CN119450894A - Motor Controllers and Vehicles - Google Patents
Motor Controllers and Vehicles Download PDFInfo
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- CN119450894A CN119450894A CN202411640439.0A CN202411640439A CN119450894A CN 119450894 A CN119450894 A CN 119450894A CN 202411640439 A CN202411640439 A CN 202411640439A CN 119450894 A CN119450894 A CN 119450894A
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Abstract
The utility model relates to a motor controller and vehicle, motor controller includes power module and radiator, power module includes base plate and power terminal, power terminal sets up the one side of base plate thickness direction, power terminal in the orientation the orthographic projection of base plate orientation covers a part of base plate, the terminal surface that power terminal is close to the base plate with the base plate electricity is connected, the terminal surface that power terminal kept away from the base plate is used for being connected with mating parts electricity, the radiator is in the thickness direction of base plate sets up the base plate is kept away from one side of power terminal, the radiator with the base plate is connected. According to the motor controller disclosed by the disclosure, the radiator is arranged on one side of the substrate, which is far away from the power terminal, so that the heat dissipation of the power module can be realized, and the reliability of the motor controller is improved. By disposing the power terminal on one side in the thickness direction of the substrate, parasitic inductance of the power module can be reduced.
Description
Technical Field
The present disclosure relates to the field of motor controllers, and in particular, to a motor controller and a vehicle.
Background
The core component of the motor controller is a power module, and the power module is used as a power switch of the motor controller, and has the main function of converting externally input direct current into three-phase alternating current for output together with a control driving circuit. In the process of current conversion of the power module, a large amount of heat is generated, and the radiator is required to radiate the motor controller, so that the reliability of the motor controller is prevented from being influenced by the fact that the temperature inside the motor controller is too high. Meanwhile, the end part of the power module is welded with a power copper bar, and the power copper bar is connected with a capacitor, so that parasitic inductance of the power module is larger.
Disclosure of Invention
The present disclosure proposes a motor controller to improve reliability of the motor controller and reduce parasitic inductance of a power module.
The motor controller comprises a power module and a radiator, wherein the power module comprises a substrate and a power terminal, the power terminal is arranged on one side of the substrate in the thickness direction, the orthographic projection of the power terminal in the direction towards the substrate covers one part of the substrate, the end face, close to the substrate, of the power terminal is electrically connected with the substrate, the end face, far away from the substrate, of the power terminal is electrically connected with a matching part, and the radiator is arranged on one side, far away from the power terminal, of the substrate in the thickness direction of the substrate, and is connected with the substrate.
Optionally, the motor controller further comprises a plastic package body, the substrate is packaged in the plastic package body, and at least a part of the power terminal is packaged in the plastic package body.
Optionally, the plastic package body includes a first plastic package portion and a second plastic package portion, the second plastic package portion protrudes from the first plastic package portion along a direction away from the substrate, a portion of the substrate and the power terminal is packaged in the first plastic package portion, and another portion of the power terminal is packaged in the second plastic package portion.
Optionally, the power terminal includes a first side and a second side disposed adjacent to each other, the first side intersecting the second side.
Optionally, the orthographic projection of the power terminal in the direction facing the substrate is rectangular, and the ratio of the long side to the short side of the rectangle is 1.5-6.5.
Optionally, the power terminal includes a first side and a second side disposed adjacent to each other, the first side intersecting the second side.
Optionally, the side of the power terminal is provided with protrusions and/or grooves.
Optionally, the power terminal is a conductive block, and a thickness direction of the conductive block is consistent with a thickness direction of the substrate.
Optionally, the thickness of the conductive block is 2 mm-5 mm.
Optionally, the number of the power terminals is plural, and the plural power terminals are arranged at intervals around the edge of the substrate.
Optionally, the power terminal comprises an input terminal and an output terminal, the input terminal and the output terminal are arranged on two opposite sides of the substrate along a first direction, the first direction is perpendicular to the thickness direction of the substrate, the matching parts comprise a first matching part and a second matching part, the motor controller further comprises an input row and an output row, one end of the input row is electrically connected with the input terminal, the other end of the input row is electrically connected with the first matching part, one end of the output row is electrically connected with the output terminal, and the other end of the output row is electrically connected with the second matching part.
Optionally, the motor controller further comprises a signal terminal, wherein the signal terminal and the power terminal are arranged on the same side of the substrate in the thickness direction, one end, close to the substrate, of the signal terminal is electrically connected with the substrate, and one end, far away from the substrate, of the power terminal is used for being electrically connected with a chip.
Optionally, the motor controller further includes a connection board, the connection board is disposed between the substrate and the signal terminal, at least a portion of the connection board is encapsulated in the plastic package body, the connection board includes a conductive layer and an insulating layer, the insulating layer is disposed between the substrate and the conductive layer, the conductive layer is electrically connected with the substrate, and the signal terminal is electrically connected with the conductive layer.
Optionally, the connecting plate further comprises a metal layer, the metal layer is arranged on one side, close to the substrate, of the insulating layer, and the metal layer is welded with the substrate.
Optionally, the connection board is a ceramic copper-clad plate, the insulating layer is a ceramic layer, and the conductive layer and the metal layer are both copper foil layers.
Optionally, the whole encapsulation of connecting plate is in the plastic envelope, the plastic envelope parcel the conducting layer is kept away from the part of the surface of base plate, the plastic envelope is equipped with and is used for dodging signal terminal dodging the portion.
Optionally, the dodging part is a dodging hole, the signal terminal is arranged in the dodging hole, and a space is reserved between the signal terminal and the hole wall of the dodging hole.
Optionally, a coating part is arranged on the surface, far away from the insulating layer, of the conductive layer, the plastic package body wraps the coating part, and the coating part comprises a groove and/or a protrusion.
Optionally, the radiator comprises a runner plate and a heat dissipation plate, wherein the runner plate is provided with a runner groove for cooling liquid to flow, the heat dissipation plate is arranged between the base plate and the runner plate and is connected with the runner plate, one side of the heat dissipation plate, facing the runner plate, is provided with heat dissipation fins, and the heat dissipation fins are arranged in the runner groove.
Optionally, the flow channel plate is provided with a liquid inlet and a liquid outlet, the liquid inlet is used for cooling liquid to enter the flow channel groove, the liquid outlet is used for cooling liquid to flow out of the flow channel groove, the liquid inlet and the liquid outlet are arranged on two opposite sides of the flow channel groove in a second direction, the second direction is perpendicular to the thickness direction of the substrate, the number of the radiating fins is multiple, the radiating fins form multiple fin groups, the fin groups are sequentially arranged along the length direction of the flow channel groove, and the distance between two adjacent radiating fins in the fin groups close to the liquid inlet is larger than the distance between two adjacent radiating fins in the fin groups close to the liquid outlet.
Optionally, the heating panel includes board body and annular bounding wall, annular bounding wall encircles the board body sets up, and with the board body encloses into the mounting groove, radiating fin sets up in the mounting groove, annular bounding wall with the runner board is connected.
Optionally, a boss is disposed on a side of the board body facing the substrate, and the boss is used for being connected with the substrate.
Optionally, an annular protrusion is disposed on the boss, and an accommodating groove is defined between the annular protrusion and the boss, and is used for accommodating solder for connecting the boss and the power module.
Optionally, a positioning protrusion is disposed on the boss in the accommodating groove, and the positioning protrusion is used for abutting against the power module.
The present disclosure also proposes a vehicle.
The vehicle of the present disclosure includes a motor controller as described in any one of the above.
According to the motor controller disclosed by the invention, the radiator is arranged on one side of the substrate, which is far away from the power terminal, and the radiator is connected with the substrate, so that the heat dissipation of the power module can be realized, the temperature inside the motor controller is prevented from being too high, and the reliability of the motor controller is improved. By disposing the power terminal on one side in the thickness direction of the substrate, and the orthographic projection of the power terminal in the direction toward the substrate covers a portion of the substrate, the power terminal can be made to have a block-like or sheet-like structure, so that parasitic inductance of the power module can be reduced.
Drawings
Fig. 1 is a perspective view of a motor controller of an embodiment of the present disclosure.
Fig. 2 is an exploded view of one of the perspectives of the motor controller of an embodiment of the present disclosure.
Fig. 3 is an exploded view of another view of a motor controller according to an embodiment of the present disclosure.
Fig. 4 is a perspective view of a power module of a motor controller according to an embodiment of the present disclosure.
Fig. 5 is a partial cross-sectional view of a power module of a motor controller according to an embodiment of the present disclosure.
Fig. 6 is a front view of a power module of a motor controller according to an embodiment of the present disclosure connected to an input row and an output row.
Fig. 7 is a front view two of a power module of a motor controller according to an embodiment of the present disclosure connected to an input row and an output row.
Fig. 8 is a view in the A-A direction of fig. 7.
Fig. 9 is a B-B view of fig. 7.
Fig. 10 is an exploded view of a power module and input and output banks of a motor controller according to an embodiment of the present disclosure.
Fig. 11 is a cross-sectional view at a signal terminal of a power module of a motor controller of an embodiment of the present disclosure.
Fig. 12 is a schematic diagram of a structure where signal terminals of a power module of a motor controller according to an embodiment of the present disclosure are connected to a connection row.
Fig. 13 is a perspective view of a flow field plate of a motor controller according to an embodiment of the present disclosure.
Fig. 14 is a cross-sectional view of a flow field plate and a heat dissipation plate of a motor controller according to an embodiment of the present disclosure.
Fig. 15 is a perspective view of a heat sink of a motor controller according to an embodiment of the present disclosure.
Fig. 16 is a bottom view of a heat sink of a motor controller according to an embodiment of the present disclosure.
Fig. 17 is a C-C view of fig. 16.
Fig. 18 is a partial enlarged view at E in fig. 17.
Reference numerals:
100. A motor controller;
10. The power module comprises a power module 101, a first power module 102, a second power module 103 and a third power module;
1. the substrate, 11, a first copper-clad layer, 12, a ceramic layer, 13, a second copper-clad layer;
2. Power terminal, 21, input terminal, 211, first pole terminal, 2111, first terminal, 2112, second terminal, 212, second pole terminal, 22, output terminal, 2001, first end face, 2002, second end face;
3. the plastic package comprises a plastic package body, a first plastic package part, a second plastic package part, 321, a protruding part, 3211 and an avoiding part, wherein the plastic package body comprises a first plastic package part, a second plastic package part, a protruding part and a connecting part;
4. signal terminals 41, base 42, terminal body;
5. Connecting plate, 51, conductive layer, 511, cladding part, 52, insulating layer, 53, metal layer;
6. A wire;
7. A chip;
81. 82, second solder layer, 83, third solder layer;
201. Input row 202, first pole input row, 2021, first main body portion, 2022, first extension portion, 2023, second extension portion, 203, second pole input row, 2031, second main body portion, 2032, third extension portion, 204, output row;
30. a heat sink;
301. Flow channel plates 3011, flow channel grooves 3012, liquid inlets 3013, liquid outlets 3014 and positioning columns;
302. Heat radiating plate, 3021, first fin group, 3022, second fin group, 3023, third fin group, 3024, heat radiating fins, 3025, plate body, 3026, annular coaming, 3056, mounting groove, 3027, boss, 3028, annular protrusion, 3029, accommodating groove, 3030, positioning protrusion, 3031, positioning hole, 3032, connecting lug, 3033, connecting hole, 3034, sealing groove;
303. and a seal.
Detailed Description
Embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, are described in detail below. The embodiments described below by referring to the drawings are exemplary and intended for the purpose of explaining the present disclosure and are not to be construed as limiting the present disclosure.
As shown in fig. 1 to 5, the motor controller 100 of the embodiment of the present disclosure includes a power module 10 and a heat sink 30, the power module 10 includes a substrate 1 and a power terminal 2, the power terminal 2 is disposed on one side in a thickness direction of the substrate 1, and a front projection of the power terminal 2 in a direction toward the substrate 1 covers a portion of the substrate 1. The end face of the power terminal 2 close to the substrate 1 is electrically connected with the substrate 1, and the end face of the power terminal 2 far from the substrate 1 is used for being electrically connected with the mating component. The heat sink 30 is provided on a side of the substrate 1 away from the power terminals 2 in the thickness direction of the substrate 1, and the heat sink 30 is connected to the substrate 1.
According to the motor controller 100 disclosed by the embodiment of the disclosure, the radiator 30 is arranged on one side, far away from the power terminal 2, of the substrate 1, and the radiator 30 is connected with the substrate 1, so that heat dissipation of the power module 10 can be realized, the temperature inside the motor controller 100 is prevented from being too high, and the reliability of the motor controller 100 is improved. By disposing the power terminal 2 on one side in the thickness direction of the substrate 1, and the orthographic projection of the power terminal 2 in the direction toward the substrate 1 covers a part of the substrate 1, the power terminal 2 can be made to have a block-like or sheet-like structure, so that parasitic inductance of the power module 10 can be reduced.
In order to make the technical solution of the present disclosure easier to understand, the technical solution of the present disclosure will be further described below by taking the case that the thickness direction of the substrate 1 coincides with the up-down direction as an example. Wherein the up and down direction is shown as the figure.
For example, as shown in fig. 4 and 5, the power terminal 2 is provided on the upper side of the substrate 1, and a downward orthographic projection of the power terminal 2 covers a part of the substrate 1. The lower end face of the power terminal 2 is electrically connected with the substrate 1, and the upper end face of the power terminal 2 is used for being electrically connected with the mating component.
Optionally, the substrate 1 is a ceramic copper-clad plate.
For example, as shown in fig. 5, the substrate 1 includes a first copper-clad layer 11, a ceramic layer 12, and a second copper-clad layer 13, the first copper-clad layer 11 being disposed on the upper side of the ceramic layer 12, the second copper-clad layer 13 being disposed on the lower side of the ceramic layer 12. The power terminal 2 is disposed on the upper side of the first copper-clad layer 11, and the lower end face of the power terminal 2 is electrically connected to the first copper-clad layer 11.
Alternatively, the power terminal 2 is soldered to the substrate 1.
For example, as shown in fig. 5, the power terminal 2 has a first end face 2001 and a second end face 2002 arranged opposite to each other in the thickness direction of the substrate 1, wherein the first end face 2001 is a lower end face of the power terminal 2, and the second end face 2002 is an upper end face of the power terminal 2. The first end face 2001 is welded to the substrate 1, and the second end face 2002 is welded to the mating member. Wherein the power terminal 2 and the substrate 1 may be soldered by the first solder layer 81. The first solder layer 81 may be a systematic solder or a silver paste or a copper paste used for sintering.
The welding of the power terminal 2 to the substrate 1 is advantageous in improving the connection reliability between the power terminal 2 and the substrate 1 and in improving the reliability of the power module 10.
In the related art, when the power terminal adopts the power copper bar, the whole cantilever structure of the power terminal, no matter adopt welding or adopt screw connection between power terminal and the mating part, all can lead to the power terminal to have the deformation of different degree because of the existence of assembly tolerance etc., lead to the power terminal to have stress concentration problem with the plastic envelope body junction, finally lead to the plastic envelope body and the power terminal junction position to take place the fracture problem easily, lead to the power module to take place insulation failure problem easily.
In some embodiments, as shown in fig. 4 and 5, the power module 10 further includes a plastic package 3, the substrate 1 is packaged in the plastic package 3, and at least a portion of the power terminal 2 is packaged in the plastic package 3.
At least a portion of the power terminal 2 is encapsulated in the plastic encapsulation body 3, which can be understood as that a portion of the power terminal 2 is encapsulated in the plastic encapsulation body 3 and another portion of the power terminal 2 is located outside the plastic encapsulation body 3, or that the power terminal 2 is integrally encapsulated in the plastic encapsulation body 3.
By covering a part of the substrate 1 with the orthographic projection of the power terminal 2 in the direction towards the substrate 1, at least a part of the power terminal 2 is encapsulated in the plastic package body 3, so that the problem of stress concentration at the joint of the power terminal 2 and the plastic package body can be avoided, and the risk of insulation failure of the power module 10 is reduced. In addition, the plastic package 3 can be used to indirectly realize the mechanical connection between the power terminal 2 and the substrate 1, thereby improving the connection reliability between the power terminal 2 and the substrate 1 and further improving the reliability of the power module 10.
Alternatively, as shown in fig. 5, the molding body 3 includes a first molding portion 31 and a second molding portion 32, and the second molding portion 32 is provided protruding from the first molding portion 31 in a direction away from the substrate 1. A part of the substrate 1 and the power terminal 2 are encapsulated in the first plastic encapsulation 31, and another part of the power terminal 2 is encapsulated in the second plastic encapsulation 32.
For example, as shown in fig. 5, the second molding part 32 is provided protruding upward from the first molding part 31. The substrate 1 and the lower portion of the power terminal 2 are encapsulated in the first plastic encapsulation 31, and the upper portion of the power terminal 2 is encapsulated in the second plastic encapsulation 32.
It will be appreciated that the end surface of the power terminal 2 away from the substrate 1 protrudes from the substrate 1, and thus, the height of the plastic package 3 required for the substrate 1 is different from the height of the plastic package 3 required for the power terminal 2. By setting the plastic package body 3 to include the first plastic package portion 31 and the second plastic package portion 32, the first plastic package portion 31 is utilized to realize the plastic package of the substrate 1 and the power terminal 2, and the second plastic package portion 32 is utilized to realize the plastic package of the other part of the power terminal 2, so that the good plastic package effect of the substrate 1 and the power terminal 2 can be realized, and meanwhile, the whole volume of the plastic package body 3 is prevented from being larger, thereby being beneficial to reducing the cost of the power module 10.
Alternatively, as shown in fig. 5, the end face of the power terminal 2 away from the first plastic package portion 31 is flush with the end face of the second plastic package portion 32 away from the first plastic package portion 31.
For example, the upper end face of the power terminal 2 is flush with the upper end face of the second plastic package 32.
By setting the end face of the power terminal 2 far away from the first plastic package part 31 and the end face of the second plastic package part 32 far away from the first plastic package part 31 to be flush, the second plastic package part 32 can be prevented from affecting the electric connection of the power terminal 2 and the matching component while improving the plastic package effect of the power terminal 2, and the reliability of the power module 10 is improved.
In the related art, the power terminal and the mating component are mostly connected by welding, for example, laser welding is used for the power terminal and the mating component. The power terminal is usually a power copper bar, and when the power terminal is welded with the mating component, the power terminal is easy to burn through, and the power module is further burned out, so that the insulation failure of the power module is caused, and the connection reliability between the power module and the mating component is poor.
In some embodiments, the power terminal 2 is a conductive block, and the thickness direction of the conductive block coincides with the thickness direction of the substrate 1.
By setting the power terminal 2 as the conductive block, the thickness of the conductive block is larger, so that when the power terminal 2 is electrically connected with the matching component, the power terminal 2 can be prevented from being burnt out, the power module 10 is prevented from being burnt out, and the connection reliability between the power module 10 and the matching component is improved.
Optionally, the thickness of the conductive block is 2 mm-5 mm.
For example, as shown in fig. 5, the thickness of the conductive block is H, which is 3mm.
It will be appreciated that the greater the thickness of the conductive block, the less likely the power terminal 2 will burn through when the power terminal 2 is electrically connected to the mating member, the better the connection reliability between the power module 10 and the mating member, but the greater the thickness of the power module 10 will be and the higher the cost, and the smaller the thickness of the conductive block, the less the thickness of the power module 10 and the lower the cost, but the more likely the power terminal 2 will burn through when the power terminal 2 is electrically connected to the mating member, and the poorer the connection reliability between the power module 10 and the mating member will be.
By setting the thickness of the conductive block to 2mm to 5mm, the thickness of the power module 10 and the cost of the power module 10 can be reduced while improving the connection reliability between the power module 10 and the mating member.
Optionally, the power terminal 2 comprises a first side and a second side arranged adjacently, the first side intersecting the second side.
By setting the first side surface and the second side surface of the power terminal 2 to intersect, the bonding force between the power terminal 2 and the plastic package body 3 can be increased, the connection reliability between the power terminal 2 and the plastic package body 3 can be improved, and the reliability of the power module 10 can be further improved.
Alternatively, the orthographic projection of the power terminal 2 in the direction toward the substrate 1 is polygonal.
For example, the orthographic projection of the power terminal 2 in the direction toward the substrate 1 is triangular, quadrangular, pentagonal, hexagonal, or the like.
By forming the orthographic projection in the direction toward the substrate 1 as a polygon, the bonding force between the power terminal 2 and the plastic package 3 can be further increased, and the reliability of the power module 10 can be further improved.
Of course, in other embodiments, the outer side of the power terminal 2 may be a cylindrical surface. At this time, the orthographic projection of the power terminal 2 in the direction toward the substrate 1 is circular.
Optionally, the orthographic projection of the power terminal 2 in the direction towards the substrate 1 is rectangular, and the ratio of the long side to the short side of the rectangle is 1.5-6.5.
For example, the orthographic projection of the first side surface in the direction toward the substrate 1 is a short side, the orthographic projection of the second side surface in the direction toward the substrate 1 is a long side, and the ratio of the long side to the short side is 4.
By setting the orthographic projection of the power terminal 2 in the direction toward the substrate 1 to be rectangular, the processing and manufacturing of the power terminal 2 are facilitated. By setting the ratio of the long side to the short side of the rectangle to 1.5-6.5, the connection reliability of the power terminal 2 and the mating component can be ensured under the condition that the width of the power terminal 2 is narrower.
Alternatively, the power terminal 2 is prismatic.
For example, the power terminal 2 has a prismatic shape such as a quadrangular prism, a triangular prism, or a hexagonal prism.
By forming the power terminal 2 into a prismatic shape, the processing and manufacturing of the power terminal 2 are facilitated, and the cost of the power module 10 is reduced.
Optionally, the sides of the power terminals 2 are provided with protrusions and/or recesses.
By arranging the protrusions and/or the grooves on the side surface of the power terminal 2, the contact area between the power terminal 2 and the plastic package body 3 can be increased, the binding force between the power terminal 2 and the plastic package body 3 can be increased, the connection reliability between the power terminal 2 and the plastic package body 3 can be improved, and the reliability of the power module 10 can be improved.
In the related art, the power terminal adopts the power copper bar, and the overall structure of the power copper bar is complicated, and only pure copper material can be adopted, so that the expansion coefficient difference between the power terminal and the plastic package body is large, and in the working process of the power module, the power terminal and the plastic package body can undergo repeated high and low temperature changes, so that the cracking problem is easily caused at the joint of the power terminal and the plastic package body, and further, the insulation failure of the power module is caused.
Optionally, the material of the power terminal 2 is an alloy.
Alternatively, the number of the power terminals 2 is plural, and the plural power terminals 2 are arranged at intervals around the edge of the substrate 1.
For example, the number of the power terminals 2 is four, and the four power terminals 2 are arranged at intervals around the edge of the substrate 1.
By arranging the power terminals 2 around the edge of the substrate 1, the power terminals 2 are facilitated to be connected with the counter parts, thereby facilitating the connection of the power module 10 with the counter parts.
The motor controller 100 of the embodiment of the disclosure, due to the simple structure of the power terminal 2, is easy to mold and has better manufacturability, so that the material of the power terminal 2 can be more selected, for example, the material which is close to the expansion coefficient of the plastic package body 3, such as copper-molybdenum alloy material, can be adopted, so that the risk of cracking problem at the joint of the power terminal 2 and the plastic package body 3 is reduced, and the risk of causing insulation failure of the power module 10 is reduced.
Alternatively, as shown in fig. 6 to 10, the power terminal 2 includes an input terminal 21 and an output terminal 22, the input terminal 21 and the output terminal 22 being disposed on opposite sides of the substrate 1 in a first direction, the first direction being perpendicular to a thickness direction of the substrate 1. The mating parts include a first mating part and a second mating part, the motor controller 100 further includes an input row 201 and an output row 204, one end of the input row 201 is electrically connected with an end surface of the input terminal 21, which is far away from the substrate 1, the other end of the input row 201 is electrically connected with the first mating part, one end of the output row 204 is electrically connected with an end surface of the output terminal 22, which is far away from the substrate 1, and the other end of the output row 204 is electrically connected with the second mating part.
For example, the input terminal 21 is provided on the front side of the substrate 1, and the output terminal 22 is provided on the rear side of the substrate 1. The first pair of mating components is a capacitor and the second pair of mating components is a three-phase input phase line of the motor.
By disposing the input terminal 21 and the output terminal 22 on opposite sides in the first direction, not only can electrical insulation performance between the input terminal 21 and the output terminal 22 be ensured, but also it is convenient for the input terminal 21 and the output terminal 22 to be electrically connected with different mating members, respectively.
Alternatively, as shown in fig. 6 to 10, the number of the input terminals 21 and the input rows 201 is plural, the input terminals 21 include a first pole terminal 211 and a second pole terminal 212, the input rows 201 include a first pole input row 202 and a second pole input row 203, the first pole input row 202 is electrically connected to the first pole terminal 211, and the second pole input row 203 is electrically connected to the second pole terminal 212. A portion of the orthographic projection of the first pole input row 202 in the thickness direction toward the substrate 1 covers a portion of the orthographic projection of the second pole input row 203 in the thickness direction toward the substrate 1.
One of the first electrode terminal 211 and the second electrode terminal 212 is a positive electrode terminal, the other of the first electrode terminal 211 and the second electrode terminal 212 is a negative electrode terminal, one of the first electrode input row 202 and the second electrode input row 203 is a positive electrode input row 201, and the other of the first electrode input row 202 and the second electrode input row 203 is a negative electrode input row 201.
For example, the first pole terminal 211 is a positive pole terminal, the second pole terminal 212 is a negative pole terminal, the first pole input row 202 is a positive pole input row, and the second pole input row 203 is a negative pole input row. As shown in fig. 10, the current direction of the first pole input row 202 and the second pole input row 203 are opposite.
By covering a portion of the orthographic projection of the first pole input row 202 in the thickness direction toward the substrate 1 with a portion of the second pole input row 203 in the thickness direction toward the substrate 1, stray inductance between the first pole input row 202 and the second pole input row 203 can be significantly reduced, reducing equivalent inductance (Equivalent series inductance, ESL) of the motor controller 100, thereby enabling the motor controller 100 to operate at a higher voltage, since the current directions of the first pole input row 202 and the second pole input row 203 are opposite (the current direction of the first pole input row 202 is shown by arrow D1 in fig. 10, and the current direction of the second pole input row 203 is shown by arrow D2 in fig. 10).
Alternatively, as shown in fig. 7 and 8, the first pole input row 202 includes a first main body portion 2021, a first extension portion 2022, and a second extension portion 2023, the first extension portion 2022 and the second extension portion 2023 being disposed on the same side of the first main body portion 2021 in the first direction and each being electrically connected to the first main body portion 2021. The number of the first pole terminals 211 is plural, and the first pole terminals 211 include a first terminal 2111 and a second terminal 2112. The first and second extension portions 2022 and 2023 are arranged at intervals along the second direction, and the first and second terminals 2111 and 2112 are arranged at intervals along the second direction. Wherein the first extension 2022 is electrically connected to the first terminal 2111, and the second extension 2023 is electrically connected to the second terminal 2112. The first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate 1.
By providing the first pole input row 202 to include the first main body portion 2021, the first extension portion 2022, and the second extension portion 2023, providing the first pole terminal 211 to include the first terminal 2111 and the second terminal 2112, the first extension portion 2022 being electrically connected to the first terminal 2111, and the second extension portion 2023 being electrically connected to the second terminal 2112, the connection area between the first pole input row 202 and the power module 10 can be increased, thereby improving the current transmission capability between the power module 10 and the counter part.
In order to make the technical solution of the present disclosure easier to understand, the technical solution of the present disclosure is further described below by taking the example that the first direction coincides with the front-back direction and the second direction coincides with the left-right direction. Wherein, the front-back direction and the left-right direction are shown in the figure.
For example, the first extension portion 2022 and the second extension portion 2023 are provided on the rear side of the first main body portion 2021, the first extension portion 2022 is provided on the left side of the second extension portion 2023, and the first terminal 2111 is provided on the left side of the second terminal 2112.
Alternatively, as shown in fig. 9 and 10, the second electrode input row 203 includes a second main body portion 2031 and a third extension portion 2032, and the third extension portion 2032 is provided on one side of the second main body portion 2031 in the first direction and is electrically connected to the second main body portion 2031. The third extension 2032 is electrically connected to the second electrode terminal 212. At least a part of the orthographic projection of the first body portion 2021 toward the thickness direction of the substrate 1 covers at least a part of the orthographic projection of the second body portion 2031 toward the thickness direction of the substrate 1.
Wherein at least a portion of the orthographic projection of the first body portion 2021 toward the thickness direction of the substrate 1 covers at least a portion of the orthographic projection of the second body portion 2031 toward the thickness direction of the substrate 1, it is understood that a portion of the orthographic projection of the first body portion 2021 toward the thickness direction of the substrate 1 covers a portion of the orthographic projection of the second body portion 2031 toward the thickness direction of the substrate 1, and another portion of the orthographic projection of the first body portion 2021 toward the thickness direction of the substrate 1 covers another portion of the orthographic projection of the second body portion 2031 toward the thickness direction of the substrate 1, or an orthographic projection of the first body portion 2021 toward the thickness direction of the substrate 1 covers an orthographic projection of the second body portion 2031 toward the thickness direction of the substrate 1.
For example, as shown in fig. 9 and 10, the second extension portion 2023 is provided on the rear side of the second main body portion 2031. The downward orthographic projection of the first body portion 2021 covers the downward orthographic projection of the second body portion 2031.
By covering at least a portion of the orthographic projection of the first body portion 2021 toward the thickness direction of the substrate 1 with at least a portion of the orthographic projection of the second body portion 2031 toward the thickness direction of the substrate 1, the lamination portion between the first pole input row 202 and the second pole input row 203 can be increased, effectively reducing the stray inductance between the first pole input row 202 and the second pole input row 203, and reducing the equivalent inductance of the motor controller 100, thereby enabling the motor controller 100 to operate at a higher voltage.
Alternatively, as shown in fig. 8 to 10, the second main body portion 2031 is provided on a side of the first main body portion 2021 away from the substrate 1 in the thickness direction of the substrate 1. The first extension portion 2022 and the second extension portion 2023 are provided to be bent in a direction toward the substrate 1. The second electrode terminal 212 is disposed between the first terminal 2111 and the second terminal 2112 in the second direction. The third extension 2032 is provided between the first extension 2022 and the second extension 2023 in the second direction.
For example, the second body portion 2031 is provided on the upper side of the first body portion 2021. The first extension portion 2022 and the second extension portion 2023 are bent downward. The third extension portion 2032 is provided between the first extension portion 2022 and the second extension portion 2023 in the left-right direction.
By the above-described design of the first extension portion 2022, the second extension portion 2023, and the third extension portion 2032, it is possible to more compactly arrange the first extension portion 2022, the second extension portion 2023, and the third extension portion 2032, and to more compactly arrange the first terminal 2111, the second terminal 2112, and the second terminal 212, further reducing the volume of the motor controller 100.
Optionally, at least one of the surface of the first extension 2022 facing the substrate 1 and the surface of the second extension 2023 facing the substrate 1 is flush with the surface of the third extension 2032 facing the substrate 1.
For example, the lower surface of the first extension 2022, the lower surface of the second extension 2023, and the lower surface of the third extension 2032 are flush.
By making at least one of the surface of the first extension 2022 facing the substrate 1 and the surface of the second extension 2023 facing the substrate 1 flush with the surface of the third extension 2032 facing the substrate 1, the volume of the motor controller 100 can be further reduced.
Optionally, the connection area of the second electrode terminal 212 and the third extension portion 2032 is larger than the connection area of the first electrode terminal 2111 and the first extension portion 2022. The connection area of the second electrode terminal 212 and the third extension portion 2032 is larger than the connection area of the second terminal 2112 and the second extension portion 2023.
For example, the connection area between the second terminal 212 and the third extension portion 2032 is S1, the connection area between the first terminal 2111 and the first extension portion 2022 is S2, and the connection area between the second terminal 2112 and the second extension portion 2023 is S3. The sum of S2 and S3 is equal to S1, or the sum of S2 and S3 is greater than S1, or the sum of S2 and S3 is less than S1.
It will be appreciated that the current between the first and second pole input rows 202, 203 is equal in magnitude, and that the current carrying capacity of the first and second pole input rows 202, 203 is comparable. By the above-described design of the connection area between the second electrode terminal 212 and the third extension portion 2032, the connection area between the first terminal 2111 and the first extension portion 2022, and the connection area between the second electrode terminal 212 and the third extension portion 2032, the current transmission capacity of the first electrode input line 202 and the second electrode input line 203 is made equivalent.
Alternatively, the input terminal 21 and the output terminal 22 are provided on opposite sides of the substrate 1 in the first direction. The input row 201 and the output row 204 are disposed on opposite sides of the substrate 1 in the first direction.
For example, as shown in fig. 6 to 10, the input terminal 21 is provided on the front side of the output terminal 22, and the input row 201 is provided on the front side of the output row 204. Wherein the output row 204 is adapted to be connected directly or indirectly to the three-phase input phase line of the motor.
By arranging the input terminals 21 and the output terminals 22 on opposite sides of the substrate 1 in the first direction. The input row 201 and the output row 204 are disposed on opposite sides of the substrate 1 in the first direction, so that the input row 201 and the output row 204 are farther apart, the insulation performance between the input row 201 and the output row 204 is improved, and the safety of the motor controller 100 is improved.
Alternatively, as shown in fig. 4, 8 to 12, the power module 10 further includes a signal terminal 4, the signal terminal 4 and the power terminal 2 being disposed on the same side in the thickness direction of the substrate 1. The signal terminal 4 is electrically connected to the substrate 1 at an end close to the substrate 1, and the power terminal 2 is electrically connected to the chip at an end far from the substrate 1.
Wherein an end of the signal terminal 4 remote from the substrate 1 is used for connection with a semiconductor chip (e.g., an IGBT chip), so that a control signal is input to the semiconductor chip through the signal terminal 4.
For example, as shown in fig. 4, the signal terminals 4 and the power terminals 2 are each provided on the upper side of the substrate 1.
By arranging the signal terminals 4 and the power terminals 2 on the same side in the thickness direction of the substrate 1, the power module 10 and the matching parts and the power module 10 and the chip are convenient to wire, and the installation efficiency of the power module 10 is improved.
Optionally, the signal terminal 4 is a signal pin.
For example, the signal terminal 4 is a spring signal pin.
In the related art, the power module is provided with the signal terminal on one side of the thickness direction of the substrate, and the signal terminal is directly welded with the substrate or welded through a copper block, so that the substrate is required to be cut into islands at the substrate, which not only results in higher equivalent inductance (Equivalent Series Inductance, ESL) of the power module, but also results in reduced current capacity of the power module.
In some embodiments, as shown in fig. 11 and 12, the power module 10 includes a connection board 5, the connection board 5 being arranged in a stack with the substrate 1 and connected, at least a portion of the connection board 5 being encapsulated within a second plastic encapsulation 32. The connection board 5 includes a conductive layer 51 and an insulating layer 52, the insulating layer 52 being disposed between the substrate 1 and the conductive layer 51, the conductive layer 51 being electrically connected to the substrate 1. The signal terminal 3 is disposed on a side of the conductive layer 51 remote from the insulating layer 52 and is electrically connected to the conductive layer 51.
The motor controller 100 of the embodiment of the present disclosure realizes connection fixation between the signal terminal 4 and the substrate 1 by connecting the connection board 5 with the substrate 1 and connecting the signal terminal 4 with the connection board 5. By providing the connection board 5 to include the conductive layer 51 and the insulating layer 52, the conductive layer 51 is electrically connected to the substrate 1, and the signal terminal 4 is electrically connected to the conductive layer 51, so that the signal terminal 4 is electrically connected to the substrate 1. By disposing the insulating layer 52 between the substrate 1 and the conductive layer 51, insulation between the conductive layer 51 and the substrate 1 can be achieved, so that the substrate 1 does not need to be cut to form islands, not only reducing the equivalent inductance of the power module 10, but also improving the current-through capability of the power module 10. In addition, by providing the signal terminals 4 on one side in the thickness direction of the substrate 1, the consistency of the upper and lower bridges of the power module 10 can be made better, and the structure can be made more compact.
For example, as shown in fig. 11, the connection board 5 is provided on the upper side of the substrate 1, the conductive layer 51 is provided on the upper side of the insulating layer 52, and the signal terminal 4 is provided on the upper side of the conductive layer 51. The lower ends of the signal terminals 4 are electrically connected to the conductive layer 51, and the lower ends of the signal terminals 4 are insulated from the substrate 1 by the insulating layer 52.
Optionally, the substrate 1 is a ceramic copper-clad plate.
For example, as shown in fig. 11, the substrate 1 includes a first copper-clad layer 11, a ceramic layer 12, and a second copper-clad layer 13, the first copper-clad layer 11 being disposed on the upper side of the ceramic layer 12, the second copper-clad layer 13 being disposed on the lower side of the ceramic layer 12. The connection plate 5 is disposed on the upper side of the first copper-clad layer 11, and the lower end of the connection plate 5 is connected to the first copper-clad layer 11.
As shown in fig. 11, the signal terminal 4 includes a base 41 and a terminal body 42, and the base 41 is electrically connected to the conductive layer 51.
The signal terminal 4 is electrically connected to the conductive layer 51 through the base 41, so that the connection area between the signal terminal 4 and the conductive layer 51 can be increased, and the connection reliability between the signal terminal 4 and the conductive layer 51 can be improved.
Optionally, the signal terminals 4 are soldered with the conductive layer 51.
For example, the signal terminal 4 and the conductive layer 51 are laser welded.
By welding the signal terminal 4 with the conductive layer 51, it is advantageous to improve the connection reliability between the signal terminal 4 and the conductive layer 51, and to improve the reliability of the power module 10.
In some embodiments, as shown in fig. 11, the connection plate 5 further includes a metal layer 53, and the metal layer 53 is welded with the substrate 1.
For example, as shown in fig. 11, the power module 10 further includes a second solder layer 82, the second solder layer 82 being disposed between the metal layer 53 and the substrate 1 in the thickness direction of the substrate 1. The metal layer 53 is soldered to the substrate 1 through the second solder layer 82. The second solder layer 82 may be a system solder, or may be silver paste or copper paste used for sintering.
By welding the metal layer 53 to the substrate 1, connection between the connection board 5 and the substrate 1 is achieved, and the connection reliability between the connection board 5 and the substrate 1 can be improved, which is advantageous for improving the reliability of the power module 10.
Optionally, the connection board 5 is a ceramic copper clad laminate (Direct Bonding Copper, DBC), the insulating layer 52 is a ceramic layer, and the conductive layer 51 and the metal layer 53 are copper foil layers.
By setting the connection plate 5 as a ceramic copper-clad plate, not only the insulation performance of the insulation layer 52 can be ensured, but also the current-passing capability of the conductive layer 51 can be ensured, and the reliability of the power module 10 can be improved.
Optionally, the connection board 5 is entirely encapsulated in the plastic package 3.
By wholly packaging the connection board 5 in the plastic package body 3, the connection reliability between the connection board 5 and the plastic package body 3 can be improved, and the reliability of the power module 10 can be further improved.
Alternatively, as shown in fig. 11, the plastic package 3 is provided with a relief portion 3211 for relieving the signal terminal 4, and the plastic package 3 wraps a portion of the surface of the conductive layer 51 remote from the substrate 1.
For example, as shown in fig. 11, the second molding part 32 includes a protrusion 321, the protrusion 321 is provided to protrude upward from the upper side of the connection board 5, and the lower end of the protrusion 321 wraps the upper surface of the connection board 5. The projection 321 is provided with a relief portion 3211 for relieving the signal terminal 4.
By wrapping the plastic package body 3 around a portion of the surface of the conductive layer 51 away from the substrate 1, the bonding force between the plastic package body 3 and the connection board 5 can be increased, the connection reliability between the plastic package body 3 and the connection board 5 can be improved, and the reliability of the power module 10 can be improved. In addition, the avoidance portion 3211 is arranged on the plastic package body 3, so that the signal terminal 4 and the plastic package body 3 can be prevented from being in direct contact, and further, the situation that the signal terminal 4 and the plastic package body 3 are cracked due to different expansion coefficients, so that the power module 10 is in insulation failure is avoided, and the reliability of the power module 10 is improved.
Optionally, the avoidance portion 3211 is an avoidance hole, the signal terminal 4 is disposed in the avoidance hole, and a space is formed between the signal terminal 4 and a wall of the avoidance hole.
By setting the relief portion 3211 as a relief hole, the connection reliability between the plastic package 3 and the connection board 5 can be increased, and the reliability of the power module 10 can be improved.
Optionally, a coating portion 511 is disposed on a surface of the conductive layer 51 away from the insulating layer 52, and the plastic package 3 wraps the coating portion 511, where the coating portion 511 includes a groove and/or a protrusion.
For example, a groove is etched on the conductive layer 51. The grooves and the protrusions can increase the adhesion of the plastic package 3 and the conductive layer 51.
By providing the coating portion 511 on the conductive layer 51, the bonding force between the plastic package body 3 and the connection board 5 can be increased, the connection reliability between the plastic package body 3 and the connection board 5 can be improved, the lamination of the plastic package body 3 and the connection board 5 can be prevented, the entry of water vapor and the like into the power module 10 can be prevented, and the insulation performance of the power module 10 can be improved.
Optionally, the orthographic projection of the insulating layer 52 in the direction towards the substrate 1 is larger than the orthographic projection of the conductive layer 51 in the direction towards the substrate 1. Or the orthographic projection of the insulating layer 52 in the direction toward the substrate 1 is smaller than the orthographic projection of the conductive layer 51 in the direction toward the substrate 1.
For example, as shown in fig. 11, the area of the insulating layer 52 is larger than that of the conductive layer 51, so that the side surface of the insulating layer 52 protrudes out of the conductive layer 51, and the bonding force between the plastic package 3 and the connecting plate 5 is increased. Of course, the area of the insulating layer 52 may be smaller than that of the conductive layer 51, so that the side surface of the conductive layer 51 protrudes out of the insulating layer 52, and the bonding force between the plastic package body 3 and the connecting plate 5 is increased.
Therefore, the connection reliability of the plastic package body 3 and the connecting plate 5 can be improved, the plastic package body 3 and the connecting plate 5 are prevented from layering, water vapor and the like are prevented from entering the power module 10, and the insulating performance of the power module 10 is improved.
Alternatively, as shown in fig. 12, the conductive layer 51 is electrically connected to the substrate 1 through a wire 6.
One end of the wire 6 is electrically connected to the conductive layer 51, and the other end of the wire 6 is electrically connected to the substrate 1.
The conducting layer 51 is electrically connected with the substrate 1 through the conducting wire 6, so that the conducting layer 51 is electrically connected with the substrate 1, and the power module 10 is convenient to process and manufacture.
As shown in fig. 11, the power module 10 further includes a chip 7, the chip 7 and the signal terminals 4 are disposed on the same side in the thickness direction of the substrate 1, and the chip 7 is electrically connected to the substrate 1.
In some embodiments, as shown in fig. 1 to 3, the heat sink 30 includes a flow channel plate 301 and a heat dissipation plate 302, the flow channel plate 301 is provided with a flow channel groove 3011 through which a cooling liquid flows, and the heat dissipation plate 302 is disposed between the substrate 1 and the flow channel plate 301. The heat sink 302 is connected to the flow channel plate 301, and heat sink fins 3024 are provided on the side of the heat sink 302 facing the flow channel plate 301, and the heat sink fins 3024 are provided in the flow channel grooves 3011.
In the motor controller 100 according to the embodiment of the disclosure, the radiator 30 is configured to include the runner plate 301 and the heat dissipation plate 302, the runner plate 301 is provided with the runner groove 3011 for flowing the cooling liquid, the heat dissipation fin 3024 is disposed in the heat dissipation plate 302, and the heat dissipation fin 3024 is disposed in the runner groove 3011, so that heat generated by the power module 10 can be transferred to the heat dissipation plate 302, and heat of the heat dissipation plate 302 is transferred to the external environment through the cooling liquid, so that the heat dissipation effect of the motor controller 100 is improved.
Alternatively, as shown in fig. 2, 13 and 14, the flow channel plate 301 is provided with a liquid inlet 3012 and a liquid outlet 3013, the liquid inlet 3012 is used for cooling liquid to enter the flow channel 3011, the liquid outlet 3013 is used for cooling liquid to flow out of the flow channel 3011, the liquid inlet 3012 and the liquid outlet 3013 are arranged on opposite sides of the flow channel 3011 in a second direction, and the second direction is perpendicular to the thickness direction of the substrate 1. For example, the second direction coincides with the left-right direction.
For example, as shown in fig. 13 and 14, the liquid inlet 3012 is provided on the left side of the liquid outlet 3013, and the cooling liquid enters the flow channel groove 3011 from the liquid inlet 3012, then flows from left to right, and finally flows out from the liquid outlet 3013 to the outside.
It will be appreciated that the more and more heat is absorbed by the coolant in the direction of flow of the coolant, the higher the temperature of the coolant, and the poorer the heat dissipation effect of the corresponding power module 10.
As shown in fig. 3 and 16, the number of the heat radiating fins 3024 is plural, and the plurality of heat radiating fins 3024 form a plurality of fin groups which are sequentially arranged in the longitudinal direction of the flow passage groove 3011. The spacing between two adjacent heat radiating fins 3024 in the fin group near the liquid inlet 3012 is larger than the spacing between two adjacent heat radiating fins 3024 in the fin group near the liquid outlet 3013.
For example, as shown in fig. 16, the heat radiation fins 3024 are formed of three fin groups, that is, a first fin group 3021, a second fin group 3022, and a third fin group 3023, respectively, the first fin group 3021 being disposed on the left side of the second fin group 3022, and the second fin group 3022 being disposed on the left side of the third fin group 3023. The spacing between two adjacent heat radiating fins 3024 in the first fin group 3021 is L1, the spacing between two adjacent heat radiating fins 3024 in the second fin group 3022 is L2, the spacing between two adjacent heat radiating fins 3024 in the third fin group 3023 is L3, L1 is larger than L2, and L2 is larger than L3.
By setting the interval between the adjacent two heat radiating fins 3024 in the fin group near the liquid inlet 3012 to be larger than the interval between the adjacent two heat radiating fins 3024 in the fin group near the liquid outlet 3013, the heat radiating area of the portion of the radiator 30 near the liquid outlet 3013 is larger than the heat radiating area of the portion near the liquid inlet 3012, so that the heat radiating effect of the portion of the radiator 30 near the liquid inlet 3012 is improved, and thus, the heat radiating uniformity of the motor controller 100 can be improved.
Alternatively, as shown in fig. 16 and 17, the heat radiation plate 302 includes a plate body 3025 and an annular surrounding plate 3026, the annular surrounding plate 3026 being provided around the plate body 3025 and enclosing a mounting groove 3056 with the plate body 3025. The heat radiation fins 3024 are provided in the mounting groove 3056, and the annular surrounding plate 3026 is connected to the flow path plate 301.
By setting the heat radiation plate 302 to the above structure, the annular coaming 3026 can strengthen the plate body 3025, improve the deformation resistance of the heat radiation plate 302, and effectively improve the overall rigidity of the heat radiation plate 302.
As shown in fig. 2 and 3, the motor controller 100 includes a sealing member 303, the sealing member 303 being disposed between the flow path plate 301 and the heat dissipation plate 302, the sealing member 303 being configured to improve sealability between the flow path plate 301 and the heat dissipation plate 302, and reduce leakage risk of the cooling liquid.
As shown in fig. 2 and 13, the annular shroud 3026 is provided with a seal groove 3034, and the seal 303 is provided in the seal groove 3034.
Alternatively, as shown in fig. 2, 15, 17 and 18, a boss 3027 is provided on a side of the board body 3025 facing the substrate 1, the boss 3027 being for connection with the substrate 1.
The thickness of the plate body 3025 can be increased by providing the boss 3027, which is advantageous for increasing the rigidity of the plate body 3025 and improving the overall rigidity of the heat radiation plate 302.
Optionally, as shown in fig. 2, an annular protrusion 3028 is disposed on the boss 3027, and an accommodating groove 3029 is enclosed between the annular protrusion 3028 and the boss 3027, where the accommodating groove 3029 is used for accommodating solder for connecting the boss 3027 and the power module 10.
For example, the power module 10 is welded to the boss 3027 by the third solder layer 83.
Through setting up annular protruding 3028 on boss 3027, enclose into holding tank 3029 between annular protruding 3028 and the boss 3027, utilize holding tank 3029 to hold the solder, can prevent that the solder from spilling over, be favorable to improving the welding effect of power module 10 and heating panel 302, improve the connection reliability of power module 10 and heating panel 302.
Alternatively, as shown in fig. 2 and 15, a positioning protrusion 3030 is provided on the boss 3027 in the receiving groove 3029, and the positioning protrusion 3030 is used to abut against the power module 10.
By providing the positioning protrusion 3030, the positioning protrusion 3030 is utilized to abut against the power module 10, so that the power module 10 can be prevented from being directly contacted with the boss 3027, namely, the positioning protrusion 3030 can ensure that the power module 10 and the boss 3027 have a certain interval, and the solder in the interval can not overflow, thereby ensuring the minimum thickness of the solder, and avoiding the overflow of the solder in the accommodating groove 3029.
Alternatively, as shown in fig. 15, the number of the positioning protrusions 3030 may be plural, and the plurality of positioning protrusions 3030 are arranged in the form of a plurality of rows and a plurality of columns.
The number of the bosses 3027 may depend on the number of the power modules 10, for example, as shown in fig. 2 and 3, the number of the power modules 10 is three, the three power modules 10 are the first power module 101, the second power module 102, and the third power module 103, the number of the bosses 3027 may be three, and the bosses 24 are welded in a one-to-one correspondence with the power modules 10. Further, the fin groups are in one-to-one correspondence with the power modules 10, for example, the first power module 101 is disposed corresponding to the first fin group 3021, the second power module 102 is disposed corresponding to the second fin group 3022, and the third power module 103 is disposed corresponding to the third fin group 3023.
Alternatively, as shown in fig. 13, 15 and 16, one of the annular coaming 3026 and the flow path plate 301 is provided with a positioning post 3014, and the other is provided with a positioning hole 3031, and the positioning post 3014 is in positioning engagement with the positioning hole 3031.
For example, the annular shroud 3026 is provided with a positioning hole 3031, and the flow field plate 301 is provided with a positioning post 3014, and the positioning post 3014 is in positioning fit with the positioning hole 3031.
By positioning the positioning posts 3014 with the positioning holes 3031, the positioning reliability of the flow channel plate 301 and the heat dissipation plate 302 can be improved, thereby improving the reliability of the heat sink 30.
Alternatively, as shown in fig. 15 and 16, the annular shroud 3026 is provided with a connection lug 3032, the connection lug 3032 is provided with a connection hole 3033, and the connection hole 3033 is used for connection with other parts of the motor controller 100 to realize fixing of the heat sink 30.
The motor controller 100 according to the embodiment of the disclosure has the advantages that the consistency of the upper and lower bridges is better and the structure is more compact by arranging the signal terminal 4 at one side of the thickness direction of the substrate 1, the parasitic inductance of the power module 10 can be reduced by arranging the power terminal 2 as a conductive block, the radiator 30 has no water temperature accumulation efficiency, and the heat dissipation performance of the motor controller 100 is good.
The vehicle of the embodiments of the present disclosure includes the motor controller 100 of any of the embodiments described above. Wherein the vehicle may be an electric vehicle.
While embodiments of the present disclosure have been shown and described above, it should be understood that the above embodiments are illustrative and not to be construed as limiting the present disclosure, and that variations, modifications, alternatives, and variations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the present disclosure.
Claims (24)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411640439.0A CN119450894A (en) | 2024-11-15 | 2024-11-15 | Motor Controllers and Vehicles |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202411640439.0A CN119450894A (en) | 2024-11-15 | 2024-11-15 | Motor Controllers and Vehicles |
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| CN119450894A true CN119450894A (en) | 2025-02-14 |
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