CN119352122A - Steel wire electroplating processing method and equipment - Google Patents
Steel wire electroplating processing method and equipment Download PDFInfo
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- CN119352122A CN119352122A CN202411919365.4A CN202411919365A CN119352122A CN 119352122 A CN119352122 A CN 119352122A CN 202411919365 A CN202411919365 A CN 202411919365A CN 119352122 A CN119352122 A CN 119352122A
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Abstract
The invention provides a steel wire electroplating processing method and equipment, which belong to the technical field of electroplating and comprise the following steps of S1 controlling a steel wire to pass through an electroplating processing tank to finish electroplating processing through a first storage tank, finish thermal diffusion processing through a heat processing tank and finish processing through a second storage tank, S2 pumping protective gas into the heat processing tank, simultaneously controlling a first treatment liquid and a second treatment liquid to directionally flow on two sides of the heat processing tank to form a liquid sealing structure, and controlling the steel wire to finish thermal diffusion processing in an oxygen-isolated environment. The processing method simplifies the steps of steel wire electroplating processing, simplifies processing equipment, greatly improves the efficiency of the electroplating processing and ensures the comprehensive performance of the steel wire after heat diffusion treatment.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a steel wire electroplating processing method and equipment.
Background
The electroplating of other metals (zinc, copper and the like) on the surface of the steel wire can enhance the corrosion resistance of the whole steel wire, optimize the material and performance of the whole steel wire, and uniformly and rapidly attach the metal material on the surface of the steel wire in an electroplating manner.
The electroplated steel wire can be further fused with the metal material on the outer side through heat diffusion treatment, so that the steel wire and the metal coating on the outer side can be mutually diffused to form a composite alloy layer with better performance, and the part defect existing in electroplating is overcome.
In the process of thermal diffusion, the outer side of the metal layer is easy to contact with oxygen in the air to form an oxidation compound such as zinc oxide, so that the material of the surface metal layer is brittle, the performance of the composite material after thermal diffusion is affected, a protective layer (such as a borax film) is partially attached to the surface of the electroplated steel wire to isolate oxygen and avoid the generation of metal oxides, but at least one process is additionally added between electroplating and thermal diffusion in the operation, and for part of the liquid oxidation protective layer, the liquid oxidation protective layer is also required to be quickly dried, so that the steel wire electroplating processing procedure is increased, the length of a production line is increased, and the electroplating processing efficiency is reduced.
Disclosure of Invention
In order to solve the problems, the invention provides the steel wire electroplating processing method and the steel wire electroplating processing equipment, the steps of the steel wire electroplating processing are simplified, the processing equipment is simplified, the electroplating processing efficiency is greatly improved, and the comprehensive performance of the steel wire after the heat diffusion treatment is ensured.
In order to solve the problems, the invention adopts the following technical scheme:
A steel wire electroplating processing method comprises the steps of S1 controlling a steel wire to pass through an electroplating processing tank to complete electroplating processing through the first storage tank, completing thermal diffusion processing through the second storage tank, and completing processing through the second storage tank, S2 pumping protective gas into the thermal processing tank, simultaneously controlling the first and second treatment liquids to directionally flow at two sides of the thermal processing tank to form a liquid sealing structure, and controlling the steel wire to complete thermal diffusion processing in an oxygen-isolated environment.
A steel wire electroplating processing device is used for the steel wire electroplating processing method and comprises an electroplating processing tank for allowing steel wires to pass through, wherein processing liquid positioned on a steel wire moving path is stored in the electroplating processing tank, an electroplating device is further arranged in the electroplating processing tank, the electroplating processing tank comprises a processing tank body and a processing tank cover plate, a plurality of partition plates are arranged between the processing tank body and the processing tank cover plate, guide holes for allowing the steel wires to pass through are formed in the side walls of the partition plates, a plurality of processing chambers are formed by the partition plates, the processing tank body and the processing tank cover plate in a sealing mode, the processing chambers comprise a first storage tank for storing the processing liquid and a second storage tank for storing the processing liquid, a thermal processing tank for performing thermal diffusion on the steel wires is arranged between the first storage tank and the second storage tank, a transition tank is arranged on one side, which is close to the first storage tank, a pumping mechanism is further arranged at the lower end of the electroplating processing tank, the partition plates, the pumping mechanism comprises a first storage tank and a second storage tank, a certain orientation control device is arranged between the first storage tank and the second storage tank, the thermal processing liquid is further arranged in the second storage tank, and the thermal processing device is used for controlling the flow of the thermal processing liquid to flow between the first storage tank and the second storage tank, and the second thermal processing device is further arranged in the sealing device.
Preferably, a drying groove is further formed in one side, close to the first transition groove, of the heat treatment groove, and a cooling groove is further formed in one side, close to the second transition groove, of the heat treatment groove.
Preferably, the pumping mechanism further comprises a second pumping device for controlling the directional flow of the shielding gas, the second pumping device comprises a second pumping pipeline and a second pumping assembly connected in series inside the second pumping pipeline, the first end of the second pumping pipeline penetrates through the first aqueduct and extends to the top in the first transition aqueduct, and the second end of the second pumping pipeline penetrates through the cooling tank and is communicated with the cooling tank.
Preferably, the pumping mechanism further comprises a third pumping device for controlling the directional flow of the cooling medium, the third pumping device comprises a third pumping pipeline close to the second pumping pipeline, a third pumping assembly is connected in series inside the third pumping pipeline, and a heat exchange assembly is arranged between the third pumping pipeline and the second pumping pipeline.
Preferably, the first pumping device comprises a first pumping pipeline and a first pumping assembly connected in series in the first pumping pipeline, wherein the first end of the first pumping pipeline penetrates into the first transition groove and is positioned at the bottom of the first transition groove, and the first end of the first pumping pipeline is further provided with a floating control valve group.
Preferably, the floating control valve group comprises a floating control valve base, a flow guiding opening is formed in the bottom of the floating control valve base, a floating control valve body is arranged in the floating control valve base, and a buoy connected with the floating control valve body is arranged at the top of the floating control valve body.
Preferably, the pumping assembly comprises a pumping shell, a pumping piston is connected inside the pumping shell in a sealing sliding manner, a pumping rod is fixed on the side wall of the pumping piston, the tail end portion of the pumping rod penetrates through the pumping shell and extends to the outer side, a return spring for resetting is sleeved on the outer side of the pumping rod, a pumping chamber is formed between one side, away from the pumping rod, of the pumping piston and the pumping shell, and the pumping chamber is communicated with pumping joints with two built-in check valves.
Preferably, a driving device is arranged outside the pumping mechanism, and the driving device is positioned outside the pumping assemblies and used for controlling the pumping assemblies to synchronously complete pumping.
Preferably, the driving device includes a squeeze plate extending toward both sides, and a driving telescopic rod controlling the squeeze plate to reciprocate linearly, and the pumping assembly is located in a moving path of the squeeze plate.
The beneficial effects of the invention are as follows:
According to the method, no additional coating protection procedure is needed between electroplating and thermal diffusion processing, only the directional flow of the treatment liquid at two sides is controlled to form the liquid sealing structure, oxygen can be prevented from entering the thermal treatment tank through the liquid sealing structure, oxidation of a metal layer in the thermal diffusion processing process is avoided, the steps of the steel wire electroplating processing are simplified by the processing method, processing equipment is simplified, meanwhile, the efficiency of the electroplating processing is greatly improved, and the comprehensive performance of the steel wire after the thermal diffusion processing is guaranteed.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic diagram of the front view of fig. 1 according to the present invention (the process tank cover plate is omitted).
Fig. 3 is a schematic side view of the structure of fig. 1 (the process bowl cover is omitted).
Fig. 4 is a schematic view of the bottom structure of fig. 1 according to the present invention.
Fig. 5 is a schematic view of the cross-sectional structure of A-A of fig. 3 according to the present invention.
Fig. 6 is an enlarged schematic view of the structure of fig. 3B according to the present invention.
Fig. 7 is an enlarged view of the structure of fig. 4 at C according to the present invention.
Fig. 8 is an enlarged schematic view of the structure of fig. 5D according to the present invention.
In the drawing, 100, a bearing frame, 200, an electroplating treatment tank, 2001, a storage tank I, 2002, a transition tank I, 2003, a drying tank, 2004, a heat treatment tank, 2005, a cooling tank, 2006, a transition tank II, 2007, a storage tank II, 210, a partition plate, 211, a guide hole, 220, a treatment tank body, 230, a treatment tank cover plate, 300, a steel wire, 400, a pumping mechanism, 4001, a pumping shell, 4002, a pumping piston, 4003, a return spring, 4004, a pumping rod, 4005, a pumping joint, 4006, a pumping chamber, 410, a first pumping device, 411, a first pumping pipeline, 412, a first pumping assembly, 413, a float valve group, 4131, a float valve base, 4132, a guide opening, 4133, a float, 420, a second pumping device, 421, a second pumping pipeline, 422, a second pumping assembly, 423, a drying assembly, 424, a heat exchange assembly, 430, a third pumping device, 431, a third pumping pipeline, 432, a third pumping assembly, 440, a fourth pumping device, a driving assembly, a driving plate, and a telescopic plate are arranged.
Detailed Description
The invention will be further described with reference to the drawings and examples.
In order to solve the problems mentioned in the background art, a wire plating method is provided, in which a wire 300 passing through the wire plating tank 200 is plated by using the wire plating tank 200, a relatively sealed processing chamber is formed inside the wire plating tank 200, and the processing chamber is closed except for an opening for the wire 300 to pass through, and comprises a first storage tank 2001, a first transition tank 2002, a heat treatment tank 2004, a second transition tank 2006 and a second storage tank 2007 which are sequentially arranged.
The first 2001 and the first 2002 storage tanks have the first treatment liquid, the first treatment liquid can be used for completing the electroplating processing of the steel wire surface, the second 2006 and the second 2007 storage tanks have the second treatment liquid, the second treatment liquid can be used for continuing to complete the electroplating processing of other metals, and the second treatment of the electroplated and thermally diffused steel wire surface can be completed.
A heat diffusion device is provided in the heat treatment tank 2004, and the heat diffusion device is selected as an electromagnetic induction heating device, and in the process of passing the steel wire, electromagnetic induction heating can be performed in a non-contact state, the plating metal is controlled to be in a molten state, and a composite alloy which is mutually fused with the steel wire is formed inside the heat diffusion.
The method specifically comprises the following steps:
s1, controlling the steel wire 300 to pass through the electroplating treatment tank 200, finish electroplating treatment through a storage tank I2001, finish thermal diffusion treatment through a heat treatment tank 2004, and finish treatment through a storage tank II 2007.
S2, pumping protective gas into the heat treatment tank 2004, and simultaneously controlling the first treatment liquid and the second treatment liquid to directionally flow at two sides of the heat treatment tank 2004 to form a liquid sealing structure, and controlling the steel wire 300 to finish heat diffusion treatment in an oxygen-isolated environment.
By the method, no extra coating protection procedure is needed between electroplating and thermal diffusion processing, only the directional flow of the treatment liquid at two sides is controlled to form a liquid sealing structure, oxygen can be prevented from entering the thermal treatment tank 2004 through the liquid sealing structure, oxidation of a metal layer in the thermal diffusion processing process is avoided, the steps of the steel wire electroplating processing are simplified by the processing method, processing equipment is simplified, the efficiency of the electroplating processing is greatly improved, and the comprehensive performance of the steel wire after the thermal diffusion processing is ensured.
Referring to fig. 1 to 8, a wire electroplating processing apparatus for wire electroplating processing includes an electroplating processing tank 200 through which a wire 300 passes, wherein a processing liquid located on a moving path of the wire 300 is stored in the electroplating processing tank 200, and the electroplating processing tank 200 is further provided with an electroplating device, through which metal can be electroplated on the surface of the wire to form a metal coating, thereby enhancing oxidation resistance of the surface of the wire.
The treatment liquid can be selected as zinc sulfate solution, and zinc ions can be electroplated on the surface of the steel wire in the electroplating process to form a continuously finished metallic zinc coating.
The electroplating treatment tank 200 comprises a treatment tank body 220 and a treatment tank cover plate 230, a plurality of separation plates 210 are arranged between the treatment tank body 220 and the treatment tank cover plate 230, guide holes 211 for the steel wires 300 to pass through are formed in the side walls of the separation plates 210, a plurality of treatment chambers are formed by sealing the separation plates 210, the treatment tank body 220 and the treatment tank cover plate 230 relatively, sealing gaskets can be arranged between the separation plates 210, the treatment tank body 220 and the treatment tank cover plate 230 relatively, the sealing effect can be enhanced, the guide holes 211 are larger than the steel wires in size, the steel wires can pass through, part of treatment liquid can flow towards the lower side through the guide holes 211, and a liquid sealing structure can be formed at the guide holes 211 under the condition that the liquid is enough, so that the relative sealing among the treatment chambers is ensured.
Specifically, the treatment chamber comprises a first storage tank 2001 for storing a first treatment liquid and a second storage tank 2007 for storing a second treatment liquid, a heat treatment tank 2004 for carrying out heat diffusion on the steel wire 300 is arranged between the first storage tank 2001 and the second storage tank 2007, and electromagnetic induction heating can be carried out on the steel wire through the heat treatment tank 2004, so that heat diffusion treatment is realized, and the comprehensive performance of the electroplated steel wire is enhanced.
In order to collect the treatment liquid overflowed from the guide hole 211 and ensure the normal operation of the whole electroplating and the thermal diffusion, a first transition groove 2002 is arranged on one side of the thermal treatment groove 2004 close to the first storage groove 2001, the treatment liquid overflowed from one side of the first storage groove 2001 can be collected by arranging the first transition groove 2002, a second transition groove 2006 is arranged on one side of the thermal treatment groove 2004 close to the second storage groove 2007, and the treatment liquid overflowed from one side of the second storage groove 2007 can be collected by the second transition groove 2006.
The lower end of the electroplating processing tank 200 is further provided with a pumping mechanism 400, the pumping mechanism 400 comprises a first pumping device 410 arranged between the first storage tank 2001 and the first transition tank 2002 and used for controlling the directional flow of the processing liquid, and a fourth pumping device 440 arranged between the second transition tank 2006 and the second storage tank 2007 and used for controlling the directional flow of the processing liquid, specifically, the first pumping device 410 can pump the processing liquid in the first transition tank 2002 into the first storage tank 2001, and the fourth pumping device 440 can pump the processing liquid in the second transition tank 2006 into the second storage tank 2007.
The protective gas is filled in the heat treatment tank 2004, the first treatment liquid and the second treatment liquid directionally flow at two sides of the heat treatment tank 2004 to form a liquid sealing structure, the fixed connection position of the heat treatment tank 2004 can be ensured to be in a relatively sealed state through the electroplating treatment tank 200, the heat treatment tank 2004 can be ensured to be in a relatively sealed state along the conveying direction of the steel wire 300 through the liquid sealing structure, oxygen in the outside air can be prevented from entering the heat treatment tank 2004 to perform oxidation reaction with the metal coating in a molten state, metal oxide generation is avoided, and the quality of the metal coating after heat treatment is improved.
The shielding gas may be a common shielding gas such as nitrogen or helium which does not react with the metal.
Here, in order to ensure the relative sealing of the liquid sealing structures on both sides, it is necessary to ensure that the liquid level of the first and second treatment liquids is greater than the height of the guide holes 211, and the guide holes 211 corresponding to both sides of the heat treatment tank 2004 can be sealed by the treatment liquid, so that oxygen in the environment is prevented from entering from the guide holes.
A drying groove 2003 is further formed in the side, close to the transition groove 2002, of the heat treatment groove 2004, a cooling groove 2005 is further formed in the side, close to the transition groove 2006, of the heat treatment groove 2004, a resistance heating device is arranged in the drying groove 2003, the temperature in the drying groove 2003 can be increased, drying of the steel wire 300 in the drying groove 2003 is accelerated, the cooling groove 2005 is connected with a cooling structure, the temperature in the cooling groove 2005 can be reduced, the steel wire 300 subjected to induction heating in the heat treatment groove 2004 can be cooled, the steel wire 300 is controlled to enter the treatment liquid II at a relatively normal temperature, and subsequent normal processing treatment of the steel wire 300 is guaranteed.
The pumping mechanism 400 further comprises a second pumping device 420 for controlling the directional flow of the shielding gas, the second pumping device 420 can control the shielding gas to move along the path opposite to the movement of the steel wire 300, and through the design, the heated gas in the heat treatment tank 2004 can enter the drying tank 2003 to assist in heating the part of the steel wire 300, so that the heat of the part can be fully utilized.
Specifically, the second pumping device 420 comprises a second pumping pipeline 421 and a second pumping assembly 422 connected in series inside the second pumping pipeline 421, the second pumping assembly 422 can control the directional compression flow of the gas in the second pumping pipeline 421, the first end of the second pumping pipeline 421 penetrates through the first transition groove 2002 and extends to the top in the first transition groove 2002, and the second end of the second pumping pipeline 421 penetrates through the cooling groove 2005 and is communicated with the cooling groove 2005.
Under the pumping action of the second pumping assembly 422, the first end of the second pumping pipeline 421 can continuously suck the protective gas, the second end of the second pumping pipeline 421 can continuously spray the gas, the protective gas directionally flows from the second end of the second pumping pipeline 421 towards the first end of the second pumping pipeline 421, the protective gas in the heat treatment tank 2004 is directionally pumped into the drying tank 2003 to assist in heating and drying the steel wire 300, and meanwhile, the influence of the moist gas entering the heat treatment tank 2004 on the induction heating of the steel wire 300 is avoided.
It should be noted that, the first end of the second pumping pipe 421 is installed at the top of the first transition groove 2002, the top of the first transition groove 2002 is in a dry state at any time, and the gas in the drying groove 2003 can enter through the guiding hole 211 between the first transition groove 2002 and the drying groove 2003, and is finally sucked by the second pumping pipe 421.
It should be further noted that, the second pumping pipe 421 is further connected in series with a drying assembly 423, and the drying assembly 423 can sufficiently dry the sucked gas, where the second pumping pipe 421 may be configured as a closed loop, and the sufficiently dried gas can be pumped into the heat treatment tank 2004 again to protect the steel wire 300.
The pumping mechanism 400 further comprises a third pumping device 430 for controlling the directional flow of the cooling medium, the third pumping device 430 comprises a third pumping pipeline 431 close to the second pumping pipeline 421, a third pumping assembly 432 is connected in series inside the third pumping pipeline 431, and a heat exchange assembly 424 is arranged between the third pumping pipeline 431 and the second pumping pipeline 421.
The cooling medium can be pumped into the third pumping pipeline 431 to flow directionally through the third pumping device 430, the third pumping pipeline 431 and the second pumping pipeline 421 can be fully contacted through the heat exchange assembly 424, and heat in the second pumping pipeline 421 can be fully absorbed and exchanged through the second pumping pipeline 421 to reduce the temperature of the protective gas in the second pumping pipeline 421.
The cooled protective gas in the second pumping pipe 421 can be pumped into the cooling groove 2005 again to cool down the steel wire 300 sufficiently, and the cooling medium can be selected as a liquid cooling medium to improve the overall heat exchange effect.
Specifically, the first pumping device 410 includes a first pumping pipe 411 and a first pumping assembly 412 connected in series inside the first pumping pipe 411, wherein a first end of the first pumping pipe 411 penetrates into the first transition tank 2002 and is located at a bottom position of the first transition tank 2002, the first end of the first pumping pipe 411 is further provided with a float valve group 413, the first pumping pipe 411 can pump the first treatment liquid at the bottom of the first transition tank 2002, and the first pumping assembly 412 can pump the first pumped treatment liquid back into the first storage tank 2001.
The floating control valve group 413 is arranged to control the opening and closing state of the first end of the first pumping pipeline 411, when the liquid level in the transition groove I2002 is low, the first end of the first pumping pipeline 411 is controlled to be in a closed state, the first pumping pipeline 411 can be prevented from pumping gas in the transition groove I2002 into the storage groove I2001, abnormal phenomenon of the whole system is avoided, automatic control is realized, and normal operation of whole electroplating is ensured.
Specifically, the float valve block 413 includes a float valve base 4131, a flow guiding opening 4132 is formed in the bottom of the float valve base 4131, a float 4133 connected to the float valve body is disposed at the top of the float valve base, when the liquid level is Yu Fupiao and the lowest point of the float valve body is high, the float 4133 can drive the float valve body to move upwards under the action of the float force, and when the float valve body moves upwards by a predetermined height, the float valve body can be completely staggered from the flow guiding opening 4132, at this time, the first end of the first pumping pipeline 411 can pump excessive first treatment liquid, so that the excessive first treatment liquid is prevented from entering the drying groove 2003 to affect the subsequent treatment process.
When the liquid level is low, the above action process is opposite, and the diversion opening 4132 is in a closed state under the action of the floating control valve body, so that the first pumping assembly 412 can be prevented from pumping gas, and the normal operation of the whole system is ensured.
The fourth pumping device 440 on the other side can also select the floating control opening and closing structure, so as to avoid the gas from being pumped into the second storage tank 2007.
Specifically, the pumping assembly includes a pumping housing 4001, a pumping piston 4002 is connected to the inside of the pumping housing 4001 in a sliding and sealing manner, a pumping rod 4004 is fixed to the side wall of the pumping piston 4002, the end portion of the pumping rod 4004 penetrates through the pumping housing 4001 and extends to the outer side, a return spring 4003 for resetting is sleeved on the outer side of the pumping rod 4004, a pumping chamber 4006 is formed between one side, away from the pumping rod 4004, of the pumping piston 4002 and the pumping housing 4001, and the pumping chamber 4006 is communicated with a pumping joint 4005 with two built-in check valves.
The return spring 4003 can pull the second pumping assembly 422 to move outwards, namely, upwards in fig. 7, so that the pumping chamber 4006 can be in a maximum state, push the pumping rod 4004 to move downwards in fig. 7 in the process of pumping liquid, compress the pumping chamber 4006 until the pumping chamber 4006 is in a minimum state, and repeat the above actions, so that the pumping chamber 4006 can be controlled to be periodically increased and decreased, and continuous pumping of the treatment liquid and the protective gas can be realized by matching with the one-way valve in the process.
The driving device 500 is arranged on the outer side of the pumping mechanism 400, the driving device 500 is arranged on the outer side of the pumping assemblies and used for controlling the pumping assemblies to synchronously complete pumping, the reciprocating control process can be automatically completed through the driving device 500, the pumping rods 4004 can be pushed to synchronously move, the front and back unification of electroplating processing equipment is ensured, and the overall normal electroplating processing control is ensured.
Specifically, the driving device 500 includes a compression plate 520 and a driving telescopic rod 510 controlling the compression plate 520 to reciprocate linearly, the compression plate 520 extending toward both sides, and a plurality of pumping assemblies positioned on a moving path of the compression plate 520.
In the driving control process, the driving telescopic rod 510 is periodically controlled to drive the extrusion plate 520 to reciprocate, the pumping rod 4004 can be pushed to move towards the inner side under the extrusion of the extrusion plate 520, the unidirectional continuous pumping of the treatment liquid and the protective gas is completed, the extrusion plate 520 and the pumping rods 4004 are not connected, the pumping rods 4004 can be reset under the action of elastic force in the shrinkage process of the driving telescopic rod 510 and the extrusion plate 520, and the unidirectional pumping of the treatment liquid and the protective gas is completed in the expansion process of the pumping chamber 4006.
It should be noted that, for the structure provided with the float valve assembly 413, when one side of the float valve assembly 413 is in a closed state, the return spring 4003 cannot pull the pumping piston 4002 to return under the action of negative pressure, and the corresponding pumping rod 4004 is still in a contracted state, so that the pumping rod 4004 is not driven by the driving device 500 in a squeezing manner, and gas is prevented from being pumped into the treatment fluid.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (10)
1. A steel wire electroplating processing method uses an electroplating processing groove (200), wherein a relatively sealed processing chamber is formed inside the electroplating processing groove (200), and is characterized in that the processing chamber comprises a first storage groove (2001), a first transition groove (2002), a heat treatment groove (2004), a second transition groove (2006) and a second storage groove (2007) which are sequentially arranged, processing liquid I is stored in the first storage groove (2001) and the first transition groove (2002), processing liquid II is stored in the second transition groove (2006) and the second storage groove (2007), and a heat diffusion device is arranged in the heat treatment groove (2004);
The method comprises the following steps:
S1, controlling a steel wire (300) to pass through an electroplating treatment tank (200) to finish electroplating treatment through a storage tank I (2001), finish thermal diffusion treatment through a thermal treatment tank (2004), and finish treatment through a storage tank II (2007);
And S2, pumping protective gas into the heat treatment tank (2004), and simultaneously controlling the first treatment liquid and the second treatment liquid to directionally flow at two sides of the heat treatment tank (2004) to form a liquid sealing structure, and controlling the steel wire (300) to finish heat diffusion treatment in an oxygen-isolated environment.
2. A steel wire electroplating processing device for the steel wire electroplating processing method of claim 1, comprising an electroplating processing tank (200) for a steel wire (300) to pass through, wherein processing liquid positioned on a moving path of the steel wire (300) is stored in the electroplating processing tank (200), and the electroplating processing tank (200) is further provided with an electroplating device, and is characterized in that:
The electroplating treatment tank (200) comprises a treatment tank body (220) and a treatment tank cover plate (230), a plurality of separation plates (210) are arranged between the treatment tank body (220) and the treatment tank cover plate (230), guide holes (211) for a steel wire (300) to pass through are formed in the side walls of the separation plates (210), and the separation plates (210), the treatment tank body (220) and the treatment tank cover plate (230) are sealed relatively to form a plurality of treatment chambers;
The treatment chamber comprises a first storage tank (2001) for storing a first treatment liquid and a second storage tank (2007) for storing a second treatment liquid, a heat treatment tank (2004) for carrying out heat diffusion on a steel wire (300) is arranged between the first storage tank (2001) and the second storage tank (2007), a transition tank (2002) is arranged on one side of the heat treatment tank (2004) close to the first storage tank (2001), a transition tank (2006) is arranged on one side of the heat treatment tank (2004) close to the second storage tank (2007), a pumping mechanism (400) is further arranged at the lower end of the electroplating treatment tank (200), the pumping mechanism (400) comprises a first pumping device (410) arranged between the first storage tank (2001) and the first transition tank (2002) and used for controlling the directional flow of the treatment liquid, and a fourth pumping device (440) arranged between the second transition tank (2006) and the second storage tank (2007) and used for controlling the directional flow of the treatment liquid, the protective gas is filled in the heat treatment tank (2004), and the first treatment liquid and the second treatment liquid form a directional liquid sealing structure on the two sides of the heat treatment tank (2004).
3. The steel wire electroplating processing apparatus according to claim 2, wherein a drying tank (2003) is further provided on a side of the heat treatment tank (2004) close to the first transition tank (2002), and a cooling tank (2005) is further provided on a side of the heat treatment tank (2004) close to the second transition tank (2006).
4. A wire electroplating processing apparatus according to claim 3, wherein the pumping mechanism (400) further comprises a second pumping means (420) controlling the directional flow of the shielding gas, the second pumping means (420) comprising a second pumping pipe (421) and a second pumping assembly (422) connected in series inside the second pumping pipe (421), the second pumping pipe (421) having a first end penetrating through the aqueduct one (2002) and extending to the top in the transition duct one (2002), the second pumping pipe (421) having a second end penetrating through the cooling duct (2005) and communicating with the cooling duct (2005).
5. The wire electroplating processing device according to claim 4, wherein the pumping mechanism (400) further comprises a third pumping device (430) for controlling the directional flow of the cooling medium, the third pumping device (430) comprises a third pumping pipeline (431) close to the second pumping pipeline (421), a third pumping assembly (432) is connected in series inside the third pumping pipeline (431), and a heat exchange assembly (424) is arranged between the third pumping pipeline (431) and the second pumping pipeline (421).
6. The wire electroplating processing device according to claim 2, wherein the first pumping means (410) comprises a first pumping pipeline (411) and a first pumping assembly (412) connected in series inside the first pumping pipeline (411), a first end of the first pumping pipeline (411) penetrates into the transition groove one (2002) and is located at a bottom position of the transition groove one (2002), and a floating control valve group (413) is further arranged at the first end of the first pumping pipeline (411).
7. The steel wire electroplating processing device according to claim 6, wherein the float valve group (413) comprises a float valve base (4131), a flow guiding opening (4132) is formed in the bottom of the float valve base (4131), a float valve body is arranged in the float valve base, and a float (4133) connected with the float valve body is arranged on the top of the float valve body.
8. The wire electroplating processing apparatus according to any one of claims 4-7, wherein the pumping assembly comprises a pumping housing (4001), a pumping piston (4002) is connected inside the pumping housing (4001) in a sealing sliding manner, a pumping rod (4004) is fixed on the side wall of the pumping piston (4002), the tail end portion of the pumping rod (4004) penetrates through the pumping housing (4001) and extends to the outer side, a return spring (4003) for resetting is sleeved on the outer side of the pumping rod (4004), a pumping chamber (4006) is formed between one side, away from the pumping rod (4004), of the pumping piston (4002) and the pumping housing (4001), and the pumping chamber (4006) is communicated with pumping joints (4005) with two built-in check valves.
9. The wire electroplating processing apparatus as recited in claim 8, wherein a driving device (500) is disposed outside the pumping mechanism (400), and the driving device (500) is disposed outside the plurality of pumping assemblies for controlling the plurality of pumping assemblies to complete pumping simultaneously.
10. The wire electroplating processing apparatus as recited in claim 9, wherein the driving means (500) includes a pressing plate (520) and a driving telescopic rod (510) controlling the pressing plate (520) to reciprocate linearly, the pressing plate (520) extending toward both sides, and a plurality of the pumping assemblies are located on a moving path of the pressing plate (520).
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CN202411919365.4A CN119352122A (en) | 2024-12-25 | 2024-12-25 | Steel wire electroplating processing method and equipment |
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CN202411919365.4A CN119352122A (en) | 2024-12-25 | 2024-12-25 | Steel wire electroplating processing method and equipment |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120279868A1 (en) * | 2009-11-03 | 2012-11-08 | Voestalpine Stahl Gmbh | Manufacturing galvannealed sheets by heat-treating electrolytically finished sheets |
WO2013117269A1 (en) * | 2012-02-06 | 2013-08-15 | Nv Bekaert Sa | Multi-wire plating line at various levels |
CN207848019U (en) * | 2017-12-05 | 2018-09-11 | 河北技投机械设备有限公司 | Single suction submerged pump liquid sealing structure and single suction submerged pump |
CN109487307A (en) * | 2018-12-28 | 2019-03-19 | 凡登(常州)新型金属材料技术有限公司 | A kind of zinc-coated wire and preparation method thereof |
US20190264347A1 (en) * | 2018-02-28 | 2019-08-29 | Lam Research Corporation | Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating |
CN214271078U (en) * | 2020-12-30 | 2021-09-24 | 无锡市蓝格林金属材料科技有限公司 | Nitrogen protection heat diffusion device for electroplating operation of copper-plated zinc steel wire |
CN216192529U (en) * | 2021-11-08 | 2022-04-05 | 钟有粮 | Atmosphere protection sealing continuous heat treatment furnace |
CN117107238A (en) * | 2023-08-28 | 2023-11-24 | 铜陵蔚屹新材料有限公司 | Multichannel fiber filament electroplating production line and electroplating process |
-
2024
- 2024-12-25 CN CN202411919365.4A patent/CN119352122A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120279868A1 (en) * | 2009-11-03 | 2012-11-08 | Voestalpine Stahl Gmbh | Manufacturing galvannealed sheets by heat-treating electrolytically finished sheets |
WO2013117269A1 (en) * | 2012-02-06 | 2013-08-15 | Nv Bekaert Sa | Multi-wire plating line at various levels |
CN207848019U (en) * | 2017-12-05 | 2018-09-11 | 河北技投机械设备有限公司 | Single suction submerged pump liquid sealing structure and single suction submerged pump |
US20190264347A1 (en) * | 2018-02-28 | 2019-08-29 | Lam Research Corporation | Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating |
CN109487307A (en) * | 2018-12-28 | 2019-03-19 | 凡登(常州)新型金属材料技术有限公司 | A kind of zinc-coated wire and preparation method thereof |
CN214271078U (en) * | 2020-12-30 | 2021-09-24 | 无锡市蓝格林金属材料科技有限公司 | Nitrogen protection heat diffusion device for electroplating operation of copper-plated zinc steel wire |
CN216192529U (en) * | 2021-11-08 | 2022-04-05 | 钟有粮 | Atmosphere protection sealing continuous heat treatment furnace |
CN117107238A (en) * | 2023-08-28 | 2023-11-24 | 铜陵蔚屹新材料有限公司 | Multichannel fiber filament electroplating production line and electroplating process |
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