Detailed Description
The following detailed description of the present invention is provided in connection with specific embodiments and figures, and it should be noted that, for ease of understanding of the reader and brevity of the drawings, various figures of the present invention depict only a portion of the apparatus and the specific elements of the drawings are not drawn to actual scale. In addition, the number and size of the elements in the drawings are illustrative only and are not intended to limit the scope of the invention.
Certain terms are used throughout the description and claims to refer to particular components. Those of ordinary skill in the art will appreciate that electronic device manufacturers may refer to a same component by different names. The present invention is not intended to distinguish between components that differ in function but not name. In the description and claims of the present invention, the words "comprising" and "including" are open-ended terms, and therefore should be interpreted to mean "including, but not limited to. When the terms "comprises," "comprising," "includes," "including," and/or "having" are used in the present specification, they specify the presence of stated features, regions, steps, operations, and/or elements, but does not preclude the presence or addition of one or more other features, areas, steps, operations, elements and/or groups thereof.
When an element or film is referred to as being "on" or "connected to" another element or film, it can be directly on or connected to the other element or film or intervening elements or films may be present therebetween. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or film, there are no intervening elements or films present therebetween.
The directional terms, such as "upper", "lower", "front", "rear", "left", "right", etc., are merely directions with reference to the drawings. Thus, the directional terminology is used for purposes of illustration and is not intended to be limiting of the invention.
The terms "about," "equal," or "identical," "substantially," or "substantially" are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1%, or 0.5% of the given value or range.
The use of ordinal numbers such as "first," "second," and the like in the description and in the claims is used for modifying an element, and is not by itself intended to exclude the presence of any preceding ordinal number, nor does it represent the order in which an element is ordered from another element, or the order in which it is manufactured, and the use of such ordinal numbers merely serves to distinguish one element having a certain name from another element having a same name. The same words may not be used in the claims and the description, whereby a first element in the description may be a second element in the claims.
The electronic device of the present invention may include a panel, which may be applied to a display device, a light emitting device, a backlight device, an antenna device, a sensing device or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous type display device or a self-luminous type display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat energy or ultrasonic waves, but is not limited thereto. The electronic device may include an electronic component. The electronic devices may include passive devices and active devices such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may comprise a light emitting diode or a photodiode. The light emitting diode may include, for example, but not limited to, an Organic LIGHT EMITTING Diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro LED, or a quantum dot LED. The splicing device can be, for example, a display splicing device or an antenna splicing device, but is not limited to this. It should be noted that the electronic device may be any of the above arrangements, but is not limited thereto.
It is to be understood that features of the several different embodiments may be substituted, rearranged, and combined to accomplish other embodiments without departing from the spirit of the invention.
Fig. 1 is a schematic diagram of an electronic device mounted on a mobile carrier according to an embodiment of the invention. As shown in fig. 1, the electronic device ED includes a first region R1, a second region R2, and a functional region R3 disposed between the first region R1 and the second region R2. The electronic device ED is suitable for being mounted on a mobile vehicle MV having a driver seat DS and a passenger seat PS, which are arranged in a first direction D1. For example, the moving vehicle MV may be a vehicle, and the driver seat DS and the auxiliary seat PS are disposed side by side along a first direction D1, wherein the first direction D1 may be parallel to a direction viewed by a window DSW adjacent to the driver seat DS toward another window PSW adjacent to the auxiliary seat PS, or may be parallel to a line connecting a cushion center (not shown) of the driver seat DS and a cushion center (not shown) of the auxiliary seat PS. The electronic device ED may be mounted on any suitable device in a center console, a storage box (or glove box), or a mobile vehicle MV. The electronic device ED includes a first panel 110, a second panel 120, and a cover layer 130. The first panel 110 overlaps the first region R1, the second panel 120 overlaps the second region R2, and the cover layer 130 is disposed on the first panel 110 and the second panel 120, for example, the cover layer 130 may cover the first panel 110 and the second panel 120 at the same time. In other words, the cover 130 would be located between the first panel 110 and the driver seat DS and between the second panel 120 and the secondary driver seat PS. The first region R1 overlapping the first panel 110 and the second region R2 overlapping the second panel 120 in the electronic device ED can provide corresponding functions, such as (but not limited to) the first panel 110 and the first region R1, and the second panel 120 and the second region R2 can be respectively used for displaying images, emitting light, receiving/transmitting signals, etc. The cover layer 130 may include, for example, glass, transparent material layers, and/or optical layers, and such film layers are disposed in a manner that does not affect the function and/or action of the first panel 110 and the second panel 120.
The functional region R3 is disposed adjacent between the first region R1 and the second region R2 in the first direction D1. The functional region R3 is a deformable (e.g., bendable or flexible) region and/or a region that can be used to dispose one or more functional elements (e.g., functional element 170 shown in fig. 7A). The functional region R3 has a central axis CL passing through the center of the functional region R3, and the central axis CL of the functional region R3 may extend along a second direction D2, such that the long axis direction of the functional region R3 is parallel to the second direction D2, wherein the second direction D2 is different from the first direction D1, and in an embodiment, the second direction D2 is perpendicular to the first direction D1. At least one of the first panel 110 and the second panel 120 may not overlap the functional region R3. For example, as shown in fig. 1, the first panel 110 and the second panel 120 may be arranged along the first direction D1, and the first panel 110 and the second panel 120 do not overlap the functional region R3. The cover layer 130 may extend in the first direction D1 and overlap the first panel 110 and the second panel 120 in the third direction D3, and a partial area of the cover layer 130 may correspond to the functional area R3, i.e., the first panel 110 and the second panel 120 may share the same cover layer 130. The third direction D3 is different from the first direction D1 and the second direction D2, in an embodiment, the third direction D3 may be parallel to a normal direction of a surface of the cover layer 130 facing the driving seat DS or to a top view direction of the electronic device ED, and the third direction D3 is perpendicular to the first direction D1 and the second direction D2. The first panel 110 and the second panel 120 are separated and discontinuously disposed, so that the problems of bright lines or damage caused by bending the functional region R3 can be reduced, and the influence on driving is reduced.
According to the embodiment shown in fig. 1, the driver seat DS has a central axis DCL passing through the center of the driver seat DS, and the secondary driver seat PS has a central axis PCL passing through the center of the secondary driver seat PS. In the first direction D1, a first distance H1 is provided between the center of the functional region R3 (indicated by the central axis CL) and the center of the driver seat DS (indicated by the central axis DCL), a second distance H2 is provided between the center of the functional region R3 and the center of the sub-driver seat PS (indicated by the central axis PCL) in the first direction D1, and the first distance H1 and the second distance H2 are not equal. The center of the functional region R3 may be closer to the driver seat DS or closer to the secondary driver seat PS, and the functional region R3 may be adjusted according to the state of the mobile carrier MV or the requirement of the user, for example (but not limited to) the functional region R3 is a bendable region of the electronic device ED. Therefore, the usage mode of the electronic device ED can be correspondingly adjusted according to different states or requirements. In some embodiments, the ratio of the first distance H1 to the second distance H2 may be in a range of more than 0.2 and less than 5 (i.e. 0.2< H1/H2< 5), and limiting the difference between the first distance H1 and the second distance H2 to the above range may improve the stability of the structure.
In some embodiments, the user can manually or acoustically adjust the electronic device ED to change the angle of the portion of the cover layer 130 corresponding to the functional region R3. In detail, in the first state, as shown in fig. 1, the portion of the cover layer 130 corresponding to the functional region R3 is not bent but is a horizontal plane, so that the electronic device ED can be viewed or used by both the driver at the driver seat DS and the passenger at the passenger seat PS. In the second state, the electronic device ED may be adjusted to bend a portion of the cover layer 130 corresponding to the functional region R3, and an angle is formed between a portion of the cover layer 130 corresponding to the first region R1 and a portion of the cover layer 130 corresponding to the second region R2 (for example, refer to fig. 2), so that the electronic device ED is mainly used for the co-driver to watch or use, and in an embodiment, the second state may be, for example (but not limited to), a case of using the electronic device ED by the co-driver for entertainment. Or in a second state, the electronic device ED may be adjusted toward driving such that the electronic device ED is primarily intended for viewing or use by driving, which in one embodiment may be, for example (but not limited to) when driving using the electronic device ED for navigation or without a person taking the secondary drive seat PS.
In some embodiments, the functional region R3 may be adjusted according to the state of the mobile carrier MV to change the angle of the portion of the cover 130 corresponding to the functional region R3. In detail, in the first state, as shown in fig. 1, the portion of the cover layer 130 corresponding to the functional region R3 is not bent, so that both the driver and the co-driver can view or use the electronic device ED. When the mobile carrier MV is driving, the electronic device ED can be adjusted to a second state, such that the portion of the cover layer 130 corresponding to the functional region R3 is bent (for example, refer to fig. 2), so that the electronic device ED is mainly used for co-driving to watch or use, thereby reducing the influence of the electronic device ED on driving and improving driving safety.
Fig. 2 is a schematic diagram of an electronic device mounted on a mobile carrier according to another embodiment of the invention. As shown in fig. 2, the mobile carrier MV may include a sensing device SE, which may be used to sense ambient light (e.g., sunlight), and the sensing device SE may include, for example (but not limited to), a camera. According to the sensing result of the sensing device SE, the functional region R3 may be adjusted to change the angle of the portion of the cover layer 130 corresponding to the functional region R3. In detail, when the sensing device SE senses that the ambient light may cause the electronic device ED to reflect light, the portion of the cover layer 130 corresponding to the functional region R3 may be adjusted to bend, so as to improve the reflection problem caused by the ambient light shining on the surface of the electronic device ED, thereby reducing the interference of the reflected light on driving and/or co-driving. In one embodiment, the electronic device ED may be adjusted to face the co-driver, and in another embodiment, the electronic device ED may be adjusted to face the driver to improve the interference caused by reflection of ambient light.
Fig. 3 is a schematic cross-sectional view illustrating an electronic device mounted on a mobile carrier according to another embodiment of the invention. Referring to fig. 1 and 3, the mobile carrier MV may include a support device 200 and an airbag module 300, and the support device 200 is adjacent to the airbag module 300, and the electronic device ED may be mounted on the support device 200. The support device 200 may be, for example, any suitable device in a center console, a storage box (or glove box), or a mobile vehicle MV. The electronic device ED may be mounted on the support device 200 via the connection member 210, and the connection member 210 may be, for example (but not limited to), an adhesive layer or other suitable fixing member. According to the embodiment shown in fig. 3, the first panel 110 may be connected to the cover layer 130 by an adhesive layer 140, and the second panel 120 may be connected to the cover layer 130 by an adhesive layer 142. The airbag module 300 has an inflation member (inflator) 310 and an airbag (airbag) 320, and the airbag 320 can be stacked in the airbag module 300 without inflation of the airbag 320, and the airbag 320 can be inflated by gas generated from the inflation member 310 when the moving vehicle MV is subjected to an external force (e.g., a collision). In some embodiments, the airbag module 300 may also be provided with a cushioning structure 330 on a surface to further provide cushioning functionality.
In the first state, when the airbag 320 is not inflated by the gas, the portion of the cover layer 130 corresponding to the functional region R3 may not be bent (for example, as shown in fig. 1), and the electronic device ED may be disposed on the airbag module 300, for example, the second panel 120 and the cover layer 130 are covered on the airbag module 300 such that the second panel 120 is located between the cover layer 130 and the airbag module 300. In the second state, as shown in fig. 3, when the airbag 320 is inflated by the gas, the airbag 320 can be pushed against the second panel 120 to change the functional region R3 into a bent state, and further the second region R2 of the electronic device ED originally disposed on the airbag module 300 is separated from the airbag module 300 without covering the airbag module 300, and at this time, the first region R1 of the electronic device ED can still be fixed on the supporting device 200 through the connection member 210. With the above-described design, the airbag 320 is not hindered or bumped against the electronic device ED when the gas generated by the inflator 310 is inflated, so that the airbag 320 can be normally inflated, thereby providing the purpose of protecting the passengers in the moving vehicle MV.
Fig. 4 is a schematic top view of an electronic device according to an embodiment of the invention. According to the electronic device ED shown in FIG. 4, in the first direction D1, the first panel 110 may have a length L1, the second panel 120 may have a length L2, and the cover 130 may have a length L3. In the second direction D2, the first panel 110 may have a width W1, the second panel 120 may have a width W2, and the cover 130 may have a width W3. Wherein, the ratio of the length L3 to the width W3 of the cover layer 130 may be greater than the ratio of the length L1 to the width W1 of the first panel 110 (i.e., L3/W3> L1/W1), or the ratio of the length L3 to the width W3 of the cover layer 130 may be greater than the ratio of the length L2 to the width W2 of the second panel 120 (i.e., L3/W3> L2/W2), so that the cover layer 130 may cover both the first panel 110 and the second panel 120 or the cover layer 130 may cover at least one panel. Moreover, the ratio of the length L1 to the width W1 of the first panel 110 may be greater than 2 (i.e., L1/W1> 2), or the ratio of the length L2 to the width W2 of the second panel 120 may be greater than 2 (i.e., L2/W2> 2), i.e., the first panel 110 and/or the second panel 120 may be respectively long panels extending in the first direction D1, so as to be more suitable for being mounted on the mobile carrier MV.
In some embodiments, as shown in fig. 4, the aspect ratio of the first panel 110 may be approximately or the same as the aspect ratio of the second panel 110, or the area of the first panel 110 may be approximately or the same as the area of the second panel 110. For example, the length L1 of the first panel 110 may be approximately or the same as the length L2 of the second panel 120, and the width W1 of the first panel 110 may be approximately or the same as the width W2 of the second panel 120. The ratio of the width W1 of the first panel 110 to the width W3 of the cover 130 may range from greater than 0.5 to less than or equal to 1 (i.e., 0.5< W1/W3. Ltoreq.1). When the ratio (W1/W3) is greater than 1, a part of the panels are not covered by the cover layer 130, so that the risk of damage to the first panel 110 is increased, and when the ratio is less than or equal to 0.5, the cover layer 130 is excessively large to occupy excessive space, thereby increasing the manufacturing cost. In other embodiments, the aspect ratio of the first panel 110 may be different from the aspect ratio of the second panel 110 (e.g., as shown with reference to fig. 1), or the area of the first panel 110 may be different from the area of the second panel 120. As shown in fig. 1, the aspect ratio of the second panel 110 located in front of the secondary driver seat PS may be greater than the aspect ratio of the first panel 110 located in front of the driver seat DS. For example, the length L1 of the first panel 110 may be different from the length L2 of the second panel 120, and the width W1 of the first panel 110 may be approximately or the same as the width W2 of the second panel 120.
In the following, other embodiments of the electronic device of the present invention will be described in detail, and for simplicity of description, the same reference numerals are used to designate the same elements, and the following description mainly refers to the differences between the different embodiments, and the same features will not be repeated. The embodiments of the invention and the embodiments of the invention may be combined and varied with each other.
Please refer to fig. 5A and fig. 5B, and fig. 4 may be combined. Fig. 5A and 5B are schematic cross-sectional views of some embodiments of the electronic device according to the present invention. As shown in fig. 5A and 5B, in the cross-sectional view of the electronic device ED, a portion of the cover layer 130 corresponding to the functional region R3 may have a patterned structure. In detail, in the cross-sectional view of the electronic device ED, the minimum thickness T1 of the portion of the cover layer 130 corresponding to the functional region R3 may be smaller than the minimum thickness T2 of the portion of the cover layer 130 corresponding to at least one of the first region R1 and the second region R2 (i.e., T1< T2). In the cross-sectional view shown in fig. 5A or 5B, the minimum distance measured from one end to the other end of the portion of the cover layer 130 corresponding to the functional region R3 in the third direction D3 may be the minimum thickness T1, and the minimum distance measured from one end to the other end of the portion of the cover layer 130 corresponding to the first region R1 and/or from one end to the other end of the portion of the cover layer 130 corresponding to the second region R2 in the third direction D3 may be the minimum thickness T2. In some embodiments, the minimum thickness T1 may be greater than 100 micrometers (μm), and the minimum thickness T2 may be greater than the minimum thickness T1 (i.e., T2> T1>100 μm) to be more suitable for being mounted on the mobile carrier MV. According to the above structural design, the partial covering layer 130 on the first panel 110 and corresponding to the first region R1 and the partial covering layer 130 on the second panel 120 and corresponding to the second region R2 can have larger thickness, so as to provide better protection effect for the first panel 110 and the second panel 120. The portion of the cover layer 130 corresponding to the functional region R3 may be thinned and have a smaller thickness when there is no panel to be protected, and may also make the functional region R3 more easily deformed, such as bendable or flexible.
According to the embodiment shown in fig. 5A, the lower side of the portion of the cover layer 130 corresponding to the functional region R3 may be partially removed to be thinned to have the minimum thickness T1, and the thinned portion may extend along the second direction D2 in parallel to the adjacent two sides of the first region R1 and the second region R2. In addition, the first panel 110 may be coupled to the cover layer 130, such as by an adhesive layer 140, and the second panel 120 may be coupled to the cover layer 130, such as by an adhesive layer 142. According to the embodiment shown in fig. 5B, the upper and lower sides of the portion of the cover layer 130 corresponding to the functional region R3 may be partially removed and thinned to have the minimum thickness T1. In addition, the electronic device ED may further optionally include a housing (housing) 150, the cover 130, the first panel 110 and the second panel 120 may be disposed on the housing 150 and connected to the housing 150, and the housing 150 may be used to support and fix the first panel 110 and the second panel 120 to enhance the strength of the electronic device ED. In some embodiments, as shown in fig. 5A or fig. 5B, the thickness of the portion of the cover layer 130 corresponding to the functional region R3 in the third direction D3 may decrease from one end adjacent to the first region R1 toward the center of the functional region R3 and/or may decrease from one end adjacent to the second region R2 toward the center of the functional region R3, in other words, when the thickness of the cover layer 130 begins to decrease, the portion may be regarded as the boundary between the functional region R3 and the first region R1 or the second region R2, and thus, the functional region R3 may be deformed.
Please refer to fig. 6A to 6F. Fig. 6A to 6F are schematic cross-sectional views of other embodiments of the electronic device according to the present invention. As shown in fig. 6A to 6F, the electronic device ED may further include another cover layer 132 and a buffer layer 160 disposed between the cover layer 130 and the first panel 110 and the second panel 120, and is a multi-layer structure. In detail, the cover layer 132 may be disposed on the first panel 110 and the second panel 120, the cover layer 130 is disposed on the cover layer 132, and the buffer layer 160 is disposed between the cover layer 130 and the cover layer 132. The cover layer 132 may include glass, polyimide (PI) or polyethylene terephthalate (polyethylene terephthalate, PET), and the buffer layer 160 may include, but is not limited to, an adhesive, an optically transparent adhesive (OCA), for example. The portion of the buffer layer 160 corresponding to the functional region R3 may have a larger thickness, and the portion of the capping layer 130 and/or the capping layer 132 corresponding to the functional region R3 may have a patterned structure. In the third direction D3, the thickness of the portion of the buffer layer 160 corresponding to the functional region R3 is greater than the thickness of the portion of the buffer layer 160 corresponding to the first region R1 and/or the second region R2, and the thickness of at least one of the portions of the cover layer 132 and the cover layer 130 corresponding to the functional region R3 is smaller than the thickness of the portion thereof corresponding to the first region R1 and/or the second region R2, so that the functional region R3 can be deformed. In the process of the electronic device ED, for example, the cover layer 130, the buffer layer 160 and the cover layer 132 may be combined, and then the combined overall structure is connected to the first panel 110 and the second panel 120 through the adhesive layer 140 and the adhesive layer 142, respectively.
According to the embodiment shown in fig. 6A, the portion of the cover layer 132 corresponding to the functional region R3 may include an arc-shaped recess region GR and have a smaller thickness than the portion of the cover layer 132 corresponding to the first region R1 and/or the second region R2, and the portion of the buffer layer 160 corresponding to the functional region R3 may include a protrusion PR filling the recess region GR and have a larger thickness. According to the embodiment shown in fig. 6B, the portion of the cover layer 130 corresponding to the functional region R3 may include an arc-shaped recess region GR and have a smaller thickness than the portion of the cover layer 130 corresponding to the first region R1 and/or the second region R2, and the portion of the buffer layer 160 corresponding to the functional region R3 may include a protrusion PR filling the recess region GR and have a larger thickness. According to the embodiment shown in fig. 6C, the portion of the cover layer 132 corresponding to the functional region R3 may include a recess region GR having a side surface SW and a bottom surface BW connected to the side surface SW and have a smaller thickness than the portion of the cover layer 132 corresponding to the first region R1 and/or the second region R2, and the portion of the buffer layer 160 corresponding to the functional region R3 may include a protrusion PR filling the recess region GR and have a larger thickness. According to the embodiment shown in fig. 6D, the portion of the cover layer 132 corresponding to the functional region R3 may include at least one opening OP, and the portion of the buffer layer 160 corresponding to the functional region R3 may include a protrusion PR filling the opening OP and have a larger thickness. According to the embodiment shown in fig. 6E, the portion of the cover layer 130 corresponding to the functional region R3 may include an arc-shaped concave region GR1 and have a smaller thickness than the portion of the cover layer 130 corresponding to the first region R1 and/or the second region R2, the portion of the cover layer 132 corresponding to the functional region R3 may include an arc-shaped concave region GR2 and have a smaller thickness than the portion of the cover layer 132 corresponding to the first region R1 and/or the second region R2, and the portion of the buffer layer 160 corresponding to the functional region R3 may include a protrusion PR1 and a protrusion PR2 respectively filling the concave region GR1 and the concave region GR2 and have a larger thickness. According to the embodiment shown in fig. 6F, the portion of the cover layer 132 corresponding to the functional region R3 may include a tapered recess GR and have a smaller thickness than the portion of the cover layer 132 corresponding to the first region R1 and/or the second region R2, and the portion of the buffer layer 160 corresponding to the functional region R3 may include a protrusion PR filling the recess GR and having a larger thickness.
Please refer to fig. 7A to 7C. Fig. 7A to 7C are schematic cross-sectional views of still other embodiments of the electronic device according to the present invention. As shown in fig. 7A-7C, the electronic device ED may further include additional cover layers 134 and 136 and an adhesive layer 144 disposed between the cover layer 130 and the first and second panels 110 and 120. In detail, the cover layer 134 may be disposed on the first panel 110, the cover layer 136 may be disposed on the second panel 120, the cover layer 130 may be disposed on the cover layer 134 and the cover layer 136, and the adhesive layer 144 may be disposed between the cover layer 130 and the cover layer 132 and the cover layer 136, wherein the cover layer 134 and the cover layer 136 may be separated from each other. The portion of the cover layer 130 corresponding to the functional region R3 may have a patterned structure such that the thickness of the portion of the cover layer 130 corresponding to the functional region R3 is smaller than the thickness of the portion thereof corresponding to the first region R1 and/or the second region R2 in the third direction D3. In the process of manufacturing the electronic device ED, for example, the cover layer 134 may be connected to the first panel 110 through the adhesive layer 140 and the cover layer 136 may be connected to the second panel 120 through the adhesive layer 142, and then the combined structure may be connected to the cover layer 130 through the adhesive layer 144, or for example, the cover layer 130 may be connected to the cover layer 134 and the cover layer 136 through the adhesive layer 144, and then the combined overall structure may be connected to the first panel 110 and the second panel 120 through the adhesive layer 140 and the adhesive layer 142.
According to the embodiment shown in fig. 7A, the portion of the cover layer 130 corresponding to the functional region R3 may include an arc-shaped recess region GR and have a smaller thickness than the portion of the cover layer 130 corresponding to the first region R1 and/or the second region R2, and the portion of the adhesive layer 144 corresponding to the functional region R3 may include a protrusion PR filling the recess region GR and have a larger thickness. The electronic device ED may also include one or more functional elements 170 that overlap the functional region R3. The functional element 170 may be disposed between the first panel 110 and the second panel 120 and covered by the cover layer 130, and the functional element 170 may be disposed under the cover layer 130 to hide it for improving the overall aesthetic appearance. The functional element 170 may be, for example, a buffer element, a detecting element, a vibrating element, or other elements that can provide suitable functions according to the requirements, which is not limited thereto. The cushioning element may, for example, comprise a damping material to provide a cushioning or impact-resistant effect, the sensing element may comprise a camera to detect an in-vehicle environment or driving condition, and the vibration element may provide a vibration effect to provide feedback, such as feedback of a key, when a user operates with touch or gesture.
According to the embodiment shown in fig. 7B, the portion of the cover layer 130 corresponding to the functional region R3 may include an arc-shaped recess region GR and have a smaller thickness than the portion of the cover layer 130 corresponding to the first region R1 and/or the second region R2, and the portion of the adhesive layer 144 corresponding to the functional region R3 may include a protrusion PR filling the recess region GR and have a larger thickness. Also, the length of the cover layer 130 may be greater than the length of the underlying film layer and/or structure in the first direction D1, i.e., at least one end of the cover layer 130 may extend beyond the first panel 110 and/or the second panel 120 in the first direction D1. The electronic device ED may include one or more functional elements 170, and the functional elements 170 may be disposed below at least one end of the cover layer 130 extending beyond the first panel 110 and/or the second panel 120. For example, reference may be made to the foregoing embodiments for the functional element 170, and the description thereof will be omitted.
According to the embodiment shown in fig. 7C, the portion of the cover layer 130 corresponding to the functional region R3 may include an arc-shaped recess GR and have a smaller thickness than the portion of the cover layer 130 corresponding to the first region R1 and/or the second region R2, and the adhesive layer 144 may be disposed in the first region R1 and the second region R2, but not disposed in the functional region R3 as much as possible. In detail, the adhesive layer 144 may include a separate adhesive layer 144a and an adhesive layer 144b. In the third direction D3, the adhesive layer 144a is disposed between the cover layer 134 and the cover layer 130, and the adhesive layer 144b is disposed between the cover layer 136 and the cover layer 130.
Please refer to fig. 8A and fig. 8B. Fig. 8A is a schematic cross-sectional view of an electronic device according to an embodiment of the invention. Fig. 8B is a schematic top view of the support plate of fig. 8A. As shown in fig. 8A and 8B, the electronic device ED may further include a support plate 180 disposed on a side opposite to the connection sides of the first panel 110 and the second panel 120 and the cover 130 to support the first panel 110 and the second panel 120. In other words, the support plate 180 and the cover 130 are respectively located on opposite sides of the first panel 110 and the second panel 120. The portion of the support plate 180 corresponding to the functional region R3 may include at least one opening 180P, which may facilitate deformation of the functional region R3.
Fig. 9 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention. As shown in fig. 9, the electronic device ED may further include a support plate 180 disposed at a side opposite to the connection sides of the first and second panels 110 and 120 and the cover layer 130. The minimum thickness T3 of the portion of the support plate 180 corresponding to the functional region R3 may be smaller than the minimum thickness T4 of the portion of the support plate 180 corresponding to at least one of the first region R1 and the second region R2 (i.e., T3< T4). The minimum distance measured from one end to the other end of the portion of the support plate 180 corresponding to the functional region R3 in the third direction D3 may be the minimum thickness T3, and the minimum distance measured from one end to the other end of the portion of the support plate 180 corresponding to the first region R1 and/or from one end to the other end of the portion of the support plate 180 corresponding to the second region R2 in the third direction D3 may be the minimum thickness T4. According to the above structural design, the partial support plate 180 having the first panel 110 disposed thereon and corresponding to the first region R1 and the partial support plate 180 having the second panel 120 disposed thereon and corresponding to the second region R2 may have a larger thickness, so as to provide better support effect for the first panel 110 and the second panel 120. The portion of the support plate 180 corresponding to the functional region R3 may be thinned without a panel or a functional element thereon and have a small thickness, which may facilitate deformation of the functional region R3.
In summary, according to the electronic device of the embodiment of the invention, the usage modes of the electronic device can be adjusted according to different states or requirements by arranging the cover layer, the first panel and the second panel. In addition, the structural design of the covering layer corresponding to the functional area can be beneficial to the deformation of the functional area and/or the arrangement of the functional element.
The above description is only an example of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.