CN119653646A - Circuit board processing control method, circuit board alignment detection method and circuit board processing equipment - Google Patents

Abstract

The invention provides a circuit board processing control method, which comprises the steps of presetting a plurality of reference positions on a target circuit board, wherein each reference position comprises a plurality of layers of reference patterns, controlling circuit board processing equipment to process a through hole with a first diameter at the reference position, controlling the circuit board processing equipment to sequentially control and deeply process a plurality of blind holes with a second diameter, wherein the second diameter is larger than the first diameter, and determining the alignment degree of the layers of reference patterns and the expansion and contraction deviation of the target circuit board according to the central coordinates of the through hole and the blind holes. A method of detecting the alignment of a circuit board, and a circuit board processing apparatus are also disclosed. The method and the equipment improve the precision and the quality of processing the multilayer circuit board.

Description

Circuit board processing control method, method for detecting alignment degree of circuit board and circuit board processing equipment

Technical Field

The disclosure relates to the technical field of methods for manufacturing circuit boards, and in particular relates to a circuit board processing control method, a method for detecting alignment degree of a circuit board and circuit board processing equipment.

Background

The printed circuit board is a basic stone of electronic products and provides electrical connection for various chips and components on the PCB. At the same time, the printed circuit board is increasingly light, thin and miniaturized, and the printed circuit board is promoted to develop towards high-frequency and higher-density interconnection, namely, the number of layers is increased, the line width and line distance L/S are smaller, the aperture is smaller, and the micropore density is higher.

Compared with single-layer circuit boards, the multi-layer, especially high multi-layer (more than 10 layers) circuit boards have more layers and thicker layers, denser circuits and through holes, larger unit size, thinner dielectric layers and the like, and the inner layer space, the interlayer alignment degree and the impedance control are more strict. The number of layers of the high multilayer circuit board is more, the alignment degree of the design end on each layer of the PCB is more and more strict, and the alignment tolerance between layers is required to be controlled within +/-75 mu m. The factors of larger unit size design, environmental temperature and humidity of a graphic transfer workshop, dislocation superposition caused by the expansion and contraction inconsistency of different core plates, interlayer positioning mode and the like are considered, so that the interlayer alignment control of the high-multilayer board is always a technological problem.

The production of the multi-layer PCB selects a batch operation manufacturing mode to control the generation quality, so that the first piece of each machine for each material number is indispensable for spot inspection. The current mainstream method is to obtain data such as maximum offset of reference patterns between inner layers or maximum offset of through holes relative to the reference patterns of the inner layers by manual visual inspection or manual measurement through a 2D X-Ray inspection machine or a 3D X-Ray precise measurement machine.

However, the existing multilayer board interlayer offset detection technology based on X-Ray is limited by the X-Ray imaging characteristic, distortion exists at the image edge, and erroneous judgment of manual visual inspection and errors of manual measurement are easy to cause. In addition, in the reality condition, because the regional setting of modern mill often has certain distance between drilling workshop and detection workshop, and the manual work is transported and is waited to detect the product and detect corresponding fixed detection board and detect for detection flow inefficiency. And because the PCB products to be tested often come from different time, different batches (different material numbers) and different drilling machine stations, the detection flow needs to be continuously adjusted according to the source of the products to be tested, and the detection flow is completely dependent on manual work to carry out material transfer, detection, data recording and tracing on the products to be tested. Finally, in the existing multilayer board interlayer offset detection technology based on X-Ray, a product to be detected is transferred from one area to another area, instant detection cannot be performed on a first site of a processing machine, and abnormal swelling and shrinkage changes of a board to be detected are possibly caused due to changes of time, space, environment (temperature, humidity and other conditions), the authenticity of a detection result is affected, and the detection result cannot be faithfully fed back or restored to the processing precision capability level of the processing machine, so that higher processing precision cannot be achieved through various debugging or compensation technical means.

In a word, from the aspect of accuracy of detection results, the existing printed circuit board processing detection method and flow make further optimization and improvement of processing accuracy of a processing machine difficult, and meanwhile, the low-efficiency detection flow is also an obstacle point for cost reduction and efficiency improvement of lean operation factories, so that an innovative detection method and equipment are urgently needed.

In view of this, it is necessary to design a precise, instant and efficient detection method, flow and device for the existing PCB factory after processing a printed circuit board, by which the time waiting can be avoided or reduced, the inconsistency between the working environment conditions of the first material space transfer redundancy link and the processing and detecting two links can be avoided or reduced, the accuracy and the reliability of the detection result can be improved, the efficiency of the detection flow can be improved, the better management and control of the processing quality can be achieved, and the goals of reducing the cost and enhancing the efficiency can be achieved.

Content of the application

The disclosure provides a circuit board processing control method, a method for detecting circuit board alignment degree and circuit board processing equipment for solving the problems existing in the prior art.

According to a first aspect of the disclosure, a circuit board processing control method is provided, and the circuit board processing control method comprises the steps of presetting a plurality of reference positions on a target circuit board, enabling each reference position to comprise a plurality of layers of reference patterns, controlling circuit board processing equipment to process a through hole with a first diameter at the reference positions, controlling the circuit board processing equipment to sequentially control deep process a plurality of blind holes with a second diameter, wherein the second diameter is larger than the first diameter, and determining the alignment degree of the plurality of layers of reference patterns and the expansion and contraction deviation of the target circuit board according to the center coordinates of the through hole and the blind holes.

In one embodiment of the present disclosure, each layer of reference pattern corresponds to one blind hole, and the alignment degree is determined according to a coordinate deviation of an average value of center coordinates of a plurality of blind holes and the center coordinates of the through holes.

In one embodiment of the disclosure, if the coordinate deviation is within a preset threshold range, the alignment degree is judged to be qualified, and if the coordinate deviation is not within the preset threshold range, the interaction information is output, the correction information is obtained, and the alignment degree of the target circuit board is determined again.

In one embodiment of the present disclosure, a circuit board processing apparatus includes a vision assembly that sequentially detects center coordinates of a through hole and a blind hole.

In one embodiment of the present disclosure, the reference pattern includes a metal conductive layer, and the shape of the metal conductive layer is the same along the lamination direction of the multi-layered reference pattern.

In one embodiment of the present disclosure, the reference pattern is in the shape of a cross, and at least one section of the metal conductive layer is in the shape of a circular arc ring after the blind hole is processed.

In one embodiment of the present disclosure, each reference position includes center coordinates of a plurality of blind holes, an average value of each reference position is determined according to the plurality of center coordinates, and a swelling deviation of the target circuit board is determined according to the plurality of average values.

In one embodiment of the present disclosure, during processing of the blind hole of the second diameter, the cutting edge angle of the tool is 145 degrees or more and 160 degrees or less.

According to a second aspect of the present disclosure, a method for detecting alignment of a circuit board is provided, and the method is applied to a multi-layer circuit board processing device, and includes the steps of presetting a reference pattern at a reference position of a multi-layer target circuit board, calling a first group of drilling components to process a through hole with a first diameter at the reference position, calling a second group of drilling components to process a blind hole with a second diameter at the reference position, wherein the second diameter is larger than the first diameter, and determining interlayer alignment of the target circuit board according to center coordinates of the through hole and the blind hole.

According to a third aspect of the disclosure, a circuit board processing device is provided, which comprises a first piece detection task corresponding to a multilayer target circuit board, a second group of drilling components, a first group of drilling components, a second group of drilling components, a blind hole, a interlayer alignment degree and a swelling deviation of the target circuit board, wherein the first piece detection task corresponds to the multilayer target circuit board, the second group of drilling components is used for detecting the top end surface position of the reference position of the target circuit board, the first group of drilling components is used for processing a through hole with a first diameter at the reference position, the second group of drilling components is used for processing a blind hole with a second diameter at the reference position, the second diameter is larger than the first diameter, the interlayer alignment degree of the target circuit board and the swelling deviation of the target circuit board are determined according to the central coordinates of the through hole and the blind hole, and when the alignment degree is not within a preset threshold value range, the alignment degree is corrected according to the swelling deviation.

The circuit board processing control method, the circuit board alignment detection method and the circuit board processing equipment have the beneficial effects that through holes and blind holes are processed in sequence at the same reference position, and the interlayer alignment of the reference position is determined through the center coordinates of the through holes and the blind holes. On one hand, the method integrates the automatic process of detection and processing, saves cost and time, improves efficiency and precision, and on the other hand, the method can improve the processing precision and quality of the multilayer circuit board by detecting the alignment degree of the target circuit board by the first part.

Other features of the present disclosure and its advantages will become apparent from the following detailed description of exemplary embodiments of the disclosure, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic diagram of a portion of a target circuit board according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a portion of a target circuit board according to an embodiment of the disclosure;

fig. 3 is a schematic view of a part of a structure of a through hole processed by a circuit board processing apparatus according to an embodiment of the present disclosure;

fig. 4 is a schematic view of a part of a structure of a blind hole processed by a circuit board processing apparatus according to an embodiment of the disclosure;

FIG. 5 is a schematic view of a portion of a blind via provided in an embodiment of the present disclosure;

FIG. 6 is a schematic view of a portion of a blind via provided in an embodiment of the present disclosure;

FIG. 7is a schematic view of a portion of a target circuit board according to an embodiment of the present disclosure;

FIG. 8 is a schematic flow diagram of a portion of a method for controlling circuit board processing according to an embodiment of the disclosure;

the one-to-one correspondence between the component names and the reference numerals in fig. 1 to 8 is as follows:

10. target circuit board, 11, sub-circuit board, 12, reference position, 121, reference pattern, 122, circular arc ring, 13, through hole, 14, blind hole, 15, conductive circuit, 21, first group drilling component, 22, second group drilling component.

Detailed Description

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless it is specifically stated otherwise. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification. It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

Specific embodiments of the present disclosure are described below with reference to the accompanying drawings. In this document, "upper", "lower", "front", "rear", "left", "right", and the like are used merely to indicate relative positional relationships between the relevant portions, and do not limit the absolute positions of the relevant portions. Herein, "first", "second", etc. are used only for distinguishing one another, and do not denote any order or importance, but rather denote a prerequisite of presence. In this document, "equal," "same," "synchronous," "sequential," "identical," "symmetrical," "duplicate," "circular," etc. are not strictly mathematical and/or geometric limitations, but also include deviations in the manufacturing or use that would be appreciated by one of ordinary skill in the art, and the like.

In the back drilling process, the interlayer alignment of the multi-layer circuit board is a key technical parameter. As shown in fig. 7, how to accurately detect the interlayer alignment and correct such unqualified alignment is a key to improve the processing accuracy and quality of the multi-layer back drill. To this end, the present disclosure provides a circuit board processing control method for determining, on a circuit board processing apparatus, an alignment degree of a multi-layer reference pattern of a reference position of a target circuit board and a swelling deviation of the target circuit board. The present disclosure also provides a method for detecting the alignment degree of a circuit board, which is used for detecting the position deviation between conductive metal layers of the reference position of a multilayer target circuit board on a circuit board processing device. The disclosure also provides a circuit board processing device for first piece detection, when the alignment degree of a target circuit board does not accord with a preset threshold range, the alignment degree is corrected by using the expansion and contraction deviation.

In one embodiment of the present disclosure, a circuit board processing apparatus includes a base, a beam, spindle assemblies, a table, etc., the table is disposed on the base, the beam is mounted above the table, at least one spindle assembly is slidingly connected to the beam, and each spindle assembly moves on the beam in a first direction. The workbench moves on the base and along the second direction, at least one processing station is arranged on the workbench, and a target circuit board is placed on each processing station. And each spindle assembly corresponds to the target circuit board on each processing station one by one, and the cutter clamped at the bottom end of each spindle assembly moves along the third direction so as to process the corresponding target circuit board. The first direction, the second direction and the third direction are mutually perpendicular. In the context of the present disclosure, the circuit board processing apparatus may be implemented as a drilling apparatus, a forming apparatus, a gong machine apparatus, a gong-drilling integrated apparatus, etc., without limitation. In the embodiments of the present disclosure, the cross beam of the circuit board processing apparatus is slidably connected with at least one spindle assembly, where the number of spindle assemblies may be one, two, three, four, six, ten, twelve, etc., and each spindle assembly has substantially the same structure and function, which is not limited in any way.

In one embodiment of the present disclosure, the target circuit boards are of different kinds, and the materials, dimensions, thicknesses, hardness, etc. thereof are different, and the physical characteristics of the different kinds of target circuit boards are greatly different. However, these target circuit boards are fixed in the processing position on the workbench, and the spindle assembly moving at high speed clamps the tool to move along the third direction so as to process the target circuit boards. There are various ways of fixing the target circuit board by the workbench, including but not limited to, air clamps, bakelite plates, suction devices, etc., which can realize stable and reliable fixing of the target circuit board in the processing position on the workbench, so that the cutter moving at high speed can not displace when processing the target circuit board.

Each processing station on the table carries a target circuit board, and as shown in fig. 1 and 2, each target circuit board 10 includes a plurality of sub-circuit boards 11, and the plurality of sub-circuit boards 11 have the same layout structure and are arranged in a matrix on the whole target circuit board. Each sub-circuit board includes a plurality of hole sites arranged in a predetermined pattern in the sub-circuit board, and the spindle assembly holds the tool to sequentially process the plurality of hole sites on the sub-circuit board in a predetermined path and order.

The target circuit board has a multilayer board and a single layer board, wherein the multilayer and single layer mainly refer to metal conductive circuit layers, and the multilayer board comprises a plurality of metal conductive circuit layers. The multilayer board can integrate a plurality of circuit patterns, so that the size of the target circuit board is reduced, the carried circuit patterns are more, the scale of the integrated circuit in unit area is improved, and the size of the target circuit board is reduced. In the field of ultra-precise electronic technology, multilayer boards are very widely used. Multilayer circuit boards require selective electrical continuity between the multilayer circuits, which requires the use of a back drilling process to make through holes or blind vias. The back drilling is a secondary drilling process, the front surface is processed to penetrate through the through hole, then copper plating process is carried out, and the back surface is processed to remove redundant copper layers, so that selective electrical conduction among partial layers of the through hole is realized, the partial layers are conducted through metal copper, and the partial layers after copper is removed are not conducted.

In the above and below embodiments of the present disclosure, as shown in fig. 7, the target circuit board is a multi-layer circuit board, and the number of layers of the guiding circuit 15 is greater than or equal to three. The multi-layer circuit board is formed by laminating a plurality of layers of conductive circuits, each layer of conductive circuit comprises a metal conductive layer, and the metal conductive layers are electrically connected and conducted in the same layer. Meanwhile, between different layers, the metal conducting layer is connected or disconnected through the through holes and/or the blind holes.

The circuit board processing control method comprises the steps of presetting a plurality of reference positions on a target circuit board, enabling circuit board processing equipment to process through holes with a first diameter at the reference positions, controlling the circuit board processing equipment to sequentially control and deeply process blind holes with a plurality of second diameters, wherein the second diameters are larger than the first diameter, and determining the alignment degree of the multi-layer reference patterns at the reference positions and the expansion and contraction deviation of the target circuit board according to the central coordinates of the through holes and the blind holes. According to the circuit board processing control method, the through hole and the blind hole are processed in sequence at the same reference position, and the interlayer alignment degree of the reference position is determined through the center coordinates of the through hole and the blind hole. On one hand, the method integrates the automatic process of detection and processing, saves cost and time, improves efficiency and precision, and on the other hand, the method can improve the processing precision and quality of the multilayer circuit board by detecting the alignment degree of the target circuit board by the first part.

In some embodiments of the disclosure, each layer of the reference pattern corresponds to one blind hole, and the alignment degree is determined according to a deviation between an average value of center coordinates of a plurality of blind holes and the center coordinates of the through holes. As shown in fig. 5, a reference pattern 121 is preset at a reference position 12 of a target circuit board 10, the target circuit board is a multi-layer circuit board, the reference pattern is arranged on each layer of circuit board in the same layer of the conductive metal layer and the same process, each layer of reference pattern 121 corresponds to one blind hole 14, and a plurality of blind holes are overlapped to form an integral hole. The laminated multi-layer reference pattern has deviation in alignment, so that the blind holes at the reference positions can comprise different center coordinates, and the deviation in alignment is represented by the center coordinates of the blind holes, so that the method is more accurate and reliable. Therefore, the average value of the center coordinates of the blind holes is obtained from the center coordinates of the plurality of blind holes through an average value algorithm, and then the average value is compared with the center coordinates of the through holes, so that the deviation of the alignment degree of the reference pattern can be determined.

The method comprises the steps of comparing an average value of center coordinates of a blind hole with center coordinates of a through hole, judging that the alignment degree of a target circuit board is qualified if the deviation of the average value of the center coordinates of the blind hole and the center coordinates of the through hole is within a preset threshold range, outputting interaction information if the deviation of the center coordinates of the blind hole and the center coordinates of the through hole is not within the preset threshold range, acquiring correction information, and determining the alignment degree of the target circuit board again. For the target circuit board, when the deviation of the target circuit board and the target circuit board meets the preset threshold requirement, the target circuit board is qualified in reference position alignment, and a plurality of target circuit boards can be processed in batch. When the deviation of the two components does not meet the preset threshold requirement, the standard position is unqualified in alignment, the first component is unqualified in detection, the circuit board processing equipment outputs interaction information through a man-machine interaction interface, after a technician makes a selection, correction parameters are automatically compensated, the target circuit board is detected for the second time based on the corrected alignment, and the first component is qualified in detection until the target circuit board meets the preset threshold requirement in alignment.

In some embodiments of the present disclosure, the circuit board processing apparatus includes a vision assembly that sequentially detects center coordinates of the through hole and the blind hole. The spindle assembly of the circuit board processing apparatus further includes a vision assembly including a camera for detecting the position and center coordinates of the through hole and the blind hole. In the context of the present disclosure, the center coordinates of the reference position are detected and determined by the vision component. The circuit board processing equipment controls the spindle assembly to process the through hole with the first diameter at the reference position, and after the through hole is processed, controls the vision assembly to detect the center coordinate of the through hole and records the center coordinate of the through hole.

In the process of processing the blind holes, reference patterns are preset at the reference positions, each blind hole is processed, one layer of reference patterns penetrates through each blind hole, and when the reference patterns are in a cross structure, each layer of reference patterns form an arc ring structure in each blind hole. Therefore, after the blind holes of the first layer are processed, the vision module can detect the center coordinates of the first layer circular arc ring 122 by using the remaining circular arc ring 122 structure of the first layer reference pattern 121. Each layer of reference pattern 121 is processed, a metal conductive layer of an arc ring 122 structure is exposed in the stacked blind holes, multiple layers of blind holes are sequentially processed, the central coordinates of the rest arc ring 122 structures of each layer of reference pattern are detected respectively, and the central coordinates of the blind holes of each layer can be determined. The inner layer of the target circuit board is of a multi-layer structure, blind holes of one layer are processed, and the center coordinates of the reference graph of the layer are detected by utilizing a vision component.

In some embodiments of the present disclosure, the reference pattern includes a metal conductive layer, and the metal conductive layer is identical in shape along a lamination direction of the multi-layer reference pattern. The multi-layer circuit board comprises a plurality of layers of conductive circuits, each layer of conductive circuit comprises a plurality of electrically connected metal conductive layers, the metal conductive layers of the reference patterns and the metal conductive layers of the conductive circuits are manufactured by the same layer and the same manufacturing process, and the same exposure and etching processes are used for manufacturing, so that the metal conductive layers of the reference patterns can be ensured to directly feed back the interlayer alignment degree of the multi-layer conductive circuits. Specifically, at the reference position, a plurality of reference patterns are preset on the target circuit board, each reference pattern including a metal conductive layer, the shape and structure of which are the same along the lamination direction of the plurality of reference patterns, that is, the thickness direction of the target circuit board. The same metal conductive layer can reduce the processing difficulty and cost, reduce the interference of the reference pattern and improve the accuracy of the interlayer alignment degree of the reference pattern.

In some embodiments of the disclosure, the reference pattern is in a cross shape, and after the blind hole is processed, at least one section of the metal conductive layer is in a circular arc ring structure. Fig. 5 is a schematic structural diagram before processing the blind hole, and fig. 6 is a schematic structural diagram after processing the blind hole to form an arc ring. In the multi-layer reference graph of the reference position, a cross-shaped structure is preferable, the manufacturing process is simple, and the subsequent detection of the center coordinates is convenient. After the blind holes are processed on the metal conductive layer of each layer of reference pattern, part of the metal conductive layer is removed, and the rest metal conductive layer forms an arc ring structure which is four sections of arc rings at intervals and forms a circular structure in a surrounding manner. Because the diameter of the blind hole is larger than that of the through hole, the circular arc ring is positioned at the periphery of the through hole, and the through hole is positioned in the circular arc ring. The vision component needs to detect the center coordinates of the blind holes on each layer of reference patterns, so that the vision component clearly determines the center coordinates of the blind holes on each layer by grabbing targets through the circular arc ring. The positions of the reference patterns of each layer are slightly different, and the interlayer alignment degree of the reference patterns of each layer can be directly fed back by determining the center coordinates of the reference patterns of each layer.

In some embodiments of the disclosure, each reference position includes a plurality of center coordinates of the blind hole, an average value of each reference position is determined according to the plurality of center coordinates, and a swelling deviation of the target circuit board is determined according to the plurality of average values. On the target circuit board, a plurality of reference positions are preset, each reference position is preset with a reference pattern, and through processing blind holes on each layer of reference patterns, center coordinates of a plurality of blind holes of different layers are formed, so that the vision component can calculate the average value of a plurality of center coordinates of a single reference position after detecting the center coordinates. After the average value of each reference position is obtained, the target circuit board is provided with a plurality of reference positions in the peripheral area of the sub circuit board, the center coordinates of each reference position comprise an actual center coordinate and a theoretical center coordinate, the average value is the actual center coordinate, and the expansion and contraction deviation of the target circuit board is obtained by fitting according to the deviation of the average value of the center coordinates of each reference position and the theoretical center coordinate. For the target circuit board, four reference positions are preferably set, and four reference positions are selected on the periphery of a plurality of sub-circuit boards on the target circuit board so as to accurately detect the expansion and contraction deviation of the target circuit board. Meanwhile, the deviation between the average value of the center coordinates of each reference position and the theoretical center coordinates is fitted to obtain the expansion coefficient of the target circuit board, and the expansion and contraction deviation is mapped through the expansion coefficient, so that the expansion and contraction deviation of the target circuit board is determined. After the collapsible bias is determined, data information support is provided for subsequent compensation and correction.

In some embodiments of the present disclosure, during the machining of the blind hole of the second diameter, the cutting edge angle of the tool is greater than 135 degrees and less than 180 degrees. In a circuit board processing apparatus, a plurality of spindle assemblies are included, each spindle assembly simultaneously or independently processing a corresponding target circuit board. And in the process of machining the blind hole with the second diameter, the cutter clamped by the spindle assembly performs mechanical drilling machining. The cutter has an edge angle which is more than or equal to 145 degrees, the larger edge angle is favorable for secondary drilling processing, the width of the residual circular arc ring of the blind hole is wider, the accurate detection of the center coordinates of the circular arc ring is favorable, meanwhile, the large edge angle is favorable for multi-layer and multi-time processing of the multi-layer target circuit board, and the damage and influence of the front and back processing on the blind hole and the circular arc ring conductive metal layer of each layer are reduced. In addition, the cutter edge angle is smaller than or equal to 160 degrees, and the smaller edge angle is beneficial to accurately controlling the depth in the process of deep-control processing of the blind holes. Therefore, the blade angle of the cutter needs to keep a reasonable balance between accurate depth control and accurate detection of the center coordinates, and the blade angle is selected to be more than or equal to 145 degrees and less than or equal to 160 degrees, so that the balance of the two is facilitated. In the upper and lower embodiments of the present disclosure, the smaller the angle of the blade, the sharper the blade tip, the flatter the blade tip, typically the blade angle ranges from 90 to 180 degrees.

The disclosure also provides a method for detecting the alignment degree of the circuit board, which comprises the following steps of S100, S200, S300, S400 and S400, wherein the reference pattern is preset at the reference position of the multilayer target circuit board, the first group of drilling components are called, the through holes with the first diameter are processed at the reference position, the second group of drilling components are called, the blind holes with the second diameter are processed at the reference position, the second diameter is larger than the first diameter, and the interlayer alignment degree of the target circuit board is determined according to the central coordinates of the through holes and the blind holes. The method for detecting the alignment degree of the circuit board comprises the steps of setting a reference pattern at a reference position, processing through holes and blind holes on the reference pattern, detecting center coordinates of the through holes and the blind holes, determining interlayer position deviation of a target circuit board through the center coordinates of the center through holes and the plurality of blind holes, and judging the alignment degree of the target circuit board through the interlayer position deviation. The method for directly detecting the interlayer alignment degree of the multilayer circuit board by utilizing the reference graph integrates detection and processing, saves cost and detection time, improves efficiency and accuracy, and can improve the processing accuracy and quality of the multilayer circuit board by detecting the alignment degree of the target circuit board by the first piece.

The disclosure also provides circuit board processing equipment which comprises a first piece detection task corresponding to a multilayer target circuit board, a second group of drilling components, a first group of drilling components, a second group of drilling components, a blind hole, a interlayer alignment degree and a swelling and shrinking deviation of the target circuit board, wherein the first piece detection task is used for obtaining the multilayer target circuit board, the second group of drilling components are used for detecting the top end surface position of the reference position of the target circuit board, the first group of drilling components are used for processing a through hole with a first diameter at the reference position, the second group of drilling components are used for processing a blind hole with a second diameter at the reference position, the second diameter is larger than the first diameter, the interlayer alignment degree of the target circuit board and the swelling and shrinking deviation of the target circuit board are determined according to the central coordinates of the through hole and the blind hole, and when the alignment degree is smaller than a preset threshold value, the alignment degree is corrected according to the swelling and shrinking deviation. According to the circuit board processing equipment, first part detection is performed before target circuit boards are processed in batches, after first part detection tasks are acquired, through holes and blind holes are processed successively, and according to the center coordinates of the through holes and the blind holes, the interlayer alignment degree of the multilayer target circuit boards is judged, determined and corrected, and the fitted expansion and contraction deviation is utilized to correct the alignment degree, so that the interlayer alignment degree is improved, and the processing precision and quality are improved.

In the above and below embodiments of the present disclosure, the reference position is an arbitrarily selected one predetermined point on the target circuit board, which is disposed in the non-processing area, that is, the reference position is located at the periphery of the sub-circuit board or in the area between adjacent sub-circuit boards. In order to ensure that the multiple reference positions accurately feed back the expansion and contraction deviation of the target circuit board, preferably, the reference positions are arranged at four corners of the target circuit board, each corner is preset with one reference position, each reference position comprises multiple reference patterns, each reference pattern is preferably a cross-shaped metal conducting layer, the reference patterns and each layer of conducting circuit of the multi-layer circuit board are manufactured in the same layer and the same process, and the interlayer alignment degree and the expansion and contraction deviation of the target circuit board are directly obtained by using the reference patterns.

Application scenario one

In this embodiment, six-axis circuit board processing equipment is taken as an example, and a circuit board processing control method, a method for detecting alignment degree of a circuit board, and a specific structure of the circuit board processing equipment are described in detail. In this embodiment, the circuit board processing apparatus is a mechanical drilling process. As shown in fig. 1, 3-8.

In this embodiment, the circuit board processing apparatus includes a table, a spindle assembly, a cross beam, and a base. The workbench is arranged on the base, the workbench is erected on a cross beam above the workbench, 6 identical spindle assemblies are connected to the cross beam in a sliding mode, and each spindle assembly moves on the cross beam along a first direction. The workbench moves on the base in the second direction, six processing stations are arranged on the workbench, a target circuit board is placed in each processing station, the spindle assembly moves in the third direction, and the target circuit board borne on the corresponding processing station is processed. In the embodiments of the present disclosure, the first direction, the second direction, and the third direction are perpendicular to each other.

In this embodiment, the circuit board processing device includes a control system, in which a plurality of object parameters for processing the circuit board are built, the target circuit boards are in one-to-one correspondence with the target object parameters, and the same target object parameters are called to process the same batch or kind of target circuit boards. As shown in fig. 1, in the target object parameter, the target circuit board 10 includes 20 sub-circuit boards 11, and each sub-circuit board 11 includes a plurality of hole sites. Around the target circuit board 10, 4 reference positions 12 are provided, and a plurality of reference patterns 121 are laminated at each reference position 12 along the thickness direction of the target circuit board 10, the reference patterns 121 of each layer being manufactured in the same process as each layer of the conductive circuit of the multilayer circuit board 10.

In this embodiment, a vision component is disposed on each spindle component, and the vision component is implemented as a camera, and may be implemented to detect coordinate positions at various positions on the target circuit board, including central coordinate positions of the through holes and the blind holes at the reference position 12, and feed back the central coordinate positions to the control system, where the control system calculates, determines, and determines the alignment degree of the target circuit board based on the central coordinate positions.

In this embodiment, as shown in fig. 1,3 to 7, before the batch processing, the circuit board processing device performs first part detection to confirm that each parameter of the circuit board processing device meets a predetermined quality requirement. Therefore, after triggering or entering the first part detection task, the loading and unloading mechanism is controlled to carry a target circuit board on the workbench, and the first part detection task corresponding to the multi-layer target circuit board is acquired, wherein the first part detection task comprises information such as the position of a reference pattern, the depth control processing depth of a blind hole and the like. In a circuit board processing apparatus, a first spindle assembly is retrieved, and a top surface position of a reference position of the target circuit board is detected. As shown in fig. 1, the number of the reference positions 12 is four, and the top surface positions of the four reference positions 12 are detected respectively for determining the positions of the subsequent deep control processing blind holes. As shown in fig. 3, in the present embodiment, the first set of drilling assemblies 21 is implemented as a first spindle assembly, and after the first spindle assembly 21 picks up the tool of the first diameter, the first spindle assembly 21 is called up, and the through holes 13 of the first diameter are machined in sequence at four reference positions 12. After the through holes 13 are machined, the vision component sequentially detects the central coordinate positions of the through holes. The first spindle assembly 21 replaces the tool, picking up a tool of a second diameter, the cross-sectional diameter of which is much larger than the cross-sectional diameter of the tool of the first diameter. And continuously processing for multiple times at the first reference position, drilling through one layer of reference pattern each time to form a blind hole, wherein the blind hole is a U-shaped opening, the upper end of the blind hole is open, and the bottom end of the blind hole does not penetrate. As shown in fig. 4, in the first reference position, the first spindle assembly 22 picks up the tool of the second diameter to process a plurality of blind holes 14 a plurality of times, and checks the center position of each blind hole 14, and records the center coordinates of each blind hole. The positions of the center coordinates of each blind hole are different due to slight differences in the positions of the reference patterns of the layers. And selecting the center coordinates of the blind holes, calculating an average value, comparing the average value with the center coordinates of the through holes, and determining the deviation between the average value and the center coordinates of the through holes as interlayer deviation at the reference position, namely the alignment degree. For four reference positions of the whole circuit board, each reference position has an actual center coordinate, the average value of the center coordinates of each blind hole is compared with the actual center coordinates of the reference positions, the difference value of the two is the deviation of the reference positions, and the expansion and contraction deviation of the target circuit board is determined through the deviation of the four reference positions. For the circuit board processing equipment, when the alignment degree does not meet the preset threshold requirement, the alignment degree can be corrected, and the alignment degree of the reference position is re-detected until the alignment degree meets the preset threshold requirement. Specifically, the method for compensating and correcting the alignment degree can be used for correcting the interlayer alignment degree by reversely compensating the expansion and contraction deviation into the alignment degree, so that the processing precision and quality of the circuit board processing equipment are improved.

In the circuit board processing apparatus of the present embodiment, a circuit board processing control method is applied, as shown in fig. 1, 3 to 8, specifically including the steps of:

First, a plurality of reference positions are preset on a target circuit board, each of which includes a multi-layer reference pattern. As shown in fig. 1, four reference positions 12 are provided on each target circuit board 10, and the four reference positions 12 are provided at four corner areas of the target circuit board 10. The present embodiment is preferably disposed at four corner regions of the target circuit board 10. At each reference position 12, a cross-shaped metal conductive layer is arranged on the same layer as each conductive circuit of the multi-layer circuit board, the cross-shaped metal conductive layer and each conductive circuit of the multi-layer circuit board are manufactured by the same exposure and etching process, and the cross-shaped reference patterns 121 are manufactured by the same layer and the same process, so that the interlayer alignment degree of the multi-layer circuit board can be directly fed back and detected. In the present embodiment, when the multi-layered circuit board includes six inner conductive circuits, six stacked reference patterns 121 are provided at reference positions, with non-conductive matrix layer spaces provided between each of the reference patterns 121, as appropriate.

Secondly, at the reference position 12, the circuit board processing equipment is controlled to process through holes with a first diameter, and then the circuit board processing equipment is controlled to sequentially and deeply process a plurality of blind holes with a second diameter, wherein the second diameter is larger than the first diameter. As shown in fig. 3, in the present embodiment, the first set of drilling assemblies 21 is implemented as a first spindle assembly, and at each reference position 12, the first spindle assembly controlling the circuit board processing apparatus processes a through hole 13 according to a preset theoretical center coordinate position, which penetrates all conductive layers and matrix layers of the multi-layered circuit board, as a through hole. Four through holes 13 are sequentially processed at four reference positions. And invokes the vision assembly to sequentially detect and record the center coordinate positions of the four through holes 13.

After the through holes are machined, the first spindle assembly replaces the cutter, unloads the cutter with the first diameter to the cutterhead, and picks up the cutter with the second diameter in the cutterhead, wherein the second diameter is far larger than the first diameter. As shown in fig. 4, in the present embodiment, the second set of drilling assemblies 22 is implemented as a first spindle assembly that picks up a tool of a second diameter, and after the first spindle assembly 22 picks up the tool of the second diameter, the blind holes 14 are sequentially machined at each of the reference positions 12 according to a preset theoretical center coordinate position. Since the center coordinates of the cross reference patterns of each layer are slightly different, in the process of sequentially processing the blind holes by the first spindle assembly 22 according to the theoretical center coordinate position, after the cross reference patterns 121 are processed into the blind holes, as shown in fig. 5 and 6, the remaining metal conductive layers are in a circular arc ring 122 structure, and the center coordinates of each circular arc ring 122 structure are slightly different. And at the reference position, the vision component is called to sequentially detect the center coordinates of the six circular arc rings, and the center coordinates of the six circular arc rings are recorded. In this embodiment, the blind holes 14 are non-through holes, and in the multilayer circuit board, each blind hole penetrates only to the corresponding reference pattern, that is, from the surface of the multilayer circuit board, the first blind hole penetrates to the reference pattern of the first layer, the second blind hole penetrates to the reference pattern of the second layer, and so on, and the sixth blind hole penetrates to the sixth reference pattern. In the process of processing the blind hole 14, after removing multiple layers of metal from the cross metal conductive layer, the metal conductive layer of the circular arc ring 122 structure is remained, the center coordinate of each layer of circular arc ring 122 is detected, and the center coordinate of the circular arc ring 122 is recorded.

And finally, determining the alignment degree of the multilayer reference graph of the reference position and the expansion and contraction deviation of the target circuit board according to the center coordinates of the through hole and the blind hole. In the present embodiment, the blind hole 14 and the through hole 13 are both machined according to the same theoretical coordinates of the reference position 12, but there is a deviation in the position of each layer of reference pattern in the lamination direction as shown in fig. 7, resulting in a difference in the center coordinates of the circular arc ring remaining after the blind hole is machined. The average value of the center coordinates of the six circular arc rings is calculated, and is determined as the actual center coordinates of the blind holes 14, and the interlayer deviation of the reference position 12, that is, the alignment degree of the reference position 12, is determined according to the deviation of the actual center coordinates of the through holes 13 and the actual center coordinates of the blind holes 14. The deviation of the actual center coordinates of the blind holes 14 from the theoretical center coordinates at the reference positions is determined as the expansion/contraction deviation of the reference positions, and the deviation of the target circuit board 10 is determined as the expansion/contraction deviation of the four reference positions 12.

In the circuit board processing apparatus of the present embodiment, a method of detecting the alignment degree of a circuit board is applied, which can detect the interlayer alignment degree of a target circuit board, which is also the interlayer alignment degree of a multilayer circuit board. As shown in fig. 1 and fig. 3 to fig. 7, the method specifically comprises the following steps:

S100, presetting a reference pattern at a reference position of the multilayer target circuit board. The target circuit board is any circuit board in the batch of circuit boards to be processed, a reference position is arranged on the target circuit board, a plurality of reference patterns are arranged in the direction of the multi-layer laminated conductive circuit of the reference position, the reference patterns 121 can be cross metal conductive layers, and each layer of reference patterns and the conductive circuit of the multi-layer circuit board are manufactured in the same layer and the same process as each other as shown in fig. 5. Thus, the interlayer position deviation of the multilayer circuit board, that is, the interlayer alignment degree of the multilayer circuit board, can be directly fed back through the interlayer position deviations of the plurality of reference patterns of the reference positions. In the present embodiment, reference positions are provided at four corners of the target circuit board, and when the target circuit board includes six layers of conductive circuits inside, stacked six layers of metal conductive layers of a cross structure are provided at each reference position.

S200, a first group of drilling components are called, and through holes with the first diameter are processed at the reference positions. As shown in fig. 3, in the present embodiment, the first set of drilling assemblies is different from the second set of drilling assemblies in terms of the cutter diameters. The first spindle assembly picking up tools of a first diameter is referred to as a first set of drilling assemblies and the first spindle assembly picking up tools of a second diameter is referred to as a second set of drilling assemblies. Thus, the first set of drilling assemblies is invoked to process the through hole, essentially by controlling the first spindle assembly to pick up the tool of the first diameter, and at the reference position, process the through hole according to the preset theoretical center coordinates. And (3) after each processing of a through hole, calling the visual component, and detecting the central coordinate position of the through hole. When four corners of the target circuit board are provided with four reference positions, four through holes are sequentially processed, and center coordinate positions of the four through holes are detected and recorded. The through hole penetrates through each layer of cross reference pattern of the reference position, and only the diameter of the through hole is smaller.

S300, a second group of drilling assemblies are called, and blind holes with a second diameter are machined in the reference positions, wherein the second diameter is larger than the first diameter. After the through hole is machined, the first spindle assembly replaces the tool, unloads the tool of the first diameter, picks up the tool of the second diameter, and moves the first spindle assembly picking up the tool of the second diameter to a reference position, and sequentially machines the blind holes according to a preset theoretical center coordinate position, as shown in fig. 4. And each time a blind hole is machined, the central coordinates of the rest circular arc rings at the blind holes are detected by the visual component, the central coordinates of the circular arc rings at the blind holes of the six inner layers are detected and recorded, and data information support is provided for the subsequent interlayer alignment.

S400, determining the interlayer alignment degree of the target circuit board according to the center coordinates of the through holes and the blind holes. After the actual center coordinates of the through holes are determined, calculating the average value of the actual center coordinates of the six circular arc rings, and calculating the average value as the actual center coordinates of the blind holes. And determining the interlayer deviation at the reference position, namely the interlayer alignment degree at the reference position according to the deviation of the actual center coordinates of the through holes and the actual center coordinates of the blind holes. And determining the deviation as the expansion and contraction deviation according to the deviation between the actual center coordinate of the blind hole and the theoretical center coordinate at the reference position. The target circuit board is provided with four reference positions, and the expansion and contraction deviation of the target circuit board can be determined through the expansion and contraction deviation of the four reference positions. According to the expansion deviation, the deviation of the alignment degree can be reversely compensated into the alignment degree to correct the deviation of the alignment degree, then one target circuit board is replaced, and the alignment degree of the target circuit board is detected again until the alignment degree meets a preset threshold value.

The circuit board processing equipment, the circuit board processing control method and the method for detecting the alignment degree of the circuit board sequentially process the through hole and the blind hole at the same reference position, and the interlayer alignment degree of the reference position is determined through the central coordinates of the through hole and the blind hole. On one hand, the method integrates the automatic process of detection and processing, saves cost and time, improves efficiency and precision, and on the other hand, the method can improve the processing precision and quality of the multilayer circuit board by detecting the alignment degree of the target circuit board by the first part.

Application scene two

In this embodiment, a circuit board processing apparatus is taken as an example, and a circuit board processing control method, a method for detecting alignment degree of a circuit board, and a specific structure of the circuit board processing apparatus are described in detail. In this embodiment, the circuit board processing apparatus is a laser drilling process. As shown in fig. 2 to 8.

The circuit board processing apparatus of this embodiment is slightly different from the first embodiment in that the circuit board processing control method and the method of detecting the alignment degree of the circuit board are substantially the same as the first embodiment in that the circuit board processing apparatus uses laser to process the circuit board instead of machining the circuit board. The reference position is arranged between adjacent areas of the plurality of sub-circuit boards, is closer to the sub-circuit board to be processed, and can accurately feed back the interlayer alignment degree.

The circuit board processing equipment of the embodiment comprises a workbench, a laser head assembly, a cross beam and a base. The workbench is arranged on the base, the workbench is erected on a beam above the workbench, 2 identical laser head assemblies are connected to the beam in a sliding mode, and each laser head assembly moves on the beam along a first direction. The workbench moves on the base in the second direction, two processing stations are arranged on the workbench, a target circuit board is placed in each processing station, the laser head assembly can emit laser beams in the third direction, and the target circuit board borne on the corresponding processing station is processed. In the embodiments of the present disclosure, the first direction, the second direction, and the third direction are perpendicular to each other.

In this embodiment, the circuit board processing device includes a control system, in which a plurality of object parameters for processing the circuit board are built, the target circuit boards are in one-to-one correspondence with the target object parameters, and the same target object parameters are called to process the same batch or kind of target circuit boards. As shown in fig. 2, in the target object parameter, the target circuit board 10 includes 20 sub-circuit boards 11, and each sub-circuit board 11 includes a plurality of hole sites. Between the adjacent two sub-circuit boards 11, 9 reference positions 12 are provided, and a plurality of reference patterns 121 are laminated at each reference position 12 in the thickness direction of the target circuit board 10, the reference patterns 121 of each layer being fabricated in the same process as each layer of the conductive circuit of the multi-layer circuit board 10.

In this embodiment, a vision component is disposed on each laser head component, and the vision component can be implemented to detect coordinate positions of positions on the target circuit board, including central coordinate positions of the through holes and the blind holes at the reference position 12, and feed back the central coordinate positions to the control system, where the control system calculates, determines, and determines the alignment degree of the target circuit board based on the central coordinate positions.

As shown in fig. 3, 4, 5, 6 and 7, in this embodiment, the first part of the circuit board processing device is detected before the batch processing is performed, so as to confirm that each parameter of the circuit board processing device meets a predetermined quality requirement. Therefore, after triggering or entering the first part detection task, the loading and unloading mechanism is controlled to carry a target circuit board on the workbench, and the first part detection task corresponding to the multi-layer target circuit board is acquired, wherein the first part detection task comprises information such as the position of a reference pattern, the depth control processing depth of a blind hole and the like. In the circuit board processing apparatus, the first drill assembly 21 is implemented as a first laser head assembly, the first laser head assembly 21 is called up, and the top end surface position of the reference position 12 of the target circuit board 10 is detected. The number of the reference positions 12 is nine, and the positions of the top surfaces of the nine reference positions are detected respectively so as to determine the positions of subsequent deep-control processing blind holes. The first laser head assembly 21 emits a first laser beam to sequentially process the through holes 13 of the first diameter at nine reference positions. After the through holes 13 are machined, the vision component sequentially detects the central coordinate positions of the through holes. The second drilling machine component 22 is implemented as a first laser head component, adjusts a laser light path and a diaphragm of the first laser head component, and controls the first laser head component 22 to emit a second laser beam, wherein the spot diameter of the second laser beam is far greater than that of the first laser beam. In the first reference position, the processing is performed continuously for a plurality of times, each processing forms a blind hole 14, the blind hole 14 is a U-shaped opening, the upper end is open, and the bottom end does not penetrate. At the first reference position 12, the first laser head assembly 22 processes a plurality of blind holes 14 a plurality of times, and checks the center position of each blind hole 14, and records the center coordinates of each blind hole 14. The position of the center coordinates of each blind hole 14 is different due to a slight difference in the positions of the reference patterns of the respective layers. The center coordinates of the plurality of blind holes 14 are selected, and an average value is calculated, and compared with the center coordinates of the through holes 13, the deviation of the average value from the center coordinates of the through holes is determined as the interlayer deviation at the reference position, which is also the alignment. For nine reference positions of the whole target circuit board, each reference position has an actual center coordinate, the average value of the center coordinates of each blind hole is compared with the actual center coordinates of the reference positions, the difference value of the two is the deviation of the reference positions, and the expansion and contraction deviation of the target circuit board is determined through the deviation of the nine reference positions. For the circuit board processing equipment, when the alignment degree does not meet the preset threshold requirement, the alignment degree can be corrected, and the alignment degree of the reference position is re-detected until the alignment degree meets the preset threshold requirement. Specifically, the method for compensating and correcting the alignment degree can be used for correcting the interlayer alignment degree by reversely compensating the expansion and contraction deviation into the alignment degree, so that the processing precision and quality of the circuit board processing equipment are improved.

In the circuit board processing apparatus of the present embodiment, a circuit board processing control method is applied, as shown in fig. 2 to 8, specifically including the steps of:

First, a plurality of reference positions, each including a multi-layer reference pattern, are preset on the target circuit board 10. Nine reference positions 12 are provided on each target circuit board 10, the nine reference positions 12 being provided in regions between a plurality of adjacent sub-circuit boards 11 on the target circuit board. At each reference position 12, a cross-shaped metal conductive layer is arranged on the same layer as each conductive circuit of the multi-layer circuit board, the cross-shaped metal conductive layer and each conductive circuit of the multi-layer circuit board are manufactured by the same exposure and etching process, and the cross-shaped reference patterns 121 are manufactured by the same layer and the same process, so that the interlayer alignment degree of the multi-layer circuit board can be directly fed back and detected. In this embodiment, when the multi-layer circuit board includes 10 inner conductive circuits, 10 stacked fiducial patterns are provided at fiducial positions with non-conductive matrix layer spaces provided between each of the fiducial patterns, as appropriate.

Secondly, at the reference position 12, the circuit board processing equipment is controlled to process through holes with a first diameter, and then the circuit board processing equipment is controlled to sequentially and deeply process a plurality of blind holes with a second diameter, wherein the second diameter is larger than the first diameter. At each reference position, the first laser head assembly of the control circuit board processing device processes a through hole 13 according to a preset theoretical center coordinate position, and the through hole 13 penetrates through all conductive layers and substrate layers of the multilayer circuit board and is a through hole. Nine through holes 13 are sequentially processed at nine reference positions. And invokes the vision assembly to sequentially detect and record the center coordinate positions of the nine through holes 13.

After the through hole 13 is machined, the first laser head assembly adjusts a laser path and a diaphragm, and controls the first laser head assembly to emit a second laser beam, wherein the spot diameter of the second laser beam is far larger than that of the first laser beam. The second drilling assembly 22 is realized as a first laser head assembly that emits a second laser beam, the first laser head assembly 22 sequentially machining the blind holes 14 at each reference position 12 according to a preset theoretical center coordinate position. Because the center coordinates of the cross reference patterns 121 of each layer are slightly different, in the process of sequentially processing the blind holes 14 by the first laser head assembly 22 according to the theoretical center coordinate positions, after the blind holes 14 are processed by the cross reference patterns 121, the rest metal conductive layers are in the circular arc ring 122 structure, and the center coordinates of the circular arc ring 122 structures of each layer are slightly different. At the reference position 12, the calling vision component sequentially detects the center coordinates of the 10 circular arc rings and records the center coordinates of the 10 circular arc rings. In this embodiment, the blind holes 14 are non-through holes, and in the multilayer circuit board, each blind hole penetrates only to the corresponding reference pattern, that is, from the surface of the multilayer circuit board, the first blind hole penetrates to the reference pattern of the first layer, the second blind hole penetrates to the reference pattern of the second layer, and so on, and the 10 th blind hole penetrates to the 10 th reference pattern. In the process of processing the blind hole 14, after removing multiple layers of metal from the cross metal conductive layer, the metal conductive layer of the circular arc ring 122 structure is remained, the center coordinate of each layer of circular arc ring 122 is detected, and the center coordinate of the circular arc ring 122 is recorded.

Finally, the alignment degree of the multi-layer reference pattern 121 of the reference position and the expansion and contraction deviation of the target circuit board 10 are determined according to the center coordinates of the through hole 13 and the blind hole 14. In this embodiment, the blind hole and the through hole are all machined according to the same theoretical coordinates of the reference positions, but in the stacking direction, there is a deviation in the positions of the reference patterns of each layer, resulting in different center coordinates of the circular arc ring remaining after the blind hole is machined. And calculating the average value of the center coordinates of the 10 circular arc rings, determining the average value as the actual center coordinates of the blind holes, and determining the interlayer deviation of the reference position, namely the alignment degree of the reference position, according to the deviation of the actual center coordinates of the through holes and the actual center coordinates of the blind holes. The deviation of the actual center coordinates of the blind holes and the theoretical center coordinates at the reference positions is determined to be the expansion and contraction deviation of the reference positions, and the deviation of the target circuit board is determined to be the expansion and contraction deviation of the nine reference positions.

The embodiment also discloses a method for detecting the alignment degree of the circuit board, as shown in fig. 2 to 8, specifically comprising S500, presetting a reference pattern 121 at the reference position of the multilayer target circuit board. S600, a first set of drilling assemblies 21 is called, and a through hole with a first diameter is machined at the reference position 10, wherein in this example, the first set of drilling assemblies 21 is a first laser beam emitted by a laser head assembly. And S700, a second group of drilling assemblies are called, and blind holes with a second diameter are processed at the reference positions, wherein the second diameter is larger than the first diameter. In this example, the second set of drilling assemblies 22 is a second laser beam emitted by the laser head assembly, the spot diameter of the second laser beam being substantially larger than the spot diameter of the first laser beam. S800, determining the interlayer alignment degree of the target circuit board according to the center coordinates of the through holes 13 and the blind holes 14.

The circuit board processing equipment, the circuit board processing control method and the method for detecting the alignment degree of the circuit board sequentially process the through hole and the blind hole at the same reference position, and the interlayer alignment degree of the reference position is determined through the central coordinates of the through hole and the blind hole. On one hand, the method integrates the automatic process of detection and processing, saves cost and time, improves efficiency and precision, and on the other hand, the method can improve the processing precision and quality of the multilayer circuit board by detecting the alignment degree of the target circuit board by the first part.

The foregoing description of the embodiments of the present disclosure has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the technical improvements in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims (10)

1. A circuit board processing control method, characterized by comprising:

Presetting a plurality of reference positions on a target circuit board, wherein each reference position comprises a plurality of layers of reference patterns;

Controlling the circuit board processing equipment to process a plurality of blind holes with second diameters in sequence, wherein the second diameters are larger than the first diameters;

And determining the alignment degree of the multilayer reference graph and the expansion and contraction deviation of the target circuit board according to the center coordinates of the through holes and the blind holes.

2. The method according to claim 1, wherein each layer of the reference pattern corresponds to one blind hole, and the alignment degree is determined based on a coordinate deviation of an average value of center coordinates of the plurality of blind holes from the center coordinates of the through holes.

3. The method for controlling circuit board processing according to claim 2, wherein if the coordinate deviation is within a preset threshold range, the alignment degree is judged to be qualified, and if the coordinate deviation is not within the preset threshold range, the interactive information is output, the correction information is obtained, and the alignment degree of the target circuit board is determined again.

4. The circuit board processing control method according to claim 2, wherein the circuit board processing apparatus includes a vision component that sequentially detects center coordinates of the through hole and the blind hole.

5. The method according to claim 1, wherein the reference pattern includes a metal conductive layer, and the metal conductive layers are identical in shape along a lamination direction of the multi-layered reference pattern.

6. The method according to claim 5, wherein the reference pattern has a cross shape, and at least one section of the metal conductive layer has a circular arc ring structure after the blind hole is processed.

7. The circuit board processing control method according to any one of claims 1 to 6, wherein each of the reference positions includes center coordinates of a plurality of the blind holes, an average value of each of the reference positions is determined based on the plurality of the center coordinates, and a swelling and shrinking deviation of the target circuit board is determined based on the plurality of the average values.

8. The method according to any one of claims 1 to 6, wherein an edge angle of the cutter is 145 degrees or more and 160 degrees or less in the process of processing the blind hole of the second diameter.

9. A method for detecting alignment of a circuit board, comprising:

S100, presetting a reference pattern at a reference position of a multilayer target circuit board;

S200, a first group of drilling components are called, and through holes with a first diameter are processed at the reference positions;

S300, a second group of drilling components are called, and blind holes with a second diameter are processed at the reference position, wherein the second diameter is larger than the first diameter;

s400, determining the interlayer alignment degree of the target circuit board according to the center coordinates of the through holes and the blind holes.

10. A circuit board processing apparatus, comprising:

the method comprises the steps of acquiring a first piece detection task corresponding to a multilayer target circuit board, calling a second group of drilling components, and detecting the top end surface position of the reference position of the target circuit board;

The method comprises the steps of firstly, calling a first group of drilling components, and processing through holes with a first diameter at the reference position;

Determining interlayer alignment degree of the target circuit board and expansion and contraction deviation of the target circuit board according to the center coordinates of the through holes and the blind holes; and correcting the alignment degree according to the expansion and contraction deviation when the alignment degree is not in a preset threshold range.