CN119518177A

CN119518177A - Composite thermal barriers and methods

Info

Publication number: CN119518177A
Application number: CN202411040727.2A
Authority: CN
Inventors: J·威廉姆斯; L·王; C·斯托
Original assignee: Aspen Air Gel
Current assignee: Aspen Air Gel
Priority date: 2023-08-22
Filing date: 2024-07-31
Publication date: 2025-02-25
Also published as: WO2025042735A1

Abstract

The present invention discloses a composite thermal barrier and a method, in particular, a composite thermal barrier and related battery modules, battery packs, thermal barriers and methods. A device may include a plurality of battery cells. A device may include at least one thermal barrier for isolating selected battery cells in the plurality of battery cells, the thermal barrier comprising an insulator layer; and a dielectric reinforcement layer.

Description

Composite thermal barrier and method

Technical Field

The present disclosure relates generally to materials and systems and methods for preventing or mitigating thermal events (e.g., thermal runaway problems) in energy storage systems. Specifically, the present disclosure provides a thermal barrier material. The present disclosure also relates to battery modules or batteries having one or more battery cells that include a thermal barrier material, and systems including such battery modules or batteries. Examples of the general description may include aerogel materials.

Background

Lithium Ion Batteries (LIBs) have a high operating voltage, low memory effect, and high energy density compared to conventional batteries, and thus are widely used to power portable electronic devices such as cellular phones, tablet computers, notebook computers, power tools, and other high current devices such as electric vehicles. However, safety is a problem because LIBs are prone to catastrophic failure under "abuse conditions", such as when a rechargeable battery is overcharged (charged beyond design voltage), overdischarged, operated at high temperature and high pressure, or exposed to high temperature and high pressure. Although LIB is exemplified, the techniques of the present disclosure may be used with any type of battery.

To prevent cascading thermal runaway events (CASCADING THERMAL runaway events), effective insulation and heat dissipation strategies are needed to address these and other technical challenges of LIBs.

Disclosure of Invention

A battery module includes a plurality of battery cells within a module housing, each of the battery cells having a respective battery cell lateral footprint, at least one thermal barrier separating selected ones of the plurality of battery cells, the at least one thermal barrier including an insulator layer having an insulator lateral footprint equal to or greater than the battery cell lateral footprint, and a first layer including a dielectric on the insulator layer, wherein the first layer extends beyond the insulator lateral footprint.

Drawings

Fig. 1A illustrates a battery module according to some aspects.

Fig. 1B illustrates another battery module according to some aspects.

FIG. 2 illustrates a thermal barrier according to some aspects.

FIG. 3 illustrates another thermal barrier in accordance with aspects.

FIG. 4 illustrates another thermal barrier in accordance with aspects.

FIG. 5 illustrates another thermal barrier in accordance with aspects.

FIG. 6A illustrates another thermal barrier in accordance with aspects.

Fig. 6B illustrates a battery module according to some aspects.

Fig. 6C illustrates a cross-sectional view of a battery module according to some aspects.

Fig. 6D illustrates another cross-sectional view of a battery module according to some aspects.

FIG. 7A illustrates another thermal barrier in accordance with aspects.

FIG. 7B illustrates a cross-sectional view of a thermal barrier according to some aspects.

FIG. 7C illustrates another cross-sectional view of a thermal barrier according to some aspects.

FIG. 8A illustrates another cross-sectional view of a thermal barrier according to some aspects.

FIG. 8B illustrates another cross-sectional view of a thermal barrier according to some aspects.

FIG. 9A illustrates another thermal barrier in accordance with aspects.

FIG. 9B illustrates another thermal barrier in accordance with aspects.

FIG. 10A illustrates another thermal barrier in accordance with aspects.

FIG. 10B illustrates another thermal barrier in accordance with aspects.

Fig. 11A illustrates an isometric exploded view of a battery module according to some aspects.

FIG. 11B illustrates a selected cross-section of a thermal barrier and a housing portion according to some aspects.

Fig. 12 illustrates an isometric exploded view of a battery module according to some aspects.

Fig. 13A illustrates another thermal barrier and battery cell in accordance with some aspects.

Fig. 13B illustrates an end view of another thermal barrier and battery cell in accordance with some aspects.

FIG. 13C illustrates an isometric view of another thermal barrier according to some aspects.

FIG. 14A illustrates an exploded view of another thermal barrier according to some aspects.

FIG. 14B illustrates an exploded view of another thermal barrier according to some aspects.

FIG. 14C illustrates an exploded view of another thermal barrier according to some aspects.

FIG. 15A illustrates an end view of another thermal barrier in accordance with aspects.

FIG. 15B illustrates an end view of another thermal barrier in accordance with aspects.

FIG. 15C illustrates an end view of another thermal barrier in accordance with aspects.

FIG. 15D illustrates an exploded view of another thermal barrier according to some aspects.

Fig. 16 illustrates a cross-sectional view of a battery module in accordance with aspects

Fig. 17 illustrates an electronic device in accordance with some aspects.

Fig. 18 illustrates an electric vehicle in accordance with some aspects.

Description of the reference numerals

100 Battery Module

102 Battery cell

104 Electric terminal, terminal

110 Thermal barrier

112 Cell subsection

114 Battery cell subsection

150 Battery Module

152 Battery cell

154 Radiator

160 Thermal barrier

200 Thermal barrier

202 Insulator layer

204 Dielectric enhancement layer

206 Second dielectric enhancement layer, dielectric enhancement layer

300 Thermal barrier

302 Insulator layer

304 Dielectric enhancement layer

306 A second dielectric enhancement layer, a dielectric enhancement layer

310 Extension part

400 Thermal barrier

402 Insulator layer

404 Dielectric enhancement layer

406 A second dielectric enhancement layer, a dielectric enhancement layer

410 Extension part

412 Extension part

500 Thermal barrier

502 Insulator layer

504 Dielectric enhancement layer

506 Second dielectric enhancement layer, dielectric enhancement layer

510 First extension

512 Second extension part

600 Thermal barrier

602 Insulator layer

604 Dielectric enhancement layer

606 Second dielectric enhancement layer, dielectric enhancement layer

610 First extension

612 Second extension

614 Third extension

616 Fourth extension

650 Battery Module

652 Battery cell

654 Module housing

656 Cover

657 Side space

658 Headspace

659 Compartment

700 Thermal barrier

702 Insulator layer

704 Dielectric enhancement layer

706 Second dielectric enhancement layer, dielectric enhancement layer

708 Edge seal

800 Thermal barrier

802 Insulator layer

804 Layer

806 Layer(s)

808 Edge seal

810 Dielectric enhancement layer

812 Adhesive layer

820 Thermal barrier

822 Insulator layer

824 First side

825 Adhesive layer

826 Second side

827 Dielectric enhancement layer

828 Edge seal

900 Thermal barrier

902 Insulator layer

904 Edge seal

906 Dielectric enhancement layer

909 Crease line

910, Close-up view

912 Joint

914 Gap of

920 End view

950 Thermal barrier

952 Insulator layer

953 Middle portion

954 Gap

956 Dielectric edge seal

960 Close-up drawing

970 End view

1000 Thermal barrier

1002 Insulator layer

1004 Gap

1006 Dielectric edge seal

1008 Packaging layer

1010 Close-up view

1050 Thermal barrier

1052 Insulator layer

1053 Middle part

1054 Gap

1056 Dielectric edge seal

1058 Packaging layer

1060 Close-up view

1070 End view

1100 Battery Module

1102 Battery case, outer case

1104 First groove

1106 Groove plate

1107 Second groove

1108 Lid

1110 Cooling plate

1112 Battery cell

1113 Vent opening

1114 Thermal barrier

1116 Secondary battery cell separator

1120 View

1121 Groove

1122, Size

1123 Insulator layer, thermal barrier

1124 Size

1130 View

1131 Groove

1132 Size

1133 Insulator layer, thermal barrier

1134 Size

1140 View

1141 Groove

1142 Size

1143 Insulator layer, thermal barrier

1144 Size

1150 View

1151 Groove

1152 Size

1153 Insulator layer, thermal barrier

1154 Size

1200 Battery module

1202 Battery case, housing

1204 First groove

1206 Top fluted plate, top plate

1207 Second groove

1208 Cover

1212 Battery cell

1213 Vent opening

1214 Insulator layer, thermal barrier

1216 Secondary battery cell separator

1218 Bottom channel plate and bottom plate

1219 Third groove

1300 Thermal barrier

1301 Insulator layer, core

1302 Battery unit

1303 Transverse Battery footprint

1304 Projected line

1306 Dielectric edge seal

1308 Corner

1310 Encapsulation layer

1350 Thermal barrier

1352 Center portion

1353 Fourth edge

1354 Corner

1356 Dielectric edge seal

1400 Thermal barrier

1402 Insulator layer

1403 Dielectric enhancement layer

1404 First side

1406 Second side

1407 Folding

1408 Edge seal

1410 Thermal barrier

1412 Insulator layer

1413 Dielectric enhancement layer

1414 First side

1416 Second side

1417 Bottom side

1418 Edge seal

1420 Thermal barrier

1422 Insulator layer

1423 Dielectric enhancement layer

1428 Edge seal

1500 Thermal barrier

1502 Insulator layer

1504 Dielectric enhancement layer

1506 Dielectric enhancement layer

1508 Encapsulation layer

1510 Thermal barrier

1512 Insulator layer

1514 Dielectric enhancement layer

1516 Dielectric enhancement layer

1518 Packaging layer

1520 Thermal barrier

1522 Insulator layer

1523 Adhesive

1524 Dielectric enhancement layer

1525 Release layer

1526 Dielectric enhancement layer

1527 Adhesive

1528 Packaging layer

1530 Thermal barrier

1532 Insulator layer

1533 Adhesive

1534 Dielectric enhancement layer

1535 Release layer

1536 Dielectric enhancement layer

1537 Adhesive layer

1538 Packaging layer

1600 Battery Module

1602 Battery cell

1604 Module housing, housing

1605 Radiator

1606 Lid

1608 Top insulator layer

1610 Thermal barrier

1700 Electronic device

1702 Casing

1710 Battery Module

1712A Circuit

1714 Charging port

1720 Functional electronic device

1800 Electric vehicle

1802 Chassis

1804 Charging port

1806 Circuit

1810 Battery module

1820 Driving Motor

1822 Wheels.

Detailed Description

The following description and the drawings sufficiently illustrate specific embodiments to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments recited in the claims encompass all available equivalents of those claims.

Insulating materials, thermal conductor materials, elastic materials, etc., described in the examples below, may be used in the battery module to separate individual battery cells or battery cell stacks in the battery device. The plurality of battery cells coupled together is referred to as a battery module in this disclosure. However, the apparatus and method may be used with any of a variety of types of multi-cell arrangements, which may be referred to as battery packs, battery systems, and the like.

The insulating material described below may be used as a single heat resistant layer, or in combination with other layers, to provide additional functions to the multilayer fabric, such as mechanical strength, compressibility, heat dissipation/conduction, etc. The insulating layer described herein is responsible for reliably accommodating and controlling the heat flow of heat generating components within a small space and provides safety and fire spread prevention for such products in the electronics, industry and automotive arts.

In many aspects of the present disclosure, the insulating layer itself or in combination with other materials is used as a flame/flame deflection layer to enhance the performance of containing and controlling heat flow. For example, the insulating layer itself may be flame and/or hot gas resistant and further include entrained particulate material that alters or enhances heat containment and control.

Aerogel

One example of a high efficiency insulation layer includes aerogel. Aerogels describe a class of materials in terms of their structure, namely low density, open cell structure, large surface area (typically 900m ²/g or higher), and sub-nanometer pore size. The holes may be filled with a gas, such as air. Aerogels can be distinguished from other porous materials by their physical and structural characteristics. Although aerogel materials are exemplary insulating materials, the invention is not so limited. Other layers of thermally insulating materials may also be used in aspects of the present disclosure.

Selected examples of aerogel formation and properties are described. In several examples, the precursor material is gelled to form a solvent-filled pore network. The solvent is then extracted, leaving behind a porous matrix. Various aerogel compositions are known, which can be inorganic, organic, and inorganic/organic mixtures. Inorganic aerogels are typically based on metal alkoxides, including materials such as silica, zirconia, alumina, and other oxides. Organic aerogels include, but are not limited to, polyurethane aerogels, resorcinol formaldehyde aerogels, and polyimide aerogels.

The inorganic aerogel can be formed from a metal oxide or metal alkoxide material. The metal oxide or metal alkoxide material may be based on an oxide or alkoxide of any metal that may form an oxide. Such metals include, but are not limited to, silicon, aluminum, titanium, zirconium, hafnium, yttrium, vanadium, cerium, and the like. Inorganic silica aerogels are traditionally produced by hydrolysis and condensation of silica-based alkoxides (e.g., tetraethoxysilane) or by gelation of silicic acid or water glass. Other related inorganic precursor materials for silica-based aerogel synthesis include, but are not limited to, metal silicates (e.g., sodium or potassium silicate), alkoxysilanes, partially hydrolyzed alkoxysilanes, tetraethoxysilanes (TEOS), partially hydrolyzed TEOS, condensation polymers of TEOS, tetramethoxysilanes (TMOS), partially hydrolyzed TMOS, condensation polymers of TMOS, tetra-n-propoxysilanes, partially hydrolyzed and/or condensation polymers of tetra-n-propoxysilanes, polyethylsilicate, partially hydrolyzed polyethylsilicate, monomeric alkylalkoxysilanes, ditrialkoxyalkyl or aryl silanes, polyhedral silsesquioxanes, or combinations thereof.

In certain embodiments of the present disclosure, pre-hydrolyzed TEOS, such as SilbondH-5 (SBH 5, silbond Corp), having a hydrolyzed water/silica ratio of about 1.9-2, may be used as a commercial product or may be further hydrolyzed prior to addition to the gelation process. Partially hydrolyzed TEOS or TMOS, such as polyethyl silicate (Silbend 40) or polymethylsilicate, may also be used as a commercial product or may be further hydrolyzed prior to addition to the gelling process.

Inorganic aerogels may also include gel precursors containing at least one hydrophobic group, such as alkyl metal alkoxides, cycloalkyl metal alkoxides, and aryl metal alkoxides, which may impart or improve certain properties in the gel, such as stability and hydrophobicity. The inorganic silica aerogel can specifically include a hydrophobic precursor, such as an alkylsilane or arylsilane. The hydrophobic gel precursor may be used as the primary precursor material to form a framework for the gel material. However, hydrophobic gel precursors are more commonly used as co-precursors, in combination with simple metal alkoxides to form amalgam aerogels. Hydrophobic inorganic precursor materials for silica-based aerogel synthesis include, but are not limited to, trimethylmethoxysilane (TMS), dimethyldimethoxysilane (DMS), methyltrimethoxysilane (MTMS), trimethylethoxysilane, dimethyldiethoxysilane (DMDS), methyltriethoxysilane (MTES), ethyltriethoxysilane (ETES), diethyldiethoxysilane, dimethyldiethoxysilane (DMDES), ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane (PhTES), hexamethyldisilazane, and hexaethyldisilazane, among others. Any derivative of any of the above precursors may be used, and in particular, polymers of certain other chemical groups may be added or crosslinked to one or more of the above precursors.

Organic aerogels are typically formed from carbon-based polymer precursors. Such polymeric materials include, but are not limited to, resorcinol Formaldehyde (RF), polyimide, polyacrylate, polymethyl methacrylate, acrylate oligomers, polyalkylene oxides, polyurethanes, polyphenols, polybutylene, trialkoxysilyl terminated polydimethylsiloxanes, polystyrene, polyacrylonitrile, polyfurfurals, melamine formaldehyde, cresol formaldehyde, phenol furals, polyethers, polyols, polyisocyanates, polyhydroxybenzenes, polyvinyl alcohol dialdehydes, polycyanurates, polyacrylamides, various epoxy resins, agar, agarose, chitosan, and combinations thereof. As one example, organic RF aerogels are typically made by sol-gel polymerization of resorcinol or melamine with formaldehyde under alkaline conditions.

The organic/inorganic hybrid aerogel consists essentially of an organically modified silica ("ormosil") aerogel. These ormosil materials include an organic component covalently bound to a silica network. Ormosil is typically formed by hydrolysis and condensation of an organomodified silane R-Si (OX) ₃ with a conventional alkoxide precursor Y (OX) ₄. In these formulas, X may represent, for example, CH ₃、C₂H₅、C₃H₇、C₄H₉, Y may represent, for example, si, ti, zr, or Al, and R may be any organic moiety, for example, methyl, ethyl, propyl, butyl, isopropyl, methacrylate, acrylate, vinyl, epoxide, and the like. The organic components in the ormosil aerogel may also be dispersed throughout or chemically bound to the silica network.

Aerogels can be formed from flexible gel precursors. The various flexible layers (including flexible fiber reinforced aerogels) can be easily combined and shaped to give a preform that, when mechanically compressed along one or more axes, can produce a body of high compressive strength along any of these axes.

One method of aerogel formation involves batch casting. Batch casting involves catalyzing the entire volume of sol to induce gelation of the entire volume simultaneously. Gel formation techniques include adjusting the pH and/or temperature of the dilute metal oxide sol to the point where gelation occurs. Suitable materials for forming the inorganic aerogel include oxides of most metals that can form oxides, such as silicon, aluminum, titanium, zirconium, hafnium, yttrium, vanadium, and the like. Particularly preferred are gels formed primarily from an alcoholic solution of hydrolyzed silicate esters, which are readily available and inexpensive (alcogel). The organic aerogel can also be made from melamine formaldehyde, resorcinol formaldehyde, and the like.

In one example, the aerogel material can be monolithic (monolithic) or continuous throughout the entire structure or layer. In other examples, the aerogel material can comprise a composite aerogel material, wherein aerogel particles are mixed with a binder or carrier. Other additives may be included in the composite aerogel material, including, but not limited to, surfactants that aid in dispersing the aerogel particles within the binder or carrier. The composite aerogel slurry can be applied to a support plate (e.g., mesh, blanket, net, etc.) and then dried to form a composite aerogel structure.

Enhancement

As noted above, aerogels can be organic, inorganic, or mixtures thereof. In some examples, the aerogel comprises a silica-based aerogel. One or more layers of the thermal barrier may include a reinforcing material. The reinforcing material can be any material that provides elasticity, compliance, or structural stability to the aerogel material. Examples of reinforcing materials include, but are not limited to, open cell macroporous frame reinforcing materials, closed cell macroporous frame reinforcing materials, open cell films, honeycomb reinforcing materials, polymeric reinforcing materials, and fibrous reinforcing materials such as discrete fibers, woven materials, nonwoven materials, needled nonwoven materials, batts, webs, mats, and felts.

The reinforcing material may be selected from organic polymer based fibers, inorganic fibers, carbon based fibers, or combinations thereof. The inorganic fibers may be selected from glass fibers, rock fibers, metal fibers, boron fibers, ceramic fibers, basalt fibers, other inorganic fibers, or combinations thereof. The organic polymer-based fibers may be selected from polyester polypropylene fibers, acrylic fibers, polyvinyl chloride fibers, aramid fibers, spandex (spandex) fibers, nylon fibers, pre-Oxidized Polyacrylonitrile (OPAN) fibers, other organic fibers, or combinations thereof. In some examples, the reinforcing material may include multiple layers of material.

Dielectric enhancement layer

The dielectric reinforcement layer provides mechanical strength for the thermal barrier, among other functions. The low conductivity thereof may prevent an accidental electrical short circuit in the battery module or the battery pack. The dielectric enhancement layer includes a dielectric material and a dielectric polymer. For example, the dielectric reinforcement layer may comprise a material selected from the group consisting of ceramics, glass, rubber, oil, paper, resins, epoxy resins, plastics, and polymers, such as polyethylene, polypropylene, polytetrafluoroethylene, polyvinylchloride (PVC), PVC elastomeric materials, PVC rigid materials, other dielectric materials, and combinations thereof.

Or the dielectric reinforcing layer may comprise mica. Advantages of using mica as a dielectric reinforcing layer include low thermal conductivity and the abundant availability of such materials at low cost. Mica also naturally exists in flake or plate form, which provides good structural properties at low cost. Mica flakes have mechanical strength and provide the required reinforcement and encapsulation for the insulating layer, as compared to powdered dielectric materials. In one aspect, the dielectric reinforcing layer includes mica particles bonded together with a binder (e.g., a polymeric binder) to form a structural sheet. In one aspect, the dielectric reinforcement layer is flexible. In one aspect, the adhesive may comprise a silicon-based polymer, although the disclosure is not limited in this regard. Silicon polymers have the advantage of high heat resistance and low thermal conductivity.

Thermal conduction

In addition to the thermal insulation layer, the thermally conductive layer in combination with the thermal insulation layer may effectively direct unwanted heat to a desired external location, such as an external heat sink, heat dissipating housing, or other external structure, to dissipate the unwanted heat into the external ambient air. In one example, the one or more thermally conductive layers help to dissipate heat from localized heat loads within the battery module or stack. Examples of high thermal conductivity materials include carbon fibers, carbon nanotubes, graphene, graphite, pyrolytic graphite sheets, silicon carbide, metals (including but not limited to copper, stainless steel, aluminum, etc.), and combinations thereof.

To aid in distributing and removing heat, in at least one embodiment, the thermally conductive layer is coupled to a heat sink. It should be understood that there are various heat sink types and configurations, as well as different techniques for coupling the heat sink to the thermally conductive layer, and that the present disclosure is not limited to use with any one heat sink/coupling technique. For example, at least one thermally conductive layer of the multilayer materials disclosed herein may be in thermal communication with an element of a cooling system (e.g., a cooling plate or cooling channel of a cooling system) of a battery module or stack. As another example, at least one thermally conductive layer may be in thermal communication with other elements of a battery pack, battery module, or battery system that may act as heat sinks (e.g., walls of the pack, module, or system) or with other multi-layer materials disposed between battery cells. Thermal communication between the thermally conductive layer and the heat spreader component within the battery system may spread excess heat from one or more battery cells in the vicinity of the multi-layer material to the heat spreader, thereby reducing the impact, severity, or spread of thermal events that may generate the excess heat. In addition to dissipating heat, the thermally conductive layer may also diffuse or dissipate heat from areas of high heat concentration to larger areas of lower heat concentration.

The thermally conductive layer may replace the dielectric reinforcing layer in applications requiring heat conduction in addition to serving the mechanical function of supporting other layers in the thermal barrier.

Elastic material

In addition to the thermally insulating layer and the thermally conductive layer, one or more layers of elastomeric material may be included adjacent to or between the cells. In one example, the elastic layer absorbs any volume expansion during normal operation of the one or more battery cells. For example, during charging, the battery cells may expand, while during discharging, the battery cells may contract. In one example, the elastic layer may also absorb permanent volume expansion caused by any cell degradation and/or thermal runaway. The elastomeric layer may include, but is not limited to, foam, fiber, fabric, sponge, spring structures, rubber, polymers, and the like.

Thermal barrier with extended edges

Fig. 1A shows an example of a battery module 100. The module 100 includes a stack of battery cells 102. In one example, the stack of battery cells 102 includes lithium ion battery cells 102, although other battery cell types are within the scope of the present disclosure. Several configurations of the battery cells 102 are possible. In one example, the stack of battery cells 102 includes prismatic battery cells (PRISMATIC BATTERY CELLS) or pouch battery cells (pouch battery cells), but the disclosure is not so limited. In one example, the stack of lithium ion battery cells 102 includes lithium Nickel Manganese Cobalt (NMC) oxide battery cells, but the disclosure is not so limited. The plurality of battery cells 102 are grouped into a plurality of battery cell subsections 112, 114. As described above, it is desirable to stop or mitigate thermal runaway conditions that may occur in a battery cell (e.g., lithium ion battery cell 102). The thermal barrier 110 is shown positioned between adjacent cell sub-portions 112, 114 to stop or mitigate thermal runaway between the cell sub-portions 112, 114.

The battery cells 102 in fig. 1A each include an electrical terminal 104. Although the example of fig. 1A shows battery cell 102 having terminal 104 on its top surface, other configurations are within the scope of the invention, including but not limited to the other examples shown in the following figures.

The present disclosure relates to the "lateral footprint (lateral footprint)" of the various components, including the battery cell 102 and the thermal barrier 110. The lateral footprint of a component refers to the area of the major surface of the component defined by the perimeter of the component. As shown in fig. 1A, the major surfaces of the battery cell 102 and thermal barrier 110 are those surfaces in the Y-Z plane (see reference axis in fig. 1A). For clarity and convenience of explanation, the term battery cell (equivalent to "battery" or "cell") lateral footprint ("footprint") refers to the major surface of the battery cell in the Y-Z plane. Similarly, the thermal barrier lateral footprint ("footprint") refers to the major surface of the thermal barrier in the Y-Z plane. In some examples described below, the thermal barrier may be made of multiple laminate layers, each of which may have its corresponding lateral footprint (i.e., insulator lateral footprint, dielectric reinforcement lateral footprint). For clarity, "minor surface" refers to a surface orthogonal to the major surface and lying in the X-Y plane using the reference coordinate axes in the figure.

Fig. 1B shows an alternative configuration of a battery module 150 that includes a heat sink 154 or cooling plate located on one side of the module 150 and in thermal communication with the battery cells 152. Fig. 1B shows a cross section of a battery module 150. One or more battery cells 152 are shown separated by one or more thermal barriers 160. Although in fig. 1B, only selected groups or sub-portions of battery cells 152 are separated by a thermal barrier 160, the present disclosure is not so limited. In other examples, each battery cell 152 is surrounded by a thermal barrier 160. The side, bottom, or top surfaces of the battery module 150 may also include a thermal barrier 160. Examples of thermal barriers 110, 160 are shown in more detail in the following discussion of the figures.

In fig. 1A and 1B, the lateral footprint of the thermal barriers 110, 160 matches the lateral footprint of the battery cell 102. In other words, the lateral surface area of the thermal barrier 110, 160 is similar or identical to the lateral surface area of the battery cell itself. The thermal barriers 110, 160 do not extend beyond the lateral dimensions of the battery cell 102. The term "footprint" is used to describe how the different battery cells not shown in the examples of fig. 1A and 1B include different lateral geometries other than rectangular or square. For example, pouch-type battery cells may be generally rectangular, but may have a less well-defined profile. The less well-defined outline of the pouch cell will still define a lateral footprint, but the footprint may not be entirely defined by the length times the width as in a rectangular cell.

FIG. 2 illustrates one aspect of a thermal barrier 200 in accordance with the present disclosure. The thermal barrier 200 of fig. 2 includes an insulator layer 202 and a dielectric reinforcement layer 204, the dielectric reinforcement layer 204 forming a laminate with the insulator layer 202. In one aspect, the dielectric reinforcement layer 204 is attached to the insulator layer 202, for example using an adhesive. The attachment of the dielectric reinforcement layer 204 is mechanically stronger than the insulator layer 202, thus providing structural support for the insulator layer 202. In one aspect, the insulator layer 202 includes an aerogel layer, but the disclosure is not limited thereto. Aerogel materials include very low thermal conductivity, while the addition of dielectric reinforcement layer 204 provides the desired mechanical strength to insulator layer 202 without adding unnecessarily high thermal conductivity. The enhanced mechanical strength improves the durability of the thermal barrier 200, especially during particle bombardment under extreme conditions (e.g., thermal runaway). The dielectric enhancement layer 204 also serves as a package for the insulator layer 202 to reduce or prevent dust in the insulator layer 202.

In one aspect, the dielectric reinforcement 204 may be selected from polyvinyl chloride (PVC), PVC elastomeric materials, PVC hard materials, rubber, other dielectric materials, and combinations thereof.

In one aspect, the dielectric enhancement layer 204 includes mica. Advantages of using mica as a dielectric reinforcing layer include low thermal conductivity and the abundant availability of such materials at low cost. Mica also naturally exists in platelet or flake form, which provides good structural properties at low cost. Mica flakes have mechanical strength and provide the required reinforcement and encapsulation for the insulator layer 202, as compared to powdered dielectric materials. In one aspect, the dielectric reinforcing layer 204 includes mica particles bonded together with a binder (e.g., a polymeric binder) to form a structural sheet. In one aspect, the dielectric enhancement layer 204 is flexible. In one aspect, the adhesive may include a silicon-based polymer, but the disclosure is not limited thereto. Silicon polymers have the advantage of high heat resistance and low thermal conductivity.

For example, the insulator layer may include layers of insulation and other materials, such as structural layers, conductive layers, compressible layers, elastic layers, dielectric layers, adhesive layers, intumescent layers, heat absorbing layers, heat releasing layers, other suitable layers, or combinations thereof, in one aspect, the insulator layer may include a structural core layer and an insulating layer disposed on one major surface of the structural core layer.

In one aspect, the structural core layer may include the dielectric reinforcing layer and/or the thermally conductive layer described previously. In one example, the structural core layer may include a mica layer, a stainless steel layer, and/or a polymer layer.

In one aspect, the insulator layer can be foam, fiberglass, nonwoven, aerogel composite, fiber reinforced aerogel, other suitable insulating material, or a combination thereof. In other examples, the insulator layer may be a composite material, such as disclosed in U.S. patent publication Nos. 2021/0163303, 2021/0167438, 2023/0032529 and U.S. Ser. Nos. 18/571,175, 18/571,178, 18/571,172, each of which is incorporated herein by reference in its entirety.

In the aspect of FIG. 2, the thermal barrier 200 further includes a second dielectric enhancement layer 206. The second dielectric enhancement layer 206, the dielectric enhancement layer 204, and the insulator layer 202 therebetween form a thermal barrier 200 having a sandwich structure (SANDWICHED STRUCTURE). The dielectric enhancement layers 204, 206 form a pair of dielectric enhancement layers on both major surfaces of the insulator layer 202. This configuration provides additional structural support for the insulator layer 202.

In one aspect, one or more dielectric enhancement layers 204, 206 are attached to the insulator layer 202 using an adhesive. In one aspect, the adhesive comprises a Pressure Sensitive Adhesive (PSA). PSA is useful because its use can simplify the manufacture and assembly of parts. Layers such as dielectric reinforcing layers 204, 206 and insulator layer 202 may be attached by applying PSA to the surface of one or more layers and laminating these together to activate the PAS. In one aspect, the PSA is included on all or part of one or more major surfaces of each dielectric enhancement layer 204, 206, although the disclosure is not so limited. The PSA on one major surface of the dielectric enhancement layer may help the dielectric enhancement layer attach to the insulator layer 202, while the PSA on the other major surface may help the dielectric enhancement layer attach to the battery cell (e.g., battery cell 102 or 152).

FIG. 3 illustrates another aspect of a thermal barrier 300. In the aspect of FIG. 3, the thermal barrier 300 includes an insulator layer 302 and a dielectric reinforcement layer 304 that forms a laminate with the insulator layer 302. In one aspect, a second dielectric enhancement layer 306 is included and a pair of dielectric enhancement layers 304, 306 are formed on both major surfaces of the insulator layer 302.

In the aspect shown in fig. 3, at least one of the dielectric enhancement layers 304 or 306 extends beyond the insulator lateral footprint, as indicated by extension 310. Examples including one or more extensions 310 provide an enhanced barrier between adjacent battery cells in a battery module that is outside of the battery footprint. The one or more extensions 310 reduce or prevent heat or thermal runaway emissions from passing through the battery module. The function of one or more extensions 310 is described in more detail below with respect to the non-limiting extension geometry in fig. 6B.

Fig. 4 illustrates another aspect of a thermal barrier 400. In the aspect of FIG. 4, the thermal barrier 400 includes an insulator layer 402 and a dielectric enhancement layer 404, the dielectric enhancement layer 404 forming a laminate with the insulator layer 402. In one aspect, a second dielectric enhancement layer 406 is included and a pair of dielectric enhancement layers 404, 406 are formed on both major surfaces of the insulator layer 402. In the aspect shown in fig. 4, one or more of the dielectric enhancement layers 404, 406 extend beyond the insulator lateral footprint in multiple dimensions. In one aspect of fig. 4, the enhancement layers 404, 406 each extend laterally upward (Z-direction) and from the sides (Y-direction and negative Y-direction) of the insulator layer. More specifically, in the example of fig. 4, dielectric enhancement layers 404, 406 are shown in fig. 4 extending beyond the top dimension (Z-direction) at extension 410 and beyond the side dimension (Y-direction) at extension 412. In these aspects, the reinforcement layers 404, 406 may extend beyond the footprint of the insulator layer to contact, engage, or otherwise interact with the side walls, bottom surface, or top cover of the module housing, as discussed in more detail below, to reduce or prevent heat or thermal runaway emissions from passing through the battery module.

FIG. 5 illustrates another aspect of a thermal barrier 500. In the aspect of FIG. 5, the thermal barrier 500 includes an insulator layer 502 and a dielectric reinforcement layer 504, the dielectric reinforcement layer 504 forming a laminate with the insulator layer 502. In one aspect, a second dielectric enhancement layer 506 is included and a pair of dielectric enhancement layers 504, 506 are formed on both major surfaces of the insulator layer 502. In the aspect shown in fig. 5, one or more of the dielectric enhancement layers 504, 506 include one or more extensions that slope outwardly away from the insulator layer. The first extension 510 of the dielectric enhancement layer 504 is shown tilted up (positive Z direction) and to the right (positive X direction) with respect to the insulator layer 502 that is coplanar with the Y-Z plane. The second extension 512 is shown tilted upward (positive Z direction) and to the left (negative X direction) from the insulator layer 502. The first and second extensions 510 and 512 each form an angle θ with the positive Z-direction. The angle θ may be an acute angle or a right angle. The angle θ provides flexibility to the dielectric reinforcement layers 504 and 506, for example, bending flexibility along the length of the extension or at the intersection between the extension and the reinforcement layer body. When the cover of the battery module is disposed, the angle increases (the first and second extensions 510 and 512 move downward in the negative Z-direction), thus sealing the space between the battery cells and the cover. This function will be further explained below in connection with fig. 6B.

Fig. 6A illustrates another aspect of a thermal barrier 600. In the aspect of FIG. 6A, the thermal barrier 600 includes an insulator layer 602 and a dielectric reinforcement layer 604 that forms a laminate with the insulator layer 602. In one aspect, a second dielectric enhancement layer 606 is included and a pair of dielectric enhancement layers 604, 606 are formed on both major surfaces of the insulator layer 602.

In the aspect shown in fig. 6A, one or more dielectric enhancement layers 604, 606 are tilted outward from the insulator layer. The first extension 610 of the dielectric enhancement layer 604 is sloped upward (Z direction) to the right (X direction) from the top edge of the insulator layer 602. The second extension 612 is inclined upward (Z direction) to the left (negative X direction) from the top of the insulator layer 602.

Further, in one aspect of fig. 6A, the reinforcement layers 604, 606 each extend laterally upward and from the sides of the insulator layer 602 beyond the cell lateral footprint. More specifically, in the example of fig. 6A, the third extension 614 is further shown as being inclined sideways and away from the side edges of the insulator layer 602. The fourth extension 616 is further shown to be sloped sideways and away from the side edges of the insulator layer 602. In one aspect, one edge of extension 610 is connected to one edge of extension 614 by a connector. In one aspect, the connector is triangular. The connectors help prevent heat and particulates from passing through the battery module during a thermal runaway event.

Fig. 6B shows how a thermal barrier 600 is used in a battery module 650. A plurality of battery cells 652 are shown within the module housing 654. The one or more battery cells 652 are separated by at least one thermal barrier 600. The thermal barrier 600 in fig. 6A is shown in the example of fig. 6B, but other thermal barrier geometries described in this disclosure may also be configured as shown in the module 650 shown in fig. 6B.

As shown in fig. 6A, the extensions 610, 612 are positioned such that the extensions 610, 612 extend into the headspace 658 between the top of the battery cell 652 and the cover 656. The extensions 610, 612 divide the headspace 658 into a plurality of individual compartments 659, which compartments 659 may better accommodate flames and/or emissions that may result from failure of one or more of the battery cells 652.

As described above, in the example of fig. 6B, the extensions 610, 612 are angled outwardly from the insulator layer 602 by an angle θ. In one aspect, the angle θ is an acute or right angle. In one aspect, the outward angle facilitates bending against cover 656 to form a better seal with cover 656 and any imperfections in the spacing between cover 656 and cell 652. The ability of the extensions 610, 612 to flex and accommodate spacing differences forms a better seal with the cover 656 than the non-flexible extensions.

Fig. 6C shows a cross-sectional view of the battery module 650 of fig. 6B cutting the insulator layer 602 along line AA'. The insulator layer 602 has one edge (e.g., a bottom edge) that contacts a cooling plate (not shown) on the bottom surface or bottom surface of the module housing 654. The top edge of insulator layer 602 and cover 656 are separated by a top space 658. The side edges of the insulator layer 602 and the side walls of the module housing 654 are separated by side spaces 657.

Fig. 6D shows a cross-sectional view of the battery module 650 of fig. 6B cutting the extensions 610, 614 of the reinforcement layer 604 along line BB'. Extensions 610 and 614 extend into side space 657 and headspace 658 pushing against cover 656 and sidewalls of module housing 654 at angle θ. Thus, extensions 610 and 614 separate headspace 658 and side space 657 into separate compartments, thereby preventing heat or particulates from passing through side space 657 and headspace 658 during thermal runaway.

Thermal barrier with sealing edge

FIG. 7A illustrates another aspect of a thermal barrier 700 having a sealing edge. Fig. 7B and 7C are cross-sectional views of thermal barrier 700 along line CC'. In the aspect of fig. 7A and 7B, the thermal barrier 700 includes an insulator layer 702 and a dielectric reinforcement layer 704, the dielectric reinforcement layer 704 forming a laminate with the insulator layer 702. In one aspect, a second dielectric enhancement layer 706 is included and a pair of dielectric enhancement layers 704, 706 are formed on both major surfaces of the insulator layer 702. An edge seal 708 is shown covering at least a portion of the perimeter of the insulator layer 702 and the reinforcement layers 704, 706. That is, the edge seal 708 is disposed on at least a portion of one or more minor surfaces (i.e., surfaces in the X-Y plane of FIG. 7A) of the thermal barrier 700.

In one aspect, the edge seal 708 comprises an elastic material that deforms to provide an improved capped seal, as shown in fig. 6B discussed above. In one aspect, the edge seal 708 is not resilient and only uses a tightly fitting dimension to provide a capped seal. In one aspect, edge seals 708 seal all four edges of insulator layer 702. In one aspect, the edge seal 708 comprises tape or other adhesive film. For example, a tape or other adhesive film may be secured over at least a portion of one or more minor surfaces of the thermal barrier (i.e., the surface in the X-Y plane of FIG. 7A). In some aspects, the edge seal may extend onto a portion of the major surface of the thermal barrier, for example onto the surface of the reinforcing layer. In one aspect, the edge seal 708 includes a molded polymer channel. In one aspect, the polymeric edge seal 708 comprises rubber, silicone, resin, other elastomeric polymeric material, or a combination thereof.

In fig. 7C, an impregnated or painted edge seal 720 is shown. Advantages of the edge seal 720 include ease of manufacture and alternative choices of polymeric materials. In contrast to the edge seal 708 in fig. 7B, the impregnated or painted edge seal 720 has a rounded edge. In one aspect, the edge seal 720 includes an aerogel composition (e.g., aerogel coating), mica, other insulating or flame retardant material, or a combination thereof. In one aspect, the edge seal 720 includes an intumescent material. The advantage of intumescent materials is that they expand to form a better seal with the lid when exposed to heat or flame above the activation temperature. As described above, improved sealing of the battery module cover may better contain uncontrolled thermal events, thereby improving safety and improving protection of adjacent components.

Fig. 8A and 8B illustrate further aspects of thermal barriers 800, 820 that may be incorporated into other thermal barriers in the present disclosure. The thermal barrier 800 includes a plurality of layers 804 and 806 on two opposite major surfaces of an insulator layer 802. Also shown in fig. 8A is an edge seal 808. The plurality of layers may comprise several different layers, each layer acting differently in the multi-layer thermal barrier. Examples of layers include, but are not limited to, dielectric reinforcement layers, elastic layers, thermal conductor layers, adhesive layers, and the like. The thermal conductor layer may be used to transfer heat from a given side of the thermal barrier to a heat sink or cooling plate, such as heat sink 154 in FIG. 1B. In one aspect of fig. 8A, the plurality of layers 804 and 806 includes an equal number of layers, and may include symmetrical types and sequences of layers. In one aspect, the plurality of layers 804 and 806 each include a dielectric reinforcement layer 810 attached to the insulator layer 802 by an adhesive layer 812.

In FIG. 8B, the thermal barrier 820 includes multiple layers on two opposite major surfaces of an insulator layer 822. Also shown in fig. 8B is an edge seal 828. In the example of fig. 8B, the plurality of layers on the first side 824 are asymmetric with the plurality of layers on the second side 826. Different layer sequences, different material layers, and different numbers of layers may be used between the first 824 and second 826 sides of the insulator layer 822 to better match conditions at different locations between battery cells within the battery module. In addition, reducing the number of layers may reduce the size and cost of the battery module.

In one aspect of fig. 8B, the multiple layers on the first side 824 include a dielectric reinforcing layer 827 attached to the insulator layer 822 by an adhesive layer 825. The multiple layers on the second side 826 include an adhesive layer 825. Thermal barrier 820 may be used at the end of the battery module, where only one side of thermal barrier 820 has battery cells. Multiple layers on the second side 826 with only the adhesive layer 825 and without the dielectric reinforcement layer may be used to attach the thermal barrier 820 to an adjacent battery cell.

FIG. 9A illustrates another aspect of a thermal barrier 900. The thermal barrier 900 includes a core 902. In one example, the core 902 includes a single layer of thermally insulating material, such as the insulator layers 202, 302, 402, 502, 602, 702, and 802 in fig. 2-8B. In one example, core 902 includes multiple layers. In one example, at least one of the plurality of layers includes a thermally insulating material. In one example, the thermal insulation material comprises an aerogel material, but the invention is not so limited. In one example, the thermal insulation material includes a reinforced aerogel material, such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In selected examples, additional layers in core 902 may include, but are not limited to, thermally conductive layers (e.g., metal layers), encapsulation layers (e.g., polymer film layers), and the like. In one example, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 of fig. 1A-8B. In one example, the core 902 includes one or more layers selected from the layers of thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in fig. 1A-8B.

In the example of fig. 9A, the thermal barrier 900 further includes a dielectric enhancement layer 906 encapsulating the core 902. The dielectric enhancement layer 906 includes an edge seal 904 at an end of the dielectric enhancement layer 906. An edge seal 904 covers the edge of core 902. In one example, the dielectric enhancement layer 906 comprises a stronger material than one or more layers of the core 902. In examples of aerogel insulation contained within the core 902, the aerogel insulation may be prone to dust generation and/or may be prone to cracking upon handling. A dielectric enhancement layer 906 is included to suppress dust and reduce damage to the core 902 caused by processing. One example of a dielectric enhancement layer 906 includes a mica-containing layer. In one example, the mica-containing layer has some flexibility and is highly thermally insulating. The mica-containing layer may include a binder material such as silicone or other polymer. Silicone is advantageous because it is flexible and has a high degree of thermal insulation.

Fig. 9A further illustrates a close-up 910 of the edge seal 904 of the dielectric enhancement layer 906. A sheet of dielectric reinforcement 906 is shown wrapped around the core 902 and covering the entire surface of the core 902. There is a gap 914 between edge seal 904 and core 902. Air is trapped in gap 914 and serves as an insulation to prevent heat and particulates from diffusing to adjacent cells in the event of thermal runaway. In some examples, gap 914 may be filled with one or more other insulating materials, such as foam, intumescent material, electronic glass, ceramic, polymer, rubber, aerogel, air, oil, other insulating materials, or combinations thereof. In one example, a portion of the core 902 extends into the gap 914. For the wrapped dielectric reinforcement 906, a degree of flexibility is required to facilitate wrapping. The first edge seal 908A forming a wrap crease is shown, and the second edge seal 908B is shown where the ends of the wrapped dielectric reinforcement layer 906 meet after being wrapped at a connection or joint 912. An end view 920 of the thermal barrier 900 is further shown in FIG. 9A.

FIG. 9B illustrates another aspect of a thermal barrier 950. The thermal barrier 950 includes a core 952. Similar to the example of fig. 9A, in one example, the core 952 includes a single layer of thermally insulating material, such as the insulator layers 202, 302, 402, 502, 602, 702, and 802 of fig. 2-8B. In one example, core 952 includes multiple layers. In one example, at least one of the plurality of layers includes a thermally insulating material. In one example, the thermal insulation material comprises an aerogel material, but the invention is not so limited. In one example, the thermal insulation material includes a reinforced aerogel material, such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In selected examples, additional layers in core 952 may include, but are not limited to, thermally conductive layers (e.g., metal layers), encapsulation layers (e.g., polymer film layers), and the like. In one example, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 of fig. 1A-8B. In one example, the core 902 includes one or more layers selected from the layers of thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in fig. 1A-8B.

In the example of fig. 9B, the thermal barrier 950 includes a dielectric edge seal 956 surrounding the edge of the core 952. A gap 954 is formed between the dielectric rim seal 956 and the core 952. In some examples, gap 954 may be filled with another material, such as a foam, an intumescent material, an electronic glass, a ceramic, a polymer, a rubber, an aerogel, air, oil, other insulating material, or a combination thereof. In one example, a portion of the core 902 extends into the gap 914. One advantage of reinforcing only the edges of core 952 includes reducing the required reinforcing materials. Another advantage of reinforcing only the edges of core 952 includes protecting only edges that may fracture during processing. Another advantage of reinforcing only the edges of the core 952 includes maintaining a thin thermal barrier 950 between the battery cells while reinforcing portions of the thermal barrier 950 that are exposed to contact adjacent components (e.g., battery housing components). Another advantage of only reinforcing the edges of core 952 includes manufacturing flexibility. By reinforcing only the edges of the core 952, the dielectric edge seal 956 may be applied to thermal barriers 950 of various zone configurations. Only the point of interest between the different zone configurations includes selecting a dielectric edge seal 956 of the appropriate length to cover the edge of the core 952. Although two opposite edges of core 952 are covered with dielectric edge seals 956 in fig. 9B, the invention is not so limited. Three edges may be enhanced, or all four edges may be enhanced.

Fig. 9B further illustrates a close-up 960 of the dielectric edge seal 956, which is shown wrapped around the edge of the core 952. In the example of fig. 9B, a crease 909 is formed at one end of the dielectric edge seal 956. Fig. 9B further illustrates an end view 970 of the thermal barrier 950. As mentioned above, it may be advantageous to maintain a thinner middle portion of the thermal barrier 950 (which is located between the battery cells). An intermediate portion 953 of the thermal barrier 950 is shown in view 970, wherein the intermediate portion 953 is thinner than the reinforced edge seal 956.

FIG. 10A illustrates another aspect of a thermal barrier 1000. The thermal barrier 1000 includes a core 1002. Similar to other examples, in one example, the core 1002 includes a single layer of thermally insulating material, such as the insulator layers 202, 302, 402, 502, 602, 702, and 802 in fig. 2-8B. In one example, core 1002 includes multiple layers. In one example, at least one of the plurality of layers includes a thermally insulating material. In one example, the thermal insulation material comprises an aerogel material, but the invention is not so limited. In one example, the thermal insulation material includes a reinforced aerogel material, such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In selected examples, additional layers in core 1002 may include, but are not limited to, thermally conductive layers (e.g., metal layers), encapsulation layers (e.g., polymer film layers), and the like. In one example, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 of fig. 1A-8B. In one example, the core 1002 includes one or more layers selected from the layers of thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in fig. 1A-8B.

In the example of fig. 10A, the thermal barrier 1000 includes a dielectric edge seal 1006. The dielectric edge seal 1006 and the core 1002 form a gap 1004. In some examples, the gap 1004 may be filled with another material, such as a foam, an intumescent material, an electronic glass, a ceramic, a polymer, rubber, aerogel, air, oil, other insulating material, or a combination thereof. In one example, a portion of the core 1002 extends into the gap 1004. As discussed above with respect to other example configurations, merely enhancing the edges of the core 1002 has many advantages. Although two opposite edges of core 1002 are shown covered by dielectric edge seal 1006 in fig. 10A, the invention is not so limited. It is also possible to enhance three edges, or all four edges.

The configuration of fig. 10A also shows an encapsulation layer 1008. In the example of fig. 10A, encapsulation layer 1008 covers all major surfaces of core 1002 and around the edges of core 1002. In one example, encapsulation layer 1008 covers the entire surface of core 1002. Encapsulation layer 1008 is shown encapsulating dielectric edge seal 1006 in a continuous sheet along with other components of thermal barrier 1000. A dielectric edge seal 1006 is disposed between the core 1002 and the encapsulation layer 1008. In one example, the encapsulation layer 1008 includes a flexible polymer sheet. Other flexible sheet materials are within the scope of the invention. In one example, the encapsulation layer 1008 is secured using a pressure sensitive adhesive strip, tape, or the like. In one example, encapsulation layer 1008 includes an adhesive on all or part of one surface to provide an attachment mechanism to core 1002 and dielectric edge seal 1006. In one example, the encapsulation layer 1008 is an adhesive layer, such as a pressure sensitive adhesive layer.

Fig. 10A further illustrates a close-up 1010 of the dielectric edge seal 1006, which is shown wrapped around the edge of the core 1002 with a gap 1004 therebetween. In the example of fig. 10A, encapsulation layer 1008 is shown covering core 1002 and dielectric edge seal 1006. A dielectric edge seal 1006 is disposed between the core 1002 and the encapsulation layer 1008. FIG. 10A further illustrates an end view 1020 of the thermal barrier 1000. As mentioned above, it may be advantageous to maintain a thinner middle portion of the thermal barrier 1000 (which is located between the battery cells). View 1020 shows a middle portion 1003 of thermal barrier 1000, where middle portion 1003 is thinner than the reinforced edge of core 1002.

FIG. 10B illustrates another aspect of the thermal barrier 1050. The insulating layer 1050 includes a core 1052. Similar to other examples, in one example, core 1052 includes a single layer of thermally insulating material, such as insulator layers 202, 302, 402, 502, 602, 702, and 802 in fig. 2-8B. In one example, core 1052 includes multiple layers. In one example, at least one of the plurality of layers includes a thermally insulating material. In one example, the thermal insulation material comprises an aerogel material, but the invention is not so limited. In one example, the thermal insulation material includes a reinforced aerogel material, such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In selected examples, additional layers in core 1052 may include, but are not limited to, thermally conductive layers (e.g., metal layers), encapsulation layers (e.g., polymer film layers), and the like. In one example, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 of fig. 1A-8B. In one example, the core 902 includes one or more layers selected from the layers of thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in fig. 1A-8B.

In the example of fig. 10B, the thermal barrier 1050 includes a dielectric edge seal 1056 surrounding an edge of the core 1052. A gap 1054 is formed between the dielectric edge seal 1056 and the core 1052. As discussed above with respect to other example configurations, merely enhancing edges has many advantages. Although two opposite edges of core 1052 are shown covered by dielectric edge seals 1056 in fig. 10B, the invention is not so limited. Three edges may be enhanced, or all four edges may be enhanced.

The configuration of fig. 10B also shows an encapsulation layer 1058. In the example of fig. 10B, encapsulation layer 1008 covers only dielectric edge seal 1056 and the surface of core 1052 adjacent dielectric edge seal 1056. In one example, the encapsulation layer 1058 includes a flexible polymer sheet. Other flexible sheet materials are within the scope of the invention. In one example, the encapsulation layer 1058 is secured using a pressure sensitive adhesive strip, tape, or the like. In one example, the encapsulation layer 1058 includes an adhesive on all or part of one surface to provide an attachment mechanism to the core 1052 and the dielectric edge seal 1056. In one example, the encapsulation layer 1058 includes tape.

FIG. 10B further shows a close-up view 1060 of the edge of thermal barrier 1050. A dielectric edge seal 1056 is shown wrapped around the edge of the core 1052. In the example of fig. 10B, encapsulation layer 1058 is shown covering only the edge portion of core 1052 and dielectric edge seal 1056. FIG. 10B further shows an end view 1070 of thermal barrier 1050. As mentioned above, it may be advantageous to maintain a thinner middle portion of the thermal barrier 1050 (between the battery cells). An intermediate portion 1053 of the thermal barrier 1050 is shown in view 1070, wherein the intermediate portion 1053 is thinner than the reinforced edge.

Fig. 11A illustrates a battery module 1100 that includes one or more thermal barriers, as described in the present disclosure. The battery module 1100 includes a plurality of battery cells 1112. The battery cell 1112 is configured to be located within the battery housing 1102. Battery module 1100 includes one or more thermal barriers 1114, which are similar to the thermal barriers described with respect to fig. 9A-10B. In the example of fig. 11A, a cooling plate 1110 is included on one side of the stack of battery cells 1112. In selected configurations, the thermal barrier 1114 extends beyond the lateral footprint of the battery cell 1112 on only three sides, allowing the cooling plate 1110 to contact the thermal barrier 1114 on the fourth side. In one example, the thermal barrier 1114 includes a thermally conductive plate within its core. In these examples, contact of the heat conduction plate with the cooling plate 1110 facilitates conduction of heat between the battery cells 1112 to the cooling plate 1110 to spread or dissipate the heat.

In the example of FIG. 11A, one or more slots are included to engage and secure the thermal barrier 1114 within the housing 1102. In the event of a thermal runaway, gases and/or emissions may be emitted from vent 1113 or other locations on battery cell 1112. The addition of the trough helps to control any hot gases and/or emissions. Fig. 11A shows a first slot 1104 in a sidewall of the housing 1102. Although the sides of the housing 1102 are shown with slots 1104, slots may also be included on the bottom or lid of the housing 1102. In the example of fig. 11A, a groove plate 1106 is included, the groove plate 1106 including a plurality of second grooves 1107 therein. The first groove 1104 and/or the second groove 1107 are positioned in alignment with the thermal barrier 1114 and secure it in place. Although the notch plate 1106 is shown adjacent to the cover 1108, the invention is not so limited. The notch plate 1106 may also be used near the bottom of the housing 1102 or on the side of the housing 1102.

Fig. 11A also shows one or more secondary cell separators 1116. The secondary battery cell separator 1116 does not extend beyond the lateral cell footprint of the battery cell 1112. In one example, the secondary battery cell separator 1116 includes a thermally conductive plate. Although a combination of thermal barrier 1114 and secondary cell separator 1116 is shown, the invention is not so limited. Other examples include only one or the other of the thermal barrier 1114 and the secondary cell separator 1116.

Fig. 11B illustrates a number of possible cross-sectional configurations of slots, such as the first slot 1104 and the second slot 1107 shown in fig. 11A. View 1120 shows recess 1121. The recess 1121 includes a taper, wherein a top portion of the recess 1121 (e.g., an opening facing the interior of the housing) is wider than a bottom portion of the recess 1121 (e.g., an inner surface of the recess opposite the top portion). Dimension 1122 represents the width of groove 1121 at the top. Dimension 1124 represents the width of the dielectric edge seal of thermal barrier 1123. As shown, the tapered dimension 1122 aids in capturing and aligning the thermal barrier 1123 during assembly.

View 1130 shows groove 1131. The groove 1131 comprises a geometry wherein the top of the groove 1131 is narrower than the bottom of the groove 1131. Dimension 1132 represents the width of groove 1131 at the top. In one example, the groove 1131 includes a contoured cross section that substantially mirrors the cross section of the dielectric edge seal of the thermal barrier 1133. Dimension 1134 represents the width of the dielectric edge seal (with encapsulation layer) of thermal barrier 1133. As shown, dimension 1132 is slightly narrower than dimension 1134. The narrow top and contoured shape improves the retention of the thermal barrier 1133 within the groove 1131.

View 1140 shows a recess 1141. The recess 1141 includes a geometry wherein the top of the recess 1141 is narrower than the bottom of the recess 1141. Dimension 1142 represents the width of recess 1141 at the top. In one example, the recess 1141 includes a trapezoidal cross section. The trapezoidal cross section allows for more variation in the edge dimensions of the thermal barrier 1143 than the contoured cross section of the groove 1131. Dimension 1144 represents the width of the dielectric edge seal of thermal barrier 1143. As shown, dimension 1142 is slightly narrower than dimension 1144. The narrow top and trapezoidal cross section improves the retention of the thermal barrier 1143 within the recess 1141.

View 1150 shows a recess 1151. Recess 1151 comprises a geometry wherein the top of recess 1141 is substantially the same as the bottom of recess 1151. Dimension 1152 represents the width of recess 1151 at the top and bottom. Dimension 1154 represents the width of the dielectric edge seal of thermal barrier 1153. As shown, dimension 1152 is slightly wider than dimension 1154. This configuration facilitates easy positioning of the thermal barrier 1153 within the recess 1151, particularly when the dielectric edge seal of the thermal barrier 1153 is not very resilient and does not easily deform into the recess 1151.

Fig. 12 illustrates a battery module 1200 that includes one or more thermal barriers, as described in the present disclosure. The battery module 1200 includes a plurality of battery cells 1212. The battery cell 1212 is configured to be located within the battery housing 1202. The battery module 1200 includes one or more thermal barriers 1214 that are similar to the thermal barriers described with respect to fig. 9A-10B.

In the example of fig. 12, one or more slots are included to engage and secure the thermal barrier 1214 within the housing 1202. In a thermal runaway event, gas and/or emissions may be emitted from vent 1213 or other locations on battery cell 1212. The addition of the slots helps to control any hot gases and/or emissions. Fig. 12 shows a first slot 1204 included in a side wall of the housing 1202. Although the sides of the housing 1202 are shown with slots 1204, slots may also be included on the bottom or lid of the housing 1202. In the example of fig. 12, a top slot plate 1206 is included, wherein a plurality of second slots 1207 are included in slot plate 1206 adjacent to a cover 1208. Also shown is a bottom slot plate 1218, wherein a plurality of third slots 1219 are included in the bottom slot plate 1218. In one example, the bottom slot plate 1218 is a cooling plate. For example, a coolant flow may be included in the bottom slot plate 1218. The first, second, and third slots 1204, 1207, 1219 are positioned to align with and hold in place the thermal barrier 1214.

Fig. 12 also shows one or more secondary cell separators 1216. The secondary cell separator 1216 does not extend beyond the lateral cell footprint (e.g., the largest surface of the cell) of the cell 1212. In one example, the secondary battery cell separator 1116 includes a thermally conductive plate, and one or more of the top plate 1206 and bottom plate 1218 are formed of metal or other conductor and serve as cooling plates. In one example, the thermal barrier 1214 extends beyond the lateral cell footprint of the battery cell 1212. Although a combination of thermal barrier 1214 and secondary cell separator 1216 is shown, the invention is not so limited. Other examples include only one or the other of thermal barrier 1214 and secondary cell separator 1216.

Fig. 13A illustrates another example of a thermal barrier 1300. The thermal barrier 1300 is shown aligned with the battery cell 1302. The lateral battery footprint 1303 is shown by projection lines 1304, located within a middle portion of the thermal barrier 1300. Although only one thermal barrier 1300 and one battery cell 1302 are shown, it should be understood that the configuration may be extended to battery modules having multiple thermal barriers 1300 and multiple battery cells 1302, as described in this disclosure.

In the example of fig. 13A, a dielectric edge seal 1306 is shown around the edge of the core 1301 of the thermal barrier 1300. In the example of fig. 13A, corners 1308 of core 1301 are not covered by dielectric edge seal 1306. This configuration is easy to manufacture because double thickness of the dielectric edge seal 1306 at the corners is avoided.

Fig. 13B shows an end view of the thermal barrier 1300 wherein the battery cell 1302 is positioned adjacent to the thermal barrier 1300. Core 1301 is shown with dielectric edge seal 1306 at the edge of thermal barrier 1300. The battery cells 1302 are shown within a lateral battery footprint 1303 (e.g., the largest surface of the battery). Dielectric edge seal 1306 is shown thicker than core 1301. The battery footprint is smaller than the maximum surface of core 1301. A portion of the encapsulation layer 1310 above the dielectric edge seal 1306 is located between the battery cell 1302 and the core 1301, while the dielectric edge seal 1306 is located outside the footprint of the battery cell 1302. As described in other examples above, in this configuration, the edges of the thermal barrier 1300 are enhanced while still allowing the use of a thin thermal barrier 1300 within the lateral battery footprint 1303, thereby making the overall size of the battery module smaller.

In one example, encapsulation layer 1310 extends to cover the entire lateral battery footprint 1303. In selected examples, the portions of the tape, encapsulation layer, etc. securing the dielectric edge seal 1306 are located within the lateral cell footprint 1303. The thickness of the encapsulation layer 1310 is significantly less than the dielectric edge seal 1306. Thus, the thermal barrier is thinner within the battery footprint 1303 and thicker outside of the battery footprint 1303 to engage with the battery housing.

Fig. 13C illustrates another example of a thermal barrier 1350. A central portion 1352 of a thermal barrier 1350 is shown that corresponds to a lateral battery footprint similar to the example shown in fig. 13A.

In the example of fig. 13C, a dielectric edge seal 1356 is shown around three edges of the core of the thermal barrier 1350. In the example of fig. 13C, the corners 1354 of the core are covered by a dielectric edge seal 1356. This configuration eliminates any channels that may be present at the core corners, and in the event of thermal runaway, gases and/or jets may escape through the thermal barrier 1350. In the example of fig. 13C, fourth edge 1353 does not include any dielectric edge seals 1356. This configuration may allow thermal contact with the cooling plate, as shown in fig. 11A.

Thermal barrier with variously configured dielectric enhancement layers

Fig. 14A illustrates another aspect of a thermal barrier 1400. The thermal barrier 1400 comprises an insulator layer 1402 and a dielectric reinforcement layer 1403, the dielectric reinforcement layer 1403 forming a laminate with the insulator layer 1402. In fig. 14A, the dielectric reinforcing layer 1403 includes a fold 1407, the fold 1407 forming an envelope having a first side 1404 and a second side 1406. In the aspect of fig. 14A, an edge seal 1408 similar to the edge seal described above is also shown as an option. In one aspect, edge seals 1408 seal three edges of insulator layer 1402. The thermal barrier comprising the wrapper structure has the advantage that edge control along the fold 1407 is easier and manufacturing costs are reduced.

FIG. 14B illustrates another aspect of a thermal barrier 1410. The thermal barrier 1410 includes an insulator layer 1412 and a dielectric enhancement layer 1413. The dielectric enhancement layer 1413 is U-shaped having a first side 1414 and a second side 1416. The first side 1414 and the second side 1416 are connected by a bottom side 1417. The bottom side 1417 is perpendicular to the first side 1414 and the second side 1416. An edge seal 1418 seals the gap between the first side 1414 and the second side 1416, closing the insulator layer 1412 therebetween.

Fig. 14C illustrates another aspect of a thermal barrier 1420. The thermal barrier 1420 includes an insulator layer 1422 and a dielectric reinforcing layer 1423. The dielectric enhancement layer 1423 has a slot with an opening in one surface thereof, e.g., forming a pocket. Insulator layer 1422 is placed into a slot, such as a pocket, through an opening. The thermal barrier 1420 further includes an edge seal 1428 to seal the insulator layer 1422 into the groove of the dielectric reinforcing layer 1423, e.g., to seal the opening of the pocket.

Thermal barrier with dielectric enhancement layer and encapsulation layer

Fig. 15A illustrates a cross-sectional view of a thermal barrier 1500. The thermal barrier 1500 includes an insulator layer 1502 and dielectric reinforcing layers 1504 and 1506 on two opposite major surfaces of the insulator layer 1502. The thermal barrier 1500 also includes an encapsulation layer 1508 that encapsulates the insulator layer 1502 to prevent or contain dust from the insulator layer 1502. Encapsulation layer 1508 may completely or partially surround insulator layer 1502. In one aspect, the encapsulation layer 1508 completely surrounds the insulator layer 1502. Encapsulation layer 1508 is disposed between dielectric enhancement layers 1504 and 1506. The thermal barrier 1500 may also include an encapsulation layer 1508 and an adhesive layer (not shown) between each of the dielectric reinforcement layers 1504 and 1506.

In one aspect, the encapsulation layer 1508 may include Polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polycarbonate (PC), other polymers, rubber or resin films, or combinations thereof.

In one aspect, the encapsulation layer 1508 may include an adhesive layer, such as a Pressure Sensitive Adhesive (PSA). Encapsulation layer 1508 is pressed against insulator layer 1502 and completely surrounds insulator layer 1502. Dielectric reinforcement layers 1504 and 1506 may be pressed against both major surfaces of insulator layer 1502 and attached to both major surfaces of insulator layer 1502 by encapsulation layer 1508.

FIG. 15B illustrates a cross-sectional view of thermal barrier 1510. The thermal barrier 1510 includes dielectric reinforcement layers 1514, 1516 and an insulator layer 1512 therebetween. Unlike the thermal barrier 1500 shown in FIG. 15A, both the insulator layer 1512 and the dielectric enhancement layers 1514 and 1516 are encapsulated in an encapsulation layer 1518. Encapsulation layer 1518 may prevent any possible dust on insulator layer 1512 or dielectric enhancement layers 1514 and 1516. Encapsulation layer 1518 may also be used to hold insulator layer 1512 and dielectric reinforcement layers 1514 and 1516 without the use of an adhesive therebetween. In other aspects, the reinforcement layers 1514 and 1516 may be attached or adhered to the insulator layer 1512, e.g., using an adhesive, and the encapsulation layer 1518 may be attached or adhered to an outer surface of the thermal barrier 1510, e.g., using an adhesive. In certain aspects, the encapsulation layer may be attached or adhered to itself only, for example, by heat sealing or selective use of an adhesive on the overlapping surfaces.

Fig. 15C shows a cross-sectional view of a thermal barrier 1520. The thermal barrier 1520 includes an insulator layer 1522 and two dielectric reinforcement layers 1524 and 1526 attached to the insulator layer 1522 by an adhesive 1523. In one aspect, the adhesive 1523 is a spray adhesive, double sided tape, or PSA.

Optionally, thermal barrier 1520 in fig. 15C may also include an adhesive 1527 to attach to an adjacent battery cell (not shown). In one aspect, the adhesive 1527 is a double sided tape, PSA, or spray adhesive. In one aspect, the adhesive 1527 is in the shape of a plurality of stripes. In one aspect, adhesive 1527 is located at different locations on opposite surfaces of thermal barrier 1520 to reduce stack thickness when multiple thermal barriers 1520 are used in a battery module.

In certain aspects of fig. 15C, the adhesive 1527 and the encapsulation layer 1528 are protected by a release layer (RELEASE LAYER) 1525, and when a thermal barrier 1520 is applied to a battery cell (not shown), the release layer 1525 may be removed to expose the adhesive 1527. In the case where the encapsulation layer 1528 is a PSA, the release layer 1525 is directly attached to the encapsulation layer 1528 without the need for an adhesive 1527.

Fig. 15D shows an exploded view of the thermal barrier 1530. The thermal barrier 1530 includes an insulator layer 1532 and dielectric reinforcement layers 1534 and 1536. In one aspect, dielectric reinforcement layers 1534 and 1536 are attached to a major surface of insulator layer 1532 by adhesive 1533. The adhesive 1533 may completely or partially cover the major surface of the insulator layer 1532. In one aspect, the adhesive 1533 may be a strip of adhesive. In one aspect, the adhesive may be sprayed onto the insulator layer 1532 or the dielectric reinforcement layer 1534.

The thermal barrier 1530 in fig. 15D may also include an encapsulation layer 1538 surrounding the insulator layer 1532 and the dielectric reinforcement layers 1534 and 1536. At least one of the encapsulation layers 1538 each includes a major surface and at least one tab (flap) 1539 adjacent to the major surface. In some aspects, one encapsulation layer has a major surface with a footprint that is the same as or less than the insulator layer 1532 and dielectric enhancement layers 1534 and 1536, while the other encapsulation layer includes at least one tab 1539. In various aspects, at least one tab 1539 may be folded to surround and contact another encapsulation layer, thereby enclosing the insulator layer 1532 and the dielectric reinforcement layers 1534 and 1536.

The thermal barrier 1530 in fig. 15D may also include an adhesive layer 1537 to attach the thermal barrier 1530 to a battery cell (not shown). The adhesive 1537 may be a double sided tape or a spray adhesive. The adhesive layer 1537 may optionally be protected from external damage, such as scratches or dust, by the release layer 1535. The release layer 1535 is removable when a thermal barrier 1530 is applied to the battery cell (not shown). Fig. 16 illustrates a battery module 1600 that may include one or more thermal barriers, as described in this disclosure. A number of battery cells 1602 within a module housing 1604 are shown. The one or more battery cells 1602 are separated by at least one thermal barrier 1610. In fig. 16, a heat sink 1605 or cooling plate is included near one edge of the battery cell 1602 and thermal barrier 1610. As described above, in one example, the one or more thermal barriers 1610 include thermally conductive layers that facilitate lateral movement of heat to the heat sink 1605. A cover 1606 is shown that contains the battery unit 1602 and a thermal barrier 1610 within the housing 1604. In one aspect, a top insulator layer 1608 is included to prevent heat from escaping upward from the battery module 1600. In one aspect, the top insulator layer 1608 may be subjected to particle bombardment under extreme conditions (e.g., thermal runaway) to protect components (not shown) above the cap 1606. Examples of top insulator layer 1608 include, but are not limited to, aerogel materials. In one example, the top insulator layer 1608 includes a similar structure to the thermal barrier described in this disclosure, such as a dielectric reinforcement layer.

As described above, battery modules and/or battery packs having thermal barriers are used in a variety of electronic devices. Fig. 17 illustrates an example electronic device 1700 that includes a battery module 1710. The battery module 1710 is coupled to the functional electronic device 1720 through circuitry 1712. In the example shown, battery module 1710 and circuitry 1712 are contained within housing 1702. A charging port 1714 is shown coupled to the battery module 1710 to facilitate charging the battery module 1710 when needed.

In one example, functional electronic device 1720 includes a device such as a semiconductor device having transistors and memory circuits. Examples include, but are not limited to, telephones, computers, display screens, navigation systems, and the like.

Fig. 18 shows another electronic system utilizing a battery module including a thermal management system as described above. Fig. 18 shows an electric vehicle 1800. The electric vehicle 1800 includes a chassis 1802 and wheels 1822. In the example shown, each wheel 1822 is coupled to a drive motor 1820. Battery module 1810 is shown coupled to drive motor 1820 through circuitry 1806. The charging port 1804 is shown coupled to the battery module 1810 to charge the battery module 1810 when needed.

Examples of electric vehicle 1800 include, but are not limited to, consumer vehicles such as automobiles, trucks, and the like. Commercial vehicles, such as tractors and semi-trucks, also fall within the scope of the present invention. Although a four-wheeled vehicle is shown in the drawings, the invention is not limited thereto. For example, two-wheeled vehicles, such as motorcycles and scooters, are also within the scope of the present invention.

To better illustrate the methods and apparatus disclosed herein, a non-limiting list of examples is provided herein:

Aspect 1. A battery module includes a plurality of battery cells, at least one thermal barrier for separating selected battery cells of the plurality of battery cells, the thermal barrier including an insulator layer, and a dielectric reinforcement layer forming a laminate with the insulator layer.

Aspect 2. The battery module according to aspect 1, wherein the dielectric reinforcing layer comprises mica.

Aspect 3. The battery module according to aspect 2, wherein mica is contained in a silicone adhesive.

Aspect 4. The battery module according to aspect 1, wherein the insulator layer comprises aerogel.

Aspect 5. The battery module according to aspect 1, wherein the dielectric reinforcing layer includes a pair of dielectric reinforcing layers on both major surfaces of the insulator layer.

Aspect 6. The battery module according to aspect 1, wherein the dielectric reinforcing layer is attached to the insulator layer with an adhesive.

Aspect 7. The battery module according to aspect 6, wherein the adhesive comprises a first pressure sensitive adhesive.

Aspect 8 the battery module of aspect 6, further comprising a second pressure sensitive adhesive attaching a thermal barrier to the at least one battery cell.

Aspects 9. A battery module includes a plurality of battery cells within a module housing, the battery cells having a cell lateral footprint, a cover enclosing the module housing and covering the plurality of battery cells, wherein the cover defines a headspace between the plurality of battery cells and the cover, at least one thermal barrier for separating selected battery cells of the plurality of battery cells, the thermal barrier including an insulator layer having an insulator lateral footprint equal to or greater than the cell lateral footprint, and a reinforcement layer including a dielectric forming a laminate with the insulator layer, wherein the reinforcement layer including the dielectric extends beyond the insulator lateral footprint.

Aspect 10. The battery module according to aspect 9, wherein the reinforcement layer includes a pair of reinforcement layers on both major surfaces of the insulator layer.

Aspect 11. The battery module of aspect 10, wherein the reinforcement layer extends into the headspace.

Aspect 12 the battery module according to aspect 9, further comprising a seal between the battery cell and the cover.

Aspect 13. The battery module according to aspect 9, wherein the reinforcement layer extends laterally upward and from a side of the insulator layer.

Aspect 14 the battery module of aspect 9, further comprising a cooling plate adjacent to a bottom edge of the plurality of battery cells.

The battery module of aspect 15, wherein the reinforcement layer is inclined outward from the insulator layer.

Aspect 16. The battery module according to aspect 9, wherein the insulator layer comprises aerogel.

Aspect 17 the battery module of aspect 9, wherein the reinforcing layer comprises mica.

Aspect 18 the battery module of aspect 9, further comprising a top thermal barrier between the plurality of battery cells and the cover.

Aspect 19 the battery module of aspect 18, wherein the top thermal barrier comprises an aerogel and mica laminate.

Aspects 20. A battery module includes a plurality of battery cells within a module housing, the battery cells having a cell lateral footprint, a cover enclosing the module housing and covering the plurality of battery cells, wherein the cover defines a headspace between the plurality of battery cells and the cover, at least one layered thermal barrier separating selected battery cells of the plurality of battery cells, the thermal barrier including an insulator layer, a reinforcement layer including a dielectric forming a laminate with the insulator layer, and an edge seal, wherein the layered thermal barrier is sized such that the edge seal contacts the cover.

Aspect 21. The battery module of aspect 20, wherein the reinforcement layer comprises a pair of reinforcement layers on both major surfaces of the insulator layer.

Aspect 22. The battery module of aspect 20, wherein the reinforcement layer comprises an envelope having a fold.

Aspect 23 the battery module of aspect 20, wherein the cover includes a top insulator layer adjacent the lower cover surface.

Aspect 24 the battery module of aspect 23, wherein the top insulator layer comprises an aerogel and mica laminate.

Aspect 25 the battery module of aspect 20, wherein the insulator layer comprises aerogel.

Aspect 26. The battery module of aspect 20, wherein the reinforcing layer comprises mica.

Aspect 27 the battery module of aspect 20, wherein the edge seal comprises an adhesive tape.

Aspect 28 the battery module of aspect 20, wherein the edge seal comprises an intumescent material.

Aspect 29. The battery module of aspect 20, wherein the edge seal is wider than the widths of the insulator layer and the reinforcement layer.

Aspect 30. A thermal barrier includes an insulator layer, an encapsulation layer surrounding the insulator layer, and a dielectric reinforcement layer forming a laminate with the insulator layer and the encapsulation layer.

Aspect 31. The thermal barrier of aspect 30, wherein the encapsulation layer encapsulates the dielectric reinforcement layer.

Aspect 32. The thermal barrier of aspect 30, wherein the insulator layer and the dielectric reinforcement layer are separated by an encapsulation layer.

Aspect 33. The thermal barrier of aspect 30, wherein the encapsulation layer is an adhesive layer.

Aspect 34. The thermal barrier of aspect 30, wherein the encapsulation layer is a pressure sensitive adhesive layer.

Aspect 35. The thermal barrier of aspect 30, wherein the thermal barrier further comprises an adhesive layer between the insulator layer and the dielectric reinforcement layer.

Aspect 36. The thermal barrier of aspect 30, wherein the thermal barrier further comprises an adhesive layer over the encapsulation layer.

Aspect 37 the thermal barrier of aspect 33, wherein the thermal barrier further comprises a release layer over the adhesive layer.

Aspect 38. The thermal barrier of aspect 30, wherein the dielectric reinforcement layer is a first dielectric reinforcement layer disposed on one side of the insulator layer, and wherein the thermal barrier further comprises a second dielectric reinforcement layer disposed on the other side of the insulator layer.

Aspect 39. A battery module includes a plurality of battery cells within a module housing, each battery cell having a corresponding battery cell lateral footprint, at least one thermal barrier separating selected battery cells of the plurality of battery cells, the at least one thermal barrier including a core insulator layer, and a dielectric edge seal closing one or more edges of the core insulator layer.

Aspect 40 the battery module of aspect 39, wherein the core insulator layer comprises an aerogel layer.

Aspect 41 the battery module of aspect 39, wherein the dielectric edge seal comprises mica.

Aspect 42 the battery module of aspect 39, further comprising an encapsulation layer covering the dielectric edge seal.

Aspect 43 the battery module of aspect 39, further comprising an encapsulation layer covering the entire dielectric edge seal and the entire core insulator layer.

Aspect 44 the battery module of aspect 39, wherein the dielectric edge seal covers the entire core insulator layer.

Aspect 45 the battery module of aspect 42, wherein the encapsulation layer comprises tape.

Aspect 46 the battery module of aspect 39, wherein the dielectric edge seal surrounds three edges and a fourth edge of the thermal barrier contacts the cooling plate.

Aspect 47. The battery module of aspect 39, wherein one or more sides of the housing include a groove corresponding to an edge of the at least one thermal barrier.

Aspect 48 the battery module of aspect 47, wherein the top of the groove is narrower than the bottom of the groove.

Aspect 49 the battery module of aspect 47, wherein the bottom of the groove is narrower than the top of the groove.

Aspect 50 the battery module of aspect 47, wherein the grooves comprise one or more grooves in the side walls of the housing.

Aspect 51 the battery module of aspect 39, further comprising one or more recess plates contained within the housing.

Aspect 52 the battery module of aspect 51, wherein the one or more recess plates comprise a top recess plate and a bottom recess plate.

Aspect 53 the battery module of aspect 39, wherein the dielectric edge seal surrounds an edge of the core insulator layer, but does not surround a corner of the core insulator layer.

Aspect 54 the battery module of aspect 39, wherein the dielectric edge seal surrounds edges and corners of the core insulator layer.

Aspect 55 the battery module of aspect 39, wherein the dielectric edge seal continuously spans three edges of the core insulator layer.

Aspect 56 the battery module of aspect 39, wherein the dielectric edge seal covers a portion of the insulator layer that is laterally outside of the cell lateral footprint.

Aspect 57 the battery module of aspect 39, wherein the battery module further comprises a secondary battery cell separator having a footprint that is less than a thermal barrier.

The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be used, for example, by one of ordinary skill in the art after reviewing the above description. The abstract meets 37c.f.r. ≡

1.72 (B) in order for the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Furthermore, in the above detailed description, various features may be combined together to simplify the disclosure. This should not be interpreted as intending to treat the unclaimed disclosed features as essential features of any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

While the summary of the present subject matter has been described with reference to specific example embodiments, various modifications and changes may be made to these embodiments without departing from the broader scope of the embodiments of the disclosure. These embodiments of the inventive subject matter may be referred to, individually or collectively, herein by the term "application" merely for convenience and without intending to voluntarily limit the scope of this application to any single disclosure or inventive concept if more is in fact disclosed.

The embodiments illustrated herein are described in sufficient detail to enable those skilled in the art to practice the disclosed teachings. Other embodiments may be utilized and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. The detailed description is, therefore, not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

As used herein, the term "or" may be interpreted in an inclusive or exclusive sense. Further, multiple instances may be provided for a resource, operation, or structure described herein as a single instance. Furthermore, the boundaries between various resources, operations, modules, engines, and data stores are somewhat arbitrary, and particular operations are illustrated in the context of particular illustrative configurations. Other allocations of functionality are contemplated and may fall within the scope of various embodiments of the present disclosure. In general, structures and functions presented as separate resources in the example configuration may be implemented as a combined structure or resource. Similarly, the structures and functions presented as a single resource may be implemented as separate resources. These and other variations, modifications, additions, and improvements fall within the scope of the embodiments of the disclosure as expressed in the following claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.

The foregoing description, for purposes of explanation, has been described with reference to specific exemplary embodiments. The illustrative discussions above are not intended to be exhaustive or to limit the possible exemplary embodiments to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to best explain the principles involved and its practical application, to thereby enable others skilled in the art to best utilize various exemplary embodiments with various modifications as are suited to the particular use contemplated.

It will be further understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first contact may be referred to as a second contact, and similarly, a second contact may be referred to as a first contact without departing from the scope of the present example embodiment. The first contact and the second contact are both contacts, but not the same contact.

The terminology used in the description of the example embodiments herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used in the description of the example embodiments and the appended examples, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

As used herein, the term "if" may be interpreted as "when" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrase "if determined" or "if detected [ the condition or event ]" may be interpreted as "determining" or "in response to determining" or "in detecting [ the condition or event ]" or "in response to detecting [ the condition or event ]" depending on the context.

Claims

1. A battery module, comprising:

a plurality of battery cells disposed within the module housing, each of said battery cells having a corresponding battery cell lateral footprint;

at least one thermal barrier for separating selected battery cells from the plurality of battery cells, the at least one thermal barrier comprising:

an insulator layer having an insulator lateral footprint equal to or greater than the battery cell lateral footprint; and

A first layer includes a dielectric on the insulator layer, wherein the first layer extends beyond the insulator lateral footprint.

2 . The battery module according to claim 1 , wherein the first layer including the dielectric is located on a first major surface of the insulator layer, and further comprises a second layer including the dielectric, the second layer being located on a second major surface of the insulator layer.

3. A battery module according to claim 2, characterized in that the first layer, the second layer or both extend to a top space, wherein the top space is defined by the module housing, a cover that encloses the module housing and covers the plurality of battery cells, and wherein the top space is the volume between the top surface of the battery cell and the cover.

4 . The battery module according to claim 3 , further comprising a seal between the battery cell and the cover.

5 . The battery module according to claim 1 , wherein the first layer extends laterally upward from a side surface of the insulator layer.

6 . The battery module according to claim 1 , further comprising a cooling plate adjacent to bottom edges of the plurality of battery cells.

7 . The battery module according to claim 2 , wherein the first layer is inclined outward from the insulator layer.

8 . The battery module of claim 1 , wherein the insulator layer comprises aerogel.

9 . The battery module of claim 1 , wherein the first layer comprises mica.

10 . The battery module according to claim 9 , wherein the mica is contained in a silicone adhesive.

11 . The battery module of claim 1 , further comprising a top thermal barrier between the plurality of battery cells and a cover closing the module housing and covering the plurality of battery cells.

12. The battery module of claim 11, wherein the top thermal barrier comprises an aerogel and mica laminate.

13. The battery module of claim 1 , wherein the at least one thermal barrier further comprises an edge seal on at least one secondary surface of the at least one thermal barrier, wherein the thermal barrier is sized such that at least a portion of the edge seal contacts a cover enclosing the module housing and covering the plurality of battery cells.

14 . The battery module according to claim 1 , further comprising a packaging layer surrounding the first layer.

15 . The battery module according to claim 1 , further comprising an encapsulation layer disposed between the insulator layer and the first layer.