CN119676546A

CN119676546A - A camera module

Info

Publication number: CN119676546A
Application number: CN202311186771.XA
Authority: CN
Inventors: 请求不公布姓名; 长田宽志; 刘佳; 姜瑶清; 黄增云; 周凯伦
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2023-09-14
Filing date: 2023-09-14
Publication date: 2025-03-21
Also published as: CN119629460A; WO2025055928A1

Abstract

The application discloses an image pickup module which is characterized by comprising a first light path changing element, a second light path changing element, a lens focusing group, a lens driving device, a photosensitive assembly and a chip driving device, wherein the first light path changing element is used for changing light rays which are transmitted along a first direction to a second direction, the second light path changing element is used for changing the light rays which are transmitted along the second direction to the first direction, the lens focusing group is arranged between the first light path changing element and the second light path changing element, the lens driving device is used for driving the lens focusing group to move along the second direction, the photosensitive surface of the photosensitive assembly is perpendicular to the first direction, the light rays emitted from the second light path changing element are projected onto the photosensitive surface of the photosensitive assembly, the chip driving device is used for driving the photosensitive assembly to move along a plane perpendicular to the first direction, at least one part of the lens driving device overlaps with at least one part of the chip driving device along the first direction, and the first direction is perpendicular to the second direction.

Description

Camera module

Technical Field

The application relates to the technical field of camera modules, in particular to a long-focus camera module.

Background

The long-focus camera module is a camera module with long focal length, and can clearly acquire a long-distance object. However, because the focal length is relatively long, the telephoto imaging module needs a total length of the long optical lens (TTL), so that the size of the telephoto imaging module is relatively large. Furthermore, the camera modules are often required to perform optical focusing and/or optical anti-shake functions, which makes the size of the tele camera module larger, making it unsuitable for assembly in small mobile devices.

The present application provides a solution to the above-mentioned problems, which miniaturizes the camera module and makes the camera module suitable for being incorporated into a small-sized mobile device.

Disclosure of Invention

An object of the present application is to provide a tele camera module which overcomes the drawbacks of the prior art, miniaturizes the camera module, and adapts the camera module to be incorporated into a small mobile device.

According to an aspect of the present application, there is provided an image pickup module including:

a first optical path changing element for changing a light ray propagating along a first direction to a second direction;

A second optical path changing element for changing the light propagating in the second direction to the first direction;

A lens focusing group disposed between the first light path changing element and the second light path changing element;

A lens driving device configured to drive the lens focusing group to move in a second direction;

The light sensing surface of the light sensing component is perpendicular to the first direction, and the light rays emitted from the second light path changing element are projected to the light sensing surface of the light sensing component;

The device comprises a chip driving device, a lens driving device and a lens driving device, wherein the chip driving device is configured to drive the photosensitive assembly to move along a plane vertical to a first direction, at least one part of the lens driving device is overlapped with at least one part of the chip driving device along the first direction, and the first direction is vertical to a second direction.

In some embodiments, the lens driving device comprises a base, a movable carrier and a guide assembly, wherein the movable carrier moves in a first direction in the base through the guide assembly, the lens focusing group is fixed on the movable carrier, the guide assembly is arranged on the top of the base, and the chip driving device extends into the lens driving device from the bottom of the base.

In some embodiments, the lens driving device further comprises a housing and a base, the housing and the base are mutually buckled to form a first installation space, a light inlet and a light outlet which are mutually connected with the first installation space are formed at two ends of the lens driving device respectively, the chip driving device comprises an upper cover and a lower cover, the upper cover and the lower cover are mutually buckled to form a second installation space, and the first installation space and the second installation space are overlapped.

In some embodiments, the base comprises a top wall, a first supporting part and a mounting part, wherein the first supporting part is formed on the top wall, the first supporting part comprises a first arm and a second arm which are arranged at intervals, the first arm and the second arm are formed on the top wall and are positioned on one side close to the light inlet, the mounting part is formed on the top wall and is positioned on one side close to the light outlet, the mounting part comprises a mounting main body, a first mounting side wall and a second mounting side wall which are connected with the mounting main body, the first mounting side wall and the second mounting side wall form a mounting groove, and the second light path changing element can be arranged in the mounting groove.

In some embodiments, the base further includes a lens barrel fixing portion formed at the top wall and close to the first supporting portion, the lens barrel fixing portion including a first fixing sidewall and a second fixing sidewall forming a mounting cavity, and the camera module further includes a lens barrel fixing group fixed in the mounting cavity.

In some embodiments, the top wall of the base is implemented as a metal piece including a main body portion, a first extension portion bent and extended in a first direction from one end of the main body portion, the first extension portion being embedded in the first and second arms of the first support portion, a second extension portion bent and extended in a first direction from the other end of the main body portion, the second extension portion being embedded in the mounting portion, and a third extension portion bent in a first direction from the main body portion, the third extension portion being embedded in the barrel fixing portion to increase the strength of the first support portion, the mounting portion, and the barrel fixing portion.

In some embodiments, the movable carrier includes a carrier body and first and second carrier sidewalls connected to the carrier body, the first and second carrier sidewalls extending in a second direction, the lens focus group being fixed to the carrier body, the first and second carrier sidewalls being located on left and right sides of the carrier body.

In some embodiments, the first carrier sidewall and the second carrier sidewall extend from the carrier body toward the light entrance, the first carrier sidewall, the second carrier sidewall, and the carrier body forming a U-shaped structure with an opening toward the light entrance, the lens fixation group being received within the opening.

In some embodiments, the first carrier side wall and the second carrier side wall extend from the carrier body towards the light exit opening, the first carrier side wall, the second carrier side wall and the carrier body forming a U-shaped structure with an opening towards the light exit opening, the second light path altering element being accommodated within the opening.

In some embodiments, the lens driving device further includes a focus driving assembly including a first focus driving mechanism and a second focus driving mechanism, which are disposed at left and right sides of the movable carrier, respectively, to provide symmetrical driving force to the movable carrier.

In some embodiments, the first focusing driving mechanism comprises a first focusing magnet and a first focusing coil, the first focusing magnet is arranged on the movable carrier, the first focusing coil is arranged opposite to the first focusing magnet, and a connecting line between the center of the first focusing magnet and the center of the lens focusing group is not perpendicular to the optical axis of the lens focusing group.

In some embodiments, the center of the first focusing magnet is located between the center of the lens focus group and the center of the lens fixation group.

In some embodiments, the photosensitive assembly comprises a photosensitive chip, a chip circuit board and a connecting circuit board, wherein the photosensitive chip is arranged on the front surface of the chip circuit board and is electrically connected with the chip circuit board, the connecting circuit board is arranged on the back surface of the chip circuit board and is electrically connected with the chip circuit board, the lens driving device comprises a circuit assembly, at least one part of the chip circuit board and/or at least one part of the connecting circuit board is/are overlapped with at least one part of the circuit assembly along a first direction, and at least one part of the circuit assembly is positioned above at least one part of the chip circuit board and/or at least one part of the connecting circuit board.

In some embodiments, the connecting circuit board comprises a fixed part, a movable part and a deformable connecting part, wherein the movable part is positioned on the inner side of the fixed part, the deformable connecting part is respectively connected with the movable part and the fixed part, a straight line where one side of the movable part connected with the deformable connecting part is not parallel to a straight line where one side of the fixed part is positioned, the movable part is fixed on the back surface of the chip circuit board, and the fixed part is fixed on the lower cover.

In some embodiments, the chip driving device comprises a frame and an anti-shake driving assembly, the frame is fixed on the upper cover, the anti-shake driving assembly is arranged between the chip circuit board and the frame to drive the chip circuit board to drive the photosensitive chip and the movable part of the connecting circuit board to move along a plane perpendicular to a first direction, the anti-shake driving assembly comprises a first anti-shake driving mechanism, a second anti-shake driving mechanism and a third anti-shake driving mechanism, and the first anti-shake driving mechanism, the second anti-shake driving mechanism and the third anti-shake driving mechanism are respectively arranged on three sides except one side of the chip driving device, which extends into the lens driving device.

In some embodiments, the lens driving device comprises a movable carrier, the lens focusing group is fixed on the movable carrier, the movable carrier is driven to move along a second direction, at least one part of the frame is overlapped with at least one part of the movable carrier along a first direction, and at least one part of the movable carrier is positioned above at least one part of the frame.

In some embodiments, the chip driving device further includes a package body integrally formed at two opposite corners of the chip circuit board and sides opposite to the two opposite corners, a ball groove is formed at a top surface of the package body, and a support assembly disposed in the ball groove to be clamped between the package body and the frame, the support assembly performing three-point support between the frame and the package body.

In some embodiments, the photosensitive assembly comprises a photosensitive chip, a chip circuit board and a connecting circuit board, wherein the photosensitive chip is arranged on the front surface of the chip circuit board and is electrically connected with the chip circuit board, the chip driving device comprises a circuit board type coil and a plurality of anti-shake magnets opposite to the circuit board type coil, the circuit board type coil comprises a substrate and a plurality of anti-shake coils formed on the substrate, the substrate is arranged on the back surface of the chip circuit board and is electrically connected with the chip circuit board, and the connecting circuit board is arranged on the back surface of the substrate and is electrically connected with the substrate.

In some embodiments, the substrate of the circuit board coil comprises a first opening and a second opening, the top surface of the connection circuit board is provided with a PIN foot corresponding to the first opening so as to arrange an electric connection medium in the first opening, the connection circuit board comprises a third opening, the second opening corresponds to the third opening, the bottom surface of the chip circuit board is provided with a chip PIN foot corresponding to the second opening and the third opening, the second opening and the third opening are internally provided with electric connection medium, the electric connection medium penetrates through the second opening, and the height of the electric connection medium in the third opening is more than 50% of the thickness of the connection circuit board.

Additional embodiments and features are set forth in part in the description which follows and in part will become apparent to those skilled in the art upon examination of the specification or may be learned by practice of the disclosed subject matter. A further understanding of the nature and advantages of the present disclosure may be realized by reference to the remaining portions of the specification and the drawings which form a part of this disclosure.

Drawings

FIG. 1 is a schematic diagram of a conventional tele camera module;

Fig. 2A and 2B are schematic views of two structures of an image capturing module according to an embodiment of the present application;

FIG. 3 is a schematic view of another camera module according to an embodiment of the present application;

FIG. 4 is an exploded view of a camera module according to an embodiment of the present application;

FIGS. 5A and 5B are two schematic top cross-sectional views of an imaging module according to an embodiment of the present application;

fig. 6 is an exploded view of a lens module according to an embodiment of the present application;

Fig. 7 is another exploded view of a lens module according to an embodiment of the present application;

FIG. 8 is a schematic structural view of a base according to an embodiment of the present application;

FIG. 9 is a schematic view of the structure of a movable carrier according to an embodiment of the present application;

FIG. 10 is a schematic top-down cross-sectional view of a lens module according to an embodiment of the application;

FIG. 11 is a schematic front cross-sectional view of an imaging module according to an embodiment of the application;

FIG. 12 is an exploded view of a photosensitive module according to an embodiment of the present application;

FIG. 13 is a schematic cross-sectional view of a photosensitive module according to an embodiment of the present application;

FIG. 14 is an exploded view of a photosensitive assembly according to an embodiment of the present application;

fig. 15 is a schematic view of a photosensitive module according to an embodiment of the present application.

Detailed Description

The present application will be further described with reference to the following specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps.

In the description of the present application, it should be noted that, for the azimuth words such as terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present application and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present application that the device or element referred to must have a specific azimuth configuration and operation.

It should be noted that the terms "first," "second," and the like in the description and in the claims are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

The terms "comprises" and "comprising," along with any variations thereof, in the description and claims, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that, as used in the present application, the terms "substantially," "about," and the like are used as terms of approximation of a table, not as terms of degree of the table, and are intended to illustrate inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through intermediaries, or connected in communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Various units, circuits, or other components may be described or described as "configured to" perform a task or tasks. In such contexts, "configured to" implies that the structure (e.g., circuitry) is used by indicating that the unit/circuit/component includes the structure (e.g., circuitry) that performs the task or tasks during operation. Further, "configured to" may include a general-purpose structure (e.g., a general-purpose circuit) that is manipulated by software and/or firmware to operate in a manner that is capable of performing one or more tasks to be solved. "configured to" may also include adjusting a manufacturing process (e.g., a semiconductor fabrication facility) to manufacture a device (e.g., an integrated circuit) suitable for performing or executing one or more tasks.

The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification and the appended claims, the singular forms "a," "an," and "the" are intended to cover the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

As used herein, the term "if" may be interpreted to mean "when..or" at..times "or" in response to a determination "or" in response to detection "depending on the context. Similarly, the phrase "if a condition or event is identified" or "if a condition or event is detected" may be interpreted to mean "upon identification of the condition or event," or "upon detection of the condition or event, depending on the context.

As shown in fig. 1, a conventional tele camera module is provided with a light reflecting element 1, such as a prism or a mirror, on an object side of an optical lens 2 to reflect light from a first direction to a second direction. And, the photosensitive chip 3 is disposed perpendicular to the second direction to receive light from the second direction. Therefore, the long total length (TTL) of the optical lens of the traditional long-focus camera module can be met by folding the optical path, and the height of the long-focus camera module can be reduced. However, since the conventional tele camera module is limited in size in the direction perpendicular to the second direction, the photosensitive surface of the photosensitive chip 3 cannot be set in a large size. However, it can be understood that, as people put more stringent requirements on the imaging quality of the camera module, the size of the photosensitive chip increases.

The present application provides an image capturing module to solve the above-mentioned problems.

Fig. 2A to 14 illustrate an image capturing module 100 according to some embodiments of the present application, the image capturing module 100 including a first light path changing element 11, an optical lens, a second light path changing element 12, and a photosensitive assembly 31 arranged in this order from an object side to an image side, wherein the first light path changing element 11 is configured to change light propagating in a first direction to a second direction, and the second light path changing element 12 is configured to change light propagating in the second direction to the first direction. The first direction is perpendicular to the second direction. The photosensitive surface of the photosensitive element 31 is disposed perpendicular to the first direction to receive the light from the first direction. The first optical path changing element 11 and the second optical path changing element 12 may be implemented as a prism or may be implemented as a mirror, and the first optical path changing element 11 and the second optical path changing element 12 in the present embodiment are described by taking a prism as an example.

It can be appreciated that by providing the first light path changing element 11 and the second light path changing element 12 in the image capturing module 100, light can be reflected multiple times, and by folding the light path, the requirement of a longer total optical lens length (TTL) of the image capturing module 100 can be satisfied. Further, the first light path changing element 11 may reflect light from the first direction to the second direction, and the second light path changing element 12 may reflect light from the second direction to the first direction, so that the light sensing surface of the light sensing element 31 may be disposed in a plane perpendicular to the first direction. Compared with the conventional tele camera module 100, the photosensitive surface of the photosensitive element 31 in the application is not limited by the size limitation of the camera module 100 in the direction perpendicular to the second direction, and the photosensitive surface of the photosensitive element 31 can be designed with a larger size.

In one embodiment of the present application, the first light path changing element 11 includes a first light incident surface 111, a first light emergent surface 112, and a first reflecting surface 113, and the first reflecting surface 113 is connected between the first light incident surface 111 and the first light emergent surface 112. An included angle is formed between the first light incident surface 111 and the first reflecting surface 113, an included angle is formed between the first light emergent surface 112 and the first reflecting surface 113, and a right angle can be formed between the first light incident surface 111 and the first light emergent surface 112. The first light incident surface 111 is an object side surface of the first light path changing element 11, and the first light exit surface 112 is an image side surface of the first light path changing element 11.

Of course, in the present application, the first light incident surface 111 and the first light emergent surface 112 may be planar, or may be spherical, cylindrical or free-form. The first reflecting surface 113 may further be provided with a high reflection film to improve reflection efficiency, so that the light is completely reflected and then enters the subsequent optical element.

In one embodiment of the present application, the angle between the first light incident surface 111 and the first reflecting surface 113 is the same as the angle between the first light emergent surface 112 and the first reflecting surface 113, for example, the angle between the first light incident surface 111 and the first reflecting surface 113 is 45 °, and the angle between the first light emergent surface 112 and the first reflecting surface 113 is 45 °. Of course, in other embodiments of the present application, the angle between the first light incident surface 111 and the first reflecting surface 113 and the angle between the first light emergent surface 112 and the first reflecting surface 113 may be different, for example, the angle between the first light incident surface 111 and the first reflecting surface 113 is 30 °, and the angle between the first light emergent surface 112 and the first reflecting surface 113 is 60 °, which is not limited by the present application.

The second light path changing element 12 includes a second light incident surface 121, a second light emergent surface 122, and a second reflecting surface 123, and the second reflecting surface 123 is connected between the second light incident surface 121 and the second light emergent surface 122. An included angle is formed between the second light incident surface 121 and the second reflecting surface 123, an included angle is formed between the second light emergent surface 122 and the second reflecting surface 123, and a right angle can be formed between the second light incident surface 121 and the second light emergent surface 122. The second light incident surface 121 is an object side surface of the second light path changing element 12, and the second light exit surface 122 is an image side surface of the second light path changing element 12.

Of course, in the present application, the second light incident surface 121 and the second light emergent surface 122 may be plane surfaces, or may be spherical surfaces, cylindrical surfaces, or free curved surfaces. The second reflecting surface 123 may further be provided with a high reflection film to improve reflection efficiency, so that the light is completely reflected and then enters the subsequent optical element.

In one embodiment of the present application, an angle between the second light incident surface 121 and the second reflecting surface 123 is the same as an angle between the second light emergent surface 122 and the second reflecting surface 123, for example, an angle between the second light incident surface 121 and the second reflecting surface 123 is 45 °, and an angle between the second light emergent surface 122 and the second reflecting surface 123 is 45 °. Of course, in other embodiments of the present application, the angle between the second light incident surface 121 and the second reflecting surface 123 and the angle between the second light emergent surface 122 and the second reflecting surface 123 may be different, for example, the angle between the second light incident surface 121 and the second reflecting surface 123 is 30 °, and the angle between the second light emergent surface 122 and the second reflecting surface 123 is 60 °, which is not limited by the present application.

It should be appreciated that although most of the light rays are folded by the first light path changing element 11 and the second light path changing element 12 so as to pass through the optical lens and image on the photosensitive chip 312, some of the light rays (e.g., stray light) need to be prevented from reaching the photosensitive chip 312. Therefore, in one embodiment of the present application, as shown in fig. 3, the size of the second light path changing element 12 is larger than the size of the first light path changing element 11 to provide the light blocking element 13 on the edge of the second light incident surface 121 of the second light path changing element 12.

The light blocking element 13 may be covered with an opaque material to block stray light. If more than 90% of the stray light will not reach the light-sensing chip 312 due to passing through the light-blocking element 13, it is indicated that the light-blocking element 13 has a width sufficient to prevent the stray light from reaching the light-sensing chip 312. For example, the light blocking element 13 may have a width of 5% -10% of the second light incident surface 121 of the second light path changing element 12 in the first direction, so that the light blocking element 13 may block most of the stray light.

Further, the height of the tele camera module 100 is affected by the size of the first light path changing element 11 and the second light path changing element 12. In order to avoid the increase in the height of the telephoto imaging module 100 caused by the increase in the size of the second light path changing element 12, in the present application, the angle between the second light incident surface 121 and the second reflective surface 123 is greater than the angle between the second light emitting surface 122 and the second reflective surface 123, so as to reduce the height of the second light path changing element 12.

In other embodiments of the present application, the size of the first light path changing element 11 may be larger than the size of the second light path changing element 12, so that the light blocking element 13 is disposed at the edge of the first light incident surface 111 of the first light path changing element 11. Of course, the light blocking element 13 may also be disposed on the first light emitting surface 112 of the first light path changing element 11, which is not limited in the present application.

With continued reference to fig. 2A to fig. 3, the image capturing module 100 further includes at least one compensation lens 14, wherein the at least one compensation lens 14 is disposed on the first light incident surface 111 of the first light path changing element 11, and the at least one compensation lens 14 can further modulate the incident light. For example, the light can be further converged by the at least one compensation lens 14 to reduce the back focus, so as to achieve the purpose of downsizing the camera module 100. In one embodiment of the present application, the compensation lens 14 may be a lens having one surface that is planar and the other surface that is convex.

In the present application, the at least one compensation lens 14 and the first light path changing element 11 may be integrally formed or may be separately formed. For example, the at least one compensation lens 14 and the first light path changing element 11 may be formed into an integrally molded structure by a process such as compression molding or grinding molding. Or at least one compensation lens 14 is fixed to the first light incident surface 111 of the first light path changing element 11 by means of glue bonding.

As shown in fig. 4 to 14, in one embodiment of the present application, the image capturing module 100 includes a reflection module 10, a lens module 20, and a photosensitive module 30, and the reflection module 10, the lens module 20, and the photosensitive module 30 are sequentially arranged from an object side to an image side.

Wherein the reflection module 10 includes an optical path changing element holder 15, a first optical path changing element 11, and a compensation lens 14. The first light path changing element 11 is fixedly connected to the light path changing element holder 15. When light from the outside enters the inside of the image capturing module 100, the light enters the compensation lens 14 from the first direction, and is contracted in the compensation lens 14. Then, the light beam enters the first light path changing element 11 through the first light incident surface 111 of the first light path changing element 11 after being emitted by the compensating lens 14, and is changed from the first direction to the second direction through the first reflecting surface 113 of the first light path changing element 11, and then is emitted through the first light emitting surface 112 of the first light path changing element 11. The first direction and the second direction intersect, in the application, the first direction is a Z-axis direction, the second direction is a Y-axis direction, the first direction and the second direction are mutually perpendicular, and the Y-axis direction is also the optical axis direction of the optical lens. In other embodiments of the present application, the specific orientations of the first direction and the second direction are not strictly limited. In the present application, the X-axis direction, which may also be referred to as a third direction, is also included, and is perpendicular to the Y-axis direction and the Z-axis direction, respectively. Of course, for ease of understanding, the X-axis direction may also be referred to as the width direction of the camera module 100, the Y-axis direction may also be referred to as the length direction of the camera module 100, and the Z-axis direction may also be referred to as the height direction of the camera module 100.

Further, the light path changing element holder 15 includes a protection member 151, and the protection member 151 extends from the bottom of the light path changing element holder 15 in the first direction, so that the protection member 151 may be located at the bottom end of the first light exit surface 112 of the first light path changing element 11, and may protect the first light path changing element 11 without affecting the propagation of light. When the camera module 100 is impacted or is swayed, the first light path changing element 11 does not fall off.

Of course, in other embodiments of the present application, a driving motor (not shown) may be provided on the optical path changing member support 15 to drive the first optical path changing member 11 to move so as to implement an optical anti-shake function. The driving motor may be a voice coil motor, a shape memory alloy (shape memory alloys, SMA) motor, or a piezoelectric motor. The driving motor drives the first light path changing element 11 to selectively move about the X-axis direction and/or the Z-axis direction to realize the optical anti-shake function in both directions.

As shown in fig. 5A to 10, in one embodiment of the present application, the lens module 20 includes a lens driving device 24, a lens fixing group 22, a lens focusing group 21, and a second optical path changing element 12. In a specific example of the present application, the first light path changing element 11, the lens fixing group 22, the lens focusing group 21, the second light path changing element 12, and the light sensing chip 312 are arranged in order from the object side to the image side.

The lens focusing group 21 includes a first lens barrel 211 and at least one lens, wherein the at least one lens is disposed in the first lens barrel 211, and the number of the at least one lens may be one or more. The lens focusing group 21 may be driven to move in a second direction (which may also be referred to as an optical axis direction or a length direction) by the lens driving device 24 to achieve an optical focusing function. The lens fixing group 22 includes a second lens barrel 221 and at least one lens, and the at least one lens may be disposed in the second lens barrel 221. The lens fixing group 22 can be used for compensating the image quality so as to improve the imaging quality of the camera module 100.

In one embodiment of the present application, the lens fixing group 22 may be disposed on the light incident side of the lens focusing group 21, and the second light path changing element 12 is disposed on the light emitting side of the lens focusing group 21, that is, the light reflected by the first light path changing element 11 sequentially passes through the lens fixing group 22, the lens focusing group 21 and the second light path changing element 12 during the process of propagating along the second direction, and the light is changed from the second direction to the first direction by the second light path changing element 12, so that the light reaches the light sensing chip 312.

Of course, in another embodiment of the present application, the lens focusing group 21 may be disposed on the light incident side of the lens fixing group 22, and the second light path changing element 12 is disposed on the light emitting side of the lens fixing group 22, that is, the light reflected by the first light path changing element 11 sequentially passes through the lens focusing group 21, the lens fixing group 22 and the second light path changing element 12 during the process of propagating along the second direction, and the light is changed from the second direction to the first direction by the second light path changing element 12, so that the light reaches the light sensing chip 312.

When shooting, the lens focusing group 21 and the lens fixing group 22 are matched with each other, and when the lens focusing group 21 needs to move a long distance, the lens fixing group 22 can compensate the optical system, so that the camera module 100 has a strong focusing capability, and the imaging quality is improved.

Further, in an embodiment of the present application, as shown in fig. 2B, the lens module 20 may further include a lens zoom group 23, where the lens zoom group 23 includes a third lens barrel and at least one lens, and the at least one lens is disposed in the third lens barrel, and the number of the at least one lens may be one or more. The lens zoom group 23 and the lens focusing group 21 can be respectively driven by the lens driving device 24 to move along a second direction (also referred to as an optical axis direction or a length direction) so as to realize optical zooming and optical focusing functions, and can realize shooting requirements of a plurality of focal segments and a plurality of different scenes.

With continued reference to fig. 6-10, the lens driving apparatus 24 includes a housing 241, a base 242, a movable carrier 243, a guide assembly 245, and a focus driving assembly 244. Wherein, the housing 241 and the base 242 are fastened to each other to form a first installation space 200, and the guide assembly 245, the focus driving assembly 244, the lens fixing group 22, the lens focusing group 21, the second light path changing element 12, and the like are accommodated in the first installation space 200.

The lens driving device 24 is also formed at both ends thereof with a light inlet and a light outlet, respectively, which are connected to the first installation space 200. An optical path is formed between the light inlet, the light outlet, and the first installation space 200, and in the first installation space 200, the lens fixing group 22, the lens focusing group 21, and the second optical path changing element 12 are disposed on the optical path. After entering from the light inlet, the light passes through the first installation space 200, is processed by the lens fixing group 22, the lens focusing group 21 and the second light path changing element 12, and is emitted from the light outlet.

As shown in fig. 6 and 7, in one embodiment of the present application, the base 242 is disposed above the housing 241 in the Z-axis direction, i.e., the base 242 is disposed at the top and the housing 241 is disposed at the bottom. During assembly, the movable carrier 243, the guide assembly 245, the focus driving assembly 244, the lens fixing group 22, the lens focusing group 21, the second light path changing element 12 and other components may be installed in the base 242 in a bottom-up manner, and finally the housing 241 is fixed to the base 242 from bottom to top. The fixing manner of the base 242 and the case 241 includes, but is not limited to, a connection manner by screws, snaps, glue, etc.

Further, in order to reduce the number of components of the image capturing module 100 and improve the integration of the image capturing module 100, in one embodiment of the present application, the optical path changing element support 15 of the reflection module 10 is integrated with the housing 241 of the lens module 20, that is, the optical path changing element support 15 and the housing 241 are integrated into a single structure, so as to improve the integration of the image capturing module 100 and also improve the consistency of the image capturing module 100.

As shown in fig. 6, the case 241 includes a bottom plate 2411 and two side plates 2412 formed at opposite sides of the bottom plate 2411, wherein the bottom plate 2411 covers the bottom of the base 242, the two side plates 2412 cover the left and right sides of the base 242, and the light inlet and the light outlet are formed at the front and rear sides of the lens driving device 24.

Further, as shown in fig. 6 and 8, the base 242 includes a top wall 2421, and a first supporting portion 2422, a barrel fixing portion 31622423 and a mounting portion 2424 formed on the top wall 2421, wherein the first supporting portion 2422, the barrel fixing portion 31622423 and the mounting portion 2424 may be integrally formed with the top wall 2421, i.e. the first supporting portion 2422, the barrel fixing portion 31622423 and the mounting portion 2424 may be integrally formed with the top wall 2421, so as to improve the strength and consistency of the base 242. Of course, the first supporting portion 2422, the lens barrel fixing portion 31622423 and the mounting portion 2424 may be in a split structure with the top wall 2421, that is, the first supporting portion 2422, the lens barrel fixing portion 31622423 and the mounting portion 2424 may be assembled with the top wall 2421 through glue, clamping and other manners after being formed separately, which is not limited in the present application.

The first support part 2422 includes a first arm 24221 and a second arm 24222 disposed at intervals, wherein the first arm 24221 and the second arm 24222 are formed on the top wall 2421 and located at a side close to the light inlet, the first arm 24221 and the second arm 24222 extend from the top wall 2421 along the first direction, and the first arm 24221 and the second arm 24222 are disposed symmetrically with respect to the optical axis.

The lens barrel fixing portion 31622423 is formed on the top wall 2421 and is close to the first arm 24221 and the second arm 24222, the lens barrel fixing portion 31622423 includes a first fixing side wall 24231 and a second fixing side wall 24232, the first fixing side wall 24231 and the second fixing side wall 24232 form a mounting cavity, and the second lens barrel 221 of the lens fixing group 22 can be fixed in the mounting cavity by bonding, clamping or screwing. Further, the first arm 24221 may be connected to the first fixed side wall 24231, and the second arm 24222 may be connected to the second fixed side wall 24232, so that on one hand, molding may be facilitated, and on the other hand, strength and consistency of the camera module 100 may be improved.

The mounting portion 2424 is formed on the top wall 2421 and located at a side close to the light exit. The mounting part 2424 includes a mounting body 24241 and first and second mounting sidewalls 24242 and 24243 connected to the mounting body 24241, wherein the mounting body 24241 and the first and second mounting sidewalls 24242 and 24243 form a mounting groove 24244, and the second light path changing element 12 may be disposed in the mounting groove 24244. Further, the mounting body 24241 has an inclined surface on which the second reflection surface 123 of the second light path changing element 12 is disposed such that the second light incident surface 121 of the second light path changing element 12 faces the light incident port and the second light emitting surface 122 of the second light path changing element 12 faces the light emitting port.

Further, the first arm 24221 is disposed at an interval in the optical axis direction from the first mounting side wall 24242, and the second arm 24222 is disposed at an interval in the optical axis direction from the second mounting side wall 24243. In other words, the left and right sides and bottom of the base 242 have openings to facilitate assembly of other components. The first arm 24221, the second arm 24222, and the top wall 2421 of the base 242 may be fixedly connected with the two side plates 2412 of the housing 241 such that the bottom plate 2411 and the two side plates 2412 of the housing 241 cover the left and right side portions and the bottom of the base 242.

In one embodiment of the present application, as shown in fig. 8, the top wall 2421 of the base 242 is implemented as a metal piece, which includes a main body portion 24211, a first extension portion 24212, a second extension portion 24213, and a third extension portion 24214, the first extension portion 24212 is bent and extended from one end of the main body portion 24211 along a first direction, and the first extension portion 24212 is embedded in the first arm 24221 and the second arm 24222 of the first support portion 2422 to increase the strength of the first arm 24221 and the second arm 24222. Further, the second extension part 24213 is bent and extended in the first direction from the other end of the main body part 24211, and the second extension part 24213 is embedded in the installation part 2424 to increase the strength of the installation part 2424. In a specific example of the present application, the second extension portion 24213 may first extend from the main body portion 24211 in a bending manner along the first direction, then extend along the Y-axis direction, and then extend in a bending manner along the X-axis direction, so as to increase the strength of the second extension portion 24213, and further enable the second extension portion 24213 to be embedded into the mounting portion 2424 as much as possible. The third extension part 24214 is bent from the main body part 24211 in the first direction, the third extension part 24214 is located at a side close to the first extension part 24212, and the third extension part 24214 is embedded in the first and second fixing sidewalls 24231 and 24232 of the lens barrel fixing part 31622423 to increase the strength of the first and second fixing sidewalls 24231 and 24232.

Further, the first extension 24212 includes two portions symmetrically disposed with respect to the optical axis, the second extension 24213 includes two portions symmetrically disposed with respect to the optical axis, and the third extension 24214 includes two portions symmetrically disposed with respect to the optical axis.

It should be appreciated that the top wall 2421 of the metal material may have a smaller thickness, so that the height space utilization of the lens module 20 is higher. Further, the base 242 may further include a light shielding sheet disposed on the top wall 2421 to prevent the top wall 2421 from reflecting light, so as to avoid the influence of stray light on the imaging effect.

As shown in fig. 5A to 7 and 9, the movable carrier 243 is used for carrying the lens focusing group 21 and is driven to drive the lens focusing group 21 to move along the optical axis direction so as to realize an optical focusing function. Wherein the movable carrier 243 includes a carrier body 2431 and first and second carrier sidewalls 2432 and 2433 coupled to the carrier body 2431, the first and second carrier sidewalls 2432 and 2433 extending in the second direction. The first lens barrel 211 of the lens focusing group 21 is fixed to the carrier body 2431 of the movable carrier 243, and the first carrier side wall 2432 and the second carrier side wall 2433 are located on the left and right sides of the lens focusing group 21 and the carrier body 2431.

Further, the first carrier side wall 2432 and the second carrier side wall 2433 extend toward one side of the light entrance, as viewed in the first direction, and the first carrier side wall 2432 and the second carrier side wall 2433 are closer to the light entrance than the carrier body 2431. In one specific example of the present application, the first carrier sidewall 2432, the second carrier sidewall 2433, and the carrier body 2431 form a U-shaped opening structure, the opening facing the light entrance, in which the lens-fixing group 22 can be accommodated. The arrangement not only can make the structure of the lens module 20 of the camera module 100 more compact, but also reduces the size of the lens module 20 along the second direction, which is beneficial to reducing the size of the camera module 100.

In other words, in one embodiment of the present application, the lens fixing group 22 is located at the front side of the lens focusing group 21, the carrier bodies 2431 of the lens focusing group 21 and the movable carrier 243 are located at the rear side of the lens fixing group 22, the first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 extend along the optical axis direction, at least a portion of the first carrier side wall 2432 overlaps at least a portion of the lens fixing component in the X-axis direction perpendicular to the optical axis direction, and at least a portion of the second carrier side wall 2433 overlaps at least a portion of the lens fixing group 22.

In one embodiment of the present application, the movable carrier 243 is moved in the optical axis direction within the first installation space 200 by the guide assembly 245. With continued reference to fig. 9 and 10, the guide assembly 245 is disposed in the first installation space 200 to guide the moving direction of the movable carrier 243. The guide assembly 245 is disposed along the optical axis, and the guide assembly 245 may be a slider, a ball, a guide rod, or the like type of guide assembly 245.

In one embodiment of the present application, the guide assembly 245 is implemented as a guide rod. The length direction of the guide member 245 is along the optical axis direction, one end of the guide member 245 is fixed to the first supporting portion 2422 of the base 242, and the other end of the guide member 245 is fixed to the mounting portion 2424 of the base 242. Specifically, the first supporting portion 2422 has a slot such that one end of the guiding component 245 extends into the slot and is fixedly connected with the first extending portion 24212 embedded in the first supporting portion 2422, and the corresponding mounting portion 2424 has a slot such that the other end of the guiding component 245 extends into the slot and is fixedly connected with the mounting portion 2424.

In one embodiment of the present application, the guide assembly 245 includes a first guide bar 2451 and a second guide bar 2452, the first guide bar 2451 and the second guide bar 2452 being disposed parallel to each other. The first guide 2451 is disposed between the first arm 24221 and the first mounting side wall 24242 and the second guide 2452 is disposed between the second arm 24222 and the second mounting side wall 24243.

Further, the top surfaces of the first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 are respectively provided with a guide groove 2434, and correspondingly, the bottom surface of the top wall 2421 of the base 242 is provided with a slideway 24215, and the guide component 245 is clamped between the guide groove 2434 and the slideway 24215. Specifically, the guide groove 2434 includes a first guide groove 2434a and a second guide groove 2434b that are parallel to each other and spaced apart, and the slide 24215 includes a first slide 24215a and a second slide 24215b that are parallel to each other and spaced apart. The first guide groove 2434a and the first slideway 24215a are oppositely arranged along the first direction, and the first guide bar 2451 is clamped between the first guide groove 2434a and the first slideway 24215 a. The second guide groove 2434b and the second slideway 24215b are oppositely arranged along the first direction, and the second guide bar 2452 is clamped between the second guide groove 2434b and the second slideway 24215b.

In one embodiment of the present application, the guide slot 2434 is in a V-shaped configuration and the slideway 24215 is in an L-shaped configuration, it should be appreciated that the guide slot 2434 of the V-shaped configuration may be better slidably guided, while the slideway 24215 of the L-shaped configuration may be used for tolerance to allow for some error in the movable carrier 243, ensuring that the movable carrier 243 can also be mounted on the guide assembly 245 in the presence of the error.

Of course, in other embodiments of the present application, the positions of the guide groove 2434 and the slideway 24215 may be reversed, for example, the top surfaces of the first carrier side wall 2432 and the second carrier side wall 2433 are respectively provided with the slideway 24215, and the bottom surface of the top wall 2421 of the base 242 is provided with the guide groove 2434, which is not limited in the present application.

Further, in an embodiment of the present application, the slideway 24215 may be implemented as a separate structure formed on the top wall 2421 of the base 242, as shown in fig. 6 to 7, and the slideway 24215 may be made of the same material as the top wall 2421 or of a different material from the top wall 2421. For example, the slideway 24215 is a cuboid structure, the slideway 24215 is formed on the bottom surface of the top wall 2421, and the length direction of the slideway 24215 is the same as the length direction of the guide component 245. The side of the slideway 24215 facing the guide assembly 245 is an L-shaped or planar structure so that the guide assembly 245 can be disposed on the slideway 24215. By such a construction, not only is the molding of the slideway 24215 facilitated, but also a smoother support for the guide assembly 245 can be provided.

The movable carrier 243 is movable in the optical axis direction along the first guide bar 2451 and the second guide bar 2452 with respect to the base 242 by the driving of the focus driving assembly 244. As shown in fig. 5A and 6, the focus driving assembly 244 includes a first focus driving mechanism 2441 and a second focus driving mechanism 2442, and the first focus driving mechanism 2441 and the second focus driving mechanism 2442 are disposed at both left and right sides of the lens barrel movable carrier 243, respectively, to simultaneously provide symmetrical driving forces to the movable carrier 243. The movable carrier 243 is prevented from tilting during movement with respect to the one-sided supply of the driving force, thereby ensuring that the movable carrier 243 moves more smoothly. In addition, the position information of the movable carrier 243 collected by the focus position sensing element 248 is more accurate, so that the accuracy of the control of the first focus driving mechanism 2441 and the second focus driving mechanism 2442 is improved, and further the shooting effect of the camera module 100 can be improved.

In one embodiment of the present application, the first focus drive mechanism 2441 includes a first focus magnet 24411 and a first focus coil 24412, the second focus drive mechanism 2442 includes a second focus magnet 24421 and a second focus coil 24422, wherein the first focus magnet 24411 is disposed on one of the movable carrier 243 and the housing 241, the first focus coil 24412 is disposed on the other of the movable carrier 243 and the housing 241, the second focus magnet 24421 is disposed on one of the movable carrier 243 and the housing 241, and the second focus coil 24422 is disposed on the other of the movable carrier 243 and the housing 241.

In one embodiment of the present application, the first focus drive mechanism 2441 and the second focus drive mechanism 2442 are symmetrically disposed on opposite sides of the movable carrier 243. The first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 have magnet mounting grooves 24244, respectively, and the first focusing magnet 24411 and the second focusing magnet 24421 are fixedly mounted in the magnet mounting grooves 24244. The first focusing coil 24412 and the second focusing coil 24422 are fixed to the housing 241, that is, in one embodiment of the application, the first focusing magnet 24411 and the second focusing magnet 24421 are movers, and the first focusing coil 24412 and the second focusing coil 24422 are stators.

The first focusing magnet 24411 and the first focusing coil 24412 are oppositely arranged along the X-axis direction, the second focusing magnet 24421 and the second focusing coil 24422 are oppositely arranged along the X-axis direction, and the planes of the first focusing coil 24412 and the second focusing coil 24422 are parallel to the optical axis direction so as to reduce the width of the camera module 100. Further, since the left and right side portions of the base 242 have openings, the first focusing magnet 24411 and the first focusing coil 24412 are disposed opposite to each other through the openings, and the second focusing magnet 24421 and the second focusing coil 24422 are disposed opposite to each other through the openings.

It should be appreciated that the first focusing magnet 24411 and the second focusing magnet 24421 have a length, and that the length direction of the first focusing magnet 24411 and the second focusing magnet 24421 is the same as the length direction of the first carrier side wall 2432 and the second carrier side wall 2433. The lens focusing group 21 can move along the optical axis direction relative to the lens fixing group 22 and the second optical path changing element 12 under the driving of the movable carrier 243, and a certain movement distance needs to be reserved between the lens focusing group 21 and the lens fixing group 22 and the second optical path changing element 12. If the center of the lens focusing group 21 is aligned with the center of the first focusing magnet 24411 (or the second focusing magnet 24421), the distance between the lens focusing group 21 and the second optical path changing element 12 increases due to the lengths of the first focusing magnet 24411, the second focusing magnet 24421, the first carrier side wall 2432 and the second carrier side wall 2433, thereby increasing the length of the image capturing module 100.

As shown in fig. 5A, in one embodiment of the present application, the center of the lens focusing group 21 is offset from the center of the first focusing magnet 24411 (or the second focusing magnet 24421), i.e., the direction of the line connecting the center of the lens focusing group 21 and the center of the first focusing magnet 24411 (or the second focusing magnet 24421) is not perpendicular to the optical axis direction. For example, the center of the first focusing magnet 24411 (or the second focusing magnet 24421) is closer to the light entrance than the center of the lens focusing group 21, and in this arrangement, the distance between the lens focusing group 21 and the second optical path changing element 12 is reduced, avoiding an increase in the length dimension of the image capturing module 100.

Further, the center of the first focusing magnet 24411 (or the second focusing magnet 24421) is located between the center of the lens focusing group 21 and the center of the lens fixing group 22. Not only can the movement stroke of the lens focusing group 21 be ensured, but also the distance from the side wall of the first movable carrier 243 to the first arm 24221 and the distance from the side wall of the second movable carrier 243 to the second arm 24222 can be shortened, so that the purpose of reducing the length of the camera module 100 is achieved.

In another embodiment of the present application, as shown in fig. 5B, the U-shaped opening of the movable carrier 243 is directed toward the second light path changing member 12, and the second light path changing member 12 is placed in the opening. In this embodiment, the center of the lens focusing group 21 is closer to the light entrance than the center of the first focusing magnet 24411 (or the second focusing magnet 24421). By the arrangement mode, not only can the moving stroke of the lens focusing group 21 be ensured, but also the integration level of the camera module 100 can be higher, and the length dimension of the camera module 100 can be reduced.

In one embodiment of the present application, the lens driving apparatus 24 further includes a circuit assembly 246, wherein the circuit assembly 246 includes a first circuit board 2461 and a second circuit board 2462, and the first circuit board 2461 and the second circuit board 2462 are disposed on the left and right sides of the movable carrier 243. The first circuit board 2461 and the second circuit board 2462 are fixed to two side plates 2412 of the housing 241, the first focusing coil 24412 is indirectly fixed to the housing 241 through the first circuit board 2461, and the second focusing coil 24422 is indirectly fixed to the housing 241 through the second circuit board 2462, wherein a plane of the first focusing coil 24412 is parallel to a plane of the first circuit board 2461, and a plane of the second focusing coil 24422 is parallel to a plane of the second circuit board 2462.

The first focusing coil 24412 is electrically connected to the first circuit board 2461, the second focusing coil 24422 is electrically connected to the second circuit board 2462, and the first circuit board 2461 and the second circuit board 2462 are electrically connected through a connection circuit 2463 and are electrically connected to external electronic devices through one of the first circuit board 2461 and the second circuit board 2462. In a specific example of the present application, the first circuit board 2461 extends a conductive pin, the second circuit board 2462 extends a conductive pin, and two ends of the connection circuit 2463 are respectively connected to the conductive pin of the first circuit board 2461 and the conductive pin of the second circuit board 2462 to realize line conduction.

In one embodiment of the application, the first and second circuit boards 2461 and 2462 may be printed circuit boards (printed circuit board, PCBs), or the first and second circuit boards 2461 and 2462 may be flexible circuit boards (flexibleprinted circuit, FPCs), rigid boards, or rigid-flex boards.

With continued reference to fig. 5 to 6, in one embodiment of the present application, the lens driving device 24 further includes two reinforcing plates 247, and the two reinforcing plates 247 are disposed between the first circuit board 2461 and the housing 241 and between the second circuit board 2462 and the housing 241, respectively. The reinforcement plate 247 may improve the strength of the first and second circuit boards.

In one embodiment of the present application, a plurality of positioning protrusions 2471 are disposed on the reinforcing plate 247, the plurality of positioning protrusions 2471 are located around and inside the first focusing coil 24412 and the second focusing coil 24422, and the first circuit board 2461 and the second circuit board 2462 are provided with openings at positions corresponding to the plurality of positioning protrusions 2471, so that the plurality of positioning protrusions 2471 can play a role in positioning and supporting protection for the first focusing coil 24412 and the second focusing coil 24422 after the first circuit board 2461 and the second circuit board 2462 are indirectly fixed to the housing 241 through the reinforcing plate 247.

As shown in fig. 5 and 6, in one embodiment of the present application, the base 242 further includes a buffering member 2425, and the buffering member 2425 can perform buffering and damping functions on the impact of the movable carrier 243. The cushioning member 2425 may be made of an elastic material, for example, an elastic soft rubber or the like.

Specifically, the bumper 2425 can be disposed within the first arm 24221 and the second arm 24222 of the base 242, wherein the first arm 24221 and the second arm 24222 are hollow structures therein, and at least a portion of the bumper 2425 can be exposed to air such that the movable carrier 243 can be in contact with the bumper 2425. Further, the buffer member 2425 may also be provided at the first and second mounting sidewalls 24242 and 24243 of the mounting part 2424, wherein the first and second mounting sidewalls 24242 and 24243 have grooves to seat the buffer member 2425, at least a portion of the buffer member 2425 is exposed to the air so that the movable carrier 243 may be in contact with the buffer member 2425.

It should be appreciated that at least a portion of the bumper 2425 overlaps at least a portion of the first carrier sidewall 2432 of the movable carrier 243 in the optical axis direction, and at least a portion of the bumper 2425 overlaps at least a portion of the second carrier sidewall 2433 of the movable carrier 243. So that the movable carrier 243 can contact with the buffer member 2425 during moving along the optical axis direction, so as to buffer the impact of the movable carrier 243, thereby avoiding abnormal sound caused by long-stroke impact, and reducing the problem of dust generation after impact, and further improving the usability of the camera module 100.

In a specific example of the present application, with continued reference to fig. 5, only a part of the front end and the rear end of the first carrier sidewall 2432 of the movable carrier 243 overlap with the buffer 2425 in the optical axis direction, i.e., a part of the front end surface and a part of the rear end surface of the first carrier sidewall 2432 respectively collide with the buffer 2425, so that the area where the movable carrier 243 collides can be reduced, and the lens focus group 21 in the movable carrier 243 can be protected. Similarly, only a part of the front end and the rear end of the second carrier side wall 2433 of the movable carrier 243 overlap the buffer 2425 along the optical axis direction, i.e. a part of the front end surface and a part of the rear end surface of the second carrier side wall 2433 respectively collide with the buffer 2425, so that the area of the movable carrier 243 impacted can be reduced, and the lens in the movable carrier 243 is protected from the focusing group 21.

In one embodiment of the present application, the lens driving device 24 further includes a focusing position sensing element 248, wherein the focusing position sensing element 248 is disposed in the first focusing coil 24412 or the second focusing coil 24422, such that the focusing position sensing element 248 can be disposed opposite to the first focusing magnet 24411 or the second focusing magnet 24421. When the position of the movable carrier 243 is changed, the relative positions of the focus position sensing element 248 and the first focusing magnet 24411 or the second focusing magnet 24421 are changed, so as to determine the position of the movable carrier 243 according to the sensed magnetic field strength, and then the current of the first focusing coil 24412 or the second focusing coil 24422 is adjusted to enable the movable carrier 243 to move to a required position. It should be understood that the focus position sensing element 248 may be a hall sensor, a driving IC, a TMR, or the like, which is not limited in the present application.

As shown in fig. 11 to 14, in one embodiment of the present application, the photosensitive module 30 includes a photosensitive assembly 31 and a chip driving device 32, and the chip driving device 32 can drive the photosensitive assembly 31 to move along a plane perpendicular to the first direction to implement an optical anti-shake function. Of course, in the present application, the photosensitive assembly 31 may also be part of the chip driving apparatus 32, that is, the chip driving apparatus 32 includes the components in the photosensitive assembly 31.

The photosensitive assembly 31 includes a photosensitive chip 312, a chip circuit board 311, a filter element 314 bracket 313, a filter element 314, and at least one electronic element 315, where a photosensitive surface of the photosensitive chip 312 can be used for collecting light and converting optical image information carried by the light into an electrical signal, and the photosensitive chip 312 is electrically connected to the chip circuit board 311. The photo chip 312 is directly or indirectly fixed to the front surface of the chip circuit board 311, the photo chip 312 includes a photo area and a non-photo area surrounding the photo area, the photo chip 312 is electrically connected to the chip circuit board 311 through a chip pad located in the non-photo area, for example, the photo chip 312 may be electrically connected to the chip circuit board 311 by wire bonding (wire bonding), soldering, FC process (flip chip), RDL (re-wiring layer technology), or the like.

The at least one electronic component 315 may be implemented as a passive electronic device such as a capacitor or a resistor, or an active electronic device such as a diode or a memory chip, where the at least one electronic component 315 is electrically connected to the chip circuit board 311, and the at least one electronic component 315 may be disposed on the front surface of the chip circuit board 311 or on the back surface of the chip circuit board 311. When the at least one electronic component 315 is disposed on the same side as the photosensitive chip 312, the at least one electronic component 315 may be disposed on the periphery of the photosensitive chip 312, and the at least one electronic component 315 may be disposed on one side, two sides, three sides and/or four sides of the photosensitive chip 312.

The filter 314 is disposed on the photosensitive path of the photosensitive chip 312 to filter out unnecessary stray light, such as infrared light. The filter element 314 is supported on the filter element support 313 by, for example, glue bonding, and the filter element support 313 is fixed to the chip circuit board 311 and surrounds the peripheral side of the photosensitive chip 312, and in the Z-axis direction, the projection of the filter element 314 overlaps with the projection of the photosensitive chip 312.

Further, in one embodiment of the present application, the photosensitive assembly 31 further includes a connection circuit board 316, and the connection circuit board 316 is disposed on the back surface of the chip circuit board 311, i.e. the side far from the photosensitive chip 312. The connection wiring board 316 includes a connection belt 3164 and a connector 3165, the connection belt 3164 extending in a direction away from the camera module 100, the connector 3165 being provided at one end of the connection belt 3164 and electrically connected to an external electronic device through the connector 3165, so that imaging information acquired by the photosensitive chip 312 is transmitted to the external electronic device.

The connecting circuit board 316 includes a fixed portion 3162, a movable portion 3161, and a deformable connecting portion 3163, wherein the movable portion 3161 is located inside the fixed portion 3162, and the deformable connecting portion 3163 connects the movable portion 3161 and the fixed portion 3162, respectively, so as to allow the deformable connecting portion 3163 to suspend the movable portion 3161 in the fixed portion 3162. In one embodiment of the present application, the number of the deformable coupling portions 3163 is four, wherein one end of each deformable coupling portion 3163 is fixedly coupled to one side of the movable portion 3161 and then is bent and extended along the side of the movable portion 3161 and the adjacent side such that the other end of each deformable coupling portion 3163 is fixedly coupled to one side of the fixed portion 3162, and a straight line where one side of the movable portion 3161 is coupled to each deformable coupling portion is not parallel to a straight line where one side of the fixed portion 3162 is.

In other words, each of the deformable coupling portions 3163 is coupled to one side of the movable portion 3161 and one side of the fixed portion 3162 adjacent to the one side of the movable portion 3161, respectively.

In the present application, in the photosensitive assembly 31, the chip circuit board 311 is a reference surface, and the photosensitive chip 312, at least one electronic component 315, the filter element 314 support 313 and the connection circuit board 316 are all disposed on the chip circuit board 311, so that the integration level of the photosensitive assembly 31 is improved, and the flatness is higher. Further, the driving chip circuit board 311 can drive the photosensitive chip 312 and other elements on the chip circuit board 311 to move together, so that the driving efficiency is higher.

With continued reference to fig. 12 and 13, in one embodiment of the present application, the chip driving device 32 includes a cover 321, a frame 322, a package 323, a supporting component 324 and an anti-shake driving component 325, where the cover 321 includes an upper cover 3211 and a lower cover 3212, and the upper cover 3211 is located above the lower cover 3212 along a first direction, and the upper cover 3211 and the lower cover 3212 are buckled with each other to form a second installation space 300, so as to accommodate the frame 322, the package 323, the supporting component 324, the anti-shake driving component 325 and the photosensitive component 31 therein.

The upper cover 3211 includes a top cover 3211a having an opening and a side cover 3211b connected to the top cover 3211a, wherein a plane of the top cover 3211a is perpendicular to a plane of the side cover 3211 b. Further, the top cover 3211a has a stepped structure, that is, a portion of the top cover 3211a is higher than another portion of the top cover 3211 a.

In one embodiment of the present application, the movable portion 3161 is provided on the back surface of the chip wiring board 311, and the fixed portion 3162 is provided on the lower cover 3212 of the cover 321. When the chip wiring board 311 is driven to move along the plane perpendicular to the first plane, the deformable connection section 3163 deforms to allow the chip wiring board 311 to drive the movable section 3161 to translate, and in this process, the deformable connection section 3163 always conducts between the movable section 3161 and the fixed section 3162.

Further, the connection belt 3164 is connected to the fixing portion 3162, and extends from the fixing portion 3162 in a direction away from the camera module 100, and the connector 3165 is provided at one end of the connection belt 3164 and electrically connected to an external electronic device through the connector 3165, so that imaging information acquired by the photosensitive chip 312 is transmitted to the external electronic device.

In one embodiment of the application, the photosensitive assembly 31 further includes a reinforcing portion 317, the reinforcing portion 317 is disposed on the back surface of the connection circuit board 316, and the connection circuit board 316 is indirectly fixed to the lower cover 3212 through the reinforcing portion 317. In other words, the reinforcing portion 317 and the chip circuit board 311 are respectively disposed at two opposite sides of the connection circuit board 316. The reinforcing portion 317 can enhance the strength of the connection circuit board 316, and the reinforcing portion 317 has a better heat conduction effect. The reinforcing portion 317 may be a stainless steel plate or other material, and the present application is not limited thereto.

The frame 322 is fixed to the upper cover 3211, and the frame 322 includes a first frame portion 3221, a second frame portion 3222, a third frame portion 3223, and a fourth frame portion 3224, and the first frame portion 3221, the second frame portion 3222, the third frame portion 3223, and the fourth frame portion 3224 are connected end to end, and a middle portion of the frame 322 has an opening to allow light to pass through. The first frame portion 3221 is adjacent to the lens module 20, and the second frame portion 3222, the third frame portion 3223, and the fourth frame portion 3224 are sequentially disposed in a clockwise direction. In one embodiment of the present application, the first frame portion 3221 includes two protrusions having a certain thickness, and a groove is formed between the two protrusions.

The anti-shake driving assembly 325 is disposed between the chip wiring board 311 and the frame 322 to drive the chip wiring board 311 to move relative to the frame 322 and the cover 321. Specifically, the anti-shake driving assembly 325 includes a first anti-shake driving mechanism 3251, a second anti-shake driving mechanism 3252 and a third anti-shake driving mechanism 3253, and the first anti-shake driving mechanism 3251, the second anti-shake driving mechanism 3252 and the third anti-shake driving mechanism 3253 are disposed on three sides of the photosensitive assembly 31, respectively. Wherein, the first anti-shake driving mechanism 3251 comprises a first anti-shake magnet 32511 and a first anti-shake coil 32512, the second anti-shake driving mechanism 3252 comprises a second anti-shake magnet 32521 and a second anti-shake coil 32522, and the third anti-shake driving mechanism 3253 comprises a third anti-shake magnet 32531 and a third anti-shake coil 32532. The first anti-shake magnet 32511 and the first anti-shake coil 32512 are disposed opposite to each other along the Z-axis direction, the second anti-shake magnet 32521 and the second anti-shake coil 32522 are disposed opposite to each other along the Z-axis direction, and the third anti-shake magnet 32531 and the third anti-shake coil 32532 are disposed opposite to each other along the Z-axis direction.

The second frame portion 3222, the third frame portion 3223, and the fourth frame portion 3224 of the frame 322 have grooves opened toward the chip wiring board 311, respectively, the first anti-shake magnet 32511 is provided at the second frame portion 3222, the second anti-shake magnet 32521 is provided at the third frame portion 3223, and the third anti-shake magnet 32531 is provided at the fourth frame portion 3224. Correspondingly, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are disposed on the top surface of the chip circuit board 311, and in one embodiment of the present application, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are board type coils, that is, three anti-shake coils are formed on a substrate 3254. In other words, the circuit board type coil includes a substrate 3254 and a plurality of anti-shake coils formed on the substrate 3254, the plurality of anti-shake coils being disposed opposite to the plurality of anti-shake magnets along the Z-axis direction. The plurality of anti-shake coils includes a first anti-shake coil 32512, a second anti-shake coil 32522, and a third anti-shake coil 32532, and the first anti-shake coil 32512, the second anti-shake coil 32522, and the third anti-shake coil 32532 are all disposed on the substrate 3254. The circuit board type coil is disposed on the chip circuit board 311 and electrically connected to the chip circuit board 311, so as to facilitate the electrical connection of the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 to the chip circuit board 311.

In one embodiment of the present application, the chip driving device 32 is not provided with coil-magnets on the side facing the lens module 20, i.e., the anti-shake driving assembly 325 is provided on three sides other than the side near the lens module 20. In other words, the first anti-shake driving mechanism 3251, the second anti-shake driving mechanism 3252, and the third anti-shake driving mechanism 3253 are provided on three sides other than the side on which the chip driving apparatus 32 extends into the lens driving apparatus 24, respectively. This arrangement prevents interference between the focus drive assembly 244 and the anti-shake drive assembly 325, which would affect the imaging performance. Moreover, since the coil-magnet is not disposed on the side of the chip driving device 32 extending into the lens driving device 24, the chip driving device 32 and the lens driving device 24 can be closer together, and the height of the camera module 100 can be reduced.

In one embodiment of the present application, the anti-shake driving assembly 325 further includes a magnetism enhancing member 3255, wherein the magnetism enhancing member 3255 is disposed between the frame 322 and the first anti-shake magnet 32511, between the frame 322 and the second anti-shake magnet 32521, and between the frame 322 and the third anti-shake magnet 32531. That is, the magnetism increasing member 3255 is disposed on the first, second and third anti-shake magnets 32511, 32521 and 32531, respectively, so that not only the magnetic field strength can be increased, but also the magnetic forces of the first, second and third anti-shake magnets 32511, 32521 and 32531 can be prevented from overflowing.

Specifically, the magnetism increasing member 3255 provided to the first anti-shake magnet 32511 will be described as an example. For example, in one embodiment of the present application, the magnetism enhancing member 3255 is configured in an L-shaped configuration, and the magnetism enhancing member 3255 covers a side of the first anti-shake magnet 32511 away from the first anti-shake coil 32512, and a side of the first anti-shake magnet 32511 away from the photosensitive assembly 31. In other words, the magnetism increasing member 3255 covers the top side and the outer side of the first anti-shake magnet 32511, wherein the outer side is a side away from the photosensitive path. In this arrangement, the magnetic force of the first anti-shake magnet 32511 can be concentrated toward the first anti-shake coil 32512 to increase the magnetic field strength between the first anti-shake magnet 32511 and the first anti-shake coil 32512. It should be understood that the magnetism enhancing members 3255 disposed on the second anti-shake magnet 32521 and the third anti-shake magnet 32531 may have the same structure or may have different structures, which is not limited in the present application.

Of course, in other embodiments of the present application, the magnetism enhancing member 3255 may have a planar structure and be disposed on only one side of the first anti-shake coil 32512, and the beneficial effect of increasing the magnetic field strength between the first anti-shake magnet 32511 and the first anti-shake coil 32512 may be implemented. Further, the magnetism enhancing member 3255 may not contain magnetism, for example, the magnetism enhancing member 3255 may be made of ferrite, or the magnetism enhancing member 3255 itself may be a permanent magnet.

In one embodiment of the present application, the lens driving device 24 extends into the chip driving device 32 to increase the space utilization efficiency of the camera module 100 and reduce the size of the camera module 100. Further, with continued reference to fig. 5A and 11, at least a portion of the lens driving device 24 overlaps at least a portion of the chip driving device 32 in the Z-axis direction. Of course, it can also be said that the chip driving device 32 extends into the lens driving device 24. Thus, the space utilization efficiency of the camera module 100 can be increased, and the size of the camera module 100 can be reduced.

Specifically, as described above, the first frame portion 3221 of the frame 322 is close to the lens module 20, and the groove of the first frame portion 3221 may be adapted to the lens focusing group 21, and at least a portion of the lens focusing group 21 and the movable carrier 243 overlap with at least a portion of the first frame portion 3221 along the Z-axis direction. When the movable carrier 243 drives the lens focusing group 21 to move along the optical axis direction, the groove of the first frame 3221 can avoid collision between the lens focusing group 21 and the first frame 3221. This arrangement not only makes the structure of the camera module 100 more compact, but also reduces the length of the camera module 100.

Specifically, in the present application, at least a portion of the first frame portion 3221 and at least a portion of the movable carrier 243 overlap in the first direction. For example, in the first direction, the carrier body 2431 of the movable carrier 243 is located above the first frame portion 3221 of the frame 322 to enable the lens driving device 24 and the chip driving device 32 to extend into each other. Thus, not only the structure of the camera module 100 can be made more compact, but also the size of the camera module 100 can be reduced.

In one embodiment of the present application, at least a portion of the circuit assembly 246 of the lens driving device 24 overlaps at least a portion of the chip wiring board 311 of the chip driving device 32 in the first direction. In other words, the first circuit board 2461 and/or the second circuit board 2462 are disposed on the chip wiring board 311 along the first direction.

In one embodiment, at least a portion of the circuit assembly 246 of the lens driving device 24 overlaps at least a portion of the connection wiring board 316 of the chip driving device 32 in the first direction. In other words, the first circuit board 2461 and/or the second circuit board 2462 is disposed above the connection circuit board 316 along the first direction.

In the present application, the first installation space 200 of the lens module 20 and the second installation space 300 of the photosensitive module 30 overlap, so that the internal space utilization of the camera module 100 is higher and the size of the camera module 100 is reduced. That is, the lens module 20 and the photosensitive module 30 use a space with each other.

Further, in the lens module 20, the guide assembly 245 is disposed on the top of the lens driving device 24, and this arrangement reserves a space for the bottom of the lens driving device 24, so that the chip driving device 32 can extend into the lens module 20 from the bottom. As described above, the base 242 is disposed at the top, the housing 241 is disposed at the bottom, and the guide assembly 245 is fixed to the base 242, so that the guide assembly 245 can be disposed at the top of the lens driving device 24 to reserve a space at the bottom of the lens driving device 24, so that the chip driving device 32 can extend into the lens module 20 from the bottom.

It should be understood that, due to the structure of the camera module 100, interference may occur between the focusing driving component 244 of the lens driving device 24 and the anti-shake driving component 325 of the chip driving device 32. Specifically, the first focusing driving mechanism 2441 and the second focusing driving mechanism 2442 of the focusing driving assembly 244 are disposed on the left and right sides of the camera module 100 along the second direction, the first anti-shake driving mechanism 3251 and the third anti-shake driving mechanism 3253 of the anti-shake driving assembly 325 are disposed on the left and right sides of the camera module 100 along the second direction, and the overlapping arrangement of the lens driving assembly and the anti-shake driving assembly 325 may cause magnetic interference. More specifically, magnetic interference may occur between the first focusing magnet 24411 and the first anti-shake magnet 32511, and between the second focusing magnet 24421 and the third anti-shake magnet 32531 due to the mutual overlapping between the lens driving assembly and the anti-shake driving assembly 325.

In order to avoid the above problem, in the present application, the first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 are further extended toward the light entrance, so that the positions of the first focusing magnet 24411 and the second focusing magnet 24421 mounted on the first carrier side wall 2432 and the second carrier side wall 2433 can be moved forward, that is, the positions of the first focusing magnet 24411 and the second focusing magnet 24421 are closer to the light entrance. The magnetic interference between the lens driving device 24 and the chip driving device 32 is reduced by increasing the distance between the first focusing magnet 24411 and the first anti-shake magnet 32511 and the distance between the second focusing magnet 24421 and the third anti-shake magnet 32531. In a specific example of the present application, the distance between the first focusing magnet 24411 and the first anti-shake magnet 32511 is not less than 2mm, and further, the distance between the second focusing magnet 24421 and the third anti-shake magnet 32531 is not less than 2mm.

As shown in fig. 12, in order to improve the stability of the chip wiring board 311 in the optical anti-shake process and improve the imaging quality, a support assembly 324 is provided between the chip wiring board 311 and the frame 322 to always support the chip wiring board 311 when the chip wiring board 311 is driven to move relative to the frame 322. In one embodiment of the present application, the support assembly 324 is implemented as balls 3241, and ball grooves 3231 are required to be provided at the bottom surface of the frame 322 and the top surface of the chip wiring board 311, respectively, to accommodate the balls 3241 therein.

It should be understood that it is more difficult to form the ball grooves 3231 on the chip wiring board 311, and the flatness of the chip wiring board 311 may be affected, and the chip wiring board 311 may be damaged. In order to avoid the above, in the present application, the package 323 is molded on the chip circuit board 311, and the package 323 may be integrally molded on the chip circuit board 311, or may be pre-molded and then attached to the chip circuit board 311. For example, in one embodiment of the present application, the package body 323 is integrally formed on the chip wiring board 311, and the ball grooves 3231 are formed on the package body 323, not only simpler, but also higher in flatness. The support member 324 is sandwiched between the package 323 and the frame 322 to support the chip wiring board 311 at all times while the chip wiring board 311 moves.

Specifically, in one embodiment of the present application, the package 323 is integrally formed on two opposite corners of the chip circuit board 311 and sides opposite to the two opposite corners. The top surface of the package 323 forms a ball groove 3231, and the balls 3241 are seated in the ball groove 3231 such that the balls 3241 are clamped between the package 323 and the frame 322.

Further, the top surface of the package 323 may be a first ball groove, and the bottom surface of the corresponding frame 322 may be a second ball groove, where the first ball groove and the second ball groove may be planar grooves, or the first ball groove and the second ball groove have a certain length direction, which is not limited in the present application.

In one embodiment of the application, the number of balls 3241 is at least three, as are the number of first and second ball grooves. For example, when the number of the balls 3241 is four and the number of the first ball groove and the second ball groove is four, the first ball groove and the second ball groove are opposed in the Z-axis direction, and the balls 3241 are sandwiched between the first ball groove and the second ball groove. Further, one of the second ball grooves is provided at the bottom surface between the second frame portion 3222 and the third frame portion 3223 of the frame 322, the other one of the second ball grooves is provided at the bottom surface between the third frame portion 3223 and the fourth frame portion 3224 of the frame 322, and the other two of the second ball grooves are provided at the bottom surface of the first frame portion 3221 of the frame 322. At a position corresponding to the second ball groove, a package 323 having the first ball groove on the top surface is provided on the chip wiring board 311.

In this way, four balls 3241 may be disposed at two corners and one side of the chip driving device 32, respectively, and it should be understood that three balls 3241 may form one supporting plane, and if four balls 3241 are disposed at four corners, four supporting planes may be formed, and the chip circuit board 311 may have a risk of tilting. In order to avoid the inclination of the chip wiring board 311, in the present application, two of the four balls 3241 are disposed at adjacent corners of the chip wiring board 311, and the other two of the four balls 3241 are disposed at opposite sides of the connection line of the adjacent corners of the chip wiring board 311. The distance between the two balls 3241 located at the adjacent corners is larger than the distance between the two balls 3241 located at the sides to ensure that the balls 3241 can smoothly support the chip wiring board 311.

As described above, the first frame 322 includes two protrusions having a certain thickness, the bottom surfaces of the two protrusions are provided with the second ball grooves, and the top surface of the package 323 is provided with the first ball grooves corresponding thereto. Since the first frame body has a certain thickness, the ball groove 3231 can be easily formed. In this arrangement, two second ball grooves may be concentrated in the first housing, and two first ball grooves may be concentrated on one side of the package 323.

In one embodiment of the application, balls 3241 are three-point supported between frame 322 and enclosure 323. That is, when the number of the balls 3241 is three or more, only three balls 3241 achieve the support. For example, when the number of the balls 3241 is four, three balls 3241 support the chip circuit board 311, and a certain gap is provided between one ball 3241 and the first ball groove and/or the second ball groove, the balls 3241 may support the chip circuit board 311 to reduce impact when the camera module 100 falls.

Wherein, the clearance between the ball 3241 and the first ball groove and/or the second ball groove is not more than 50um.

In one embodiment of the present application, anti-shake driving assembly 325 further includes a magnetic attraction member (not shown) disposed on substrate 3254 of the track-board coil. For example, the magnetic attraction member is disposed on a side of the first anti-shake coil 32512 away from the first anti-shake magnet 32511 such that the magnetic attraction member is disposed opposite the first anti-shake magnet 32511 along the Z-axis direction. Further, along the Z-axis direction, at least a portion of the magnetic attraction member overlaps at least a portion of the first anti-shake magnet 32511, and the magnetic attraction member can interact with the first anti-shake magnet 32511 to generate magnetic attraction force, so that the support assembly 324 is clamped between the frame 322 and the package 323 by the magnetic attraction force, and the balls 3241 are prevented from falling off due to shaking of the camera module 100. Of course, the magnetic attraction member may be disposed on a side of the second anti-shake coil 32522 away from the second anti-shake magnet 32521, and the magnetic attraction member may be disposed on a side of the third anti-shake coil 32532 away from the third anti-shake magnet 32531. In this way, the magnetic attraction piece is attached to the substrate 3254 of the circuit board type coil, so that the assembly steps can be reduced, and the assembly of the camera module 100 is simpler.

Of course, in other embodiments of the present application, a magnetic attraction member may be disposed in the package 323, for example, the magnetic attraction member may be disposed in the package 323 by an insert molding process. Wherein, along the Z-axis direction, at least a portion of the magnetic attraction member overlaps at least a portion of the first anti-shake magnet 32511, at least a portion of the second anti-shake magnet 32521, and at least a portion of the third anti-shake magnet 32531.

In an embodiment of the present application, the chip driving device 32 further includes an anti-shake position sensing element 326, the anti-shake position sensing element 326 includes a first anti-shake sensing element 3261 and a second anti-shake sensing element 3262, the first anti-shake sensing element 3261 and the first anti-shake magnet 32511 are disposed opposite to each other along the Z-axis direction, and the second anti-shake sensing element 3262 and the second anti-shake magnet 32521 are disposed opposite to each other along the Z-axis direction. When the chip circuit board 311 moves, the relative positions of the first anti-shake sensing element 3261 and the first anti-shake magnet 32511 change, and the relative positions of the second anti-shake sensing element 3262 and the second anti-shake magnet 32521 change. The position of the chip circuit board 311 is determined according to the magnetic field strength sensed by the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262, and then the currents of the first anti-shake coil 32512 and the second anti-shake coil 32522 are adjusted so that the chip circuit board 311 moves to a required position. In the present application, the first and second anti-shake sensing elements 3261 and 3262 may be hall elements, driving ICs, or TMRs.

Specifically, in one embodiment of the present application, the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262 are disposed on the substrate 3254 of the wiring board coil. Specifically, the first anti-shake sensing element 3261 is disposed on the back side of the first anti-shake coil 32512, i.e., the first anti-shake coil 32512 is located between the first anti-shake sensing element 3261 and the first anti-shake magnet 32511, and the second anti-shake sensing element 3262 is disposed on the back side of the second anti-shake coil 32522, i.e., the second anti-shake coil 32522 is located between the second anti-shake sensing element 3262 and the second anti-shake magnet 32521. That is, the first and second anti-shake sensing elements 3261 and 3262 are disposed at adjacent sides of the substrate 3254.

More specifically, the chip wiring board 311 has openings at the positions of the first and second anti-shake sensing elements 3261 and 3262 so that the first and second anti-shake sensing elements 3261 and 3262 may be disposed within the openings of the chip wiring board 311 to avoid increasing the height of the chip driving apparatus 32 due to the presence of the anti-shake position sensing element 326.

It should be understood that in the present application, the magnetic attraction member and the anti-shake position sensing element 326 are disposed on the substrate 3254 of the circuit board type coil, for example, the magnetic attraction member and the anti-shake position sensing element 326 are disposed on the back surface of the substrate 3254 opposite to the anti-shake magnet along the Z-axis direction. In this way, the number of assembly steps of the chip driving apparatus 32 can be reduced, making the structure of the chip driving apparatus 32 simpler.

It should be noted that in one embodiment of the present application, a method for assembling the photosensitive module 30 may include the steps of:

S110, providing a chip circuit board 311 and at least one electronic component 315, disposing the at least one electronic component 315 on the chip circuit board 311, and electrically connecting the at least one electronic component 315 with the chip circuit board 311.

S111, the package 323 is formed on the opposite sides of the two opposite corners of the chip wiring board 311 and the opposite sides of the two opposite corners, and the ball groove 3231 is formed on the top surface of the package 323.

S112, a connection circuit board 316 is provided, wherein the connection circuit board 316 includes a fixed portion 3162, a movable portion 3161, and a deformable connection portion 3163 connecting the fixed portion 3162 and the movable portion 3161, and the movable portion 3161 is reversely attached to the back surface of the chip circuit board 311.

S113, a circuit board-type coil is provided, the circuit board-type coil includes a substrate 3254, a first anti-shake coil 32512, a second anti-shake coil 32522 and a third anti-shake coil 32532, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are formed on the substrate 3254, the circuit board-type coil is disposed on the front surface of the chip circuit board 311 and electrically connected to the chip circuit board 311, and the circuit board-type coil and the connection circuit board 316 are respectively located on two sides of the chip circuit board 311.

S114, providing a photosensitive chip 312, a filter element 314 and a filter element support 313, wherein the photosensitive chip 312 is arranged on the front surface of the chip circuit board 311, the filter element support 313 is fixed on the chip circuit board 311 and surrounds the periphery of the photosensitive chip 312, the filter element 314 is fixed on the filter element support 313 so that the filter element 314 is positioned on the photosensitive path of the photosensitive chip 312, and a protective film is attached on the top surface of the filter element 314 to protect the filter element 314.

S115, providing an upper cover 3211 and a lower cover 3212, fixedly connecting the fixing portion 3162 of the connecting circuit board 316 with the lower cover 3212, placing balls 3241 in the ball grooves 3231 of the package 323, and tearing off the protective film to form a first semi-finished product.

S116, providing a frame 322 and first, second and third anti-shake magnets 32511, 32521 and 32531, respectively, mounting the first, second and third anti-shake magnets 32511, 32521 and 32531 at the corresponding positions of the frame 322, such that the first frame portion 3221 of the frame 322 is not provided with anti-shake magnets, the first, second and third anti-shake magnets 32511, 32521 and 32531 are respectively provided at other positions than the first frame portion 3221, and fixing the frame 322 in the upper cover 3211 to form a second semi-finished product.

S117, the first semi-finished product and the second semi-finished product are integrated, and the upper cover 3211 and the lower cover 3212 are fixedly connected to each other, so as to form a photosensitive module 30.

In step S111, the ball groove 3231 on the top surface of the package 323 may be a planar groove, or may be a guide groove 2434 having a direction, and the shape of the ball groove 3231 may be specifically set as needed.

In step S112, the connection circuit board 316 may cause problems such as displacement and rotation of the movable portion 3161 relative to the fixed portion 3162 due to the deformation of the deformable connection portion 3163, thereby affecting the movement stroke of the chip driving device 32. In one embodiment of the present application, the k value of the deformable coupling portion 3163 is increased to avoid unnecessary deformation of the deformable coupling portion 3163. It should be understood that the k value may also be referred to as an elastic coefficient, and describes the magnitude of elastic force generated when a unit deformation amount, and that the k value is large, which means that the force required for deforming a unit length is large, the less easy the deformation.

Further, since the movable portion 3161 of the connection wiring board 316 and the chip wiring board 311 are vertically soldered up and down, the soldering condition cannot be detected, and the risk of soldering between the movable portion 3161 of the connection wiring board 316 and the chip wiring board 311 increases. To solve the above problem, in one embodiment of the present application, holes are formed in the movable portion 3161 of the connection wiring board 316 and/or the chip wiring board 311, and solder paste is disposed in the holes for soldering. And detecting whether the cold joint problem exists or not through the amount of the solder paste in the hole after welding. This part will be described in detail later.

In step S115, the fixing portion 3162 of the connection circuit board 316 is only fixedly connected with the lower cover 3212, but there is no fixedly connected portion with the upper cover 3211, which may affect the fixing strength of the connection circuit board 316 and cause damage during the shaking or falling process of the camera module 100. In order to solve the above problem, in the present application, the fixing portion 3162 of the connection circuit board 316 is increased in size so as to be fixedly connected not only to the lower cover 3212 but also to the upper cover 3211, thereby increasing the connection strength of the chip driving apparatus 32.

In another embodiment of the present application, a method for assembling the photosensitive module 30 is provided, which may include the steps of:

S210, providing a chip circuit board 311 and at least one electronic component 315, disposing the at least one electronic component 315 on the chip circuit board 311, and electrically connecting the at least one electronic component 315 with the chip circuit board 311.

S211, forming the package 323 on two opposite corners of the chip circuit board 311 and opposite sides of the two opposite corners, and forming the ball groove 3231 on the top surface of the package 323.

S212, a circuit board type coil is provided, the circuit board type coil includes a substrate 3254, a first anti-shake coil 32512, a second anti-shake coil 32522 and a third anti-shake coil 32532, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are disposed on the substrate 3254, and the circuit board type coil is disposed on the front surface of the chip circuit board 311 and electrically connected to the chip circuit board 311.

S213, a connection circuit board 316 is provided, wherein the connection circuit board 316 includes a fixed portion 3162, a movable portion 3161, and a deformable connecting portion 3163 connecting the fixed portion 3162 and the movable portion 3161, the movable portion 3161 is reversely attached to the back surface of the chip circuit board 311, and the circuit board coil and the connection circuit board 316 are respectively located at two sides of the chip circuit board 311 to form a third semi-finished product.

S214, providing a frame 322 and first, second and third anti-shake magnets 32511, 32521 and 32531, respectively, mounting the first, second and third anti-shake magnets 32511, 32521 and 32531 at the corresponding positions of the frame 322 so that the first frame portion 3221 of the frame 322 is not provided with anti-shake magnets, respectively, the first, second and third anti-shake magnets 32511, 32521 and 32531 are provided at other positions except the first frame portion 3221, placing balls in the ball grooves 3231 of the frame 322, providing an upper cover 3211 and a lower cover 3212, and fixing the frame 322 in the upper cover 3211 to form a fourth semi-finished product

S215, assembling the fourth semi-finished product and the third semi-finished product into a whole.

S216, providing a photosensitive chip 312, a light filtering element 314 and a light filtering element support 313, wherein the photosensitive chip 312 is arranged on the front surface of the chip circuit board 311, the light filtering element 314 support 313 is fixed on the chip circuit board 311 and surrounds the periphery of the photosensitive chip 312, the light filtering element 314 is fixed on the light filtering element support 313 so that the light filtering element 314 is positioned on the photosensitive path of the photosensitive chip 312, and the photosensitive chip 312, the light filtering element 314 and the light filtering element support 313 are arranged in the parts assembled by the third semi-finished product and the fourth semi-finished product.

S217, the lower cover 3212 is fixedly connected with the upper cover 3211 to form a photosensitive module 30.

Since the chip circuit board 311, the substrate 3254 of the circuit board coil, and the movable portion 3161 of the connection circuit board 316 are vertically soldered up and down, soldering conditions cannot be detected, and soldering of the three layers of circuit boards is more complicated, which easily results in an increased risk of soldering cold solder joints between the respective circuit boards. To solve the above problem, as shown in fig. 15, in one embodiment of the present application, a through-hole solder paste soldering structure is provided.

In this embodiment, the chip wiring board 311, the substrate 3254 of the wiring board coil, and the movable portion 3161 of the connection wiring board 316 are disposed in this order from top to bottom, the chip wiring board 311 is located on the front surface of the substrate 3254 of the wiring board coil, and the movable portion 3161 of the connection wiring board 316 is located on the back surface of the substrate 3254 of the wiring board coil.

Specifically, the substrate 3254 of the circuit board coil includes a first opening 3254a and a second opening 3254b, and the first opening 3254a and the second opening 3254b are offset. The movable portion 3161 of the connection wiring board 316 has PIN PINs on the top surface thereof, the PIN PINs corresponding to the positions of the first openings 3254a, and a conductive material, such as copper or the like, is provided on the inner surface of the first openings 3254 a. And an electrical connection medium is provided in the first opening 3254a, and the electrical connection medium rises up in the first opening 3254a to electrically connect the substrate 3254 of the board-type coil and the movable portion 3161 of the connection board 316. The electrical connection medium may be solder paste, and the solder paste is laser cured to electrically connect the substrate 3254 of the circuit board coil and the movable portion 3161 of the connection circuit board 316.

In one embodiment of the application, the height of the electrical connection medium within the first opening 3254a is greater than 50% of the thickness of the substrate 3254.

More specifically, the movable portion 3161 of the connection circuit board 316 includes a third opening 3161a, the third opening 3161a corresponds to the position of the second opening 3254b, the second opening 3254b and the third opening 3161a may be communicated to form a through hole, and a conductive material, such as a metal, e.g., copper, is disposed on the inner surfaces of the second opening 3254b and the third opening 3161 a. The bottom surface of the chip wiring board 311 has a chip PIN corresponding to the positions of the second opening 3254b and the third opening 3161a, and an electrical connection medium may be disposed in the through hole, the electrical connection medium climbing up in the through hole to achieve electrical connection between the chip wiring board 311, the base of the wiring board type coil, and the movable portion of the connection wiring board 316. In one embodiment of the application, the electrical connection medium extends through the second opening 3254b and the height of the electrical connection medium within the third opening 3161a is greater than 50% of the thickness of the connection wiring board 316.

In one embodiment of the application, the diameters of the second and third openings 3254b, 3161a are different, e.g., the diameter of the third opening 3161a is greater than the diameter of the second opening 3254b, such that the electrical connection medium is in a T-shaped configuration within the through-holes of the second and third openings 3254b, 3161 a.

In one embodiment of the present application, the conductive material may be disposed only at the inner surface of the third opening 3161a, and the conductive material is not disposed at the inner surface of the second opening 3254b, so that the chip wiring board 311 may be directly electrically connected to the connection wiring board 316.

In one embodiment of the present application, there is provided a via dielectric connection dielectric soldering method comprising the steps of:

S310, a connection circuit board 316 is provided, wherein the connection circuit board 316 includes a fixed portion 3162, a movable portion 3161, and a deformable connection portion 3163 connecting the fixed portion 3162 and the movable portion 3161, the top surface of the movable portion 3161 has a PIN on which a solder ball is pre-applied.

S320, a board-type coil is provided, and the board-type coil is provided on the front surface of the connection board 316. The circuit board coil basically includes a first opening 3254a and a second opening 3254b, the first opening 3254a corresponds to the PIN, a conductive material is disposed on an inner surface of the first opening 3254a, and an electrical connection medium is disposed in the first opening 3254a to electrically connect the circuit board 316 and the circuit board coil.

S330, a chip circuit board 311 is provided, the chip circuit board 311 is arranged on the front surface of the substrate 3254 of the circuit board coil, the back surface of the chip circuit board 311 is provided with a chip PIN PIN, and a solder ball is pre-arranged on the chip PIN PIN. The movable portion 3161 of the connection circuit board 316 includes a third opening 3161a, the second opening 3254b and the chip PIN are corresponding, conductive material is disposed on the inner surfaces of the second opening 3254b and the third opening 3161a, the third opening 3161a and the second opening 3254b are communicated to form a through hole, and a dielectric connection medium is disposed in the through hole to electrically connect the chip circuit board 311, the circuit board coil and the movable portion of the connection circuit board 316.

Further, in S320, the substrate 3254 of the board-type coil and the movable portion 3161 of the connection board 316 are assembled by being electrically connected in a forward manner, that is, the photosensitive surface of the photosensitive chip 312 faces upward, and an electrical connection medium is provided in the first opening 3254a in this direction.

Further, in S330, the chip wiring board 311 and the wiring board coil are assembled by flip-chip conduction, i.e., the photosensitive surface of the photosensitive chip 312 faces downward, in which direction the through-holes formed by the second opening 3254b and the third opening 3161a of the dielectric connection medium are provided.

The foregoing has outlined the basic principles, features, and advantages of the present application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made therein without departing from the spirit and scope of the application, which is defined by the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.

Claims

1. A camera module, comprising:

2. The camera module of claim 1, wherein the lens driving device comprises a base, a movable carrier and a guide assembly, wherein the movable carrier moves in a first direction in the base through the guide assembly, the lens focusing group is fixed on the movable carrier, the guide assembly is arranged on the top of the base, and the chip driving device extends into the lens driving device from the bottom of the base.

3. The camera module of claim 1, wherein the lens driving device further comprises a housing and a base, the housing and the base are buckled with each other to form a first installation space, a light inlet and a light outlet which are connected with the first installation space are formed at two ends of the lens driving device respectively, the chip driving device comprises an upper cover and a lower cover, the upper cover and the lower cover are buckled with each other to form a second installation space, and the first installation space and the second installation space are overlapped.

4. The camera module according to claim 2, wherein the base includes a top wall, and a first supporting portion and a mounting portion formed on the top wall, the first supporting portion includes a first arm and a second arm that are disposed at intervals, the first arm and the second arm are formed on the top wall and located at a side close to the light entrance, the mounting portion is formed on the top wall and located at a side close to the light exit, the mounting portion includes a mounting body and a first mounting side wall and a second mounting side wall connected to the mounting body, the mounting body and the first mounting side wall, the second mounting side wall form a mounting groove, and the second light path changing member can be disposed in the mounting groove.

5. The camera module of claim 4, wherein the base further comprises a barrel fixing portion formed on the top wall and adjacent to the first support portion, the barrel fixing portion comprising a first fixed side wall and a second fixed side wall forming a mounting cavity, the camera module further comprising a lens fixing group fixed within the mounting cavity.

6. The camera module according to claim 5, wherein the top wall of the base is implemented as a metal piece including a main body portion, a first extension portion, a second extension portion and a third extension portion, the first extension portion being bent and extended in a first direction from one end of the main body portion, the first extension portion being embedded in the first arm and the second arm of the first support portion, the second extension portion being bent and extended in a first direction from the other end of the main body portion, the second extension portion being embedded in the mounting portion, the third extension portion being bent in a first direction from the main body portion, the third extension portion being embedded in the barrel fixing portion to increase strength of the first support portion, the mounting portion and the barrel fixing portion.

7. The camera module of claim 5, wherein the movable carrier comprises a carrier body and first and second carrier sidewalls connected to the carrier body, the first and second carrier sidewalls extending in a second direction, the lens focus group being secured to the carrier body, the first and second carrier sidewalls being located on left and right sides of the carrier body.

8. The camera module of claim 7, wherein the first carrier sidewall and the second carrier sidewall extend from the carrier body toward the light entrance, the first carrier sidewall, the second carrier sidewall, and the carrier body forming a U-shaped structure with an opening toward the light entrance, the lens holding group being received in the opening.

9. The camera module of claim 7, wherein the first carrier sidewall and the second carrier sidewall extend from the carrier body toward the light exit opening, the first carrier sidewall, the second carrier sidewall, and the carrier body forming a U-shaped structure with an opening toward the light exit opening, the second light path altering element being received within the opening.

10. The image capturing module of any of claims 1-9, wherein the lens driving apparatus further comprises a focus driving assembly including a first focus driving mechanism and a second focus driving mechanism, the first focus driving mechanism and the second focus driving mechanism being disposed on left and right sides of the movable carrier, respectively, to provide symmetrical driving force to the movable carrier.

11. The camera module of claim 10, wherein the first focus driving mechanism comprises a first focus magnet and a first focus coil, the first focus magnet is disposed on the movable carrier, the first focus coil is disposed opposite to the first focus magnet, and a line connecting a center of the first focus magnet and a center of the lens focus group is not perpendicular to an optical axis of the lens focus group.

12. The camera module of claim 11, wherein a center of the first focusing magnet is located between a center of the lens focusing group and a center of the lens fixing group.

13. The camera module according to claim 3, wherein the light sensing assembly comprises a light sensing chip, a chip circuit board and a connection circuit board, the light sensing chip is arranged on the front surface of the chip circuit board and is electrically connected with the chip circuit board, the connection circuit board is arranged on the back surface of the chip circuit board and is electrically connected with the chip circuit board, the lens driving device comprises a circuit assembly, at least one part of the chip circuit board and/or at least one part of the connection circuit board overlaps with at least one part of the circuit assembly along the first direction, and at least one part of the circuit assembly is positioned above at least one part of the chip circuit board and/or at least one part of the connection circuit board.

14. The camera module according to claim 13, wherein the connection wiring board includes a fixed portion, a movable portion, and a deformable connection portion, the movable portion being located inside the fixed portion, the deformable connection portion connecting the movable portion and the fixed portion, respectively, a straight line of one side of the movable portion connected by the deformable connection portion being not parallel to a straight line of one side of the fixed portion, the movable portion being fixed to a back surface of the chip wiring board, the fixed portion being fixed to the lower cover.

15. The camera module of claim 14, wherein the chip driving device comprises a frame and an anti-shake driving assembly, the frame is fixed on the upper cover, the anti-shake driving assembly is arranged between the chip circuit board and the frame to drive the chip circuit board to drive the photosensitive chip and the movable part of the connection circuit board to move along a plane perpendicular to a first direction, the anti-shake driving assembly comprises a first anti-shake driving mechanism, a second anti-shake driving mechanism and a third anti-shake driving mechanism, and the first anti-shake driving mechanism, the second anti-shake driving mechanism and the third anti-shake driving mechanism are respectively arranged on three sides except one side of the chip driving device, which extends into the lens driving device.

16. The camera module of claim 15, wherein the lens driving device comprises a movable carrier to which the lens focus group is fixed, the movable carrier being driven to move in a second direction, at least a portion of the frame overlapping at least a portion of the movable carrier in a first direction, the at least a portion of the movable carrier being located above the at least a portion of the frame.

17. The camera module of claim 15, wherein the chip driving device further comprises a package body integrally formed at two opposite corners of the chip wiring board and sides opposite to the two opposite corners, a ball groove formed at a top surface of the package body, and a support member disposed in the ball groove to be clamped between the package body and the frame, the support member performing three-point support between the frame and the package body.

18. The camera module of claim 3, wherein the photosensitive assembly comprises a photosensitive chip, a chip circuit board and a connecting circuit board, the photosensitive chip is arranged on the front surface of the chip circuit board and is electrically connected with the chip circuit board, the chip driving device comprises a circuit board type coil and a plurality of anti-shake magnets opposite to the circuit board type coil, the circuit board type coil comprises a substrate and a plurality of anti-shake coils formed on the substrate, the substrate is arranged on the back surface of the chip circuit board and is electrically connected with the chip circuit board, and the connecting circuit board is arranged on the back surface of the substrate and is electrically connected with the substrate.

19. The camera module of claim 17, wherein the substrate of the circuit board coil includes a first opening and a second opening, the top surface of the connection circuit board has a PIN corresponding to the first opening to provide an electrical connection medium in the first opening, the connection circuit board includes a third opening corresponding to the second opening, the bottom surface of the chip circuit board has a chip PIN corresponding to the second opening and the third opening, and the second opening and the third opening have an electrical connection medium disposed therein, the electrical connection medium extending through the second opening, and the height of the electrical connection medium in the third opening is greater than 50% of the thickness of the connection circuit board.