, wherein the aging board comprises an expansion output module, a plurality of first switch modules and a plurality of terminating resistors, a device to be tested is provided with a plurality of pins, the first switch modules and the terminating resistors are in one-to-one correspondence, the first switch modules and the corresponding terminating resistors are connected in series between a first power supply and the corresponding pins, the first switch modules are also connected with the expansion output module, and the expansion output module is connected with a main control board through communication bus communication. Through setting up the extension output module in the ageing board, when the device to be tested switches the test, need not main control board direct control each first switch module, but through carrying out the communication with the extension output module and can control each first switch module, the main control board only need provide a communication interface and the extension output module in the ageing board carry out communication connection and can realize switching different tests, save main control board's pin quantity, reduce structure complexity and cost.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.
FIG. 1 is a block diagram of a test system according to an embodiment of the present invention;
FIG. 2 is a block diagram of a portion of an burn-in board according to an embodiment of the present invention;
FIG. 3 is a block diagram illustrating a portion of another burn-in board according to an embodiment of the present invention;
FIG. 4 is a block diagram of a portion of another burn-in board according to an embodiment of the present invention;
FIG. 5 is a block diagram showing a portion of a burn-in board according to an embodiment of the present invention;
FIG. 6 is a block diagram of another test system according to an embodiment of the present invention;
Fig. 7 is a block diagram of a main control board according to an embodiment of the present invention;
Fig. 8 is a flow chart of a testing method according to an embodiment of the present invention.
Detailed Description
In order that the invention may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "electrically connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "upper," "lower," "inner," "outer," "bottom," and the like as used in this specification are used in an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items. In addition, the technical features mentioned in the different embodiments of the invention described below can be combined with one another as long as they do not conflict with one another.
Current double data rate (Doub L E DATA RATE, DDR) memory granule burn-in is tested using a burn-in repair tester that does not support the DC testing by the parameter measurement unit (PARAMETER MEASUREMENT UNIT, PMU), while a DC-capable FT tester cannot be used for burn-in. This results in the need to use different testers when burn-in testing and DC testing the device under test, resulting in increased development and testing costs. Besides, a main control board can be used for controlling a large number of relays in the burn-in board to disconnect pins of the device to be tested from the terminating resistor so as to support current parameter test, but the number of pins of the main control board is increased sharply, so that the structure is complex and the cost is increased. The DC test comprises open circuit and short circuit test, leakage current test, IDD test and the like, and the IDD test refers to the test of total current flowing into a device to be tested.
In order to solve the technical problems, the embodiment of the invention provides an aging board, a testing system and a testing method, wherein an expansion output module is arranged in the aging board and is in communication connection with a main control board, the main control board is used for controlling the expansion output module to output a plurality of control signals to a plurality of first switch modules so as to control loops between pins and terminating resistors, so that the number of pins of the main control board is reduced, and the complexity and cost of the structure are reduced.
In a first aspect, referring to fig. 1, an embodiment of the present invention provides a burn-in board 100 for burn-in testing a device under test 200, where the burn-in board 100 includes an extended output module 10, a plurality of first switch modules 20, and a plurality of termination resistors 30.
The device under test 200 has a plurality of pins 210, the first switch modules 20 and the terminating resistors 30 are in one-to-one correspondence, the first switch modules 20 and the corresponding terminating resistors 30 are connected in series between the first power source V1 and the corresponding pins 210, the first switch modules 20 are further connected with the extended output module 10, and the extended output module 10 is connected with the main control board 300 through communication bus communication. The extended output module 10 is configured to receive a first control signal of the main control board 300 through the communication bus and output a plurality of first control sub-signals to the plurality of first switch modules 20 based on the first control signal, respectively, and receive a second control signal of the main control board 300 through the communication bus and output a plurality of second control sub-signals to the plurality of first switch modules 20 based on the second control signal, respectively. The first switch module 20 is configured to be turned on based on the first control sub-signal to loop the first power supply V1, the first switch module 20, the terminating resistor 30 and the pin 210, and turned off based on the second control sub-signal to break the loop.
The device under test 200 may be a DDR memory or other test chip, such as DDR4, having a plurality of pins 210 for facilitating connection to external devices. The package forms of the device under test are various, including a single unlimited 78 ball grid array, 82 ball grid array, and 496 ball grid array. The state of the chip after long-time use, such as performance change, etc., can be detected by burn-in testing of the device under test 200.
The extended output module 10 is a device having a plurality of output terminals, and is capable of being communicatively connected to the main control board 300, and outputting a plurality of control sub-signals to the plurality of first switch modules 20 in response to a control signal of the main control board 200, so as to control the on states of the plurality of first switch modules 20.
The first switch module 20 is a switching device on the burn-in board 100 for controlling the connection between the pins 210 of the device under test 200 and the termination resistor 30. The pins 210 of each device under test 200 correspond to a first switch module 20 and a terminating resistor 30, and the first switch module 20 can be turned on or turned off according to the control sub-signal provided by the extended output module 10, so as to control the circuit connection state between the pins 210 of the device under test 200 and the terminating resistor 30.
The termination resistor 30 is a resistor on the burn-in board 100 for connection in series with the pin 210 of the device under test 200. During the burn-in test, the termination resistor 30 may simulate the load in an actual circuit to evaluate the performance of the device under test 200 under specific load conditions, and the termination resistor 30 may also be used to limit the current to protect the device under test 200 from excessive current.
The first power V1 may be an external dc power, and may be provided by the main control board 300 or other devices.
The main control board 300 is a core control unit of the burn-in system, and is responsible for generating control signals and transmitting the control signals to the extended output module 10 through a communication bus. Software or hardware logic on the main control board 300 can dynamically adjust the content of the control signal according to the test requirement, execute the test process and collect the test result.
In the burn-in board 100, the main control board 300 may send different control signals to the extended output module 10 through the communication bus, and the extended output module 10 may output a plurality of control sub-signals to the plurality of first switch modules 20 based on the control signals, respectively, to control the first switch modules 20 to be in an on state or to be in an off state, so as to establish or disconnect a loop, so that when the loop is established, the burn-in test or the read-write test may be performed on the device 200 to be tested, and when the loop is disconnected, the DC test may be performed on the device 200 to be tested, such as the leakage current test, the open circuit test, the short circuit test, and the like.
In the present invention, by arranging the extended output module 10 in the burn-in board 100, when the device 200 to be tested is subjected to the switching test, the main control board 200 is not required to directly control each first switch module 20, but can control each first switch module 20 by communicating with the extended output module 10, and the main control board 300 can realize the switching of different tests by only providing one communication interface to be in communication connection with the extended output module 10 in the burn-in board 100, thereby saving the pin number of the main control board 300 and reducing the complexity and cost of the structure.
In some embodiments, referring to fig. 2, the extended output module 10 includes an IO extended chip 11, where the IO extended chip 11 is connected to each first switch module 20, and the IO extended chip 11 is further communicatively connected to the main control board 300 through a communication bus.
The IO expansion chip 11 is a chip dedicated to adding or expanding input/output ports of a system. Specifically, the IO expansion chip 11 may be a TCA9539QPWRQ chip, and the communication bus may be an I2C communication bus, that is, the IO expansion chip 11 and the main control board 300 communicate by adopting an I2C communication protocol, and the number of the IO expansion chips 11 may be set according to actual needs.
In this embodiment, by providing the IO expansion chip 11 to provide an additional IO port, the main control board 300 only needs to provide a communication interface for communicating with the IO expansion chip 11 to control the plurality of first switch modules 20, so as to control whether the circuits among the plurality of pins 210, the terminating resistor 30 and the first power supply V1 of the device under test 200 are turned on, so as to realize different tests for switching the device under test 200, and the burn-in board 100 can support a test environment up to 110 ℃, and can stably operate in an environment of 98 ℃.
In some embodiments, referring to fig. 3, the extended output module 10 further includes a first switch unit 12, where the first switch unit 12 is connected to the IO extended chip 11 and the first switch module 20, respectively.
For convenience of management, the first switch modules 20 may be controlled in groups, for example, the first switch modules 20 corresponding to the pins 210 of the same type are used as the same group, in this embodiment, in order to save the output pins 210 of the IO expansion chip 11, the on states of the first switch modules 20 of different groups may be controlled by the on states of the plurality of first switch units 12, so that the IO expansion chip 11 may control the on states of the first switch units 12, i.e. may control the on states of the plurality of first switch modules 20. Specifically, the control end of the first switch unit 12 is connected to the IO expansion chip 11, one end of the first switch unit 12 is connected to the fourth power source V4, for example, a 3.3V power source, the other end of the first switch unit 12 is respectively connected to a plurality of first switch modules 20 in the same group, and the first switch unit 12 may include a PMOS transistor or a PNP transistor, so that the IO expansion chip 11 may control on or off of the first switch unit 12 to control a connection state between the first switch module 20 and the fourth power source V4, so that the first switch module 20 is in an on or off state.
In this embodiment, by using the first switch units 12, the grouping control of the plurality of first switch modules 20 can be implemented, so that the plurality of first switch modules 20 that originally need to be controlled by the output pins 210 of the plurality of IO expansion chips 11 respectively can be synchronously controlled by controlling one or a few of the first switch units 12, thereby greatly saving the output pin resources of the IO expansion chips 11.
In some embodiments, referring to fig. 4, the first switch module 20 includes a first optical relay U1, a first end of the first optical relay U1 is connected to the extended output module 10, a second end of the first optical relay U1 is grounded GND, a third end of the first optical relay U1 is connected to the first power source V1, a fourth end of the first optical relay U1 is connected to a corresponding termination resistor 30, and the termination resistor 30 is connected to a corresponding pin 210.
The first optical relay U1 may use a TLP3450 chip, the first control sub-signal may be a high level signal, the second control sub-signal may be a low level signal, after receiving the high level signal output by the extended output module 10, the light emitting diode between the first end and the second end will emit light to make the connection between the third end and the fourth end conductive, that is, the loop between the first power source V1 and the terminating resistor 30, and the pin 210 is conductive, the light emitting diode between the first end and the second end will not emit light after receiving the low level signal output by the extended output module 10 by the first optical relay U1, that is, the loop between the first power source V1 and the terminating resistor 30, and the pin 210 is disconnected.
In the present embodiment, by providing the first optical relay U1 as the first switching module 20, transmission of the control signal is achieved through the optical signal, and has a higher isolation performance than a conventional relay electrically connected directly.
In some embodiments, referring to fig. 4, in order to protect the light emitting diode in the first optical relay U1, a current limiting resistor Rp1 may be connected between the second end of the first optical relay U1 and the ground GND, and/or, in order to improve the stability of the power supply, a first capacitor C1 may be respectively connected to the first power supply V1 and the ground GND, and the first power supply V1 may be filtered through the first capacitor C1, so as to improve the stability of the circuit.
In some of these embodiments, referring to fig. 5, burn-in board 100 further includes a second switch module 40. The second switch module 40 is respectively connected with the expansion output module 10, the pin 210, the second power supply V2 and the main control board 300. The extended output module 10 is further configured to output a third control sub-signal to the second switching module 40 based on the first control signal, and to output a fourth control sub-signal to the second switching module 40 based on the second control signal. The second switching module 40 is configured to establish connection between the pin 210 and the second power V2 and disconnect connection between the pin 210 and the main control board 300 based on the third control sub-signal, and to establish connection between the pin 210 and the main control board 300 and disconnect connection between the pin 210 and the second power V2 based on the fourth control sub-signal.
The voltage value of the second power supply V2 may be 0V or a voltage higher than 0V. For example, for the pin 210 requiring a pull-up level in the device under test 200 when performing the read/write test, the voltage value of the second power V2 connected to the corresponding second switch module 40 may be a voltage higher than 0V, and for the pin 210 requiring a pull-down level in the device under test 200 when performing the read/write test, the voltage value of the second power V2 connected to the corresponding second switch module 40 may be 0V, that is, ground.
The second switch module 40 may employ a switch or any other suitable switching device, and may change the connection state between the pin 210 and the second power V2 and the connection state between the pin 210 and the main control board 300 under different signal directions. Specifically, the first control signal includes a first a control signal and a first B control signal, when the device 200 to be tested needs to be subjected to burn-in test, the main control board 300 sends the first a control signal to the extended output module 10, the extended output module 10 outputs a first control sub-signal to the first switch module 20 based on the first a control signal, the first switch module 20 is turned on, when the device 200 to be tested needs to be subjected to read-write test, the main control board 300 sends a first B control signal to the extended output module 10, the extended output module 10 outputs a first control sub-signal to the first switch module 20 based on the first B control signal and outputs a third control sub-signal to the second switch module 40, the first switch module 20 is turned on, the second switch module 40 establishes a connection between the pin 210 and the second switch module 20 based on the third control sub-signal and disconnects the connection between the pin 210 and the main control board 300, so that the pin 210 pulls up or pulls down, when the device 200 to be tested needs to be tested is subjected to DC test, the main control board 300 sends a second control signal to the extended output module 10, the extended output module 10 outputs a second control sub-signal to the first switch module 20 based on the second control sub-signal to the second switch module 20 and connects the second switch module 40 to the second switch module 40 and disconnects the connection between the pin 210 and the first switch module 40 and the second switch module 40.
In this embodiment, by setting the second switch module 40, the main control board 300 can control the second switch module 40 to be in a conducting state through the expansion output module 10, so that the pin 210 is connected with the second power supply V2 in a read-write test state to realize a pull-up level or a pull-down level, thus, a circuit for the pull-up level or the pull-down level of the pin 210 is not required to be set in the main control board 300, and the structure in the main control board 300 is reduced, or the main control board 300 can control the second switch module 40 through the expansion output module 10 to establish the connection between the pin 210 and the main control board 300 so as to perform a DC test on the pin 210.
In some embodiments, referring to fig. 5, the second switch module 40 includes a second optical relay U2 and a third optical relay U3, wherein a first end of the second optical relay U2 is connected to the third power source V3, a second end of the second optical relay U2 and a first end of the third optical relay U3 are both connected to the extended output module 10, a second end of the third optical relay U3 is grounded GND, a third end of the second optical relay U2 is connected to the second power source V2, a fourth end of the second optical relay U2 and a third end of the third optical relay U3 are connected to the pin 210, and a fourth end of the third optical relay U3 is connected to the main control board 300.
The second optical relay U2 and the third optical relay U3 may use TLP3450 chips, the third control sub-signal is a low level signal, and the fourth control sub-signal is a high level signal. When the extended output module 10 outputs a low level signal to the second optical relay U2 and the third optical relay U3, the light emitting diode between the first end and the second end of the second optical relay U2 is turned on, the connection between the third end and the fourth end of the second optical relay U2 is turned on, the light emitting diode between the first end and the second end of the third optical relay U3 is turned off, the connection between the third end and the fourth end of the third optical relay U3 is turned on, and thus, the connection between the pin 210 and the second power supply V2 is turned on, and when the extended output module 10 outputs a high level signal to the second optical relay U2 and the third optical relay U3, the light emitting diode between the first end and the second end of the second optical relay U2 is turned off, the light emitting diode between the first end and the second end of the third optical relay U3 is turned on, and the connection between the pin 210 and the main control board 300 is turned on.
In the present embodiment, by providing the second optical relay U2 and the third optical relay U3 as the second switching module 40, transmission of the control signal is achieved through the optical signal, and the relay has a higher isolation performance than a conventional relay electrically connected directly.
In a second aspect, an embodiment of the present invention provides a test system, referring to fig. 1, the test system includes a device under test 200, a main control board 300, and an burn-in board 100 according to any of the embodiments of the first aspect. Pins 210 of the device under test 200 are respectively connected with the burn-in board 100 and the main control board 300, and an expansion output module 10 in the burn-in board 100 is in communication connection with the main control board 300 through a communication bus.
In this embodiment, the burn-in board 100 has the same structure and function as the burn-in board 100 according to any one of the first aspect, and will not be described here.
In the test system, the expansion output module 10 in the burn-in board 100 is in communication with the main control board 300, so that the main control board 300 can control the plurality of first switch modules 20 through the expansion output module 10 to realize different switching tests, thereby reducing the pin number of the main control board 300 and reducing the structural complexity and cost.
In some embodiments, referring to fig. 6, the main control board 300 includes a control module 310, a DC test module 320, a read/write test module 330, and a switch module 340. The control module 310 is respectively connected with the DC test module 320, the read-write test module 330 and the switch module 340, the control module 310 is in communication connection with the extended output module 10 through a communication bus, and the switch module 340 is also respectively connected with the DC test module 320, the read-write test module 330 and the pins 210 of the device 200 to be tested. The control module 310 is configured to control the working state of the switch module 340 to establish a connection between the pin 210 and the DC test module 320, so that the device under test 200 performs DC test, or to establish a connection between the pin 210 and the read/write test module 330, so that the device under test 200 performs read/write test.
The DC test module 320 refers to a module that can perform a direct current parameter test on each pin 210 of the device under test 200. For example, the DC test module 320 may provide a DC power to the pins 210 of the device under test 200 and measure the current value through the pins 210 to evaluate the performance and electrical characteristics of the device under test 200 under different voltage or current conditions, such as leakage current.
The read/write test module 330 refers to a module that can perform read/write test on each pin 210 of the device under test 200. For example, the read/write test module 330 may send data to the pins 210, perform write operations, or receive data from the pins 210, perform read operations, thereby verifying the data processing capabilities, data transfer rates, communication protocols, etc. of the device under test 200.
The change-over switch module 340 is a module that can establish connection between different terminals upon receiving different control signals, so that the connection state between each pin 210 and the DC test module 320 and the read-write test module 330 can be changed.
Under different tests, the main control board 300 can selectively connect the DC test module 320 or the read-write test module 330 to pins of the device under test by controlling the change-over switch module 340, so as to facilitate different tests. If the burn-in test is performed, the main control board 300 controls the switch module 340 to be turned off, so that the pin 210 of the device 200 to be tested is not connected with the DC test module 320 or the read-write test module 330, if the burn-in test is performed, the main control board 300 controls the switch module 340 to connect the pin 210 of the device 200 to be tested with the DC test module 320, and if the read-write test is performed, the main control board 300 controls the switch module 340 to connect the pin 210 of the device 200 to be tested with the read-write test module 330. By the flexible mode, different tests on the pins can be achieved without replacing hardware.
In some of these embodiments, referring to fig. 7, the dc test module 320 includes a parameter measurement unit 321, an AD acquisition unit 322, and a second switching unit 323. The parameter measurement unit 321 is connected to the control module 310, and the second switch unit 322 is further connected to the AD acquisition unit 322, the control module 310, and the switch module 340.
Parameter measurement unit (PARAMETER MEASUREMENT UNIT, PMU) 321 is a device dedicated to measuring circuit parameters, and in DC test block 320, parameter measurement unit 321 is responsible for leakage current testing, open circuit and short circuit testing.
The AD acquisition unit 322 and the parameter measurement unit 321 are connected with the second switch unit 323 at the same time, and the AD acquisition unit 322 can more accurately measure and determine whether the signal output by the parameter measurement unit 321 is correct, so as to ensure reliable test.
The second switching unit 323 is an electronic component for switching signals between a plurality of circuit paths, and may include switching devices such as analog switches, relays, and the like. In the DC test module 320, the second switching unit 323 selectively connects or disconnects the pin 210 to the parameter measurement unit 321 according to an instruction of the control module 310.
In the present embodiment, by setting the parameter measurement unit 321 and the second switching unit 323, the pin 210 can be DC tested.
In some of these embodiments, referring to fig. 7, the control module 310 includes a first controller 311 and a second controller 312. The first controller 311 is connected to the second controller 312, the extended output module 10, and the read/write test module 330, and the second controller 312 is connected to the DC test module 320 and the switch module 340, respectively.
Specifically, the first controller 311 may be a central processing unit (Centra l Process I ng Unit, CPU), the second controller 312 may be a field programmable gate array (Fie l d-Programmab L E GATE ARRAY, FPGA), the first controller 311 and the second controller 312 may be connected through an SPI communication bus, the first controller 311 and the read/write test module 330 may be connected through an SPI communication bus, the first controller 311 and the expansion output module 10 may be connected through an I2C communication bus, the second controller 321 and the parameter measurement unit 321 may be connected through an SPI communication bus, and the second controller 321 may be further connected to the second switch unit 323 and the switch module 340, respectively.
In this embodiment, by setting two controllers as the control module 310, different tasks can be distributed to the two controllers for processing, so as to improve the data processing efficiency.
In a third aspect, an embodiment of the present invention provides a testing method applied to the testing system according to any one of the second aspect, referring to fig. 8, the testing method includes:
In step S10, the control module 310 sends a first control signal to the extended output module 10.
Specifically, taking the embodiment shown in fig. 6 and fig. 7 as an example, in this step, the first control signal includes a first a control signal and a first B control signal, when performing the burn-in test, the first controller 311 sends the first a control signal to the extended output module 10 through the I2C communication bus, and when performing the read-write test, the first controller 311 sends the first B control signal to the extended output module 10 through the I2C communication bus.
In step S20, the expansion output module 10 outputs a plurality of first control sub-signals to the first switch module 20 in response to the first control signals, respectively.
After receiving the first a control signal or the first B control signal, the extended output module 10 outputs a plurality of first control sub-signals to the plurality of first switch modules 20.
Step S30, the first switch module 20 responds to the first control sub-signal to establish connection between the pin 210 and the first power supply V1, so that the burn-in board 100 performs burn-in test on the device 200 to be tested or the main control board 300 performs read-write test on the device 200 to be tested;
then, the first switch module 20 is turned on after receiving the first control signal, so that the pin 210, the termination resistor 30, and the loop between the first switch module 20 and the first power V1 are turned on, and the burn-in test or the read-write test can be performed on the device 200 to be tested.
In step S40, the control module 310 sends a second control signal to the extended output module 10.
In performing the DC test, the first controller 311 will send a second control signal to the expansion output module 10 via the I2C communication bus.
In step S50, the expansion output module 10 outputs a plurality of second control sub-signals to the plurality of first switch modules 20 in response to the second control signals, respectively.
After receiving the second control signals, the extended output module 10 outputs a plurality of second control sub-signals to the plurality of first switch modules 20.
In step S60, the first switch module 20 responds to the second control sub-signal to disconnect the connection between the pin 210 and the first power V1, so that the main control board 300 performs DC test on the device 200 to be tested.
Then, the first switch module 20 receives the first control signal and turns off, so that the loop among the pin 210, the terminating resistor 30, the first switch module 20 and the first power supply V1 is disconnected, and the device under test 200 can be DC tested.
It can be seen that, in this embodiment, the main control board 300 only needs to communicate with the expansion output module 10 to control the working states of the first switch modules 20, so as to switch different tests.
In some of these embodiments, burn-in board 100 further includes a second switch module 40, and the test method further includes the steps of:
In step S71, during the read-write test of the device under test 200, the extended output module 10 also responds to the first control sub-signal and outputs a third control sub-signal to the second switch module 40. In step S72, the second switch module 40 disconnects the connection between the pin 210 and the main control board 300 and establishes the connection between the pin 210 and the second power source V2 in response to the third control sub-signal.
Specifically, when the extended output module 10 receives the first B control signal during the read-write test, the extended output module 10 further outputs a third control sub-signal to the second switch module 40, so that the connection between the pin 210 and the second power V2 is established, so as to pull up or pull down the pin 210.
Step S73, when the DC test is performed on the device under test 200, the extended output module 10 further responds to the second control sub-signal and outputs a fourth control sub-signal to the second switch module 40. In step S74, the second switch module 40 establishes connection between the pin 210 and the main control board 300 and disconnects connection between the pin 210 and the second power source V2 in response to the fourth control sub-signal.
Specifically, during the DC test, the extended output module 10 further controls the second switch module 40 to disconnect the connection between the pin 210 and the second power V2, and establishes the connection between the pin 210 and the main control board 300, so that the main control board 300 can perform the DC test on the pin 210 subsequently.
In this embodiment, the main control board 300 can control the second switch module 40 to be in a conducting state through the expansion output module 10, so that the pin 210 is connected with the second power supply V2 in a read-write test state to realize a pull-up level or a pull-down level, thus, a circuit for the pull-up level or the pull-down level of the pin 210 is not required to be set in the main control board 300, and the structure in the main control board 300 is reduced, in addition, the main control board 300 can establish the connection between the main control board 300 and the pin 210 by controlling the second switch module 40, so as to perform a DC test on the pin 210.
In some embodiments, the main control board 300 includes a switch module 340, and the testing method further includes the step of step S81 of the control module 310 sending a third control signal to the switch module 340 when the read-write test or the burn-in test is performed on the device 200 to be tested, the switch module 340 establishing the connection between the pin 210 and the read-write test module 330 and disconnecting the connection between the pin 210 and the DC test module 320 in response to the third control signal. In step S82, when the DC test is performed on the device under test 200, the control module 310 sends a fourth control signal to the switch module 340, and the switch module 340 disconnects the connection between the pin 210 and the read/write test module 330 and establishes the connection between the pin 210 and the DC test module 320 in response to the fourth control signal.
Specifically, when the device 200 to be tested is subjected to the read-write test or the burn-in test, the second controller 312 sends a third control signal to the switch module 340, and the switch module 340 can establish connection between the pin 210 and the read-write test module 330 based on the third control signal, so that the second controller 312 can control the read-write test module 330 to work, to implement the read-write test, or to run some test procedures when the device 200 to be tested is subjected to the burn-in test. When the DC test is performed on the device under test 200, the second controller 312 sends a fourth control signal to the switch module 340, and the switch module 340 can establish a connection between the pin 210 and the DC test module 320, for example, a connection between the pin 210 and the second switch unit 323, based on the fourth control signal, so that the second controller 312 can control the parameter measurement unit 321 and the second switch unit 323 to work to implement the DC test.
The control process for the specific read-write test and DC test is not limited herein, referring to the prior art. In this embodiment, by controlling the operation state of the switch module 340, the module connected to the pin 210 is changed, so that different tests can be performed.
It should be noted that the above-described apparatus embodiments are merely illustrative, and the units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
It should finally be noted that the above embodiments are only intended to illustrate the technical solution of the present invention and not to limit it, that the technical features of the above embodiments or of the different embodiments may be combined in any order, and that many other variations in the different aspects of the present invention as described above exist, which are not provided in details for the sake of brevity, and that although the invention has been described in the detailed description with reference to the foregoing embodiments, it should be understood by those skilled in the art that it may still make modifications to the technical solution described in the foregoing embodiments or equivalent to some of the technical features thereof, where these modifications or substitutions do not depart from the essence of the corresponding technical solution from the scope of the technical solution of the embodiments of the present invention.
Claims (13)
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