CN119320922A - Hot-dip tinned copper plate strip capable of reducing friction coefficient of copper strip surface and manufacturing method thereof - Google Patents
Hot-dip tinned copper plate strip capable of reducing friction coefficient of copper strip surface and manufacturing method thereof Download PDFInfo
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- CN119320922A CN119320922A CN202411833954.0A CN202411833954A CN119320922A CN 119320922 A CN119320922 A CN 119320922A CN 202411833954 A CN202411833954 A CN 202411833954A CN 119320922 A CN119320922 A CN 119320922A
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- 239000010949 copper Substances 0.000 title claims abstract description 152
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 100
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 27
- 238000005238 degreasing Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 238000000137 annealing Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 11
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 230000001680 brushing effect Effects 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 6
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 claims description 5
- 229910000042 hydrogen bromide Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 238000004321 preservation Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims 2
- 230000007797 corrosion Effects 0.000 abstract description 11
- 238000005260 corrosion Methods 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 abstract 2
- 230000000052 comparative effect Effects 0.000 description 10
- 229910000905 alloy phase Inorganic materials 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Thermal Sciences (AREA)
- Coating With Molten Metal (AREA)
Abstract
本发明公开了一种降低铜带表面摩擦系数的热浸镀锡铜板带及其制造方法，涉及铜板带热浸镀锡领域，旨在解决现有技术中无法使产品同时兼备高硬度和良好的可焊性、耐腐蚀性的问题，采用的技术方案是，先在铜板带的表面热浸镀一层纯锡层，在冷却至室温后，退火、保温，使铜板带和纯锡层之间生长Cu6Sn5层，并持续至Cu6Sn5层生长至占据了镀层整体厚度的一半以上，以提高铜板带锡镀层的硬度。从而实现了热浸镀锡铜板带能够兼具高硬度和良好的可焊性、耐腐蚀性，且最外层的纯锡层能够使铜板带具有较低的摩擦系数，插拔率低，能够用于多单子对插。
The invention discloses a hot-dip tinned copper strip with reduced surface friction coefficient of the copper strip and a manufacturing method thereof, relates to the field of hot-dip tinning of copper strips, aims to solve the problem that the prior art cannot make the product have both high hardness and good solderability and corrosion resistance. The technical scheme adopted is to first hot-dip plate a layer of pure tin on the surface of the copper strip, and after cooling to room temperature, anneal and keep warm, so that a Cu 6 Sn 5 layer grows between the copper strip and the pure tin layer, and continues until the Cu 6 Sn 5 layer grows to occupy more than half of the overall thickness of the coating, so as to improve the hardness of the tin coating of the copper strip. Thus, the hot-dip tinned copper strip can have both high hardness and good solderability and corrosion resistance, and the outermost pure tin layer can make the copper strip have a lower friction coefficient, a low plug-in rate, and can be used for multi-unit plug-in.
Description
Technical Field
The invention relates to the technical field of hot dip tinning of copper strips, in particular to a hot dip tinned copper strip capable of reducing friction coefficient of the surface of a copper strip and a manufacturing method thereof.
Background
The existing processing technology of the tinned copper plate belt is that pure tin is directly plated on the copper plate belt or a Cu 3 Sn layer is directly attached on a Cu matrix, and a Cu 6Sn5 layer is grown on the Cu 3 Sn layer.
For the direct dip plating process of pure tin, the process is recorded in an environment-friendly copper and copper alloy plate and strip surface hot dip tinning method of Chinese patent CN107587095B, and the product is characterized by good weldability and corrosion resistance but poor hardness.
In the process of directly attaching a Cu 3 Sn layer to a Cu substrate and growing a Cu 6Sn5 layer on a Cu 3 Sn layer, the process is described in chinese patent CN110592515B, a hot dip tinned copper material and a method for manufacturing the same, and the product is characterized by high hardness but poor solderability and corrosion resistance. The scanning electron microscope diagram of the alloy phase is shown in figure 1.
From the characteristics of the product, the existing processing technology can not ensure that the product has high hardness and good weldability and corrosion resistance.
Disclosure of Invention
The invention aims to overcome the existing defects, and provides a hot-dip tinned copper plate strip capable of reducing the friction coefficient of the surface of a copper strip and a manufacturing method thereof, which can effectively solve the problems in the background art.
In order to achieve the above purpose, the invention discloses a hot dip tin-plated copper plate strip for reducing the friction coefficient of the surface of a copper strip, which adopts the technical scheme that the hot dip tin-plated copper plate strip comprises a substrate and a plating layer, wherein the plating layer is attached to the substrate, the substrate is a copper or copper alloy plate strip, the plating layer comprises a Cu 3 Sn layer, a Cu 6Sn5 layer and a Sn layer, the Cu 3 Sn layer is attached to the substrate, the Cu 6Sn5 layer is attached to the Cu 3 Sn layer, the Sn layer is attached to the Cu 6Sn5 layer, the thickness of the Cu 3 Sn layer is not more than 10 nm, the thickness of the Cu 6Sn5 layer occupies 50% or more of the whole plating layer thickness, and the thickness of the Sn layer occupies less than 50% of the whole plating layer thickness. The Cu 6Sn5 layer (alloy phase layer) of large thickness can improve the hardness of the copper strip, while the pure tin plating can improve the solderability and corrosion resistance of the copper strip.
As a preferable technical scheme of the invention, the whole thickness of the plating layer is 1-2 micrometers.
The invention also discloses a preparation method of the hot-dip tinned copper plate strip, which adopts the technical scheme that the preparation method comprises the following steps:
Step 1, degreasing, impurity removal, cleaning and acid cleaning are carried out on a base material, so that the cleanliness of the surface of the base material is improved;
Step 2, plating assistance is carried out on the base material by adopting a plating assistance agent, and the base material is dried to obtain a pretreated base material;
Step 3, immersing the pretreated base material obtained in the step 2 into pure tin metal liquid, carrying out hot dip plating, taking out the base material after dip plating, and cooling to room temperature to obtain a hot dip tinned copper plate belt;
And 4, annealing and preserving heat of the hot-dip tinned copper plate belt, wherein nitrogen, hydrogen or nitrogen-hydrogen mixture is used as protective gas during annealing to prevent tin layer adhesion and oxidation. In the annealing and heat preservation process, copper elements in the base material can diffuse to the tin layer, so that the Cu 6Sn5 layer is rapidly increased, and the hardness of the copper plate strip can be increased along with the increase of the thickness of the Cu 6Sn5 layer.
In a preferred embodiment of the present invention, in the step 3, the immersion-plated substrate is cooled to room temperature by air cooling. Air cooling can control the cooling temperature and speed, and simultaneously can avoid introducing pollution components.
As a preferable technical scheme of the invention, in the step 4, the annealing temperature is 90-150 ℃ and the heat preservation time is 5-15 h. This temperature can contribute to the rapid growth of the Cu 6Sn5 layer.
In the step 1, the base material is degreased by using alkaline degreasing liquid, the concentration is 0.3-2%, the temperature is 30-90 ℃, after the degreasing treatment, the surface of the base material is scrubbed and decontaminated, and is washed by using clear water, so that the impurities generated by scrubbing are removed, and the base material is pickled by using H 2SO4, wherein the concentration is 10-20%, the temperature is 15-50 ℃ and the copper ion concentration is less than 40 g/l.
In a preferred embodiment of the present invention, in the step 2, the substrate is activated with ammonium bromide or hydrogen bromide and then dried.
As a preferred technical scheme of the invention, in the step 3, the hot dip plating tin plating temperature is 230-290 ℃.
Compared with the prior art, the method has the beneficial effects that the weldability and corrosion resistance of the copper plate belt are improved by hot dip plating the pure tin coating on the copper plate belt, and then the hot dip tinned copper plate belt is annealed and insulated to grow an alloy phase layer, and the alloy phase layer grows to more than half of the thickness of the coating, so that the hardness of the tin coating of the copper plate belt is improved. Therefore, the hot-dip tinned copper plate belt has high hardness, good weldability and corrosion resistance, and the copper plate belt has lower friction coefficient and low insertion rate due to the pure tin layer on the outermost layer, so that the hot-dip tinned copper plate belt can be used for multi-sheet opposite insertion.
Drawings
FIG. 1 is a scanning electron microscope image of a hot dip tinning material alloy phase of the prior art;
fig. 2 is a scanning electron microscope image of the hot dip tinning material alloy phase of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The first embodiment of the invention firstly discloses a hot dip tin-plated copper plate strip for reducing the friction coefficient of the surface of a copper strip, which adopts the technical scheme that the hot dip tin-plated copper plate strip comprises a copper plate strip, a Cu 3 Sn layer which is almost invisible under a 1000-time scanning electron microscope is attached to the copper plate strip, in the embodiment, the thickness of the Cu 3 Sn layer is 2nm, a Cu 6Sn5 layer is arranged on the Cu 3 Sn layer, a pure Sn layer is arranged on the Cu 6Sn5 layer, a plating layer is formed by the Cu 3 Sn layer, the Cu 6Sn5 layer and the pure Sn layer together, the whole thickness of the plating layer is 1 micron, the thickness of the Cu 6Sn5 layer is 0.75 micron for obtaining larger strength, and the rest part of the plating layer is the pure Sn layer.
The embodiment also discloses a preparation method of the hot-dip tinned copper plate strip, which adopts the technical scheme that the method comprises the following steps:
Step 1, degreasing the copper plate strip by using alkaline degreasing fluid, wherein the concentration is 2% and the temperature is 30 ℃, brushing and impurity removal are carried out on the surface of the copper plate strip after degreasing, and washing is carried out by using clear water to remove impurities generated by brushing;
Step 2, carrying out plating assistance on the copper plate strip by using ammonium bromide and hydrogen bromide, and drying to obtain a pretreated copper plate strip;
step 3, immersing the pretreated copper plate belt obtained in the step 2 into pure tin metal liquid at the temperature of 290 ℃, carrying out hot dip plating, taking out the copper plate belt after dip plating, and air-cooling to room temperature to obtain a hot-dip tinned copper plate belt;
and 4, annealing the hot-dip tinned copper plate belt at the temperature of 150 ℃ and preserving heat for 5h ℃, wherein nitrogen is required to be used as protective gas during annealing to prevent tin layer adhesion and oxidation.
Example 2
The second embodiment of the present invention firstly discloses a hot dip tin-plated copper plate strip for reducing the surface friction coefficient of a copper strip, which adopts the technical scheme that the hot dip tin-plated copper plate strip comprises a copper plate strip, a layer of Cu 3 Sn layer which is almost invisible under a 1000-time scanning electron microscope is attached to the copper plate strip, in the embodiment, the thickness of the Cu 3 Sn layer is 5nm, a Cu 6Sn5 layer is arranged on the Cu 3 Sn layer, a pure Sn layer is arranged on the Cu 6Sn5 layer, the Cu 3 Sn layer, the Cu 6Sn5 layer and the pure Sn layer jointly form a plating layer, the whole thickness of the plating layer is 2 microns, the thickness of the Cu 6Sn5 layer is 1.25 microns for obtaining larger strength, and the rest part of the plating layer is the pure Sn layer.
The embodiment also discloses a preparation method of the hot-dip tinned copper plate strip, which adopts the technical scheme that the method comprises the following steps:
Step 1, degreasing the copper plate strip by using alkaline degreasing fluid, wherein the concentration of the degreasing fluid is 0.3 percent, and the temperature is 90 ℃, brushing and impurity removing are carried out on the surface of the copper plate strip after the degreasing treatment, and clean water is used for washing to remove impurities generated by brushing;
Step 2, carrying out plating assistance on the copper plate strip by using ammonium bromide and hydrogen bromide, and drying to obtain a pretreated copper plate strip;
Step 3, immersing the pretreated copper plate belt obtained in the step 2 into pure tin metal liquid at the temperature of 230 ℃, carrying out hot dip plating, taking out the copper plate belt after dip plating, and air-cooling to room temperature to obtain a hot-dip tinned copper plate belt;
and 4, annealing the hot-dip tinned copper plate belt at the temperature of 90 ℃ and preserving heat for 15 h ℃, wherein hydrogen is required to be used as protective gas during annealing to prevent tin layer adhesion and oxidation.
Example 3
The embodiment discloses a third implementation mode of the invention, which firstly discloses a hot-dip tin-plated copper plate belt for reducing the friction coefficient of the surface of a copper belt, and adopts the technical scheme that the hot-dip tin-plated copper plate belt comprises a copper belt, a Cu 3 Sn layer which is almost invisible under a 1000-time scanning electron microscope is attached to the copper belt, in the embodiment, the thickness of the Cu 3 Sn layer is 7nm, a Cu 6Sn5 layer is arranged on the Cu 3 Sn layer, a pure Sn layer is arranged on the Cu 6Sn5 layer, a plating layer is formed by the Cu 3 Sn layer, the Cu 6Sn5 layer and the pure Sn layer together, the whole thickness of the plating layer is 1.5 microns, the thickness of the Cu 6Sn5 layer is 1 micron for obtaining larger strength, and the rest part of the plating layer is the pure Sn layer.
The embodiment also discloses a preparation method of the hot-dip tinned copper plate strip, which adopts the technical scheme that the method comprises the following steps:
Step 1, degreasing the copper plate strip by using alkaline degreasing fluid, wherein the concentration is 1%, and the temperature is 60 ℃, after degreasing, brushing and impurity removing are carried out on the surface of the copper plate strip, and washing is carried out by using clear water to remove impurities generated by brushing, and acid washing treatment is carried out on the copper plate strip by using 15% H 2SO4 solution at the temperature of 30 ℃, wherein the copper ion concentration is less than 40 g/l;
Step 2, carrying out plating assistance on the copper plate strip by using ammonium bromide and hydrogen bromide, and drying to obtain a pretreated copper plate strip;
step 3, immersing the pretreated copper plate belt obtained in the step 2 into pure tin metal liquid at the temperature of 260 ℃, carrying out hot dip plating, taking out the copper plate belt after dip plating, and air-cooling to room temperature to obtain a hot-dip tinned copper plate belt;
And 4, annealing the hot-dip tinned copper plate belt at the temperature of 120 ℃ and preserving heat for 10 h ℃, wherein nitrogen-hydrogen mixed gas is required to be used as protective gas during annealing to prevent tin layer adhesion and oxidation.
Comparative example 1 tin-plated copper sheet produced according to the hot dip plating method described in chinese patent CN 107587095B.
Comparative example 2 tin-plated copper sheet produced according to the hot dip plating method described in chinese patent CN 110592515B.
Comparative example 3 electroplated tin copper plate.
Examples 1-3 and comparative examples 1-3 were compared for coefficient of friction, hardness, weldability, corrosion resistance, and the comparison results were as follows:
As is evident from the above comparison, the friction coefficients of examples 1 and 3 are significantly lower than those of comparative examples 1 and 3, the friction coefficient of example 2 is significantly lower than that of comparative example 3 and comparable to comparative example 1, and the hardness of examples 1 to 3 is significantly higher than those of comparative examples 1 and 3, and although the friction coefficients thereof are higher than those of example 2 and lower than those of comparative example 2, the weldability and corrosion resistance thereof are significantly advantageous compared to those of comparative example 2. It is clear from this that examples 1 to 3 have low friction coefficient and also have the characteristics of high hardness, good weldability and good corrosion resistance.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a reduce hot dip tinned copper plate area of copper strips surface coefficient of friction, includes substrate and cladding material, the cladding material is attached to the substrate, the substrate is copper or copper alloy plate area, its characterized in that: the plating layer comprises a Cu 3 Sn layer, a Cu 6Sn5 layer and a Sn layer, wherein the Cu 3 Sn layer is attached to the base material, the Cu 6Sn5 layer is attached to the Cu 3 Sn layer, the Sn layer is attached to the Cu 6Sn5 layer, the thickness of the Cu 3 Sn layer is not more than 10nm, the thickness of the Cu 6Sn5 layer occupies 50% or more of the whole plating layer thickness, and the thickness of the Sn layer occupies 50% or less of the whole plating layer thickness.
2. The hot-dip tin-plated copper plate strip with reduced surface friction coefficient according to claim 1, wherein the overall thickness of the plating layer is 1-2 μm.
3. A method of preparing the reduced copper surface coefficient of friction hot dip tin-plated copper plate strip according to claim 1, comprising the steps of:
Step 1, degreasing, impurity removing, cleaning and acid cleaning are carried out on a base material;
Step 2, plating assistance is carried out on the base material by adopting a plating assistance agent, and the base material is dried to obtain a pretreated base material;
Step 3, immersing the pretreated base material obtained in the step 2 into pure tin metal liquid, carrying out hot dip plating, taking out the base material after the dip plating is finished, and cooling to room temperature to obtain a hot dip tinned copper plate strip;
And 4, annealing and preserving heat of the hot-dip tinned copper plate belt, wherein protective gas is required to be introduced during annealing to prevent tin layer adhesion and oxidation.
4. The method for producing a hot-dip tin-plated copper sheet strip with reduced surface friction coefficient according to claim 3, wherein in said step 3, the immersion-plated substrate is cooled to room temperature by air cooling.
5. The method for preparing a hot-dip tin-plated copper strip with reduced surface friction coefficient of copper strip according to claim 3, wherein in the step 4, the annealing temperature is 90-150 ℃ and the heat preservation time is 5-15 h.
6. The method for producing a hot dip tin coated copper strip with reduced coefficient of friction on a copper strip surface according to claim 3, wherein in step 1, the base material is degreased with an alkaline degreasing liquid at a concentration of 0.3-2% and a temperature of 30-90 ℃, after degreasing, the surface of the base material is brushed to remove impurities, and the surface of the base material is rinsed with clear water to remove impurities generated by brushing, and the base material is pickled with H 2SO4 at a concentration of 10-20% and a temperature of 15-50 ℃ and a copper ion concentration of less than 40 g/l.
7. The method for producing a hot-dip tin-plated copper strip with reduced surface friction coefficient according to claim 3, wherein in said step 2, the substrate is activated with ammonium bromide or hydrogen bromide and then dried.
8. The method for producing a hot-dip tin-plated copper sheet strip with reduced surface friction coefficient as claimed in claim 3, wherein in said step 3, the tin plating temperature of the hot dip plating is 230 to 290 ℃.
9. The method for producing a hot-dip tin-plated copper strip with reduced surface friction coefficient according to claim 3, wherein in the step 4, the shielding gas is nitrogen, hydrogen or a mixture of nitrogen and hydrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411833954.0A CN119320922A (en) | 2024-12-13 | 2024-12-13 | Hot-dip tinned copper plate strip capable of reducing friction coefficient of copper strip surface and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411833954.0A CN119320922A (en) | 2024-12-13 | 2024-12-13 | Hot-dip tinned copper plate strip capable of reducing friction coefficient of copper strip surface and manufacturing method thereof |
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| CN119320922A true CN119320922A (en) | 2025-01-17 |
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| CN202411833954.0A Pending CN119320922A (en) | 2024-12-13 | 2024-12-13 | Hot-dip tinned copper plate strip capable of reducing friction coefficient of copper strip surface and manufacturing method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004156147A (en) * | 2004-03-04 | 2004-06-03 | Kobe Steel Ltd | Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same |
| US20080090096A1 (en) * | 2004-09-10 | 2008-04-17 | Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel,Ltd) | Conductive Material For Connecting Part And Method For Manufacturing The Conductive Material |
| EP2386668A1 (en) * | 2010-05-12 | 2011-11-16 | KME Germany AG & Co. KG | Product with an anti-microbial surface layer and method for producing same |
| CN109891005A (en) * | 2017-06-08 | 2019-06-14 | 株式会社豊山 | The tin plated materials of tin plating method and the copper alloy being produced from it for electrical or electronic components and the copper alloy of automobile component |
| CN110592515A (en) * | 2019-09-30 | 2019-12-20 | 凯美龙精密铜板带（河南）有限公司 | Hot-dip tinned copper material and manufacturing method thereof |
| CN118369448A (en) * | 2021-12-02 | 2024-07-19 | 维兰德轧制品北美有限公司 | Silver tin coating for electrical connector and electrical connector with silver tin coating |
-
2024
- 2024-12-13 CN CN202411833954.0A patent/CN119320922A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004156147A (en) * | 2004-03-04 | 2004-06-03 | Kobe Steel Ltd | Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same |
| US20080090096A1 (en) * | 2004-09-10 | 2008-04-17 | Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel,Ltd) | Conductive Material For Connecting Part And Method For Manufacturing The Conductive Material |
| EP2386668A1 (en) * | 2010-05-12 | 2011-11-16 | KME Germany AG & Co. KG | Product with an anti-microbial surface layer and method for producing same |
| CN109891005A (en) * | 2017-06-08 | 2019-06-14 | 株式会社豊山 | The tin plated materials of tin plating method and the copper alloy being produced from it for electrical or electronic components and the copper alloy of automobile component |
| CN110592515A (en) * | 2019-09-30 | 2019-12-20 | 凯美龙精密铜板带（河南）有限公司 | Hot-dip tinned copper material and manufacturing method thereof |
| CN118369448A (en) * | 2021-12-02 | 2024-07-19 | 维兰德轧制品北美有限公司 | Silver tin coating for electrical connector and electrical connector with silver tin coating |
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