CN119342703A - PCB board gold finger wiring method, device and printed circuit board - Google Patents
PCB board gold finger wiring method, device and printed circuit board Download PDFInfo
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- CN119342703A CN119342703A CN202411316232.8A CN202411316232A CN119342703A CN 119342703 A CN119342703 A CN 119342703A CN 202411316232 A CN202411316232 A CN 202411316232A CN 119342703 A CN119342703 A CN 119342703A
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Abstract
本发明涉及PCB板金手指布线方法、装置及印制电路板，本发明通过外层工序，对所述多层板依次进行压干膜处理、曝光处理、显影处理、蚀刻处理，在多层板表面形成外层线路；其中，所述多层板包括有效金手指区域和无效金手指区域，所述外层线路包括有效金手指区域；制作出有效金手指区域的铜层；本申请通过防焊工序，对所述多层板的焊接区域进行开窗处理，并对所述多层板除焊接区域外的其他区域进行防焊处理；其中，所述焊接区域包括有效金手指区域；制作出无效金手指区域的油墨层。实现有效金手指区域具有信号传输、驱动供电功能性作用；无效金手指区域起到结构补强，板面平整作用。保证了光电板金手指板厚均匀性；降低了生产成本，提高光电板金手指的良品率。
The present invention relates to a PCB board gold finger wiring method, device and printed circuit board. The present invention sequentially performs a dry film pressing process, an exposure process, a developing process and an etching process on the multilayer board through an outer layer process, and forms an outer layer circuit on the surface of the multilayer board; wherein the multilayer board includes an effective gold finger area and an invalid gold finger area, and the outer layer circuit includes the effective gold finger area; a copper layer of the effective gold finger area is produced; the present application performs a window opening process on the welding area of the multilayer board through a solder mask process, and performs a solder mask process on other areas of the multilayer board except the welding area; wherein the welding area includes the effective gold finger area; an ink layer of the invalid gold finger area is produced. The effective gold finger area has the functional role of signal transmission and driving power supply; the invalid gold finger area plays the role of structural reinforcement and board surface flatness. The uniformity of the thickness of the gold finger of the photovoltaic board is guaranteed; the production cost is reduced, and the yield rate of the gold finger of the photovoltaic board is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to a PCB signal line manufacturing method and device and a printed circuit board.
Background
Along with the rapid development of PCB circuit board manufacturing industry, market competition is stronger, the LCD photoelectric board, namely the printed circuit board used in the LCD backlight module, has wider application and is produced in batch more than other types of circuit boards, but gold surface treatment is needed because the Bonding process characteristic is involved in the process of manufacturing the plasma display module, and the interconnection between the flexible circuit board and the rigid circuit board is involved. In the design of the golden finger wiring aiming at the LCD photoelectric plate, uneven plate thickness is caused by forming a low-lying area easily, so that the yield of the traditional LCD photoelectric plate is low.
Disclosure of Invention
In view of the above problems, embodiments of the present invention provide a method and an apparatus for wiring a gold finger on a PCB, and a printed circuit board, which are used to solve the problem in the prior art that the yield of the existing LCD photovoltaic panel is low due to uneven thickness caused by formation of a low-lying area in the layout of the gold finger on the LCD photovoltaic panel.
According to an aspect of the embodiment of the invention, there is provided a method for wiring a golden finger of a PCB board, the method comprising:
a previous step of manufacturing a multilayer board and drilling holes in the multilayer board;
electroplating, namely forming a copper layer with a preset thickness on the multilayer board;
An outer layer process, namely sequentially performing dry film pressing treatment, exposure treatment, development treatment and etching treatment on the multilayer board to form an outer layer circuit on the surface of the multilayer board, wherein the multilayer board comprises an effective golden finger area and an ineffective golden finger area, and the outer layer circuit comprises the effective golden finger area;
a welding prevention procedure, wherein a window opening treatment is carried out on a welding area of the multi-layer board, and welding prevention treatment is carried out on other areas of the multi-layer board except the welding area, and the welding area comprises an effective golden finger area;
a gold melting step of forming a nickel-gold layer in the welding region by a displacement reaction;
and a later procedure, namely molding, electrical testing, final inspection and packaging the multilayer board.
In some alternative embodiments, the outer layer process specifically includes:
a step of dry film pressing treatment, which is to cover a photosensitive film on the surface of the copper layer;
Exposing the photosensitive film by UV light;
a developing treatment, namely dissolving the unpolymerized photosensitive film in the exposure treatment to expose the copper surface;
etching, namely etching and removing the copper layer with the copper surface exposed to form an outer layer circuit.
In some optional embodiments, in the anti-welding procedure, the window opening process is not performed on the invalid golden finger area, and the ink layer is formed on the invalid golden finger area through the anti-welding process on the invalid golden finger area.
In some alternative embodiments, the ink layer thickness is higher than the copper layer thickness of the active gold finger area.
In some alternative embodiments, the active golden finger regions and inactive golden finger regions are alternately spaced apart.
In some alternative embodiments, after the welding prevention process and before the gold forming process, a text process is further included, wherein the text process specifically includes printing text symbols for identification on the surface of the multilayer board.
In some alternative embodiments, the pre-process specifically includes:
cutting a substrate into a laminate with a preset size through a board dividing machine, and baking the laminate;
An inner layer process, namely manufacturing an inner layer circuit on the laminate according to the inner layer image and the board frame data;
A lamination process, namely aligning the positioning holes of the plurality of laminates, and laminating the plurality of laminates to form a multilayer board through preset temperature and preset pressure;
and a drilling procedure, namely drilling through holes among different layers of the multilayer board through a numerical control drilling machine.
In some alternative embodiments, the post-process specifically includes:
A forming process, namely milling the multi-layer board after the gold melting process into a single PCS or a connected circuit board;
an electrical measurement procedure, namely conducting detection on the circuit board;
A final inspection procedure, namely performing appearance final inspection on the circuit board passing through the electrical measurement, and screening out qualified circuit boards;
and packaging, namely packaging and delivering qualified circuit boards according to the care number.
According to another aspect of the embodiment of the invention, a PCB golden finger wiring device is provided, and the device is used for executing the PCB golden finger wiring method and manufacturing a printed circuit board.
According to still another aspect of the embodiment of the present invention, a printed circuit board is provided, which is characterized in that the printed circuit board is manufactured by executing the PCB golden finger wiring method described above through the PCB golden finger wiring device described above.
The PCB golden finger wiring method and device and the PCB have the beneficial effects that through the outer layer working procedure, the multi-layer board is sequentially subjected to dry film pressing treatment, exposure treatment, development treatment and etching treatment, an outer layer circuit is formed on the surface of the multi-layer board, wherein the multi-layer board comprises an effective golden finger area and an ineffective golden finger area, the outer layer circuit comprises the effective golden finger area, a copper layer of the effective golden finger area is manufactured, the welding area of the multi-layer board is subjected to windowing treatment through the anti-welding working procedure, and other areas of the multi-layer board except the welding area are subjected to anti-welding treatment, the welding area comprises the effective golden finger area, and an ink layer of the ineffective golden finger area is manufactured. The effective golden finger area has the function of signal transmission and driving power supply, and the ineffective golden finger area has the function of structural reinforcement and board surface leveling. The thickness uniformity of the photoelectric plate golden finger is guaranteed, the production cost is reduced, and the yield of the photoelectric plate golden finger is improved.
The foregoing description is only an overview of the technical solutions of the embodiments of the present invention, and may be implemented according to the content of the specification, so that the technical means of the embodiments of the present invention can be more clearly understood, and the following specific embodiments of the present invention are given for clarity and understanding.
Drawings
The drawings are only for purposes of illustrating embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
Fig. 1 shows a schematic flow chart of a wiring method of a golden finger of a PCB board in embodiment 1 provided by the invention;
FIG. 2 is a schematic flow chart showing the outer layer process of example 1 provided by the present invention;
FIG. 3 shows a schematic flow chart of the previous process of example 1 provided by the present invention;
FIG. 4 is a schematic view showing the structure of the post-process of example 1 provided by the present invention;
Fig. 5 shows a schematic structural diagram of an effective golden finger area and an ineffective golden finger area of embodiment 1 provided by the present invention.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein.
In the case of example 1,
Referring to fig. 1, according to an aspect of the embodiment of the present invention, there is provided a PCB golden finger wiring method, which may be applied to an LCD or LED optoelectronic board, the method including:
110, a pre-process, namely manufacturing a multi-layer board, and drilling holes on the multi-layer board, wherein in the step 110, the pre-process specifically comprises the steps of cutting a substrate into laminated boards with preset sizes through a board cutting machine, baking the laminated boards, manufacturing an inner layer circuit on the laminated boards according to inner layer images and board frame data, aligning the positioning holes of the laminated boards, laminating the laminated boards to form the multi-layer board through preset temperature and preset pressure, and drilling through holes between different layers of the multi-layer board through a numerical control drilling machine.
And 120, electroplating, namely forming a copper layer with a preset thickness on the multilayer board, wherein in step 120, the multilayer board is required to be put into an electroplating bath and then subjected to electrode reaction when electroplating is carried out, so that copper ions are deposited on the surface of the circuit board to form a copper film with uniform and smooth thickness. Parameters such as electroplating time, current density, temperature and the like need to be adjusted according to specific conditions so as to achieve the best effect.
130, An outer layer process, namely sequentially performing dry film pressing treatment, exposure treatment, development treatment and etching treatment on the multilayer board to form an outer layer circuit on the surface of the multilayer board, wherein the multilayer board comprises an effective golden finger area and an ineffective golden finger area, the outer layer circuit comprises the effective golden finger area, and in step 130, the outer layer process specifically comprises the steps of covering a photosensitive film on the surface of a copper layer, exposing the photosensitive film through UV light, dissolving the unpolymerized photosensitive film in the exposure treatment to expose a copper surface, and etching and removing the copper layer exposed from the copper surface to form the outer layer circuit.
140, Performing a welding prevention process, namely windowing a welding area of the multi-layer board and performing welding prevention processing on other areas of the multi-layer board except the welding area, wherein the welding area comprises an effective golden finger area, and in step 140, the welding prevention layer of the multi-layer board is an important step for protecting a circuit after etching the circuit board, and is usually realized through welding prevention ink, which is also called green paint or green oil. In the application, the window opening treatment is carried out on the welding area of the multilayer board, so that the effective golden finger area is not covered with ink, and only non-welding areas such as the ineffective golden finger area are covered with ink.
150, A gold-plating process, wherein a nickel-gold layer is formed in the welding area through a displacement reaction, and in step 150, , a composite plating layer of nickel and gold is formed on the surface of the circuit board mainly through a chemical gold plating method, which is also called nickel-plating immersion gold. this method does not require the complex process of electroplating, but rather the nickel and gold are attached to the copper sheet by chemical displacement.
160, A post-process, namely molding, electrical testing, final inspection and packaging the multilayer board. In step 160, the post-process specifically includes milling the multi-layer board after the gold-plating process into a single PCS or a connected circuit board, detecting the electrical conduction of the circuit board, screening out qualified circuit boards, and packaging and delivering the qualified circuit boards according to the care number.
The method comprises the steps of sequentially carrying out dry film pressing treatment, exposure treatment, development treatment and etching treatment on a multi-layer board through an outer layer procedure, forming an outer layer circuit on the surface of the multi-layer board, wherein the multi-layer board comprises an effective golden finger area and an ineffective golden finger area, the outer layer circuit comprises the effective golden finger area, a copper layer of the effective golden finger area is manufactured, window opening treatment is carried out on a welding area of the multi-layer board through a welding prevention procedure, welding prevention treatment is carried out on other areas of the multi-layer board except the welding area, the welding area comprises the effective golden finger area, and an ink layer of the ineffective golden finger area is manufactured. The effective golden finger area has the function of signal transmission and driving power supply, and the ineffective golden finger area has the function of structural reinforcement and board surface leveling. The thickness uniformity of the photoelectric plate golden finger is guaranteed, the production cost is reduced, and the yield of the photoelectric plate golden finger is improved.
In some alternative embodiments, referring to fig. 2, the outer layer process specifically includes 210, pressing a dry film to cover a photosensitive film on the surface of the copper layer, 220, exposing the photosensitive film by UV light, 230, developing, dissolving the unpolymerized photosensitive film in the exposing process to expose the copper surface, 240, etching to remove the copper layer exposed from the copper surface to form an outer layer circuit.
In some alternative embodiments, in the anti-welding process, the window opening process is not performed on the invalid golden finger area, and the ink layer is formed on the invalid golden finger area through the anti-welding process on the invalid golden finger area. Referring to fig. 5,500 is a multi-layer board, 510 is an active gold finger area, and 520 is an inactive gold finger area. The effective golden finger regions 510 and the ineffective golden finger regions 520 are alternately arranged at intervals. The thickness of the ink layer of the invalid golden finger area is higher than that of the copper layer of the effective golden finger area. The thickness of the ink layer of the invalid golden finger area is 35um-45um, and the thickness of the copper layer of the effective golden finger area is 31um-41um, so that the thickness of the LCD photoelectric plate golden finger is relatively uniform. In a specific example, the ink layer of the invalid gold finger region has a thickness of 43.17um, and the copper layer of the valid gold finger region has a thickness of 35.12um.
In some alternative embodiments, after the welding prevention process and before the gold forming process, a text process is further included, wherein the text process specifically includes printing text symbols for identification on the surface of the multilayer board. In this embodiment, various character symbols are printed on the multilayer board for easy recognition.
In some alternative embodiments, referring to fig. 3, the pre-process specifically includes a cutting process 310 of cutting a substrate into laminates with preset sizes through a board dividing machine and baking the laminates, a lining process 320 of manufacturing an inner layer circuit on the laminates according to an inner layer image and a board frame data, a pressing process 330 of pressing the laminates according to positioning holes of the laminates to form a multilayer board through preset temperature and preset pressure, and a drilling process 340 of drilling through holes among different layers of the multilayer board through a numerical control drilling machine. In this embodiment, the steps 310-340 are implemented to realize that the large-size substrate is cut into working size and processed and baked, so as to prepare for manufacturing the inner layer circuit, make inner layer graph and plate frame data, align the positioning holes of the inner layer, press multiple cores and pp into a multi-layer board by high temperature and high pressure, and drill through holes between different layers by a numerical control drilling machine according to the design of customers.
In some alternative embodiments, referring to fig. 4, the post-process specifically includes 410, a forming process, 420, an electrical testing process, 430, a final inspection process, 430, and a packaging process, wherein the multi-layer board after the gold-melting process is milled into a single PCS or a connected circuit board, the electrical conduction detection is performed on the circuit board, the final inspection process is performed on the circuit board passing through the electrical testing, qualified circuit boards are screened out, and the packaging process is performed on the qualified circuit boards according to the care number. In this embodiment, the steps 410-440 are used to mill the multi-typesetting manufacturing boards into single PCS or continuous shipment boards, so as to meet the customer plug-in requirements, test the electrical conduction status of the circuit board, finally check the appearance of the circuit board before shipment, and package the PCB finished boards with different material numbers in a classified manner, so that the PCB finished boards can be transported and moisture absorption is avoided, and the customer requirements are met.
Example 2:
According to another aspect of the embodiment of the invention, a PCB golden finger wiring device is provided, and the device is used for executing the PCB golden finger wiring method and manufacturing a printed circuit board. In this embodiment, the following steps are performed by the PCB golden finger routing device:
Cutting, namely cutting a substrate with a large size into a working size, processing and baking to prepare for manufacturing an inner layer circuit;
an inner layer, which is to make inner layer graphics and plate frame data;
Laminating, namely laminating a plurality of cores and pp into a multi-layer board by utilizing high temperature and high pressure according to the alignment of the positioning holes of the inner layer;
drilling, namely drilling through holes among different layers by utilizing a numerical control drilling machine according to the design of a customer;
electroplating, namely generating a copper layer with a certain thickness in the hole and on the plate surface through a displacement reaction, and realizing the conduction function between different layers;
The outer layer is formed by transferring a design pattern onto a photosensitive film through exposure irradiation after film pressing according to the copper sheet at the outermost layer, developing to wash away the photosensitive film which does not receive photopolymerization reaction to expose the copper surface, and etching to etch away the copper exposed from the copper surface to form a required circuit pattern;
in the design of the circuit board, part of the outer layer patterns need to be welded with parts and Bonding, some of the outer layer patterns do not need to be covered by ink, and the unnecessary parts are insulated and prevented from causing connection short circuit between wires when the parts are welded, so that the appearance is beautified;
the characters are printed with various character symbol marks on the circuit board so as to be convenient for recognition;
forming a nickel-gold layer with good oxidation resistance and welding effect on a client welding position through a displacement reaction;
Milling the multi-typesetting manufacturing boards into single PCS or connected cargo boards, so as to meet the requirements of customer plug-ins;
Testing the electrical conduction state of the circuit board;
Final inspection, namely finally inspecting the appearance of the circuit board before the product is delivered;
and packaging, namely sorting and packaging the PCB finished products with different material numbers, so that the PCB finished products can be transported and prevented from absorbing moisture, and the requirements of customers are met.
Only the golden finger in the effective area is reserved in the outer layer graph, and the Dummy pad golden finger design in the non-effective area is removed, so that the signal transmission and driving power supply functional functions are reserved. The solder resist data is designed to open windows for the golden fingers in the effective area, so that a nickel-gold layer is normally formed in the subsequent process, and the Dummy pad golden fingers in the non-effective area are removed from the outer layer, so that the positions are lower than the effective areas, and therefore the positions are designed to not open windows to cover ink, so that the ink fills the lower areas, the thickness of the plate is ensured to be even and smooth, and the Bonding quality requirement is met. Through verification, the outer layer non-effective area Dummy pad golden finger design is removed, the anti-welding exposure data is subjected to non-windowing oil covering design, the contrast thickness is 8.05um, the Bonding quality requirement of a customer is met, the gold melting area is reduced by about 27%, and the subsequent golden finger wiring design aiming at the LCD photoelectric plate can be designed in the mode.
Example 3:
According to still another aspect of the embodiment of the present application, a printed circuit board is provided, which is characterized in that the printed circuit board is manufactured by executing the PCB golden finger wiring method described above through the PCB golden finger wiring device described above. In the embodiment, the method sequentially performs dry film pressing treatment, exposure treatment, development treatment and etching treatment on the multilayer board through an outer layer procedure to form an outer layer circuit on the surface of the multilayer board, wherein the multilayer board comprises an effective golden finger area and an ineffective golden finger area, the outer layer circuit comprises the effective golden finger area, a copper layer of the effective golden finger area is manufactured, the window opening treatment is performed on a welding area of the multilayer board through a welding prevention procedure, welding prevention treatment is performed on other areas of the multilayer board except the welding area, the welding area comprises the effective golden finger area, and an ink layer of the ineffective golden finger area is manufactured. The effective golden finger area has the function of signal transmission and driving power supply, and the ineffective golden finger area has the function of structural reinforcement and board surface leveling. The thickness uniformity of the photoelectric plate golden finger is guaranteed, the production cost is reduced, and the yield of the photoelectric plate golden finger is improved.
In the description provided herein, numerous specific details are set forth. It will be appreciated, however, that embodiments of the invention may be practiced without such specific details. Similarly, in the above description of exemplary embodiments of the invention, various features of embodiments of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. Wherein the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
Those skilled in the art will appreciate that the modules in the apparatus of the embodiments may be adaptively changed and disposed in one or more apparatuses different from the embodiments. The modules or units or components of the embodiments may be combined into one module or unit or component and, furthermore, they may be divided into a plurality of sub-modules or sub-units or sub-components. Except that at least some of such features and/or processes or elements are mutually exclusive.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names. The steps in the above embodiments should not be construed as limiting the order of execution unless specifically stated.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411316232.8A CN119342703A (en) | 2024-09-20 | 2024-09-20 | PCB board gold finger wiring method, device and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411316232.8A CN119342703A (en) | 2024-09-20 | 2024-09-20 | PCB board gold finger wiring method, device and printed circuit board |
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| Publication Number | Publication Date |
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| CN119342703A true CN119342703A (en) | 2025-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202411316232.8A Pending CN119342703A (en) | 2024-09-20 | 2024-09-20 | PCB board gold finger wiring method, device and printed circuit board |
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| CN (1) | CN119342703A (en) |
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