CN119342722A

CN119342722A - Housing assembly and foldable electronic device

Info

Publication number: CN119342722A
Application number: CN202310912110.4A
Authority: CN
Inventors: 白一凡; 宋本南; 陈义甫; 封蕾; 毛春程
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-07-21
Filing date: 2023-07-21
Publication date: 2025-01-21

Abstract

The application discloses a shell assembly and foldable electronic equipment, relates to the technical field of electronic products, and can optimize folds of a folding screen while reducing the temperature difference between a first shell and a second shell. The shell assembly comprises a first shell, a second shell, a rotating shaft mechanism, a supporting sheet and a heat conducting sheet, wherein the rotating shaft mechanism is connected between the first shell and the second shell, the first shell can rotate relative to the second shell, the supporting sheet is arranged on one side of the rotating shaft mechanism, a containing space is formed between the supporting sheet and the rotating shaft mechanism, when the rotating shaft mechanism is in an unfolding state, the supporting sheet is arranged on the rotating shaft mechanism in a stacked mode, the supporting sheet is bent when the rotating shaft mechanism is in a folding state, the heat conducting sheet comprises a first heat conducting part, a second heat conducting part and a third heat conducting part, the first heat conducting part is fixedly connected with the first shell, the second heat conducting part is fixedly connected with the second shell, the third heat conducting part is connected between the first heat conducting part and the second heat conducting part, and at least one part of the third heat conducting part is located in the containing space.

Description

Housing assembly and foldable electronic device

Technical Field

The present disclosure relates to electronic devices, and particularly to a housing assembly and a foldable electronic device.

Background

Currently, in order to solve the problem that the conventional straight-plate electronic device is large in size and inconvenient to carry, a foldable electronic device has been developed. The housing assembly of the foldable electronic device includes a first housing, a second housing, and a hinge mechanism coupled between the first housing and the second housing. Since the heat generated by the devices inside the first case and the heat generated by the devices inside the second case are generally different, and the soaking performance of the foldable electronic device is poor, a temperature difference between the first case and the second case is large. And, after the foldable electronic device is repeatedly folded, the folding screen is easy to fold. The foldable electronic equipment in the related art cannot give consideration to soaking performance of the foldable electronic equipment and folds of the folding screen, so that user experience is affected.

Disclosure of Invention

The embodiment of the application provides a shell assembly and foldable electronic equipment, which can optimize crease of a folding screen while reducing temperature difference between a first shell and a second shell.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme:

The application provides a shell assembly, which comprises a first shell, a second shell, a rotating shaft mechanism, a supporting sheet and a heat conducting sheet, wherein the rotating shaft mechanism is connected between the first shell and the second shell, the first shell can rotate relative to the second shell so that the shell assembly can be switched between an unfolding state and a folding state, the supporting sheet is arranged on one side of the rotating shaft mechanism, a containing space is formed between the supporting sheet and the rotating shaft mechanism, when the rotating shaft mechanism is in the unfolding state, the supporting sheet is arranged on the rotating shaft mechanism in a stacked mode, the supporting sheet is bent when the rotating shaft mechanism is in the folding state, the heat conducting sheet comprises a first heat conducting part, a second heat conducting part and a third heat conducting part, the first heat conducting part is fixedly connected with the first shell, the second heat conducting part is fixedly connected with the second shell, the third heat conducting part is connected between the first heat conducting part and the second heat conducting part, and at least one part of the third heat conducting part is located in the containing space.

According to the shell assembly provided by the application, the supporting sheet and the heat conducting sheet are arranged, and the third heat conducting part of the heat conducting sheet is arranged between the supporting sheet and the rotating shaft mechanism, so that the folding screen and the third heat conducting part of the heat conducting sheet can be separated through the supporting sheet, the third heat conducting part of the heat conducting sheet is prevented from being in direct contact with the folding screen, and further, the third heat conducting part is prevented from being propped against the screen in the folding process of the foldable electronic equipment, the risk of the inverted arch caused by tension of the folding screen in the folding process is reduced, and the reliability of the folding screen is improved. Meanwhile, when the foldable electronic equipment is in an unfolding state, the folding screen can be effectively supported through the supporting sheet, the flatness of the folding screen in the unfolding state can be improved, the screen light and shadow can be reduced, and the folding screen crease can be optimized.

In one possible implementation manner of the first aspect, the rotating shaft mechanism includes a base, a first rotating door plate and a second rotating door plate, the first rotating door plate and the second rotating door plate are respectively rotatably connected to two opposite sides of the base, the first rotating door plate includes a first supporting surface, the second rotating door plate includes a second supporting surface, when the housing assembly is in a unfolded state, the supporting sheets are stacked on the first supporting surface and the second supporting surface, the third heat conducting part includes a first section and a second section, the first section is located between the supporting sheets and the first rotating door plate, and the second section is located between the supporting sheets and the second rotating door plate. A specific structure of a spindle mechanism is provided.

In a possible implementation manner of the first aspect, the rotating shaft mechanism further includes an intermediate door panel, the intermediate door panel is located between the first rotating door panel and the second rotating door panel, the intermediate door panel includes a third supporting surface, the first supporting surface, the second supporting surface, and the third supporting surface face the same direction when the housing assembly is in the unfolded state, the third heat conducting part further includes a third section, the third section is connected between the first section and the second section, and the third section is located between the supporting sheet and the intermediate door panel. Another specific structure of the spindle mechanism is provided.

In a possible implementation manner of the first aspect, the first rotating door panel includes a first bottom surface, the first bottom surface is opposite to the first supporting surface, a first sink groove recessed toward the first bottom surface is provided on the first supporting surface, a first accommodating groove is defined between the supporting piece and the first sink groove, and at least part of the first section is located in the first accommodating groove. In this way, the support sheet is convenient to support on the first support surface when the shell component is in the unfolding state, and the support area of the support sheet by the rotating shaft mechanism can be ensured, and meanwhile, the superposition size of the first rotating door plate, the first section and the support sheet in the thickness direction of the rotating shaft mechanism is reduced, so that the whole thickness of the shell component is reduced, and further the thin design of the foldable electronic equipment is realized.

In a possible implementation manner of the first aspect, the second rotating door panel includes a second bottom surface, the second bottom surface is opposite to the second supporting surface, a second sink groove recessed toward the second bottom surface is provided on the second supporting surface, a second accommodating groove is defined between the supporting piece and the second sink groove, and at least part of the second section is located in the second accommodating groove. In this way, the overlapped size of the second rotating door plate, the second section and the supporting piece in the thickness direction of the rotating shaft mechanism can be reduced, the whole thickness of the shell assembly can be reduced, and further the thin design of the foldable electronic equipment can be realized.

In a possible implementation manner of the first aspect, the intermediate door panel includes a third bottom surface, the third bottom surface is opposite to the third supporting surface, a third sink groove recessed toward the third bottom surface is provided on the third supporting surface, a third accommodating groove is defined between the supporting piece and the third sink groove, and at least part of the third section is located in the third accommodating groove. In this way, the overlapped sizes of the middle door plate, the third section and the supporting piece in the thickness direction of the rotating shaft mechanism can be reduced, the overall thickness of the shell assembly can be reduced, and further the thin design of the foldable electronic equipment can be realized.

In a possible implementation manner of the first aspect, the first rotating door panel includes a first inner side surface and a first outer side surface opposite to each other, and when the housing assembly is in the unfolded state, the first inner side surface faces the second rotating door panel, and the first countersink penetrates the first inner side surface and the first outer side surface. Therefore, the first section is convenient to assemble in the first sinking groove, the superposition size of the first section and the first rotating door plate in the thickness direction of the rotating shaft mechanism is reduced, and the thin design of the shell assembly and the foldable electronic equipment is realized.

In a possible implementation manner of the first aspect, the second rotating door panel includes a second inner side surface and a second outer side surface opposite to each other, and the second inner side surface faces the first rotating door panel when the housing assembly is in the unfolded state, and the second countersink penetrates the second inner side surface and the second outer side surface. Therefore, the second section is convenient to assemble in the second sinking groove, the superposition size of the second section and the second rotating door plate in the thickness direction of the rotating shaft mechanism is reduced, and the thin design of the shell assembly and the foldable electronic equipment is realized.

In a possible implementation manner of the first aspect, the intermediate door panel includes a first side wall surface and a second side wall surface opposite to each other, and the first side wall surface faces the first rotating door panel and the second side wall surface faces the second rotating door panel when the rotating shaft mechanism is in the unfolded state. The third sinking groove penetrates through the first side wall surface and the second side wall surface. Therefore, the third section is convenient to assemble in the third sinking groove, the superposition size of the third section and the middle door plate in the thickness direction of the rotating shaft mechanism is reduced, and the thin design of the shell assembly and the foldable electronic equipment is realized.

In a possible implementation manner of the first aspect, the first section is parallel to the first support surface when the housing assembly is in the unfolded state. Therefore, the size of the first section is free from redundancy, the first section is prevented from being clamped in a gap of the rotating shaft mechanism in the folding process of the rotating shaft mechanism, the step difference between the first heat conduction part and the first section is reduced, and the bending stress of the heat conduction sheet in the unfolded state of the rotating shaft mechanism is reduced. In addition, the occupied space of the first section in the thickness direction of the rotating shaft structure can be reduced, and the thickness of the rotating shaft mechanism can be reduced.

In a possible implementation manner of the first aspect, the second section is parallel to the second support surface when the housing assembly is in the unfolded state. Therefore, the second section has no redundancy in size, the second section is prevented from being clamped in a gap of the rotating shaft mechanism in the folding process of the rotating shaft mechanism, the step difference between the second heat conduction part and the second section is reduced, and the bending stress of the heat conduction sheet in the unfolded state of the rotating shaft mechanism is reduced. In addition, the occupied space of the second section in the thickness direction of the rotating shaft structure can be reduced, and the thickness of the rotating shaft mechanism can be reduced.

In a possible implementation manner of the first aspect, the first countersink includes a first bottom wall surface, the first bottom wall surface faces the same direction as the first supporting surface, and the first bottom wall surface is parallel to the first supporting surface, and the first section is supported on the first bottom wall surface when the housing assembly is in the unfolded state. Therefore, when the shell assembly is in the unfolding state, the flatness of the first section can be ensured, the redundancy-free design of the first section can be realized, and bending stress on the first section can be reduced, so that the occurrence of the inverted arch of the first section is avoided. Simultaneously, still be favorable to reducing the size of first heavy groove in the pivot mechanism thickness direction, be favorable to improving pivot mechanism's structural strength.

In a possible implementation manner of the first aspect, the second countersink includes a second bottom wall surface, the second bottom wall surface faces the same direction as the second supporting surface, and the second bottom wall surface is parallel to the second supporting surface, and the second section is supported on the second bottom wall surface when the housing assembly is in the unfolded state. Therefore, when the shell assembly is in the unfolding state, the flatness of the second section can be ensured, so that bending stress on the second section can be reduced, and the occurrence of the inverted arch of the first section is avoided. Meanwhile, the size of the second sinking groove in the thickness direction of the rotating shaft mechanism is reduced, and the structural strength of the rotating shaft mechanism is improved.

In a possible implementation manner of the first aspect, the first bottom wall surface and the second bottom wall surface are arranged coplanar when the housing assembly is in the unfolded state. Specifically, when the housing assembly is in the unfolded state, the first bottom wall surface and the second bottom wall surface are located on the same plane. In this way, the dimensions of the first section and the second section can be guaranteed to be free from redundancy.

In a possible implementation manner of the first aspect, the first housing includes a first fixing surface, the first heat conducting portion is fixedly connected to the first fixing surface, and the first fixing surface is coplanar with the first bottom wall surface. Therefore, when the shell assembly is in the unfolding state, the first heat conduction part and the first section can be transited through the straight line section, so that the step difference between the first heat conduction part and the first section can be eliminated, bending between the first heat conduction part and the first section is avoided, and the bending stress on the heat conduction sheet can be reduced.

In a possible implementation manner of the first aspect, the third countersink includes a third bottom wall surface, the third bottom wall surface is oriented in the same direction as the third supporting surface, and the third bottom wall surface is parallel to the third supporting surface, and the third section is supported on the third bottom wall surface when the housing assembly is in the unfolded state. In this way, the flatness of the third section can be ensured when the housing assembly is in the unfolded state, so that the bending stress on the third section can be reduced.

In a possible implementation manner of the first aspect, the third bottom wall surface is coplanar with the first bottom wall surface when the housing assembly is in the unfolded state. Therefore, when the shell assembly is in the unfolding state, the first section and the third section can be transited through the straight line section, so that the step difference between the third section and the first section can be eliminated, bending between the third section and the first section is avoided, and bending stress on the third heat conduction part is reduced.

In a possible implementation manner of the first aspect, the third bottom wall surface is coplanar with the second bottom wall surface when the housing assembly is in the unfolded state. Therefore, when the shell assembly is in the unfolding state, the second section and the third section can be transited through the straight line section, so that the section difference between the third section and the second section can be eliminated, bending between the third section and the second section is avoided, and bending stress on the third heat conduction part is reduced.

In a possible implementation manner of the first aspect, when the housing assembly is in the unfolded state, the first bottom wall surface, the second bottom wall surface and the third bottom wall surface are oriented identically and coplanar. Like this, when the casing subassembly is in the state of expanding, third heat conduction portion is dull and stereotyped form, and the size of third heat conduction portion is non-redundant this moment, like this, in pivot mechanism in folding process, can avoid third heat conduction portion to be pressed from both sides in pivot mechanism's the space, and can reduce the material of conducting strip, be favorable to reduce cost.

In one possible implementation of the first aspect, the first section is connected to the first rotating door panel by a cushioning material and/or the second section is connected to the second rotating door panel by a cushioning material. On the one hand, the buffer material is used for limiting the positions of the first section and the second section, so that the displacement of the first section and the second section relative to the rotating mechanism is reduced, the first section and the second section can be prevented from being clamped in a gap of the rotating mechanism, and on the other hand, when the buffer material piece has certain deformability and is bent along with the rotating mechanism, the deformation of the buffer material piece can be used for weakening the stress born by the third heat conduction part, and the stretching rate of the third heat conduction part can be reduced, so that the reliability of the third heat conduction part is improved, and the possibility that the third heat conduction part is broken, layered and the like is reduced.

In a possible implementation manner of the first aspect, the buffer material piece is an adhesive glue. For example, the adhesive may be an ultraviolet curable adhesive, a hot melt adhesive, a wire bonding adhesive, a white glaze adhesive, a foam adhesive, a silicone adhesive, or the like. A specific example of a cushioning material member is provided.

In a possible implementation manner of the first aspect, the third section is parallel to the third supporting surface when the rotation axis mechanism is in the unfolded state. In this way, the third section is not redundant in size, and is beneficial to avoiding the third section from being clamped into the gap of the rotating shaft mechanism during the folding process of the rotating shaft mechanism. Meanwhile, the size of the third sinking groove in the thickness direction of the rotating shaft mechanism is reduced, and the structural strength of the rotating shaft mechanism is improved.

In one possible implementation of the first aspect, at least part of the third section arches towards a direction away from the support sheet forming an arching section. That is, the length of the third section is greater than the spacing between the first section and the second section. The size of the third section leaves some redundancy. In this way, the stress applied to the third heat conduction part in the bending process can be reduced, so that the reliability of the third heat conduction part can be improved, the third heat conduction part can be effectively prevented from being inverted arch due to multiple times of folding, and the force of the third heat conduction part on the folding screen in the bending process can be reduced.

In a possible implementation manner of the first aspect, the intermediate door panel includes a third bottom surface, opposite to the third supporting surface, and a third groove recessed toward the third bottom surface is provided on the third supporting surface, and the arch section is located in the third groove. In this way, the arching section can be accommodated by the third recess. Therefore, when the rotating shaft mechanism is in the unfolding state, the stress on the third section can be reduced, the third section can be kept unfolded, bending of the third section due to insufficient accommodating space is avoided, and the reliability of the heat conducting fin is improved.

In a possible implementation manner of the first aspect, the third groove includes a third groove bottom wall, a first groove side wall and a second groove side wall, the third groove bottom wall faces the supporting piece, the first groove side wall is connected to a side of the third groove bottom wall near the first rotating door plate, the second groove side wall is connected to a side of the third groove bottom wall near the second rotating door plate, the first groove side wall extends toward a direction near the first rotating door plate in a direction from the middle door plate to the supporting piece, and the second groove side wall extends toward a direction near the second rotating door plate. In this way, the extrusion stress of the third section can be further reduced, and the stress concentration on the third section is avoided, so that the reliability of the third section can be further improved.

In one possible implementation manner of the first aspect, the third groove includes a third groove bottom wall, the third groove bottom wall faces the supporting piece, the housing assembly further includes a limiting plate disposed on the middle door panel, the limiting plate is disposed opposite to and spaced apart from the third groove bottom wall, and the arch section is disposed between the limiting plate and the third groove bottom wall. In this way, the movement of the third section in the thickness direction of the rotating shaft mechanism can be restricted by the limiting plate, and the influence of the third section on the folding screen due to the arching can be further reduced.

In a possible implementation manner of the first aspect, the limiting plate is detachably connected to the middle door panel. Therefore, the size of the third groove can be prevented from limiting the sizes of the first heat conduction part and the second heat conduction part, the soaking capacity of the shell assembly can be improved, and the heat dissipation performance of the shell assembly can be improved.

In a possible implementation manner of the first aspect, at least part of the support piece is slidable relative to the rotation shaft mechanism when the housing assembly is switched between the unfolded state and the folded state. In this way, it is easy to achieve that the support sheet is folded together with the folding screen.

In a possible implementation manner of the first aspect, the support piece is fixedly connected to the first rotating door plate, and the support piece is slidably connected to the second rotating door plate. A specific implementation is provided.

In one possible implementation manner of the first aspect, the supporting piece includes a first surface and a second surface opposite to each other, and a first side surface and a second side surface opposite to each other, the second surface faces the rotating shaft mechanism, the first side surface faces the first housing when the housing assembly is in the unfolded state, the second surface is provided with a step groove dodged towards the first surface, the step groove penetrates through the first side surface and the second side surface, and a containing space is defined between the step groove and the rotating shaft mechanism. Another limiting mode of the accommodating space is provided.

In a possible implementation manner of the first aspect, the heat conducting strip includes a heat conducting layer, a first protection layer and a second protection layer, the first protection layer covers a surface of a side of the heat conducting layer facing away from the rotating shaft mechanism, and the second protection layer covers a surface of a side of the heat conducting layer facing toward the rotating shaft mechanism. A laminated structure of heat conductive sheets is provided.

In a possible implementation manner of the first aspect, the first housing includes a first fixing surface, the first heat conducting portion is fixedly connected to the first fixing surface, the heat conducting strip includes a first wear layer, the first wear layer is disposed on a side of the first protection layer facing away from the heat conducting layer, when the housing assembly is in the unfolded state, an orthographic projection of the first wear layer on the reference plane overlaps an orthographic projection of the rotating shaft mechanism on the reference plane, and the orthographic projection of the first wear layer on the reference plane does not overlap an orthographic projection of the first fixing surface on the reference plane, where the reference plane is parallel to the first fixing surface. Thus, when the heat conducting fin is applied to the foldable electronic equipment, the thickness of the first shell of the foldable electronic equipment can be reduced, the thin design of the foldable electronic equipment is facilitated, the material consumption of the first wear-resistant layer can be reduced, and the cost is reduced.

In a possible implementation manner of the first aspect, the second heat conducting portion is fixedly connected to the second fixing surface, and when the housing assembly is in the unfolded state, an orthographic projection of the first wear layer on the reference plane does not overlap with an orthographic projection of the second fixing surface on the reference plane. Thus, when the heat conducting fin is applied to the foldable electronic equipment, the thickness of the second shell of the foldable electronic equipment can be reduced, the thin design of the foldable electronic equipment is facilitated, the material consumption of the first wear-resistant layer can be reduced, and the cost is reduced

In a possible implementation manner of the first aspect, the heat conducting strip includes a second wear layer, the second wear layer is disposed on a side of the second protection layer facing away from the heat conducting layer, when the housing assembly is in the unfolded state, an orthographic projection of the second wear layer on the reference plane overlaps with an orthographic projection of the rotating shaft mechanism on the reference plane, and the orthographic projection of the second wear layer on the reference plane does not overlap with an orthographic projection of the first fixing surface on the reference plane, wherein the reference plane is parallel to the first fixing surface. Thus, when the heat conducting fin is applied to the foldable electronic equipment, the thickness of the first shell of the foldable electronic equipment can be reduced, the thin design of the foldable electronic equipment is facilitated, the material consumption of the second wear-resistant layer can be reduced, and the cost is reduced.

In a possible implementation manner of the first aspect, when the housing assembly is in the unfolded state, the front projection of the second wear layer on the reference plane overlaps with the front projection of the rotation axis mechanism on the reference plane, and the front projection of the second wear layer on the reference plane does not overlap with the front projection of the second fixing surface on the reference plane. Thus, when the heat conducting fin is applied to the foldable electronic equipment, the thickness of the second shell of the foldable electronic equipment can be reduced, the thin design of the foldable electronic equipment is facilitated, the material consumption of the second wear-resistant layer can be reduced, and the cost is reduced.

In one possible implementation manner of the first aspect, the elongation at break of the heat conducting layer is greater than or equal to 3.5%. Thus, the reliability of the heat conducting fin can be improved, and the heat conducting fin is prevented from being broken in the bending process.

In a second aspect, the present application provides a foldable electronic device, where the foldable electronic device includes a housing assembly and a folding screen, the housing assembly is a housing assembly in any of the above-mentioned technical solutions, and the folding screen is disposed on the housing assembly.

In a possible implementation manner of the second aspect, the folding screen includes a first portion, a second portion, and a third portion, the third portion is connected between the first portion and the second portion, the first portion is supported on the first housing, the second portion is supported on the second housing, and the third portion is supported on the rotating shaft mechanism.

In a third aspect, the application provides a heat conducting fin, which comprises a heat conducting layer, a first protective layer and a second protective layer, wherein the first protective layer covers the surface of one side of the heat conducting layer, which is away from a rotating shaft mechanism, and the second protective layer covers the surface of one side of the heat conducting layer, which is towards the rotating shaft mechanism.

The technical effects caused by any implementation manner of the second aspect to the third aspect may refer to the technical effects caused by different implementation manners of the first aspect, which are not described herein.

Drawings

Fig. 1 is a perspective view of a foldable electronic device in an unfolded state according to some embodiments of the present application;

FIG. 2 is a partially exploded view of the foldable electronic device of FIG. 1;

FIG. 3 is a schematic view of the foldable electronic device shown in FIG. 1 in a folded state;

FIG. 4 is a cross-sectional view of the foldable electronic device of FIG. 1 taken along line A-A;

FIG. 5a is a schematic diagram illustrating temperature simulation of a foldable electronic device according to the related art;

FIG. 5b is a schematic diagram illustrating temperature simulation of a foldable electronic device 100 according to another related art;

FIG. 6 is a perspective view of a housing assembly provided in some embodiments of the present application;

FIG. 7 is a schematic view of the assembly of the housing assembly and folding screen of FIG. 6;

FIG. 8 is a perspective view of a housing assembly provided in some embodiments of the present application;

FIG. 9 is an exploded view of the housing assembly of FIG. 8;

FIG. 10 is a perspective view of the spindle mechanism in the housing assembly of FIG. 8;

FIG. 11 is a schematic view of the hinge mechanism of FIG. 10 in a folded state;

FIG. 12 is a schematic diagram illustrating the assembly of the spindle mechanism and the support plate shown in FIG. 10;

FIG. 13 is a cross-sectional view of the assembled schematic of FIG. 12 taken along line B-B;

FIG. 14 is a schematic view of the hinge mechanism and support tab of FIG. 10 in a folded condition;

FIG. 15 is a schematic view of the hinge mechanism of FIG. 13 illustrating a configuration of the first and second door panels rotated relative to each other;

FIG. 16 is a cross-sectional view of the assembled schematic of FIG. 12 taken along line C-C;

FIG. 17 is a partial cross-sectional view of the housing assembly shown in FIG. 8, taken along line D-D;

FIG. 18 is a schematic view of the assembly of the housing assembly and folding screen of FIG. 17;

FIG. 19a is a schematic view of a stacked structure of the heat conductive fins in the housing assembly shown in FIG. 9;

fig. 19b is a schematic view of a laminated structure of a heat conductive sheet in the prior art;

FIG. 20 is a schematic view of the structure of the first wear-resistant layer in the heat conductive sheet shown in FIG. 19 a;

FIG. 21 is a schematic view of a first wear layer according to further embodiments of the present application;

FIG. 22 is a partial cross-sectional view of a housing assembly provided by other embodiments of the present application;

FIG. 23 is a schematic view of the spindle mechanism in the cross-sectional view of FIG. 22;

FIG. 24 is a partial cross-sectional view of a housing assembly provided by further embodiments of the present application;

FIG. 25 is a perspective view of the intermediate door panel of the housing assembly of FIG. 24;

FIG. 26 is a perspective view of a housing assembly according to still further embodiments of the present application;

FIG. 27 is a schematic view of an assembly of the limiting plate and the spindle mechanism of the housing assembly of FIG. 26;

FIG. 28 is an exploded view of the stop plate and spindle mechanism shown in FIG. 27;

FIG. 29 is a perspective view of a support sheet provided by further embodiments of the present application;

FIG. 30 is a schematic diagram illustrating a temperature simulation of the foldable electronic device after the housing assembly shown in FIG. 8 is applied to the foldable electronic device.

Reference numerals:

100. a foldable electronic device;

10. folding screen, 10a, screen, 10b, supporting structure, 11, first part, 12, second part, 13, third part;

20. The shell comprises a shell component, a first shell, a 211, a first middle frame, a 211a, a first fixing surface, a 212, a first back cover, a C1, a first accommodating cavity, a 22, a second shell, a 221, a second middle frame, a 221a, a second fixing surface, a 222, a second back cover and a C2, a second accommodating cavity;

23. 230 parts of rotating shaft mechanism, 230 parts of base, 2301 parts of bottom plate, 2302 parts of side wall board;

231. the first rotating door plate, 2311, a first supporting surface, 2312, a first bottom surface, 2313, a first inner side surface, 2314, a first outer side surface, 231a, a first sinking groove, 231a1, a first bottom wall surface, 231b and a first groove;

232. The second rotating door panel, 2321, a second supporting surface, 2322, a second bottom surface, 2323, a second inner side surface, 2324, a second outer side surface, 232a, a second countersink, 232a1, a second bottom wall surface, 232b, and a second groove;

233. Middle door plate, 2331, third supporting surface, 2332, third bottom surface, 2333, first side wall surface, 2334, second side wall surface, 233a, third sinking groove, 233b, third groove, 233c, mounting groove, 234, limiting plate;

24. the heat conducting fin, 241, the first heat conducting part, 242, the second heat conducting part, 243, the third heat conducting part, 2431, the first section, 2432, the second section, 2433, the third section, 2433a, the arched section, 24a, the heat conducting layer, 24b, the first protective layer, 24c, the second protective layer, 24d, the first wear-resisting layer, 24d1, the first hollowed-out hole, 24e, the second wear-resisting layer, 24f, the first heat conducting layer, 24g, the third protective layer, 24h, the fourth protective layer, 25k and the adhesive layer;

25. Support sheet, 25a, first surface, 25b, second surface, 25c, first side, 25d, second side, 25e, step groove, 251, first support portion, 252, second support portion, 253, third support portion;

31. a main board, 32, a battery, 33, a heating element;

40. a fastener;

60. the device comprises a first bonding structure, 70, a lubricating structure, 80, a containing space, 81, a first containing groove, 82, a second containing groove, 83, a third containing groove and 90, and a buffer material.

Detailed Description

The following description of the technical solutions according to the embodiments of the present application will be given with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.

In embodiments of the present application, the terms "exemplary" or "such as" and the like are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment should not be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

In embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the description of the embodiment of the present application, "and/or" is merely an association relationship describing the association object, and indicates that three relationships may exist, for example, a and/or B may indicate that a exists alone, and a and B exist together, and B exists alone. In the present application, the character "/" generally indicates that the front and rear related objects are an or relationship.

In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" should be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected, or may be directly connected or indirectly connected through an intermediary. Wherein, "fixedly connected" means that the relative positional relationship is unchanged after being connected with each other. "rotationally coupled" means coupled to each other and capable of relative rotation after coupling. "slidingly coupled" means coupled to each other and capable of sliding relative to each other after being coupled. By "drive connection" is meant that movement of one of the two components being connected may be transferred to the other component, the connection between the two components including, but not limited to, at least one of a rotational connection, a sliding connection, a gear engagement drive connection, a sprocket drive connection, a cam mechanism drive connection, and the like.

In the description of embodiments of the application, the terms "oriented in unison", "perpendicular", "parallel", "equal" include the stated cases and cases similar to the stated cases, the range of which is within acceptable deviation ranges as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the range of acceptable deviation of approximately parallel may be, for example, within 5 °, 8 °, or 10 °, and "perpendicular" includes absolute perpendicular and approximately perpendicular, where the range of acceptable deviation of approximately perpendicular may also be, for example, within 5 °, 8 °, or 10 °. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5%, 8%, or 10% of either within an acceptable deviation of approximately equal.

For ease of understanding, prior to a detailed description of the housing assembly and foldable electronic device in the embodiments of the present application, description will be given first of related terms related to the embodiments of the present application.

By thermally conductive connection is meant a connection having heat transfer between two components.

Elongation at break, the ratio of the length of elongation after stretching to the length before stretching is called elongation at break, expressed as a percentage, when an object is pulled out by an external force.

The embodiment of the application provides foldable electronic equipment. Under different use demands, the foldable electronic equipment can be unfolded to an unfolding state, can be folded to a folding state and can be in an intermediate state between the unfolding state and the folding state. That is, the foldable electronic device has at least two states, namely an unfolded state and a folded state. In some cases, a third state, intermediate between the unfolded state and the folded state, may also be further included. It will be appreciated that the intermediate state is not the only state, but may be any state or states of the foldable electronic device between the unfolded state and the folded state.

Specifically, the foldable electronic device may be a User Equipment (UE) or a terminal device (terminal), and the foldable electronic device may be, for example, a tablet (portable android device, PAD), a personal digital assistant (personal DIGITAL ASSISTANT, PDA), a notebook, an electronic reader, a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device (including but not limited to a smart watch, a smart bracelet, and the like), a Virtual Reality (VR) terminal device (e.g., VR glasses, and the like), an augmented reality (augmented reality, AR) terminal device (e.g., glasses, and the like), a wireless terminal in industrial control (industrial control), a wireless terminal in unmanned (SELF DRIVING), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (SMART GRID), a wireless terminal in transportation security (transportation safety), a wireless terminal in smart city (SMART CITY), a wireless terminal in smart home (smart home), and the like. The form of the foldable electronic device in the embodiment of the application is not particularly limited.

Referring to fig. 1-2, fig. 1 is a perspective view of a foldable electronic device 100 in an unfolded state according to some embodiments of the present application, and fig. 2 is a partially exploded structure schematic view of the foldable electronic device 100 shown in fig. 1. The present embodiment and the following embodiments are exemplary descriptions taking the foldable electronic device 100 as a handheld device with a wireless communication function, for example, a mobile phone.

The foldable electronic device 100 is approximately rectangular flat-plate-shaped in the unfolded state. For convenience of description of the embodiments hereinafter, an XYZ coordinate system is established for the foldable electronic device 100 in the unfolded state, the length direction of the foldable electronic device 100 is defined as the X-axis direction, the width direction of the foldable electronic device 100 is defined as the Y-axis direction, and the thickness direction of the foldable electronic device 100 is defined as the Z-axis direction. It is to be understood that the coordinate system of the foldable electronic device 100 may be flexibly set according to actual needs, which is not specifically limited herein. In other embodiments, the shape of the foldable electronic device 100 may also be square planar, circular planar, oval planar, etc.

Referring to fig. 1-2, a foldable electronic device 100 includes a folding screen 10 and a housing assembly 20.

In some embodiments, referring to fig. 2, the folding screen 10 includes a screen 10a and a support structure 10b in a stacked arrangement. The screen 10a is used to display information such as images, videos, and the like. The screen 10a is a flexible screen capable of bending deformation between a folded state and an unfolded state. By way of example, the screen 10a may be an organic light-emitting diode (OLED) screen, a micro-organic light-emitting diode (micro organic light-emitting diode) screen, a quantum dot LIGHT EMITTING diodes (QLED) screen, or the like.

The screen 10a has a display surface for displaying image information, and the display surface of the screen 10a is exposed so as to present information such as images, videos, and the like to a user. The support structure 10b is disposed on a side of the screen 10a facing away from the display surface, and is stacked with the screen 10 a. The support structure 10b is also referred to as a bamboo book for increasing the structural strength of the folding screen 10, while the support structure 10b may be folded along with the screen 10 a. The support structure 10b may be in a sheet shape, and the material of the support structure 10b may be a metal such as stainless steel or titanium alloy, or may be a carbon fiber material. These materials have a certain hardness and a large elastic modulus, and can improve the hardness and bending resilience of the screen 10 a.

Referring to fig. 1 and 2, the folding screen 10 includes a first portion 11, a second portion 12, and a third portion 13. The first portion 11, the second portion 12 and the third portion 13 are each composed of a partial screen 10a and a partial support structure 10b opposite thereto. The third portion 13 is connected between the first portion 11 and the second portion 12.

In the foldable electronic device 100 shown in fig. 1, the folding screen 10 is in an unfolded state, and the first portion 11, the third portion 13, and the second portion 12 are sequentially arranged in the X-axis direction, so that the foldable electronic device 100 can be folded in the longitudinal direction. In other embodiments, the first portion 11, the third portion 13, and the second portion 12 may be sequentially arranged along the Y-axis direction when the folding screen 10 is in the unfolded state. In this way, the foldable electronic device 100 can be folded in the lateral direction. When the folding screen 10 is in the unfolded state, a large screen display can be realized to provide the user with richer information, and bring the user with better use experience.

Referring to fig. 3, fig. 3 is a schematic structural diagram of the foldable electronic device 100 shown in fig. 1 in a folded state, and the folding screen 10 in the foldable electronic device 100 is also in a folded state. Specifically, when the folding screen 10 is in the folded state, the first portion 11 of the folding screen 10 is opposite to the second portion 12, and the third portion 13 is folded. At this time, the third portion 13 may have a drop shape, a U shape, or the like. In this state, the foldable electronic device 100 is small in size and convenient to carry.

It should be noted that, in the embodiment shown in fig. 3, when the foldable electronic device 100 is in the folded state, the housing assembly 20 is protected outside the folding screen 10, and the folding screen 10 is not visible to the user. That is, the foldable electronic device 100 is an in-folding electronic device. In other embodiments, the folding screen 10 may also be located outside of the housing assembly 20 when the foldable electronic device 100 is in the folded state, the folding screen 10 being visible to a user. That is, the foldable electronic device 100 is an out-folding electronic device.

The housing assembly 20 is used to carry the folding screen 10. Referring to fig. 2, the housing assembly 20 includes a first housing 21, a second housing 22, and a rotation shaft mechanism 23. The first housing 21 is adapted to carry the first portion 11 of the folding screen 10. The second housing 22 is adapted to carry the second portion 12 of the folding screen 10. The first housing 21 is rotatable relative to the second housing 22 between an extended position and a collapsed position to switch the housing assembly 20 between the extended and collapsed positions. The hinge mechanism 23 is connected between the first housing 21 and the second housing 22, and is used for carrying the third portion 13 of the folding screen 10. The rotation shaft mechanism 23 is used to achieve relative rotation between the second housing 22 and the first housing 21.

Referring to fig. 2, the length direction of the rotation shaft mechanism 23 is parallel to the Y-axis direction, the width direction is parallel to the X-axis direction, and the thickness direction is parallel to the Z-axis direction. The first housing 21 and the second housing 22 may be located on both sides of the spindle mechanism 23 in the width direction, respectively.

In this embodiment, the housing assembly 20 includes two housings, a first housing 21 and a second housing 22, and the housing assembly 20 can be folded once. It will be appreciated that in other embodiments, the housing assembly 20 may also include three, four, or more housings. That is, the housing assembly 20 may include at least one third housing in addition to the first housing 21 and the second housing 22 described above. In this case, the first housing 21, the second housing 22, and at least one third housing may be connected in sequence, and adjacent two housings may be connected by the rotation shaft mechanism 23. In this way, the housing assembly 20 may be folded multiple times (two or more times).

Referring to fig. 4, fig. 4 is a cross-sectional view of the foldable electronic device 100 shown in fig. 1 taken along line A-A. The first housing 21 may include a first middle frame 211 and a first back cover 212, with the first portion 11 of the folding screen 10 being carried on the first middle frame 211. The first back cover 212 is fixedly connected to a side of the first middle frame 211 away from the first portion 11, and the first back cover 212 may be replaced with a display screen (such as an LCD display screen). The first housing 21 may be connected to the rotation shaft mechanism 23 via the first middle frame 211 or the first back cover 212. A first accommodating cavity C1 is formed between the first middle frame 211 and the first back cover 212, and the first accommodating cavity C1 may be used for accommodating functional devices such as the motherboard 31 and the camera module.

The second housing 22 may include a second middle frame 221 and a second back cover 222, with the second portion 12 of the folding screen 10 being carried on the second middle frame 221. The second back cover 222 is fixedly connected to a side of the second middle frame 221 away from the second portion 12, and the second back cover 222 may be replaced with a display screen (such as an LCD display screen). The second housing 22 may be connected to the rotation shaft mechanism 23 by means of a second middle frame 221 or a second back cover 222. A second accommodating cavity C2 is formed between the second middle frame 221 and the second back cover 222. The second receiving chamber C2 may be used to receive functional devices such as speaker modules, arrays, batteries 32, etc.

Referring to fig. 4, the foldable electronic device 100 further includes a heat generating element 33. The heating element 33 is a component or a module composed of a plurality of components that generate heat. By way of example, the heating element 33 may be a System On Chip (SOC), a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), or the like. The heating element 33 may be disposed on the main board 31.

In some embodiments, the heat generating element 33 (e.g., SOC chip) may be disposed in one of the first housing 21 and the second housing 22 as a primary heat generating source of the foldable electronic device 100. This results in the temperature of the housing provided with the heating element 33 being greater than the temperature of the other housing not provided with the heating element 33. For example, in the present embodiment, the heating element 33 is provided in the first housing 21, in which case the temperature of the first housing 21 is greater than the temperature of the second housing 22.

The heat dissipation problems and challenges faced by the current foldable electronic device 100 include the following:

In the first aspect, as technology advances, the thickness of the foldable electronic device 100 is designed to be thinner, in which case the thermal resistance in the thickness direction (for example, the Z-axis direction in fig. 4) of the foldable electronic device 100 is smaller, and the heat generated by the heat generating element 33 more easily reaches the surface of the foldable electronic device 100, resulting in local hot spots. In the second aspect, since the hinge mechanism 23 of the foldable electronic device 100 is designed with a large number of parts and air gaps, the thermal resistance is large, and the heat conduction path between the first case 21 and the second case 22 is blocked at the hinge mechanism 23, deteriorating the soaking capability of the foldable electronic device 100. In the third aspect, the conventional heat dissipation auxiliary materials have a limited application scenario, in which a Vacuum Chamber (VC) soaking board commonly used in electronic devices cannot span the rotating shaft mechanism 23 of the foldable electronic device 100, and only a single-side housing (such as the first housing 21) can be soaked by the VC soaking board, so that a housing (such as the second housing 22) with a lower temperature at the other side cannot be effectively utilized for soaking. In addition, as the thickness of the foldable electronic device 100 is reduced, the heat dissipation space inside the foldable electronic device 100 is compressed to a limited extent, and heat dissipation and soaking cannot be performed using a heat dissipation material having a large size and a high thickness.

In this way, the temperature difference between the first housing 21 and the second housing 22 is larger, which affects the thermal experience of the user, and the color difference between the first portion 11 and the second portion 12 of the folding screen 10 is larger, which affects the display effect of the foldable electronic device 100.

Referring to fig. 5a, fig. 5a is a schematic diagram illustrating temperature simulation of a foldable electronic device 100 in the related art. In the foldable electronic device 100, the heating element 33 is disposed in the first housing 21, and the heat conducting structure is not disposed in the foldable electronic device 100. As can be seen in fig. 5a, the foldable electronic device 100 presents a thermal fault at the hinge mechanism 23. Wherein the maximum temperature on the first housing 21 is 49.6999 ℃ and the maximum temperature on the second housing 22 is 37.6622 ℃. The temperature difference between the highest temperature of the first housing 21 and the highest temperature of the second housing 22 is as high as 12.0377 ℃, affecting the user experience.

Referring to fig. 5b, fig. 5b is a schematic diagram illustrating temperature simulation of a foldable electronic device 100 according to another related art. The foldable electronic device 100 in the present embodiment is different from the foldable electronic device 100 in fig. 5a in that in the present embodiment, the first housing 21 includes a first heat conducting structure, and the second housing 22 is provided with a second heat conducting structure, and the first heat conducting structure and the second heat conducting structure are independent from each other. In this way, the first housing 21 can be cooled by the first heat conductive structure, and the second housing 22 can be cooled by the second heat conductive structure.

As can be seen in fig. 5b, the foldable electronic device 100 still presents a thermal fault at the hinge mechanism 23. Wherein the maximum temperature on the first housing 21 is 42.9107 ℃. The maximum temperature on the second housing 22 is 29.6342 ℃. The temperature difference between the highest temperature of the first housing 21 and the highest temperature of the second housing 22 is 11.2728 ℃.

In order to improve the soaking performance of the foldable electronic device 100 and further improve the temperature of the foldable electronic device 100, refer to fig. 6-7, fig. 6 is a perspective view of the housing assembly 20 according to some embodiments of the present application, and fig. 7 is an assembly schematic diagram of the housing assembly 20 and the folding screen 10 shown in fig. 6. The housing assembly 20 of the foldable electronic device 100 includes a heat conductive sheet 24 in addition to the first housing 21, the second housing 22, and the rotation shaft mechanism 23.

Referring to fig. 6 to 7, the heat conductive sheet 24 includes a first heat conductive portion 241, a second heat conductive portion 242, and a third heat conductive portion 243. The third heat conductive portion 243 is connected between the first heat conductive portion 241 and the second heat conductive portion 242. The first heat conducting portion 241 is thermally connected to the third heat conducting portion 243, and the second heat conducting portion 242 is thermally connected to the third heat conducting portion 243. In this way, heat transfer between the first heat conductive portion 241 and the second heat conductive portion 242 can be achieved by the third heat conductive portion 243.

Specifically, there are various ways of implementing the heat conduction connection between the first heat conduction portion 241 and the third heat conduction portion 243, for example, the first heat conduction portion 241 and the third heat conduction portion 243 may be directly connected, or the first heat conduction portion 241 and the third heat conduction portion 243 may be indirectly connected through other heat conduction structures. The connection between the second and third heat conductive parts 242 and 243 may be the same as the connection between the first and second heat conductive parts 241 and 242.

In some embodiments, the first heat conductive portion 241, the third heat conductive portion 243, and the second heat conductive portion 242 are integrally formed structures. That is, the heat conductive sheet 24 is an integrally molded piece. In this way, the heat transfer between the first heat conduction portion 241 and the second heat conduction portion 242 is achieved, and the connection strength between the first heat conduction portion 241 and the third heat conduction portion 243 and the connection strength between the third heat conduction portion 243 and the second heat conduction portion 242 can be improved, so that the assembling process of the heat conduction sheet 24 can be simplified.

It is to be understood that in other embodiments, the first heat conducting portion 241 and the third heat conducting portion 243 may be configured as a single molded structure, or the second heat conducting portion 242 and the third heat conducting portion 243 may be configured as an integrally molded structure, or the first heat conducting portion 241, the second heat conducting portion 242, and the third heat conducting portion 243 may be configured as separate members.

Referring to fig. 7, the first heat conducting portion 241 is located at a side of the first housing 21 facing the folding screen 10. The first heat conduction portion 241 is thermally conductively connected to the first housing 21. Specifically, the first heat conducting portion 241 may be fixedly connected to the first housing 21, and illustratively, the first heat conducting portion 241 may be fixedly connected to the first housing 21 by means of gluing, clamping, screw connection, or the like. In this way, heat transfer between the first housing 21 and the first heat conduction portion 241 can be achieved.

The second heat conducting portion 242 is located at a side of the second housing 22 facing the folding screen 10. The second heat conducting portion 242 is in heat conducting connection with the second housing 22. In this way, heat transfer between the second housing 22 and the second heat conduction portion 242 can be achieved.

The second heat conductive part 242 may be connected to the second case 22 in the same manner as the first case 21 is connected to the first case 21.

In some embodiments, referring to fig. 6, the first housing 21 has a first fixing surface 211a, and the first fixing surface 211a is formed on a side surface of the first middle frame 211 facing away from the first back cover 212. The second housing 22 has a second fixing surface 221a. The second fixing surface 221a is formed on a side surface of the second middle frame 221 facing away from the second back cover 222. The first heat conductive portion 241 may be fixedly connected to the first fixing surface 211a, and the second heat conductive portion 242 may be fixedly connected to the second fixing surface 221a.

Referring to fig. 6, the third heat conducting portion 243 is disposed opposite to the rotating shaft mechanism 23. The third heat conductive portion 243 can be bent along with the folding screen 10. At least the third heat conductive portion 243 of the heat conductive sheet 24 is made of a flexible material. The first and second heat conductive portions 241 and 242 may be made of a flexible material, may be made of a rigid material, or may be made of a flexible material, and are not particularly limited herein. In this way, when the first housing 21 rotates relative to the second housing 22 between the extended position and the folded position, the third heat conductive portion 243 can be folded in accordance with the relative rotation between the first housing 21 and the second housing 22. Thereby, the folding performance of the foldable electronic device 100 can be ensured, enabling the foldable electronic device 100 to be switched between the unfolded state and the folded state.

Referring to fig. 7, the third heat conducting portion 243 is disposed between the third portion 13 of the folding screen 10 and the rotating shaft mechanism 23. That is, the third heat conduction portion 243 is provided across the rotation shaft mechanism 23. In this way, the third heat conducting portion 243 can be prevented from occupying the internal space of the hinge mechanism 23, which is advantageous for reducing the thickness of the hinge mechanism 23 and the thickness of the foldable electronic device 100, and for realizing a slim design of the foldable electronic device 100.

In this embodiment, the heat on the first housing 21 can be transferred to the first heat conductive portion 241 of the heat conductive sheet 24 and transferred to the second heat conductive portion 242 via the third heat conductive portion 243. In this way, the heat transfer between the first casing 21 and the second casing 22 can be achieved through the heat conducting sheet 24, so that the soaking capability of the foldable electronic device 100 can be improved, the temperature difference between the first casing 21 and the second casing 22 can be reduced, the local overhigh temperature of the first casing 21 or the second casing 22 can be avoided, the local hot spot of the foldable electronic device 100 can be avoided, the color difference between the first part 11 and the second part 12 of the folding screen 10 can be reduced, the display effect of the foldable electronic device 100 can be improved, and the user experience can be improved.

In some embodiments, in order to reduce the bending stress of the heat conducting fin 24, the third heat conducting portion 243 is not generally fixed relative to the rotating shaft mechanism 23. In this way, when the foldable electronic device 100 is in the folded state or the foldable electronic device 100 is switched between the unfolded state and the folded state, the stress to which the third heat conducting portion 243 is subjected can be reduced, which is beneficial to reducing the risk of breakage, faults, etc. of the third heat conducting portion 243, and the requirement for the breaking stretch rate of the heat conducting sheet 24 can be reduced, which is beneficial to reducing the cost of the heat conducting sheet 24.

In the foldable electronic device 100 and the housing assembly 20 in this embodiment, only the heat conducting strip 24 is required to be fixedly connected to the first housing 21 and the second housing 22, and the heat conducting strip 24 is not required to be fixedly connected to the rotating shaft mechanism 23, so that the assembly is simple, the part of the heat conducting strip 24 (namely, the third heat conducting part 243) which is spanned on the rotating shaft mechanism 23 is used as a stretching region in the bending process of the housing assembly 20, the stress applied to the heat conducting strip 24 in the bending process is small, and the requirement on the breaking elongation of the heat conducting strip 24 can be reduced.

However, the foldable electronic device 100 and the housing assembly 20 in this embodiment also have the disadvantages that, because the third heat conducting portion 243 of the heat conducting strip 24 is not fixed to the rotating shaft mechanism 23, when the foldable electronic device 100 is folded between the unfolded state and the folded state, the third heat conducting portion 243 is easy to contact with the third portion 13 of the folded screen 10, there is a risk of top screen, and after repeated bending, the third heat conducting portion 243 has poor flatness, and the third portion 13 of the folded screen 10 cannot be effectively supported by the third heat conducting portion 243, which is detrimental to optimizing the crease of the folded screen 10. In addition, in order to avoid the occurrence of the arching phenomenon after the third portion 13 of the folding screen 10 is bent multiple times, in some designs, the third portion 13 of the folding screen 10 is fixed with the hinge mechanism 23 by dispensing. On the basis, in order to ensure the bending performance of the third heat conduction part 243, the dispensing position between the folding screen 10 and the rotating shaft mechanism 23 is spaced from the third heat conduction part 243. In this way, the dimension of the third heat conducting portion 243 in the length direction (i.e., the Y-axis direction in fig. 6) of the hinge mechanism 23 is affected by the dispensing position, and the gaps between the components of the hinge mechanism 23 cannot be covered by the heat conducting sheet 24, so that the portion of the folding screen 10 opposite to the gaps cannot be effectively supported, further affecting the screen light and shadow, and making the folding screen 10 easy to have folds, resulting in a low user experience of the foldable electronic device 100.

In order to achieve both the soaking performance of the foldable electronic device 100 and the folding of the folding screen 10, please refer to fig. 8-9, fig. 8 is a perspective view of the housing assembly 20 according to some embodiments of the present application, and fig. 9 is an exploded view of the housing assembly 20 shown in fig. 8. The housing assembly 20 includes a support sheet 25 in addition to the first housing 21, the second housing 22, the rotation shaft mechanism 23, and the heat conductive sheet 24.

The support sheet 25 is sheet-shaped. Referring to fig. 9, the support sheet 25 includes opposite first and second surfaces 25a and 25b. Wherein the first surface 25a faces away from the spindle means 23 and the second surface 25b faces towards the spindle means 23. Specifically, when the rotation shaft mechanism 23 is in the unfolded state, the support sheet 25 is stacked on the rotation shaft mechanism 23, and the third portion 13 of the folding screen 10 may be supported on the first surface 25a of the support sheet 25. That is, the support sheet 25 is located between the folding screen 10 and the third heat conductive portion 243.

In this way, the third portion 13 of the folding screen 10 and the third heat conducting portion 243 of the heat conducting sheet 24 can be separated by the supporting sheet 25, so that the third heat conducting portion 243 of the heat conducting sheet 24 is prevented from directly contacting the third portion 13 of the folding screen 10, and further, the third heat conducting portion 243 is prevented from being propped against the screen during the folding process of the foldable electronic device 100, and the reliability of the folding screen 10 can be improved. Meanwhile, when the foldable electronic device 100 is in the unfolded state, the third portion 13 of the folding screen 10 can be effectively supported by the first surface 25a of the supporting sheet 25, so that the flatness of the folding screen 10 in the unfolded state can be improved, the screen light and shadow can be reduced, and the crease of the folding screen 10 can be optimized.

The specific structure of the housing assembly 20 in the embodiment of the present application will be described in detail.

Referring to fig. 10, fig. 10 is a perspective view of the rotating shaft mechanism 23 in the housing assembly 20 shown in fig. 8. The rotation shaft mechanism 23 shown in fig. 10 is in a deployed state. The rotation shaft mechanism 23 includes a base 230, a first rotation door panel 231, a second rotation door panel 232, and a middle door panel 233. It will be appreciated that fig. 10 schematically illustrates some components included in the spindle mechanism 23, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 10. For example, in other embodiments, the spindle mechanism 23 may not include the intermediate door panel 233. As another example, in still other embodiments, the spindle mechanism may further include a plurality of intermediate door panels 233.

Base 230 includes a floor 2301 and side gussets 2302. Side gusset 2302 surrounds the outer edge of bottom panel 2301, and side gusset 2302 and bottom panel 2301 define a receiving space therebetween. At least part of the components of the spindle mechanism 23 are accommodated in the accommodation space. In this way, the components of the rotating shaft mechanism 23 can be hidden inside the base 230, and the appearance of the folding screen 10 can be improved.

The first and second rotating door panels 231 and 232 are rotatably coupled to opposite sides of the base 230, respectively, to support the rotating shaft mechanism 23 to be switched between the unfolded state and the folded state. Specifically, referring to fig. 10, a first rotating door plate 231 is rotatably connected to one side of the base 230 in the width direction (X-axis direction in fig. 10), and a second rotating door plate 232 is rotatably connected to the other side of the base 230 in the width direction. The first and second rotating door panels 231 and 232 may be rotatably connected to the base 230 through a rotation shaft, a swing arm, a hinge, etc., which is not particularly limited in the embodiment of the present application.

Referring to fig. 10, an intermediate door panel 233 is disposed on the base 230 and between the first and second door panels 231 and 232. Both the first and second rotating door panels 231 and 232 are rotatable relative to the intermediate door panel 233.

Referring to fig. 9, the first housing 21 may be connected to a first rotating door plate 231. For example, the first housing 21 may be connected with the first rotating door panel 231 by means of the first middle frame 211. In some embodiments, the first housing 21 may be fixedly coupled to the first rotating door panel 231, or the first housing 21 may be slidably coupled to the first rotating door panel 231. The second housing 22 is connected to a second swing door 232. The connection between the second housing 22 and the second swing door 232 may be designed with reference to the connection between the first housing 21 and the first swing door 231. In this way, when the first housing 21 rotates between the extended position and the folded position, the first rotating door plate 231 can be driven to rotate relative to the base 230, and when the second housing 22 rotates between the extended position and the folded position, the second rotating door plate 232 can be driven to rotate relative to the base 230, so that the foldable electronic device 100 can be switched between the extended state and the folded state.

Referring to fig. 10, the first rotary door panel 231, the second rotary door panel 232, and the intermediate door panel 233 are each plate-shaped. The first swing door panel 231 includes a first support surface 2311, and the first swing door panel 231 may support a portion of the support sheet 25 by means of the first support surface 2311. The second swing door 232 includes a second support surface 2321, and the second swing door 232 may support a portion of the support sheet 25 via the second support surface 2321. The intermediate door panel 233 includes a third support surface 2331 by means of which the intermediate door panel 233 can support a portion of the support flap 25.

The rotation shaft mechanism 23 shown in fig. 10 is in an unfolded state, in which the first support surface 2311, the second support surface 2321 and the third support surface 2331 are oriented in the same direction, and the first support surface 2311, the second support surface 2321 and the third support surface 2331 are disposed substantially coplanar. That is, the angle between the first supporting surface 2311 and the third supporting surface 2331 is approximately 180 °, and the angle between the second supporting surface 2321 and the third supporting surface 2331 is also approximately 180 °. In this way, the supporting pieces 25 supported on the first supporting surface 2311, the second supporting surface 2321 and the third supporting surface 2331 can be in a flattened state, so that the flatness of the third portion 13 of the folding screen 10 can be ensured when the foldable electronic device 100 is in the unfolded state, which is beneficial to reducing the crease of the folding screen 10.

It will be appreciated that when the hinge mechanism 23 is in the extended state, the housing assembly 20 and the foldable electronic device 100 including the housing assembly 20 are also in the extended state, and the angle between the first housing 21 and the second housing 22 is substantially 180 ° and the angle between the first portion 11 and the second portion 12 of the folding screen 10 is also substantially 180 °.

With continued reference to fig. 10, the first rotating door panel 231 includes a first inner side 2313 and a first outer side 2314 opposite to each other, and the first inner side 2313 faces the second rotating door panel 232 when the rotating mechanism 23 is in the unfolded state. The first rotating door panel 231 further includes a first bottom surface 2312 opposite to the first supporting surface 2311, and the first supporting surface 2311 is provided with a first sinking groove 231a recessed toward the first bottom surface 2312, where the first sinking groove 231a is used to accommodate a portion of the third heat conducting portion 243.

The second swing door 232 includes a second opposite inner side 2323 and a second outer side 2324, the second inner side 2323 facing the first swing door 231 when the swing mechanism 23 is in the deployed state. The second swing door 232 further includes a second bottom surface 2322 opposite to the second supporting surface 2321, and the first supporting surface 2311 is provided with a second countersink 232a recessed toward the second bottom surface 2322, where the second countersink 232a is configured to receive a portion of the third heat conducting portion 243.

The intermediate door panel 233 includes opposing first and second side walls 2333, 2334, the first side wall 2333 facing the first swing door panel 231 and the second side wall 2334 facing the second swing door panel 232 when the swing mechanism 23 is in the extended state. The intermediate door panel 233 also includes a third bottom surface 2332 opposite the third support surface 2331. The third supporting surface 2331 is provided with a third sinking groove 233a recessed toward the third bottom surface 2332, and the third sinking groove 233a is used for accommodating a part of the third heat conducting portion 243.

In some embodiments, referring to fig. 10, when the rotating shaft mechanism 23 is in the unfolded state, a first gap K1 is formed between the middle door panel 233 and the first rotating door panel 231, and a second gap K2 is formed between the middle door panel 233 and the second rotating door panel 232. In this way, when the first rotating door plate 231 and the second rotating door plate 232 rotate between the unfolding position and the folding position, collision, friction and even jamming between the first rotating door plate 231 and the middle door plate 233 and between the second rotating door plate 232 and the middle door plate 233 can be avoided, and the reliability of the rotating shaft mechanism 23 can be improved.

Referring to fig. 11, fig. 11 is a schematic view of the hinge mechanism 23 shown in fig. 10 in a folded state. The hinge mechanism 23 may define a bent shape of the third portion 13 of the folding screen 10 by the first swing door panel 231, the intermediate door panel 233, and the second swing door panel 232 when in the folded state. Specifically, as shown in fig. 11, the first swing door panel 231 and the second swing door panel 232 are in the folded position, the first support surface 2311 is disposed opposite to the second support surface 2321, and the first support surface 2311 and the second support surface 2321 are disposed obliquely or vertically with respect to the third support surface 2331. Wherein, the first supporting surface 2311 and the second supporting surface 2321 are disposed opposite to each other, which means that the first supporting surface 2311 and the second supporting surface 2321 face each other, so that the third portion 13 of the folding screen 10 disposed opposite to the rotating shaft mechanism 23 is also in a folded state.

It will be appreciated that when the hinge mechanism 23 is in the folded state, the housing assembly 20 including the hinge mechanism 23 and the foldable electronic device 100 including the housing assembly 20 are also in the folded state, and the angle between the first housing 21 and the second housing 22 is substantially 0 °, and the angle between the first portion 11 of the folding screen 10 and the second portion 12 of the folding screen 10 is also substantially 0 °.

In some embodiments, referring to fig. 11, the first and second rotating door panels 231 and 232 rotate from the unfolded position to the folded position by respective angles θ1 and θ2, and in the embodiment shown in fig. 11, the angles of rotation θ1 and θ2 are each greater than 90 °. In this way, the third portion 13 of the folding screen 10 can be folded into a drop shape. In other embodiments, the rotation angles θ1 and θ2 may be less than or equal to 90 ° to fold the third portion 13 of the folding screen 10 into other shapes, which is not particularly limited in the embodiment of the present application.

The first rotating door plate 231 and the middle door plate 233, and the second rotating door plate 232 and the middle door plate 233 may be directly and rotatably connected by means of a rotating shaft, may be rotatably connected by means of a middle transmission mechanism such as a hinge mechanism and a four-bar mechanism, and may be rotatably connected by means of soft materials such as leather and cloth, which are not particularly limited herein.

Referring to fig. 12, fig. 12 is an assembly schematic diagram of the rotating shaft mechanism 23 and the supporting plate 25 shown in fig. 10. When the rotation shaft mechanism 23 is in the unfolded state, the support sheet 25 is stacked on the first support surface 2311, the second support surface 2321 and the third support surface 2331. That is, the supporting sheet 25 is tiled on the first supporting surface 2311, the second supporting surface 2321 and the third supporting surface 2331. The first surface 25a of the support sheet 25 is substantially parallel to the first support surface 2311, the second support surface 2321 and the third support surface 2331. In this way, the supporting sheet 25 can be kept flat when the rotating shaft mechanism 23 is in the unfolded state, so that the flatness of the third portion 13 of the folding screen 10 in the unfolded state can be improved, the screen light shadow can be reduced, and the crease of the folding screen 10 can be optimized.

Specifically, referring to fig. 13, fig. 13 is a cross-sectional view of the assembly schematic shown in fig. 12 taken along line B-B. The support piece 25 may be supported on the rotation shaft mechanism 23 by means of the second surface 25 b. Specifically, when the rotation shaft mechanism 23 is in the unfolded state, a part of the support piece 25 is opposite to the first space K1, and a part of the support piece 25 is opposite to the second space K2. Thus, when the rotation shaft mechanism 23 is in the unfolded state, the supporting piece 25 can span the first gap K1 and the second gap K2. That is, when the rotation shaft mechanism 23 is in the unfolded state, the supporting piece 25 can cover the first space K1 and the second space K2. Therefore, when the shell assembly 20 is applied to the foldable electronic device 100, the rotating shaft mechanism 23 can support the part, opposite to the first gap K1 and the second gap K2, of the folding screen 10 by means of the supporting sheet 25, so that the supporting performance of the rotating shaft mechanism 23 can be improved, the shock resistance of the folding screen 10 can be improved, broken bright spots on the folding screen 10 can be avoided, the flatness of the folding screen 10 in an unfolding state can be improved, the screen light shadow can be reduced, and folds of the folding screen 10 in the folding process can be reduced.

Specifically, referring to fig. 13, the support sheet 25 includes a first support portion 251, a second support portion 252, and a third support portion 253, and the third support portion 253 is connected between the first support portion 251 and the second support portion 252. When the rotation shaft mechanism 23 is in the unfolded state, the first support portion 251 is disposed opposite to the first rotation door plate 231, and the second support portion 252 is disposed opposite to the second rotation door plate 232. A portion of the third support portion 253 covers the first space K1, a portion of the third support portion 253 covers the second space K2, and a portion of the third support portion 253 is disposed opposite to the intermediate door panel 233.

Referring to fig. 14, fig. 14 is a schematic view of the rotating shaft mechanism 23 and the supporting plate 25 shown in fig. 10 in a folded state. When the rotation shaft mechanism 23 is in the folded state, the supporting piece 25 is folded. In this way, when the first and second rotating door panels 231 and 232 rotate between the unfolded position and the folded position with respect to the base 230, the supporting sheet 25 can be folded along with the folding screen 10, avoiding the supporting sheet 25 from affecting the folding effect of the folding screen 10.

To facilitate bending of the support tab 25 with the folding screen 10, in some embodiments, the support tab 25 is at least partially slidable relative to the hinge mechanism 23 when the housing assembly 20 is switched between the unfolded state and the folded state.

In some embodiments, referring to fig. 13 and 14, the first support portion 251 is connected to the first rotating door panel 231. The first support portion 251 may be fixedly coupled to the first swing door panel 231 by means of the first adhesive structure 60. The first adhesive structure 60 includes, but is not limited to, double sided adhesive, hot melt adhesive, and the like. The first bonding structures 60 may be disposed at opposite sides of the first sink 231 a. In this way, the connection area between the support piece 25 and the first swing door panel 231 can be increased, and the connection reliability between the support piece 25 and the first swing door panel 231 can be improved.

It will be appreciated that, in other embodiments, the first supporting portion 251 may be fixedly connected to the first rotating door plate 231 by a screw, a buckle, or the like, or the first supporting portion 251 may be rotatably connected to the first rotating door plate 231 by a rotating shaft, a flexible structure, or the like, which is not limited herein. The second support portion 252 is slidably coupled to the second swing door 232. That is, the second support portion 252 can slide relative to the second swing door panel 232 when the swing mechanism 23 is folded between the unfolded state and the folded state.

Referring to fig. 15, fig. 15 is a schematic view illustrating a structure of the rotating shaft mechanism 23 shown in fig. 13 when the first rotating door plate 231 and the second rotating door plate 232 rotate relatively. When the rotation shaft mechanism 23 rotates from the unfolded state to the folded state in the r1 direction, the second support portion 252 of the support piece 25 contacts the second rotation door panel 232 and slides in the direction e1 with respect to the second rotation door panel 232. When the rotation shaft mechanism 23 rotates from the folded state to the unfolded state in the r2 direction, the second support portion 252 of the support piece 25 contacts the second rotation door panel 232 and slides in the direction e2 with respect to the second rotation door panel 232. Thus, when the rotation shaft mechanism 23 is folded between the unfolded state and the folded state, the supporting sheet 25 can adapt to the gap variation between the first rotation door plate 231 and the second rotation door plate 232, the stress received by the folding screen 10 can be reduced, and the flatness of the supporting sheet 25 can be ensured, and further, when the third portion 13 of the folding screen 10 is supported on the supporting sheet 25, the flatness of the third portion 13 can be improved.

On this basis, in order to improve the wear resistance of the housing assembly 20 and reduce noise generated by scraping the supporting piece 25 against the second supporting surface 2321 during the folding process of the rotating shaft mechanism 23, referring to fig. 13 to 15, the rotating shaft mechanism 23 further includes a lubrication structure 70. The lubrication structure 70 is provided at least between the support plate 25 and the rotation shaft mechanism 23. Specifically, the lubrication structure 70 may be disposed between the second support portion 252 and the second support surface 2321, and between the third support portion 253 and the third support surface 2331.

In some embodiments, the lubrication structure 70 may be a surface slip structure, with the coefficient of friction of the lubrication structure 70 being less than the coefficient of friction of the second support surface 2321. Specifically, the lubrication structure 70 may be a type of structure having a surface friction coefficient of less than 0.25. Illustratively, the lubrication structure 70 may have a surface coefficient of friction of 0.24, 0.23, 0.2, 0.1, 0.05, 0.02, or 0.01, etc. On this basis, the material of the lubrication structure 70 includes, but is not limited to, a compound containing fluorine element, and the material of the lubrication structure 70 is exemplified by polytetrafluoroethylene (may also be referred to as teflon). In other embodiments, the material of the lubrication structure 70 may also be Polyoxymethylene (POM). In still other embodiments, the lubrication 70 may also be a Mylar. In this way, the friction coefficient between the supporting piece 25 and the second supporting surface 2321 can be reduced, the wear resistance of the housing assembly 20 can be improved, and the noise generated by scraping between the supporting piece 25 and the rotating shaft mechanism 23 can be reduced, so that the user experience of the foldable electronic device 100 can be improved.

There are various positions in which the lubrication structure 70 is provided. In some embodiments, referring to fig. 13-15, the lubrication structure 70 is disposed on the second supporting surface 2321. The lubrication structure 70 may be provided on a part of the surface of the second support surface 2321, or may be provided on the entire surface of the second support surface 2321. For example, the lubrication structure 70 may be formed on the second supporting surface 2321 by spraying, curtain coating, electrochemical deposition, electroplating, or the like, or the lubrication structure 70 may be adhered to the second supporting surface 2321, which is not limited herein.

In other embodiments, the lubrication structure 70 may also be disposed on the second surface 25b of the support sheet 25. Specifically, the lubrication structure 70 may be disposed on the second surface 25b of the support sheet 25 corresponding to the second support portion 252. The lubrication structure 70 may be disposed at a partial region of the second surface 25b corresponding to the second support portion 252, or may be disposed at an entire region of the second surface 25b corresponding to the second support portion 252. Further, the lubrication structure 70 may be provided in other areas of the second surface 25b in addition to the second surface 25b corresponding to the second support portion 252. In this way, the wear resistance of the housing assembly 20 can be further improved, and the noise generated by the rotation shaft mechanism 23 during folding can be further reduced.

In other embodiments, the lubrication structure 70 may also be provided on the second support surface 2321 at the same time as the lubrication structure 70 is provided on the second surface 25b of the support sheet 25.

In the embodiment shown in fig. 13, one end of the supporting piece 25 is fixed with respect to the rotation shaft mechanism 23, and the other end is slidably connected with the rotation shaft mechanism 23. In other embodiments, the middle portion of the supporting plate 25 may be fixed to the rotating shaft mechanism 23, and both ends of the supporting plate 25 are slidably connected to the rotating shaft mechanism 23. For example, the third support portion 253 of the support sheet 25 may be fixedly coupled to the intermediate door panel 233, the first support portion 251 is slidably coupled to the first swing door panel 231, and the second support portion 252 is slidably coupled to the second swing door panel 232. Of course, in other embodiments, both ends of the supporting plate 25 may be fixedly connected to the rotating shaft mechanism 23.

In the embodiment shown in fig. 13, the number of the support pieces 25 is one, and in other embodiments, the number of the support pieces 25 may be two. At this time, the first space K1 may be covered by one of the support pieces 25, and the second space K2 may be covered by the other support piece 25. In this case, one end of one of the support pieces 25 may be fixedly coupled to the first rotation door panel 231, and the other end is slidably coupled to the middle door panel 233. One end of the other support piece 25 may be fixedly connected to the second swing door panel 232, and the other end is slidably connected to the middle door panel 233. So long as it is ensured that at least part of the support sheet 25 can slide relative to the hinge mechanism 23 when the hinge mechanism 23 is folded directly in the unfolded state and the folded state.

Referring to fig. 16, fig. 16 is a cross-sectional view of the assembled schematic of fig. 12 taken along line C-C. The supporting plate 25 and the rotating shaft mechanism 23 define a containing space 80 therebetween. The accommodating space 80 is for accommodating at least part of the structure of the third heat conductive portion 243 of the heat conductive sheet 24. In other words, at least part of the third heat conductive portion 243 may be located within the accommodating space 80. In this embodiment, the supporting plate 25 defines the accommodating space 80 with the first rotating door plate 231, the second rotating door plate 232, and the middle door plate 233.

Specifically, referring to fig. 16, a first accommodating groove 81 is defined between the first sink 231a and the supporting plate 25, a second accommodating groove 82 is defined between the second sink 232a and the supporting plate 25, and a third accommodating groove 83 is defined between the third sink 233a and the supporting plate 25. The receiving space 80 may include the first, second and third receiving grooves 81, 82 and 83 described above. In this way, the contact area between the rotating shaft mechanism 23 and the supporting piece 25 can be ensured, and the overlapped dimensions of the rotating shaft mechanism 23, the third heat conducting portion 243 and the supporting piece 25 in the thickness direction of the rotating shaft mechanism 23 can be reduced, which is beneficial to reducing the overall thickness of the housing assembly 20, and further is beneficial to realizing the thin design of the foldable electronic device 100.

Referring to fig. 17, fig. 17 is a partial cross-sectional view of the housing assembly shown in fig. 8 taken along line D-D. The third heat conductive portion 243 includes a first section 2431, a second section 2432, and a third section 2433. Third section 2433 is connected between first section 2431 and second section 2432. The third heat conductive portion 243 may be connected with the first heat conductive portion 241 by the first section 2431 and with the second heat conductive portion 242 by the second section 2432. The first section 2431 of the third heat conducting part 243 is located in the first accommodating groove 81, the second section 2432 is located in the second accommodating groove 82, and the third section 2433 is located in the third accommodating groove 83.

In some embodiments, referring to fig. 17, in order to reduce scratch between the support sheet 25 and the third heat conductive portion 243, the support sheet 25 is disposed spaced apart from the third heat conductive portion 243.

Referring to fig. 18, fig. 18 is a schematic view illustrating the assembly of the housing assembly 20 and the folding screen 10 shown in fig. 17. The support sheet 25 is located between the third portion 13 of the folded screen 10 and the third heat conductive portion 243 of the heat conductive sheet 24. The third portion 13 of the folding screen 10 is supported on the first surface 25a of the support sheet 25. In this way, the housing assembly 20 can separate the third portion 13 of the folding screen 10 from the third heat conducting portion 243 of the heat conducting sheet 24 by means of the supporting sheet 25, so as to avoid the third heat conducting portion 243 of the heat conducting sheet 24 from directly contacting the third portion 13 of the folding screen 10, and further avoid the third heat conducting portion 243 from propping against the screen during the folding process of the foldable electronic device 100, thereby improving the reliability of the folding screen 10. Meanwhile, when the foldable electronic device 100 is in the unfolded state, the third portion 13 of the folding screen 10 can be effectively supported by the first surface 25a of the supporting sheet 25, so that the flatness of the folding screen 10 in the unfolded state can be improved, the screen light and shadow can be reduced, and the screen crease can be optimized.

In some embodiments, referring to fig. 18, when the foldable electronic device 100 is in the unfolded state, the third portion 13 of the folding screen 10 is attached to the first surface 25a of the supporting sheet 25. In this way, the flatness of the folding screen 10 in the unfolded state can be further improved, and the folds of the screen 10a can be further optimized.

On the basis of any of the above embodiments, in order to secure the supporting strength and the supporting performance of the supporting sheet 25. The elastic modulus of the support sheet 25 is greater than that of the third heat conductive portion 243.

In some embodiments, the material of the support sheet 25 includes, but is not limited to, metals such as steel, titanium alloys, and composites containing fibrous materials such as fiberglass, carbon fibers, aramid fibers, and the like. The support sheet 25 is illustratively a metal sheet or a carbon fiber sheet. Wherein, the steel is iron-carbon alloy with carbon content of 0.02 to 2.11 percent by mass. The materials have large elastic modulus and better structural strength, and are beneficial to reducing the thickness of the supporting sheet 25 while ensuring the supporting strength of the supporting sheet 25 so as to facilitate the thinning of the folding screen 10 equipment. Meanwhile, these materials are elastoplastic materials, and when the support sheet 25 is in a sheet shape, the support sheet 25 has elasticity, and the support sheet 25 can be bent together with the folding screen 10.

In some embodiments, the thickness of the support sheet 25 may be greater than or equal to 0.02 millimeters (mm) and less than or equal to 0.10mm. Specifically, the thickness of the support sheet 25 may be 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, or 0.1mm. In this way, the thickness of the supporting sheet 25 is moderate, the structural strength of the supporting sheet 25 is ensured, and the thickness of the rotating shaft mechanism 23 in the Z-axis direction can be considered, so that the thin design of the foldable electronic device 100 in the unfolded state or the folded state is facilitated.

It should be noted that, the thickness of the supporting sheet 25 in the embodiment of the present application refers to the distance between the first surface 25a and the second surface 25b of the supporting sheet 25.

In some embodiments, in order to avoid rubbing the folding screen 10 during bending of the support sheet 25, a mylar sheet may be provided on the first surface 25a of the support sheet 25.

In some embodiments, to reduce the stress to which the third heat conductive portion 243 is subjected during folding of the hinge mechanism 23, the third heat conductive portion 243 can slide relative to the hinge mechanism 23 when the hinge mechanism 23 is switched between the folded state and the unfolded state. That is, the third heat conductive portion 243 and the rotating shaft mechanism 23 are not fixed relatively. In this way, in the bending process of the rotating shaft mechanism 23, the whole third heat conducting portion 243 can be used as a stretching area, so that the stretching force applied to the third heat conducting portion 243 in the bending process can be reduced, the requirement on the breaking stretching rate of the heat conducting sheet 24 can be reduced, and the reliability of the heat conducting sheet 24 can be ensured, and meanwhile, the material cost can be reduced. In addition, the structure is simple to assemble and high in assembly efficiency.

In this embodiment, referring to fig. 18, when the rotation shaft mechanism 23 is in the unfolded state (i.e. when the housing assembly 20 is in the unfolded state), the third section 2433 of the third heat conducting portion 243 is substantially parallel to the first surface 25a of the supporting plate 25. That is, the size of third section 2433 is not redundant. In this way, during folding of the hinge mechanism 23, the third section 2433 may be prevented from being pinched in the gaps of the hinge mechanism 23 (e.g., the gap between the first hinge door panel 231 and the middle door panel 233 and the gap between the second hinge door panel 232 and the middle door panel 233).

Further, with continued reference to fig. 18, when the hinge mechanism 23 is in the extended state, the first section 2431, the second section 2432 and the third section 2433 are all substantially parallel to the first surface 25 a. The third heat conductive portion 243 has a flat plate shape. That is, the size of the entire third heat conductive portion 243 is not redundant. In this way, the third heat conducting portion 243 is prevented from being clamped into the gap of the rotating shaft mechanism 23 during the folding process of the rotating shaft mechanism 23. In addition, the redundancy-free design of the third heat conducting portion 243 can reduce the space occupied by the third heat conducting portion 243 in the thickness direction of the rotating shaft mechanism 23, and is also beneficial to reducing the size of the accommodating space 80 in the thickness direction of the rotating shaft mechanism 23, and is further beneficial to reducing the sizes of the first sink 231a, the second sink 232a and the third sink 233a in the thickness direction of the rotating shaft mechanism 23, so that the structural reliability of the rotating shaft mechanism 23 can be ensured while the thickness of the rotating shaft mechanism 23 is reduced.

It will be appreciated that in other embodiments, when the rotation shaft mechanism 23 is in the unfolded state, only the first section 2431 may be disposed parallel to the first supporting surface 2311, only the second section 2432 may be disposed parallel to the second supporting surface 2321, or the first section 2431 may be disposed parallel to the first supporting surface 2311 while the second section 2432 may be disposed parallel to the second supporting surface 2321.

In some embodiments, referring to fig. 17-18, the first sink 231a includes a first bottom wall 231a1, and the first bottom wall 231a1 faces the same direction as the first support surface 2311. The second countersink 232a includes a second bottom wall surface 232a1, and the second bottom wall surface 232a1 faces the same direction as the second support surface 2321. The third sinking groove 233a includes a third bottom wall surface 233a1, and the third bottom wall surface 233a1 is oriented in the same direction as the third support surface 2331.

When the rotation shaft mechanism 23 is in the unfolded state, the first section 2431 is supported on the first bottom wall surface 231a1, the second section 2432 is supported on the second bottom wall surface 232a1, and the third section 2433 is supported on the third bottom wall surface 233a1. In this way, the third heat conducting portion 243 can be kept flat when the hinge mechanism 23 is in the unfolded state, which is advantageous in avoiding the third heat conducting portion 243 from being inverted, and thus is advantageous in reducing the force of the third heat conducting portion 243 acting on the folding screen 10.

In some embodiments, referring back to fig. 10, the first countersink 231a extends through the first inner side 2313 and the first outer side 2314. Specifically, one end of the first bottom wall surface 231a1 extends to be flush with the first inner side surface 2313, and the other end extends to be flush with the first outer side surface 2314. In this way, the first section 2431 is conveniently assembled in the first countersink 231a, the assembling difficulty of the first section 2431 can be reduced, the contact area between the first section 2431 and the first bottom wall surface 231a1 can be increased, and the flatness of the first section 2431 in the unfolded state of the rotating shaft mechanism 23 is ensured.

Similarly, second countersink 232a extends through second inner side 2323 and second outer side 2324, and third countersink 233a extends through first side 2333 and second side 2334.

With continued reference to fig. 10, the first bottom wall surface 231a1 is parallel to the first supporting surface 2311. Since the third heat conducting portion 243 of the heat conducting sheet 24 is a flexible material, the shape of the first bottom wall surface 231a1 affects the shape of the first section 2431 when the rotation axis mechanism 23 is in the unfolded state, and therefore, the first bottom wall surface 231a1 is disposed parallel to the first supporting surface 2311, on one hand, when the rotation axis mechanism 23 is in the unfolded state, the first section 2431 can be ensured to be parallel to the first supporting surface 2311, so that a size non-redundant design of the first section 2431 can be realized, and the first section 2431 is advantageously prevented from being clamped into a gap of the rotation axis mechanism 23 during the folding process of the rotation axis mechanism. On the other hand, the size of the first sink 231a in the thickness direction of the rotation shaft mechanism 23 is advantageously reduced, and the structural strength of the rotation shaft mechanism 23 is advantageously improved. In yet another aspect, the step difference between the first heat conducting portion 241 and the first section 2431 is advantageously reduced, and thus the bending stress of the heat conducting fin 24 in the unfolded state of the rotation shaft mechanism 23 is advantageously reduced.

For similar reasons, the second bottom wall surface 232a1 is parallel to the second support surface 2321. The third bottom wall surface 233a1 is parallel to the third support surface 2331.

In some embodiments, in order to enable the third heat conducting portion 243 to be flat when the rotation shaft mechanism 23 is in the unfolded state, the first bottom wall surface 231a1, the second bottom wall surface 232a1, and the third bottom wall surface 233a1 are disposed coplanar.

It should be noted that the term "coplanar" in the embodiments of the present application should be interpreted broadly. Specifically, "coplanar" includes a case where a plurality of planes are located in the same plane, and also includes a case where a step difference between two planes is within a certain error range. For example, a difference in level between two planes within + -0.2 mm may be considered to be coplanar.

It will be appreciated that in other embodiments, only the first bottom wall surface 231a1 may be disposed coplanar with the third bottom wall surface 233a 1. Alternatively, only the second bottom wall surface 232a1 may be disposed coplanar with the third bottom wall surface 233a 1.

In some embodiments, referring to fig. 17-18, in order to reduce the step difference between the first heat conducting portion 241 and the first section 2431, the first fixing surface 211a of the first housing 21 is disposed coplanar with the first bottom wall surface 231a 1. In this way, when the rotation shaft mechanism 23 is in the unfolded state, the first heat conducting portion 241 and the first section 2431 can be transited by the straight line segment, so that bending between the first heat conducting portion 241 and the first section 2431 can be avoided.

Similarly, referring to fig. 17-18, in order to reduce the step between the second heat conducting portion 242 and the second section 2432, the second fixing surface 221a of the second housing 22 is disposed coplanar with the second bottom wall surface 232a 1.

It will be appreciated that in other embodiments, the first section 2431 may also be formed as an arc that arches in a direction away from the support sheet 25 when the spindle mechanism 23 is in the deployed state. Likewise, the second and third sections 2432, 2433 may be formed in an arc shape that arches in a direction away from the support sheet 25. The structures of the second and third settling tanks 232a and 233a may be designed with reference to the structure of the first settling tank 231 a. In addition, in the same embodiment, the shapes of the first section 2431, the second section 2432, and the third section 2433 may be the same or different.

Referring to fig. 19a, fig. 19a is a schematic view of a stacked structure of the heat conducting fins 24 in the housing assembly 20 shown in fig. 9. The heat conductive sheet 24 includes a heat conductive layer 24a, a first protective layer 24b, and a second protective layer 24c. It will be appreciated that fig. 19a schematically shows some of the film layers comprised by the thermally conductive sheet 24, the actual shape and actual thickness of which are not limited by fig. 19 a.

Specifically, the heat conductive layer 24a may extend from the first heat conductive portion 241 to the second heat conductive portion 242. That is, the first, second, and third heat conductive portions 241, 242, and 243 each include the heat conductive layer 24a.

In some embodiments, the material of thermally conductive layer 24a is graphite. The graphite has good layer heat conduction performance, and particularly, the heat conduction coefficient of the graphite in the plane extension direction is larger and can reach 1000W/(m.times.K) -2000W/(m.times.K). In this way, the heat on the heat conducting fin 24 can diffuse rapidly outwards along the plane thereof, so that the heat between the first heat conducting portion 241 and the second heat conducting portion 242 can be rapidly transferred by the third heat conducting portion 243, and the soaking capability of the housing assembly 20 can be effectively improved.

Of course, the material of the heat conductive layer 24a is not limited thereto. In other embodiments, the material of the heat conducting layer 24a may also be metal, polymer material, etc. As long as the heat conduction coefficient of the heat conduction layer 24a is higher than that of the first casing 21, the second casing 22, and the rotation shaft mechanism 23.

In some embodiments, to improve the reliability of the thermally conductive sheet 24, breakage of the thermally conductive sheet 24 during bending is avoided, and the elongation at break of the thermally conductive layer 24a is 3.5% or more. Illustratively, the elongation at break of the thermally conductive layer 24a may be 3.5%, 3.6%, 3.7%, 3.8%, 3.9%, 4.0%, 4.2%, 4.5%, 4.6%, 4.8%, 5.0%, etc.

In some embodiments, the thickness of the thermally conductive layer 24a may be greater than or equal to 0.04mm and less than or equal to 0.08mm. By way of example, the thermally conductive layer 24a may have a thickness of 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, etc. In this way, the overall thickness of the heat conductive sheet 24 can be reduced while ensuring the heat conductive performance of the heat conductive sheet 24, which is advantageous for reducing the thickness of the housing assembly 20, and realizing the slim design of the foldable electronic device 100.

The first protection layer 24b is used for protecting the heat conductive layer 24a. Specifically, referring to fig. 19a, the heat conductive layer 24a includes a first surface 24a1 and a second surface 24a2 opposite to each other. Wherein the first face 24a1 may be directed towards the folding screen 10 and the second face 24a2 may be directed towards the hinge mechanism 23. The first protection layer 24b is disposed on the first surface 24a1 of the heat conductive layer 24a. Specifically, the first protection layer 24b may cover the entire surface of the first surface 24a1. In this way, the first surface 24a1 of the heat conducting layer 24a can be prevented from being exposed, so that oxidation of the heat conducting layer 24a can be prevented, rubbing between the first surface 24a1 of the heat conducting layer 24a and the supporting sheet 25 can be prevented, and the service life of the heat conducting layer 24a can be prolonged.

In some embodiments, the material of the first protective layer 24b may be polyethylene terephthalate (polyethylene glycol terephthalate, PET), polytetrafluoroethylene (also referred to as teflon), or the like. The first protective layer 24b may be formed on the first surface 24a1 of the heat conductive layer 24a by bonding, spraying, or the like. In this way, the protective action of the first protective layer 24b can be ensured, and the material cost of the heat conductive sheet 24 can be reduced.

In some embodiments, the thickness of the first protective layer 24b is greater than or equal to 0.004mm and less than or equal to 0.01mm. Illustratively, the thickness of the first protective layer 24b may be 0.004mm, 0.005mm, 0.006mm, 0.007mm, 0.008mm, 0.009mm, 0.10mm, etc.

With continued reference to fig. 19a, the second passivation layer 24c is disposed on the second surface 24a2 of the heat conductive layer 24 a. The second protective layer 24c may cover the entire surface of the second face 24a2. In this way, the second surface 24a2 of the heat conducting layer 24a can be prevented from being exposed, so that oxidation of the heat conducting layer 24a can be prevented, rubbing between the second surface 24a2 of the heat conducting layer 24a and the rotating shaft mechanism 23 can be prevented, and the service life of the heat conducting layer 24a can be prolonged.

In some embodiments, the second protective layer 24c is an adhesive layer. For example, the second protective layer 24c may be a hot melt adhesive, a double sided adhesive tape, or the like. In this way, the first heat conduction portion 241 of the heat conduction sheet 24 can be adhesively fixed to the first case 21 via the second protection layer 24c, and the second heat conduction portion 242 of the heat conduction sheet 24 can be adhesively fixed to the second case 22 via the second protection layer 24 c. In this way, the heat conductive layer 24a can be protected, and the heat conductive sheet 24 can be connected to the first case 21 and the second case 22, which is advantageous in reducing the number of stacked heat conductive sheets 24, and thus in reducing the overall thickness of the heat conductive sheet 24.

In some embodiments, the thickness of the second protective layer 24c is greater than or equal to 0.008mm and less than or equal to 0.012mm. The thickness of the second protective layer 24c may be, for example, 0.008mm, 0.009mm, 0.01mm, 0.011mm, 0.012mm, or the like.

The third heat conducting portion 243 of the heat conducting strip 24 is easily scratched with the supporting strip 25 and the rotating shaft mechanism 23 during the bending process of the foldable electronic device 100, and on this basis, in order to improve the wear resistance of the heat conducting strip 24, please continue to refer to fig. 19a, the heat conducting strip 24 further includes a first wear resistant layer 24d and a second wear resistant layer 24e.

The first abrasion resistant layer 24d may serve to reduce friction between the third heat conductive portion 243 and the support sheet 25. The first wear-resistant layer 24d is disposed on a surface of the first protective layer 24b facing away from the heat conductive layer 24a, and the first wear-resistant layer 24d is disposed on the third heat conductive portion 243 of the heat conductive sheet 24.

Specifically, when the heat conducting strip 24 is assembled to the housing assembly 20, the front projection of the first wear layer 24d on the reference plane does not overlap with the front projection of the first fixing surface 211a on the reference plane, and the front projection of the first wear layer 24d on the reference plane overlaps with the front projection of the rotating shaft mechanism 23 on the reference plane. Wherein the reference plane is parallel to the first fixing surface 211a when the rotation shaft mechanism 23 is in the unfolded state. That is, the first abrasion resistant layer 24d is provided on the third heat conductive portion 243, and the first abrasion resistant layer 24d is not provided on the first heat conductive portion 241. In this way, when the heat conductive sheet 24 is applied to the foldable electronic device 100, the thickness of the first housing 21 can be reduced, which is advantageous for realizing a slim design of the foldable electronic device 100, and the material consumption of the first wear-resistant layer 24d can be reduced, which is advantageous for reducing the cost.

Likewise, to reduce the thickness of the second housing 22, the material used for the first wear layer 24d is reduced, and the orthographic projection of the first wear layer 24d on the reference plane does not overlap with the orthographic projection of the second fixing surface 221a on the reference plane. That is, the first abrasion resistant layer 24d is not provided on the second heat conductive portion 242.

In some embodiments, the material of the first wear layer 24d includes, but is not limited to, polytetrafluoroethylene (PTFE), PET, or the like. The thickness of the first wear layer 24d may be 0.015mm to 0.02mm. By way of example, the thickness of the first wear layer 24d may be 0.015mm, 0.016mm, 0.017mm, 0.018mm, 0.019mm, 0.02mm, etc.

The second abrasion resistant layer 24e may serve to reduce friction between the third heat conductive portion 243 and the rotation shaft mechanism 23. The second wear-resistant layer 24e is disposed on a surface of the second protection layer 24c facing away from the heat conductive layer 24a, and the second wear-resistant layer 24e is disposed on the third heat conductive portion 243 of the heat conductive sheet 24. Specifically, when the heat conducting strip 24 is assembled to the housing assembly 20, the orthographic projection of the second wear layer 24e on the reference plane does not overlap with the orthographic projection of the first fixing surface 211a on the reference plane, and the orthographic projection of the second wear layer 24e on the reference plane overlaps with the orthographic projection of the rotating shaft mechanism 23 on the reference plane. That is, the second abrasion resistant layer 24e is provided on the third heat conductive portion 243, and the second abrasion resistant layer 24e is not provided on the first heat conductive portion 241. In this way, when the heat conductive sheet 24 is applied to the foldable electronic device 100, the thickness of the first housing 21 can be reduced, which is advantageous for realizing a slim design of the foldable electronic device 100, and the material consumption of the second wear-resistant layer 24e can be reduced, which is advantageous for reducing the cost.

Likewise, to reduce the thickness of the second housing 22, the material used for the second wear layer 24e is reduced, and the orthographic projection of the second wear layer 24e on the reference plane does not overlap with the orthographic projection of the second fixing surface 221a on the reference plane. That is, the second abrasion resistant layer 24e is not provided on the second heat conductive portion 242.

When the second protective layer 24c is an adhesive layer, the second wear layer 24e may be connected to the heat conductive layer 24a by means of the second protective layer 24 c. In this way, the stacked size of the heat conductive sheet 24 and the first housing 21, and the stacked size of the heat conductive sheet 24 and the second housing 22 can be reduced while improving the wear resistance of the heat conductive sheet 24.

The material and thickness of the second wear layer 24e may be designed with reference to the material and thickness of the first wear layer 24d and will not be described in detail herein.

For example, in the embodiment shown in fig. 19a, the material of the heat conducting layer 24a is graphite, the material of the first protective layer 24b is PET, the material of the second protective layer 24c is an adhesive layer, and the materials of the first wear-resistant layer 24d and the second wear-resistant layer 24e are PTFE. On this basis, when the thickness of the heat conductive layer 24a is 0.04mm, the thickness of the first protective layer 24b is 0.007mm, the thickness of the second protective layer 24c is 0.01mm, the thickness of the first abrasion resistant layer 24d is 0.016mm, and the thickness of the second abrasion resistant layer 24e is 0.016mm, the thickness of the portion of the heat conductive sheet 24 corresponding to the first case 21 (i.e., the first heat conductive portion 241) is 0.057mm, and the thickness of the portion of the heat conductive sheet 24 corresponding to the second case 22 (i.e., the second heat conductive portion 242) is 0.057mm.

Referring to fig. 19b, fig. 19b is a schematic diagram of a laminated structure of a heat conducting fin 24 in the prior art. The heat conductive sheet 24 includes a first heat conductive layer 24f, a third protective layer 24g, a fourth protective layer 24h, and an adhesive layer 24k, the third protective layer 24g and the fourth protective layer 24h being oppositely disposed on both side surfaces of the first heat conductive layer 24 f. The material of the first heat conducting layer 24f may be graphite, the material of the third protective layer 24g may be PTFE, and the material of the fourth protective layer 24h may be PET. The first heat conductive layer 24f, the third protective layer 24g and the fourth protective layer 24h all cover the entire surface of the first heat conductive layer 24 f. That is, the third protective layer 24g and the fourth protective layer 24h each extend from the first heat conduction portion to the second heat conduction portion. The adhesive layer 24k is disposed at a portion of the fourth protective layer 24h corresponding to the first heat conductive portion 241 and a portion of the fourth protective layer 24h corresponding to the second heat conductive portion 242.

When the heat conductive sheet 24 shown in fig. 19b is applied to a foldable electronic device, the third protective layer 24g may face the folding screen 10. The fourth protective layer 24h may face the housing assembly and be fixedly connected to the first housing 21 and the second housing 22 by means of an adhesive layer 24 k.

In the heat conductive sheet 24 shown in fig. 19b, the thickness of the first heat conductive layer 24f is 0.04mm, the thickness of the third protective layer 24g is 0.016mm, the thickness of the fourth protective layer 24h is 0.010mm, and the thickness of the adhesive layer 24k is 0.01mm, when the thickness of the portion of the heat conductive sheet 24 corresponding to the first housing 21 is 0.076mm, the thickness of the portion of the heat conductive sheet 24 corresponding to the rotation axis mechanism is 0.066mm, and the thickness of the portion of the heat conductive sheet 24 corresponding to the second housing 22 is 0.076mm.

In this way, the superimposed thickness of the heat conductive sheet 24 and the first housing 21 and the superimposed thickness of the heat conductive sheet 24 and the second housing 22 in the embodiment shown in fig. 19a can be reduced by 0.019mm as compared with the heat conductive sheet 24 shown in fig. 19 b. Thus, when the heat conductive sheet 24 is applied to the foldable electronic device 100, the entire thickness of the foldable electronic device 100 can be reduced, which is advantageous in realizing a slim design of the foldable electronic device 100.

Since the third heat conductive portion 243 is folded along with the folding of the housing assembly 20, the third heat conductive portion 243 is in a stretched state. And the third heat conductive portion 243 applies a force to the folding screen 10 when being stretch-deformed, which increases the risk of cracking the folding screen and the risk of failure of the adhesive layer between the stacked layers of the folding screen.

In some embodiments, in order to reduce the force applied to the folding screen by the heat conducting strip 24 under the same stretching amount and improve the bending performance of the third heat conducting portion 243, referring to fig. 20, fig. 20 is a schematic structural diagram of the first abrasion resistant layer 24d in the heat conducting strip 24 shown in fig. 19 a. The first wear-resistant layer 24d is provided with a first hollowed-out hole 24d1. In the thickness direction of the first wear-resistant layer 24d, the first hollowed-out hole 24d1 penetrates through the first wear-resistant layer 24d. That is, the first hollow hole 24d1 is a through hole. The first hollowed holes 24d1 are a plurality of, and the first hollowed holes 24d1 are arranged on the first wear-resistant layer 24d at intervals.

Referring to fig. 20, in this embodiment, the plurality of first hollow holes 24d1 may be arranged in a plurality of rows and columns. Specifically, the plurality of first hollowed holes 24d1 in each row are arranged at intervals in the first direction, and the plurality of first hollowed holes 24d1 in each column are arranged at intervals in the second direction. The first hollow holes 24d1 in two adjacent rows are staggered. The first direction and the second direction are different. Illustratively, the first direction is parallel to the X-axis direction and the second direction is parallel to the Y-axis direction. In this way, the aperture ratio of the first hollow hole 24d1 can be increased, which is advantageous for improving the deformability of the third heat conductive portion 243, and thus the bending performance of the third heat conductive portion 243 can be improved.

Of course, the arrangement of the first hollowed-out holes 24d1 is not limited thereto. For example, referring to fig. 21, fig. 21 is a schematic structural diagram of a first wear-resistant layer 24d according to other embodiments of the present application. For example, as shown in (a) of fig. 21, the plurality of first hollowed-out holes 24d1 may be arranged in a rectangular array. As another example, as shown in (b) of fig. 21, the first hollow hole 24d1 may be elongated, and the first hollow hole 24d1 may extend from one end to the other end of the third heat conducting portion 243 along the Y-axis direction. Or the first hollow hole 24d1 may also extend from one end to the other end of the third heat conducting portion 243 along the X-axis direction.

The shape of the first hollowed-out hole 24d1 may be rectangular, square, diamond, triangle, trapezoid, circle, ellipse, U-shape, irregular pattern, etc., which is not limited in particular in the embodiment of the present application.

Further, a second hollowed-out hole is formed on the second wear-resistant layer 24 e. The arrangement and shape of the second hollow holes can be designed with reference to the first hollow holes 24d1, which will not be described in detail herein.

In some embodiments, the third heat conductive portion 243 has a smaller dimension in the Y-axis direction than the first heat conductive portion 241, and the third heat conductive portion 243 has a smaller dimension in the Y-axis direction than the second heat conductive portion 242. In this way, the force acting on the folding screen 10 when the third heat conductive portion 243 is bent can also be reduced to some extent.

Experiments prove that when the dimension of the third heat conducting portion 243 in the length direction (i.e., the Y-axis direction) of the rotating shaft mechanism 23 is 14.4mm, the heat conducting layer 24a is graphite, and the elongation of the graphite reaches 3.5%, the heat conducting sheet 24 in the embodiment of the application can reduce the stress by about 16.2% under the same elongation compared with the scheme without the first and second hollow holes 24d1 and 24d1 after the first and second hollow holes are provided.

Thus, in the case assembly 20 and the foldable electronic device 100 according to the embodiments of the present application, the hollowed holes are formed in the first wear-resistant layer 24d and the second wear-resistant layer 24e, that is, the first wear-resistant layer 24d and the second wear-resistant layer 24e are used to perform the grid design, and the size of the third heat conducting portion 243 (for example, the width size of the third heat conducting portion 243) in the Y-axis direction is reduced, so that the acting force of the heat conducting sheet 24 on the foldable screen 10 is reduced.

In other embodiments, referring to fig. 22, fig. 22 is a partial cross-sectional view of a housing assembly 20 according to other embodiments of the present application. The difference between the housing assembly 20 in the present embodiment and the housing assembly 20 in the embodiment shown in fig. 17 is that the whole of the third heat conducting portion 243 in the embodiment shown in fig. 17 is not fixed relative to the rotating shaft mechanism 23, but in the present embodiment, the first section 2431 of the third heat conducting portion 243 is connected to the rotating shaft mechanism 23 through the buffer material member 90, and the second section 2432 of the third heat conducting portion 243 is connected to the rotating shaft mechanism 23 through the buffer material member 90. Specifically, referring to fig. 22, the first section 2431 is connected to the first rotating door plate 231 through the buffer material 90, and the second section 2432 is connected to the second rotating door plate 232 through the buffer material 90.

Wherein the cushioning material member 90 has a certain deformability. In some embodiments, the cushioning material 90 may be an adhesive. For example, the adhesive may be an ultraviolet curable adhesive, a hot melt adhesive, a wire bonding adhesive, a white glaze adhesive, a foam adhesive, a silicone adhesive, or the like.

In this way, on one hand, the buffer material 90 can limit the positions of the first section 2431 and the second section 2432, so as to reduce the displacement of the first section 2431 and the second section 2432 relative to the movement of the rotating mechanism, and avoid the first section 2431 and the second section 2432 from being clamped in the gap of the rotating shaft mechanism 23, and on the other hand, when the buffer material 90 has a certain deformability and the third heat conduction portion 243 is bent along with the rotating shaft mechanism 23, the deformation of the buffer material 90 can be utilized to weaken the stress applied to the third heat conduction portion 243, and the stretching rate of the third heat conduction portion 243 can be reduced, thereby being beneficial to improving the reliability of the third heat conduction portion 243 and reducing the possibility that the third heat conduction portion 243 is broken, layered and the like to be damaged.

On this basis, in order to reduce the stacking size between the third heat conducting portion 243 and the rotating shaft mechanism 23, please refer to fig. 23, fig. 23 is a schematic diagram of the rotating shaft mechanism 23 in the cross-sectional view shown in fig. 22. The first supporting surface 2311 is provided with a first groove 231b recessed toward the first bottom surface 2312, and the buffer material member 90 between the first section 2431 and the first rotating door plate 231 may be disposed in the first groove 231 b.

Specifically, in this embodiment, the first recess 231b is recessed from a portion of the first bottom wall surface 231a1 toward the first bottom surface 2312. It will be appreciated that in other embodiments, the cushioning material 90 may be disposed directly on the first bottom wall surface 231a1.

With continued reference to fig. 23, a second recess 232b recessed toward the second bottom surface 2322 is formed in the second supporting surface 2321, and the cushioning material 90 between the second section 2432 and the second rotating door 232 is disposed in the second recess 232 b. The arrangement and location of the second grooves 232b may be designed with reference to the first grooves 231b, which will not be described in detail herein.

It will be appreciated that in other embodiments, the first section 2431 may be connected to the spindle mechanism 23 only by the buffer material 90, the second section 2432 may not be fixed to the spindle mechanism 23, or the second section 2432 may be connected to the spindle mechanism 23 by other structures. In still other embodiments, the second section 2432 may be coupled to the spindle mechanism 23 solely by the buffer material 90, with the first section 2431 not being fixed to the spindle mechanism 23, or with the first section 2431 being coupled to the spindle mechanism 23 by other structures.

With continued reference to fig. 22, in this embodiment, in the unfolded state of the rotation shaft mechanism 23, the third section 2433 of the third heat conducting portion 243 is substantially parallel to the first supporting surface 2311. That is, the size of third section 2433 is not redundant. In this way, during the folding process of the rotating shaft mechanism 23, the third section 2433 can be prevented from being clamped in the gap (such as the gap between the first rotating door plate 231 and the middle door plate 233 and the gap between the second rotating door plate 232 and the middle door plate 233) of the rotating shaft mechanism 23, and the risk that the heat conducting plate 24 is scratched by the supporting plate 25 during the bending process can be reduced.

The manner of assembly between the first section 2431 and the first swing door panel 231 and the manner of assembly between the second section 2432 and the second swing door panel 232 of the present embodiment can be applied to the housing assembly 20 and the foldable electronic device 100 of any of the embodiments of the present application.

Referring to fig. 24, fig. 24 is a partial cross-sectional view of a housing assembly 20 according to still further embodiments of the present application. The housing assembly 20 in this embodiment differs from the housing assembly 20 in the embodiment shown in fig. 22 in that in this embodiment, the pivot mechanism 23 is in the unfolded state, and at least part of the third section 2433 arches in a direction away from the support sheet 25 to form an arching section 2433a. Specifically, third section 2433 can be integrally formed as a domed section 2433a, or a portion of the structure of third section 2433 can be formed as a domed section 2433a. That is, the length of third section 2433 is greater than the spacing between first section 2431 and second section 2432. The size of the third section 2433 leaves some redundancy. In this way, the stress applied to the third heat conducting portion 243 during bending can be reduced, so that the reliability of the third heat conducting portion 243 can be improved, the occurrence of the inverted arch of the third heat conducting portion 243 due to multiple folds can be effectively avoided, and the force of the third heat conducting portion 243 acting on the folding screen 10 during bending can be reduced.

With reference to fig. 25, fig. 25 is a perspective view of the middle door panel 233 of the housing assembly 20 shown in fig. 24. The intermediate door panel 233 is provided with a third groove 233b. The arching segment 2433a is located within the third recess 233b. In this way, the arched section 2433a can be accommodated by the third groove 233b. In this way, when the rotation shaft mechanism 23 is in the unfolded state, the stress applied to the third section 2433 can be reduced, and the third section 2433 can be kept unfolded, so that the third section 2433 is prevented from being bent due to insufficient accommodating space, and the reliability of the heat conducting fin 24 is improved.

The shape of the arching section 2433a is adapted to the shape of the third recess 233 b. In some embodiments, with continued reference to fig. 25, the third recess 233b includes a third recess bottom wall 233b1, a first recess side wall 233b2, and a second recess side wall 233b3. The third groove bottom wall 233b1 is oriented in the same direction as the third support surface 2331, the first groove side wall 233b2 is connected to a side of the third groove bottom wall 233b1 adjacent to the first swing door panel 231, and the second groove side wall 233b3 is connected to a side of the third groove bottom wall 233b1 adjacent to the second swing door panel 232. In the direction from the rotation shaft mechanism 23 to the support piece 25, the first groove side wall 233b2 extends toward the first rotation door panel 231, and the second groove side wall 233b3 extends toward the second rotation door panel 232. In this way, the compressive stress of the third section 2433 can be further reduced, and stress concentration on the third section 2433 can be avoided, thereby further improving the reliability of the third section 2433.

In order to further reduce the stress on the third section 2433 on the basis of the above-described embodiment, the first groove sidewall 233b2 and the third groove bottom wall 233b1 are smoothly transitioned, and the second groove sidewall 233b3 and the third groove bottom wall 233b1 are smoothly transitioned.

In other embodiments, the third groove bottom wall 233b1, the first groove side wall 233b2, and the third groove side wall of the third groove 233b may also be co-cambered. At this time, the shape of the arch section 2433a may be arc-shaped.

Referring to fig. 24 to 25, in this embodiment, a third recess 233b is formed in the third recess 233 a. Specifically, the third recess 233b is formed by a portion of the third bottom wall surface 233a1 of the third countersink 233a being recessed in a direction away from the support sheet 25. In this way, the step between the first section 2431 and the other portion of the third section 2433 except the arched section 2433a is advantageously eliminated, bending between the third section 2433 and the first section 2431 can be avoided, and stress applied to the heat conductive sheet 24 can be reduced.

It will be appreciated that in other embodiments, the third recess 233b may be recessed from the third support surface 2331 toward the third bottom surface 2332. In this case, the third settling tank 233a may be provided on the intermediate door panel 233, or the third settling tank 233a may not be provided.

In the case assembly 20 and the foldable electronic device 100 of the present embodiment, the third heat conducting portion 243 is redundant, and the third section 2433 and the middle door panel 233 are not fixed relatively, so that the stress of the heat conducting sheet 24 in the bending process can be reduced, the force applied to the folding screen 10 by the heat conducting sheet 24 can be reduced, and the reliability of the foldable electronic device 100 can be improved.

It should be noted that, in the embodiment of the present application, the structure of the third section 2433 may be applied to the housing assembly 20 and the foldable electronic device 100 in any embodiment of the present application.

Referring to fig. 26, fig. 26 is a perspective view of a housing assembly 20 according to still other embodiments of the present application. The housing assembly 20 in this embodiment is different from the housing assembly 20 in the embodiment shown in fig. 24 in that the intermediate door panel 233 in this embodiment is provided with a limiting plate 234, and the third section 2433 is disposed opposite to and spaced apart from the third groove bottom wall 233b 1. The third section 2433 is located between the limiting plate 234 and the third tank bottom wall 233b 1. Specifically, a limiting space is defined between the limiting plate 234 and the third groove 233 b. The third section 2433 is located within the spacing space. In this way, the movement of the third section 2433 in the thickness direction of the hinge mechanism 23 can be restricted by the stopper plate 234, and the influence of the arching of the third section 2433 on the folding screen 10 can be further reduced.

Referring to fig. 27-28, fig. 27 is a schematic assembly view of the limiting plate 234 and the rotating shaft mechanism 23 in the housing assembly 20 shown in fig. 26, and fig. 28 is an exploded view of the limiting plate 234 and the rotating shaft mechanism 23 shown in fig. 27. In some embodiments, the limiting plate 234 is removably connected to the intermediate door panel 233. Thus, during assembly, the third section 2433 can be assembled to the third recess 233b before the retainer plate 234 is coupled to the intermediate door panel 233. Thereby, the size of the third groove 233b can be prevented from limiting the sizes of the first and second heat conductive portions 241 and 242, the sizes of the first and second heat conductive portions 241 and 242 in the Y-axis direction can be ensured, and thus the soaking capacity of the case assembly 20 can be improved, and the heat dissipation performance of the case assembly 20 can be improved.

Illustratively, one end of the limiting plate 234 may be detachably coupled to the intermediate door panel 233. For example, in some embodiments, one end of the restrictor plate 234 may be connected to the intermediate door panel 233 by a fastener 40. In other embodiments, one end of the limiting plate 234 may also be coupled to the intermediate door panel 233 by a snap fit or the like. The other end of the limiting plate 234 may be connected to the middle door panel 233 by means of a clamping connection, a fastening connection, or the like, or the other end of the limiting plate 234 may be rotatably connected to the middle door panel 233 by means of a rotating shaft, a flexible member, or the like.

On the basis of any of the above embodiments, the surface of the limiting plate 234 facing away from the third recess 233b is coplanar with the third support surface 2331. Illustratively, the third support surface 2331 is provided with a mounting groove 233c recessed toward the third bottom surface 2332, and the limiting plate 234 is disposed in the mounting groove 233 c. Thus, the limiting plate 234 and the middle door plate 233 can jointly support the supporting plate 25, so that the supporting area of the supporting plate 25 can be increased, and the flatness of the supporting plate 25 in the unfolded state of the rotating shaft mechanism 23 can be improved.

It is understood that the limiting plate 234 of the present embodiment may be applied to the housing assembly 20 and the foldable electronic device 100 of any of the embodiments of the present application.

In the above embodiments, the supporting plate 25 is formed in a flat plate shape, and the accommodation space 80 between the supporting plate 25 and the rotation shaft mechanism 23 is defined by the supporting plate 25 and the first, second and third settling grooves 231a, 232a, 233a on the rotation shaft mechanism 23. In other embodiments, referring to fig. 29, fig. 29 is a perspective view of a supporting plate 25 according to still other embodiments of the present application. The support piece 25 in the present embodiment is different from the support piece 25 in the above-described embodiments in that the support piece 25 in the present embodiment is provided with a step groove 25e recessed toward the first surface 25a on the second surface 25 b. The step groove 25e and the rotating shaft mechanism 23 may define a receiving space 80 therebetween for receiving the third heat conductive portion 243. In this case, the first, second, and third settling tanks 231a, 232a, and 233a may be provided on the rotation shaft mechanism 23, or the first, second, and third settling tanks 231a, 232a, and 233a may not be provided.

Specifically, referring to fig. 29, the support sheet 25 includes opposite first and second sides 25c and 25d. The rotation shaft mechanism 23 is in the unfolded state, and the first side 25c faces the first housing 21. The stepped groove 25e penetrates the first side 25c and the second side 25d. Simple structure and convenient processing.

It is understood that the support sheet 25 in this embodiment may be applied to the housing assembly 20 and the foldable electronic device 100 in any of the embodiments of the present application.

By providing the limiting plate 234, the housing assembly 20 and the foldable electronic device 100 in the present embodiment can further reduce the acting force of the third section 2433 against the folding screen 10, and further reduce the risk of the heat conducting fin 24 being scratched by the supporting fin 25 during bending.

It will be appreciated that in other embodiments, the first sink 231a, the second sink 232a, and the third sink 233a may not be provided on the spindle mechanism 23, and at the same time, the step groove 25e is not provided on the support piece 25, and in this case, the support piece 25 and the spindle mechanism 23 may be spaced apart by a connection member (such as a boss, an adhesive structure, etc.). In this case, too, a housing space 80 can be defined between the support piece 25 and the rotation shaft mechanism 23.

Referring to fig. 30, fig. 30 is a schematic diagram illustrating a temperature simulation of the foldable electronic device 100 after the housing assembly 20 shown in fig. 8 is applied to the foldable electronic device 100. As can be seen from fig. 30, in the foldable electronic device 100 according to the embodiment of the present application, the maximum temperature of the first housing 21 is 42.085 ℃, and the maximum temperature of the second housing 22 is 32.7565 ℃. The phenomenon of shaft region temperature fault is improved. The temperature difference between the maximum temperature of the first housing 21 and the maximum temperature of the second housing 22 is 9.3285 ℃.

Compared to the foldable electronic device 100 in the related art, the maximum temperature of the foldable electronic device in the embodiment of the present application is reduced by 0.83 ℃, and the temperature difference between the maximum temperature of the first housing 21 and the maximum temperature of the second housing 22 is reduced by 1.9443 ℃.

According to the description of the above embodiments, the housing assembly 20 and the foldable electronic device 100 according to the embodiments of the present application, by providing the supporting sheet 25 and the trans-axial heat conducting sheet 24, and providing the third heat conducting portion 243 of the heat conducting sheet 24 between the supporting sheet 25 and the rotating shaft mechanism 23, on one hand, the highest temperature of the foldable electronic device 100 is effectively reduced, the temperature difference between the first housing 21 and the second housing 22 is reduced, on the other hand, the screen light shadow is effectively reduced, the fold of the folding screen is optimized, on the other hand, the direct contact of the heat conducting sheet 24 with the folding screen 10 is avoided, the risk of the anti-arching caused by the tension of the folding screen 10 during the folding process is reduced, and on the other hand, the risk of the top of the heat conducting sheet 24 after 20 ten thousands of folds of the housing assembly 20 and the foldable electronic device 100 is reduced.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present application, and not for limiting the same, and although the present application has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the technical solution described in the above-mentioned embodiments may be modified or some technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiments of the present application.

Claims

1. A housing assembly, comprising:

The device comprises a first shell, a second shell and a rotating shaft mechanism, wherein the rotating shaft mechanism is connected between the first shell and the second shell, and the first shell can rotate relative to the second shell so as to enable the shell assembly to be switched between an unfolding state and a folding state;

The support piece is arranged on one side of the rotating shaft mechanism, a containing space is formed between the support piece and the rotating shaft mechanism, when the rotating shaft mechanism is in the unfolding state, the support piece is arranged on the rotating shaft mechanism in a stacked mode, and when the rotating shaft mechanism is in the folding state, the support piece is bent;

The heat conducting fin comprises a first heat conducting part, a second heat conducting part and a third heat conducting part, wherein the first heat conducting part is fixedly connected with the first shell, the second heat conducting part is fixedly connected with the second shell, the third heat conducting part is connected between the first heat conducting part and the second heat conducting part, and at least one part of the third heat conducting part is positioned in the accommodating space.

2. The housing assembly of claim 1, wherein the spindle mechanism comprises a base, a first rotating door plate and a second rotating door plate, the first rotating door plate and the second rotating door plate are respectively rotatably connected to opposite sides of the base, the first rotating door plate comprises a first supporting surface, the second rotating door plate comprises a second supporting surface, and the supporting sheets are stacked on the first supporting surface and the second supporting surface when the housing assembly is in the unfolded state;

The third heat conduction part comprises a first section and a second section, wherein the first section is positioned between the supporting sheet and the first rotating door plate, and the second section is positioned between the supporting sheet and the second rotating door plate.

3. The housing assembly of claim 2, wherein the first rotating door panel includes a first bottom surface opposite a first support surface, the first support surface having a first countersink recessed toward the first bottom surface, the support tab and the first countersink defining a first receiving channel therebetween, at least a portion of the first section being located within the first receiving channel.

4. The housing assembly of claim 3, wherein the first rotating door panel includes first and second opposing inner and outer sides, the first inner side facing the second rotating door panel when the housing assembly is in the deployed state;

the first sinking groove penetrates through the first inner side face and the first outer side face.

5. The housing assembly of claim 3 or 4, wherein the first countersink includes a first bottom wall surface oriented in the same direction as the first support surface and parallel thereto, the first section being supported on the first bottom wall surface when the housing assembly is in the deployed state.

6. The housing assembly of any one of claims 3-5, wherein the second rotating door panel includes a second bottom surface opposite a second support surface, the second support surface having a second sink recessed toward the second bottom surface, the support tab and the second sink defining a second receiving channel therebetween, at least a portion of the second section being located within the second receiving channel.

7. The housing assembly according to any one of claims 2-6, wherein the first section is parallel to the first support surface and/or the second section is parallel to the second support surface when the housing assembly is in the deployed state.

8. The housing assembly according to any of claims 2-7, wherein the first section is connected to the first rotating door panel by a cushioning material and/or the second section is connected to the second rotating door panel by a cushioning material.

9. The housing assembly of claim 8, wherein the cushioning material is an adhesive.

10. The housing assembly of any one of claims 2-9, wherein the pivot mechanism further comprises a middle door panel positioned between the first and second door panels, the middle door panel comprising a third support surface, the first, second, and third support surfaces facing the same when the housing assembly is in the deployed state;

The third heat conduction part further comprises a third section, wherein the third section is connected between the first section and the second section, and the third section is positioned between the supporting sheet and the middle door plate.

11. The housing assembly of claim 10, wherein the intermediate door panel includes a third bottom surface opposite a third support surface, the third support surface having a third countersink recessed toward the third bottom surface, the support tab and the third countersink defining a third receiving channel therebetween, at least a portion of the third section being located within the third receiving channel.

12. The housing assembly of claim 11, wherein the third countersink includes a third bottom wall surface oriented in the same direction as the third support surface and parallel thereto, the third section being supported on the third bottom wall surface when the housing assembly is in the expanded state.

13. The housing assembly of claim 12, wherein the first support surface is provided with a first countersink, the first countersink including a first bottom wall surface oriented in the same direction as the first support surface, the first section being supported on the first bottom wall surface when the housing assembly is in the expanded state, the first bottom wall surface being coplanar with the third bottom wall surface.

14. The housing assembly of any one of claims 10-13, wherein the third section is parallel to the third support surface when the housing assembly is in the deployed state.

15. The housing assembly of any one of claims 10-13, wherein at least a portion of the third section arches toward a direction away from the support sheet to form an arching section.

16. The housing assembly of claim 15, wherein the intermediate door panel includes a third bottom surface opposite the third support surface, the third support surface having a third recess recessed toward the third bottom surface, the arching section being located within the third recess.

17. The housing assembly of claim 16, wherein the third groove comprises:

A third groove bottom wall facing the support piece;

a first slot side wall connected to a side of the third slot bottom wall proximate to the first rotating door panel;

a second slot side wall connected to a side of the third slot bottom wall adjacent to the second rotating door panel;

in a direction from the intermediate door panel to the support sheet, the first slot side wall extends toward a direction approaching the first rotating door panel, and the second slot side wall extends toward a direction approaching the second rotating door panel.

18. The housing assembly of claim 16 or 17, wherein the third groove comprises a third groove bottom wall, the third groove bottom wall facing the support tab;

The shell assembly further comprises a limiting plate, the limiting plate is arranged on the middle door plate, the limiting plate is opposite to the third tank bottom wall and is arranged at intervals, and the arch section is located between the limiting plate and the third tank bottom wall.

19. The housing assembly of claim 18, wherein the retainer plate is removably attached to the intermediate door panel.

20. The housing assembly of any one of claims 1-19, wherein at least a portion of the support tab is slidable relative to the spindle mechanism when the housing assembly is switched between the extended state and the collapsed state.

21. The housing assembly of any one of claims 1-20, wherein the support tab includes first and second opposing surfaces and first and second opposing sides, the second surface facing the spindle mechanism, the first side facing the first housing when the housing assembly is in the deployed state;

the second surface is provided with a step groove which is opposite to the first surface and is avoided, the step groove penetrates through the first side face and the second side face, and the accommodating space is defined between the step groove and the rotating shaft mechanism.

22. The housing assembly of any one of claims 1-21, wherein the thermally conductive sheet comprises:

A heat conducting layer;

the first protection layer covers the surface of one side of the heat conduction layer, which is away from the rotating shaft mechanism;

the second protection layer covers the surface of one side of the heat conduction layer, which faces the rotating shaft mechanism.

23. The housing assembly of claim 22, wherein the first housing includes a first stationary surface, the first thermally conductive section being fixedly coupled to the first stationary surface;

the heat conducting sheet comprises a first wear-resistant layer arranged on one side of the first protection layer, which is far away from the heat conducting layer, wherein when the shell component is in the unfolded state, the orthographic projection of the first wear-resistant layer on a reference plane is overlapped with the orthographic projection of the rotating shaft mechanism on the reference plane, and the orthographic projection of the first wear-resistant layer on the reference plane is not overlapped with the orthographic projection of the first fixing surface on the reference plane, and/or

The heat conducting fin comprises a second wear-resistant layer, the second wear-resistant layer is arranged on one side of the second protection layer, which is far away from the heat conducting layer, when the shell component is in the unfolding state, the orthographic projection of the second wear-resistant layer on a reference plane is overlapped with the orthographic projection of the rotating shaft mechanism on the reference plane, and the orthographic projection of the second wear-resistant layer on the reference plane is not overlapped with the orthographic projection of the first fixing surface on the reference plane;

wherein the reference plane is parallel to the first fixation surface.

24. The housing assembly of claim 22 or 23, wherein the thermally conductive layer has an elongation at break of greater than or equal to 3.5%.

25. A foldable electronic device, comprising:

a housing assembly according to any one of claims 1 to 24;

and the folding screen is arranged on the shell assembly.