CN119408743A - Modularized heat dissipation device applied to satellite and artificial satellite - Google Patents

Abstract

The present invention relates to the field of satellite heat dissipation technology, and provides a modular heat dissipation device and an artificial satellite applied to a satellite. The modular heat dissipation device applied to a satellite includes a heat collecting plate, a plurality of heat pipes, an electromagnetic pump and a plurality of heat dissipation plates, one side of the heat collecting plate is used to contact with the heat source of the satellite; the plurality of heat pipes are arranged in an array, and each two adjacent heat pipes are detachably connected, each heat pipe has an evaporation end and a condensation end, the evaporation end is connected to the heat collecting plate, liquid metal is contained in the heat pipe, and an axially through steam flow channel and condensation flow channel are provided in the heat pipe, the liquid metal evaporates into gas at the evaporation end and reaches the condensation end along the steam flow channel, the liquid metal condenses into liquid at the condensation end and reaches the evaporation end along the condensation flow channel; the electromagnetic pump is connected to the heat pipe, and the electromagnetic pump is used to drive the liquid metal in the heat pipe to flow; the plurality of heat dissipation plates are connected to each other to enclose around the plurality of heat pipes. By freely increasing or decreasing the number of heat pipes to correspond to different satellite products, the adaptability is improved.

Description

Modularized heat dissipation device applied to satellite and artificial satellite

Technical Field

The invention relates to the technical field of satellite heat dissipation, in particular to a modularized heat dissipation device applied to satellites and an artificial satellite.

Background

With the rapid development of the aerospace technology, the requirements on the functions and the performances of satellites are continuously improved. Satellites are evolving towards high functional densities, high payload ratios, multi-tasking multi-modes, etc. Due to size and weight limitations, the integrated design of satellite load and platform is a trend. In addition, in order to meet the requirements of high-performance tasks, satellites need to continuously operate for a long time, which leads to increased power consumption of satellite devices, and the problem of heat dissipation becomes more prominent, which presents challenges for thermal design of satellite platforms.

The traditional satellite heat dissipation design mainly adopts a mode of combining passive heat dissipation and active temperature control. For example, thermal management is achieved by arranging a cooling surface, a radiation plate and a temperature control loop. However, these conventional designs have significant limitations under different temperature conditions. Under the high-temperature working condition, although the satellite radiation plate can radiate heat, the heat radiation efficiency is limited, so that the equipment temperature is difficult to control in a safety range, and the overheating problem occurs, while under the low-temperature working condition, the traditional temperature control system needs to start a heating loop to maintain the equipment temperature, so that the power consumption is increased, and the energy utilization efficiency is obviously reduced. These problems directly affect the operational stability and task performance of the satellite, especially in long-term high-power operational tasks, where heat dissipation design is a critical factor affecting satellite life and performance.

In the related art, the difference of the heat dissipation surface areas of different satellite products is larger, and the adaptability of the satellite heat radiator is poorer for different satellite products.

Disclosure of Invention

The present invention is directed to solving at least one of the technical problems existing in the related art. Therefore, the invention provides a modularized heat dissipation device applied to satellites, which aims to improve the suitability of the heat dissipation device.

The invention also provides an artificial satellite.

An embodiment of a modular heat sink for a satellite according to a first aspect of the present invention includes:

a heat collecting plate, one side of which is used for contacting with a heat source of a satellite;

The heat pipes are arranged in an array, every two adjacent heat pipes are detachably connected, each heat pipe is provided with an evaporation end and a condensation end, the evaporation ends are connected with the heat collecting plate, liquid metal is contained in the heat pipes, the heat pipes are internally provided with a vapor flow passage and a condensation flow passage which are axially communicated, the liquid metal evaporates into a gas state at the evaporation ends and reaches the condensation ends along the vapor flow passages, and the liquid metal condenses into a liquid state at the condensation ends and reaches the evaporation ends along the condensation flow passages;

The electromagnetic pump is connected with the heat pipe and is used for driving the liquid metal in the heat pipe to flow;

The heat dissipation plates are connected with each other to enclose the periphery of the heat pipes.

According to the modularized heat dissipation device applied to the satellite, disclosed by the embodiment of the invention, the heat emitted by the satellite is received through the heat collection plate, and the heat is transferred to a plurality of surrounding heat dissipation plates through the plurality of heat pipes to dissipate heat. The evaporation end of the heat pipe is connected with the heat collecting plate, liquid metal flows in the heat pipe, and when the liquid metal in the heat pipe evaporates into a gaseous state at the evaporation end, the heat collecting plate absorbs heat. The liquid metal in the gaseous state reaches the condensing end along the steam flow channel, so that the liquid metal can be condensed into the liquid state, the electromagnetic pump can drive the liquid metal to flow, the recycling of the liquid metal is realized, and the heat pipe can radiate heat to the periphery through a plurality of heat radiating plates, so that a good heat radiating effect is achieved. The heat pipes are arranged in an array and are detachably connected to form the modularized radiating device, so that the number of the heat pipes can be freely increased or decreased to correspond to different satellite products, and the adaptability is improved.

According to one embodiment of the invention, every two adjacent heat pipes are communicated with the steam flow channel through connecting pipes, so that the flow of steam is realized by utilizing the pressure difference caused by the temperature difference between the two heat pipes.

According to one embodiment of the invention, the modularized heat dissipating device applied to the satellite comprises a control unit and a plurality of first temperature sensors, wherein the plurality of first temperature sensors are distributed in the plurality of steam flow channels and are in communication connection with the control unit, the control unit is in communication connection with the electromagnetic pump, and the control unit controls the electromagnetic pump to start or stop according to signals of the plurality of first temperature sensors.

According to one embodiment of the invention, the modularized radiating device applied to the satellite comprises a plurality of second temperature sensors, the second temperature sensors are distributed at a plurality of positions of the heat collecting plate, and the control unit receives signals from the second temperature sensors and adjusts the working state of the modularized radiating device applied to the satellite according to a preset temperature threshold.

According to one embodiment of the invention, the plurality of heat dissipation plates comprise a bottom plate and a plurality of coamings, the bottom plate is arranged at one end of the plurality of heat pipes, which is away from the heat collection plate, the plurality of coamings are arranged around the periphery of the bottom plate, one side of each coamings is rotatably connected with one side of the bottom plate through a unfolding mechanism, and the plurality of coamings encircle the plurality of heat pipes.

According to one embodiment of the invention, the surface of the heat dissipation plate is coated with a heat dissipation coating.

According to one embodiment of the invention, a liquid reservoir is provided in the steam flow channel adjacent to the condensing end.

According to one embodiment of the invention, the liquid metal is sodium or a sodium-potassium alloy;

And/or the outer tube of the heat pipe is an aluminum tube or a copper tube.

According to one embodiment of the invention, the heat pipe comprises a pipe shell and a liquid suction core;

The liquid suction core and the liquid metal are arranged in the tube shell, the vapor flow passage penetrating along the axial direction of the tube shell is formed in the liquid suction core, the liquid suction core comprises a first sintered liquid suction core, a micro-groove liquid suction core and a second sintered liquid suction core which are sequentially connected along the axial direction of the tube shell, and the condensation flow passage is formed;

the micro-groove liquid suction core comprises a plurality of liquid suction flow passages extending along the axial direction of the pipe shell, and groove structures extending along the axial direction of the pipe shell are arranged on the inner walls of the liquid suction flow passages;

The liquid metal can reach the evaporation end along the second sintered wick, the micro-groove wick and the first sintered wick in sequence.

The artificial satellite according to the embodiment of the second aspect of the invention comprises a satellite main body and the modularized heat dissipation device applied to the satellite, wherein the modularized heat dissipation device applied to the satellite is arranged on the satellite main body.

The artificial satellite according to the embodiment of the invention includes the above-mentioned modularized heat dissipating device applied to the satellite, so that all the technical effects of the above-mentioned modularized heat dissipating device applied to the satellite are achieved, and the description thereof is omitted herein.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic structural diagram of a modularized heat dissipating device applied to a satellite according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a plurality of heat pipes according to an embodiment of the present invention.

Fig. 3 is a schematic diagram of a flow direction of liquid metal in a heat pipe according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a heat pipe according to the present invention.

Fig. 5 is a schematic cross-sectional view of a wick provided by the present invention.

Fig. 6 is a schematic structural diagram of a monolithic metallic copper mesh provided by the present invention.

Fig. 7 is a schematic view of the structure of a single pipette provided by the present invention.

Reference numerals:

1. A tube shell; 2, a liquid suction core, 21, a first sintered liquid suction core, 22, a micro-groove liquid suction core, 23, a second sintered liquid suction core, 20, a steam flow channel, 201, an evaporation end, 202, a condensation end, 211, a metal copper net, 221, a liquid suction pipe, 2211, a liquid suction flow channel, 2212, a groove structure, 7, a heat collecting plate, 8, a heat dissipation plate, 9, a heat pipe, 94 and a condensation flow channel.

Detailed Description

Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In describing embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "coupled" should be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, or indirectly connected via an intermediate medium. The specific meaning of the above terms in embodiments of the present invention will be understood in detail by those of ordinary skill in the art.

In embodiments of the invention, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Heat dissipation solutions include liquid cooling systems, heat pipe systems, phase change materials, and the like. However, as satellite power continues to increase, limitations of these schemes are increasingly apparent. For example, liquid cooling systems, although improving heat dissipation efficiency to some extent, have complicated piping designs that increase the weight and volume of satellite systems, traditional heat pipes, while having high thermal conductivity, tend to have less than ideal heat dissipation when subjected to extremely high temperature conditions, and phase change materials, while absorbing heat in a specific temperature range, may rapidly saturate in heat storage capacity when the thermal load continues to increase, resulting in reduced heat dissipation.

In order to realize a more efficient and stable thermal control system, novel heat dissipation technologies such as heat pipes, expandable modularized heat dissipation devices and the like are explored and developed, and the application of the technologies effectively solves the problems of high-temperature and low-temperature working conditions in satellite heat management, improves the energy utilization efficiency, prolongs the service life of satellites and provides more powerful technical guarantees for future aerospace tasks.

As shown in fig. 1 and 2, the modularized heat dissipating device applied to a satellite according to the first aspect of the present invention includes a heat collecting plate 7, a plurality of heat pipes 9, an electromagnetic pump and a plurality of heat dissipating plates 8, wherein one side of the heat collecting plate 7 is used for contacting with a heat source of the satellite, the plurality of heat pipes 9 are arranged in an array, each two adjacent heat pipes 9 are detachably connected, each heat pipe 9 has a evaporating end 201 and a condensing end 202, the evaporating end 201 is connected with the heat collecting plate 7, liquid metal is contained in the heat pipes 9, a steam flow channel 20 and a condensing flow channel 94 which are axially penetrated are arranged in the heat pipes 9, the liquid metal evaporates into a gas state at the evaporating end 201 and reaches the condensing end 202 along the steam flow channel 20, the liquid metal condenses into a liquid state at the condensing end 202 and reaches the evaporating end 201 along the condensing flow channel 94, the electromagnetic pump is connected with the heat pipes 9, and the electromagnetic pump is used for driving the liquid metal in the heat pipes 9 to flow, and the plurality of heat dissipating plates 8 are connected with each other so as to enclose the periphery of the plurality of heat pipes 9.

According to the modularized heat dissipating device applied to the satellite, disclosed by the embodiment of the invention, heat emitted by the satellite is received through the heat collecting plate 7, and the heat is transferred to the surrounding heat dissipating plates 8 through the heat pipes 9 to dissipate the heat. The evaporation end 201 of the heat pipe 9 is connected to the heat collecting plate 7, and the liquid metal flows in the heat pipe 9, and when the liquid metal in the heat pipe 9 evaporates into a gaseous state at the evaporation end 201, heat absorption of the heat collecting plate 7 is achieved. The liquid metal in the gaseous state reaches the condensation end 202 along the steam flow channel 20 so as to be condensed into the liquid state, and the electromagnetic pump can drive the liquid metal to flow, so that the liquid metal can be recycled, and the heat pipe 9 can emit heat to the periphery through the plurality of heat dissipation plates 8 so as to achieve a good heat dissipation effect. The heat pipes 9 are arranged in an array and are detachably connected to form a modularized heat dissipation device, and the number of the heat pipes 9 can be freely increased or decreased to correspond to different satellite products, so that the adaptability is improved. The modularized heat dissipation device has the advantages that the modularized heat dissipation device can be customized and expanded according to different heat sources and heat dissipation requirements, and different heat dissipation requirements are adapted by increasing and decreasing modules, so that the flexibility and the efficiency of a heat dissipation system are improved. This design is particularly important for spatially constrained environments such as satellites, as it allows for efficient thermal management while maintaining satellite size and weight constraints.

In this embodiment, the heat pipe technology has excellent heat conducting performance and a wider working temperature range, so that the heat pipe technology becomes a potential solution in the future high-power satellite heat dissipation design. The high thermal conductivity of the liquid metal allows it to rapidly conduct heat from the device to the condenser, thereby achieving more efficient heat dissipation. In addition, modular, expandable heat dissipating designs are also being used in satellites in a step-wise fashion to provide a larger area of heat dissipating surface without increasing Wei Xingti volumes and weights, thereby increasing overall heat dissipation efficiency. Through the optimal design of the combination of different evaporators and condensers, the novel heat dissipation technologies are expected to play an important role in satellites with high power and high task density, and the reliable operation of the satellites under different working conditions is ensured.

It should be noted that, the plurality of heat pipes 9 are arranged in parallel to each other to form an array structure, and the sidewalls thereof may be detachably connected to each other by a connecting member, such as a snap connection, a bolt connection, or the like, which is not limited herein. In this manner, the evaporation ends 201 of the plurality of heat pipes 9 are aligned so as to be simultaneously connected to the heat collecting plate 7. Illustratively, the heat pipe 9 is provided with a steam flow channel 20 and a condensation flow channel 94 extending along the axial direction, and two ends of the steam flow channel 20 and the condensation flow channel 94 are communicated, so that the liquid metal can flow circularly, and the condensation flow channel 94 can be arranged around the steam flow channel 20. In one embodiment, the heat pipe 9 adopts a porous core pore structure, the condensation runner 94 is composed of a plurality of irregular pores, and the plurality of irregular pores penetrate through the axial direction of the heat pipe 9, so that a single-layer surrounding steam runner 20 or a multi-layer surrounding steam runner 20 can be formed. The heat pipes 9 may be of a cylindrical type or a hexagonal prism type, which is not limited herein, wherein the hexagonal prism type facilitates distinguishing the orientations of the heat pipes 9 so as to facilitate installation at corresponding positions between the two heat pipes 9.

Optionally, an evaporator is arranged at the evaporation end 201, a condenser is arranged at the condensation end 202, a liquid storage device is arranged at the condensation end, heat absorbed by the evaporator provides a starting heat source for the heat pipe 9, liquid metal flows into the condenser after absorbing the heat, the liquid metal flows back to the liquid storage device after discharging the heat by the condenser, a cycle is completed, and the cycle is started again under the pushing of the evaporator, so that the heat of the heat source is collected and discharged.

Referring to fig. 2 and 3 in combination, according to an embodiment of the present invention, each two adjacent heat pipes 9 are connected to the steam flow channel 20 through a connection pipe to realize the flow of steam by using the pressure difference caused by the temperature difference between the two heat pipes. It can be understood that the connecting pipe penetrates through the heat pipe 9 and is communicated to the steam flow channel 20, so that the liquid metal in the gaseous state in the steam flow channel 20 can be transferred to other heat pipes 9, and thus, the power for flowing the liquid metal in the heat pipe 9 can be provided, and the liquid metal can also realize the circulation flow in the heat pipe 9 without starting the electromagnetic pump to drive the liquid metal to flow under the condition that the heat dissipation capacity required by the satellite is not large or the satellite does not continuously generate a large amount of heat, thereby realizing the heat exchange and energy saving effect. For example, when the satellite generates a small amount of heat, the heat pipes 9 are likely to have a temperature difference when just radiating heat, and when the satellite continuously generates heat, the temperatures in the heat pipes 9 gradually approach each other, so that the liquid metal can be driven to flow in the heat pipes 9 by the electromagnetic pump.

According to one embodiment of the invention, the modularized heat dissipating device applied to the satellite comprises a control unit and a plurality of first temperature sensors, wherein the plurality of first temperature sensors are distributed in the plurality of steam flow channels 20 and are in communication connection with the control unit, the control unit is in communication connection with the electromagnetic pump, and the control unit controls the electromagnetic pump to start or stop according to signals of the plurality of first temperature sensors.

It will be appreciated that the plurality of first temperature sensors may transmit the temperature signals in each steam flow channel 20 to the control unit, and if the temperature difference between the plurality of first temperature sensors is greater than or equal to the set threshold value, the electromagnetic pump is controlled to stop, and at this time, the flow of steam, that is, the flow of liquid metal in the gaseous state, is realized by the pressure difference caused by the temperature difference. If the temperature difference between the plurality of first temperature sensors is smaller than the set threshold value, the control unit can judge that the steam cannot flow due to the pressure difference, and then the electromagnetic pump is started.

According to an embodiment of the present invention, the modularized heat dissipating device applied to the satellite includes a plurality of second temperature sensors distributed at a plurality of positions of the heat collecting plate 7, and the control unit receives signals from the second temperature sensors and adjusts the operating state of the modularized heat dissipating device applied to the satellite according to a preset temperature threshold. The second temperature sensor is used for monitoring the temperature change of the heat source in real time, and the control unit receives signals from the second temperature sensor and adjusts the working state of the heat radiating device according to a preset temperature threshold value so as to realize more intelligent temperature control.

According to an embodiment of the present invention, the plurality of heat dissipation plates 8 include a bottom plate provided at one end of the plurality of heat pipes 9 facing away from the heat collection plate 7, and a plurality of surrounding plates provided around the periphery of the bottom plate, one side of each surrounding plate being rotatably connected to one side of the bottom plate by a spreading mechanism, the plurality of surrounding plates surrounding the plurality of heat pipes 9.

Illustratively, the bottom plate, the plurality of coamings and the heat collecting plate 7 enclose a square structure so as to wrap the plurality of heat pipes 9 inside, thereby playing a role in protection. Radiating fins can be arranged on one side of the bottom plate and the coaming, which is away from the heat pipe 9, so that the radiating area is increased, and the radiating efficiency is improved. It will be appreciated that the base plate is located at the condensing end 202 to facilitate heat dissipation to a side remote from the heat source. Meanwhile, the bottom plate can be used for supporting and connecting a plurality of coamings, so that the installation stability is guaranteed.

In this embodiment, the connection design of bottom plate and bounding wall is the expansion, is connected bottom plate and a plurality of bounding wall through expansion mechanism, like spring, flexible arm or movable hinge etc. to improve and install and remove the convenience, be convenient for increase and decrease heat pipe 9 quantity adapts to different heat dissipation demands, thereby improves cooling system's flexibility and efficiency.

According to one embodiment of the invention, the surface of the heat-dissipating plate 8 is coated with a heat-dissipating coating, which is a high emissivity coating to enhance radiant heat dissipation.

According to one embodiment of the invention, a reservoir is provided within the steam flow path 20 adjacent the condensing end 202. The design does not need to additionally increase a liquid reservoir, reduces the complexity of the structure, and is beneficial to the modularized preparation of the whole structure of the steam cavity.

According to one embodiment of the present invention, the liquid metal is sodium or sodium-potassium alloy, and it should be noted that the melting point and boiling point of the sodium-potassium alloy with different proportions are changed, but are generally lower than those of pure sodium and pure potassium, and different types of sodium-potassium alloy are filled according to the environment of the actual satellite, so as to adapt to the requirements of low-temperature condensation and high-temperature evaporation in the heat pipe 9.

Alternatively, the outer tube of the heat pipe 9 is an aluminum tube or a copper tube, and it is understood that the aluminum tube or the copper tube has high thermal conductivity and low density properties to improve heat dissipation and reduce weight.

Referring to fig. 4 and 5 in combination, according to one embodiment of the present invention, a heat pipe 9 includes a tube 1 and a wick 2;

The liquid suction core 2 and the liquid metal are arranged in the tube shell 1, a steam flow passage 20 penetrating along the axial direction of the tube shell 1 is formed in the liquid suction core 2, the liquid suction core 2 comprises a first sintered liquid suction core 21, a micro-groove liquid suction core 22 and a second sintered liquid suction core 23 which are sequentially connected along the axial direction of the tube shell 1, and a condensation flow passage 94 is formed, and as can be appreciated, the first sintered liquid suction core 21, the micro-groove liquid suction core 22 and the second sintered liquid suction core 23 are connected and the condensation flow passage 94 is formed inside, and the condensation flow passage 94 is arranged around the steam flow passage 20.

The micro-groove liquid suction cores comprise a plurality of liquid suction flow passages extending along the axial direction of the tube shell, groove structures extending along the axial direction of the tube shell are arranged on the inner walls of the liquid suction flow passages, and liquid metal can sequentially reach the evaporation end along the second sintered liquid suction cores, the micro-groove liquid suction cores and the first sintered liquid suction cores. In which fig. 5 the flow direction of the gaseous liquid metal and the liquid metal along the wick 2 is illustrated with different arrows, respectively.

It will be appreciated that the first end of the envelope 1 acts as the evaporating end 201 of the heat pipe and is configured to be connected to a heat source in the satellite device, and the second end of the envelope 1 acts as the condensing end 202 of the heat pipe.

The envelope 1 may be provided to extend along a straight line or along a curved line, and is not particularly limited. The envelope 1 is usually arranged in a straight line in practical use.

Meanwhile, a first cavity for storing liquid metal is arranged between the first end of the tube shell 1 and one end of the first sintered liquid absorbing core 21 far away from the micro-groove liquid absorbing core 22, and a second cavity for storing liquid metal is arranged between the second end of the tube shell 1 and one end of the second sintered liquid absorbing core 23 far away from the micro-groove liquid absorbing core 22. Wherein, the liquid metal can be sodium, potassium, lithium, etc.

Since the wick 2 is provided with the vapor flow channels 20, the wick 2 may be specifically configured in a cylindrical shape, and accordingly, the vapor flow channels 20 sequentially penetrate through the first sintered wick 21, the micro-groove wick 22, and the second sintered wick 23, and the first sintered wick 21, the micro-groove wick 22, and the second sintered wick 23 may be configured in a cylindrical shape.

Fig. 6 illustrates a structure of a single metal copper mesh 211, wherein the single metal copper mesh 211 is configured in a cylindrical shape, and a plurality of cylindrical metal copper meshes 211 are sequentially arranged from inside to outside, sintered and rolled to obtain the first sintered liquid suction core 21 or the second sintered liquid suction core 23.

When the heat pipe works, the evaporation end 201 absorbs heat from a heat source, the liquid metal absorbs heat and evaporates, so that gaseous liquid metal enters the steam flow channel 20, and due to the condensation of vapor at the condensation end 202, the gaseous liquid metal condenses into liquid and releases heat, so that a pressure difference is formed between the evaporation end 201 and the condensation end 202, under the action of the pressure difference, the gaseous liquid metal reaches the condensation end 202 from the evaporation end 201 along the steam flow channel 20, and under the action of capillary action of the liquid core 2, the liquid metal returns to the evaporation end 201 along the gaps in the second sintering liquid core 23, along the liquid absorption flow channel 2211 in the micro-groove liquid core 22 and along the gaps in the first sintering liquid core 21 in sequence, and is heated and evaporated again under the action of the heat source, so that a phase change process of the liquid metal is completed, and the liquid metal can flow back and forth along the circulation path. The above cycle achieves heat transfer from the evaporating end 201 to the condensing end 202 of the heat pipe.

Because the wick 2 of the heat pipe is composed of the first sintered wick 21, the micro-groove wick 22 and the second sintered wick 23, the first sintered wick 21 and the second sintered wick 23 have the characteristics of high capillary pumping pressure and relatively low liquid permeability, and the micro-groove wick 22 has the characteristics of low capillary pumping pressure and relatively high liquid permeability, the wick 2 can better balance the contradiction between high capillary capacity and high permeability, can obtain relatively high capillary pumping force and evaporation efficiency, and can realize low flow resistance and radial heat conductance.

In some embodiments, as shown in fig. 5, each of the first sintered wick 21 and the second sintered wick 23 comprises a plurality of wick segments connected in sequence;

the porosity of the plurality of liquid-absorbing segments corresponding to the first sintered liquid-absorbing core 21 gradually increases and the porosity of the plurality of liquid-absorbing segments corresponding to the second sintered liquid-absorbing core 23 gradually decreases along the direction from the evaporation end 201 to the condensation end 202.

It is understood that for the first sintered liquid-absorbing core 21 or the second sintered liquid-absorbing core 23, the liquid-absorbing sections are sequentially connected along the axial direction of the tube shell 1, each liquid-absorbing section is composed of a plurality of cylindrical metal copper meshes 211 sequentially arranged from inside to outside, and the first sintered liquid-absorbing core 21 and the second sintered liquid-absorbing core 23 required by the invention can be prepared by selecting the metal copper meshes 211 with different braiding densities for different liquid-absorbing sections.

By setting the porosities of the respective liquid suction sections corresponding to the first sintered liquid suction core 21 and the second sintered liquid suction core 23, not only is the gaseous liquid metal of the evaporation end 201 ensured to flow from the evaporation end 201 to the condensation end 202 along the steam flow channel 20, but also the contradiction between the high capillary capacity and the high permeability of the liquid suction core 2 is well balanced, the liquid metal of the condensation end 202 is ensured to flow from the condensation end 202 to the evaporation end 201 along the liquid suction core 2 by utilizing the capillary suction force, and no great mutual interference occurs between the two flow directions of the liquid metal, so that the antigravity heat transfer performance of the heat pipe is optimized, and the limit power of the heat transfer of the heat pipe is improved.

Optionally, the first sintered wick 21 and the second sintered wick 23 each comprise two sequentially connected wick segments, the porosity of one of the two wick segments proximate to the micro-groove wick 22 being in the range of 87% -97%, for example, the porosity may specifically be 87%, 90%, 92%, 95%, 97%, etc., while the porosity of one of the two wick segments distal to the micro-groove wick 22 is in the range of 75% -85%, for example, the porosity may specifically be 75%, 78%, 80%, 83%, 85%, etc.

In some embodiments, as shown in fig. 5 and 7, the micro groove wick 22 includes a plurality of pipettes 221, the plurality of pipettes 221 being arranged in a cylindrical shape, and a pipette flow passage 2211 being formed in each of the pipettes 221.

Specifically, the liquid suction pipe 221 comprises a first half pipe and a second half pipe, the first half pipe and the second half pipe can be assembled to form the liquid suction pipe 221, a liquid suction flow passage 2211 is formed between the first half pipe and the second half pipe, a plurality of groove structures 2212 extending along the axial direction of the pipe shell 1 are arranged on the inner walls of the first half pipe and the second half pipe, and the groove structures 2212 can better guide liquid metal to flow along the liquid suction flow passage 2211 and provide capillary force for the flow of the liquid metal.

Illustratively, the cross section of the pipette 221 is rectangular, the first half pipe and the second half pipe are in a groove-shaped structure, and two groove edges of the first half pipe and two groove edges of the second half pipe are connected in one-to-one correspondence, so that the first half pipe and the second half pipe are assembled to form the pipette 221.

Wherein, the tank bottom of the first half pipe and the tank bottom of the second half pipe are respectively provided with a plurality of bulges which are arranged side by side, each bulge extends along the length direction of the liquid suction pipe 221, and a groove structure 2212 is formed between two adjacent bulges.

In some embodiments, the cartridge 1 is a metal shell, for example the metal shell may be a copper shell, the inner wall of which is provided with a layer of nano-porous copper powder prepared from sintered nano-porous copper powder, the inner wall of the layer of nano-porous copper powder being in contact with the peripheral wall of the wick 2.

It is understood that nanoporous copper powder is a material with a unique microstructure that is characterized by a large number of micropores, with a porosity of typically between 20% and 80%.

The nano-porous copper powder has a porous structure, so that the nano-porous copper powder layer prepared from the nano-porous copper powder has good thermal conductivity, and the radial heat conduction and heat dissipation effects of the heat pipe can be ensured by utilizing the nano-porous copper powder layer.

In some embodiments, the metallic copper mesh 211 is prepared using sintered irregular copper powder.

It is understood that an irregular copper powder is one that is irregularly shaped, irregularly sized, and has a broad particle size distribution, typically varying from a few microns to hundreds of microns, and has a density approaching that of pure copper, about 8.96g/cm3.

Thus, the metal copper mesh 211 is prepared by adopting the sintered irregular copper powder, so that the heat conductivity of the metal copper mesh 211 can be ensured, and the antigravity heat transfer performance of the heat pipe is optimized.

In some embodiments, the liquid metal is a bismuth-based metal.

It can be understood that the heat pipe transfers heat by utilizing the phase change of the liquid metal, and because the bismuth-based metal has the characteristics of high electrical conductivity, high thermal conductivity, low viscosity, wide liquid temperature zone and the like, the efficient convection heat exchange and solid-liquid phase heating control effect can be realized in the space microgravity environment by selecting the liquid metal as the bismuth-based metal.

It will be appreciated that both the heat collecting plate and the heat dissipating plate may be made of a metal with a good thermal conductivity, the heat collecting plate being configured to be connected to a heat source in the sanitary fixture, the heat dissipating plate being connected to a corresponding heat sink of the satellite fixture, e.g. the heat dissipating plate may be directly exposed to a space environment facing away from the solar surface.

The heat pipe is used for transferring heat between the heat collecting plate and the heat radiating plate, so that heat generated by a heat source in satellite equipment can be effectively managed and dispersed, the stability of the temperature in the satellite equipment can be maintained under the extreme temperature condition, equipment faults caused by overheating are reduced, the maintenance cost and the maintenance frequency of the satellite equipment are reduced, the reliability and the service life of the satellite equipment are improved, and the operation cost of space missions is further reduced.

In some embodiments, as shown in fig. 4, the central axis of the heat pipe is disposed obliquely with respect to the plate surface of the heat dissipation plate.

Specifically, the included angle between the central axis of the heat pipe and the plate surface of the heat dissipation plate is alpha, and the value range of alpha isFor example, alpha has a specific value of、、And the like, the design ensures that the heat pipe can adapt to the space layout of the internal structure of satellite equipment, is convenient for liquid metal to flow back from the condensation end 202 to the evaporation end 201 along the liquid suction core 2, and realizes that the heat transfer limit power of the heat pipe under the condition of complete antigravity (the inclination angle is 90 degrees) is as high as 90W.

In some embodiments, the heat sink further comprises a circulation channel connected between the evaporation end 201 and the condensation end 202 of the heat pipe, and an electromagnetic pump for driving the liquid metal from the condensation end 202 to the evaporation end 201 along the circulation channel.

It can be understood that in practical application, the electromagnetic pump can effectively drive the liquid metal to flow in the microgravity environment, ensure that the liquid metal can flow quickly and fill the heat pipe when being started, and realize quick starting of the heat pipe from a frozen state to a normal working state.

In the working process of the heat pipe, the electromagnetic pump drives the liquid metal to flow back from the condensation end 202 towards the evaporation end 201 along the circulation channel, so that the flow and the phase change process of the liquid metal can be accurately controlled, and the control of the working state of the heat pipe is realized.

Further, in order to finely control the working state of the heat pipe, the heat radiating device also comprises a temperature sensor and a control module, wherein the temperature sensor is electrically connected with the control module, and the control module is electrically connected with the electromagnetic pump;

the temperature sensor is arranged on the heat collecting plate and used for detecting temperature information of the heat collecting plate, and the control module is used for controlling the working state of the electromagnetic pump according to the temperature information fed back by the temperature sensor.

The design can detect the temperature change of the heat source in real time based on the temperature sensors, the control module can accurately calculate the temperature of the heat source according to the information fed back by the temperature sensors, and the working state of the electromagnetic pump is adaptively controlled according to the temperature of the heat source, so that the working state of the heat pipe is intelligently regulated and controlled.

The artificial satellite according to the embodiment of the second aspect of the invention comprises a satellite main body and the modularized heat dissipation device applied to the satellite, wherein the modularized heat dissipation device applied to the satellite is arranged on the satellite main body.

The artificial satellite according to the embodiment of the invention includes the above-mentioned modularized heat dissipating device applied to the satellite, so that all the technical effects of the above-mentioned modularized heat dissipating device applied to the satellite are achieved, and the description thereof is omitted herein.

Finally, it should be noted that the above-mentioned embodiments are merely illustrative of the invention, and not limiting. While the invention has been described in detail with reference to the embodiments, those skilled in the art will appreciate that various combinations, modifications, or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and it is intended to be covered by the scope of the claims of the present invention.

Claims (10)

1. A modular heat sink for use with a satellite, comprising:

a heat collecting plate, one side of which is used for contacting with a heat source of a satellite;

The heat pipes are arranged in an array, every two adjacent heat pipes are detachably connected, each heat pipe is provided with an evaporation end and a condensation end, the evaporation ends are connected with the heat collecting plate, liquid metal is contained in the heat pipes, the heat pipes are internally provided with a vapor flow passage and a condensation flow passage which are axially communicated, the liquid metal evaporates into a gas state at the evaporation ends and reaches the condensation ends along the vapor flow passages, and the liquid metal condenses into a liquid state at the condensation ends and reaches the evaporation ends along the condensation flow passages;

The electromagnetic pump is connected with the heat pipe and is used for driving the liquid metal in the heat pipe to flow;

The heat dissipation plates are connected with each other to enclose the periphery of the heat pipes.

2. The modular heat sink for a satellite according to claim 1, wherein each adjacent two of the heat pipes are connected to the steam flow channel by a connection pipe to realize the flow of steam by using a pressure difference caused by a temperature difference between the respective heat pipes.

3. The satellite-applied modular heat sink of claim 2, comprising a control unit and a plurality of first temperature sensors distributed within the plurality of steam flow channels and communicatively coupled to the control unit, the control unit communicatively coupled to the electromagnetic pump, the control unit controlling the electromagnetic pump to start or stop based on signals from the plurality of first temperature sensors.

4. A modular heat sink for a satellite according to claim 3, wherein the modular heat sink for a satellite comprises a plurality of second temperature sensors distributed at a plurality of positions of the heat collecting plate, and the control unit receives signals from the second temperature sensors and adjusts an operation state of the modular heat sink for a satellite according to a preset temperature threshold.

5. The modular heat sink for a satellite of claim 1, wherein the plurality of heat sinks includes a base plate and a plurality of enclosures, the base plate being disposed at an end of the plurality of heat pipes facing away from the heat collecting plate, the plurality of enclosures being disposed around a periphery of the base plate, one side of each of the enclosures being rotatably coupled to one side of the base plate by a deployment mechanism, the plurality of enclosures surrounding the plurality of heat pipes.

6. The modular heat sink for a satellite of claim 1, wherein the surface of the heat sink is coated with a heat sink coating.

7. The modular heat sink for a satellite of claim 1, wherein a reservoir is disposed within the steam flow path adjacent the condensing end.

8. The modular heat sink for satellite applications of claim 1, wherein the liquid metal is sodium or a sodium potassium alloy;

And/or the outer tube of the heat pipe is an aluminum tube or a copper tube.

9. The modular heat sink for a satellite according to any one of claims 1 to 8, wherein the heat pipe comprises a tube shell and a wick;

The liquid suction core and the liquid metal are arranged in the tube shell, the vapor flow passage penetrating along the axial direction of the tube shell is formed in the liquid suction core, the liquid suction core comprises a first sintered liquid suction core, a micro-groove liquid suction core and a second sintered liquid suction core which are sequentially connected along the axial direction of the tube shell, and the condensation flow passage is formed;

the micro-groove liquid suction core comprises a plurality of liquid suction flow passages extending along the axial direction of the pipe shell, and groove structures extending along the axial direction of the pipe shell are arranged on the inner walls of the liquid suction flow passages;

The liquid metal can reach the evaporation end along the second sintered wick, the micro-groove wick and the first sintered wick in sequence.

10. A satellite comprising a satellite body and a modular heat sink for a satellite according to any one of claims 1 to 9, said modular heat sink for a satellite being provided on said satellite body.