CN119495643A - Medical module packaging structure and packaging method - Google Patents

Abstract

The present invention discloses a medical module packaging structure and packaging method, the packaging structure includes a substrate, a first chip, a second chip, a PCB module and a plastic package. The substrate has a first surface; the first chip has a second surface and a third surface arranged opposite to each other, the second surface is arranged in contact with the first surface of the substrate, and a first welding protrusion and a pad are formed on the third surface; the second chip is arranged on the third surface of the first chip and is electrically connected to the first welding protrusion; the PCB module is arranged on the first surface of the substrate and is electrically connected to the pad of the first chip; the plastic package is formed on the first surface of the substrate and covers the PCB module and the pad of the first chip; wherein the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip. The medical module packaging structure and packaging method of the present invention can reduce the warping of the chip and the substrate, while reducing the risk of chip damage.

Description

Medical module packaging structure and packaging method

Technical Field

The present invention relates to the field of module packaging technology, and more particularly, to a medical module packaging structure and a medical module packaging method.

Background

At present, for the module packaging in the traditional field, factories have certain basic process capability. However, for packaging of medical modules, there is a need for a process that places higher demands on each process detail.

At present, the existing module packaging technology based on the traditional field is to increase a middle PCB substrate as a support, and to respectively arrange chips on two sides of the PCB substrate. However, to realize the interconnection conduction of the chips at two sides, a hole stacking process of the PCB substrate needs to be selected. The substrate hole stacking process has higher price. Secondly, the PCB substrate is single operation, and a plurality of Unit substrates (substrate units) are arranged on each PCB substrate, so that when a chip is packaged, the edge positions of the substrate and the chip are tilted relatively more, the packaging difficulty is increased, and meanwhile, the utilization rate of the substrate is likely to be reduced to about 60% during packaging, so that the loss of the substrate is increased.

Because the warpage requirements of the traditional module package on the edge of the PCB substrate are not high, the packaging structure can be applied to the traditional module package.

However, the new medical module requires less than 10um warpage for secondary interconnection. However, because the material of the PCB substrate is mainly an organic material, the thermal expansion coefficient is large, and the material of the chip and the passive device is mostly silicon, the thermal expansion coefficient is small, and in the process of manufacturing, the mismatch of the thermal expansion coefficients of the chip and the passive device may cause the increase of the warpage degree, so that the required product requirement is difficult to be achieved.

Secondly, in the module encapsulation of traditional field, the bottom does not have to support and do not carry out the plastic envelope after chip and PCB base plate interconnection, consequently need special management and control at the transportation, avoid causing the chip to damage. Meanwhile, in the conventional module package, the secondary interconnection process of the second chip-TransducerArray and the PCB substrate is pressurized again, and the pressure directly acts on the chip and the PCB substrate to easily cause the chip damage problem.

The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.

Disclosure of Invention

The invention aims to provide a medical module packaging structure and a medical module packaging method, which can reduce the warpage of a chip and a substrate and reduce the risk of damaging the chip.

In order to achieve the above objective, an embodiment of the present invention provides a medical module packaging structure, which includes a substrate, a first chip, a second chip, a PCB module and a plastic package. The substrate is provided with a first surface, the first chip is provided with a second surface and a third surface which are oppositely arranged, the second surface is attached to the first surface of the substrate, a first welding protrusion and a bonding pad are formed on the third surface, the second chip is arranged on the third surface of the first chip and is electrically connected with the first welding protrusion, the PCB module is arranged on the first surface of the substrate and is electrically connected with the bonding pad of the first chip, the plastic package body is formed on the first surface of the substrate and covers the PCB module and the bonding pad of the first chip, and the thermal expansion coefficient of the substrate is matched with that of the first chip.

In the above technical solution, the thermal expansion coefficient of the substrate is matched with the thermal expansion coefficient of the first chip, which is understood to be the same as or similar to the thermal expansion coefficient of the first chip, where similar means that the difference between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the first chip is within an allowable range, where the allowable range is ±5 (unit: 1/° C).

In one or more embodiments of the invention, the substrate is selected from glass substrates and the first chip is selected from ASIC chips.

In one or more embodiments of the present invention, a first bonding region and at least one pad region are disposed on the third surface of the first chip, the pad region being located at an edge of the first bonding region, the first bonding protrusion being formed in the first bonding region, and the pad being formed in the pad region.

In one or more embodiments of the invention, the second chip is disposed within the first bonding region of the first chip.

In one or more embodiments of the present invention, the plastic package body is disposed to cover the pad area of the first chip.

In one or more embodiments of the present invention, a second bonding bump is formed on the second chip, one side of the second chip provided with the second bonding bump is attached to the third surface of the first chip, and the second bonding bump is electrically connected with the first bonding bump.

In one or more embodiments of the present invention, an adhesive layer is provided between the second chip and the first chip.

In one or more embodiments of the present invention, the PCB module is spaced apart from the first chip, and wire bonds are formed between the PCB module and pads of the first chip.

In one or more embodiments of the present invention, the PCB module includes a PCB board and a passive device formed on the PCB board, the PCB board portion being disposed on the first surface of the substrate.

The invention further provides a medical module packaging method, which comprises the steps of providing a substrate, providing a first chip, providing a second chip, providing a bonding pad, and providing a second chip, wherein the first chip is provided with a second surface and a third surface which are oppositely arranged, the third surface is provided with a first welding protrusion and the bonding pad, the thermal expansion coefficient of the substrate is matched with that of the first chip, attaching the second surface of the first chip to the first surface of the substrate, providing a PCB module, attaching the PCB module to the first surface of the substrate and electrically connecting the bonding pad of the first chip, performing plastic package on the PCB module and the bonding pad of the first chip, and providing a second chip, wherein the second chip is arranged on the first chip and electrically connected with the first welding protrusion of the first chip.

In one or more embodiments of the invention, the second chip is attached to the side of the first chip remote from the substrate by using a low temperature bonding technique.

In one or more embodiments of the present invention, the providing a first chip includes providing a wafer including a plurality of first chips arranged in an array, performing fabrication of the first bonding bumps on the wafer, and dicing the wafer to obtain the first chips.

The embodiment of the invention also provides a medical module packaging structure which comprises a substrate, a first chip, a PCB module and a plastic package body. The substrate is provided with a first surface, the first chip is provided with a second surface and a third surface which are oppositely arranged, the second surface is attached to the first surface of the substrate, a bonding pad is formed on the third surface, the PCB module is arranged on the first surface of the substrate and is electrically connected with the bonding pad of the first chip, the plastic package body is formed on the first surface of the substrate and covers the PCB module and the bonding pad of the first chip, and the thermal expansion coefficient of the substrate is matched with that of the first chip.

Compared with the prior art, the medical module packaging structure and the packaging method have the advantages that the substrate with the thermal expansion coefficient matched with the first chip is used as the supporting plate, the first chip is attached to the substrate by using the chip bonding film-film adhesive, and the warping degree of the first chip and the substrate in the packaging process can be reduced due to the matching degree of the thermal expansion coefficients of the first chip and the substrate, so that the requirement of subsequent processing of the medical module on the warping degree is met.

According to the medical module packaging structure and the packaging method, the first chip is arranged on the substrate, and the substrate provides buffering for the first chip, so that the damage risk of the chip and the packaging module can be reduced.

According to the medical module packaging structure and the medical module packaging method, the second chip and the first chip are directly connected with each other, an intermediate substrate hole stacking process is not needed, and packaging cost is reduced.

According to the medical module packaging structure and the packaging method, the second chip and the first chip can be electrically connected through the low-temperature bonding technology, the first welding protrusion on the first chip and the second welding protrusion on the second chip can be protected, the process is simplified, the structure between the first chip and the second chip is compact, the packaging size of the chip is reduced, and the packaging cost is reduced.

Drawings

FIG. 1 is a schematic view of a medical module package structure according to an embodiment of the present invention;

FIG. 2 is a process flow diagram of a medical module packaging method according to an embodiment of the invention;

FIG. 3 is a detailed process flow diagram of a medical module packaging method according to an embodiment of the invention;

fig. 4 a-4 k are schematic views illustrating a packaging step of a medical module packaging method according to an embodiment of the invention.

Detailed Description

The following detailed description of embodiments of the invention is, therefore, to be taken in conjunction with the accompanying drawings, and it is to be understood that the scope of the invention is not limited to the specific embodiments.

Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.

As described in the background art, the module package structure in the conventional field includes an intermediate substrate, a first chip formed on an upper surface of the intermediate substrate, and a second chip formed on a lower surface of the intermediate substrate, where interconnection between the first chip and the second chip is achieved through a hole stacking process of the intermediate substrate. However, the substrate stacking process is expensive, resulting in high packaging cost of the above-described package structure. Second, the degree of warpage between the first chip or the second chip and the intermediate substrate increases (much greater than 10 um) due to the mismatch of the coefficients of thermal expansion of the intermediate substrate and the first chip or the second chip. For the packaging structure of the medical module with the warpage requirement of less than 10um, the structure is difficult to meet the requirement of the required product, and is obviously not applicable. Furthermore, since the first chip and the second chip are both directly connected with the intermediate substrate, the first chip and the second chip are not supported by the support structure and are not encapsulated, and the chips are easy to damage.

In order to solve the technical problems, the application provides a packaging structure of a medical module, wherein a substrate with a thermal expansion coefficient matched with that of a first chip is provided as a support, a PCB module and the first chip are arranged on the substrate and connected through leads, a bonding pad area of the PCB module and the first chip is subjected to plastic packaging protection, and finally a second chip and the first chip are directly interconnected, so that the strength of the module is increased while the warping of the chip is reduced, and the packaging cost of the medical module is reduced.

As shown in fig. 1, the medical module package structure according to an embodiment of the invention includes a substrate 10, a first chip 20, a second chip 30, a PCB module and a plastic package 50. The first chip 20 and the PCB module are both disposed on the same surface of the substrate 10, and Wire bonding (Wire bonding) is performed between the two through metal wires 60. The second chip 30 is directly disposed on the first chip 20 and is electrically connected to the first chip 20. The plastic package 50 encapsulates the PCB module and a portion of the first chip 20 to provide protection.

The substrate 10 is preferably a glass substrate. The substrate 10 has a planar first surface 11. In other embodiments, the substrate 10 may be another material substrate, as long as the thermal expansion coefficient of the material substrate is matched with that of the first chip, i.e. the thermal expansion coefficient of the material substrate is the same as or similar to that of the first chip. Wherein, the close means that the difference between the thermal expansion coefficient of the material substrate and the thermal expansion coefficient of the first chip is within the allowable range, and the allowable range is + -5 (unit: 1/°c).

The first chip 20 is preferably an ASIC chip. The first chip 20 has a second surface 20a and a third surface 20b disposed opposite to each other. The second surface 20a of the first chip 20 is attached to the first surface 11 of the substrate 10 by a film adhesive 70. The third surface 20b of the first chip 20 is provided with a first bonding region 21 and one or more bonding pad regions 22, the bonding pad regions 22 being located at edges of the first bonding region 21. The first bonding region 21 of the third surface 20b has a plurality of first bonding protrusions 211 formed therein, and the bonding pad region 22 has a plurality of bonding pads formed therein.

In the technical scheme, as the matching degree of the thermal expansion coefficient of the glass substrate and the thermal expansion coefficient of the ASIC chip is higher, the warpage can be reduced by adhering the ASIC chip on the surface of the glass substrate, so that the requirement of subsequent processing in the medical module on the warpage is met.

The second chip 30 is disposed on the third surface 20b of the first chip 20, preferably in the first bonding region 21 of the first chip 20. The second chip 30 is electrically connected to the first bonding bump 211. The second chip 30 is preferably a Transducer chip, for example. The second chip 30 is formed with a second bonding bump 31, and a side of the second chip 30 where the second bonding bump 31 is disposed is attached to the third surface 20b of the first chip 20, and the second bonding bump 31 is electrically connected to the first bonding bump 211. Further, the second chip 30 and the first chip 20 are closely interconnected by a low temperature bonding technique. Illustratively, an adhesive layer 80 is provided between the second chip 30 and the first chip 20 by a low temperature bonding technique. The adhesive layer 80 can not only enhance the electrical connection strength of the first chip 20 and the second chip 30, but also protect the first bonding bumps 211 of the first chip 20 and the second bonding bumps 31 of the second chip 30.

The PCB module is adhered to the first surface 11 of the substrate 10 by the film adhesive 70 and electrically connected to the pads of the first chip 20. Illustratively, the PCB module is disposed at a distance from the first chip 20, and the PCB module is electrically connected to the pad of the first chip 20 through the metal wire 60. The PCB module includes a PCB 41 and a passive device 42 formed on the PCB 41, where a portion of the PCB 41 is disposed on the first surface 11 of the substrate 10, and a portion of the PCB protruding from the substrate 10 may also be provided with other corresponding devices as required.

The plastic package 50 is formed on the first surface 11 of the substrate 10 and covers the PCB module and the pad arrangement of the first chip 20. Specifically, the plastic package 50 completely encapsulates the PCB module (including the portion protruding from the substrate 10), and the plastic package 50 completely encapsulates the metal leads 60 and the pad area 22 where the pads are located. The plastic package body 50 can enhance the connection strength of the connection structure (pad, PCB module and metal lead) in the medical module, and protect the connection structure from damage.

The invention further provides a packaging method of the medical module, which comprises the steps of providing a substrate with a first surface, providing a first chip with a second surface and a third surface which are oppositely arranged, forming a first welding protrusion and a welding pad on the third surface, enabling the thermal expansion coefficient of the substrate to be matched with that of the first chip, attaching the second surface of the first chip to the first surface of the substrate, providing a PCB module, attaching the PCB module to the first surface of the substrate and electrically connecting the welding pad of the first chip, providing a second chip, and arranging the second chip on the first chip and electrically connecting the second chip with the first welding protrusion of the first chip, wherein the first surface of the substrate is provided with the first surface, the second surface of the substrate is provided with the second surface of the first chip, and the second surface of the substrate is provided with the first welding protrusion.

Wherein, referring to fig. 3, the first chip in step s2 may be obtained by the following steps. S201, providing a wafer, wherein the wafer comprises a plurality of first chips arranged in an array, S202, manufacturing first welding bulges on the wafer, and S203, cutting the wafer to obtain the first chips.

Fig. 4 a-4 k are schematic views illustrating steps of a medical module packaging method according to an embodiment of the invention. The medical module packaging method of the present invention is described in detail below with reference to the schematic steps of the medical module packaging method.

As shown in fig. 4a, an ASIC wafer 100 is provided. The ASIC wafer 100 is arranged with a plurality of first chips 20 in an array, and dicing channels are formed between adjacent first chips 20, so that the ASIC wafer 100 can be divided into the plurality of first chips 20 along the dicing channels. Each of the first chips 20 includes a land 21 for forming a first bonding bump 211 and a pad region 22 located at an edge of the land 21. The pad region 22 has an I/O pad formed therein for electrically connecting with an external implementation. The fabrication of the first bonding pads 211 is performed at each bonding pad 21 of the ASIC wafer 100.

As shown in fig. 4b, the back side (the side where the first bonding pads 211 are not provided) of the ASIC wafer 100 is back ground, and the thickness of the chip is reduced to obtain a desired chip size.

As shown in fig. 4c, the film adhesive 70 is adhered to the back surface (the side where the first bonding pads 211 are not disposed) of the ASIC wafer 100, so that the subsequent first chip 20 is adhered to the substrate 10.

As shown in fig. 4d, the ASIC wafer 100 is diced along dicing channels to obtain first chips 20.

As shown in fig. 4e, the first chip 20 is attached to the substrate 10. The substrate 10 is preferably a glass substrate, but may be a substrate made of another material having a thermal expansion coefficient matching that of the ASIC wafer 100. The substrate 10 has a planar first surface 11. The first chip 20 is an ASIC chip. The first chip 20 has a second surface 20a and a third surface 20b disposed opposite to each other. The second surface 20a of the first chip 20 is attached to the first surface 11 of the substrate 10 by a film adhesive 70.

In the technical scheme, as the matching degree of the thermal expansion coefficient of the glass substrate and the thermal expansion coefficient of the ASIC chip is higher, the warpage can be reduced by adhering the ASIC chip on the surface of the glass substrate, so that the requirement of subsequent processing in the medical module on the warpage is met.

As shown in fig. 4f, a PCB module is provided. The PCB module includes a PCB board 41 and a passive device 42, and the passive device 42 such as R/L/C is attached to the PCB board 41 through an SMT process.

As shown in fig. 4g, a thin film adhesive 70 is adhered to a portion of the back surface (side where the passive device 42 is not disposed) of the PCB 41, so that the subsequent PCB module is adhered to the substrate 10. The area of the back surface of the PCB 41 where the film adhesive 70 is not provided may be electrically connected to other corresponding devices as needed.

As shown in fig. 4h and 4i, the PCB module is attached to the first surface 11 of the substrate 10 and electrically connected to the pads of the first chip 20. The PCB module is disposed at an interval with the first chip 20, and is electrically connected with the bonding pad of the first chip 20 by wire bonding through a metal wire 60.

As shown in fig. 4j, the PCB module and the pads of the first chip 20 are encapsulated. The plastic package 50 is formed on the first surface 11 of the substrate 10 and covers the PCB module and the pad arrangement of the first chip 20. Specifically, the plastic package 50 completely encapsulates the PCB module (including the portion protruding from the substrate 10), and the plastic package 50 completely encapsulates the metal leads 60 and the pad area 22 where the pads are located. The plastic package body 50 can enhance the connection strength of the connection structure (pad, PCB module and metal lead) in the medical module, and protect the connection structure from damage.

As shown in fig. 4k, a second chip 30 is provided, and the second chip 30 is disposed on the first chip 20 and electrically connected to the first bonding bumps 211 of the first chip 20. Specifically, the second chip 30 is disposed on the third surface 20b of the first chip 20, and preferably, is disposed in the first bonding area 21 of the first chip 20. The second chip 30 is electrically connected to the first bonding bump 211. The second chip 30 is preferably a Transducer chip, for example. The second chip 30 is formed with a second bonding bump 31, and a side of the second chip 30 where the second bonding bump 31 is disposed is attached to the third surface 20b of the first chip 20, and the second bonding bump 31 is electrically connected to the first bonding bump 211. Further, the second chip 30 and the first chip 20 are closely interconnected by a low temperature bonding technique. The low temperature bonding technique is a known prior art in the semiconductor industry and is not addressed by the present application.

In still another embodiment of the present application, the medical module package structure may further include only the substrate 10, the first chip 20, the PCB module and the plastic package 50. The first chip 20 and the PCB module are disposed on the same surface of the substrate 10, and are connected by Wire bonding (Wire bonding) through metal wires 60. The plastic package 50 encapsulates the PCB module and a portion of the first chip 20 to provide protection. The packaging structure can also reduce the warpage of the chip and increase the strength of the module, and simultaneously reduce the packaging cost of the medical module.

In this embodiment, the structure, material, and interconnection of the substrate 10, the first chip 20, the PCB module, and the plastic package 50 are the same as those of the medical module package of the previous embodiment, and the difference between this embodiment and the previous embodiment is that the medical module package of this embodiment does not include the second chip 30. The second chip 30 may be connected to the medical module package structure of the present embodiment in other subsequent processes.

Compared with the prior art, the medical module packaging structure and the packaging method have the advantages that the substrate with the thermal expansion coefficient matched with the first chip is used as the supporting plate, the first chip is attached to the substrate by using the chip bonding film-film adhesive, and the warping degree of the first chip and the substrate in the packaging process can be reduced due to the matching degree of the thermal expansion coefficients of the first chip and the substrate, so that the requirement of subsequent processing of the medical module on the warping degree is met.

According to the medical module packaging structure and the packaging method, the first chip is arranged on the substrate, and the substrate provides buffering for the first chip, so that the damage risk of the chip and the packaging module can be reduced.

According to the medical module packaging structure and the medical module packaging method, the second chip and the first chip are directly connected with each other, an intermediate substrate hole stacking process is not needed, and packaging cost is reduced.

According to the medical module packaging structure and the packaging method, the second chip and the first chip can be electrically connected through the low-temperature bonding technology, the first welding protrusion on the first chip and the second welding protrusion on the second chip can be protected, the process is simplified, the structure between the first chip and the second chip is compact, the packaging size of the chip is reduced, and the packaging cost is reduced.

The various aspects, embodiments, features and examples of the invention are to be considered in all respects as illustrative and not intended to limit the invention, the scope of which is defined solely by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.

The use of headings and chapters in this disclosure is not meant to limit the disclosure, and each chapter may apply to any aspect, embodiment, or feature of the disclosure.

Throughout this disclosure, where a composition is described as having, comprising, or including a particular component, or where a process is described as having, comprising, or including a particular process step, it is contemplated that the composition of the teachings of the present disclosure also consist of or consist of the recited component on a substrate, and that the process of the teachings of the present disclosure also consist of or consist of the recited process step on a substrate.

Where elements or components are referred to in this disclosure as being included in and/or selected from a list of recited elements or components, it should be understood that the elements or components may be any of the recited elements or components and may be selected from the group consisting of two or more of the recited elements or components. Furthermore, it is to be understood that the elements and/or features of the compositions, apparatus, or methods described herein may be combined in various ways, whether explicitly or implicitly described herein, without departing from the spirit and scope of the teachings of the application.

The use of the terms "comprising," "having," and "including" are generally understood to be open-ended and not limiting, unless specifically stated otherwise.

The use of the singular herein includes the plural (and vice versa) unless specifically stated otherwise. Furthermore, the singular forms "a," "an," and "the" include plural forms unless the context clearly dictates otherwise. In addition, where the term "about" is used prior to a magnitude, the present teachings include the particular magnitude itself, unless specifically stated otherwise.

It should be understood that the order of steps or order in which a particular action is performed is not critical, as long as the present teachings remain operable. Furthermore, two or more steps or actions may be performed simultaneously.

It is to be understood that the figures and descriptions of the present invention have been simplified to illustrate elements that are relevant for a clear understanding of the present invention, while eliminating, for purposes of clarity, other elements. However, one of ordinary skill in the art will recognize that these and other elements may be desirable. However, since such elements are well known in the art, and since they do not facilitate a better understanding of the present invention, a discussion of such elements is not provided herein. It should be appreciated that the figures are presented for illustrative purposes and are not as constructional figures. Omitted details and modified or alternative embodiments are within the purview of one skilled in the art.

It can be appreciated that in particular aspects of the invention, a single component can be replaced by multiple components and that multiple components can be replaced by a single component to provide an element or structure or perform a given function or functions. Such alternatives are considered to be within the scope of the invention except where such alternatives would not operate to practice a particular embodiment of the invention.

While the invention has been described with reference to an illustrative embodiment, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.

Claims (10)

1. A medical module package structure, comprising:

a substrate having a first surface;

The first chip is provided with a second surface and a third surface which are oppositely arranged, the second surface is attached to the first surface of the substrate, and the third surface is provided with a first welding protrusion and a welding pad;

the second chip is arranged on the third surface of the first chip and is electrically connected with the first welding bulge;

The PCB module is arranged on the first surface of the substrate and is electrically connected with the bonding pad of the first chip;

The plastic package body is formed on the first surface of the substrate and coats the PCB module and the bonding pad of the first chip;

Wherein the coefficient of thermal expansion of the substrate is matched to the coefficient of thermal expansion of the first chip.

2. The medical module package structure of claim 1, wherein the substrate is selected from a glass substrate and the first chip is selected from an ASIC chip.

3. The medical module package structure of claim 1, wherein a first bonding pad and at least one bonding pad are disposed on the third surface of the first chip, the bonding pad is located at an edge of the first bonding pad, the first bonding bump is formed in the first bonding pad, and the bonding pad is formed in the bonding pad.

4. The medical module package structure of claim 3, wherein the second chip is disposed within the first bonding region of the first chip and/or,

And the plastic package body is arranged to cover the bonding pad area of the first chip.

5. The medical module package structure of claim 1, wherein the second chip has a second solder bump formed thereon;

the second chip is provided with a second welding bulge, one side of the second chip is attached to the third surface of the first chip, and the second welding bulge is electrically connected with the first welding bulge.

6. The medical module package structure of claim 5, wherein an adhesive layer is disposed between the second chip and the first chip.

7. The medical module package structure of claim 1, wherein the PCB module is spaced apart from the first chip and wire bonded to the bonding pad of the first chip.

8. A medical module packaging method, comprising:

providing a substrate, wherein the substrate is provided with a first surface;

Providing a first chip, wherein the first chip is provided with a second surface and a third surface which are oppositely arranged, a first welding bulge and a welding pad are formed on the third surface, and the thermal expansion coefficient of the substrate is matched with that of the first chip;

Attaching the second surface of the first chip to the first surface of the substrate;

providing a PCB module, attaching the PCB module to the first surface of the substrate and electrically connecting the bonding pad of the first chip;

Performing plastic packaging on the PCB module and the bonding pad of the first chip;

providing a second chip, and arranging the second chip on the first chip and electrically connecting the second chip with the first welding bulge of the first chip.

9. The medical module packaging method of claim 8, wherein the second chip is attached to the side of the first chip remote from the substrate by using a low temperature bonding technique.

10. A medical module package structure, comprising:

a substrate having a first surface;

The first chip is provided with a second surface and a third surface which are oppositely arranged, the second surface is attached to the first surface of the substrate, and a bonding pad is formed on the third surface;

The PCB module is arranged on the first surface of the substrate and is electrically connected with the bonding pad of the first chip;

The plastic package body is formed on the first surface of the substrate and coats the PCB module and the bonding pad of the first chip;

Wherein the coefficient of thermal expansion of the substrate is matched to the coefficient of thermal expansion of the first chip.