CN119676993A - A method for manufacturing a vehicle-grade PCB board and a PCB board - Google Patents
A method for manufacturing a vehicle-grade PCB board and a PCB board Download PDFInfo
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- CN119676993A CN119676993A CN202411830108.3A CN202411830108A CN119676993A CN 119676993 A CN119676993 A CN 119676993A CN 202411830108 A CN202411830108 A CN 202411830108A CN 119676993 A CN119676993 A CN 119676993A
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Abstract
本申请属于半导体技术领域，公开了一种车规级PCB板的制作方法及PCB板。将若干个表面已焊接功率模组的陶瓷基板放置在预先设计的PTFE冶具的铣空槽内；在PTFE冶具的上表面覆盖粘结片和铜箔，进行压合处理形成第一增层；通过激光钻孔、电镀填孔和填塞铜浆在第一增层内形成第一连接件和第二连接件；在第一增层的表面进行图形转移处理形成内层线路图；在第一增层的上表面覆盖粘结片和铜箔，进行压合处理形成第二增层；通过激光钻孔和电镀填孔在第二增层内形成第三连接件；在第二增层的表面进行图形转移处理形成外层线路图；将铣空槽内的PCB板切割出来完成制作。将陶瓷基板与有机基板材料进行结合形成复合电路板结构，有效改善PCB板的散热性能和可靠性。
The present application belongs to the field of semiconductor technology, and discloses a method for manufacturing an automotive-grade PCB board and a PCB board. Place a number of ceramic substrates with power modules welded on the surface into the milling slot of a pre-designed PTFE jig; cover the upper surface of the PTFE jig with an adhesive sheet and copper foil, and perform a lamination process to form a first build-up layer; form a first connector and a second connector in the first build-up layer by laser drilling, electroplating hole filling, and filling with copper paste; perform a graphic transfer process on the surface of the first build-up layer to form an inner layer circuit diagram; cover the upper surface of the first build-up layer with an adhesive sheet and copper foil, and perform a lamination process to form a second build-up layer; form a third connector in the second build-up layer by laser drilling and electroplating hole filling; perform a graphic transfer process on the surface of the second build-up layer to form an outer layer circuit diagram; and cut out the PCB board in the milling slot to complete the production. The ceramic substrate is combined with the organic substrate material to form a composite circuit board structure, which effectively improves the heat dissipation performance and reliability of the PCB board.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a manufacturing method of a vehicle-gauge PCB and the PCB.
Background
Currently, the heat dissipation design of a vehicle-mounted power chip module generally adopts a method that firstly, heat is transferred from a chip to the lower layer of a PCB board by utilizing a copper block and a dense laser drilling technology, and then, the heat is effectively dissipated into the surrounding environment through a heat dissipation adhesive film with high heat conduction performance (the heat conduction coefficient is more than 10W/mk). The heat dissipation scheme has strict requirements on the performance of the heat dissipation adhesive film. The heat dissipation film is required to have a high heat conductivity coefficient (usually 160 mu m thick), a heat conductivity coefficient of more than 15W/mk, a high electrical insulation property (2) to prevent current leakage and short circuit, so that the film can keep stable insulation property under a high voltage environment, a good fluidity (4) to resist copper foil separation caused by thermal circulation and mechanical vibration in long-term operation (3) to reduce delamination and explosion caused by cavities when filling gaps of thick copper lines, and a good heat resistance and ageing resistance (5) to adapt to ageing caused by long-term operation at high temperature of an automobile inverter product.
However, the heat dissipation materials which can meet all the requirements and are applied on the PCB are few, and a new method is needed to solve the problem.
Disclosure of Invention
Therefore, the embodiment of the application provides a manufacturing method of a vehicle-gauge PCB and the PCB, and the ceramic substrate with high heat dissipation performance and high pressure resistance is combined with an organic substrate material to form a composite circuit board structure, so that the heat dissipation performance and the reliability of the PCB are effectively improved.
In a first aspect, the application provides a manufacturing method of a vehicle-gauge PCB.
The application is realized by the following technical scheme that the manufacturing method of the vehicle-gauge PCB comprises the following steps:
s1, providing a PTFE (polytetrafluoroethylene) jig, wherein the PTFE jig is provided with a plurality of milling empty slots with the same size;
S2, placing a plurality of ceramic substrates with the surfaces welded with the power modules in a milling empty groove of a PTFE jig;
S3, covering an adhesive sheet and a copper foil on the upper surface of the PTFE jig, and performing lamination treatment to form a first build-up layer on the ceramic substrate;
s4, forming a first connecting piece and a second connecting piece in the first build-up layer through laser drilling, electroplating hole filling and copper paste filling;
s5, performing pattern transfer treatment on the surface of the first build-up layer to form an inner layer circuit diagram;
s6, covering an adhesive sheet and a copper foil on the upper surface of the first build-up layer, and performing lamination treatment to form a second build-up layer;
S7, forming a third connecting piece in the second build-up layer through laser drilling and electroplating hole filling;
s8, performing pattern transfer treatment on the surface of the second build-up layer to form an outer layer circuit diagram;
S9, cutting the PCB in the milling empty groove to finish manufacturing.
In a preferred example of the present application, it may be further configured that a relationship between a thickness d 1 of the PTFE jig and a thickness d 2 of the ceramic substrate of the surface-welded power module satisfies:
0μm≤d1-d2≤25μm。
In a preferred embodiment of the application it may be further provided that,
The relation between the size of the milling empty groove and the size of the ceramic substrate of the welded power module meets the following conditions:
4mm≤x1-x2≤6mm,4mm≤y1-y2≤6mm,
Where x 1 denotes the length of the milled open groove, y 1 denotes the width of the milled open groove, x 2 denotes the length of the ceramic substrate of the soldered power module, and y 2 denotes the width of the ceramic substrate of the soldered power module.
In a preferred embodiment of the application, it can be provided that the distance between two adjacent milling recesses is greater than 5mm.
In a preferred embodiment of the present application, the ceramic substrate may be any one of an alumina substrate, an aluminum nitride substrate, and a silicon nitride substrate.
In a preferred embodiment of the present application, the ceramic substrate may be a silicon nitride substrate, and the heat dissipation coefficient of the silicon nitride substrate is 70W/mk to 90W/mk.
In a preferred embodiment of the present application, it may be further configured that the adhesive sheet is a PP adhesive sheet or an ABF prepreg adhesive sheet.
In a preferred example of the present application, it may be further arranged that the copper foil includes one or more of a 3 μm copper foil, a 12 μm copper foil, an 18 μm copper foil, or a 35 μm copper foil.
In a second aspect, the application provides a vehicle-gauge grade PCB.
The application is realized by the following technical scheme:
A vehicle gauge grade PCB board, the PCB board comprising:
the power module is fixed on the ceramic substrate;
the upper surfaces of the ceramic substrate and the power module are connected with a first build-up layer, and the first build-up layer comprises a first dielectric layer and a first wiring layer;
The first build-up layer is provided with a first connecting piece and a second connecting piece, the first connecting piece is used for connecting the first wiring layer and the power module, and the second connecting piece is used for connecting the first wiring layer and the ceramic substrate;
The upper surface of the first build-up layer is connected with a second build-up layer, and the second build-up layer comprises a second dielectric layer and a second wiring layer;
And a third connecting piece is arranged on the second build-up layer and is used for connecting the first wiring layer and the second wiring layer.
In a preferred embodiment of the present application, the thickness of the first dielectric layer may be 200 μm to 250 μm, and the thickness of the second dielectric layer may be 100 μm to 150 μm.
In summary, compared with the prior art, the technical scheme provided by the embodiment of the application has the following beneficial effects:
The application discloses a manufacturing method of a Printed Circuit Board (PCB), which comprises the steps of placing a plurality of ceramic substrates with surface welded power modules in a milling empty groove of a pre-designed PTFE jig, covering an adhesive sheet and a copper foil on the upper surface of the PTFE jig, performing pressing treatment to form a first enhancement layer, forming a first connecting piece and a second connecting piece in the first enhancement layer through laser drilling, electroplating filling holes and filling copper paste, performing pattern transfer treatment on the surface of the first enhancement layer to form an inner layer circuit diagram, covering the adhesive sheet and the copper foil on the upper surface of the first enhancement layer, performing pressing treatment to form a second enhancement layer, forming a third connecting piece in the second enhancement layer through laser drilling and electroplating filling holes, performing pattern transfer treatment on the surface of the second enhancement layer to form an outer layer circuit diagram, and cutting the PCB in the milling empty groove. The packaging method does not need to use a radiating copper frame, so that thicker core board materials are not needed to support the power module, resin can better flow into and fill the circuit gaps in the pressing process due to the reduction of the plate thickness, the occurrence of glue filling cavities in the final PCB product is reduced, and the yield of the product is improved.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a vehicle-standard PCB according to an embodiment of the present application;
FIG. 2 is a schematic view of a jig according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of an intermediate product of a PCB board according to an embodiment of the present application;
Fig. 4 is a schematic structural diagram of a vehicle-gauge PCB according to another embodiment of the present application;
reference numerals illustrate:
PTFE fixture 101, ceramic substrate 1, power module 11, first interpolation layer 2, first dielectric layer 21, first wiring layer 22, first connecting piece 4, second connecting piece 5, second interpolation layer 3, second dielectric layer 31, second wiring layer 32, third connecting piece 6.
Detailed Description
The present embodiment is only for explanation of the present application and is not to be construed as limiting the present application, and modifications to the present embodiment, which may not creatively contribute to the present application as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present application.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In addition, the term "and/or" in the present application is merely an association relation describing the association object, and indicates that three kinds of relations may exist, for example, a and/or B may indicate that a exists alone, and a and B exist together, and B exists alone. In the present application, unless otherwise specified, the term "/" generally indicates that the associated object is an "or" relationship.
The terms "first," "second," and the like in this disclosure are used for distinguishing between similar elements or items having substantially the same function and function, and it should be understood that there is no logical or chronological dependency between the terms "first," "second," and "n," and that there is no limitation on the amount and order of execution.
In embodiments of the application, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment should not be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.
The conventional organic substrate generally uses high heat dissipation adhesive films for heat dissipation, but the heat dissipation coefficient of the heat dissipation adhesive films is generally within 20W/mk. In addition, as the heat dissipation coefficient increases, the fluidity of the heat dissipation film becomes poor, and the adhesive force becomes weak, which not only affects the sufficient filling of the circuit gaps, but also weakens the adhesive force between the layers of the PCB. Because the heat dissipation coefficient of the heat dissipation adhesive film is limited, the thickness of the adhesive film cannot be designed to be too thick, otherwise, the heat dissipation performance is affected. However, the limited thickness of the adhesive film brings the risk of high voltage failure of 800V and 1200V. These problems are common on the organic substrate at the present stage, and limit the improvement of the finished product performance of the PCB. In view of the above, the application proposes an innovative method for manufacturing a composite PCB board with high heat dissipation performance by combining a ceramic substrate and an organic material, considering that the ceramic substrate not only has excellent heat dissipation performance and can bear high voltage, but also has good adhesion strength with copper foil. The method aims to solve the defects of the traditional organic substrate in heat dissipation, voltage resistance and copper foil bonding strength, so as to realize remarkable improvement of the performance of the PCB. Through the use of the composite material, the high heat dissipation property and the voltage resistance property of the ceramic substrate can be fully utilized, and meanwhile, the flexibility and the processing convenience of the organic material are maintained, so that a more reliable PCB solution is provided for high-performance electronic equipment.
The following describes embodiments of the present application in further detail with reference to the accompanying drawings, and as shown in fig. 1, a manufacturing method of a vehicle-gauge PCB board according to a first exemplary embodiment of the present application includes:
s1, providing a PTFE jig, wherein a plurality of milling empty slots with the same size are arranged on the PTFE jig.
As shown in fig. 3a, a plurality of milling grooves are formed on the PTFE jig 101. The PTFE jig is a polytetrafluoroethylene jig and has good insulating property and mechanical property.
At present, ceramic substrates and organic substrates produced in mass production of PCBs are different in size, wherein the maximum size of the ceramic substrates is 192 multiplied by 380mm, and the minimum size of the organic substrates is 356 multiplied by 457mm. In order to solve the problem of the mismatch of the sizes, the application adopts a special jig to adapt to the sizes of the two. As shown in fig. 2, a plurality of milling empty slots are formed in the jig (i.e., the PTFE jig), and each milling empty slot has the same size, and is used for placing a ceramic substrate. The number of milling flutes may be designed according to the size of the PTFE jig, and the number of milling flutes in fig. 2 is only for illustration, and is not limited to the number of milling flutes.
The design of the jig aims at flexibly matching products with different specifications, improving the production efficiency and reducing the production cost. By using the special jig, the problem of size matching of the ceramic substrate and the organic substrate can be effectively solved, so that the ceramic substrate and the organic substrate can be effectively combined, and the overall performance of the PCB is improved.
Wherein, the relation between the thickness d 1 of the PTFE jig and the thickness d 2 of the ceramic substrate with the surface welded with the power module is more than or equal to 0 mu m and less than or equal to 1-d2 and less than or equal to 25 mu m. That is, in some embodiments, the thickness of the PTFE jig may be the same as the thickness of the ceramic substrate of the surface-welded power module, and in some embodiments, the thickness of the PTFE jig may be greater than the thickness of the ceramic substrate of the surface-welded power module. The ceramic substrate with the surface welded with the power module is ensured to be completely placed in the milling empty groove, and the precision of the subsequent processing process is improved.
In a preferred embodiment, the thickness of the PTFE jig is 20 μm to 25 μm greater than the thickness of the ceramic substrate with the power module soldered thereto. Meanwhile, the relation between the size of the milling empty slot and the size of the ceramic substrate of the welded power module meets the requirement that x 1-x2≤6mm,4mm≤y1-y2 is smaller than or equal to 4mm and smaller than or equal to 6mm, wherein x 1 represents the length of the milling empty slot, y 1 represents the depth of the milling empty slot, x 2 represents the length of the ceramic substrate of the welded power module, and y 2 represents the width of the ceramic substrate of the welded power module.
S2, placing the ceramic substrates with the power modules welded on the surfaces into milling empty grooves of the PTFE jig.
As shown in fig. 3b, the ceramic substrate 1 with the surface welded with the power module is placed in a milling recess of the PTFE jig 101. Wherein, the power module on the ceramic substrate 1 is a vehicle-standard power module.
In the practical implementation process, the ceramic substrate 1 is fixed by sticking the adhesive tape on the lower surface of the PTFE jig 101, so that the ceramic substrate 1 can be ensured to be stably placed in a milling empty groove, and the positioning precision in the assembly process is improved. Wherein, the ceramic substrate can be any one of an alumina substrate, an aluminum nitride substrate and a silicon nitride substrate. Preferably, the ceramic substrate is a silicon nitride substrate, the heat dissipation coefficient of the silicon nitride substrate is 70W/mk-90W/mk, the bending strength of the silicon nitride substrate can reach 800Mpa, and the silicon nitride substrate has excellent heat dissipation capacity and high bending strength, so that the reliability and durability of a product can be effectively improved when the ceramic substrate is applied to manufacturing of a vehicle-mounted PCB.
And S3, covering the upper surface of the PTFE jig with a bonding sheet and a copper foil, and performing lamination treatment to form a first build-up layer on the ceramic substrate.
As shown in fig. 3c, a first build-up layer 2 is formed on the surface of the PTFE jig 101 and the ceramic substrate 1 to which the power module has been soldered. Specifically, the upper surface of the PTFE jig 101 and the surface of the ceramic substrate 1 to which the power module has been soldered are first subjected to cleaning treatment, so that the upper surface is dust-free and oil-free, to ensure that the adhesive sheet and the copper foil can be better attached. And uniformly paving a layer of bonding sheet on the upper surface of the PTFE jig, paving a layer of copper foil on the bonding sheet, and selecting the bonding sheet and the copper foil according to circuit design and thermal management requirements. The adhesive sheet and copper foil should at least be able to cover all the milled open grooves. And placing the PTFE jig paved with the bonding sheet and the copper foil into a pressing machine. And pressing at a preset temperature and pressure to ensure that good bonding is formed between the bonding sheet and the copper foil and between the bonding sheet and the ceramic substrate, and the bonding sheet flows into a gap between the ceramic substrate and the milling empty groove by heating and melting. The parameters of temperature, time and pressure in the pressing process are set differently according to the adhesive sheet materials used. Under normal conditions, the temperature is raised to a temperature T 1 (100-120 ℃) and kept at the temperature T 1 for about 30min, then the temperature is raised to a temperature T 2 (190-250 ℃) and kept at the temperature T 2 for 60-120 min, finally the temperature is reduced to room temperature, and the pressure is usually set to be above 5kgf/cm 2.
The bonding sheet adopts a PP bonding sheet or an ABF semi-cured bonding sheet. The copper foil includes one or more of a3 μm copper foil, a 12 μm copper foil, an 18 μm copper foil, or a 35 μm copper foil.
Preferably, a cushioning material is placed on the bottom of the PTFE jig prior to the lamination operation, the cushioning material comprising one or more of a tri-in-one material, an aluminum sheet, a lamination pad, and kraft paper. The buffer material can buffer the lamination pressure, so that the pressure is more uniformly transferred to the surfaces of the copper foil and the bonding sheet, the whole board surface is uniformly heated and pressed, the bonding sheet is more uniformly fused to the line gap, and the generation of glue filling cavities is reduced.
And S4, forming a first connecting piece and a second connecting piece in the first build-up layer through laser drilling, electroplating hole filling and copper paste filling.
As shown in fig. 3d, a plurality of laser holes are drilled in the region corresponding to the power module in the first build-up layer 2 by laser, then a copper layer with a certain thickness is formed on the hole walls of all the laser holes by means of copper deposition electroplating after the laser drilling is completed, the copper layer is called a seed layer, then the laser holes are filled with copper electroplating slurry, finally the surface of the copper electroplating slurry is filled with copper to form a first connecting piece 4, and the first connecting piece 4 is used for establishing electrical connection between the power module and the first build-up layer and transmitting signals generated by the power module. And then filling copper paste into the laser holes, leveling electroplated copper on the surfaces to form second connecting pieces 5, wherein the second connecting pieces 5 are used for establishing connection between the ceramic substrate and the first build-up layer, and transmitting heat of the ceramic substrate outwards. The aperture of the first connector is smaller than the aperture of the second connector. The manufacturing process of the first connector 4 and the second connector 5 may be performed simultaneously or in batches.
And S5, performing pattern transfer processing on the first build-up layer to form an inner layer circuit diagram.
Specifically, a photosensitive material is attached to the first build-up layer, exposure equipment is used for exposing the photosensitive material, an unexposed dry film is removed through a developing process, a dry film pattern which is polymerized by exposure is exposed, a copper layer at a non-circuit part is corroded by a chemical reaction method, only a circuit pattern which is protected by the dry film is left, the residual dry film is removed, a required inner layer circuit pattern is obtained, pattern transfer of the first build-up layer is completed, and a semi-finished product is shown in a figure 3 e.
And S6, covering the adhesive sheet and the copper foil on the upper surface of the first build-up layer, and performing lamination treatment to form a second build-up layer.
As shown in fig. 3f, a layer of bonding sheet is uniformly laid on the upper surface of the first build-up layer 2 after the pattern transfer treatment, a layer of copper foil is laid on the bonding sheet, and the PTFE jig with the laid bonding sheet and copper foil is placed into a press for press fit to form a second build-up layer 3. And pressing at a preset temperature and pressure to ensure that good bonding is formed between the bonding sheet and the copper foil and the ceramic substrate. The parameters of temperature, time and pressure in the pressing process are set differently according to the adhesive sheet materials used. In a normal case, the temperature is raised to a temperature T 1 (100-120 ℃) and kept at the temperature T 1 for about 30min, then the temperature is raised to a temperature T 2 (190-250 ℃) and kept at the temperature T 2 for 60-120 min, then the temperature is set to be at room temperature, and the pressure is usually set to be above 5kgf/cm 2. Wherein, the bonding sheet adopts a PP bonding sheet or an ABF semi-solidified bonding sheet. The copper foil includes at least one of a3 μm copper foil, a 12 μm copper foil, an 18 μm copper foil, or a 35 μm copper foil.
And S7, forming a third connecting piece in the second build-up layer through laser drilling and electroplating hole filling.
As shown in fig. 3g, a laser drilling apparatus is used to drill holes at the designated locations of the second build-up layer, after which the holes are cleaned using a brush and solvent to remove residues and debris from the walls of the holes and prepare a good surface for subsequent electroplating. The third connection member 6 is formed by plating copper on the through hole wall using an electroplating process. The third connection 6 is used to establish an electrical connection between the first build-up layer and the second build-up layer.
And S8, performing pattern transfer treatment on the surface of the second build-up layer to form an outer layer circuit diagram.
And similar to the step of carrying out pattern transfer treatment on the surface of the first build-up layer, attaching a photosensitive material on the second build-up layer, exposing the photosensitive material by adopting exposure equipment, removing the unexposed dry film through a development process to expose the exposed polymerized dry film pattern, corroding the copper layer at the non-circuit part by using a chemical reaction method, only leaving the circuit pattern protected by the dry film, removing the residual dry film to obtain a required outer layer circuit pattern, and forming a semi-finished product shown in figure 3 h. It should be noted that the outer layer circuit diagram may be the same as the inner layer circuit diagram, and the outer layer circuit diagram may be a different arrangement from the inner layer circuit diagram.
S9, cutting the PCB in the milling empty groove to finish manufacturing.
The current technical scheme is to weld the power module to a heat dissipation copper frame to realize heat dissipation. Such heat dissipating copper frames typically have a thickness exceeding 1mm, which in embedded designs results in a corresponding increase in core board thickness, which in turn results in an increase in the thickness of the final product. The present application proposes a new solution to directly sinter the power module onto the plane of the ceramic substrate without the use of a massive heat dissipating copper frame. The thickness of the power chip is typically 0.180 + -0.020 mm, which means that thicker core material is not required to support the power module. By using a resin adhesive sheet with good fluidity for lamination, the thickness of the finished product can be significantly reduced. The design not only reduces the material cost, but also meets the market demand of the miniaturization development of the packaging module.
In another embodiment, as shown in fig. 4, a vehicle-standard-level PCB is provided, wherein the PCB comprises a ceramic substrate 1, a power module 11 is fixed on the ceramic substrate 1, a first build-up layer 2 is connected to the upper surfaces of the ceramic substrate 1 and the power module 11, the first build-up layer 2 comprises a first dielectric layer 21 and a first wiring layer 22, a first connecting piece 4 and a second connecting piece 5 are arranged on the first build-up layer 2, the first connecting piece 4 is used for connecting the first wiring layer 22 and the power module 11, the second connecting piece 5 is used for connecting the first wiring layer 22 and the ceramic substrate 1, a second build-up layer 3 is connected to the upper surface of the first build-up layer 2, the second build-up layer 3 comprises a second dielectric layer 31 and a second wiring layer 32, a third connecting piece 6 is arranged on the second build-up layer 3, and the third connecting piece 6 is used for connecting the first wiring layer 22 and the second wiring layer 32.
Wherein the thickness of the first dielectric layer 21 is 200 μm to 250 μm, and the thickness of the second dielectric layer 31 is 100 μm to 150 μm.
The specific limitation of the vehicle-gauge PCB provided in this embodiment may refer to the embodiment of the manufacturing method of the vehicle-gauge PCB described above, and will not be described herein.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the system of the present application is divided into different functional units or modules to perform all or part of the above-described functions.
Claims (10)
1. The manufacturing method of the vehicle-gauge PCB is characterized by comprising the following steps:
s1, providing a PTFE (polytetrafluoroethylene) jig, wherein the PTFE jig is provided with a plurality of milling empty slots with the same size;
S2, placing a plurality of ceramic substrates with the surfaces welded with the power modules in a milling empty groove of a PTFE jig;
S3, covering an adhesive sheet and a copper foil on the upper surface of the PTFE jig, and performing lamination treatment to form a first build-up layer on the ceramic substrate;
s4, forming a first connecting piece and a second connecting piece in the first build-up layer through laser drilling, electroplating hole filling and copper paste filling;
s5, performing pattern transfer treatment on the surface of the first build-up layer to form an inner layer circuit diagram;
s6, covering an adhesive sheet and a copper foil on the upper surface of the first build-up layer, and performing lamination treatment to form a second build-up layer;
S7, forming a third connecting piece in the second build-up layer through laser drilling and electroplating hole filling;
s8, performing pattern transfer treatment on the surface of the second build-up layer to form an outer layer circuit diagram;
S9, cutting the PCB in the milling empty groove to finish manufacturing.
2. The method for manufacturing a vehicle-gauge PCB according to claim 1, wherein the relationship between the thickness d 1 of the PTFE jig and the thickness d 2 of the ceramic substrate with the surface-welded power module satisfies:
0μm≤d1-d2≤25μm。
3. the manufacturing method of the vehicle-gauge PCB according to claim 2, wherein the relationship between the size of the milled empty slot and the size of the ceramic substrate of the welded power module satisfies:
4mm≤x1-x2≤6mm,4mm≤y1-y2≤6mm,
Where x 1 denotes the length of the milled open groove, y 1 denotes the width of the milled open groove, x 2 denotes the length of the ceramic substrate of the soldered power module, and y 2 denotes the width of the ceramic substrate of the soldered power module.
4. The manufacturing method of the vehicle-mounted PCB according to claim 3, wherein the distance between two adjacent milling empty grooves is larger than 5mm.
5. The method for manufacturing a vehicle-mounted PCB of claim 1, wherein the ceramic substrate is any one of an alumina substrate, an aluminum nitride substrate, and a silicon nitride substrate.
6. The manufacturing method of the vehicle-mounted PCB according to claim 5, wherein the ceramic substrate is a silicon nitride substrate, and the heat dissipation coefficient of the silicon nitride substrate is 70W/mk-90W/mk.
7. The method for manufacturing the vehicle-mounted PCB according to claim 1, wherein the bonding sheet is a PP bonding sheet or an ABF semi-cured bonding sheet.
8. The method of manufacturing a vehicle-gauge PCB according to claim 1, wherein the copper foil comprises any one of a3 μm copper foil, a 12 μm copper foil, an 18 μm copper foil, or a 35 μm copper foil.
9. The utility model provides a car rule level PCB board, its characterized in that, the PCB board includes:
the power module is fixed on the ceramic substrate;
the upper surfaces of the ceramic substrate and the power module are connected with a first build-up layer, and the first build-up layer comprises a first dielectric layer and a first wiring layer;
The first build-up layer is provided with a first connecting piece and a second connecting piece, the first connecting piece is used for connecting the first wiring layer and the power module, and the second connecting piece is used for connecting the first wiring layer and the ceramic substrate;
The upper surface of the first build-up layer is connected with a second build-up layer, and the second build-up layer comprises a second dielectric layer and a second wiring layer;
And a third connecting piece is arranged on the second build-up layer and is used for connecting the first wiring layer and the second wiring layer.
10. The vehicle-mounted PCB of claim 9, wherein the first dielectric layer has a thickness of 200 μm to 250 μm and the second dielectric layer has a thickness of 100 μm to 150 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411830108.3A CN119676993A (en) | 2024-12-12 | 2024-12-12 | A method for manufacturing a vehicle-grade PCB board and a PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411830108.3A CN119676993A (en) | 2024-12-12 | 2024-12-12 | A method for manufacturing a vehicle-grade PCB board and a PCB board |
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| Publication Number | Publication Date |
|---|---|
| CN119676993A true CN119676993A (en) | 2025-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202411830108.3A Pending CN119676993A (en) | 2024-12-12 | 2024-12-12 | A method for manufacturing a vehicle-grade PCB board and a PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119676993A (en) |
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2024
- 2024-12-12 CN CN202411830108.3A patent/CN119676993A/en active Pending
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