CN119324714B - Front end of tile type integrated radio frequency receiving array with open architecture - Google Patents
Front end of tile type integrated radio frequency receiving array with open architectureInfo
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- CN119324714B CN119324714B CN202411316883.7A CN202411316883A CN119324714B CN 119324714 B CN119324714 B CN 119324714B CN 202411316883 A CN202411316883 A CN 202411316883A CN 119324714 B CN119324714 B CN 119324714B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/08—Constructional details, e.g. cabinet
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/0003—Software-defined radio [SDR] systems, i.e. systems wherein components typically implemented in hardware, e.g. filters or modulators/demodulators, are implented using software, e.g. by involving an AD or DA conversion stage such that at least part of the signal processing is performed in the digital domain
- H04B1/0007—Software-defined radio [SDR] systems, i.e. systems wherein components typically implemented in hardware, e.g. filters or modulators/demodulators, are implented using software, e.g. by involving an AD or DA conversion stage such that at least part of the signal processing is performed in the digital domain wherein the AD/DA conversion occurs at radiofrequency or intermediate frequency stage
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/1607—Supply circuits
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Abstract
The invention discloses a front end of a tile type integrated radio frequency receiving array with an open framework. The front end comprises an antenna module, a tile-type front end receiving module, a frequency conversion module, a multifunctional feed board, a comprehensive digital module and a power supply module, wherein the antenna module receives space electromagnetic signals, the front end receiving module amplifies the space electromagnetic signals received by the antenna, performs sub-array level signal synthesis and amplitude-phase modulation of analog signals, the frequency conversion module converts broadband radio frequency signals into intermediate frequency signals, the multifunctional feed board provides a connecting interface of the analog signals and the digital signals, the comprehensive digital module converts the analog signals and the radio frequency signals into the digital signals to generate high-speed data streams, and performs unified control of array-plane amplitude phase change frequency, and the power supply module provides power supply and power supply management for each functional module. The invention has the advantages of integrated structure, open architecture, reconfigurable function, light and thin structure and wide band receiving, and can meet the functional requirements of radar, electronic warfare and communication.
Description
Technical Field
The invention relates to the technical field of system design of phased array surfaces, in particular to a front end of a tile type integrated radio frequency receiving array with an open framework.
Background
In modern countermeasures, the mastering of electromagnetic information determines the key to the success of the war. In the face of complex operational environments, carrier-based platforms are required to have strong electromagnetic receiving capability. The traditional carrier-based radio frequency receiver is provided with various receiving channels with a plurality of different functions, so that antenna equipment in an upper building is increased continuously, various systems are mutually interfered, additional electromagnetic compatibility design is needed, the electromagnetic stealth performance of a ship is greatly influenced, and future combat demands are difficult to adapt.
Patent CN113938146A discloses a high-integration ultralow-noise tile-type receiving component of Ka frequency band, a method for assembling a monitoring network and a receiving channel in a component shell is adopted to realize the tile-type high-integration design of the Ka section, but an interface in the component is not open and can only be applied to a product of a certain model, and patent CN115688210A discloses a tile-type multichannel receiving and transmitting subarray design method, which is used for forming a receiving and transmitting subarray by combining an antenna and a receiving and transmitting component together, so that the system integration level is improved, the array plane height is reduced, but the subarray integration only reaches an analog channel part, the cooperation of modules such as a rear-end digital power supply and the like is needed, and the complete independent subarray function still cannot be realized.
In order to solve the problems, an integrated receiving array surface compatible with functions such as radar, electronic warfare and communication is urgently needed, and function control and resource unified scheduling are implemented.
Disclosure of Invention
The invention aims to provide the front end of the tile type integrated radio frequency receiving array with an open architecture, reconfigurable function, compatibility with various functional applications and strong expansibility.
The technical scheme for realizing the purpose of the invention is that the front end of the tile type comprehensive radio frequency receiving array of an open architecture comprises an antenna module, a front end receiving module, a frequency conversion module, a multifunctional feed plate, a comprehensive digital module and a power supply module;
The antenna module is used for providing matching of space electromagnetic and radio frequency transmission channels and monitoring amplitude phase change conditions of each channel of the array surface at regular time;
The front-end receiving module is used for amplifying the space electromagnetic signals received by the antenna, synthesizing subarray-level signals, modulating the amplitude and phase of analog signals according to beam directions, and enhancing the signal receiving intensity in a certain direction of space;
the frequency conversion module is used for carrying out frequency mixing, filtering and amplifying on the broadband radio frequency signals, converting the broadband radio frequency signals into intermediate frequency signals and inhibiting additionally generated spurious signals;
The multifunctional feed plate is used for providing a connection interface of analog signals and digital signals and providing connection control signals and a power supply in the forward direction;
The comprehensive digital module is used for converting analog and radio frequency signals into digital signals, generating high-speed data streams according to input signals, performing back-end operation, and providing a unified control function of array amplitude phase change frequency;
the power module adopts a high-frequency oscillation switch power supply to convert an input high-voltage signal into various low-voltage power supplies for output, and provides power supply and power management for each functional module.
Further, the antenna module comprises an antenna unit, an inner monitoring unit and a comprehensive wiring layer;
The antenna unit is used for matching space electromagnetic and radio frequency transmission channels, adopts a low-profile broadband antenna, and comprises a tightly-coupled cross-shaped printed antenna, a Violet first antenna, a butterfly-shaped element antenna and an open slot antenna so as to realize broadband reception;
the inner monitoring unit synthesizes the coupling signals of each path of array element into an array surface inner monitoring signal, uniformly enters an inner monitoring transceiver module at the rear end of the inner monitoring unit, and monitors the amplitude phase change condition of each channel of the array surface at fixed time;
the comprehensive wiring layer is used for connecting a receiving radio frequency channel with an antenna module port and keeping the phase consistency of each channel;
the inner monitoring unit and the comprehensive wiring layer are realized in a mode of embedding wiring in the multilayer radio frequency printed board, and are integrally designed with the antenna module.
Further, the front end receiving module adopts a silicon-based packaging microsystem mode to realize the arrangement of the antenna subarray surface, and the method specifically comprises the following steps:
The front-end limiting amplifying chip, the multichannel amplitude-phase modulation chip and the combined chip are packaged into a self-sealing device of a patch by adopting a silicon-based adapter plate, the chips are arranged in a stacked welding mode and in a height mode in the package body, the patch of the silicon-based packaging microsystem module is welded to a front-end carrier plate, and an interface is advanced and then discharged according to a tile-type structure.
Furthermore, the frequency conversion module adopts an independent box body for packaging, or firstly adopts a ceramic micro-packaging mode for packaging the core function chip, and then uses the box body for secondary packaging, so that the integration level is improved, and the frequency conversion module can integrate the channel delay and input switch combination switching function.
Further, the multifunctional feed board distributes signals in a mode of multilayer printed boards and micro-interconnection elastic connection, and signal networks with different functions are distributed in layers in the printed boards so as to realize interconnection of various complex signals.
The integrated digital module is composed of digital, analog and photoelectric devices, comprises an AD chip, an FPGA chip, a photoelectric conversion chip and a power management chip, and adopts an SOC chip integrating the AD and FPGA operation cores, and can not only independently control subarrays to work and generate pointing information of a specific azimuth target, but also realize the collaborative work of multiple subarrays or a full array surface according to the application requirements of different functions and different load platforms, thereby realizing the flexible and configurable array surface aperture resources.
The front end of the tile type comprehensive radio frequency receiving array surface adopts a multi-level interface, the tile type comprehensive radio frequency receiving array surface adopts a hierarchical connection design, universal interfaces are adopted among modules, digital preprocessing, dynamic expansion of a receiver, array surface radio frequency cancellation and distributed preprocessing among different subarrays are adopted to realize an open architecture and a function reconfiguration, each module is provided with an independent functional interface, definition of each interface is distributed according to power supply, radio frequency and low frequency control, a contact elastic joint is adopted, when each module is used separately, each function is independently realized, and when technology is upgraded and the module is updated, each module is upgraded according to the interface.
The front end of the tile type comprehensive radio frequency receiving array adopts a generalized framework, and array surface expansion design is carried out according to different load platforms and array surface scales, so that receiving array surfaces with different scales are formed by splicing.
Furthermore, the front end of the tile type integrated radio frequency receiving array adopts a laminated design, and based on a low-profile conformal antenna, the conformal design with the surface of the mounting platform is realized through the arrangement of a rear end receiving structure.
Furthermore, the front end of the tile type comprehensive radio frequency receiving array adopts an AD chip with dynamic and sampling rate meeting requirements, and the AD chip covers the working bandwidth of multiple functions, thereby not only realizing the reconnaissance function, but also meeting the narrowband communication receiving function, and simultaneously being capable of switching various forms of space wave beams by matching with a distributed radar.
Compared with the prior art, the invention has the remarkable advantages that (1) the system has a development type framework, the system can go forward and backward according to signal flow, the hierarchy functions are clear, the functions are realized independently, the modules with the same interfaces can be replaced independently, the framework is open, (2) the function is reconfigurable, the front end of the system can cover the working frequency and the working bandwidth of multiple functions, has higher receiving dynamic, can be compatible with radar, electronic warfare, communication and other functional applications, can be matched with a system to switch working modes at any time, and (3) the system has expandability, the plane size of the front end of the system of the receiving system is smaller than the splicing size of an antenna, the expandable design of the system can be carried out according to different load platforms and the array scale, and the receiving system can be spliced at will to form the receiving array of different scales.
Drawings
FIG. 1 is a schematic exploded view of the design of the present invention.
Fig. 2 is a block diagram of the front end of an open architecture tile-type integrated radio frequency receiving array according to the present invention.
Fig. 3 is a schematic structural diagram of a front end of a tile-type integrated radio frequency receiving array with an open architecture according to an embodiment.
Fig. 4 is a schematic structural diagram of a front-end receiving module and a frequency conversion module in an embodiment of the present invention.
Fig. 5 is a schematic diagram of an extended array plane in an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a tile-shaped receiving front-end expansion splice according to an embodiment of the present invention.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
Referring to fig. 1 to 3, the front end of the tile-type integrated radio frequency receiving array with an open architecture of the present invention specifically includes the following parts:
S1, the front end of the comprehensive radio frequency receiving array surface of the tile framework mainly comprises an antenna module, a front end receiving module, a frequency conversion module, a multifunctional feed plate, a comprehensive digital module, a power supply module and the like.
S2, the working mechanism is that the front end of the comprehensive radio frequency receiving array of the tile framework mainly has the function of receiving electromagnetic signals radiated by space, and the electromagnetic signals enter an AD sampling digital channel after analog processing such as amplitude limiting amplification, amplitude phase modulation, subarray synthesis, frequency conversion and the like, and are subjected to digital preprocessing to generate high-speed data streams. The data stream contains fundamental information such as frequency, amplitude, phase, etc. of the complete spatial electromagnetic signal. With the input, the space electromagnetic sensing information such as signal direction, modulation information, target echo characteristics and the like of the space can be obtained through various operations.
In order to be compatible with radar, electronic warfare, communication and other functions, an integrated universal receiving platform is provided, an analog channel from an electromagnetic signal to a digital sampling end must be designed to be as wide as possible, the working bandwidth of multiple functions is covered, and the resolution of the digital receiver in a complex electromagnetic environment can be improved by adopting an AD chip with high dynamic and high sampling rate.
S3, architecture design:
the front end of the comprehensive radio frequency receiving array of the tile framework is designed in a layered mode according to the signal flow direction in the signal transmission direction, the signal flow direction is space radiation, the antenna module is used for receiving front end modules, the frequency conversion module, the multifunctional feed plate, the comprehensive digital module and the optical fiber output, the multifunctional feed plate provides a connection interface for analog signals and digital signals, and auxiliary resources such as connection control signals, power supplies and the like are provided in the forward direction.
And S4, the antenna module is further divided into an antenna unit, an inner monitoring unit and a comprehensive wiring layer by module functions. The antenna unit provides matching of space electromagnetic and radio frequency transmission channels, and various modes such as a tightly coupled cross printed antenna, a Virwan antenna, a butterfly element antenna, an open slot antenna and the like can be selected for realizing various realization modes of the broadband receiving antenna. The internal monitoring unit is mainly used for providing the coupling signals of each path of array element, the integrated monitoring signals in the array surface are synthesized and then uniformly enter the internal monitoring transceiver module at the rear end, the amplitude phase change condition of each channel of the array surface can be monitored at fixed time, the comprehensive wiring layer is mainly used for matching the connection between the receiving radio frequency channel and the port of the antenna module, and the phase consistency of each channel must be maintained in design. The internal monitoring unit and the comprehensive wiring layer are realized in a mode of embedding wires in the multilayer radio frequency printed board, and can be designed integrally with the antenna unit part.
S5, the front-end receiving module is mainly used for further amplifying the space electromagnetic signals received by the antenna, adopting subarray-level signal synthesis and carrying out amplitude-phase modulation on analog signals according to beam directions so as to enhance the signal receiving intensity in a certain direction of space. In order to realize the arrangement of the antenna subarray surface, the implementation adopts a microsystem integrated design, specifically, a silicon-based adapter plate is used for packaging a front-end limiting amplifying chip, a multichannel amplitude-phase modulation chip, a combining chip and the like into a patch self-sealing device with a smaller size, and the package body can further adopt a stacking welding mode to arrange the chips in a height mode for improving the packaging efficiency. The silicon-based packaging microsystem module patch is welded to the front-end carrier plate, and the interface is advanced and then discharged according to the tile-type structure.
S6, the frequency conversion module is mainly used for converting a broadband radio frequency signal into a lower intermediate frequency signal through frequency mixing, filtering, amplifying and the like, and the frequency conversion system is required to have higher dynamic state for keeping the integrity of radio frequency information and is required to inhibit spurious signals generated additionally in the frequency conversion process. In order to further cooperate with the array plane to work, the functions of channel delay, input switch combination switching and the like can be further integrated. The chip with multiple functions such as mixing, filtering, amplifying and switching is needed in the implementation, and the chip with multiple functions is internally related to the chip with multiple functions and complex interconnection relationship, so that an independent box body packaging mode can be adopted in the implementation, a ceramic micro-packaging technology can also be used for packaging the core functional chip, and the box body is used for secondary packaging, so that the integration level is improved.
And S7, the multifunctional feed board has the main functions of providing a connection interface of analog signals and digital signals, and providing auxiliary resources such as connection control signals, power supplies and the like in the forward direction. In order to realize interconnection of various complex signals in a limited space, the realization is mainly realized by adopting multilayer printed boards and micro interconnection elastic connection, and signal distribution is realized by arranging signal networks without functions in layers in the printed boards.
S8, the integrated digital module is mainly used for converting analog and radio frequency signals into digital signals, generating high-speed data stream according to input signals, providing back-end operation data and further providing a unified control function of array-area-width phase-change frequency control. The implementation mainly comprises digital, analog and photoelectric devices such as an AD chip, an FPGA chip, a photoelectric conversion chip, a power management chip and the like, and further an SOC chip integrating AD and FPGA operation cores can be adopted. The integrated digital module can not only independently control the subarrays to work according to the application requirements of different functions and different load platforms to generate the pointing information of a specific azimuth target, but also realize the cooperative work of a plurality of subarrays or a whole array surface, thereby realizing the flexible and configurable array surface aperture resources.
S9, the power supply module is mainly used for converting the input high-voltage signals into various low-voltage power supply outputs, providing power supply and power management for each functional module of the subarray and receiving control signals of the comprehensive digital module. The high-frequency oscillation switch power supply is adopted in the implementation, the power supply voltage conversion efficiency is improved, and the heat consumption of the power supply module is reduced as much as possible.
Furthermore, the front end of the tile type comprehensive radio frequency receiving array surface of the open framework adopts a hierarchical design, the front end is advanced and then discharged according to signal flow, the hierarchical function is clear, an antenna module is responsible for a space electromagnetic interface, a front end receiving module is responsible for amplitude-phase modulation, a frequency conversion module is responsible for conversion from radio frequency to intermediate frequency, a comprehensive digital module is responsible for digital preprocessing and beam control, and a power module provides high-voltage and low-voltage conversion. Each module is provided with an independent functional interface, and the definition of each interface is distributed according to power supply, radio frequency, low frequency control and the like, so that the contact elastic connector is adopted. If each module is used separately, the functions of each module can be realized independently, such as technology upgrading and module updating, each module can be upgraded according to the interface, and the whole radio frequency front end does not need to be replaced.
Furthermore, the front end of the tile type comprehensive radio frequency receiving array adopts a microsystem integration technology and a radio frequency comprehensive wiring technology, so that the size of the front end of the whole receiving array is greatly reduced, and the plane size of the front end of the whole receiving array is smaller than the splicing size of an antenna, so that the array surface can be designed in an extensible mode according to different load platforms and array surface scales. The front end of the tile-type receiving front array is used as a generalized framework, and can be spliced arbitrarily to form receiving array surfaces with different scales.
Furthermore, the tile-type framework can further adopt a low-profile conformal antenna due to the adoption of a laminated design, the rear-end receiving structure of the fine design is distributed, the conformal design with the surface of the mounting platform is realized, and the stealth performance of the platform is improved.
Furthermore, the architecture design of the front end of the tile type comprehensive radio frequency receiving array covers the working bandwidth of multiple functions, and an AD chip with high dynamic and high sampling rate is adopted. The method not only can meet the wide frequency-wide airspace coverage of a reconnaissance function, but also can provide the narrow bandwidth communication receiving function with high dynamic and low distortion, and can be matched with a distributed radar to perform various types of space beam switching. The integrated reconfigurable receiving platform can be compatible with radar, electronic war, communication and other functional applications.
The front end of the tile type comprehensive radio frequency receiving array is as shown in fig. 5 and 6, and the micro-system integration technology and the radio frequency comprehensive wiring technology are adopted, so that the volume is greatly reduced, the plane size of the front end of the whole receiving array is smaller than the splicing size of an antenna, therefore, the front end of the tile type comprehensive radio frequency receiving array can be subjected to array surface extensible design according to different load platforms and array surface scales, and the front end of the tile type comprehensive radio frequency receiving array is used as a generalized framework, and can be spliced to form receiving array surfaces with different scales at will.
In planar dimensions, sub-array antenna dimensions are calculated from the phased array plane:
The antenna subarray size is:
wherein, the Is the array unit spacing; Is the highest operating frequency wavelength; Is the scanning angle; The array element number of the subarray horizontal antenna is the array element number of the subarray horizontal antenna; Is the number of subarray vertical antenna array elements.
The planar dimensions of all functional modules of the receiving front terminal array are constrained byWithin the range of (1), and front and back tile type splicing is adopted to form a receiving front end array. According to the size scale of the array surface of the adaptive loading platform, the receiving front end array can be two-dimensionally expanded into a receiving array surface with any multiple of array elements of the subarray.
The invention will now be described in further detail with reference to the drawings and to specific examples.
Examples
The embodiment provides a front end of a comprehensive radio frequency receiving array surface of a tile framework, which mainly comprises an antenna module, a front end receiving module, a frequency conversion module, a multifunctional feed plate, a comprehensive digital module, a power supply module and the like.
In design, as shown in fig. 1, a schematic diagram of functional application decomposition is shown, and the architecture of the front end of the tile type integrated radio frequency receiving array is designed to meet the requirements of radar, electronic warfare, communication and other functional applications, so as to provide an integrated reconfigurable receiving platform. The design adopts an open architecture, and has the advantages of reconfigurable functions, light and thin structure, broadband receiving and the like.
In order to realize the full coverage of a broadband receiving airspace, and the system of matching with the system, a multi-beam system, an analog-digital beam synthesis system, a full polarization receiving channel and the like are adopted, various equipment light and small components such as a low-profile broadband antenna, a radio frequency microsystem integration system, a digital SOC integration system and the like can be adopted for realizing the light design, a multi-level interface is adopted for the design of realizing an open architecture and the function reconstruction, a tile-type hierarchical connection design is adopted, a universal interface is adopted among modules, a digital preprocessing technology is fully exerted, the dynamic expansion of a receiver, the radio frequency cancellation of an array plane, the distributed preprocessing technology among different subarrays and the like are adopted.
The working principle block diagram is shown in figure 2, and the signal flow direction is space radiation, an antenna module, a receiving front-end module, a frequency conversion module, a multifunctional feed plate, an integrated digital module and optical fiber output. The multifunctional feed board provides a connection interface of analog signals and digital signals, and forward provides auxiliary resources such as connection control signals, power supplies and the like. The main function is to receive electromagnetic signals radiated by space, and after analog processing such as amplitude limiting amplification, amplitude phase modulation, subarray synthesis, frequency conversion and the like, the electromagnetic signals enter an AD sampling digital channel to be subjected to digital preprocessing to generate high-speed data streams. The data stream contains fundamental information such as frequency, amplitude, phase, etc. of the complete spatial electromagnetic signal. The receiving front end covers the working frequency and the working bandwidth of multiple functions, and adopts an AD chip with high dynamic and high sampling rate. The wide frequency wide airspace coverage of the reconnaissance function can be met, the instantaneous wide bandwidth receiving function can be provided, the high dynamic high low distortion narrow bandwidth communication receiving function can be provided, and meanwhile, the distributed radar can be matched to perform various types of space beam switching.
The three-dimensional structure diagram of the front end array of the tile type integrated radio frequency receiving array is shown in figure 3. Wherein the channel section, including the three-dimensional block diagram of the receiving front-end module and the frequency conversion module, is shown in fig. 4. The front end of the tile type comprehensive radio frequency receiving array surface of the open framework adopts a hierarchical design, the front end enters and exits according to signal flow, the hierarchical function is clear, an antenna module is responsible for space electromagnetic signal receiving, a front end receiving module is responsible for amplitude-phase modulation, a frequency conversion module is responsible for conversion from radio frequency to intermediate frequency, a comprehensive digital module is responsible for digital preprocessing and wave beam control, and a power supply module provides high-low voltage conversion. Each module is provided with an independent functional interface, and the definition of each interface is distributed according to power supply, radio frequency, low frequency control and the like, so that the contact elastic connector is adopted. If each module is used separately, the functions of each module can be realized independently, such as technology upgrading and module updating, each module can be upgraded according to the interface, and the whole radio frequency front end does not need to be replaced.
The antenna module functions are further decomposed into antenna units, internal monitoring units and comprehensive wiring layers. The antenna unit provides matching of space electromagnetic and radio frequency transmission channels, and various modes such as a tightly coupled cross printed antenna, a Virwan antenna, a butterfly element antenna, an open slot antenna and the like can be selected for realizing various realization modes of the broadband receiving antenna. The internal monitoring unit is mainly used for providing the coupling signals of each path of array element, the integrated monitoring signals in the array surface are synthesized and then uniformly enter the internal monitoring transceiver module at the rear end, the amplitude phase change condition of each channel of the array surface can be monitored at fixed time, the comprehensive wiring layer is mainly used for matching the connection between the receiving radio frequency channel and the port of the antenna module, and the phase consistency of each channel must be maintained in design. The internal monitoring unit and the comprehensive wiring layer are realized in a mode of embedding wires in the multilayer radio frequency printed board, and can be designed integrally with the antenna unit.
The main function of the receiving front-end module is to further amplify the space electromagnetic signals received by the antenna, to synthesize the signals at the subarray level, and to modulate the amplitude and phase of the analog signals according to the beam direction, so as to enhance the signal receiving intensity in a certain direction of space. In order to realize the arrangement of the antenna subarray surface, the implementation adopts a microsystem integrated design, specifically, a silicon-based adapter plate is used for packaging a front-end limiting amplifying chip, a multichannel amplitude-phase modulation chip, a combining chip and the like into a patch self-sealing device with a smaller size, and the package body can further adopt a stacking welding mode to arrange the chips in a height mode for improving the packaging efficiency. The silicon-based packaging microsystem module patch is welded to the front-end carrier plate, and the interface is advanced and then discharged according to the tile-type structure.
The frequency conversion module has the main functions of converting a broadband radio frequency signal into a lower intermediate frequency signal through frequency mixing, filtering, amplifying and the like, and the frequency conversion system has higher dynamic state and is required to restrain additionally generated spurious signals in the frequency conversion process in order to keep the integrity of radio frequency information. In order to further cooperate with the array plane to work, the functions of channel delay, input switch combination switching and the like can be further integrated. The chip with multiple functions such as mixing, filtering, amplifying and switching is needed in the implementation, and the chip with multiple functions is internally related to the chip with multiple functions and complex interconnection relationship, so that an independent box body packaging mode can be adopted in the implementation, a ceramic micro-packaging technology can also be used for packaging the core functional chip, and the box body is used for secondary packaging, so that the integration level is improved.
The multifunctional feed board has the main functions of providing a connection interface of analog signals and digital signals, and providing auxiliary resources such as connection control signals, power supplies and the like in the forward direction. In order to realize interconnection of various complex signals in a limited space, the realization is mainly realized by adopting multilayer printed boards and micro interconnection elastic connection, and signal distribution is realized by arranging signal networks without functions in layers in the printed boards.
The integrated digital module has the main functions of converting analog and radio frequency signals into digital signals, generating high-speed data stream according to input signals, providing back-end operation data, and providing a unified control function of array amplitude phase-change frequency control. The implementation mainly comprises digital, analog and photoelectric devices such as an AD chip, an FPGA chip, a photoelectric conversion chip, a power management chip and the like, and further an SOC chip integrating AD and FPGA operation cores can be adopted. The integrated digital module can not only independently control the subarrays to work according to the application requirements of different functions and different load platforms to generate the pointing information of a specific azimuth target, but also realize the cooperative work of a plurality of subarrays or a whole array surface, thereby realizing the flexible and configurable array surface aperture resources.
The main function of the power supply part is to convert the input high-voltage signals into various low-voltage power supply outputs, provide power supply and power management of each functional module of the subarray and receive the control signals of the comprehensive digital module. The high-frequency oscillation switch power supply is adopted in the implementation, the power supply voltage conversion efficiency is improved, and the heat consumption of the power supply module is reduced as much as possible.
The front-end expansion and splicing three-dimensional diagram of the tile type comprehensive radio frequency receiving array is shown in fig. 6, and the micro-system integration technology and the radio frequency comprehensive wiring technology are adopted, so that the size of the front-end plane of the whole receiving array is greatly reduced, and the size of the front-end plane of the whole receiving array is smaller than the splicing size of an antenna, so that the array surface expansion design can be carried out according to different load platforms and array surface scales. The front end of the tile type integrated radio frequency receiving array is used as a generalized framework, and receiving array surfaces with different scales can be formed by arbitrary splicing.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
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