CN119525697A - Laser light irradiation device and alignment adjustment method - Google Patents
Laser light irradiation device and alignment adjustment method Download PDFInfo
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- CN119525697A CN119525697A CN202411092109.2A CN202411092109A CN119525697A CN 119525697 A CN119525697 A CN 119525697A CN 202411092109 A CN202411092109 A CN 202411092109A CN 119525697 A CN119525697 A CN 119525697A
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Abstract
本发明提供一种激光光照射装置及对准调整方法，进一步提高激光光的照射位置的精度。激光光照射装置，包括：激光光源，射出激光光；基板载台，载置被照射了激光光的安装基板；掩模，设置于激光光源与基板载台之间，并通过多个开口将激光光分离；微透镜阵列，设置于掩模的后级，通过多个微透镜使分别透过多个开口的激光光聚光；第一照相机，对透过设置于掩模的第一标记开口并利用设置于微透镜阵列的微透镜聚光后的照明光进行拍摄；以及第二照相机，对设置于微透镜阵列的第二标记进行拍摄，激光光照射装置基于照明光的拍摄结果调整掩模的平面位置，并且基于第二标记的拍摄结果调整掩模及所述微透镜阵列的平面位置。
The present invention provides a laser light irradiation device and an alignment adjustment method, which further improve the accuracy of the irradiation position of the laser light. The laser light irradiation device includes: a laser light source, which emits laser light; a substrate carrier, which carries a mounting substrate irradiated with laser light; a mask, which is arranged between the laser light source and the substrate carrier, and separates the laser light through a plurality of openings; a microlens array, which is arranged at the rear stage of the mask, and focuses the laser light respectively passing through the plurality of openings through a plurality of microlenses; a first camera, which photographs the illumination light which passes through the first mark opening arranged in the mask and is focused by the microlens arranged in the microlens array; and a second camera, which photographs the second mark arranged in the microlens array, the laser light irradiation device adjusts the plane position of the mask based on the photographing result of the illumination light, and adjusts the plane position of the mask and the microlens array based on the photographing result of the second mark.
Description
Technical Field
The present invention relates to a laser light irradiation device and an alignment adjustment method.
Background
In a process for manufacturing a light emitting Diode (LIGHT EMITTING Diode) element including a compound semiconductor, it is known to perform a laser lift-off process in which a LED element formed on one surface of a substrate is irradiated with laser light from the other surface of the substrate, thereby removing the LED element from the substrate.
For example, patent document 1 discloses a laser lift-off apparatus capable of sequentially irradiating laser beams to a growth substrate having chip parts formed in a matrix at a predetermined arrangement pitch on one surface thereof, thereby removing the chip parts from the growth substrate. In the laser lift-off apparatus disclosed in patent document 1, laser beams transmitted through a photomask are condensed to the same extent as the outer diameter of a chip component by microlenses provided in an array, whereby the laser beams are irradiated to a substrate for growth.
[ Prior Art literature ]
[ Patent literature ]
Patent document 1 Japanese patent laid-open No. 2022-147017
Disclosure of Invention
[ Problem to be solved by the invention ]
Here, when the laser light emitted from the laser light source is separated into a plurality of laser lights by the mask, and each of the separated plurality of laser lights is condensed by the microlens array, alignment of the mask, the microlens array, and the irradiation position becomes important.
However, in patent document 1, a method for adjusting alignment of a mask with a microlens array and an irradiation position is not sufficiently studied. If these alignments are not sufficiently adjusted, the accuracy of the irradiation position of the laser light is lowered.
Accordingly, the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a novel and improved laser light irradiation apparatus and an alignment adjustment method capable of further improving the accuracy of the irradiation position of laser light.
[ Means of solving the problems ]
In order to solve the above problems, according to one aspect of the present invention, there is provided a laser light irradiation apparatus including a light source unit including a laser light source emitting laser light and an illumination light source emitting illumination light, a substrate stage on which a mounting substrate to which the laser light is irradiated is mounted, a mask provided between the light source unit and the substrate stage and separating the laser light by the plurality of openings, a microlens array provided between the light source unit and the substrate stage at a rear stage of the mask, the laser light transmitted through the plurality of openings respectively being condensed to the mounting substrate by the plurality of microlenses, a first camera provided at a position opposite to the illumination light source and capturing the illumination light emitted from the illumination light source and condensed by the microlenses provided at the mask by the first mark openings, a second camera provided at a position opposite to the second mark and capturing the second mark by the microlenses, and a second camera provided at a position opposite to the microlens array and capturing a planar mark by the second camera based on the obtained result of the alignment and the second camera.
In order to solve the above-mentioned problems, according to another aspect of the present invention, there is provided an alignment adjustment method for aligning a substrate stage on which a mounting substrate is mounted, the mounting substrate being irradiated with laser light emitted from a laser light source included in a light source portion, a mask and a microlens array, the mask being disposed between the light source portion and the substrate stage so as to be capable of adjusting a planar position, the laser light being separated by a plurality of openings, the microlens array being disposed between the light source portion and the substrate stage so as to be capable of adjusting a planar position, the laser light transmitted through the plurality of openings being condensed to the mounting substrate by a plurality of microlenses, the alignment adjustment method including a step of photographing the laser light emitted from the illumination light source included in the light source portion by a first camera disposed at a position corresponding to an illumination light source, the first mark opening of the mask and the laser light being separated by a plurality of openings, the microlens array being disposed at a position corresponding to the second mark, a step of photographing the laser light being transmitted through the first mark opening of the mask and a second mark being disposed at a position corresponding to the second camera, and a step of photographing the captured by the second camera being disposed at a position corresponding to the second camera, the second mark being based on the obtained position.
[ Effect of the invention ]
As described above, according to the present invention, the accuracy of the irradiation position of the laser light can be further improved.
Drawings
Fig. 1 is a block diagram showing a schematic configuration of a laser light irradiation apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view illustrating a detailed structure of a laser light source, a mask, a microlens array, and a substrate stage.
Fig. 3 is a schematic perspective view illustrating a detailed structure of the mounting substrate.
Fig. 4 is a flowchart showing a flow of alignment adjustment operation performed by the laser light irradiation apparatus.
Fig. 5 is a schematic cross-sectional view showing the positional relationship of the first mark opening, the second mark, the third mark, and the fourth mark.
[ Description of symbols ]
1 Laser light irradiation device
110 Light source part
111 Laser light source
112 Illumination source
120 Mask
121 Opening(s)
130 Microlens array
131. 131A micro lens
140 Substrate stage
150 Photographing part
151 First camera
152 Second camera
153 Third camera
160 Alignment adjustment part
170 Control device
200 Mounting substrate
210 Circuit substrate
220 LED element
230 Support substrate
L, L1 laser light
S, illumination light
M1 first mark opening
M2 second marker
M3 third marker
M4:fourth marker
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and the drawings, structural members having substantially the same functional structure are denoted by the same reference numerals, and repetitive description thereof will be omitted.
<1. Summary >
First, a schematic configuration of a laser light irradiation apparatus according to an embodiment of the present invention will be described with reference to fig. 1. Fig. 1 is a block diagram showing a schematic configuration of a laser light irradiation apparatus 1 according to the present embodiment.
As shown in fig. 1, the laser light irradiation apparatus 1 includes a laser light source 111, a mask 120, a microlens array 130, a substrate stage 140, an imaging section 150, an alignment adjustment section 160, and a control device 170.
The laser light irradiation apparatus 1 irradiates the mounting substrate 200 mounted on the substrate stage 140 with laser light L emitted from the laser light source 111, transmitted through the mask 120, and condensed by the microlens array 130. The mounting board 200 is a laminate formed by bonding a support board having LED elements formed on one surface thereof and a circuit board to each other so that the LED elements are transferred to the circuit board. That is, the laser light irradiation device 1 is a laser peeling device that peels the support substrate from the LED element by irradiating laser light from the other surface side of the support substrate to the interface between the LED element and the support substrate.
The laser light source 111 is, for example, an excimer laser. The laser light L emitted from the laser light source 111 is emitted to the mask 120. The laser light source 111 may emit laser light L having a uniform light intensity distribution by using a homogenizer or the like, for example.
The mask 120 is a light shielding substrate having a plurality of openings through which the laser light L can pass. The mask 120 may be formed by forming a light shielding film of chromium (Cr) or the like on a transparent substrate of quartz glass or the like, for example, and patterning the light shielding film after the film formation. The mask 120 may separate the laser light L emitted from the laser light source 111 into a plurality of laser lights L1 by using a plurality of openings provided corresponding to the respective microlenses of the microlens array 130 described later.
The microlens array 130 is a transparent substrate having a plurality of microlenses provided on one surface thereof in a predetermined arrangement. The microlens array 130 may collect the plurality of laser lights L1 separated by the plurality of openings of the mask 120 to the mounting substrate 200, respectively, using microlenses. For example, the microlens array 130 may condense each of the plurality of laser lights L1 to a beam spot diameter that is the same as the outer diameter of the LED element provided on the mounting substrate 200.
The substrate stage 140 mounts the mounting substrate 200 on a surface facing the laser light source 111, and conveys the mounted mounting substrate 200 in a direction opposite to the scanning direction of the laser light L1. The substrate stage 140 can irradiate each of the LED elements on the mounting substrate 200 with the laser light L1 by conveying the mounted mounting substrate 200. For example, the substrate stage 140 may transport the mounting substrate 200 in the X direction and the Y direction, respectively.
The imaging unit 150 uses a camera to capture the alignment marks provided on the mask 120 and the microlens array 130, respectively. For example, the imaging unit 150 may take an image of the alignment marks of the mask 120 and the microlens array 130 from the substrate stage 140 side by using a camera provided on the substrate stage 140.
The alignment adjustment unit 160 adjusts the planar positions of the mask 120 and the microlens array 130 based on the imaging result of the alignment marks provided on the mask 120 and the microlens array 130. For example, the alignment adjustment unit 160 may adjust the planar positions of the mask 120 and the microlens array 130 based on the deviation of the imaging positions of the alignment marks provided on the mask 120 and the microlens array 130.
The imaging unit 150 may take an image of alignment marks provided on the substrate stage 140 and the mounting substrate 200, respectively, using another camera. For example, the imaging unit 150 may take an image of alignment marks provided on the substrate stage 140 and the mounting substrate 200 with a camera provided opposite to the substrate stage 140.
In this case, the alignment adjustment unit 160 may adjust the planar positions of the substrate stage 140 and the mounting substrate 200 based on the imaging result of the alignment marks provided on the substrate stage 140 and the mounting substrate 200. For example, the alignment adjustment unit 160 may adjust the planar positions of the substrate stage 140 and the mounting substrate 200 based on the deviation of the imaging positions of the alignment marks provided on the substrate stage 140 and the mounting substrate 200.
The control device 170 controls the substrate stage 140 and the laser light source 111 in linkage. Specifically, the control device 170 controls the conveyance of the mounting substrate 200 by the substrate stage 140 and controls the timing of emission of the laser light L from the laser light source 111. Thus, the control device 170 can control the conveyance of the mounting substrate 200 and the timing of irradiation of the laser light L so that the laser light L emitted from the laser light source 111 is irradiated to a desired LED element of the mounting substrate 200.
The functions of the alignment adjuster 160 and the controller 170 may be realized by cooperation of software with hardware such as a central processing unit (Central Processing Unit, CPU), a Read Only Memory (ROM), and a random access Memory (Random Access Memory, RAM). The CPU functions as an arithmetic processing device, and controls the operations of the alignment adjuster 160 and the controller 170 according to various programs recorded in the ROM, the RAM, and the like. The ROM is a storage device that stores programs, operation parameters, and the like used by the CPU. The RAM is a storage device that temporarily stores a program used in execution of the CPU, parameters used in the execution, and the like.
<2 > Structure >
Next, a detailed configuration of the laser light irradiation device according to the present embodiment will be described with reference to fig. 2 and 3. Fig. 2 is a schematic perspective view illustrating detailed structures of the laser light source 111, the mask 120, the microlens array 130, and the substrate stage 140. Fig. 3 is a schematic perspective view illustrating a detailed structure of the mounting substrate 200.
As shown in fig. 2, in the laser light irradiation apparatus 1, laser light L is irradiated from a laser light source 111 included in a light source section 110 to a substrate stage 140. The laser light L emitted from the laser light source 111 is separated and molded through the plurality of openings 121 provided in the mask 120, and then condensed by each of the microlenses 131 provided in the microlens array 130, and reaches the substrate stage 140.
The mask 120 and the microlens array 130 are disposed to move independently in the X-direction, the Y-direction, and the rotational direction about the Z-axis, respectively. The laser light irradiation apparatus 1 can adjust the alignment of the light source 110, the mask 120, the microlens array 130, and the substrate stage 140 by moving the mask 120 and the microlens array 130 in the X-direction, the Y-direction, and the rotational direction about the Z-axis with respect to the substrate stage 140.
The mounting substrate 200 shown in fig. 3 is placed on the substrate stage 140. As shown in fig. 3, the mounting board 200 is configured by bonding a support board 230 having a plurality of LED elements 220 arranged in a matrix on one surface thereof to the circuit board 210 such that the LED elements 220 face the circuit board 210. The laser light irradiation device 1 can peel the plurality of LED elements 220 from the support substrate 230 by laser peeling by irradiating each of the plurality of LED elements 220 provided on the mounting substrate 200 with laser light L.
Specifically, the laser light L having a rectangular shape extending in the Y direction is emitted from the laser light source 111. The width of the laser light L in the X direction may be equal to or greater than the arrangement pitch of the LED elements 220 arranged on the mounting substrate 200 in the X direction (i.e., the row direction). For example, the width of the laser light L in the X direction may be 1 or more and less than 2 or less than the arrangement pitch of the LED elements 220 in the X direction. The length of the laser light L in the Y direction may be a length corresponding to at least a part of one row extending in the Y direction (i.e., the column direction) of the LED elements 220 arranged on the mounting substrate 200, or may be a length corresponding to a plurality of amounts of the LED elements 220 arranged in the Y direction, for example. The light intensity distribution of the laser light L emitted from the laser light source 111 may be uniform by being converted into an irradiation region by a homogenizer or the like, for example.
The light source unit 110 includes an illumination light source 112 in addition to the laser light source 111. The illumination light sources 112 are provided on both sides of the laser light source 111 in the Y direction, respectively, and emit illumination light S to the first mark opening M1 provided in the mask 120.
The mask 120 is provided with a plurality of openings 121 corresponding to the arrangement pitch in the Y direction of the LED elements 220 arranged on the mounting substrate 200. Specifically, in the mask 120, a plurality of openings 121 are arranged in the Y direction at a pitch that is the same as the arrangement pitch of the LED elements 220 of the mounting substrate 200 in the Y direction. Further, in the mask 120, a plurality of columns of the openings 121 arranged in the Y direction may be provided at predetermined intervals in the X direction. The plurality of openings 121 may be, for example, rectangular in shape corresponding to the shape of the LED element 220. The laser light L emitted from the laser light source 111 and incident on the mask 120 is split into a plurality of laser lights L1 by passing through the plurality of openings 121.
In addition, the mask 120 is provided with first mark openings M1 on the outermost peripheries of both sides in the Y direction across the region where the plurality of openings 121 are provided. For example, the first mark openings M1 may be provided on both sides in the Y direction of the row in which the plurality of openings 121 are arranged as openings such as a cross that easily define the shape of the center. In order to adjust the position of the mask 120 in the rotation direction about the Z axis, the first mark openings M1 are desirably provided at least two or more mutually different positions. The first mark opening M1 may shape the illumination light S into a planar shape corresponding to the shape of the first mark opening M1 by transmitting the illumination light S irradiated from the illumination light source 112.
The microlens array 130 is provided with a plurality of microlenses 131 corresponding to the arrangement pitch in the Y direction of the LED elements 220 arranged on the mounting substrate 200. Specifically, in the microlens array 130, a plurality of microlenses 131 are arranged in the Y direction at a pitch equal to the arrangement pitch of the LED elements 220 of the mounting substrate 200 in the Y direction. Further, in the microlens array 130, a plurality of rows of microlenses 131 arranged in the Y direction may be further provided at predetermined intervals in the X direction. The plurality of microlenses 131 may be, for example, lenses in a shape that can image an image of the position of the mask 120 (i.e., an image of the opening 121) on the substrate stage 140 at a desired magnification. The plurality of laser lights L1 transmitted through the plurality of openings 121 and incident on the microlens array 130 are condensed by the microlenses 131, respectively, to form images on the substrate stage 140.
Further, the microlens array 130 is further provided with microlenses 131A at positions corresponding to the first mark openings M1 of the mask 120. Specifically, the microlens array 130 is further provided with microlenses 131A for condensing the illumination light S transmitted through the first mark opening M1, on the outermost peripheries of both sides in the Y direction, with respect to the region where the plurality of microlenses 131 are provided. The microlens 131A can image the illumination light S shaped in the shape of the first mark opening M1 on the substrate stage 140. The illumination light S imaged on the substrate stage 140 is used for positional adjustment of the mask 120 by photographing with the first camera 151 provided to the substrate stage 140.
Further, the microlens array 130 is provided with second marks M2 on both sides in the X direction across the region where the microlenses 131 are provided. For example, the second marks M2 may be provided on the outermost peripheries of both sides of the microlens array 130 in the X direction as marks such as crosses that facilitate centering. In order to adjust the position of the microlens array 130 in the rotational direction about the Z axis, the second marks M2 are desirably provided at least two or more mutually different positions. The second mark M2 is used for positional adjustment of the mask 120 and the microlens array 130 by photographing with the second camera 152 provided on the substrate stage 140.
The positions of the first mark openings M1 and the second marks M2 are not limited to the above. The first mark opening M1 and the second mark M2 may be provided at different positions from each other to avoid overlapping.
The substrate stage 140 is provided with a first camera 151 and a second camera 152 of the imaging unit 150 so that imaging can be performed from the mounting surface of the mounting substrate 200. For example, the first camera 151 and the second camera 152 may be embedded in a mounting surface of the substrate stage 140 on which the mounting substrate 200 is mounted.
The first camera 151 is provided at a position facing the first mark opening M1, and photographs the illumination light S emitted from the illumination light source 112, transmitted through the first mark opening M1, and condensed by the microlens 131A. The result of photographing the illumination light S by the first camera 151 is used for alignment of the mask 120 and the microlens array 130.
The second camera 152 is provided at a position facing the second mark M2, and photographs the second mark M2 provided in the microlens array 130. The result of photographing the second mark M2 by the second camera 152 is used for aligning the substrate stage 140 with the mask 120 and the microlens array 130.
Specifically, the alignment adjustment unit 160 may perform alignment of the mask 120 and the microlens array 130 by adjusting the planar position of the mask 120 according to a difference between the position of the photographing center of the first camera 151 and the position of the photographed illumination light S. Thereafter, the alignment adjustment unit 160 can perform alignment between the substrate stage 140 and the mask 120 and the microlens array 130 by adjusting the planar positions of the mask 120 and the microlens array 130 by equal amounts based on the difference between the position of the imaging center of the second camera 152 and the position of the imaged second mark M2.
The third camera 153 of the imaging unit 150 is provided so as to face the mounting board 200 of the board stage 140.
The third camera 153 photographs a third mark M3 provided on the outer periphery of the substrate stage 140 and a fourth mark M4 provided on the mounting substrate 200 so as to correspond to the third mark M3. The alignment of the substrate stage 140 and the mounting substrate 200 is performed based on the result of capturing the third mark M3 by the third camera 153 and the result of capturing the fourth mark M4 by the third camera 153.
The third mark M3 is provided at a corner of the periphery of the substrate stage 140 as a mark that easily specifies the shape of the center, such as a cross. In order to perform alignment in the rotational direction around the Z axis of the substrate stage 140 and the mounting substrate 200, the third mark M3 is preferably provided at least two mutually different positions. As shown in fig. 3, the fourth mark M4 is provided as a mark such as a cross that is easily shaped to the center, and is provided at a corner of the outer periphery of the circuit board 210 of the mounting substrate 200 so as to correspond to the third mark M3 of the substrate stage 140. In order to set the mounting direction of the mounting substrate 200 to the substrate stage 140 to be arbitrary, the fourth marks M4 may be provided at the corners of the four corners of the circuit substrate 210, respectively.
Specifically, the alignment adjustment unit 160 can adjust the mounting position of the mounting substrate 200 based on the difference between the position of the third mark M3 imaged by the third camera 153 and the position of the fourth mark M4 imaged by the third camera 153, thereby aligning the substrate stage 140 with the mounting substrate 200. The mounting position of the mounting substrate 200 can be adjusted by, for example, a robot arm used when the mounting substrate 200 is mounted on the substrate stage 140.
According to the above configuration, the laser light irradiation device 1 can automatically adjust the planar position of the mask 120 based on the result of capturing the illumination light S emitted from the illumination light source 112 and condensed by the microlens 131A after being formed by the first mark opening M1 provided in the mask 120. Furthermore, the laser light irradiation device 1 can automatically adjust the planar positions of the mask 120 and the microlens array 130 based on the result of capturing the second mark M2 provided on the microlens array 130. Therefore, the laser light irradiation apparatus 1 can adjust the alignment of the light source unit 110, the mask 120, the microlens array 130, and the substrate stage 140 with high accuracy based on the imaging results of the first camera 151 and the second camera 152.
Further, the laser light irradiation device 1 can automatically adjust the planar position of the mounting substrate 200 based on the result of imaging the third mark M3 provided on the substrate stage 140 and the result of imaging the fourth mark M4 provided on the mounting substrate 200. Therefore, the laser light irradiation apparatus 1 can adjust the alignment of the substrate stage 140 and the mounting substrate 200 with high accuracy based on the imaging result of the third camera 153.
< 3> Procedure for alignment adjustment
Next, a flow of the alignment adjustment operation performed by the laser light irradiation apparatus 1 will be described with reference to fig. 4 and 5. Fig. 4 is a flowchart showing a flow of alignment adjustment operation performed by the laser light irradiation apparatus 1. Fig. 5 is a schematic cross-sectional view showing the positional relationship among the first mark opening M1, the second mark M2, the third mark M3, and the fourth mark M4.
As shown in fig. 4, first, the illumination light S emitted from the illumination light source 112 and transmitted through the first mark opening M1 and condensed by the microlens 131A is photographed by the first camera 151 (S101). Specifically, the illumination light S emitted from the illumination light sources 112 provided on both sides of the laser light source 111 is formed by the first mark opening M1 provided on the outer periphery of the mask 120, and then condensed by the microlenses 131A provided on the outer periphery of the microlens array 130. The illumination light S condensed by the microlens 131A is imaged on the substrate stage 140, and is captured by the first camera 151 provided on the substrate stage 140 so as to face the illumination light source 112.
Next, the planar position of the mask 120 is adjusted based on the result of capturing the illumination light S by the first camera 151 (S103). Specifically, the alignment adjustment unit 160 adjusts the planar position of the mask 120 based on the difference between the position of the imaging center of the first camera 151 and the position of the illumination light S imaged by the first camera 151. Thus, the laser light irradiation apparatus 1 can adjust the alignment of the mask 120 and the microlens array 130.
In addition, the second mark M2 provided to the microlens array 130 is photographed by the second camera 152 (S105). Specifically, the second mark M2 provided on the outer periphery of the microlens array 130 is photographed by the second camera 152 provided on the substrate stage 140 so as to face the second mark M2.
Next, the planar positions of the mask 120 and the microlens array 130 are adjusted based on the result of capturing the second mark M2 by the second camera 152 (S107). Specifically, the alignment adjustment unit 160 adjusts the planar positions of the mask 120 and the microlens array 130 by an equal amount based on the difference between the position of the imaging center of the second camera 152 and the position of the second mark M2 imaged by the second camera 152.
The alignment of the mask 120 and the microlens array 130 has been adjusted through the action of step S103. Therefore, the alignment adjustment unit 160 can adjust the alignment of the substrate stage 140 with the mask 120 and the microlens array 130 without changing the alignment of the mask 120 and the microlens array 130 by moving the planar positions of the mask 120 and the microlens array 130 by the same amount. Thus, the laser light irradiation apparatus 1 can adjust the alignment of the substrate stage 140 with the mask 120 and the microlens array 130.
Further, the third mark M3 provided on the substrate stage 140 and the fourth mark M4 provided on the mounting substrate 200 are photographed by the third camera 153 (S109). Specifically, first, the third mark M3 provided on the substrate stage 140 is photographed by the third camera 153 facing the substrate stage 140 before the mounting of the substrate 200. Then, the fourth mark M4 provided on the mounting board 200 is photographed by the third camera 153 after the mounting board 200 is placed thereon.
Then, the planar position of the mounting substrate 200 is adjusted based on the imaging results of the third mark M3 and the fourth mark M4 obtained by the third camera 153 (S111). Specifically, the alignment adjustment unit 160 moves the mounting board 200 based on the positional deviation of the third mark M3 and the fourth mark M4 imaged by the third camera 153. Thus, the laser light irradiation apparatus 1 can adjust the alignment of the substrate stage 140 and the mounting substrate 200.
According to the above operation flow, the laser light irradiation apparatus 1 can adjust the alignment of each of the laser light source 111, the mask 120, the microlens array 130, the substrate stage 140, and the mounting substrate 200. Therefore, the laser light irradiation device 1 can irradiate the mounting substrate 200 with the laser light L1 with higher positional accuracy.
The preferred embodiments of the present invention have been described in detail above with reference to the drawings, but the present invention is not limited to the examples. It is obvious that various modifications and modifications can be made by those having ordinary skill in the art to which the present invention pertains within the scope of the technical idea described in the claims, and it is needless to say that these modifications and modifications fall within the technical scope of the present invention.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-134852 | 2023-08-22 | ||
| JP2023134852A JP2025029939A (en) | 2023-08-22 | 2023-08-22 | Laser light irradiation device and alignment adjustment method |
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| Publication Number | Publication Date |
|---|---|
| CN119525697A true CN119525697A (en) | 2025-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202411092109.2A Pending CN119525697A (en) | 2023-08-22 | 2024-08-09 | Laser light irradiation device and alignment adjustment method |
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|---|---|
| JP (1) | JP2025029939A (en) |
| CN (1) | CN119525697A (en) |
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- 2023-08-22 JP JP2023134852A patent/JP2025029939A/en active Pending
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