CN119511056A - A blind hole reliability testing method, equipment, device and system - Google Patents
A blind hole reliability testing method, equipment, device and system Download PDFInfo
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- G01R31/302—Contactless testing
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/67—Testing the correctness of wire connections in electric apparatus or circuits
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Abstract
本发明涉及一种盲孔可靠性测试方法、设备、装置及系统，其方法包括：将激光束射向线路板并对准盲孔进行激光加热以施加热场，形成温度梯度；对盲孔进行电学测试或机械力学测试或金相学测试，以判断连接孔导电柱与下导电层或/和上导电层之间电连接的可靠性。本发明通过激光束局部高温加热，对盲孔孔底电镀金属与原生金属的机械与电子连接，进行节能、高效、在线全检盲孔可靠性测试，填补了全球行业空白，让行业不再对线路板盲孔视为畏途；同时根据本发明原理，由于温度梯度的存在，盲孔内电镀金属局部加热温度可以远高于中间绝缘层的绝缘材料能承受的温度，其测试的严格程度远高于目前行业的温度循环箱体测试，具备更可靠性的检测结果。
The present invention relates to a blind hole reliability test method, equipment, device and system, and the method includes: emitting a laser beam to a circuit board and aiming at the blind hole for laser heating to apply a thermal field to form a temperature gradient; performing electrical testing or mechanical testing or metallographic testing on the blind hole to determine the reliability of the electrical connection between the conductive column of the connection hole and the lower conductive layer or/and the upper conductive layer. The present invention uses a laser beam to perform local high-temperature heating to perform energy-saving, high-efficiency, and full-online blind hole reliability testing on the mechanical and electronic connection between the electroplated metal at the bottom of the blind hole and the original metal, filling the global industry gap and allowing the industry to no longer be afraid of blind holes in circuit boards; at the same time, according to the principle of the present invention, due to the existence of a temperature gradient, the local heating temperature of the electroplated metal in the blind hole can be much higher than the temperature that the insulating material of the intermediate insulating layer can withstand, and the strictness of the test is much higher than the current industry temperature cycle box test, with more reliable test results.
Description
Technical Field
The invention relates to the field of blind hole testing of circuit boards, in particular to a blind hole reliability testing method, equipment, a device and a system.
Background
Blind holes are the content of the color change of the circuit board industry for decades, and the key is that the existing blind hole production means is difficult to control hole bottom residual glue and hole bottom copper-carbon alloy, and once the blind hole is found, a large amount of products are scrapped, so that the blind hole production method is tragic. The existing blind hole management and control is experience management and control, sampling inspection, such as ice-coating, and sampling inspection is destructive inspection. The sampling inspection in the current industry is mainly temperature cycle impact test. The other AOI full inspection in the production process only checks whether the hole bottom is residual glue or not, and does not check the alloy (such as copper-carbon alloy) of the metal and the carbon at the hole bottom of the blind hole, the four-wire test inspection after electroplating only checks whether the hole bottom is residual glue or not, if the copper-carbon alloy is only used, the conductivity is not changed too much, so that the four-wire inspection is not performed, but the existence of the copper-carbon alloy at the hole bottom of the blind hole is a fatal problem.
In the current circuit board industry, whether it is a soft board, a hard board, a soft and hard combined board, a carrier board, a high-frequency high-speed board, an AI board, an automobile board and the like, once a circuit board blind hole is involved, a link of testing the reliability of the blind hole exists, the current blind hole reliability test is generally carried out by adopting a temperature cycle impact mode, some of the blind hole reliability test adopts a cycle from minus low temperature to plus zero high temperature, some of the blind hole reliability test adopts a cycle from 50 ℃ to 245 ℃ or even 260 ℃ to carry out the temperature cycle impact, the temperature cycle speed is very slow, the temperature cycle is carried out for the whole circuit board temperature balance, the temperature cycle is usually relatively fast, so that 30 temperature cycles are carried out, a great deal of time is required, the test can not be carried out on-line test of the circuit board production line, but the test is carried out by taking a physical laboratory to carry out a sample off-line, and the blind hole reliability full-detection test can not be realized. The industry is urgent to find a way to check out the blind holes with residual glue or copper-carbon alloy at the bottoms of the blind holes and realize full detection so as to thoroughly avoid blind hole accidents.
Disclosure of Invention
The invention provides a blind hole reliability test method, equipment, a device and a system, which can solve the problem that the blind hole reliability test cannot realize the online, efficient and full-detection test of the pain spot in the industry.
The technical scheme for solving the technical problems is as follows:
The invention provides a blind hole reliability test method, which is used for testing the reliability of a blind hole on a circuit board, wherein the circuit board at least comprises a lower conductive layer, an intermediate insulating layer and an upper conductive layer which are laminated;
the blind hole reliability test method comprises the following steps:
The first step is that laser beams are shot to the circuit board, and laser heating is conducted aiming at the blind holes to apply a thermal field, so that temperature gradients are formed on the upper conducting layer, the connecting hole conducting columns and the lower conducting layer, and meanwhile, temperature gradients are formed between the conducting area of the circuit board and the middle insulating layer around the blind holes;
Wherein, the temperature gradient and the temperature of the thermal field are controlled by controlling the heating speed and the intensity of the laser beam; the thermal field with temperature gradient forms stress field between the connecting hole conductive column and the upper conductive layer and the lower conductive layer;
and step two, performing an electrical test, a mechanical test or a metallographic test on the blind holes to judge the reliability of the electrical connection between the connecting hole conductive columns and the lower conductive layer or/and the upper conductive layer.
The invention provides blind hole reliability test equipment, which is used for testing the reliability of blind holes on a circuit board, wherein the circuit board at least comprises a lower conductive layer, an intermediate insulating layer and an upper conductive layer which are laminated, a connecting hole conductive column is arranged in the blind holes, penetrates through the intermediate insulating layer and is connected with the upper conductive layer at the orifice of the blind holes, and the bottom of the blind holes is connected with the lower conductive layer;
The blind hole reliability test equipment comprises:
the motion platform is used for bearing the circuit board and driving the circuit board to move;
the positioning module is used for positioning the circuit board on the motion platform to obtain positioning information;
A laser for generating a laser beam;
The vibrating mirror scanning and flat field focusing device is connected with the laser and the positioning module and is used for conducting vibrating mirror scanning and flat field focusing on the laser beam, outputting the laser beam, directing the output laser beam to the circuit board according to the positioning information, and conducting laser heating aiming at the blind hole to apply a thermal field, so that temperature gradients are formed on the upper conducting layer, the connecting hole conducting column and the lower conducting layer, and meanwhile, temperature gradients are formed between a conducting area of the circuit board and an intermediate insulating layer around the blind hole;
Wherein, the temperature gradient and the temperature of the thermal field are controlled by controlling the heating speed and the intensity of the laser beam; the thermal field with temperature gradient forms stress field between the connecting hole conductive column and the upper conductive layer and the lower conductive layer;
And the test module is used for carrying out an electrical test, a mechanical test or a metallographic test on the blind holes so as to judge the reliability of the electrical connection between the connecting hole conductive columns and the lower conductive layer or/and the upper conductive layer.
In a third aspect, the present invention provides a blind hole reliability test device, comprising a processor, a memory, and a computer program stored in the memory and operable on the processor, wherein the computer program is operable to implement the blind hole reliability test method as described above.
In a fourth aspect, the invention provides a blind hole reliability test system, which comprises a machine table, a laser and the blind hole reliability test device, wherein the blind hole reliability test device is electrically connected with the laser;
The machine is used for bearing a circuit board to be processed;
The laser is used for generating a laser beam;
The blind hole reliability testing device is used for controlling laser beams generated by the laser to irradiate the circuit board, and aiming at the blind holes on the circuit board to perform laser heating so as to apply a thermal field, so that temperature gradients are formed on the upper conductive layer, the connecting hole conductive columns and the lower conductive layer, and meanwhile, temperature gradients are formed between the conductive region of the circuit board and the middle insulating layer around the blind holes;
Wherein, the temperature gradient and the temperature of the thermal field are controlled by controlling the heating speed and the intensity of the laser beam; the thermal field with temperature gradient forms stress field between the connecting hole conductive column and the upper conductive layer and the lower conductive layer;
And performing an electrical test, a mechanical test or a metallographic test on the blind holes to judge the reliability of the electrical connection between the connecting hole conductive posts and the lower conductive layer or/and the upper conductive layer.
The method, the device and the system for testing the reliability of the blind hole have the advantages that the mechanical and electronic connection between the electroplated metal and the original metal at the bottom of the blind hole is realized through the local high-temperature heating of the laser beam, the energy-saving, efficient and online full-detection of the reliability of the blind hole is realized, the blank of the global industry is filled, the industry is not regarded as dangerous road to be regarded as the blind hole of the circuit board any more, meanwhile, the local heating temperature of the electroplated metal in the blind hole can be far higher than the temperature which can be born by the insulating material of the middle insulating layer due to the existence of the temperature gradient, the testing strictness is far higher than that of the temperature circulation box body test in the current industry, and the method, the device and the system have more reliable detection results.
Drawings
FIG. 1 is a flow chart of a blind hole reliability testing method according to the present invention;
FIG. 2 is an exemplary diagram of a reliability test performed on blind holes on a circuit board in one implementation;
FIG. 3 is another exemplary diagram of a reliability test performed on blind holes on a circuit board in one implementation;
FIG. 4 is a schematic diagram of the reliability test failure shown in FIG. 2;
FIG. 5 is a schematic diagram showing the passing of the reliability test shown in FIG. 2;
FIG. 6 is a schematic diagram of the reliability test failure shown in FIG. 3;
FIG. 7 is a schematic diagram showing the passing of the reliability test shown in FIG. 3;
FIG. 8 is a cross-sectional view of a second order blind via;
FIG. 9 is a cross-sectional view of a stacked hole;
fig. 10 is a cross-layer hole cross-sectional view.
In the drawings, the list of components represented by the various numbers is as follows:
1. The semiconductor device comprises a lower conductive layer, an intermediate insulating layer, an upper conductive layer, a 4a, a blind hole, a 4b, a connecting hole conductive column, a 5, a grain boundary surface, a 6, a surface electroplated layer, a 7, a laser beam, an 8, a thermal field, a 9, a gap, an 11, a third conductive layer, a 12, a cross-layer insulating layer, a 21, a second intermediate insulating layer, a 22, a third intermediate insulating layer, a 111 and a fourth conductive layer.
Detailed Description
The principles and features of the present invention are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
Embodiment one:
the blind hole reliability test method is characterized in that a blind hole on a circuit board is subjected to reliability test, the circuit board at least comprises a lower conductive layer, an intermediate insulating layer and an upper conductive layer which are laminated, and the bottom of the blind hole is the lower conductive layer;
As shown in fig. 1, the blind hole reliability test method includes:
The first step is that laser beams are shot to the circuit board, and laser heating is conducted aiming at the blind holes to apply a thermal field, so that temperature gradients are formed on the upper conducting layer, the connecting hole conducting columns and the lower conducting layer, and meanwhile, temperature gradients are formed between the conducting area of the circuit board and the middle insulating layer around the blind holes;
Wherein, the temperature gradient and the temperature of the thermal field are controlled by controlling the heating speed and the intensity of the laser beam; the thermal field with temperature gradient forms stress field between the connecting hole conductive column and the upper conductive layer and the lower conductive layer;
and step two, performing an electrical test, a mechanical test or a metallographic test on the blind holes to judge the reliability of the electrical connection between the connecting hole conductive columns and the lower conductive layer or/and the upper conductive layer.
Specifically, as shown in fig. 2 or fig. 3, the circuit board includes a lower conductive layer 1, an intermediate insulating layer 2 and an upper conductive layer 3, a blind hole 4a is processed on the upper conductive layer 3, the blind hole 4a passes through the intermediate insulating layer 2, and the bottom of the blind hole is the surface of the lower conductive layer 1. After the circuit board passes through a black hole, a shadow or electroless copper plating, the lower conductive layer 1 and the upper conductive layer 3 have conductive performance, so that the surface of the upper conductive layer 3 is plated with a surface plating layer 6 through plating lines or filling lines, if the lower surface of the lower conductive layer 1 is not provided with an insulating layer, the lower surface of the lower conductive layer 1 is also plated with a metal, and if the lower surface of the lower conductive layer 1 is still made of insulating material, the lower surface of the lower conductive layer 1 is not plated with the metal.
After the blind hole 4a is electroplated, a connecting hole conductive post 4b is formed in the hole of the blind hole 4a, the connecting hole conductive post 4b is physically and electrically connected with the lower conductive layer 1 and the upper conductive layer 3, and crystal interfaces are formed between the connecting hole conductive post 4b and the lower conductive layer 1 and between the connecting hole conductive post 4b and the upper conductive layer 3, which are the interfaces between the electroplated layer and the original conductive layer and are the weakest places of the blind hole reliability. Among them, the grain boundary 5 between the connection hole conductive post 4b and the lower conductive layer 1 is where the blind hole 4a is at the greatest risk of failure. The crystal interface 5 is an interface between the electroplated layer and the original conductive layer, and has many lattice defects, various stresses naturally exist, the probability of containing impurities is high, for example, the carbon content is too high, an alloy of metal and carbon exists (for example, when the electroplated layer and the original conductive layer are both made of copper, the alloy of metal and carbon is copper-carbon alloy), or even worse, carbon-containing organic matters such as residual gum and P I polyimide exist, so that once inorganic matters are too much in impurities, the lower conductive layer 1 and the connecting hole conductive posts 4b are disconnected at the crystal boundary surface 5 due to environmental influence or time reasons, systematic faults and disastrous are caused, and once the organic matters exist, the connecting hole conductive posts 4b are in direct blind hole risk, so that the electric connection between the upper conductive layer 1 and the lower conductive layer 3 is failed.
As shown in fig. 2, the laser beam 7 is shot to the blind hole 4a in the surface electroplated layer 6 to directly generate a thermal field 8, and the heat of the thermal field 8 is transmitted to the connecting hole conductive post 4b and the corresponding lower conductive layer 1 to form a strong temperature gradient, so that not only is the temperature gradient generated between the conductive area (including the upper conductive layer 3, the connecting hole conductive post 4b and the lower conductive layer 1) of the circuit board and the middle insulating layer 2, but also the thermal expansion coefficient is different along with the temperature rise, the thermal expansion coefficient of nonmetal is generally larger than that of metal, and the connecting hole conductive post 4b and the lower conductive layer 1 generate a great thermal stress field at the grain boundary surface 5, so that not only shearing force, but also tensile stress and the like exist. In this case, 1) when the connecting hole conductive post 4b and the lower conductive layer 1 are connected without impurities (lattice defect stress and the like are not excluded), heat of the connecting hole conductive post 4b is smoothly introduced into the lower conductive layer 1, a temperature gradient between the connecting hole conductive post 4b and the lower conductive layer 1 is small, a thermal stress (mainly, tensile stress) of a grain boundary surface 5 where the connecting hole conductive post 4b and the lower conductive layer 1 are connected is small, and the connecting surface is kept in a normal state with a high probability. 2) When impurities or gaps exist in the grain boundary surface 5 where the connecting hole conductive column 4b is connected with the lower conductive layer 1, heat of the connecting hole conductive column 4b is delayed to be led into the lower conductive layer 1, the temperature gradient of the connecting hole conductive column 4b and the lower conductive layer 1 is large, the grain boundary surface 5 where the connecting hole conductive column 4b is connected with the lower conductive layer 1 generates large thermal stress (mainly shear stress), and in addition, the conductive layer (comprising the lower conductive layer 1 and the upper conductive layer 3) and the middle insulating layer 2 also have temperature gradient, the middle insulating layer 2 is expanded by heating and is extruded by the lower conductive layer 1 and the upper conductive layer 3, the middle insulating layer 2 is subjected to compressive stress, the lower conductive layer 1 and the upper conductive layer 3 are physically connected by the connecting hole conductive column 4b, the lower conductive layer 1 and the upper conductive layer 3 are subjected to tensile stress, and finally, the tensile stress acts on two ends of the connecting hole conductive column 4b, wherein the crystal boundary surface 5 is generated or broken under the combined stress of the shearing force, the tensile stress and the like when the temperature gradient is large enough. 3) When an organic matter, such as a residual glue, exists at the crystal interface 5 where the connecting hole conductive post 4b is connected with the lower conductive layer 1, the residual glue has poor thermal conductivity, and is thermally expanded, so that the connecting hole conductive post 4b is directly "exploded" with the lower conductive layer 1 to cause mechanical connection failure and electrical connection failure, in such a case, the connecting hole conductive post 4b is expanded with the middle insulating layer 2 around the lower conductive layer 1 to generate tensile stress, the connecting hole conductive post 4b is not consistent with the thermal expansion of the lower conductive layer 1 to generate shearing force, and the connecting hole conductive post 4b is heated to generate explosion pressure due to severe expansion of the organic matter in the middle of the lower conductive layer 1, so that the electrical connection failure occurs first.
The transfer direction of heat energy is transferred from high temperature to low temperature, and the spatial change of the high temperature and the low temperature is called temperature gradient. The temperature gradient of the invention comprises that laser continuously heats and maintains the local constant temperature state of the circuit board (the heat of a heating area can be constantly radiated, and the heat input of laser heating is assisted, so that the local constant temperature is maintained).
After laser heating the blind holes with the laser beam 7 to apply a thermal field, the blind holes are then tested electrically or mechanically or metallographically. Wherein:
The electrical test of the blind hole is specifically that when the connecting hole conductive post 4b is connected with the lower conductive layer 1 without impurities, the two ends of the connecting hole conductive post 4b are subjected to on-line electrical test or off-line electrical test afterwards, the electrical property of the connection of the lower conductive layer 1 and the upper conductive layer 3 through the connecting hole conductive post 4b is not changed, and when the grain boundary surface 5 of the connection of the connecting hole conductive post 4b and the lower conductive layer 1 has impurities or gaps and forms microcracks or even breaks due to overlarge thermal stress, the electrical property of the connection of the lower conductive layer 1 and the upper conductive layer 3 through the connecting hole conductive post 4b is changed. The electrical test refers to electrical tests in terms of capacitance, resistance, inductance, voltage, current and the like, and the electrical performance refers to electrical parameters such as capacitance, resistance, inductance and the like.
In addition, the manner of electrical testing includes four-wire testing and two-wire testing. The circuit board test is an indispensable link in electronic production, wherein four-wire test and two-wire test are two commonly used test methods.
Four-wire test is to test by introducing test signals into two of four pins of a PCB, and the other two pins receive return signals; the four-wire test can test whether the circuit board functions normally by respectively adding the VCC, GND, signal output and signal input on the circuit board. The four wires are respectively connected with VCC, GND, signal wires and input wires on the circuit board, and the circuit board can be ensured to work normally by carrying out system test on the circuit board. The principle of four-wire testing of a circuit board is based on resistance measurement, and during the test, test equipment injects current into a signal output line of the circuit board and measures the voltage between the signal output line and a signal input line. In this way, the signal input resistance and the signal output resistance, and the signal output offset voltage, the ac coupling, and other indicators can be calculated. According to the indexes, whether the output and the input of the circuit board meet the design requirements or not can be judged, and whether the function of the circuit board is normal or not can be further detected.
The two-wire test is to test the resistance value between two pins and realize the test by connecting a resistor between the test pins, and the method can only test basic parameters such as conductivity, resistance value and the like and cannot test other electric parameters.
The mechanical test of the blind hole is specifically that the mechanical test is carried out on the connection of the connecting hole conductive column 4b and the grain boundary surface 5 of the lower conductive layer 1, and the mechanical property of the connection is ensured not to be changed by carrying out the hole copper tensile test on the connecting hole conductive column 4 b. If the tensile test results in a break in the connection, the product may be judged to be unacceptable.
The metallographic test of the blind hole comprises the steps of slicing a metallographic mechanical section of hole copper, observing that a grain boundary surface 5 connected with the upper conductive layer 3 and/or the lower conductive layer 1 by the connecting hole conductive column 4b is not broken or microcracked under a microscope, indicating that the hole copper is well connected, and otherwise, judging that the hole copper is bad.
The blind hole reliability temperature cycle impact test of the circuit board in the current industry has the following defects that 1) energy is consumed, the temperature cycle test is to heat the internal temperature of the whole test cabinet body to raise the whole temperature of the circuit board, 2) the temperature cycle impact test is low in efficiency, the temperature cycle impact test needs the whole temperature of the circuit board to raise, the insulating material is a hot bad conductor and is slow in temperature rise, 3) the blind hole reliability temperature cycle impact test can only be used for off-line test and is destructive sampling test, on-line full-detection test cannot be realized, and 4) the highest temperature cannot exceed the temperature which can be born by the insulating material, so that the highest temperature is generally 245 ℃ and cannot exceed 260 ℃ at most, and the highest temperature is limited by the highest temperature which can be born by the insulating material.
The invention has the advantages that 1) energy is saved, the invention adopts the laser beam to directly irradiate the connecting hole conductive column, which is the weakest part to be tested in temperature circulation, a local thermal field with larger temperature gradient is directly formed, the test target can be realized by using the minimum energy input, 2) the invention has high efficiency, the laser beam heating speed is extremely high, the local thermal field with huge temperature gradient is formed in the shortest time, 3) the invention can realize on-line test, the laser beam can carry out the local heating test with high efficiency, the next procedure can be carried out through the heating test (equivalent to aging test), the conductive column cannot be directly scrapped through the next procedure, 4) the invention can realize the local high temperature test, the laser beam can locally heat the conductive material to extremely high temperature (such as the laser cutting of a circuit board is high, the copper layer can be gasified, but the bonding force between the insulating material of the circuit board and the copper layer is not influenced), the extremely high temperature gradient is obtained, thereby not only the traditional tension test factor is introduced, but also the shearing force test factor of the crystal interface is introduced, the traditional circuit board temperature impact circulation test is carried out, the internal temperature of the circuit board is relatively high, namely the temperature of the circuit board can be relatively high, the temperature gradient can be controlled to be relatively high, the temperature gradient is relatively high, the temperature gradient can be balanced, the temperature of the conductive column can be connected with the laser beam is relatively high (the temperature gradient is relatively high, and the temperature gradient can be compared with the temperature gradient is relatively high, and the temperature gradient can be balanced, and the temperature test is relatively high when the temperature is relatively high temperature gradient is relatively low.
The method of the invention also has the following preferable scheme:
Preferably, in the first step, before the laser beam is emitted to the circuit board, the circuit board is placed on a heat sink.
Specifically, the heat sink is an object capable of rapidly conducting heat away. The heat sink can enable the circuit board attached to the heat sink to dissipate heat naturally and passively or actively at a controllable temperature. The heat sink is added, so that heat conduction of a region far away from the laser heating point is faster, the temperature gradient of a thermal field can be enhanced, and the detection effect and the requirements are further improved.
Preferably, in the first step, the laser beam is directed to the circuit board, specifically, the laser beam is directed to the upper conductive layer or/and the lower conductive layer of the circuit board;
when a laser beam is emitted to an upper conductive layer of the circuit board, the thermal field is specifically an upper thermal field, and the direction of the temperature gradient of the upper thermal field is directed to the lower conductive layer from the upper conductive layer;
when the laser beam is emitted to the lower conductive layer of the circuit board, the thermal field is specifically a lower thermal field, and the direction of the temperature gradient of the lower thermal field is directed to the upper conductive layer from the lower conductive layer;
When the laser beam is directed to the upper conductive layer and the lower conductive layer of the circuit board, the thermal field comprises an upper thermal field and a lower thermal field, the direction of the temperature gradient of the upper thermal field is directed to the lower conductive layer from the upper conductive layer, and the direction of the temperature gradient of the lower thermal field is directed to the upper conductive layer from the lower conductive layer.
Specifically, the laser beam may be emitted to the upper conductive layer, the thermal field temperature gradient direction is directed to the lower conductive layer from the upper conductive layer, or emitted to the lower conductive layer from the lower conductive layer, or emitted to the upper conductive layer and the lower conductive layer simultaneously or sequentially (when the laser beam is emitted to the upper conductive layer and the lower conductive layer simultaneously, the laser beam is provided with two beams, and the two beams are respectively emitted to the upper conductive layer and the lower conductive layer). The heating point of the laser beam on the conductive material is preferably closest to the interface of the conductive stud of the connecting hole and the lower conductive layer, so that a temperature gradient can be formed at the highest speed on the crystal interface 5.
For example, as shown in fig. 2, the upper conductive layer 3 is 9 micrometers thick copper, the lower conductive layer 1 is 30 micrometers thick copper, a circuit board (not shown in the figure) with other layer structures can be arranged below the lower conductive layer 1, the middle insulating layer 2 is a high-speed insulating material with the thickness of 75 micrometers of the circuit board, the upper aperture of the blind hole 4a is 150 micrometers, the lower aperture of the blind hole is 120 micrometers, after the processes of electroless copper deposition, hole filling electroplating and the like, the blind hole 4a is filled with the connecting hole conductive column 4b, and the thickness of the surface electroplated layer 6 is 10 micrometers. The greatest risk point of the reliability of the blind hole is the binding force of the connecting hole conductive post 4b and the grain boundary surface 5 of the lower conductive layer 1, the embodiment adopts a 50 watt@100 KHz green laser to output a laser beam 7, the pulse width is 30 nanoseconds, a heating spot of the laser beam 7 adopts a round flat-top design, the spot size is 60 micrometers, the heating time is set to 500 microseconds to 10 milliseconds, and the laser beam 7 carries out laser heating on the position of the blind hole orifice of the upper conductive layer 3. And then slicing the blind hole, wherein if the crystal interface 5 is not cracked or broken or gaps are not formed, as shown in fig. 5, the blind hole is reliable, and if the crystal interface 5 is cracked or gaps are formed, as shown in fig. 4, as shown in the hole bottom gap 9 of the blind hole (for convenience of expression, the gap 9 is marked at the hole bottom of the other blind hole), the temperature impact of the blind hole is not passed, the blind hole is unreliable in judgment, and the specific reasons are analyzed by other working procedures.
For example, as shown in fig. 3, the upper conductive layer 3 is copper with a thickness of 12 micrometers, the lower conductive layer 1 is copper sheet with a thickness of 12 micrometers, a circuit board (not shown in the figure) with other layer structures is arranged below the lower conductive layer 1, the middle insulating layer 2 is polyimide insulating material with a thickness of 25 micrometers, the upper aperture of the blind hole 4a is 100 micrometers, the lower aperture of the blind hole is 80 micrometers, after processes such as black hole and electroplating, the thickness of the surface electroplated layer 6 is 10 micrometers, and the conductive post 4b of the connecting hole penetrates through the blind hole 4a to connect the lower conductive layer 1 and the upper conductive layer 3. The maximum risk point of the reliability of the blind hole is still the binding force between the conductive post 4b of the connecting hole and the crystal boundary surface 5 of the lower conductive layer 1, the embodiment adopts a 30 watt@100 KHz infrared laser to output the laser beam 7, the pulse width is 120 nanoseconds, the heating spot of the laser beam 7 adopts a round flat-top design, the spot size is 60 micrometers, the heating time is set to 500 microseconds to 10 milliseconds, and the laser beam 7 carries out laser heating towards the blind hole bottom position of the lower conductive layer 1 because the lower conductive layer 1 is closer to the crystal boundary surface 5 (the lower conductive layer in the figure can also be electroplated with 10 micrometers of copper, which is not marked in the figure). And then slicing the blind hole, wherein if the crystal interface 5 is not cracked or broken or gaps are shown in fig. 7, the blind hole is reliable, and if the crystal interface 5 is gaps shown in fig. 6, such as a blind hole bottom gap 9 (for convenience of expression, the gap 9 is marked at the bottom of another blind hole), the temperature impact test of the blind hole is not passed, the blind hole judgment is unreliable, and the specific reasons are analyzed by other working procedures.
In other embodiments, the heating efficiency can be further improved by performing laser heating by the laser beam 7 against the blind hole opening position of the upper conductive layer 3 and performing laser heating by the laser beam 7 against the blind hole bottom position of the lower conductive layer 1, i.e. double-sided laser heating.
Preferably, in the first step, the blind hole is aligned for laser heating to apply the thermal field, specifically, in the time dimension, the blind hole is aligned for laser intermittent or cyclic heating to apply the thermal field.
Specifically, intermittent or cyclic laser heating is performed on the blind holes to apply a thermal field, so that high-low temperature cyclic aging test of the reliability of the blind holes can be realized.
Preferably, in the first step, the blind holes are aligned for laser heating to apply a thermal field, specifically, in the spatial dimension, the blind holes are aligned for laser spot impact heating or/and scanning motion heating to apply a thermal field.
Specifically, the laser beam can be heated at fixed points, and if the heating surface is required to be relatively large, the laser beam scanning mode can be adopted for heating.
Preferably, in the first step, the blind holes are aligned for laser heating to apply a thermal field, specifically, the blind holes are aligned for laser heating to apply a thermal field, or the blind holes are aligned for laser heating simultaneously or sequentially to apply a thermal field.
Preferably, when the blind holes are aligned and laser heating is performed simultaneously or sequentially to apply a heating field, in the second step, the electrical test is performed on the blind holes, specifically, the electrical test is performed on the blind holes in electrical series or/and electrical parallel.
Preferably, in the second step, the electrical test is performed on the blind hole, specifically, an online electrical test or an offline electrical test is performed on the blind hole.
Specifically, the on-line test is to use test equipment as a procedure of a circuit board production line to perform spot check or full check on the reliability of the blind hole of the circuit board. Off-line testing is not performed on a circuit board production line, but rather is performed by taking individual samples to a physical laboratory.
Preferably, in the second step, the blind hole is electrically tested, specifically, the blind hole is electrically tested after laser heating to apply a thermal field, or the blind hole is electrically tested while laser heating to apply a thermal field.
Preferably, the laser beam is a composite laser beam.
Specifically, the composite laser beams can be combined beams of laser beams with different wavelengths, different pulse widths, different laser powers, different laser pulse repetition frequencies, different beam divergence angles, different beam transverse field intensity distribution and the like, and finally the combined beams are formed to carry out metal heat treatment on the circuit board conductive copper columns.
Wherein the laser beam wavelength comprises far infrared, visible light, ultraviolet, deep ultraviolet laser wavelength, and/or the laser beam pulse width comprises continuous laser, millisecond, microsecond, nanosecond, picosecond, femtosecond, etc.
In addition, the laser source can be used in the invention, including gas lasers and solid state lasers, semiconductor lasers, carbon dioxide lasers, fiber lasers, semiconductor pump solid state lasers, continuous wave lasers, pulse lasers, quasi-continuous lasers, Q-switched lasers, mode-locked ultrafast lasers, seed amplification continuous and pulse lasers, and the like.
Preferably, the projection light spot field intensity distribution of the laser beam applied heating field is one or any combination of a plurality of gaussian distribution, flat-top distribution, annular distribution and polygonal field intensity distribution.
Specifically, the heating spot of the laser beam depends on the specific situation, and can be specifically designed based on the optimal thermal stress field at the interface between the conductive column of the connecting hole and the upper conductive layer and/or the lower conductive layer. The best means that the maximum breaking stress can be formed.
Preferably, the upper conductive layer is formed by electroplating together with the conductive posts of the connecting holes in the blind holes.
Specifically, for the chip carrier circuit board, an addition method is generally adopted at present, namely, a lower conductive layer and an insulating layer are firstly adopted, then after blind holes are drilled by laser, an electroplating seed layer is formed by adopting the addition method and electroless copper deposition or ion sputtering injection, and then electroplating is thickened, so that a connecting hole conductive column and an upper conductive layer are formed.
Preferably, the blind holes comprise any one or a combination of any plurality of single-order blind holes, multi-order blind holes, stacked holes and cross-layer blind holes.
In particular, single-step blind holes are shown as blind holes in fig. 2 or 3.
As shown in fig. 8, the second intermediate insulating layer 21 is attached to the lower surface of the lower conductive layer 1, the third conductive layer 11 is attached to the lower surface of the second intermediate insulating layer 21, the blind hole 4a penetrates through the upper conductive layer 3, the intermediate insulating layer 2, the lower conductive layer 1 and the second intermediate insulating layer 21, the bottom of the blind hole is on the upper surface of the third conductive layer 11, the crystal interface 5 is a connecting surface for connecting the conductive post 5 of the hole with the third conductive layer 11, which is a second-order blind hole, a multi-order blind hole with more than second order, and so on.
As shown in fig. 9, the blind holes are formed by sequentially stacking a plurality of first-order blind holes, which are stacked holes. Wherein, the second middle insulating layer 21 is attached to the lower surface of the lower conductive layer 1, the third conductive layer 11 is attached to the lower surface of the second middle insulating layer 21, the third middle insulating layer 22 is attached to the lower surface of the third conductive layer 11, and the fourth conductive layer 111 is attached to the lower surface of the third middle insulating layer 22.
As shown in fig. 10, if the connection hole conductive post 4b is disconnected from the lower conductive layer 1, the connection hole conductive post is insulated by the cross-layer insulating layer 12, and the hole is a cross-layer hole.
Preferably, the conductive metal materials of the upper conductive layer, the connection hole conductive pillars, and the lower conductive layer include any one material or a combination of any plurality of materials of copper, iron, gold, nickel, chromium, and titanium;
Or/and the combination of the two,
The insulating material of the intermediate insulating layer comprises any one material or combination of any multiple materials of silicon, ceramic, glass and polymer insulating materials.
Embodiment two:
The invention provides blind hole reliability test equipment which is used for testing the reliability of a blind hole on a circuit board, wherein the circuit board at least comprises a lower conductive layer, an intermediate insulating layer and an upper conductive layer which are laminated, a connecting hole conductive column is arranged in the blind hole, penetrates through the intermediate insulating layer and is connected with the upper conductive layer at an orifice of the blind hole, and the bottom of the blind hole is connected with the lower conductive layer;
The blind hole reliability test equipment comprises:
the motion platform is used for bearing the circuit board and driving the circuit board to move;
the positioning module is used for positioning the circuit board on the motion platform to obtain positioning information;
A laser for generating a laser beam;
The vibrating mirror scanning and flat field focusing device is connected with the laser and the positioning module and is used for conducting vibrating mirror scanning and flat field focusing on the laser beam, outputting the laser beam, directing the output laser beam to the circuit board according to the positioning information, and conducting laser heating aiming at the blind hole to apply a thermal field, so that temperature gradients are formed on the upper conducting layer, the connecting hole conducting column and the lower conducting layer, and meanwhile, temperature gradients are formed between a conducting area of the circuit board and an intermediate insulating layer around the blind hole;
Wherein, the temperature gradient and the temperature of the thermal field are controlled by controlling the heating speed and the intensity of the laser beam; the thermal field with temperature gradient forms stress field between the connecting hole conductive column and the upper conductive layer and the lower conductive layer;
And the test module is used for carrying out an electrical test, a mechanical test or a metallographic test on the blind holes so as to judge the reliability of the electrical connection between the connecting hole conductive columns and the lower conductive layer or/and the upper conductive layer.
Embodiment III:
The invention provides a blind hole reliability testing device which comprises a processor, a memory and a computer program stored in the memory and capable of running on the processor, wherein the blind hole reliability testing method is realized when the computer program runs.
Embodiment four:
the invention provides a blind hole reliability test system, which comprises a machine table, a laser and the blind hole reliability test device, wherein the blind hole reliability test device is electrically connected with the laser;
The machine is used for bearing a circuit board to be processed;
The laser is used for generating a laser beam;
The blind hole reliability testing device is used for controlling laser beams generated by the laser to irradiate the circuit board, and aiming at the blind holes on the circuit board to perform laser heating so as to apply a thermal field, so that temperature gradients are formed on the upper conductive layer, the connecting hole conductive columns and the lower conductive layer, and meanwhile, temperature gradients are formed between the conductive region of the circuit board and the middle insulating layer around the blind holes;
Wherein, the temperature gradient and the temperature of the thermal field are controlled by controlling the heating speed and the intensity of the laser beam; the thermal field with temperature gradient forms stress field between the connecting hole conductive column and the upper conductive layer and the lower conductive layer;
And performing an electrical test, a mechanical test or a metallographic test on the blind holes to judge the reliability of the electrical connection between the connecting hole conductive posts and the lower conductive layer or/and the upper conductive layer.
Compared with the prior art, the blind hole reliability testing method, device and system provided by the invention has the following advantages:
1) The invention adopts the laser beam blind hole to heat near the key point position of the reliability detection, forms a thermal field with larger temperature gradient, the thermal field brings tensile stress and shearing stress to the interface of the blind hole bottom crystal, the detection impact strength of the blind hole bottom is far higher than that of the conventional temperature cycle, and the heating of electroplated copper in the blind hole can be far higher than the bearing temperature of an insulating material due to the existence of the temperature gradient, so the damage to the defect of the blind hole bottom is more easily brought by the larger temperature gradient, so the invention can achieve the higher blind hole reliability detection standard.
2) The invention can carry out the reliability test of the blind hole offline and can also carry out the reliability test of the blind hole in the production line of the circuit board.
3) The detection efficiency is greatly improved, and the flexibility of laser heating and the speed of laser heating temperature rise are extremely high, so that the timeliness of the detection of the reliability of the blind hole of the circuit board is improved by orders of magnitude.
4) The method can realize the full detection test of the blind holes of the circuit board of the production line due to the high efficiency of detection, remove unqualified products, and leave the qualified products (laser heating belongs to local heating and does not affect the reliability of the qualified products).
5) The method of the invention is to laser heating the blind hole with limited part, the blind hole is a part with very small circuit board, so the energy consumption of the equipment is very small, and the energy is saved much than the heating of the temperature cycle impact box body (not only the heating of the box body but also the heating of the whole circuit board).
The reader will appreciate that in the description of this specification, a description of terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (17)
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