CN119485915A

CN119485915A - Circuit board structure and electronic equipment

Info

Publication number: CN119485915A
Application number: CN202411678525.0A
Authority: CN
Inventors: 谢勇
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2024-11-22
Filing date: 2024-11-22
Publication date: 2025-02-18

Abstract

The application discloses a circuit board structure and electronic equipment, and belongs to the technical field of electronics. The circuit board structure comprises a circuit board and an electronic device, wherein the electronic device is welded on a first side wall of the circuit board, a bonding pad is arranged on the first side wall, the electronic device is welded on the bonding pad, and the bonding pad is electrically connected with wiring inside the circuit board.

Description

Circuit board structure and electronic equipment

Technical Field

The application belongs to the technical field of electronics, and particularly relates to a circuit board structure and electronic equipment.

Background

The spring is a component commonly used on a printed circuit board (Printed Circuit Board, PCB) of an electronic device, and is usually designed on the front and back sides of the periphery of the PCB, and other components, such as an antenna, a receiver, a speaker, a flash lamp, and the like, are connected with a main board by contacting with the spring, and besides, the spring is grounded. However, the design mode makes the spring plate occupy more area of the PCB and easily blocks other components on the PCB.

Disclosure of Invention

The embodiment of the application aims to provide a circuit board structure and electronic equipment, which can solve the problems that a shrapnel occupies more area of a PCB and other components on the PCB are easy to clamp in the existing circuit board structure design.

In a first aspect, an embodiment of the application provides a circuit board structure, which comprises a circuit board and an electronic device, wherein the electronic device is welded on a first side wall of the circuit board, a bonding pad is arranged on the first side wall, the electronic device is welded on the bonding pad, and the bonding pad is electrically connected with a wiring inside the circuit board.

In a second aspect, an embodiment of the present application provides an electronic device, including the circuit board structure described in the first aspect.

In the embodiment of the application, the circuit board structure comprises a circuit board and an electronic device, wherein the electronic device is welded on the first side wall of the circuit board, a bonding pad is arranged on the first side wall, the electronic device is welded on the bonding pad, and the bonding pad is electrically connected with the wiring inside the circuit board. Therefore, the electronic devices such as the spring plates are welded on the side wall of the circuit board, so that the layout space of the devices on the front side and the back side of the circuit board is not occupied, and the problem of clamping other components on the board is avoided.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of a circuit board with through holes and copper exposure layers according to an embodiment of the present application;

fig. 3 is a cross-sectional view of a circuit board structure according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or otherwise described herein, and that the objects identified by "first," "second," etc. are generally of a type not limited to the number of objects, for example, the first object may be one or more. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

In the description of the present application, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

The circuit board structure provided by the embodiment of the application is described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the application. As shown in fig. 1, the circuit board structure 100 includes:

The circuit board 10 and the electronic device 20, the electronic device 20 is welded on the first side wall 11 of the circuit board 10, the bonding pad 12 is arranged on the first side wall 11, the electronic device 20 is welded on the bonding pad 12, and the bonding pad 12 is electrically connected with the internal wiring of the circuit board 10.

As shown in fig. 1, a circuit board structure 100 provided in an embodiment of the present application includes a circuit board 10 and an electronic device 20, where the circuit board 10 may be a PCB, and in specific application, may be a motherboard or a Cavity board. In the embodiment of the application, in order to avoid the defect that the whole area of the PCB is not utilized enough because the elastic sheets are distributed on the front side or the back side of the PCB to be connected with other externally-hung devices, an innovative elastic sheet distribution mode is provided, namely, the elastic sheets, the components and the like are distributed on the side walls of the PCB outside the front side and the back side of the PCB, so that functional connection with other components can be realized under the condition of not occupying the front side and the back side of the PCB, and the utilization rate of the area of the PCB is improved.

Specifically, as shown in fig. 1, the bonding pads 12 may be disposed at appropriate positions of the first side wall 11 of the circuit board 10, and then the electronic device 20 is soldered at the bonding pads 12, so that the electronic device 20 can be connected to the side wall of the circuit board 10, for example, a common spring sheet may be soldered to the bonding pads 12 of the side wall of the circuit board 10 by a surface mount technology (Surface Mounted Technology, SMT) process, so that the spring sheet is stably connected to the side wall of the circuit board 10. The pads 12 are electrically connected with the wiring inside the circuit board 10, so that the circuit board 10 can be electrically connected with the electronic device 20 on the side wall.

According to some embodiments of the application, the electronic device 20 is a dome or a component.

In some embodiments, the electronic device 20 may be a spring, that is, the spring may be attached to the side wall of the circuit board 10, so that the circuit board 10 may be conveniently connected to other components through the spring on the side wall, and the electronic device 20 may also be a component, that is, the resistor, the capacitor and other components may be attached to the side wall of the circuit board 10, so that the circuit board 10 may be directly connected to other components through the side wall, thereby improving the utilization rate of the circuit board.

According to some embodiments of the present application, as shown in fig. 2, a copper exposing layer 13 is disposed at a first position of the first sidewall 11, and the pad 12 is electrically connected to the copper exposing layer 13.

As shown in fig. 2, a copper exposure layer 13 may be disposed on a first position of the first side wall 11 of the circuit board 10, and a bonding pad 12 is plated on the position of the copper exposure layer 13, so that the bonding pad 12 and an internal wiring of the circuit board 10 are connected through the copper exposure layer 13, and further, the electrical connection between the circuit board 10 and the electronic device 20 is realized.

According to a further embodiment of the present application, as shown in fig. 2, a first through hole 14 perpendicular to the surface of the circuit board 10 is provided at a second position of the circuit board 10, the first through hole 14 is subjected to a copper plating process, the copper exposing layer 13 is electrically connected to the inner wall of the first through hole 14, and the second position is adjacent to the first sidewall 11.

As shown in fig. 2, to realize the electrical connection between the spring sheet on the side wall of the circuit board 10 and the circuit board, a mechanical through hole from top to bottom, that is, a first through hole 14 may be formed at a second position of the circuit board 10 adjacent to the first side wall 11, the through hole is perpendicular to the front and back surfaces of the circuit board 10 and parallel to the first side wall 11, and copper plating process may be performed on the first through hole 14, so that the inner wall of the first through hole 14 is plated with a copper layer, and at this time, the first through hole 14 is electrically connected with the internal wiring of the circuit board 10. The copper exposing layer 13 is designed on the first side wall 11, and the copper exposing layer 13 is electrically connected with the inner wall of the first through hole 14, so that the electronic device 20 such as the spring plate on the first side wall 11 is electrically connected with the wiring inside the circuit board 10.

Through the implementation mode, the electric connection between the elastic sheet on the side wall of the circuit board and the wiring inside the circuit board can be well realized.

According to further embodiments of the present application, the exposed copper layer 13 is uniformly provided at a plurality of positions of the first sidewall 11, and the plurality of positions are plated with the pads 12 electrically connected to the exposed copper layer 13, and the electronic device 20 is soldered at each pad 12.

That is, in some embodiments, the exposed copper layers 13 may be respectively disposed at different positions of the first sidewall 11, each exposed copper layer 13 is electrically connected with the inner wall of the first through hole 14, then the bonding pads 12 are plated at each exposed copper layer 13, and the spring sheet or other components are soldered at each bonding pad 12. Therefore, a plurality of spring plates can be arranged on one side wall of the circuit board, and the utilization rate of the circuit board is further improved.

According to still further embodiments of the present application, the circuit board 10 is a Cavity circuit board Cavity board or motherboard.

That is, the electronic device 20 such as the spring plate may be attached to not only the sidewall of the Cavity board but also the sidewall of the main board, so that the Cavity board or the main board can be electrically connected to each device through the spring plate of the sidewall, thereby improving the utilization rate of the Cavity board or the main board.

According to still other embodiments of the present application, the circuit board 10 is a Cavity board 10, the circuit board 10 is electrically connected to the motherboard 30, and the electrical signals on the motherboard 30 reach the electronic device 20 through the first via hole 14, the copper-exposed layer 13 and the bonding pad 12.

As shown in fig. 2, the electronic device 20 may be disposed on the side wall of the Cavity board 10, and the Cavity board 10 may be mounted on the motherboard 30, specifically, the electronic device 20 may be soldered on the side pad 12 of the Cavity board 10 by SMT process, so that the electronic device 20 is stably connected with the side wall of the Cavity board 0, and then the Cavity board 10 is mounted on the motherboard 30 by SMT process, so as to complete the whole path connection.

As shown in fig. 3, the electrical signal output on the motherboard 30 may reach the electronic device 20, such as a dome, via the first through hole 14, the copper-exposed layer 13 and the bonding pad 12 in the Cavity board 10, and the connection signal is transferred to an external connection device, that is, to an external device connected to the dome on the sidewall of the Cavity board 10.

Through the implementation mode, the electric signals on the main board can be transmitted to the external connecting device connected to the side wall of the Cavity board, and the application scene of the circuit board is expanded.

According to some embodiments of the present application, as shown in fig. 3, the electronic device 20 is a spring plate, through which the circuit board 10 is connected to the external electronic device 40.

In some embodiments, the electronic device 20 is a spring, that is, the spring can be connected to the side wall of the circuit board 10, and then the spring is connected to the external electronic device 40, so as to meet the requirements of different application scenarios.

According to some embodiments of the present application, the second side wall of the circuit board 10 is also provided with a bonding pad, and the second side wall is soldered with a spring sheet through the bonding pad, and the spring sheet is electrically connected with the internal wiring of the circuit board 10.

That is, in some embodiments, a similar structure to the first side wall 11 may be further disposed on other side walls of the circuit board 10, so as to connect different external electronic devices by disposing the elastic pieces on different side walls of the circuit board 10, further improve the utilization rate of the PCB, and in practical application, may further flexibly apply the layout elastic pieces on different side walls of the circuit board 10 according to specific requirements.

The circuit board structure comprises a circuit board and an electronic device, wherein the electronic device is welded on the first side wall of the circuit board, a bonding pad is distributed on the first side wall, the electronic device is welded on the bonding pad, and the bonding pad is electrically connected with the wiring inside the circuit board. Therefore, the electronic devices such as the spring plates are welded on the side wall of the circuit board, so that the layout space of the devices on the front side and the back side of the circuit board is not occupied, and the problem of clamping other components on the board is avoided.

The embodiment of the application also provides electronic equipment, which comprises the circuit board structure described in the embodiment of the foregoing fig. 1 to 3. It should be noted that, as an embodiment of the electronic device corresponding to the embodiment of the circuit board structure, a specific implementation manner of the embodiment may be referred to the related description of the foregoing embodiment, and the technical effects similar to those of the foregoing embodiment may be obtained, so that the repetition is avoided and no redundant description is provided herein.

Other components, such as processors and controllers, and the like, and the operation of electronic devices according to embodiments of the present application are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims

1. The circuit board structure is characterized by comprising a circuit board and an electronic device, wherein the electronic device is welded on a first side wall of the circuit board, a bonding pad is distributed on the first side wall, the electronic device is welded on the bonding pad, and the bonding pad is electrically connected with wiring inside the circuit board.

2. The circuit board structure of claim 1, wherein the electronic device is a spring or a component.

3. The circuit board structure of claim 1, wherein the first location of the first sidewall is provided with a copper-exposed layer, and the bonding pad is electrically connected to the copper-exposed layer.

4. A circuit board structure according to claim 3, wherein a first through hole perpendicular to the surface of the circuit board is provided at a second position of the circuit board, the first through hole is treated by a copper plating process, the copper exposing layer is electrically connected to an inner wall of the first through hole, and the second position is adjacent to the first sidewall.

5. The circuit board structure of claim 4, wherein the copper exposure layer is uniformly distributed at a plurality of positions of the first side wall, bonding pads electrically connected with the copper exposure layer are plated at the plurality of positions, and the electronic device is soldered at each bonding pad.

6. The circuit board structure of any one of claims 1 to 5, wherein the circuit board is a Cavity circuit board Cavity board or motherboard.

7. The circuit board structure of claim 4, wherein the circuit board is a Cavity board, the circuit board is electrically connected to a motherboard, and electrical signals on the motherboard reach the electronic device through the first via, the copper-exposed layer, and the bonding pad.

8. The circuit board structure of claim 2, wherein the electronic device is a spring, and the circuit board is connected to an external electronic device through the spring.

9. The circuit board structure of claim 2, wherein a bonding pad is also disposed on the second side wall of the circuit board, and a spring is welded on the second side wall through the bonding pad, and the spring is electrically connected with the circuit board internal wiring.

10. An electronic device comprising the circuit-board structure of any one of claims 1-9.