CN1193056C - 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物 - Google Patents
多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物 Download PDFInfo
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- C08F269/00—Macromolecular compounds obtained by polymerising monomers on to polymers of heterocyclic oxygen-containing monomers as defined in group C08F24/00
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- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
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- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
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Abstract
Description
组成 | 实施例 | 比较例 | ||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 1 | 2 | 3 | 4 | ||
环氧化合物 | (a-1)(a-2)(a-3)(a-4)(a-5)(a-6)(a-7) | 100 | 100 | 100 | 100 | 100 | 100 | 100 | ||||
(1)(2)(3)(4) | 100 | 100 | 100 | 100 | ||||||||
酚树脂 | 34.9 | 28.2 | 23.1 | 39.7 | 34.3 | 40.6 | 40.0 | 26.4 | 19.5 | 14.7 | 28.6 | |
固化促进剂(PDMI) | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | |
溶剂(卡必醇醋酸酯) | 70 | 80 | 100 | 65 | 70 | 65 | 70 | 70 | 80 | 105 | 65 |
特性 | 实施例 | 比较例 | |||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 1 | 2 | 3 | 4 | |
玻璃转变点(℃) | 189.4 | 180.1 | 173.5 | 198.8 | 190.5 | 204.5 | 213.1 | 168.1 | 166.3 | 165.1 | 172.4 |
拉伸弹性率(N/mm2) | 1955.7 | 1924.2 | 1892.4 | 1961.8 | 1956.3 | 2320.3 | 2340.5 | 1936.5 | 1907.5 | 1882.6 | 1942.9 |
拉伸强度(N/mm2) | 62.9 | 62.3 | 61.6 | 63.2 | 62.8 | 69.4 | 70.2 | 62.1 | 61.6 | 60.8 | 62.5 |
伸长率(%) | 5.61 | 5.64 | 5.71 | 5.58 | 5.62 | 5.11 | 5.32 | 5.64 | 5.66 | 5.69 | 5.61 |
吸水率(%) | 0.61 | 0.66 | 0.73 | 0.58 | 0.60 | 0.66 | 0.71 | 1.05 | 1.10 | 1.18 | 1.04 |
粘附性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ | ○ |
电绝缘电阻(×1013Ω) | 3.7 | 3.4 | 3.5 | 4.0 | 3.9 | 3.5 | 3.7 | 3.4 | 3.3 | 3.3 | 3.5 |
铅笔硬度 | 6H | 6H | 5H | 7H | 6H | 6H | 6H | 3H | 3H | 2H | 3H |
耐酸性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ | ○ |
耐碱性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
组成(质量份) | 实施例 | 比较例 | |||||||||
8 | 9 | 10 | 11 | 12 | 13 | 5 | 6 | 7 | 8 | ||
树脂清漆 | b-1b-2b-3b-4b-5b-6 | 167----- | -167---- | --167--- | ---167-- | ----167- | -----167 | ------ | ------ | ------ | ------ |
b’-1b’-2b’-3b’-4 | ---- | ---- | ---- | ---- | ---- | ---- | 143--- | -143-- | --143- | ---167 | |
Irgacure-907ITX双氰胺DPHAKS-66R-974卡必醇醋酸酯硫酸钡 | 120.5-151102080 | 120.51151102080 | 120.5-151102080 | 120.5-151102080 | 120.5-151102080 | 120.5-151102080 | 120.5-151102080 | 120.51151102080 | 120.5-151102080 | 120.5-151102080 | |
备注 | Irgacure-907:2-甲基-1-[4-(甲硫基)苯基]-2-吗啉氨基丙酮-1(汽巴特用化学品公司制光聚合引发剂)ITX:异丙基硫蒽酮(日本化药(股)制)DPHA:二季戊四醇六丙烯酸酯(日本化药(股)制)KS-66:硅酮系消泡剂(信越化学工业(股)制)R-974:微粉二氧化硅(日本Aerosil(股)制)组成 |
特性 | 实施例 | 比较例 | ||||||||
8 | 9 | 10 | 11 | 12 | 13 | 5 | 6 | 7 | 8 | |
玻璃转变点(℃) | 155.4 | 167.2 | 150.5 | 160.8 | 160.7 | 162.5 | 128.1 | 134.3 | 1251 | 120.4 |
拉伸弹性率(N/mm2) | 1975.7 | 2015.2 | 1920.4 | 1998.8 | 2340.1 | 2349.5 | 2293.5 | 2307.5 | 2249.6 | 2018.9 |
拉伸强度(N/mm2) | 62.9 | 60.3 | 63.6 | 61.2 | 70.5 | 71.2 | 62.1 | 61.6 | 62.8 | 63.1 |
伸长率(%) | 5.61 | 5.14 | 5.76 | 5.58 | 4.98 | 4.95 | 2.54 | 2.46 | 2.69 | 4.01 |
吸水率(%) | 0.78 | 0.71 | 0.83 | 0.76 | 0.72 | 0.81 | 1.20 | 1.17 | 1.25 | 1.29 |
铅笔硬度 | 6H | 6H | 5H | 6H | 6H | 6H | 4H | 4H | 3H | 2H |
粘附性 | ○ | ○ | ○ | ○ | ○ | ○ | △ | △ | △ | ○ |
电绝缘电阻(×1013Ω) | 3.4 | 2.9 | 3.6 | 3.0 | 3.2 | 3.1 | 2.4 | 2.0 | 2.4 | 2.5 |
耐酸性 | ○ | ○ | ○ | ○ | ○ | ○ | △ | △ | △ | ○ |
耐碱性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
组成(质量份) | 实施例 | 比较例 | |||||||
14 | 15 | 16 | 17 | 18 | 9 | 10 | 11 | ||
树脂清漆 | A-1A-2A-3A-4A-5B-1B-2B-3 | 167------- | -167------ | --167----- | ---149---- | ----149--- | -----167-- | ------167- | -------167 |
Irgacure-907ITX双氰胺DPHAKS-66YX4000R-974卡必醇醋酸酯硫酸钡 | 120.5115136102080 | 120.5115135102080 | 120.5115134102080 | 120.5115135102080 | 120.5115136102080 | 120.5115135102080 | 120.5115134102080 | 120.5115137102080 | |
备注 | YX4000:联二甲酚型环氧树脂(日本环氧树脂(股)制) |
特性 | 实施例 | 比较例 | ||||||
14 | 15 | 16 | 17 | 18 | 9 | 10 | 11 | |
显影性40分钟干燥50分钟干燥60分钟干燥70分钟干燥 | ○○○○ | ○○○○ | ○○○○ | ○○○○ | ○○○○ | ○○○△ | ○○○△ | ○○△× |
玻璃转变点(℃) | 165.4 | 157.2 | 150.5 | 161.2 | 167.3 | 150.7 | 150.5 | 125.6 |
拉伸弹性率(N/mm2) | 2475.7 | 2415.2 | 2390.4 | 2432.7 | 2464.1 | 2891.3 | 2820.5 | 2451.8 |
拉伸强度(N/mm2) | 63.9 | 64.3 | 68.6 | 68.9 | 70.5 | 48.3 | 49.1 | 64.1 |
伸长率(%) | 4.90 | 5.04 | 5.76 | 6.17 | 5.93 | 2.75 | 3.10 | 5.11 |
吸水率(%) | 0.71 | 0.78 | 0.83 | 0.78 | 0.80 | 1.32 | 1.35 | 1.47 |
铅笔硬度 | 6H | 6H | 5H | 6H | 6H | 6H | 6H | 2H |
粘附性 | ○ | ○ | ○ | ○ | ○ | × | × | ○ |
电绝缘电阻(×1013Ω) | 3.6 | 3.4 | 3.5 | 3.5 | 3.3 | 2.1 | 1.9 | 0.8 |
耐酸性 | ○ | ○ | ○ | ○ | ○ | △ | △ | ○ |
耐碱性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
耐PCT性 | ○ | ○ | ○ | ○ | ○ | × | × | △ |
Claims (22)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8505/2000 | 2000-01-18 | ||
JP2000008505 | 2000-01-18 | ||
JP2000081036 | 2000-03-22 | ||
JP81036/2000 | 2000-03-22 | ||
JP90931/2000 | 2000-03-29 | ||
JP2000090931A JP3723036B2 (ja) | 2000-03-29 | 2000-03-29 | 活性エネルギー線硬化性樹脂及びこれを用いた光硬化性・熱硬化性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
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CN1396937A CN1396937A (zh) | 2003-02-12 |
CN1193056C true CN1193056C (zh) | 2005-03-16 |
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CN 01803841 Expired - Lifetime CN1193056C (zh) | 2000-01-18 | 2001-01-17 | 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物 |
Country Status (3)
Country | Link |
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CN (1) | CN1193056C (zh) |
TW (1) | TW524813B (zh) |
WO (1) | WO2001053375A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100358932C (zh) * | 2003-08-21 | 2008-01-02 | 旭化成化学株式会社 | 感光性组合物及其固化物 |
SG110189A1 (en) * | 2003-09-26 | 2005-04-28 | Japan Epoxy Resins Co Ltd | Epoxy compound, preparation method thereof, and use thereof |
CN1981237B (zh) * | 2004-07-07 | 2010-05-05 | 太阳油墨制造株式会社 | 光固化性·热固化性树脂组合物和使用其的干膜、及其固化物 |
JP4683182B2 (ja) * | 2004-09-28 | 2011-05-11 | 山栄化学株式会社 | 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法 |
JP4849860B2 (ja) * | 2005-10-04 | 2012-01-11 | 太陽ホールディングス株式会社 | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
WO2007049665A1 (ja) * | 2005-10-27 | 2007-05-03 | Toppan Printing Co., Ltd. | アルカリ現像型感光性樹脂組成物、それを用いて形成した液晶分割配向制御用突起付き基板、及び液晶表示装置 |
CN101591423B (zh) * | 2008-05-29 | 2012-09-05 | 新日铁化学株式会社 | 碱可溶性树脂及其制造方法以及使用了碱可溶性树脂的感光性树脂组合物、固化物和滤色器 |
CN104039903A (zh) * | 2011-11-22 | 2014-09-10 | 日本油漆株式会社 | 硬涂层组合物 |
KR102541614B1 (ko) * | 2015-03-04 | 2023-06-09 | 다이요 홀딩스 가부시키가이샤 | 에칭 레지스트 조성물 및 드라이 필름 |
JP6705412B2 (ja) * | 2017-03-28 | 2020-06-03 | 味の素株式会社 | 感光性樹脂組成物 |
Family Cites Families (3)
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JP2879860B2 (ja) * | 1991-05-31 | 1999-04-05 | 日本化薬株式会社 | エポキシ樹脂、エポキシ樹脂組成物およびその硬化物 |
JP3233222B2 (ja) * | 1991-07-31 | 2001-11-26 | 大日本インキ化学工業株式会社 | エポキシ樹脂組成物 |
JP3190251B2 (ja) * | 1995-06-06 | 2001-07-23 | 太陽インキ製造株式会社 | アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物 |
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2001
- 2001-01-17 WO PCT/JP2001/000268 patent/WO2001053375A1/ja active Application Filing
- 2001-01-17 TW TW90101202A patent/TW524813B/zh not_active IP Right Cessation
- 2001-01-17 CN CN 01803841 patent/CN1193056C/zh not_active Expired - Lifetime
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Publication number | Publication date |
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WO2001053375A1 (fr) | 2001-07-26 |
CN1396937A (zh) | 2003-02-12 |
TW524813B (en) | 2003-03-21 |
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