CN119247094A - Chip wide temperature test system and control method thereof, and electronic equipment - Google Patents
Chip wide temperature test system and control method thereof, and electronic equipment Download PDFInfo
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Abstract
The application discloses a chip wide-temperature testing system, a control method thereof and electronic equipment, and relates to the technical field of chip testing. The system comprises a test box and a temperature control device, wherein each test box comprises a plurality of test boards, each test board comprises a test bottom plate provided with a heat insulation layer, a plurality of test stations are arranged in the heat insulation layer, each test station comprises a test sub-board, an isolation chamber arranged between the test sub-board and the test bottom plate and provided with a heat insulation film on the bottom surface, a heat exchange tube and a temperature sensor, the heat exchange tube and the temperature sensor are arranged in the isolation chamber, each test sub-board comprises a non-test surface which is arranged in the isolation chamber and provided with a plurality of non-test elements, and a test surface which is arranged outside the isolation chamber and is provided with a chip to be tested, the temperature control device comprises a controller, a high-temperature medium box and a low-temperature medium box which are arranged in parallel, a first conveying valve is arranged between the high-temperature medium box and the heat exchange tube, a second conveying valve is arranged on the conveying pipeline, and the reliability of the chip wide-temperature test can be improved.
Description
Technical Field
The application relates to the technical field of chip testing, in particular to a chip wide-temperature testing system, a control method thereof and electronic equipment.
Background
In the chip processing and detecting process, before each chip leaves the factory, the performance parameters of the chip in different environment temperatures need to be detected. Some chips are high-speed interfaces with the CPU, and the length, impedance and the like of the signal lines are strictly limited. For such chips, other devices and chips such as CPUs must be implemented on a PCB board and placed as close together as possible to meet signal integrity requirements. When the chip which is placed on the same PCB with other devices such as a CPU and the like is required to be subjected to wide temperature test, the PCB can only be placed in a test box together. When the temperature of the testing environment in the testing box exceeds the reliable temperature range in which other devices such as a CPU can normally work, the performance of the other devices such as the CPU can be deteriorated, the wide temperature testing of the chip is interfered, and the reliability of the wide temperature testing of the chip is reduced.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a chip wide temperature test system, a control method thereof and electronic equipment, which can improve the reliability of chip wide temperature test.
In a first aspect, an embodiment of the present application provides a chip wide temperature testing system, including:
The test box comprises a plurality of test boards, wherein each test board comprises a test bottom plate provided with a heat insulation layer, and a plurality of test stations are arranged in the heat insulation layer, each test station comprises a test sub-board, an isolation cavity arranged between the test sub-board and the test bottom plate and provided with a heat insulation film on the bottom surface, a heat exchange tube and a temperature sensor, wherein the heat exchange tube and the temperature sensor are arranged in the isolation cavity;
The temperature control device comprises a controller, a high-temperature medium box and a low-temperature medium box which are arranged in parallel, wherein a temperature control loop is formed among the high-temperature medium box, the low-temperature medium box and the heat exchange pipe through a conveying pipeline and a backflow pipeline;
The controller is respectively in communication connection with the temperature sensor, the test box, the first conveying valve, the second conveying valve and the flow rate regulating valve;
The controller is used for controlling the opening and closing states of the first conveying valve and the second conveying valve according to the mode of test verification performed in the test box, conveying fluid media with different temperatures to the isolation chamber to enable the chamber temperature to reach a target temperature range in which the non-test element can normally work, and controlling the opening of the flow rate regulating valve according to the acquired chamber temperature to regulate the flow rate of the fluid media.
In a second aspect, an embodiment of the present application provides a control method of a chip wide temperature testing system, which is applied to the controller of the chip wide temperature testing system according to any one of the embodiments of the first aspect, wherein the chip wide temperature testing system further comprises a testing box and a temperature control device, the testing box comprises a testing sub-board, an isolation chamber and a temperature sensor, the testing sub-board comprises a non-testing surface in the isolation chamber, and the temperature control device comprises a high temperature medium box, a low temperature medium box, a first conveying valve, a second conveying valve and a flow rate regulating valve;
the control method comprises the following steps:
According to the mode of test verification carried out in the test box, controlling the opening and closing states of the first conveying valve and the second conveying valve, and conveying fluid media with different temperatures to the isolation chamber to enable the temperature of the chamber to reach a target temperature interval in which the non-test element can normally work;
And controlling the opening of the flow rate regulating valve according to the acquired chamber temperature so as to regulate the flow rate of the fluid medium.
In a third aspect, an embodiment of the present application provides an electronic device, including at least one processor and a memory for communication connection with the at least one processor, where the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor, so that the at least one processor can perform the method for controlling the chip wide temperature test system according to any one of the second aspects.
The embodiment of the application comprises a chip wide temperature testing system, a temperature control device and a temperature control device, wherein the testing box comprises a plurality of testing bottom plates provided with heat insulation layers, and a plurality of testing stations are arranged in the heat insulation layers; the test station comprises a test sub-board, an isolation chamber, a heat exchange tube and a temperature sensor, wherein the isolation chamber is arranged between the test sub-board and a test bottom plate, the bottom surface of the isolation chamber is provided with a heat insulation film, the heat exchange tube is arranged in the isolation chamber, the test sub-board comprises a non-test surface, which is arranged in the isolation chamber and provided with a plurality of non-test elements, and a test surface, which is arranged outside the isolation chamber and is provided with a chip to be tested, the non-test elements are isolated from the chip to be tested, the non-test elements are respectively arranged on the two surfaces of the test sub-board so as to be convenient for controlling the temperature in different areas, the temperature control device comprises a controller, a high-temperature medium box and a low-temperature medium box which are arranged in parallel, a temperature control loop is formed between the high-temperature medium box, the low-temperature medium box and the heat exchange tube through a conveying pipeline and a backflow pipeline, a first conveying valve is arranged between the high-temperature medium box and the heat exchange tube, a flow rate adjusting valve is arranged on the conveying pipeline, the controller is respectively connected with the temperature sensor, the test box, the first conveying valve, the second conveying valve and the flow rate adjusting valve are in communication connection, and the temperature control device is used for controlling the temperature of the temperature chamber of the isolation chamber where the non-test elements are located. In the process of using a chip wide temperature test system to conduct wide temperature test on a chip to be tested, firstly, according to a test verification mode conducted in a test box, the opening and closing states of a first conveying valve and a second conveying valve are controlled, fluid media with different temperatures are conveyed to an isolation chamber, the temperature of the chamber reaches a target temperature interval in which a non-test element can work normally, and then, according to the acquired temperature of the chamber, the opening of a flow rate regulating valve is controlled to regulate the flow rate of the fluid media. In the process of performing wide temperature test on the chip to be tested, the temperature control device is used for controlling the temperature of the isolation chamber where the non-test element is positioned and the temperature of the test environment of the test box where the chip to be tested is positioned, and the temperature of the chamber can be regulated, so that the normal performance of the non-test element is ensured, the probability that the performance deterioration of the non-test element interferes with the wide temperature test of the chip is reduced, and the reliability of the wide temperature test of the chip is improved. That is, the embodiment of the application can improve the reliability of the chip wide temperature test.
Drawings
FIG. 1 is a schematic diagram of a chip wide temperature test system according to an embodiment of the present application;
FIG. 2 is a schematic top view of a single test board with test sub-boards removed in accordance with one embodiment of the present application;
FIG. 3 is a side cross-sectional view of a single test plate provided in one embodiment of the application;
FIG. 4A is a top view of a test sub-board provided by one embodiment of the present application;
FIG. 4B is a side view of a test sub-board provided by one embodiment of the present application;
FIG. 4C is a bottom view of a test sub-board according to one embodiment of the present application
FIG. 5 is a schematic diagram showing a specific structure of a temperature control apparatus according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a communication connection of a controller of a chip wide temperature test system according to an embodiment of the present application;
FIG. 7 is a flow chart illustrating steps of a control method of a chip wide temperature test system according to an embodiment of the present application;
fig. 8 is a schematic hardware structure of an electronic device according to an embodiment of the present invention.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent.
It should be understood that in the description of the present application, references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, only for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present application.
It should be noted that although a logical order is illustrated in the flowchart in the description of the present application, in some cases, the steps illustrated or described may be performed in an order different from that in the flowchart. In the description of the present application, a plurality means one or more, and a plurality means two or more. The description of "first" and "second" is used for the purpose of distinguishing between technical features only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the application only and is not intended to be limiting of the application.
The application discloses a chip wide-temperature testing system, a control method thereof and electronic equipment, and relates to the technical field of chip testing. The system comprises a test box and a temperature control device, wherein each test box comprises a plurality of test boards, each test board comprises a test bottom plate provided with a heat insulation layer, a plurality of test stations are arranged in the heat insulation layer, each test station comprises a test sub-board, an isolation chamber arranged between the test sub-board and the test bottom plate and provided with a heat insulation film on the bottom surface, a heat exchange tube and a temperature sensor, the heat exchange tube and the temperature sensor are arranged in the isolation chamber, each test sub-board comprises a non-test surface which is arranged in the isolation chamber and provided with a plurality of non-test elements, and a test surface which is arranged outside the isolation chamber and is provided with a chip to be tested, the temperature control device comprises a controller, a high-temperature medium box and a low-temperature medium box which are arranged in parallel, a first conveying valve is arranged between the high-temperature medium box and the heat exchange tube, a second conveying valve is arranged on the conveying pipeline, and the reliability of the chip wide-temperature test can be improved.
Embodiments of the present application will be further described below with reference to the accompanying drawings.
In a first aspect, as shown in fig. 1 to 6, the chip wide temperature testing system 1000 includes a testing box 100 and a temperature control device 200.
The test box 100 comprises a plurality of test bottom plates 110 provided with a heat insulation layer 120, wherein a plurality of test stations 130 are arranged in the heat insulation layer 120, the test stations 130 comprise a test sub-plate 131, an isolation chamber 132 arranged between the test sub-plate 131 and the test bottom plates 110 and provided with a heat insulation film 133 at the bottom surface, a heat exchange tube 134 and a temperature sensor 135 arranged in the isolation chamber 132, and the test sub-plate 131 comprises a non-test surface 131B which is arranged in the isolation chamber 132 and provided with a plurality of non-test elements 139, and a test surface which is arranged outside the isolation chamber 132 and is provided with a chip 138 to be tested.
The temperature control device 200 comprises a controller 210, a high-temperature medium tank 220 and a low-temperature medium tank 230 which are arranged in parallel, wherein a temperature control loop is formed among the high-temperature medium tank 220, the low-temperature medium tank 230 and the heat exchange tube 134 through a conveying pipeline 300 and a backflow pipeline 400, a first conveying valve T1 is arranged between the high-temperature medium tank 220 and the heat exchange tube 134, a second conveying valve T2 is arranged between the low-temperature medium tank 230 and the heat exchange tube 134, and a flow speed regulating valve T5 is arranged on the conveying pipeline 300.
The controller 210 is communicatively coupled to the temperature sensor 135, the test tank 100, the first delivery valve T1, the second delivery valve T2, and the flow rate regulating valve T5, respectively.
It can be appreciated that the plurality of test boards 100A are integrally placed in the test box 100, and are placed layer by layer, so that the batch of chips 138 to be tested can be tested simultaneously, and the number of the same test is large. Specifically, according to the size of the test box 100, 1800 chips 138 to be tested can be tested normally.
Further, the roles of the respective elements in the test box 100 will be explained.
It will be appreciated that the insulating layer 120 is used to isolate the isolation chamber 132 from the environment in which the chip 138 to be tested is located in the test box 100, and serves to seal the isolation chamber 132, and to provide good thermal blocking, thereby facilitating zonal temperature control. Specifically, the heat insulating layer 120 and the heat insulating film 133 are made of silicone rubber, and have a good heat insulating effect.
In particular, the test base 110 is configured to carry a plurality of test stations 130, which facilitates batch testing of chips.
Specifically, the test station 130 is used for loading and fixing the chip 138 to be tested so as to realize wide-temperature test of the chip 138 to be tested.
Specifically, the test sub-board 131 is used for loading and fixing the chip to be tested 138 and the non-test element 139, and the chip to be tested 138 and the non-test element 139 are respectively disposed on two sides of the test sub-board 131, so as to independently adjust the environmental temperature of the non-test element 139.
Specifically, the isolation chamber 132 is used to provide a reliable operating environment for the non-test elements 139 on the non-test face 131B of the test sub-board 131, enabling the non-test elements 139 to operate within a reliable temperature range.
Specifically, the heat insulating film 133 serves to further enhance the sealability of the insulating chamber 132 and enhance the heat insulating effect.
Specifically, the heat exchange tube 134 is used for performing heat exchange with air in the isolation chamber 132, and adjusting the chamber temperature in the isolation chamber 132, so that the non-test element 139 on the non-test surface 131B of the test sub-board 131 works in a reliable temperature range in the process of performing wide temperature test on the chip 138 to be tested.
Specifically, the temperature sensor 135 is used to detect the chamber temperature of the isolation chamber 132 in real time during the wide temperature test of the chip 138 to be tested, so as to provide a reliable reference for the temperature control device 200 to adjust the chamber temperature. Specifically, the temperature sensor 135 employs a temperature probe, which is connected to the controller 210 through a temperature detection signal line.
With reference to fig. 2, a temperature control circuit provided in an embodiment of the present application is further described. Specifically, the chip wide temperature test system 1000 further includes a transfer line 300 and a return line 400. The heat exchange tubes 134 in each of the test stations 130 include an inlet 1341 and an outlet 1342, the inlet 1341 being adapted to be connected to one end of the transfer duct 300 for introducing the fluid medium for adjusting the temperature of the chamber, and the outlet 1342 being adapted to be connected to one end of the return duct 400 for discharging the fluid medium after heat exchange. The temperature control apparatus 200 further includes a delivery port 240 and a return port 250. The temperature control loop comprises a first conveying branch pipeline where the high-temperature medium tank 220 is located and a second conveying branch pipeline where the low-temperature medium tank 230 is located. The first conveying branch pipeline and the second conveying branch pipeline are connected in parallel to form a conveying branch unit, one end of the conveying branch unit is connected with the conveying port 240, and the other end of the conveying branch unit is connected with the backflow port 250. The delivery port 240 is connected to the inlet 1341 of the heat exchange tube 134 through the delivery pipe 300, and the return port 250 is connected to the outlet 1342 of the heat exchange tube 134 through the return pipe 400, thereby forming a temperature control loop. The temperature control loop is used for providing a flow path for fluid media with different temperatures, when the fluid media flows into the heat exchange tube 134 to exchange heat with the ambient temperature in the isolation chamber 132 to adjust the temperature of the chamber, and after the heat exchange is finished, the fluid media flows out of the heat exchange tube 134 to return to the temperature control device 200, so that medium circulation is realized, and the temperature of the isolation chamber 132 is adjusted continuously.
Further, the operation of each element in the temperature control device 200 will be described.
It will be appreciated that the hot medium tank 220 is used to store the hot medium and to output the hot medium to the isolation chamber 132 through the delivery pipe 300 when it is desired to raise the chamber temperature of the isolation chamber 132. In particular, the high temperature medium may be hot water or hot gas.
It will be appreciated that the low temperature medium tank 230 is used to store the low temperature medium and to output the low temperature medium to the isolation chamber 132 through the delivery pipe 300 when it is desired to lower the chamber temperature of the isolation chamber 132. In particular, the cryogenic medium may be cold air and cold air.
It is understood that the first transfer valve T1 is disposed on the first transfer branch pipe and between the transfer port 240 and the high temperature medium tank 220, for controlling the on-off of the passage between the transfer port 240 and the high temperature medium tank 220. Specifically, when the first transfer valve T1 is opened, the passage between the transfer port 240 and the high temperature medium tank 220 is conducted, and when the first transfer valve T1 is closed, the passage between the transfer port 240 and the high temperature medium tank 220 is blocked.
It will be appreciated that the second transfer valve T2 is disposed on the second transfer branch pipe and between the transfer port 240 and the low temperature medium tank 230 for controlling the on-off of the passage between the transfer port 240 and the low temperature medium tank 230. Specifically, when the second transfer valve T2 is opened, the passage between the transfer port 240 and the low temperature medium tank 230 is conducted, and when the second transfer valve T2 is closed, the passage between the transfer port 240 and the low temperature medium tank 230 is blocked.
It will be appreciated that the flow rate regulating valve T5 is used to regulate the flow rate of fluid in the conduit. By adjusting the opening degree of the flow rate adjusting valve T5, the amount of liquid flowing through the valve can be adjusted, thereby controlling the flow rate.
In some embodiments, the flow rate adjusting valve T5 of the system according to the embodiment of the present application is disposed in the chip wide temperature testing system 1000 in three ways.
The first arrangement is that one flow rate adjusting valve T5 is adopted, and one flow rate adjusting valve T5 is used as a total adjusting valve and is arranged between the conveying port 240 and the test box 100, so that the flow rate of the fluid medium flowing into the test box 100 body can be uniformly adjusted according to the average temperature of all the isolation chambers 132, so that the flow rates of the fluid medium flowing into all the heat exchange tubes 134 in different test boards 100A are the same, and the chamber temperatures of all the isolation chambers 132 can be uniformly adjusted. The uniform adjustment of the chamber temperatures of all the isolation chambers 132 is not highly accurate and targeted, although the adjustment is efficient. Based on this, a second arrangement is provided.
The second arrangement is that a plurality of flow rate regulating valves T5 are adopted, the number of the flow rate regulating valves T5 is the same as that of the test boards 100A, one flow rate regulating valve T5 is arranged between each test board 100A and the conveying port 240 of the temperature control device 200, and the plurality of flow rate regulating valves T5 are in a parallel connection mode. At this time, each flow rate adjusting valve T5 corresponds to a bypass regulator, and is capable of independently adjusting the flow rate of the fluid medium flowing into the corresponding test plate 100A according to the average temperature of all the isolation chambers 132 on the corresponding test plate 100A, so that the flow rates of the fluid medium flowing into all the heat exchange tubes 134 on the same test plate 100A are the same, thereby uniformly adjusting the chamber temperatures of all the isolation chambers 132 on the same test plate 100A. Further, by adjusting each flow rate adjusting valve T5, the flow rate of the fluid medium flowing into the different test plates 100A is made different. In this way, the chamber temperatures of all the isolation chambers 132 on the same test board 100A can be uniformly adjusted, and the pertinence and the accuracy of the temperature adjustment are improved. In order to further improve the pertinence and the accuracy of the temperature adjustment, a third setting mode is provided.
The third setting mode is that a plurality of flow rate regulating valves T5 are adopted, the number of the flow rate regulating valves T5 is the same as that of the isolation chambers 132, one flow rate regulating valve T5 is arranged at the inlet 1341 of each isolation chamber 132, and each flow rate regulating valve T5 can independently regulate the flow rate of the fluid medium flowing into the corresponding isolation chamber 132 according to the temperature of the corresponding isolation chamber 132, so that the chamber temperature of the corresponding isolation chamber 132 can be independently regulated. In the third setting mode, the flow rate of the fluid medium flowing into each isolation chamber 132 can be independently regulated by using the flow rate regulating valve T5, and the chamber temperature of each isolation chamber 132 can be independently regulated, so that the pertinence and the accuracy of temperature regulation are further improved.
Therefore, the number and the setting mode of the flow rate regulating valves T5 are not particularly limited, and can be selected according to actual requirements.
The controller 210 is configured to control the opening and closing states of the first delivery valve T1 and the second delivery valve T2 according to a mode of test verification performed in the test box 100, deliver fluid media with different temperatures to the isolation chamber 132, so that the chamber temperature reaches a target temperature range in which the non-test element 139 can normally operate, and control the opening of the flow rate adjusting valve T5 according to the acquired chamber temperature to adjust the flow rate of the fluid media. In the process of performing the wide temperature test on the chip 138 to be tested, the temperature control device 200 is used for controlling the chamber temperature of the isolation chamber 132 where the non-test element 139 is located and the test environment temperature of the test box 100 where the chip 138 to be tested is located, so that the chamber temperature can be adjusted, the normal performance of the non-test element 139 is ensured, the probability that the performance deterioration of the non-test element 139 interferes with the chip wide temperature test is reduced, and the reliability of the chip wide temperature test is improved. Therefore, the chip wide temperature test system 1000 provided by the embodiment of the application can improve the reliability of chip wide temperature test.
As shown in fig. 3 and 4A, the test sub-board 131 includes a test surface and a non-test surface 131B, and a plurality of non-test elements 139 are disposed on the non-test surface 131B. According to some embodiments of the present application, the test surface is provided with a chip test socket 137, the chip test socket 137 is used for loading the chip 138 to be tested, and the isolation chamber 132 is filled with heat-conducting silica gel 1321. The non-test elements 139 are placed in the isolation chamber 132 isolated from the incubator by the provision of thermally conductive silicone 1321.
It is understood that the plurality of non-test elements 139 disposed on the non-test face 131B include, but are not limited to, a CPU, a power chip, and the like.
As shown in fig. 4B and 4C, the test sub-board 131 is connected to the chassis via a connector 136, and the connector 136 is disposed on the non-test surface 131B. The test sub-board 131 is further provided with a screw mounting hole 131C, and a screw is screwed with the bottom plate through the screw mounting hole 131C to further fix the test sub-board 131.
As shown in fig. 5 and 6, the temperature control apparatus 200 further includes a heater 221, a refrigerator 231, a fluid pump 260, a first feed valve T3, a second feed valve T4 communicatively connected to the controller 210, the heater 221 being disposed in the high temperature medium tank 220, the refrigerator 231 being disposed in the low temperature medium tank 230, the fluid pump 260 being disposed on the return line 400, the first feed valve T3 being disposed between the high temperature medium tank 220 and the fluid pump 260, and the second feed valve T4 being disposed between the low temperature medium tank 230 and the fluid pump 260, according to some embodiments of the present application.
Specifically, the heater 221 is used to heat the fluid medium stored in the high-temperature medium tank 220 to raise the temperature of the fluid medium to a first target temperature.
Specifically, the refrigerator 231 is used to cool the fluid medium stored in the low-temperature medium tank 230 to reduce the temperature of the fluid medium to the second target temperature.
Specifically, the fluid pump 260 is used for providing power for the flow of the fluid medium, sending the fluid medium in the return pipeline 400 into the high-temperature medium tank 220 or the low-temperature medium tank 230, and realizing the recycling of the fluid medium. Specifically, when the fluid medium is gas, the fluid pump 260 adopts an air pump, when the fluid medium is water, the fluid pump 260 adopts a water pump, and the selection of the fluid pump 260 is not particularly limited according to the requirement.
Specifically, the first feeding valve T3 is disposed on the first conveying branch pipe and between the high-temperature medium tank 220 and the fluid pump 260, for controlling the on-off of the passage between the high-temperature medium tank 220 and the fluid pump 260. Specifically, when the first feed valve T3 is opened, the passage between the high temperature medium tank 220 and the fluid pump 260 is communicated, and the fluid medium enters the high temperature medium tank 220, and when the first feed valve T3 is closed, the passage between the high temperature medium tank 220 and the fluid pump 260 is blocked.
Specifically, the second feeding valve T4 is disposed on the second conveying branch pipe and between the low-temperature medium tank 230 and the fluid pump 260, and is used for controlling the on-off of the passage between the low-temperature medium tank 230 and the fluid pump 260. Specifically, when the second feed valve T4 is opened, the passage between the low temperature medium tank 230 and the fluid pump 260 is communicated, and the fluid medium enters the low temperature medium tank 230, and when the second feed valve T4 is closed, the passage between the low temperature medium tank 230 and the fluid pump 260 is blocked.
In some embodiments, the heater 221 and the refrigerator 231 may not be provided, but the high temperature medium tank 220 may be directly connected to an external heat source (an external hot water source or an external hot air source), the external heat source may inject a high temperature medium into the high temperature medium tank 220 and store a certain amount of the high temperature medium in the high temperature medium tank 220, and the low temperature medium tank 230 may be directly connected to an external cold source (an external cold water source or an external cold air source), and the external cold source may inject a low temperature medium into the low temperature medium tank 230 and store a certain amount of the low temperature medium.
According to some embodiments of the present application, when the high temperature medium tank 220 is a hot water tank and the low temperature medium tank 230 is a cold water tank, the temperature control apparatus 200 further includes a water storage tank 270 provided on the return pipe 400 between the outlet 1342 of the heat exchange pipe 134 and the fluid pump 260, the water storage tank 270 being provided with a water supply port connected to an external water source.
It will be appreciated that when water is used as the fluid medium, there will be a loss in the heated evaporation of water, and therefore the water storage tank 270 is provided to ensure that the fluid medium used to regulate the chamber temperature is sufficient to enable continuous regulation of the chamber temperature and to maintain normal performance of the non-test elements 139. And when the water in the water storage tank 270 is consumed insufficiently, the water storage tank 270 may be filled with water through an external water source, and the special case of water cut-off should be dealt with.
In some embodiments, when the fluid medium is a gas, the heat pump system of the air conditioner may be used in the temperature control device 200 to achieve both hot and cold air delivery.
The temperature control device 200 controls the chamber temperature of the isolation chamber 132 where the non-test element 139 is located and the test environment temperature of the test box 100 where the chip 138 to be tested is located. The chip wide temperature test system 1000 provided by the embodiment of the application can improve the reliability of chip wide temperature test.
It will be appreciated by persons skilled in the art that the system architecture shown in the figures is not limiting of the embodiments of the application and may include more or fewer components than shown, or certain components may be combined, or a different arrangement of components.
It will be understood by those skilled in the art that the system architecture and the application scenario described in the embodiments of the present application are for more clearly describing the technical solution of the embodiments of the present application, and are not limited to the technical solution provided in the embodiments of the present application, and those skilled in the art can know that, with the evolution of the system architecture and the appearance of the new application scenario, the technical solution provided in the embodiments of the present application is equally applicable to similar technical problems.
Based on the above system configuration, various embodiments of the control method of the chip wide temperature test system of the present application are presented below.
In a first aspect, as shown in fig. 7, the control method of the chip wide temperature test system can be applied to the controller of the chip wide temperature test system shown in fig. 1. In addition, the chip wide temperature testing system also comprises a testing box and a temperature control device, wherein the testing box comprises a testing sub-board, an isolation cavity and a temperature sensor, the testing sub-board comprises a non-testing surface in the isolation cavity, and the temperature control device comprises a high temperature medium box, a low temperature medium box, a first conveying valve, a second conveying valve and a flow rate regulating valve. The control method may include, but is not limited to, steps S110 to S120.
And S110, controlling the opening and closing states of the first conveying valve and the second conveying valve according to the mode of test verification performed in the test box, and conveying fluid media with different temperatures to the isolation chamber to enable the temperature of the chamber to reach a target temperature interval in which the non-test element can work normally.
And step S120, controlling the opening degree of the flow rate regulating valve according to the acquired chamber temperature so as to regulate the flow rate of the fluid medium.
Specifically, the test verification modes comprise a high-temperature verification test and a low-temperature verification test, and the fluid mediums with different temperatures comprise a high-temperature medium and a low-temperature medium.
It will be appreciated that the target temperature interval is a reliable temperature interval at which the non-test element can function properly. Typically, conventional devices such as CPUs operate reliably at 0 to 60 ℃. I.e. the target temperature interval is 0 to 60 ℃.
In the process of using the chip wide temperature test system to perform the wide temperature test on the chip to be tested, through steps S110 to S120, firstly, according to the mode of test verification performed in the test box, the opening and closing states of the first conveying valve and the second conveying valve are controlled, fluid media with different temperatures are conveyed to the isolation chamber, so that the chamber temperature reaches the target temperature range where the non-test element can normally work, and then, according to the acquired chamber temperature, the opening of the flow speed regulating valve is controlled to regulate the flow speed of the fluid media. In the process of performing wide temperature test on the chip to be tested, the temperature control device is used for controlling the temperature of the isolation chamber where the non-test element is positioned and the temperature of the test environment of the test box where the chip to be tested is positioned, and the temperature of the chamber can be regulated, so that the normal performance of the non-test element is ensured, the probability that the performance deterioration of the non-test element interferes with the wide temperature test of the chip is reduced, and the reliability of the wide temperature test of the chip is improved. That is, the embodiment of the application can improve the reliability of the chip wide temperature test.
According to some embodiments of the present application, the temperature control apparatus further includes a heater, a refrigerator, a fluid pump, a first feed valve and a second feed valve, and the control method further includes, but is not limited to, steps S210 to S220 before step S110.
Step S210, when the test verification mode is low-temperature verification test, the first feed valve is controlled to be opened, the second feed valve is controlled to be closed, the fluid pump is started to send fluid medium at normal temperature into the high-temperature medium box, the heater is controlled to heat the fluid medium, and when the temperature of the fluid medium is increased to a first target temperature, the test box is started to carry out low-temperature verification test on a chip to be tested.
And step S220, when the test verification mode is a high Wen Yanzheng test, the first feed valve is controlled to be closed, the second feed valve is controlled to be opened, the fluid pump is started to send the fluid medium at normal temperature into the low-temperature medium box, the refrigerator is controlled to cool the fluid medium, and when the temperature of the fluid medium is reduced to a second target temperature, the test box is started to perform high-temperature verification test on the chip to be tested.
Specifically, the first target temperature is 100 degrees celsius and the second target temperature is 0 degrees celsius.
Through steps S210 to S220, when the chip wide temperature test system is used initially, before the test box performs verification test on the chip to be tested, a required high temperature medium or low temperature medium is prepared according to a mode of test verification to be performed, so that the required fluid medium for adjusting the temperature of the cavity can be timely conveyed in the process of performing the chip wide temperature test. And heating or refrigerating can be performed as required, which is beneficial to reducing the energy consumption of the temperature control device.
According to some embodiments of the application, step S110 is further described, step S110 including, but not limited to, steps S111 to 112.
And S111, when the mode of test verification performed in the test box is a low-temperature verification test, controlling the first delivery valve to be opened and the second delivery valve to be closed, and sending the high-temperature medium in the high-temperature medium box into the heat exchange tube so as to increase the temperature of the isolation chamber to a target temperature interval.
And step S112, when the mode of test verification performed in the test box is a high Wen Yanzheng test, the first delivery valve is controlled to be closed, the second delivery valve is controlled to be opened, and the low-temperature medium in the low-temperature medium box is sent into the heat exchange tube, so that the temperature of the isolation chamber is reduced to a target temperature interval.
Specifically, when the temperature control device further comprises a fluid pump, a first feed valve and a second feed valve. In order to ensure that the temperature of the fluid medium in the temperature control loop is circularly regulated and controlled in the low-temperature verification test process, the step S111 further comprises the steps of controlling the first feed valve to be opened, controlling the second feed valve to be closed and controlling the fluid pump to be started, enabling the high-temperature medium to flow out of the high-temperature medium tank, and enabling the high-temperature medium to return to the high-temperature medium tank after sequentially passing through the heat exchange pipe, the return pipeline and the fluid pump so as to realize recycling.
Specifically, in order to ensure that the fluid medium circularly circulates in the temperature control loop to regulate the temperature of the chamber in the high-temperature verification test process, step S112 further comprises the steps of controlling the first feed valve to be closed, the second feed valve to be opened and the fluid pump to be started, enabling the low-temperature medium to flow out of the low-temperature medium tank, sequentially passing through the heat exchange tube, the return pipeline and the fluid pump, and returning to the low-temperature medium tank to realize recycling.
Through step S111 to step S112, when the low temperature verification test is performed, the first delivery valve is controlled to be opened to conduct the passage between the delivery port and the high temperature medium box, the second delivery valve is controlled to be closed to block the passage between the delivery port and the low temperature medium box, the high temperature medium in the high temperature medium box flows into the heat exchange tube of the isolation chamber through the delivery pipeline to perform heat exchange with the environment of the isolation chamber, the chamber temperature of the isolation chamber is raised to a target temperature interval, and the normal performance of the non-test element is ensured. When high-temperature verification test is carried out, the first conveying valve is controlled to be closed to block a passage between the conveying port and the high-temperature medium box, the second conveying valve is controlled to be opened to conduct the passage between the conveying port and the low-temperature medium box, and low-temperature medium in the low-temperature medium box flows into the heat exchange tube of the isolation chamber through the conveying pipeline to exchange heat with the environment of the isolation chamber, so that the temperature of the chamber of the isolation chamber is reduced to a target temperature range, and the performance of the non-test element is ensured to be normal. Thus, the probability that performance deterioration of the non-test element interferes with the chip wide temperature test is reduced, and the reliability of the chip wide temperature test is improved.
As an example, the temperature control device controls the temperature range of the chamber within a reliable temperature range required by devices such as a CPU, and when the chip to be tested is in a high temperature environment (85 ℃), the temperature control device includes but is not limited to injecting ice water/cold air at 0 ℃ into the heat exchange tube through the conveying pipeline so as to take away heat conducted by the isolation chamber where the non-test element such as the CPU is located, and ensure that circuits such as the CPU, the power IC and the like work within a qualified high temperature range (< 60 ℃). When the chip to be tested is in a low-temperature environment (-40 ℃), the temperature control device comprises but is not limited to injecting hot water/hot air at 100 ℃ into the heat exchange tube through the conveying pipeline, and heating the isolation chamber where the non-test element is located, so that circuits such as a CPU (Central processing Unit), a power IC (Integrated Circuit) and the like are ensured to work in a qualified low-temperature zone (> 0 ℃). So as to reduce the implementation difficulty of the temperature control device and reduce the energy consumption of the temperature control device.
According to some embodiments of the application, step S120 is further described, step S120 including, but not limited to, steps S310 to S350.
Step S310, opening the flow rate regulating valve and regulating the opening of the flow rate regulating valve to an initial opening value in the process of performing the low-temperature verification test.
And step 320, acquiring the chamber temperature of each isolation chamber in real time through a temperature sensor.
Step S330, determining a temperature reference value according to the chamber temperature of each isolation chamber.
Step S340 of increasing the opening of the flow rate regulating valve from the initial opening to a first opening value to increase the flow rate of the fluid medium when the temperature reference value is lower than the first temperature threshold value.
And step S350, when the temperature reference value is higher than a second temperature threshold value, reducing the opening of the flow speed regulating valve from the initial opening to a second opening value to reduce the flow speed of the fluid medium, wherein the first temperature threshold value is smaller than the second temperature threshold value.
It is understood that the opening degree of the flow rate regulating valve influences the flow rate of the fluid medium, and the opening degree of the flow rate regulating valve can be determined according to the actually required flow rate of the high-temperature medium, so that the values of the first opening degree value and the second opening degree value are not particularly limited.
In one embodiment, the first temperature threshold is 5 ℃ and the second temperature threshold is 10 ℃.
Through step S310 to step S350, in the low-temperature verification test process, the temperature control device can automatically and timely adjust the temperature of the chamber by adjusting and controlling the flow rate of high-temperature medium fed into the isolation chamber according to the temperature of the chamber of the isolation chamber, so that the normal performance of non-test elements is ensured, and the reliability of the chip wide-temperature test is improved.
For example, when a low-temperature verification test is performed on a chip to be tested, 100 ℃ hot water is injected into a conveying pipeline, the temperature of a cavity of an isolation cavity where a CPU is located is detected in real time, the injection speed of the hot water is increased when the temperature of the cavity is lower than 5 ℃, and the injection speed of the hot water is reduced when the temperature of the cavity is higher than 10 ℃. By the dynamic adjustment method, when the chip to be tested is in a low-temperature environment, the temperature of the cavity is higher than 0 ℃, and the reliable operation of the non-test element is ensured.
According to some embodiments of the application, step S120 is further described, step S120 including, but not limited to, steps S410 to S450.
Step S410, opening the flow rate regulating valve and regulating the opening of the flow rate regulating valve to an initial opening value in the process of performing the high-temperature verification test.
And S420, acquiring the chamber temperature of each isolation chamber in real time through a temperature sensor.
Step S430, determining a temperature reference value according to the chamber temperature of each isolation chamber.
Step S440, when the temperature reference value is higher than the third temperature threshold value, the opening degree of the flow rate regulating valve is increased from the initial opening degree to a third opening degree value so as to increase the flow rate of the fluid medium.
And S450, when the temperature reference value is lower than a fourth temperature threshold value, reducing the opening of the flow rate regulating valve from the initial opening to a fourth opening value to reduce the flow rate of the fluid medium, wherein the third temperature threshold value is larger than the fourth temperature threshold value.
It is understood that the opening degree of the flow rate regulating valve influences the flow rate of the fluid medium, and the opening degree of the flow rate regulating valve can be determined according to the actually required flow rate of the low-temperature medium, so that the values of the third opening degree value and the fourth opening degree value are not particularly limited.
In one embodiment, the third temperature threshold is 55 ℃, and the fourth temperature threshold is 50 ℃.
Through step S410 to step S450, in the high temperature verification test process, the temperature control device can automatically and timely adjust the temperature of the chamber by adjusting and controlling the flow rate of the low temperature medium fed into the isolation chamber according to the temperature of the chamber of the isolation chamber, so that the normal performance of the non-test element is ensured, and the reliability of the chip wide temperature test is improved.
For example, when a high-temperature verification test is performed on a chip to be tested, 0 ℃ of ice water is injected into a conveying pipeline, the temperature of a chamber of an isolation chamber where a CPU is located is detected in real time, the injection speed of the ice water is increased when the temperature of the chamber is higher than 55 ℃, and the injection speed of the ice water is reduced when the temperature of the chamber is lower than 50 ℃. By the dynamic adjustment method, when the chip to be tested is in a high-temperature environment, the temperature of the cavity is lower than 60 ℃, and the reliable operation of the non-test element is ensured.
Step S330 and step S430 are further described. It can be understood that the flow rate regulating valve of the system provided by the embodiment of the application has three setting modes in the chip wide temperature test system, and three different temperature reference value determining modes correspond to different setting modes of the flow rate regulating valve.
When the first arrangement is used to provide the flow rate regulating valves, i.e. one flow rate regulating valve as the total regulating valve, the flow rate of the fluid medium flowing into the test tank is uniformly regulated. The corresponding temperature reference value determining mode is that the chamber temperatures of all the isolation chambers are obtained, the first average temperature of the isolation chambers is calculated based on the chamber temperatures of all the isolation chambers, and the first average temperature is determined to be a temperature reference value, so that the total regulating valve can be conveniently regulated by taking the first average temperature as a reference.
When the second arrangement is used, the flow rate regulating valves are arranged, i.e. one flow rate regulating valve independently regulates the flow rate of the fluid medium flowing into the corresponding test plate. The corresponding temperature reference value is determined by calculating a second average temperature of all isolation chambers on one test board after the chamber temperatures of all isolation chambers on the corresponding test board are obtained for each flow rate regulating valve, and determining the second average temperature as the temperature reference value so as to be convenient for the subsequent reference regulation of the flow rate regulating valves of each branch.
When the third arrangement is adopted, the flow rate regulating valves are arranged, that is, each flow rate regulating valve individually regulates the flow rate of the fluid medium flowing into the corresponding isolation chamber. The corresponding temperature reference value is determined by determining the acquired chamber temperature of the isolation chamber as a temperature reference value for each flow rate regulating valve so as to be convenient for the subsequent reference to regulate the flow rate regulating valve of each branch.
It should be emphasized that the present invention is also applicable to all other applications requiring scaled compatibility testing, burn-in testing in the IC industry.
As shown in fig. 8, the present invention further provides an electronic device, including:
the processor 801 may be implemented by a general purpose central processing unit, a microprocessor, an application specific integrated circuit, or one or more integrated circuits, etc. for executing related programs to implement the technical solutions provided by the embodiments of the present application.
The memory 802 may be implemented in the form of read-only memory, static storage, dynamic storage, random access memory, or the like. The memory 802 may store an operating system and other application programs, and when the technical solutions provided in the embodiments of the present disclosure are implemented by software or firmware, relevant program codes are stored in the memory 802, and the control method for executing the chip wide temperature test system of the embodiments of the present disclosure is called by the processor 801.
An input/output interface 803 for implementing information input and output.
The communication interface 804 is configured to implement communication interaction between the apparatus and other devices, and may implement communication through a wired manner (such as USB, network cable, etc.), or may implement communication through a wireless manner (such as mobile network, WIFI, bluetooth, etc.).
A bus 805 that transfers information between the various components of the device (e.g., the processor 801, the memory 802, the input/output interface 803, and the communication interface 804).
Wherein the processor 801, the memory 802, the input/output interface 803, and the communication interface 804 implement communication connection between each other inside the device through a bus 805.
While the preferred embodiments of the present application have been described in detail, the present application is not limited to the above embodiments, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the present application, and these equivalent modifications and substitutions are intended to be included in the scope of the present application.
Claims (10)
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012112116A1 (en) * | 2012-12-11 | 2014-06-12 | CTS Clima Temperatur Systeme GmbH | testing system |
| CN207832352U (en) * | 2017-11-20 | 2018-09-07 | 泉州七洋机电有限公司 | Calorimeter temperature shock test device |
| CN111289877A (en) * | 2020-03-03 | 2020-06-16 | 武汉精鸿电子技术有限公司 | Aging test equipment |
| CN112604720A (en) * | 2020-11-27 | 2021-04-06 | 山东大学 | Constant-temperature and constant-humidity test box and rapid temperature and humidity adjustment control method |
| CN115951733A (en) * | 2022-12-29 | 2023-04-11 | 天芯互联科技有限公司 | Temperature control system and aging test box |
| CN116580752A (en) * | 2023-04-26 | 2023-08-11 | 深圳市晶存科技有限公司 | Incubator for test and test method thereof |
| CN117849584A (en) * | 2023-12-29 | 2024-04-09 | 成都态坦测试科技有限公司 | Semiconductor chip aging test cabinet |
| CN118189397A (en) * | 2024-03-29 | 2024-06-14 | 华南理工大学 | A green water-heat storage circulation system with multiple cold and hot water tanks and energy flow method |
-
2024
- 2024-09-20 CN CN202411317959.8A patent/CN119247094A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012112116A1 (en) * | 2012-12-11 | 2014-06-12 | CTS Clima Temperatur Systeme GmbH | testing system |
| CN207832352U (en) * | 2017-11-20 | 2018-09-07 | 泉州七洋机电有限公司 | Calorimeter temperature shock test device |
| CN111289877A (en) * | 2020-03-03 | 2020-06-16 | 武汉精鸿电子技术有限公司 | Aging test equipment |
| CN112604720A (en) * | 2020-11-27 | 2021-04-06 | 山东大学 | Constant-temperature and constant-humidity test box and rapid temperature and humidity adjustment control method |
| CN115951733A (en) * | 2022-12-29 | 2023-04-11 | 天芯互联科技有限公司 | Temperature control system and aging test box |
| CN116580752A (en) * | 2023-04-26 | 2023-08-11 | 深圳市晶存科技有限公司 | Incubator for test and test method thereof |
| CN117849584A (en) * | 2023-12-29 | 2024-04-09 | 成都态坦测试科技有限公司 | Semiconductor chip aging test cabinet |
| CN118189397A (en) * | 2024-03-29 | 2024-06-14 | 华南理工大学 | A green water-heat storage circulation system with multiple cold and hot water tanks and energy flow method |
Non-Patent Citations (1)
| Title |
|---|
| 王彩霞;李瑛;方杰;姚熠恺;胡永攀;: "洗衣机性能测试恒温水系统设计", 家电科技, no. 08, 15 August 2015 (2015-08-15) * |
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Inventor after: Lai Nai Inventor after: Liu Xiaojin Inventor before: Liu Xiaojin Inventor before: Lai Nai |