CN119635028A

CN119635028A - Glass laser chamfering method and laser processing system

Info

Publication number: CN119635028A
Application number: CN202411964832.5A
Authority: CN
Inventors: 高昆; 李成; 蔡新晨
Original assignee: Shenzhen Qinghong Laser Technology Co ltd
Current assignee: Shenzhen Qinghong Laser Technology Co ltd
Priority date: 2024-12-30
Filing date: 2024-12-30
Publication date: 2025-03-18

Abstract

The present invention relates to the field of laser processing technology, and discloses a glass laser chamfering method and a laser processing system, wherein the glass laser chamfering method comprises the following steps: controlling the laser processing point of a cutting laser to be located at a plurality of height positions above the glass in sequence; controlling the glass to make a circumferential movement of a corresponding length at the plurality of height positions of the laser processing point, so that microcracks are formed on the circumferential side of the glass; and cracking the glass along the path direction of the microcracks, so that a chamfer is formed on the circumferential side of the glass. The glass laser chamfering method of the present invention can improve the processing quality of glass chamfering and reduce the production cost of glass chamfering.

Description

Glass laser chamfering method and laser processing system

Technical Field

The invention relates to the technical field of laser processing, in particular to a glass laser chamfering method and a laser processing system.

Background

Because of the high-speed development and rapid demand of the current markets of electronic consumption, automobiles and the like, more display screens adopt glass as a display screen or a touch screen, and the glass chamfering not only can lead the display screen to be smooth, beautiful and safe, but also can reach higher precision, so that the market of the glass chamfering machine is also becoming larger and larger. Because the laser machining efficiency is high, the stability is good, the maintenance is convenient, and the mechanical chamfering machine is basically replaced by the laser chamfering machine at present.

In the related technology of glass laser chamfering, glass is placed on a lifting platform to lift, and the periphery of the glass is scanned by a laser galvanometer, so that the glass has different scanning widths corresponding to different lifting heights, and micro cracks are formed on the glass preliminarily. Then, the glass is broken along the direction of the microcrack path by a breaking device, so that a chamfer is formed on the peripheral side of the glass. However, since the scanning width of the laser galvanometer is limited, the glass with a larger diameter cannot be chamfered.

Disclosure of Invention

The invention aims to provide a glass laser chamfering method which aims to chamfer and score micro-cracks on glass in a platform movement mode, so that glass with larger diameter can be chamfered.

In order to achieve the above purpose, the glass laser chamfering method comprises the following steps of controlling laser processing points of a cutting laser to be sequentially located at a plurality of height positions above glass, controlling the glass to perform circumferential movement with corresponding lengths when the glass is respectively located at the plurality of height positions of the laser processing points, so that microcracks are formed on the periphery of the glass, and splitting the glass along the path direction of the microcracks, so that chamfering is formed on the periphery of the glass.

Optionally, the step of controlling the laser processing points of the cutting laser to be sequentially located at a plurality of height positions above the glass comprises the steps of controlling the laser processing points to be located at initial processing positions of the glass, obtaining a first trigger signal, wherein the first trigger signal is a signal for controlling the glass to perform a preset end position when performing circumferential motion with a corresponding length, and controlling the laser processing points to rise by a preset distance value according to the first trigger signal.

Optionally, before the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, controlling the cutting laser to stop emitting light according to the first trigger signal.

Optionally, after the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, a second trigger signal is obtained, wherein the second trigger signal is a signal for controlling the glass to perform a preset initial position when performing circumferential movement of a corresponding length, and the cutting laser is controlled to re-emit light according to the second trigger signal.

Optionally, the step of controlling the glass to perform circumferential movement of corresponding lengths when the glass is at a plurality of the height positions of the laser processing point respectively so that microcracks are formed on the circumferential side of the glass comprises the steps of controlling the glass to perform circumferential movement of the N-th height position according to a first track and controlling the glass to perform circumferential movement of the (n+1) -th height position according to a second track, wherein the length of the second track is smaller than that of the first track.

Optionally, the step of controlling the glass to perform circumferential movement of the (n+1) th height position on a second track further comprises controlling the glass to perform circumferential movement of the (n+2) th height position on a third track, wherein a distance value between the first track and the second track is equal to a distance value between the second track and the third track.

Optionally, the step of cracking the glass along the path direction of the microcracks to form chamfers on the glass comprises the steps of setting a heating path according to the path direction, and controlling a heating laser to emit light along the heating path so that the microcracks are heated to expand and then shrink, and then the chamfers are formed on the glass cracking pieces.

The invention further provides a laser processing system, the laser processing system adopts the glass laser chamfering method, the laser processing system comprises a two-dimensional translation module, a cutting laser and a splitting component, the two-dimensional translation module is provided with a translation platform, the translation platform is used for placing glass so as to drive the glass to do circumferential motion, the cutting laser and the two-dimensional translation module are arranged at intervals in the vertical direction, the cutting laser comprises a focusing mirror, the light emergent focal point of the focusing mirror is used for carrying out focusing processing on the glass, the height position of the light emergent focal point on the glass is adjustable so as to guide the glass to form microcracks in cooperation with the translation platform, and the splitting component is arranged at intervals with the two-dimensional translation module and the cutting laser so as to split the glass along the path direction of the microcracks, so that the glass forms the chamfer.

Optionally, the cutting laser further comprises a lifting shaft, and the lifting shaft is used for driving the focusing mirror to move up and down so as to adjust the height position of the emergent light focus on the glass.

Optionally, the breaking assembly comprises a heating laser and a heating table, the heating laser and the heating table are arranged at intervals, the heating table is used for placing the glass, the heating laser is used for carrying out laser heating on the micro-cracks so as to enable the micro-cracks to be heated and expanded, and after the micro-cracks shrink, the glass breaking is formed with the chamfer.

According to the technical scheme, glass is placed on a platform of a cutting laser, laser processing points of the cutting laser are controlled to be sequentially located at a plurality of height positions above the glass, the glass is controlled to perform circumferential movement with corresponding lengths at the height positions respectively so that microcracks are formed on the periphery of the glass, and the glass is split along the path direction of the microcracks so that chamfers are formed on the periphery of the glass.

Compared with a mode of chamfering glass cutting through the laser vibrating mirror matched with the lifting platform, the limitation of the scanning breadth of the laser vibrating mirror can not chamfer glass with larger size. According to the scheme, the glass is controlled to do circumferential movement so as to realize laser edge drawing of the cutting laser on the periphery of the glass, so that the glass is not limited by the scanning breadth limitation of the laser vibrating mirror, and chamfering of the glass with a larger ruler diameter can be realized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic flow chart of an embodiment of the glass laser chamfering according to the present invention;

FIG. 2 is a schematic diagram of a laser processing system according to an embodiment of the present invention;

FIG. 3 is a schematic view of an outline of an embodiment of the glass chamfering process of the present invention.

Reference numerals illustrate:

the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear are used in the embodiments of the present invention) are merely for explaining the relative positional relationship, movement conditions, and the like between the components in a certain specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are changed accordingly.

In the present invention, unless explicitly specified and limited otherwise, the terms "connected," "fixed," and the like are to be construed broadly, and for example, "fixed" may be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout is meant to include three side-by-side schemes, for example, "a and/or B", including a scheme, or B scheme, or a scheme that is satisfied by both a and B. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

Because of the high-speed development and rapid demand of the current markets of electronic consumption, automobiles and the like, more display screens adopt glass as a display screen or a touch screen, and the glass chamfering not only can lead the display screen to be smooth, beautiful and safe, but also can reach higher precision, so that the market of the glass chamfering machine is also becoming larger and larger.

The common chamfering treatment mode mainly comprises mechanical polishing and chemical corrosion and other methods. Dust is generated in the machining process of the mechanical polishing mold, secondary pollution of glass is caused, the edges of the glass are cracked, the yield of products is low, and cooling liquid is needed to be cooled in the machining process. Toxic and volatile hydrofluoric acid is needed in the chemical corrosion processing process, so that the requirements on production conditions are high, and the waste liquid causes environmental pollution. In contrast, the laser chamfering device has the advantages of high laser processing efficiency, good stability and convenient maintenance, and is widely used at present.

In view of the above problems, the invention provides a glass laser chamfering method, which aims to chamfer and score a micro-crack on glass 6 in a platform movement mode, so that glass 6 with a larger diameter can be chamfered.

Referring to fig. 1 to 3, fig. 2 is a schematic flow chart of an embodiment of a glass laser chamfering method according to the present invention, the glass laser chamfering method includes the following steps:

Step S10, controlling the laser processing point of the cutting laser 3 to be located at a plurality of height positions above the glass 6 in sequence.

And step S20, controlling the glass 6 to perform circumferential movement with corresponding lengths when the glass 6 is at a plurality of height positions of the laser processing point respectively, so that microcracks are formed on the circumferential side of the glass 6.

Before the laser cutting process, the glass 6 is placed on the translation stage 15 of the cutting laser 3. Other transparent brittle materials besides glass 6 are also possible, and thus other transparent brittle materials related to the chamfering method of glass 6 of the present application are also within the scope of the present application. The stage is a laser cutting stage for placing the glass 6, which can realize movement of the glass 6 in the X-axis and Y-axis directions. An adsorption component can be arranged on the platform, and the adsorption component is utilized to realize the adsorption fixation of the glass 6.

The beam of the cutting laser 3 for processing chamfer is Gaussian beam focused by the objective lens, and the focusing light spot is 1-2um. The laser processing point is a processing point at which the glass 6 is irradiated with laser light, and may be desirably a laser focus by default. One of the advantages of laser cutters is the high energy density of the beam, so the focal spot diameter is as small as possible to produce very small kerfs. Because the smaller the focal depth of the focusing lens, the smaller the diameter of the focal spot. For high quality, high precision cuts, the effective depth of focus is also related to the lens diameter and the material being cut, so it is important to control the position of the focal point and the surface of the material being cut.

In one embodiment of adjusting the height position of the laser processing point, the adjustment can be performed by adjusting the height position of the focal lens, or the cutting laser 3 as a whole can be lifted to change the height position of the light emitting point of the cutting laser 3.

In this embodiment, when the laser processing point is located at a specific height position above the glass 6, the glass 6 moves circumferentially by a corresponding length, thereby scribing the periphery of the glass 6. Similarly, by changing the height position of the laser processing point and correspondingly changing the length of the glass 6 doing circumferential movement, chamfering and scribing can be achieved on the glass 6, so that micro cracks are primarily formed on the glass 6.

It should be noted that, the present embodiment does not limit the motion process of the chamfering track, and all the processing modes of performing peripheral laser cutting on the glass 6 to form the chamfer by the glass laser chamfering method fall within the protection scope of the present application.

And step S30, breaking the glass 6 along the path direction of the microcracks so that chamfers are formed on the periphery of the glass 6.

The glass 6 may be broken along the path direction of the micro-crack due to the effect of thermal expansion and contraction by heating the micro-crack of the glass 6, so as to form a chamfer.

According to the technical scheme, glass 6 is placed on a platform, laser processing points of a cutting laser 3 are controlled to be sequentially located at a plurality of height positions above the glass 6, the glass 6 is controlled to perform circumferential movement with corresponding lengths at the plurality of height positions respectively so that microcracks are formed on the periphery of the glass 6, and the glass 6 is split along the path direction of the microcracks so that chamfers are formed on the periphery of the glass 6.

In the chamfering process of the glass 6 by laser, the processing tool is not in direct contact with the glass 6, dust generated by mechanical chamfering is not generated, the phenomenon of cracking of the edge of the glass 6 caused by mutual friction and contact is not generated, the product yield is high, natural cooling is adopted for cooling in the processing process, and cooling liquid is not needed for cooling.

Compared with a mode of cutting and chamfering glass 6 through the laser vibrating mirror matched with the lifting platform, the limitation of the scanning breadth of the laser vibrating mirror can not chamfer glass 6 with a larger diameter. According to the scheme, the glass 6 is controlled to perform circumferential movement so as to realize laser edge drawing on the periphery of the glass 6 by the cutting laser 3, so that the glass 6 with a larger ruler diameter can be chamfered without being limited by the scanning width of a laser vibrating mirror.

Compared with the laser scanning galvanometer, the laser processing point has larger light spot, and when the glass 6 is subjected to laser chamfering and scribing, the glass 6 is easy to break. The laser processing point of the cutting laser 3 has smaller light spots, which is beneficial to realizing focusing processing on the glass 6 and avoids edge breakage of the glass 6 caused by larger processing light spots.

In an embodiment of the glass chamfering method, the step of controlling the laser processing points of the cutting laser 3 to be located at a plurality of height positions above the glass 6 sequentially includes controlling the laser processing points to be located at initial processing positions of the glass 6, acquiring a first trigger signal, wherein the first trigger signal is a signal for controlling the glass 6 to perform a preset end position when doing circumferential motion of a corresponding length, and controlling the laser processing points to rise by a preset distance value according to the first trigger signal.

The initial processing station is an initial processing position of the glass 6 by a laser processing point, and is generally located at a position above the bottom surface of the glass 6, so as to realize chamfer scribing on the glass 6 from bottom to top. The laser processing points are sequentially increased by a preset distance value on the basis of the initial processing station, and the circumference of the circumferential movement of the glass 6 is reduced by a preset length value. By locating the laser machining point at the starting point of the interpolation motion, a stepped machining of the chamfer of the glass 6 is thus facilitated.

In one embodiment of determining that the glass 6 completes the circumferential movement for the preset number of times, the glass 6 is driven to move by using the linear motor, the driving stroke value of the linear motor is monitored, and then the movement stroke of the glass 6 is determined, so as to determine whether the glass 6 completes the circumferential movement. Correspondingly, by planning a processing track on the processing layer of the translation platform 15, the preset end point position can be considered as the final position when the linear motor drives the glass 6 to do circumferential movement of a corresponding length through the translation platform 15.

The preset times for controlling the glass to perform circumferential movement with the corresponding length can be one time, namely at least one circle of the chamfer angle of the glass 6 scanned by the laser processing point is ensured, and the preset times for controlling the glass 6 to perform circumferential movement for a plurality of times along the corresponding circumference can also be controlled.

The specific acquisition process of the preset distance value, namely the height value of each rise of the laser processing point, comprises the steps of determining the length value of the right-angle edge of the chamfer according to the thickness value and the chamfer angle value of the glass 6, dividing the length value of the right-angle edge by the distance value between two adjacent lines of the glass 6 moving circumferentially to acquire the number of scanning turns, and dividing the thickness value of the glass 6 by the number of scanning turns to acquire the preset distance value.

In this embodiment, after the laser processing point performs the circumferential scanning processing for the preset times on the glass 6, the laser processing point is correspondingly lifted by a preset distance value, so as to implement the circle-by-circle processing for the glass 6 along the height direction.

In an embodiment of the glass laser chamfering method of the present invention, before the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, the step of controlling the cutting laser 3 to stop light emission according to the first trigger signal is further included.

In this embodiment, during the process of raising the laser processing point, the cutting laser 3 is controlled to stop light emission, so that long-time light emission to a single position of the glass 6 is avoided, and the quality of chamfer scribing of the glass 6 is prevented from being affected.

In an embodiment of the glass laser chamfering method, after the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, a second trigger signal is obtained, wherein the second trigger signal is a signal for controlling the glass 6 to perform a preset initial position in a corresponding length circumferential motion, and the cutting laser 3 is controlled to re-emit light according to the second trigger signal.

The preset initial position can be considered as an initial position when the linear motor drives the glass 6 to perform circumferential movement with a corresponding length through the translation platform 15 by planning a processing track on a processing layer of the translation platform 15. Alternatively, if the translation stage 15 moves first and then the cutting laser 3 emits light, there may be several processing points on the processed track of the glass 6 corresponding to the circumferential length that are not processed, so that the compensation length may be set to make the glass 6 run several more points before stopping the circumferential movement.

In one embodiment of determining the height variation value of the laser processing point, the glass 6 is driven by the linear motor to lift, and the driving stroke value of the linear motor is monitored, so as to determine the height variation value of the laser processing point.

In this embodiment, when it is detected that the glass 6 is at the preset initial position during the circumferential movement of the corresponding length, and after the laser processing point moves to the next position by the preset distance value, the cutting laser 3 is controlled to re-emit light to perform the chamfering cutting processing on the glass 6. Therefore, the light-emitting signal of the cutting laser 3 is given according to the movement of the translation platform 15, when the translation platform 15 moves according to the track of the processing layer, the cutting laser 3 emits light, and the translation platform 15 turns off the light after completing the circumferential movement of the corresponding length according to the track of the processing layer, so that the movement coordination of the cutting laser 3 and the translation platform 15 is guaranteed, and the high-efficiency chamfering of the glass 6 is realized.

In an embodiment of the glass chamfering method, the step of controlling the glass 6 to perform circumferential movements of corresponding lengths at a plurality of height positions of the laser processing point, respectively, so that microcracks are formed on the peripheral side of the glass 6 includes controlling the glass 6 to perform circumferential movements of the nth height position with a first track, and controlling the glass 6 to perform circumferential movements of the (n+1) th height position with a second track, wherein the length of the second track is smaller than that of the first track.

In this embodiment, when the laser processing points are raised upward in sequence and located at different processing positions, the glass 6 is controlled to move in the circumferential direction with a reduced length value, so as to perform chamfering scribing of the glass 6.

In an embodiment of the glass laser chamfering method, the step of controlling the glass 6 to perform the circumferential movement of the n+1 height positions on the second track further comprises controlling the glass 6 to perform the circumferential movement of the n+2 height positions on the third track, wherein the distance value between the first track and the second track is equal to the distance value between the second track and the third track.

The distance value is a length value between two adjacent wires of the glass 6 which do circumferential movement each time, and is related to the diameter value of the laser spot.

In this embodiment, after the laser processing point moves to the next position by the preset distance value and re-emits light, the circumference of the glass 6 doing the circumferential movement is reduced by the corresponding control glass 6 by the equal distance value, so that the homogenization processing of the laser chamfer of the glass 6 can be realized.

It should be noted that, referring to fig. 3, in the process of making the glass 6 perform circumferential movement, by setting a length value between two adjacent wires and correspondingly calculating a height value of each elevation of the laser processing point, the glass 6 can be chamfered at any angle.

In an embodiment of the glass chamfering method, the step of cracking the glass 6 along the path direction of the micro-cracks to form chamfer angles on the glass 6 comprises the steps of setting a heating path according to the path direction, controlling a heating laser to emit light along the heating path to enable the micro-cracks to expand after being heated and contracted again, and forming chamfer angles on the glass 6 cracks.

The heating laser is a laser for performing light-emitting heating on the workpiece, for example, the heating laser can be selected from a CO ₂ laser by utilizing high absorption efficiency of the glass 6 material in a far infrared band.

In this embodiment, compared with other heating modes, the heating laser emits light along the heating path, so that the micro-cracks of the glass 6 are heated, accurate heating of the micro-cracks can be better realized, edge breakage of the glass 6 is avoided, and the forming quality of the chamfer is affected.

Referring to fig. 2, the invention further provides a laser processing system 10, the laser processing system 10 applies the glass laser chamfering method, the laser processing system 10 comprises a two-dimensional translation module 1, a cutting laser 3 and a splitting component, the two-dimensional translation module 1 is provided with a translation platform 15, the translation platform 15 is used for placing the glass 6 so as to drive the glass 6 to do circumferential motion, the cutting laser 3 is arranged at intervals in the vertical direction with the two-dimensional translation module 1, the cutting laser 3 comprises a focusing mirror 35, the light-emitting focal point of the focusing mirror 35 is used for focusing the glass 6, the height position of the light-emitting focal point of the focusing mirror 35 is adjustable so as to guide the glass 6 to form micro cracks in cooperation with the translation platform 15, and the splitting component is arranged at intervals with the two-dimensional translation module 1 and the cutting laser 3 and is used for splitting the glass 6 along the path direction of the micro cracks so as to form the chamfer on the glass 6.

Wherein, laser beam machining system 10 still includes frame 5, and two-dimensional translation module 1 includes first straight line module 11 and second straight line module 13, and first straight line module 11 is located in frame 5, and the removal end of first straight line module 11 is located to second straight line module 13, and the removal end of second straight line module 13 is equipped with translation platform 15, is equipped with glass 6 on the translation platform 15 to drive glass 6 and carry out the circumferential motion of two-dimensional direction. In order not to influence the shielding of the clamp on the laser processing of the glass 6, the adsorption component can be arranged on the translation platform 15 to adsorb and fix the glass 6, so that the glass 6 laser is ensured to cut and process the peripheral side of the glass 6.

The cutting laser 3 comprises a laser generator 31, a light guide assembly 33 and a focusing mirror 35, wherein laser generated by excitation of the laser generator 31 is guided by the light guide assembly 33, focused by the focusing mirror 35 to generate an optical focus, and the optical focus is positioned on the glass 6 of the translation platform 15 for processing. In an embodiment in which the height position of the light-emitting focal point on the glass 6 is adjustable, a lifting platform is arranged on the frame 5, and the cutting laser 3 is driven to move up and down by the lifting platform, so that the height position of the light-emitting focal point is changed.

The breaking assembly is used for breaking the glass 6, for example, the breaking assembly can be used for heating and breaking by a laser or for mechanically breaking by a breaking machine.

Referring to fig. 2, in one embodiment of the present invention, the cutting laser 3 further includes a lifting shaft 37, and the lifting shaft 37 is used to drive the focusing mirror 35 to move up and down, so as to adjust the height position of the light-emitting focal point on the glass 6.

In this embodiment, the objective lens is driven to lift by the lifting shaft 37 to adjust the light-emitting focal point, so that the light-emitting focal point can be quickly adjusted.

Referring to fig. 2, in one embodiment of the present invention, the laser heating assembly includes a heating laser and a heating stage, the heating laser and the heating stage are spaced apart, the heating stage is used for placing the glass 6, the heating laser is used for performing laser heating on the micro-cracks so as to make the micro-cracks expand when heated, and after the micro-cracks shrink, the glass 6 cracks form the chamfer.

In summary, the laser processing system 10 of the present invention can implement the glass laser chamfering operation, and the popularization and application of the glass laser chamfering method and the laser processing system 10 have positive significance for improving the processing quality of glass chamfering and reducing the production cost thereof.

The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.

Claims

1. A glass laser chamfering method, characterized in that the glass laser chamfering method comprises the steps of:

controlling laser processing points of a cutting laser to be sequentially positioned at a plurality of height positions above the glass;

controlling the glass to perform circumferential movement with corresponding lengths when the glass is at a plurality of height positions of the laser processing point respectively, so that microcracks are formed on the periphery of the glass;

and splitting the glass along the path direction of the microcracks so as to form chamfers on the periphery of the glass.

2. The glass laser chamfering method according to claim 1, wherein the step of controlling the laser processing point of the cutting laser to be located at a plurality of height positions sequentially above the glass comprises:

Controlling the laser processing point to be positioned at an initial processing station of the glass;

Acquiring a first trigger signal, wherein the first trigger signal is a signal for controlling a preset end position of the glass to perform circumferential movement with a corresponding length;

and according to the first trigger signal, controlling the laser processing point to rise by a preset distance value.

3. The glass laser chamfering method according to claim 2, wherein the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal further comprises:

and controlling the cutting laser to stop light emission according to the first trigger signal.

4. The glass laser chamfering method according to claim 3, wherein the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal further comprises:

Acquiring a second trigger signal, wherein the second trigger signal is a signal for controlling a preset initial position of the glass to perform circumferential movement with a corresponding length;

and controlling the cutting laser to re-emit light according to the second trigger signal.

5. The method of laser chamfering glass according to any one of claims 1 to 4, wherein the step of controlling the glass to perform circumferential movements of corresponding lengths at a plurality of the height positions of the laser processing point, respectively, so that microcracks are formed on the peripheral side of the glass includes:

controlling the glass to perform circumferential movement of the Nth height position according to a first track;

and controlling the glass to perform circumferential movement of the (n+1) th height position on a second track, wherein the length of the second track is smaller than that of the first track.

6. The glass laser chamfering method according to claim 5, wherein the step of controlling the glass to perform the circumferential movement of the n+1th height position in the second trajectory further comprises:

and controlling the glass to perform circumferential movement of the (n+2) th height position in a third track, wherein the distance value between the first track and the second track is equal to the distance value between the second track and the third track.

7. The glass laser chamfering method according to any one of claims 1 to 4, wherein the step of breaking the glass along the path direction of the microcracks to form the glass with a chamfer includes:

setting a heating path according to the path direction;

And controlling the heating laser to emit light along the heating path so that the glass splinter forms a chamfer after the microcracks are heated and expanded and then contracted.

8. A laser processing system, wherein the laser processing system applies the glass laser chamfering method according to any one of claims 1 to 7, the laser processing system comprising:

The two-dimensional translation module is provided with a translation platform, and the translation platform is used for placing the glass so as to drive the glass to do circumferential motion;

The cutting laser is arranged at intervals in the vertical direction with the two-dimensional translation module, the cutting laser comprises a focusing lens, a light emergent focal point of the focusing lens is used for focusing the glass, the height position of the light emergent focal point on the glass is adjustable so as to guide the glass to form microcracks in cooperation with the translation platform, and

And the splitting assembly is arranged at intervals with the two-dimensional translation module and the cutting laser and is used for splitting the glass along the path direction of the microcracks so as to form the chamfer on the glass.

9. The laser processing system of claim 8, wherein the cutting laser further comprises a lift shaft for driving the focusing mirror up and down to adjust the height position of the light exit focal point on the glass.

10. The laser processing system of claim 8, wherein the breaking assembly comprises a heating laser and a heating stage, the heating laser and the heating stage are arranged at intervals, the heating stage is used for placing the glass, the heating laser is used for carrying out laser heating on the micro-cracks so as to enable the micro-cracks to expand under heating, and after the micro-cracks shrink, the glass breaking is formed with the chamfer.