CN119275143B - Chip Memory - Google Patents

Abstract

The present disclosure relates to the field of semiconductor fabrication, and provides a wafer memory. The wafer storage comprises a bin body, a first conveying device and a second conveying device. The bin body is provided with a storage bin, a first window and a second window. The wafer box is used for containing wafers, and the wafers are sent into or out of the storage bin through the second window. The first conveying device is arranged in the storage bin and is used for conveying the wafer box among the plurality of carrying platforms. The second carrying device is arranged in the storage bin and is used for taking out the wafer from the wafer box and sending the wafer out of the storage bin through the second window, and is used for receiving the wafer outside the storage bin and sending the wafer into the wafer box in the storage bin through the second window. The wafer storage is internally provided with the carrying device for carrying the wafers, so that the space utilization rate of the interior of the wafer storage is improved, and the space occupied by the process area outside the wafer storage is reduced.

Description

Wafer memory

Technical Field

The present disclosure relates to the field of semiconductor fabrication, and more particularly, to a wafer memory.

Background

In the semiconductor industry, wafer storage is used as an automated storage device to enable wafer transfer between different processes through cooperation with an automated material handling system. The wafer storage is provided with a storage bin for storing wafer boxes, and the wafer boxes are used for containing wafers. The storage bin is provided with a carrying device for carrying the wafer box. The bin wall of the wafer storage is provided with a window through which wafers can be sent out to a process area for processing the wafers. The processed wafers may be fed from the process zone through a window into a storage bin. The transfer of wafers and the transfer of wafers is accomplished by a handling device provided in the process field, but the handling device is generally bulky, resulting in a large space occupied by the process field.

Disclosure of Invention

Accordingly, the present disclosure provides a wafer storage device to solve the problem of more space occupied by the conventional process field transporting device.

The wafer storage comprises a bin body, a first conveying device and a second conveying device. The bin body is provided with a storage bin, a first window and a second window. The wafer box is used for containing wafers, and the wafers are sent into or out of the storage bin through the second window. The first conveying device is arranged in the storage bin and is used for conveying the wafer box among the plurality of carrying platforms. The second carrying device is arranged in the storage bin and is used for taking out the wafer from the wafer box and sending the wafer out of the storage bin through the second window, and is used for receiving the wafer outside the storage bin and sending the wafer into the wafer box in the storage bin through the second window.

As a possible implementation, a calibration device is provided in the storage bin, which is used for performing a calibration process on the wafers sent out of or into the storage bin.

As a possible implementation manner, the wafer storage device further includes a moving platform moving in an up-down direction, and the second carrying device and the alignment device are supported on the moving platform to be lifted and lowered together.

As one possible implementation, the plurality of carriers includes a first carrier, and the second carrying device is used for taking out or putting in the wafer cassette on the first carrier, and the first carrier is supported on the moving platform so as to lift together with the second carrying device and the calibration device.

As one possible implementation, the bin body includes a first bin wall and a second bin wall, the first bin wall and the second bin wall being perpendicular to and spaced along a first direction, the first direction being perpendicular to the up-down direction. The first bin wall is provided with a first window, the second bin wall is provided with a second window, and the second bin wall is closer to the moving platform than the first bin wall.

As a possible implementation manner, the bin body includes a third bin wall and a fourth bin wall, the third bin wall and the fourth bin wall are perpendicular to the second direction and are spaced along the second direction, the first direction, the second direction and the up-down direction are perpendicular to each other, the first carrying platform is located between the third bin wall and the second carrying device in the second direction, and the calibration device is located between the fourth bin wall and the second carrying device in the second direction.

As a possible implementation, the first stage is located at a corner formed by the second and third walls.

As a possible implementation, the plurality of carriers further includes a second carrier, and the second handling device is configured to place the defective wafer and/or the sampled wafer into a wafer cassette on the second carrier, where the second carrier is located at a corner of the second bin wall and the fourth bin wall.

As a possible implementation, the second stage is fixed to the bin body and is located above the calibration device. When the moving platform is positioned at the position where the second carrying device can send in or send out wafers through the second window, the wafers on the calibrating device are higher than the lower edge of the second window, the wafer boxes on the first carrying platform are higher than the calibrating device, the wafer boxes on the second carrying platform are higher than the wafer boxes on the first carrying platform, and the upper edge of the second window is higher than the wafer boxes on the second carrying platform.

As one possible implementation, the first stage is provided with a first in-place sensor, wherein the first in-place sensor is triggered in response to a wafer in a wafer cassette on the first stage not being in place, and/or the second stage is provided with a second in-place sensor, wherein the second in-place sensor is triggered in response to a wafer in a wafer cassette on the second stage not being in place.

As one possible implementation, the plurality of carriers includes a plurality of third carriers supported on the first cartridge wall.

As a possible implementation, the wafer storage device further includes a moving platform that moves in an up-and-down direction. The first handling device includes a first securing mechanism for releasably securing a wafer cassette. The second handling device includes a second securing mechanism for releasably securing the wafer. The first carrying device and the second carrying device comprise arm mechanisms which are shared with each other, one end of each arm mechanism is supported on the mobile platform, and the other end of each arm mechanism is connected with the first fixing mechanism and the second fixing mechanism.

As a possible implementation, the first fixing mechanism and the second fixing mechanism are assembled together to form the fixing mechanism. The fixing mechanism is rotatably connected with the other end of the arm mechanism around a rotation axis, and the first fixing mechanism and the second fixing mechanism are arranged along a straight line and face to one side deviating from each other.

As one possible implementation, the cartridge body comprises a first cartridge wall and a second cartridge wall. The first bin wall and the second bin wall are perpendicular to the first direction and are spaced along the first direction, the first direction is perpendicular to the up-down direction, the first bin wall is provided with a first window, and the second bin wall is provided with a second window. The second window is higher than the first window in a plan view perpendicular to the first direction, and a reference straight line extending in the first direction and intersecting the principal axis of the arm mechanism passes through the first window and the second window in a plan view perpendicular to the up-down direction.

The wafer storage is internally provided with the carrying device for carrying the wafers, the carrying device for carrying the wafers is not required to be arranged in the process area outside the wafer storage, and the space utilization rate inside the wafer storage is improved while the space occupied by the process area is reduced.

Drawings

It is appreciated that the following drawings depict only certain embodiments of the disclosure and are not to be considered limiting of its scope.

It should be understood that the same or similar reference numerals are used throughout the drawings to refer to the same or like elements.

It should be understood that the drawings are merely schematic and that the dimensions and proportions of the elements in the drawings are not necessarily accurate.

FIG. 1a is a schematic diagram of a wafer memory according to one embodiment of the present disclosure.

FIG. 1b is a schematic diagram of another view of the wafer memory of FIG. 1 a.

Fig. 2 is a schematic diagram illustrating the positions of a first handling device and a second handling device of an embodiment of the wafer storage device of fig. 1a from a top view.

Fig. 3 is a schematic diagram showing the positions of a first handling device and a second handling device of another embodiment of the wafer storage of fig. 1a from a side view.

Fig. 4 is a schematic diagram showing the positions of the first carrying device, the second carrying device, the first moving platform and the second moving platform of the wafer storage in fig. 1a from a side view.

Fig. 5 is a schematic diagram showing the structure of the first and second transporting devices of the wafer storage device in fig. 1a from a top view.

Fig. 6 is a schematic structural view of the first carrying device, the second carrying device and the moving platform of the wafer storage in fig. 1 a.

Fig. 7a is a schematic diagram of the structure of the first window and the second window of the wafer memory in fig. 1 a.

Fig. 7b is a schematic diagram showing the positions of the first transporting device, the second transporting device, the first window and the second window of the wafer memory in fig. 1a from a top view.

Fig. 8 is a schematic diagram showing the structure of the calibration device of the wafer memory in fig. 1a from a top view.

Fig. 9 is a schematic structural view of the first carrying device, the second carrying device, the moving platform and the calibration device of the wafer storage in fig. 1 a.

Fig. 10 is a schematic structural view of the first carrying device, the second carrying device, the moving platform, the calibrating device and the first carrier of the wafer storage in fig. 1 a.

Fig. 11 is a schematic diagram showing the structure of the moving platform, the alignment device and the first stage of the wafer storage in fig. 1a from a top view.

Fig. 12 is a schematic diagram showing the position of a second stage of the wafer memory of fig. 1a from a top view.

Fig. 13 is a schematic view of the positions of the alignment device, the first stage and the second stage when the second handling device of the wafer storage device of fig. 1a is in a position where a wafer can be fed in or out.

Fig. 14 is a schematic view of the structure of the spindle inside the body of the wafer memory of fig. 1 a.

FIG. 15 is a schematic diagram of a first in-place sensor of the wafer memory of FIG. 1 a.

FIG. 16 is a schematic view of a third stage of the wafer memory of FIG. 1 a.

Reference numerals of fig. 1a to 16 illustrate:

10-bin body, 100-storage bin, 101-bottom wall, 102-top wall, 103-side wall, 11-first bin wall, 111-first window, 12-second bin wall, 121-second window, 13-third bin wall, 14-fourth bin wall, 20-first handling device, 201-first body, 202-first arm mechanism, 203-first fixed mechanism, 21-body, 211-shaft, 22-arm mechanism, 221-main axis, 30-second handling device, 301-second body, 302-second arm mechanism, 303-second fixed mechanism, 40-stage, 41-first stage, 42-second stage, 43-third stage, 50-wafer cassette, 60-moving stage, 61-first moving stage, 62-second moving stage, 601-motor, 602-guide rail, 603-slide, 604-first stage, 605-frame, 606-second stage, 607-third stage, 70-calibration device, 80-first sensor, 82-y-receiver, and 82-y-receiver.

Detailed Description

Numerous specific details are set forth below to provide an understanding of the structure, function, and use of the embodiments described in the specification and illustrated in the accompanying drawings. It is to be understood that the embodiments described and illustrated herein are non-limiting examples, so that it is recognized that the specific structural and functional details disclosed herein may be representative and exemplary. Modifications and changes may be made to these embodiments without departing from the scope of the claims.

In the semiconductor industry, wafer storage is used as an automated storage device to enable wafer transfer between different processes through cooperation with an automated material handling system. The wafer storage is internally provided with a storage bin which is used for storing wafer boxes, and the wafer boxes are used for containing wafers. The storage bin is provided with a carrying device for carrying the wafer box. The bin wall of the wafer storage is provided with a window through which wafers can be sent out to a process area for processing the wafers. The processed wafers may be fed from the process zone through a window into a storage bin.

The inventors have found that the transfer of wafers to and from the processing area is accomplished by a handling device that is provided in the processing area, but the handling device is generally bulky, resulting in a large space occupied by the processing area. At the same time, more space within the wafer memory is not utilized. For example, the space around the walls of the wafer storage bin, and the space occupied by the handling device for handling wafer cassettes during handling. In view of the above, the present disclosure provides a wafer handling apparatus for handling wafers in a wafer storage device, which uses wasted space in the wafer storage device in the past, improves the space utilization rate inside the wafer storage device, and does not increase the volume of the wafer storage device. Because the carrying device for carrying the wafer does not need to be arranged in the process area outside the wafer storage, the space occupied by the process area is reduced.

The wafer memory provided by the present disclosure is described in more detail below.

As shown in fig. 1a, 1b and 2, the wafer storage includes a bin 10, a first carrying device 20 and a second carrying device 30. The bin body 10 is provided with a storage bin 100, and the bin body 10 can be a hollow rectangular cube, and an inner accommodating space is used as the storage bin 100. The storage bin 100 is provided with a plurality of stages 40, wherein the stages 40 are used for carrying wafer boxes 50, and the wafer boxes 50 are used for accommodating wafers. The plurality of stages 40 may be fixedly provided to the housing 10 in a stacked arrangement in the height direction, or may be supported by a frame 605 inside the storage housing 100 so as not to contact the housing 10. Each carrier 40 may be used to carry multiple sizes of wafer cassettes 50, such as 6 inch and 8 inch wafer cassettes 50. The bin body 10 is also provided with a first window 111 and a second window 121. The present disclosure does not limit the positions, shapes, and sizes of the first window 111 and the second window 121. As long as wafer cassette 50 can be moved into and out of storage bin 100 through first window 111, wafers can be moved into and out of storage bin 100 through second window 121. The first conveying device 20 is disposed in the storage bin 100, and is used for conveying the wafer cassette 50 among the plurality of stages 40. The second transporting device 30 is disposed in the storage bin 100, and is used for taking out the wafer from the wafer cassette 50 and sending the wafer out of the storage bin 100 through the second window 121, and is used for receiving the wafer outside the storage bin 100 and sending the wafer into the wafer cassette 50 in the storage bin 100 through the second window 121.

In some embodiments, the cartridge body 10 includes a plurality of cartridge walls, as shown in fig. 2, the first handling device 20 may be disposed on the same cartridge wall as the second handling device 30. As shown in fig. 3, may also be provided on different walls, respectively. Specifically, the bin wall includes a bottom wall 101, a top wall 102, and a side wall 103, and the first handling device 20 and the second handling device 30 are disposed opposite to the bottom wall 101 and the top wall 102, respectively. The first conveyance device 20 includes a first body 201 in which a power source is provided, and the first body 201 is fixed to the bottom wall 101. A first arm mechanism 202 supported above the first body 201, the first arm mechanism 202 including a plurality of links and a plurality of joints, wherein the joints may be universal joints. The first arm mechanism 202 has one end rotatably connected to the first body 201 and the other end rotatably connected to the first fixing mechanism 203. For example, the first arm mechanism 202, the first body 201, and the first fixing mechanism 203 may be connected by a universal joint. The power source inside the first body 201 can drive the first arm mechanism 202 to rotate, move and stretch, so as to drive the first fixing mechanism 203 to reach a designated position. The first fixing mechanism 203 is used to releasably fix the wafer cassette 50, i.e. can grasp and place the wafer cassette 50, so as to realize the transportation of the wafer cassette 50 between different stages 40. The second carrying device 30 includes a second body 301 having a power source disposed therein, the second body 301 being fixed to the top wall 102. A second arm mechanism 302 disposed below the second body 301, the second arm mechanism 302 including a plurality of links and a plurality of joints, wherein the joints may be universal joints. The second arm mechanism 302 is rotatably connected at one end to the second body 301 and at the other end to the second fixing mechanism 303. For example, the second arm mechanism 302, the second body 301, and the second fixing mechanism 303 may be connected by a universal joint. The power source inside the second body 301 can drive the second arm mechanism 302 to rotate, move and stretch, so as to drive the second fixing mechanism 303 to reach a designated position. The second fixing mechanism 303 is used to releasably fix the wafer, that is, to grasp and place the wafer, so that the wafer is taken out of the wafer cassette 50 and sent out of the storage bin 100 through the second window 121, and to receive the wafer outside the storage bin 100 and send the wafer into the wafer cassette 50 inside the storage bin 100 through the second window 121. In the above embodiment, in order to avoid collision interference between the first carrying device 20 and the second carrying device 30, the second carrying device 30 may be restored to the original form when the first carrying device 20 carries the wafer cassette 50. The second carrying device 30 restored to the original state is located outside the movable range of the first carrying device 20. Similarly, when the second transporting device 30 is operated, the first transporting device 20 can be restored to the original shape, and collision interference can be avoided by programming and planning the movement paths of the first arm mechanism 202 and the second arm mechanism 302. Since the first carrying device 20 and the second carrying device 30 are respectively arranged on different bin walls, the space near the different bin walls is utilized, and the space utilization rate in the wafer storage is improved.

However, in the above-described embodiment, the first arm mechanism 202 and the second arm mechanism 302 are generally long in length to support the first fixture 203 and the second fixture 303 for grasping and placing the wafer cassette 50 and wafers at a distance. Thus, as shown in fig. 4, in some embodiments, a first moving platform 61 may be provided between the first handling device 20 and the bin wall. A second moving platform 62 is provided between the second handling device 30 and the bin wall. Specifically, when the first handling device 20 is provided on the bottom wall 101, the first moving platform 61 provided between the first body 201 and the side wall 103 can support the first handling device 20 to be lifted and lowered in the height direction. The first moving platform 61 may include a motor (not shown), a rail 602, and a slider 603. The guide rail 602 is disposed on the side wall 103, and one end of a slider 603 on the guide rail 602 is connected to the screw in the guide rail 602, and the other end is connected to the first conveying device 20. The motor 601 drives the screw rod in the guide rail 602 to rotate, and the rotating screw rod drives the sliding block 603 to move along the guide rail 602, so as to drive the first carrying device 20 to lift in the height direction. Similarly, the second moving platform 62 may be provided on a different side wall 103 or on the same side wall 103, and may be configured in the same manner as the first moving platform 61, so as to support the second carrying device 30 to be lifted and lowered in the height direction. In some embodiments, the first moving platform 61 may also be disposed between the first handling device 20 and the bottom wall 101, and the moving platform 60 may include a telescopic rod. The upper end face of the telescopic rod is fixedly connected with the bottom of the first carrying device 20, and the lower end face of the telescopic rod is connected with the bottom wall 101. The telescopic rod is telescopic in a hydraulic mode. The present disclosure is not limited to the specific structure of the first moving platform 61 and the second moving platform 62, as long as the first conveying device 20 and the second conveying device 30 can be lifted and lowered in the height direction. Also, in order to avoid collision interference between the first and second carrying devices 20 and 30, the second carrying device 30 may be restored to the original form when the first carrying device 20 carries the wafer cassette 50. The second carrying device 30 restored to the original state is located outside the movable range of the first carrying device 20. Similarly, when the second conveying device 30 is operated, the first conveying device 20 can be restored to the original shape. In the above embodiment, by providing the first moving platform 61 and the second moving platform 62 so that the first conveying device 20 and the second conveying device 30 are liftable in the height direction, the lengths of the first arm mechanism 202 and the second arm mechanism 302 are reduced, and the space occupied by the first conveying device 20 and the second conveying device 30 is reduced.

However, in the above embodiment, the second body 301 and the second arm mechanism 302 of the second conveying device 30 still occupy more space. Thus, in some embodiments, the first handling device 20 and the second handling device 30 include an arm mechanism 22 that is common to each other. One end of the arm mechanism 22 is supported by the moving platform 60, and the other end of the arm mechanism 22 is connected to the first fixing mechanism 203 and the second fixing mechanism 303. In some embodiments, as shown in fig. 5, the first handling device 20 and the second handling device 30 may also comprise a body 21 in common with each other. One end of the arm mechanism 22 is supported by the main body 21, and the main body 21 is supported by the moving platform 60. The first handling device 20 includes a first fixing mechanism 203, where the first fixing mechanism 203 is used to releasably fix the wafer cassette 50, i.e. can grasp and place the wafer cassette 50. The first fixing mechanism 203 includes a pair of jaws, and grooves extending in the height direction are provided inside the two jaws. When the wafer box 50 is grasped, the two clamping jaws are driven to approach each other, and the extending flange on the wafer box 50 along the height direction is clamped into the groove, so that the wafer box 50 is clamped. When the wafer cassette 50 is placed, the two clamping jaws are driven away from each other, thereby releasing the wafer cassette 50. The second handling device 30 includes a second securing mechanism 303, the second securing mechanism 303 being adapted to releasably secure the wafer, i.e., to grasp and place the wafer. The second fixing mechanism 303 includes a fork, and two prongs of the fork are respectively provided with an air hole. When the wafer is grasped, the air holes are used for air intake, and the wafer is adsorbed on the tooth fork. When the wafer is placed, the air holes stop air inlet and release the wafer. The arm mechanism 22 may include a plurality of links and joints. The wafer storage may further include a moving stage 60 moving in the up-down direction, wherein the moving stage 60 may employ the first moving stage 61 or the second moving stage 62 mentioned above. Specifically, as shown in fig. 6, one end of the arm mechanism 22 is supported by the main body 21, and the arm mechanism 22 and the main body 21 are rotatable with each other about an axis. The main body 21 is supported by the moving platform 60. One end of the arm mechanism 22 may be a lower end surface of the arm mechanism 22, or may be a tip end portion of the arm mechanism 22. The other end of the arm mechanism 22 is rotatably connected to the first fixing mechanism 203 and the second fixing mechanism 303 about an axis. The other end of the arm mechanism 22 may be an upper end surface of the arm mechanism 22, or another tip end portion of the arm mechanism 22. In the above embodiment, the first fixing mechanism 203 and the second fixing mechanism 303 are disposed on the same arm mechanism 22, and under the support of the moving platform 60 and the arm mechanism 22, the first fixing mechanism 203 and the second fixing mechanism 303 can reach the designated positions to convey the wafer box 50 and the wafer, so that the manufacturing cost is greatly reduced, and the space occupied by the two conveying devices is reduced.

In some embodiments, as shown in fig. 5, first fixture 203 and second fixture 303 fit together to form a fixture that can both grasp and place wafer cassette 50 and grasp and place wafers. The fixing mechanism is rotatably connected to the other end of the arm mechanism 22 about a rotation axis. This means that after a wafer cassette 50 is placed, when the wafer cassette 50 is intended to take out a wafer, the fixing mechanism is moved a certain distance away from the wafer cassette 50, so as to avoid collision with the wafer cassette 50 when the fixing mechanism rotates, and then the second fixing mechanism 303 is aligned with the wafer only by rotating the fixing mechanism around the rotation axis by a certain angle. In this process, the second fixture 303 is aligned to the wafer without the participation of the arm mechanism 22, simplifying the control procedure. The first fixing mechanism 203 and the second fixing mechanism 303 are arranged along a straight line and each face a side facing away from the other. That is, as shown in fig. 5, the central axis of the first fixing mechanism 203 coincides with the central axis of the second fixing mechanism 303 in a plan view. For example, when the first fixing mechanism 203 is a jaw and the second fixing mechanism 303 is a fork, the jaw and the fork are opened in opposite directions. This means that the wafer cassette 50 and the wafer can be fixed at the same time on the fixing mechanism without interference. In operation, the first and second securing mechanisms 203, 303 have minimal impact on each other.

In some embodiments, as shown in fig. 7a,7b, the cartridge body 10 comprises a first cartridge wall 11 and a second cartridge wall 12, the first cartridge wall 11 and the second cartridge wall 12 being perpendicular to and spaced apart along a first direction y, the first direction y being perpendicular to the up-down direction. The first compartment wall 11 is provided with a first window 111 and the second compartment wall 12 is provided with a second window 121. In a plan view perpendicular to the first direction y, the second window 121 is higher than the first window 111. As described above, the wafer cassette 50 can be transferred into and out of the storage bin 100 from the external environment through the first window 111, and dust of the external environment is inevitably introduced into the storage bin 100 during the transfer into and out. In order to prevent dust in the storage bin 100 from entering the process zone through the second window 121, the height of the second window 121 may be made higher than the first window 111, so that dust is difficult to float from the second window 121 into the process zone. Alternatively, the air in the storage bin 100 may be caused to flow downward, for example by providing a fan above the wafer storage to blow air toward the bottom of the wafer storage, further preventing dust from drifting from the second window 121 into the process zone. As shown in fig. 7b, in a plan view perpendicular to the up-down direction, a reference straight line L1 extending in the first direction y and intersecting the main axis 221 of the arm mechanism 22 passes through the first window 111 and the second window 121. The main axis 221 of the arm mechanism 22 may be a centroid of the arm mechanism 22 projected on a horizontal plane, or may be an axis of a connecting shaft with the main body 21. That is, the first window 111, the arm mechanism 22, and the second window 121 are aligned in the first direction y. The wafer cassette 50 can be grasped interactively with the first window 111 and the wafer can be grasped interactively with the second window 121 due to the fixing mechanism. Therefore, when the arm mechanism 22 is aligned with the first window 111 and the second window 121 in the first direction y, the distance of the interactive travel between the arm mechanism 22 and the first window 111 and the second window 121 is minimized, and the conveyance efficiency can be improved.

In some embodiments, as shown in fig. 8, a calibration device 70 is disposed within the storage bin 100, and the calibration device 70 is used to perform a calibration process on wafers that are transferred from or into the storage bin 100. Specifically, the second conveyance device 30 and the first conveyance device 20 include an arm mechanism 22 and a main body 21 that are common to each other, the first conveyance device 20 includes a first fixing mechanism 203 for releasably fixing the wafer cassette 50, and the second conveyance device 30 includes a second fixing mechanism 303 for releasably fixing the wafer. The second transporting device 30 may take out the wafer from the wafer cassette 50 on the carrier 40, then place the wafer on the alignment device 70, and after the alignment device 70 performs the alignment process on the wafer, the second transporting device 30 sends the wafer to the wafer boat in the process area through the second window 121. The alignment device 70 detects the edge of the wafer by optical techniques and determines the position and orientation of the wafer to achieve precise alignment and docking of the die to the wafer boat.

In some embodiments, the wafer storage further includes a moving platform 60 moving in the up-and-down direction, and the second transporting device 30 and the alignment device 70 are supported on the moving platform 60 to be lifted and lowered together. The present disclosure does not limit the positions and heights of the second carrier device 30 and the alignment device 70 on the moving platform 60 as long as the second carrier device 30 can place the wafer on the alignment device 70 and can be taken out from the alignment device 70. For example, as shown in fig. 9, the second handling device 30 and the first handling device 20 include an arm mechanism 22 and a main body 21 that are common to each other, the first handling device 20 includes a first fixing mechanism 203 for releasably fixing the wafer cassette 50, and the second handling device 30 includes a second fixing mechanism 303 for releasably fixing the wafer. The moving platform 60 comprises a motor 601, a guide 602, a slider 603, and a first platform 604. The guide rail 602 is fixedly arranged on the second bin wall 12, one end of a sliding block 603 on the guide rail 602 is connected with a screw rod in the guide rail 602, and the other end of the sliding block 603 is connected with the first platform 604. The body 21 is supported on a first platform 604. The arm mechanism 22 has one end rotatably connected to the main body 21 about an axis and the other end rotatably connected to the first fixing mechanism 203 and the second fixing mechanism 303 about an axis. The arm mechanism 22 includes a plurality of links and a plurality of joints, and two links connected to the same joint are rotatable relative to each other in a horizontal plane. The mobile platform 60 further comprises a frame 605, the frame 605 being supported on the first platform 604, a second platform 606 being disposed over the frame 605, and the alignment device 70 being supported on the second platform 606. The second platform 606 is higher than the first platform 604 so that the alignment device 70 and the second securing mechanism 303 are at substantially the same height. The power source inside the main body 21 can drive the arm mechanism 22 to rotate, move and stretch, so as to drive the second fixing mechanism 303 to reach a designated position. The second fixing mechanism 303 is used to releasably fix the wafer, that is, to grasp and place the wafer, so that the wafer is taken out of the wafer cassette 50 and placed on the alignment device 70, and then sent out of the storage bin 100 through the second window 121, and to receive the wafer outside the storage bin 100 and send the wafer into the wafer cassette 50 inside the storage bin 100 through the second window 121. the motor 601 in the moving platform 60 drives the screw rod in the guide rail 602 to rotate, and the rotating screw rod drives the sliding block 603 to move along the guide rail 602, so that the second carrying device 30 and the calibrating device 70 are lifted and lowered together under the support of the first platform 604. In the conventional wafer storage, the wafer cassette 50, the alignment device 70 and the second window 121 may not be at the same height. After the second transporting device 30 takes out the wafer from the wafer cassette 50, it is required to lift the wafer to the height of the alignment device 70, and lift the wafer to the height of the second window 121 after the alignment of the wafer is completed. During the lifting, the second conveying device 30 cannot perform other operations. However, in the above embodiment, when the wafer cassette 50 and the second window 121 are not at the same height, the second transporting device 30 may be directly placed on the alignment device 70 after taking out the wafers from the wafer cassette 50. Because the calibration device 70 and the second carrying device 30 can be lifted together, the calibration device 70 can calibrate the wafer in the process of lifting the second carrying device 30 to the second window 121, thereby saving a lot of time and improving the carrying efficiency of the wafer. Meanwhile, the space occupied in the lifting process of the mobile platform 60 is effectively utilized.

However, in the above embodiment, when the wafer cassette 50 and the second window 121 are not at the same height, the second handling device 30 still needs to be lifted and lowered between the wafer cassette 50 and the second window 121, which takes much time. Thus, in some embodiments, the plurality of carriers 40 includes a first carrier 41 and the second carrier 30 is configured to take out or put in wafers from or to the wafer cassette 50 on the first carrier 41, and the first carrier 41 is supported on the moving platform 60 to be lifted and lowered together with the second carrier 30 and the alignment device 70. The present disclosure does not limit the positions and heights of the first stage 41, the second transfer device 30, and the alignment device 70 on the moving platform 60, as long as the second transfer device 30 can transfer the wafer between the first stage 41 and the alignment device 70. For example, as shown in fig. 10, a third platform 607 is provided on the frame 605, and the third platform 607 and the second platform 606 are located on both sides of the second conveying device 30 and have the same height. The first stage 41 is supported above the third stage 607. The first stage 41, the second fixing mechanism 303, and the alignment device 70 are located at substantially the same height. In the above embodiment, after the first transporting device 20 can transport the wafer cassette 50 on the other carrier 40 onto the first carrier 41, the moving platform 60 can lift the first carrier 41, the second transporting device 30, and the alignment device 70 to the height of the second window 121. The second carrying device 30 can take out the wafer from the wafer cassette 50 on the first stage 41, place the wafer on the alignment device 70, and send out the wafer through the second window 121 after the alignment is completed. The second handling device 30 does not need to be lifted during the process of taking out, calibrating and delivering the wafer, thereby further saving a lot of time. Meanwhile, the space occupied in the lifting process of the mobile platform 60 is effectively utilized. When the wafer cassette 50 on the first stage 41 needs to be carried to other stages 40 or when the wafer cassette 50 on other stages 40 is placed on the first stage 41, the first carrying device 20 can take out or place the wafer cassette 50 on the first stage 41 while lifting, so that a great amount of time is further saved.

In some embodiments, as shown in fig. 11, the cartridge body 10 includes a first cartridge wall 11 and a second cartridge wall 12, the first cartridge wall 11 and the second cartridge wall 12 being perpendicular to and spaced apart along a first direction y, the first direction y being perpendicular to the up-down direction. The first bin wall 11 is provided with a first window 111 and the second bin wall 12 is provided with a second window 121, the second bin wall 12 being closer to the moving platform 60 than the first bin wall 11. That is, the distance from the first wall 11 to the moving platform 60 is greater than the distance from the second wall 12 to the moving platform 60. There may be more space between the first chamber wall 11 and the moving platform 60 for the carrier 40 to place the wafer cassette 50. The proximity of the mobile platform 60 to the second bin wall 12 means that the second handling device 30 on the mobile platform 60 is closer to the second bin wall 12 and that the second handling device 30 needs to travel less distance to send wafers out of the wafer storage through the second window 121. At the same time, the arm mechanism 22 can extend the wafer out of the second window 121 without a longer length, and the space occupied by the second carrier 30 can be reduced.

In some embodiments, as shown in fig. 11, the cartridge body 10 includes a third cartridge wall 13 and a fourth cartridge wall 14. The third and fourth walls 13 and 14 are perpendicular to and spaced apart from the second direction x, the first direction y, the second direction x, and the up-down direction are perpendicular to each other, the first stage 41 is located between the third wall 13 and the second carrying device 30 in the second direction x, and the alignment device 70 is located between the fourth wall 14 and the second carrying device 30 in the second direction x. The first handling device 20 and the second handling device 30 need to interact with the first window 111 and the second window 121 in the first direction y, so the first stage 41 and the alignment device 70 are arranged on both sides of the second handling device 30 in the second direction x. That is, the first stage 41 is close to the third compartment wall 13 and the alignment device 70 is close to the fourth compartment wall 14 without impeding the interaction between the handling device and the window.

In some embodiments, as shown in fig. 11, the first stage 41 is located at a corner formed by the second and third walls 12, 13. The opening of the wafer cassette 50 on the first stage 41 is opposite to the second conveying device 30. When the second carrying device 30 takes out the wafer from the wafer cassette 50 on the first stage 41, the wafer needs to be moved from the cassette opening of the wafer cassette 50 toward the second carrying device 30 by a certain distance until the projections of the wafer and the wafer cassette 50 on the horizontal plane do not overlap. That is, the wafer needs to be moved a certain distance between the second transporting device 30 and the wafer cassette 50 on the first stage 41. Therefore, the distance between the second carrier 30 and the wafer cassette 50 on the first stage 41 is at least greater than the diameter of the wafer. The distance between the second carrying device 30 and the wafer cassette 50 on the first stage 41 is the vertical distance from the axis of the connecting shaft between the main body 21 and the arm mechanism 22 to the end face of the cassette 50 on the first stage 41. When the first carrier 41 is disposed at the corner formed by the second and third walls 12 and 13 on the premise that the housing 10 is rectangular, the distance between the second carrying device 30 and the wafer cassette 50 on the first carrier 41 is maximized, so that the wafers in the wafer cassette 50 can be taken out.

In some embodiments, as shown in fig. 12, the plurality of carriers 40 further includes a second carrier 42, and the second handling device 30 is configured to place defective wafers and/or sampled wafers into the wafer cassettes 50 on the second carrier 42, the second carrier 42 being located at a corner of the second bin wall 12 and the fourth bin wall 14. Specifically, the second stage 42 may be fixed to the second wall 12, the fourth wall 14, or the moving platform 60. So long as the distance between the wafer cassette 50 on the second carrier 42 and the second handling device 30 is at least greater than the diameter of the wafer to remove the wafer from within the wafer cassette 50 on the second carrier 42. When the second carrier 42 is positioned at the corners of the second and fourth walls 12 and 14, there is sufficient space between the second carrier 30 and the wafer cassette 50 on the second carrier 42 to take out and put in wafers. At the same time, the defect and/or sample wafer retrieved from second window 121 need only travel a short distance to be placed into wafer cassette 50 on second stage 42.

In some embodiments, as shown in fig. 12 and 13, the second stage 42 is secured to the cartridge body 10 and is positioned above the calibration device 70. The orthographic projection of the second stage 42 on the horizontal plane may or may not be partially coincident with the orthographic projection of the calibration device 70 on the horizontal plane. When the moving platform 60 is located at a position where the second transporting device 30 can send or send wafers through the second window 121, the wafers on the alignment device 70 are higher than the lower edge of the second window 121, the wafer cassette 50 on the first stage 41 is higher than the alignment device 70, the wafer cassette 50 on the second stage 42 is higher than the wafer cassette 50 on the first stage 41, and the upper edge of the second window 121 is higher than the wafer cassette 50 on the second stage 42. Wafer cassette 50 on first stage 41, alignment device 70, and wafer cassette 50 on second stage 42 are alternately spaced up and down and left and right. With this arrangement, the second transporting device 30 has a sufficient operation space when transporting wafers between the three, and the arm mechanism 22 can move between any two of the three. In some embodiments, arm mechanism 22 may be raised and lowered relative to body 21 to enable second handling device 30 to handle wafers between wafer cassette 50 on first stage 41, alignment device 70, and wafer cassette 50 on second stage 42. Specifically, as shown in fig. 14, a shaft 211 may be provided inside the main body 21, and one end of the shaft 211 is rotatably connected to the arm mechanism 22. The shaft 211 can be driven to lift and lower relative to the main body 21, so as to drive the arm mechanism 22 and the moving platform 60 to lift and lower. The drive shaft 211 is lifted by means including, but not limited to, an electric drive, a hydraulic drive.

In some embodiments, as shown in fig. 15, the first stage 41 is provided with a first in-situ sensor 80, wherein the first in-situ sensor 80 is triggered in response to a wafer not in-situ in the wafer cassette 50 on the first stage 41. The first in-place sensor 80 may be disposed at a cassette port of the wafer cassette 50. The first in-place sensor 80 may include a transmitter 81 and a receiver 82. The transmitter 81 is configured to transmit the light beam 83 to the receiver 82, which is configured to receive the light beam 83 transmitted by the transmitter 81. After the wafer is placed in wafer cassette 50, the wafer does not block beam 83 with the wafer in place. If the wafer is not in place, e.g., the wafer protrudes a little, beam 83 is blocked, receiver 82 does not receive beam 83, first in-place sensor 80 is triggered, and the control device can know that the wafer is not in place. In some embodiments, second carrier 42 is provided with a second in-situ sensor, wherein the second in-situ sensor is triggered in response to a wafer in wafer cassette 50 on second carrier 42 not being in place. The second in-place sensor may take the same structure as the first in-place sensor 80.

In some embodiments, as shown in fig. 16, the plurality of carriers 40 includes a plurality of third carriers 43, the plurality of third carriers 43 being supported on the first cartridge wall 11. The third stage 43 may include a temporary storage stage and a storage stage. The orthographic projection of the temporary storage table on the first bin wall 11 falls into the first window 111. The storage table may be disposed above the temporary storage table in a stacked manner in the height direction. The wafer cassette 50 fed from the external environment into the magazine 100 through the first window 111 may be first placed on the temporary storage stage. The first transfer device 20 may transfer the wafer cassette 50 between the plurality of third stages 43.

The present disclosure is described in more detail below in conjunction with specific examples. It should be noted that this example is merely to aid one skilled in the art in understanding the present disclosure, and is not intended to limit the present disclosure to the specific values or particular scenarios illustrated. Various equivalent modifications or variations will be apparent to those skilled in the art from the examples given below, and such modifications or variations are intended to be within the scope of this disclosure.

In some embodiments, as shown in fig. 1 a-16, the wafer storage includes a pod 10, a first handling device 20, and a second handling device 30. The bin body 10 is a hollow rectangular cube. The storage bin 100 is a storage space inside the bin body 10, and a plurality of carrying platforms 40 are arranged in the storage bin 100, wherein the carrying platforms 40 are used for carrying wafer boxes 50, and the wafer boxes 50 are used for containing wafers. The cartridge body 10 comprises a first cartridge wall 11, a second cartridge wall 12, a third cartridge wall 13 and a fourth cartridge wall 14. The first and second walls 11, 12 are spaced apart along the first direction y and the third and fourth walls 13, 14 are spaced apart along the second direction x. The first compartment wall 11 is provided with a first window 111, through which first window 111 the wafer cassette 50 is transferred into or out of the storage compartment 100. The first bin wall 11 is further provided with a plurality of third carriers 43, wherein the third carriers 43 comprise a temporary storage table and a storage table. The orthographic projection of the temporary storage table on the first bin wall 11 falls into the first window 111. The storage table may be disposed above the temporary storage table in a stacked manner in the height direction. The second chamber wall 12 is provided with a second window 121 through which wafers are transferred into and out of the storage chamber 100. The first and second conveyance devices 20 and 30 are disposed in the storage bin 100. the first transfer device 20 is used for transferring the wafer cassette 50 between the plurality of stages 40. The second handling device 30 is used for taking out wafers from the wafer cassette 50 and sending out the wafers out of the magazine 100 through the second window 121, and for receiving wafers outside the magazine 100 and sending the wafers into the wafer cassette 50 inside the magazine 100 through the second window 121. The first conveyance device 20 and the second conveyance device 30 include an arm mechanism 22 and a main body 21 that are common to each other. The arm mechanism 22 includes a plurality of links and joints. The first handling device 20 further comprises a clamping jaw for releasably securing the wafer cassette 50 and the second handling device 30 further comprises a fork for releasably securing the wafer. The clamping jaw and the tooth fork are assembled together to form the fixing mechanism, and the clamping jaw and the tooth fork are arranged along a straight line and face to one side away from each other. The fixing mechanism is connected to one end of the arm mechanism 22, and the main body 21 is connected to the other end of the arm mechanism 22. The main body 21 can drive the arm mechanism 22 to rotate, move and stretch, thereby driving the fixing mechanism to reach the designated position. The wafer storage further includes a movable platform 60 that can be lifted and lowered in the up-down direction. The first handling device 20 and the second handling device 30 are supported on a mobile platform 60. The moving platform 60 comprises a motor 601, a guide 602, a slide 603. The rail 602 is arranged on the second compartment wall 12, the rail 602 being lower in height than the second window 121. One end of a sliding block 603 on the guide rail 602 is connected with a screw rod in the guide rail 602, and the other end is connected with a first platform 604. The body 21 is supported on a first platform 604. The motor 601 drives the screw rod in the guide rail 602 to rotate, and the rotating screw rod drives the sliding block 603 to move along the guide rail 602, so as to drive the first carrying device 20 and the second carrying device 30 on the first platform 604 to lift in the height direction. The mobile platform 60 further includes a frame 605 supported above the first platform 604 and second and third platforms 606, 607 positioned above the frame 605. The second platform 606 and the third platform 607 are higher than the first platform 604 and are located at two sides of the second transporting device 30. The storage bin 100 is also provided with a calibration device 70 and a first stage 41. The calibration device 70 is supported on the second platform 606. The first stage 41 is supported on the third stage 607. The alignment device 70, the first stage 41, the second carrying device 30, and the second carrying device 30 can be lifted and lowered together on the moving platform 60. The calibration device 70 is used to perform a calibration process on wafers that are transferred from or into the magazine 100. A second carrier 42 is also provided in the storage bin 100, and the second handling device 30 is configured to place defective wafers and/or sampled wafers into the wafer cassette 50 on the second carrier 42. The second stage 42 is secured to the fourth cartridge wall 14 and is positioned above the aligner. In a top view, the first stage 41 is located at a corner formed by the second and third walls 12 and 13, and the second stage 42 is located at a corner of the second and fourth walls 12 and 14. When the moving platform 60 is located at a position where the second transporting device 30 can send or send wafers through the second window 121, the wafers on the alignment device 70 are higher than the lower edge of the second window 121, the wafer cassette 50 on the first stage 41 is higher than the alignment device 70, the wafer cassette 50 on the second stage 42 is higher than the wafer cassette 50 on the first stage 41, and the upper edge of the second window 121 is higher than the wafer cassette 50 on the second stage 42. The first stage 41 is provided with a first in-situ sensor 80, the first in-situ sensor 80 being triggered in response to a wafer not being in place in the wafer cassette 50 on the first stage 41. The second stage 42 is provided with a second in-situ sensor that is triggered in response to the wafer in the wafer cassette 50 on the second stage 42 not being in place. In the above embodiment, the second transporting device 30 for transporting wafers is provided inside the wafer memory without increasing the volume of the wafer memory, and the second transporting device 30 and the first transporting device 20 share the arm mechanism 22 and the main body 21, so that it is not necessary to separately provide the transporting device for transporting wafers in the process area outside the wafer memory. The first carrier 41 and the alignment device 70 are provided on the moving platform 60, so that the first carrying device 20, the second carrying device 30, the first carrier 41 and the alignment device 70 are lifted and lowered together, thereby improving the space utilization rate in the wafer storage and improving the carrying efficiency of the wafer cassette 50 and the wafers.

It should be noted that the elements described in the above embodiments may be combined in any suitable manner without contradiction. The various possible combinations are not described further in this disclosure in order to avoid unnecessary repetition.

It should be understood that multiple components and/or portions can be provided by a single integrated component or portion. Alternatively, a single integrated component or part may be separated into separate multiple components and/or parts. The disclosure of "a" or "an" to describe a component or section is not intended to exclude other components or sections.

It should be understood that although the terms "first" or "second," etc. may be used in this disclosure to describe various elements (e.g., a first stage and a second stage), these elements are not provided by these terms, which are merely used to distinguish one element from another element.

The basic principles of the present disclosure have been described above in connection with specific embodiments, but it should be noted that the advantages, benefits, effects, etc. mentioned in the present disclosure are merely examples and not limiting, and these advantages, benefits, effects, etc. are not to be considered as necessarily possessed by the various embodiments of the present disclosure. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, since the disclosure is not necessarily limited to practice with the specific details described.

The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the disclosure, and it should be covered in the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (14)

1. A wafer memory, comprising:

the storage bin is internally provided with a plurality of carrying platforms which are used for carrying wafer boxes, the wafer boxes are sent into or out of the storage bin through the first window, the wafer boxes are used for containing wafers, and the wafers are sent into or out of the storage bin through the second window;

a first transporting device arranged in the storage bin for transporting the wafer box among the multiple platforms, and

The second carrying device is arranged in the storage bin and is used for taking out wafers from the wafer box and conveying the wafers out to a process area outside the wafer storage through the second window, and is used for receiving the wafers in the process area outside the wafer storage and conveying the wafers into the wafer box in the storage bin through the second window.

2. Wafer storage according to claim 1, characterized in that a calibration device is provided in the storage bin for performing a calibration process on wafers fed out of or into the storage bin.

3. The wafer storage of claim 2, further comprising a moving platform moving in an up-down direction, said second handling device and said alignment device being supported on said moving platform to be lifted and lowered together.

4. A wafer storage according to claim 3, wherein said plurality of stages includes a first stage, said second handling means is for taking out or putting in wafers into a wafer cassette on said first stage, and said first stage is supported on said moving stage to be lifted and lowered together with said second handling means and said alignment means.

5. The wafer storage of claim 4, wherein said housing comprises a first housing wall and a second housing wall, said first housing wall and said second housing wall being perpendicular to and spaced apart along a first direction, said first direction being perpendicular to an up-down direction, said first housing wall being provided with said first window and said second housing wall being provided with said second window, said second housing wall being closer to said moving platform than said first housing wall.

6. The wafer storage of claim 5, wherein said enclosure includes a third enclosure wall and a fourth enclosure wall, said third enclosure wall and said fourth enclosure wall being perpendicular to and spaced apart along a second direction, said first direction, said second direction and said up-down direction being perpendicular to each other, said first carrier being positioned between said third enclosure wall and said second handling device in said second direction, said alignment device being positioned between said fourth enclosure wall and said second handling device in said second direction.

7. The wafer memory of claim 6 wherein the first carrier is located at a corner formed by the second and third walls.

8. The wafer storage of claim 7, wherein the plurality of carriers further comprises a second carrier, the second handling device being configured to place defective wafers and/or sampled wafers into wafer cassettes on the second carrier, the second carrier being located at a corner of the second bin wall and the fourth bin wall.

9. The wafer storage of claim 8 wherein said second carrier is secured to said housing and is positioned above said alignment means, wherein when said movable platform is positioned such that said second carrier is capable of transporting wafers through said second window, wafers on said alignment means are above the lower edge of said second window, wafer cassettes on said first carrier are above said alignment means, wafer cassettes on said second carrier are above wafer cassettes on said first carrier, and the upper edge of said second window is above wafer cassettes on said second carrier.

10. The wafer storage of claim 8, wherein the first carrier is provided with a first in-place sensor, wherein the first in-place sensor is triggered in response to a wafer in a wafer cassette on the first carrier not being in place, and/or wherein the second carrier is provided with a second in-place sensor, wherein the second in-place sensor is triggered in response to a wafer in a wafer cassette on the second carrier not being in place.

11. The wafer memory of claim 5 wherein the plurality of carriers comprises a plurality of third carriers supported on the first bin wall.

12. The wafer storage of claim 1, further comprising a moving platform moving in an up-down direction, wherein the first handling device includes a first fixing mechanism for releasably fixing the wafer cassette, wherein the second handling device includes a second fixing mechanism for releasably fixing the wafer, wherein the first handling device and the second handling device include arm mechanisms common to each other, one end of the arm mechanisms being supported to the moving platform, and the other end of the arm mechanisms being connected to the first fixing mechanism and the second fixing mechanism.

13. The wafer storage of claim 12, wherein said first securing mechanism and said second securing mechanism are assembled together to form a securing mechanism, said securing mechanism being rotatably connected to said other end of said arm mechanism about an axis of rotation, said first securing mechanism and said second securing mechanism being aligned and each facing a side facing away from each other.

14. The wafer storage of claim 12 wherein said housing includes a first housing wall and a second housing wall, said first housing wall and said second housing wall being spaced apart in a first direction perpendicular to a top-bottom direction, said first housing wall being provided with said first window and said second housing wall being provided with said second window, said second window being higher than said first window in a plan view perpendicular to said first direction, and a reference line extending in said first direction and intersecting a major axis of said arm mechanism passing through said first window and said second window in a plan view perpendicular to said top-bottom direction.