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CN119233546A - A MiniLED circuit board immersion etching system - Google Patents

A MiniLED circuit board immersion etching system Download PDF

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Publication number
CN119233546A
CN119233546A CN202411732731.5A CN202411732731A CN119233546A CN 119233546 A CN119233546 A CN 119233546A CN 202411732731 A CN202411732731 A CN 202411732731A CN 119233546 A CN119233546 A CN 119233546A
Authority
CN
China
Prior art keywords
plate
circuit board
etching
fixedly connected
miniled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202411732731.5A
Other languages
Chinese (zh)
Inventor
葛啟顺
刘培培
郑雨停
陈立冬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Longnan Dingtai Electronic Technology Co ltd
Original Assignee
Longnan Dingtai Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Longnan Dingtai Electronic Technology Co ltd filed Critical Longnan Dingtai Electronic Technology Co ltd
Priority to CN202411732731.5A priority Critical patent/CN119233546A/en
Publication of CN119233546A publication Critical patent/CN119233546A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

本发明涉及电路板加工技术领域,并公开了一种MiniLED电路板浸入式蚀刻系统,包括蚀刻槽本体,所述蚀刻槽本体的内壁底部固定连接有限位板,且该蚀刻槽本体的内壁底部还设置有可与限位板配合固定外部电路板的定位件;其中,所述定位件包括固定板,所述固定板的下表面与蚀刻槽本体的内壁底部固定连接,所述固定板通过开设在其内部的槽孔滑动连接有连接杆。该MiniLED电路板浸入式蚀刻系统,能够有效解决现有技术将电路板放置在蚀刻槽内进行蚀刻时,电路板无法在蚀刻槽内部稳定放置,多个电路板之间会相互堆叠,导致它们之间的重合面无法与蚀刻液体充分接触,降低了电路板蚀刻工艺的均匀性,从而使得蚀刻效果差的问题。

The present invention relates to the technical field of circuit board processing, and discloses a MiniLED circuit board immersion etching system, comprising an etching tank body, the bottom of the inner wall of the etching tank body is fixedly connected to a limit plate, and the bottom of the inner wall of the etching tank body is also provided with a positioning member that can cooperate with the limit plate to fix the external circuit board; wherein, the positioning member comprises a fixing plate, the lower surface of the fixing plate is fixedly connected to the bottom of the inner wall of the etching tank body, and the fixing plate is slidably connected to a connecting rod through a slot hole provided inside the fixing plate. The MiniLED circuit board immersion etching system can effectively solve the problem that when the circuit board is placed in the etching tank for etching in the prior art, the circuit board cannot be stably placed inside the etching tank, and multiple circuit boards will be stacked on each other, resulting in the overlapping surfaces between them being unable to fully contact with the etching liquid, reducing the uniformity of the circuit board etching process, thereby resulting in poor etching effect.

Description

MiniLED circuit board immersion etching system
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a MiniLED circuit board immersion etching system.
Background
A circuit board, also called a printed circuit board, is a board made of insulating material (such as fiberglass or plastic) on which conductive paths, also called traces, are engraved for connecting various electronic components on board, which are an integral part of modern electronic equipment, and which, by providing an efficient and reliable means of connecting the components, make the design and manufacture of electronic products more accurate and efficient.
In the prior art, when a circuit board is placed in an etching groove for etching, the circuit board cannot be stably placed in the etching groove, a plurality of circuit boards can be stacked mutually, so that the overlapped surfaces between the circuit boards cannot be fully contacted with etching liquid, the uniformity of the etching process of the circuit board is reduced, and the etching effect is poor.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects existing in the prior art, the invention provides a MiniLED circuit board immersion etching system, which can effectively solve the problems that when the circuit board is placed in an etching groove for etching in the prior art, the circuit board cannot be stably placed in the etching groove, a plurality of circuit boards can be mutually stacked, so that the superposition surfaces of the circuit boards cannot be fully contacted with etching liquid, the uniformity of the etching process of the circuit board is reduced, and the etching effect is poor.
Technical proposal
In order to achieve the above purpose, the invention is realized by the following technical scheme:
The invention provides a MiniLED circuit board immersion etching system, comprising:
The etching tank comprises an etching tank body, wherein the bottom of the inner wall of the etching tank body is fixedly connected with a limiting plate, and the bottom of the inner wall of the etching tank body is also provided with a positioning piece which can be matched with the limiting plate to fix an external circuit board;
The positioning piece comprises a fixed plate, the lower surface of the fixed plate is fixedly connected with the bottom of the inner wall of the etching groove body, the fixed plate is slidably connected with a connecting rod through a slotted hole formed in the fixed plate, one end of the connecting rod, which is close to the limiting plate, is fixedly connected with a pressing plate, a corrosion-resistant spring is connected between the adjacent surfaces of the fixed plate and the pressing plate, and the corrosion-resistant spring is sleeved on the circumferential outer surface of the connecting rod;
wherein, the surface of pressing the board is provided with the regulating part that can be used for adjusting its position.
Further, still include rotation portion, rotation portion includes the lift bar, the spout has been seted up to the circumference internal surface of etching bath body, the lift bar is through setting up the sliding seat and spout sliding connection at its circumference surface, the lower surface fixedly connected with arc of lift bar, one side of arc is provided with the driving medium.
Further, the inside of supporting the clamp plate is connected with the grip block through the pivot rotation, and this pivot circumference surface cover is equipped with the torsional spring that is connected with grip block inside, the grip block is provided with two and uses the connecting rod as central symmetry distribution.
Further, the regulating part comprises a regulating block, the outer surface of the regulating block is fixedly connected with one side, away from the limiting plate, of the pressing plate, a V-shaped groove is formed in the upper surface of the regulating block, a guide rod is fixedly connected to the upper surface of the arc-shaped plate, and a guide column is fixedly connected to the lower surface of the guide rod.
Further, the lower surface of the pressing plate is fixedly connected with a weight plate which can be used for supporting an external circuit board, and the adjacent surfaces of the two clamping blocks are designed to be cambered surfaces.
Further, the driving medium includes pinion rack, lower pinion rack, the surface of pinion rack, lower pinion rack all is close to one side fixed plate with the arc, the one end fixedly connected with gear that the connecting rod is close to the arc, go up pinion rack, lower pinion rack and be the staggered distribution.
Further, the lifting rods are arranged in four and distributed in a circumferential array by taking the axle center of the etching bath body as the center, and the upper surfaces of the four lifting rods are fixedly connected with rotating rings.
Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
The invention is provided with the limiting plate, the locating piece and the guide post, when the circuit boards are stably placed in etching liquid in a mutually independent manner, the guide post rotates along with the rotating part and is matched with the V-shaped groove to drive the pressing plate in the locating piece to move to the side far away from the limiting plate, the clamping block is in a contracted state, the packaged circuit boards do not deviate and shake, after the circuit boards are placed, the guide post is matched with the V-shaped groove to enable the pressing plate to gradually restore to an initial state, the circuit boards are close to the direction of the limiting plate, the circuit boards are limited, and meanwhile, the clamping block is in an unfolding state, so that both surfaces of the circuit boards are contacted with the etching liquid, the etching is uniform, and the processing effect of the circuit boards is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of an etching chamber according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a rotating part according to an embodiment of the present invention;
FIG. 4 is a schematic perspective view of a pressing plate and a driving member according to an embodiment of the present invention;
FIG. 5 is a schematic view of a gear of a positioning assembly according to an embodiment of the present invention;
FIG. 6 is a schematic view of the structure of FIG. 4 with a partial enlargement according to an embodiment of the present invention;
FIG. 7 is a schematic view of a limiting plate, a positioning member and an arc plate according to an embodiment of the present invention;
FIG. 8 is a separation view of the pressing plate, torsion spring and clamping block according to the embodiment of the present invention.
The reference numbers in the figure respectively represent 1, an etching bath body, 11, a limiting plate, 12, a positioning piece, 121, a fixing plate, 122, a connecting rod, 123, a pressing plate, 1231, a counterweight plate, 124, a corrosion-resistant spring, 125, a clamping block, 126, a torsion spring, 13, an adjusting piece, 131, an adjusting block, 1311, a V-shaped groove, 132, a guide rod, 133, a guide post, 2, a rotating part, 21, a lifting rod, 22, a sliding seat, 23, an arc plate, 24, a transmission piece, 241, an upper toothed plate, 242, a lower toothed plate, 243, a gear, 25 and a rotating ring.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention is further described below with reference to examples.
Examples:
Referring to FIGS. 1-8, the present invention provides a method for manufacturing a MiniLED circuit board immersion etching system, comprising:
The etching tank comprises an etching tank body 1, wherein a limiting plate 11 is fixedly connected to the bottom of the inner wall of the etching tank body 1, positioning pieces 12 which can be matched with the limiting plate 11 to fix an external circuit board are further arranged at the bottom of the inner wall of the etching tank body 1, a plurality of groups of the limiting plates 11 and the positioning pieces 12 are arranged in one-to-one correspondence, and the limiting plates are distributed in a circumferential array by taking the axis of the etching tank body 1 as the center.
The positioning piece 12 comprises a fixing plate 121, wherein the lower surface of the fixing plate 121 is fixedly connected with the bottom of the inner wall of the etching bath body 1, the fixing plate 121 is slidably connected with a connecting rod 122 through a slotted hole formed in the fixing plate 121, one end of the connecting rod 122, which is close to the limiting plate 11, is fixedly connected with a pressing plate 123, a corrosion-resistant spring 124 is connected between the adjacent surfaces of the fixing plate 121 and the pressing plate 123, and the corrosion-resistant spring 124 is sleeved on the circumferential outer surface of the connecting rod 122;
wherein the outer surface of the pressing plate 123 is provided with an adjusting member 13 for adjusting the position thereof.
Still include rotation portion 2, rotation portion 2 includes lift bar 21, and the spout has been seted up to the circumference internal surface of etching bath body 1, and lift bar 21 is through setting up the sliding seat 22 and spout sliding connection at its circumference surface, and the lower surface fixedly connected with arc 23 of lift bar 21, and one side of arc 23 is provided with driving medium 24.
The inside of the pressing plate 123 is rotationally connected with a clamping block 125 through a rotating shaft, and the circumferential outer surface of the rotating shaft is sleeved with a torsion spring 126 connected with the inside of the clamping block 125, and the clamping blocks 125 are provided with two and symmetrically distributed by taking the connecting rod 122 as a center.
The regulating part 13 comprises a regulating block 131, the outer surface of the regulating block 131 is fixedly connected with one side, far away from the limiting plate 11, of the pressing plate 123, a V-shaped groove 1311 is formed in the upper surface of the regulating block 131, the upper surface of the arc-shaped plate 23 is fixedly connected with a guide rod 132, the lower surface of the guide rod 132 is fixedly connected with a guide post 133, the pressing plate 123 is fixedly connected with the regulating block 131, and the pressing plate 123 can be driven to move when the guide post 133 is matched with the V-shaped groove 1311, so that the distance between the pressing plate 123 and the limiting plate 11 is changed, and the clamping of an external circuit board is realized.
The lower surface of the pressing plate 123 is fixedly connected with a counterweight plate 1231 for supporting an external circuit board, and the adjacent surfaces of the two clamping blocks 125 are designed to be cambered surfaces.
The transmission member 24 includes an upper toothed plate 241 and a lower toothed plate 242, the outer surfaces of the upper toothed plate 241 and the lower toothed plate 242 are fixedly connected with one side of the arc plate 23, which is close to the fixed plate 121, one end of the connecting rod 122, which is close to the arc plate 23, is fixedly connected with a gear 243, the upper toothed plate 241 and the lower toothed plate 242 are distributed in a staggered manner, and the upper toothed plate 241 is contacted with the gear 243 or the lower toothed plate 242 is contacted with the gear 243 by moving the upper and lower positions of the arc plate 23, so as to achieve different effects.
The lifting rods 21 are arranged in four and distributed in a circumferential array with the axis of the etching bath body 1 as the center, and the upper surfaces of the four lifting rods 21 are fixedly connected with rotating rings 25.
The circuit board placing process comprises the following steps:
In practical application, when etching is performed on the surface of the circuit board, the etching liquid is placed in the etching bath body 1, the driving motor is started to drive the rotating ring 25 to rotate around the axis of the etching bath body 1, the lifting rod 21 fixedly connected with the rotating ring 25 and the arc plate 23 rotate along with the rotating ring, the lifting rod 21 and the arc plate 23 are positioned at the bottom end in a controllable range in the initial state, racks of the upper toothed plate 241 positioned on the outer surface of the arc plate 23 can be meshed with the gear 243, the arc plates 23 are provided with four racks, the positions of the axis of the etching bath body 1 are distributed in a central circumference array, and the limiting plates 11 are provided with a plurality of groups and are in one-to-one correspondence with the positioning pieces 12.
After the etching system is started, the arc-shaped plate 23 can rotate clockwise along with the lifting rod 21 and the rotating ring 25, the outer surface of the arc-shaped plate 23 slides in a fitting way with the inner circumferential wall of the etching groove body 1, and the sliding seat 22 sleeved on the outer surface of the lifting rod 21 slides in a fitting way in the sliding groove, so that the stable rotation of the arc-shaped plate 23 is ensured. The etching tank body 1 is internally provided with a plurality of groups of locating pieces 12 for placing an external circuit board, the upper surface of the arc plate 23 is fixedly connected with a guide rod 132, the guide rod 132 extends out of the arc plate 23, and a guide post 133 on the lower surface of the guide rod 132 can be attached to the inner wall of the V-shaped groove 1311 for sliding. When the rotating part 2 rotates clockwise, the etching bath body 1 and the positioning piece 12 inside the etching bath body are kept motionless, the guide rod 132 on the upper surface of the arc plate 23 approaches the positioning piece 12 firstly, along with the continuous rotation, the guide post 133 is attached to the side opening of the V-shaped groove 1311 on the upper surface of the adjusting block 131, the inner wall of the V-shaped groove 1311 is mutually matched with the circumferential outer surface of the guide post 133, along with the continuous rotation of the guide post 133, the guide post 133 drives the adjusting block 131 to approach the arc plate 23 along with the path direction of the V-shaped groove 1311, and the adjusting block 131 is fixedly connected with the pressing plate 123, so that the pressing plate 123, the clamping block 125, the counterweight plate 1231, the connecting rod 122 and the gear 243 do not attach to the circumferential inner wall of the etching bath body 1 in the initial state, attach to the circumferential inner wall of the etching bath body 1 after the movement, and can always contact with the upper toothed plate 241 and the lower toothed plate 242.
In the initial state, the outer surface of the rotating shaft inside the pressing plate 123 is sleeved with a torsion spring 126 connected with the inside of the clamping block 125, so that the clamping block 125 keeps in the unfolded state under the condition of no external force, and the bottom of the fixing plate 121 is fixedly connected with the bottom of the inner wall of the etching bath body 1 and always keeps still. When the pressing plate 123 is displaced toward the fixed plate 121, the corrosion-resistant spring 124 sleeved on the outer surface of the connecting rod 122 is in a compressed state under the influence of the pressing plate 123 until the guide post 133 moves to the middle of the V-shaped groove 1311, the gap between the pressing plate 123 and the fixed plate 121 is minimized, and the distance between the pressing plate 123 and the limiting plate 11 is increased. The side of the clamping block 125 away from the limiting plate 11 is contacted with the fixing plate 121 from the initial inclined state, and then is contacted with the outer surface of the fixing plate 121, so that the clamping block 125 rotates around the rotating shaft until the side of the clamping block 125 away from the limiting plate 11 is completely contacted with the outer surface of the fixing plate 121, and at the moment, the two clamping blocks 125 are in a contracted state.
At this time, the circuit board is grabbed by the external manipulator, and placed at the counterweight plate 1231 between the positioning piece 12 and the limiting plate 11 in the etching bath body 1, and the four guide posts 133 are arranged, so that the position of the pressing plate 123 in the four positioning pieces 12 can be adjusted, and therefore, the four circuit boards can be placed by the mechanical arm at the same time. At this time, the clamping blocks 125 are in an open state, the opening of the clamping block 125 close to the limiting plate 11 adopts an arc inclined plane design, when the circuit board is placed vertically, one side of the circuit board close to the positioning piece 12 is located in the arc inclined planes of the two clamping blocks 125, and the bottom side of the circuit board is located above the counterweight plate 1231. When the mechanical arm stably places the circuit board and then resumes upward, and continues to place other circuit boards, at the same time, the rotating part 2 keeps the original speed and continues to rotate clockwise, the guide post 133 continues to rotate clockwise from the middle part of the V-shaped groove 1311, in this process, the inner wall of the V-shaped groove 1311 and the circumferential outer surface of the guide post 133 cooperate with each other, along with the continued rotation of the guide post 133, the guide post 133 drives the adjusting block 131 to start to move to the side far away from the arc plate 23 along with the path direction of the V-shaped groove 1311, and at the same time, the pressing plate 123, the clamping block 125, the counterweight plate 1231, the connecting rod 122 and the gear 243 simultaneously move to the side of the limiting plate 11, the distance between the pressing plate 123 and the fixing plate 121 is increased, the corrosion-resistant spring 124 loses the pressing force of the pressing plate 123 against the pressing force of the pressing plate, the elastic potential energy starts to resume, and the gap between the pressing plate 123 and the limiting plate 11 is reduced.
Along with the increase of the gap between the pressing plate 123 and the fixed plate 121, the clamping block 125 moves towards the side of the limiting plate 11 along with the pressing plate 123, the side, close to the arc plate 23, of the clamping block 125 starts to separate from the outer surface of the fixed plate 121, after separation, the clamping block 125 rotates around the rotating shaft under the action of the torsion spring 126 inside the clamping block 125, and gradually expands outwards until the initial state is restored, and the torsion spring 126 is made of the same material as the corrosion-resistant spring 124. In this process, the distance between the pressing plate 123 and the limiting plate 11 is reduced, the pressing plate 123 gradually moves towards the circuit board, the clamping blocks 125 are also gradually opened, the bottom side of the circuit board is placed on the counterweight plate 1231, along with the pressing plate 123 moving together, when one side edge of the circuit board is moved to be attached to the limiting plate 11 (in this process, the side edge of the circuit board is located in the arc inclined plane between the two clamping blocks 125 and cannot fall out of the positioning piece 12 due to movement), the pressing plate 123 continues to move, the other side edge of the circuit board is attached to the outer surface of the pressing plate 123 between the two clamping blocks 125, in this process, the corner of the adjacent surfaces of the two clamping blocks 125 close to the rotating shaft is also designed to be an arc surface, when the clamping blocks 125 are completely unfolded, the arc surface in the clamping blocks 125 still can stably limit the circuit board therein without falling off, so far, the guide post 133 is completely detached from the V-shaped groove 1311 formed in the upper surface of the adjusting block 131, the bottom side of the circuit board is attached to the upper surface of the counterweight plate 1231, the bottom side edge of the circuit board is attached to the outer surface of the circuit board between the clamping block 123 and the left side of the circuit board and the outer surface of the limiting plate 11 is attached to the left side of the limiting plate 11, and the outer surface of the circuit board is attached to the left side of the circuit board is attached to the outer surface of the limiting plate 11.
The rotating ring 25 continues to rotate clockwise, after the guide rod 132 and the guide post 133 pass through the adjusting block 131, the upper toothed plate 241 on the outer surface of the arc plate 23 rotates clockwise along with the guide rod, when the guide rod 122 passes through the connecting rod, teeth of the upper toothed plate 241 start to mesh with the gear 243, the upper toothed plate 241 continues to rotate clockwise, the gear 243 can be driven to rotate in the rotating process, the gear 243 is fixedly connected with the connecting rod 122 and the pressing plate 123, when the gear 243 rotates, the pressing plate 123 and the connecting rod 122 can be driven to rotate around a slotted hole formed in the fixing plate 121, after the pressing plate 123 rotates for a certain angle, the upper toothed plate 241 is separated from the teeth of the gear 243, and the lengths of the upper toothed plate 241 and the lower toothed plate 242 can be designed according to the size of a circuit board, so that the circuit board can rotate for a certain angle in the locating piece 12.
Because the bottom of the fixed plate 121 is fixedly connected with the lower surface of the inner wall of the etching bath body 1, and the pressing plate 123 and the counterweight plate 1231 are in a suspended state and have a certain distance from the etching bath body 1, collision cannot occur in the rotation process of the pressing plate 123, and the circuit boards in the pressing plate 123, the counterweight plate 1231 and the clamping block 125 rotate together to eliminate the problem that the circuit boards are immersed in etching liquid, and bubbles or liquid films possibly generated on the surfaces of the boards, particularly small holes, slits and other parts due to the action of surface tension, prevent the etching liquid from contacting the surface of the circuit boards due to the obstruction of the bubbles or the liquid films, so that the etching of the circuit boards is uneven and the etching effect is poor. During rotation, the clamping block 125 is in an open state, but the inner arc surface of the clamping block 125 can still stably limit the circuit board therein without falling off. After the gear 243 is separated from the upper toothed plate 241, the weight plate 1231 has a certain weight, so that the pressing plate 123 and the clamping block 125 can be quickly restored to the initial state for stabilization.
The rotating ring 25 continues to rotate clockwise to the next positioning piece 12, the above actions are repeated, the circuit board is placed in the positioning piece 12 and then is limited and fixed, the upper toothed plate 241 is meshed with the gear 243 to drive the circuit board to swing within a certain range so as to eliminate bubbles and liquid films on the surface of the circuit board, and the actions are repeated until the circuit board is placed in the positioning piece 12 for etching.
The etching process of the circuit board comprises the following steps:
At this time, the external driving motor is started to lift the rotating ring 25 upwards by a certain distance, the lifting rod 21, the arc plate 23, the upper toothed plate 241 and the lower toothed plate 242 move upwards together until the teeth above the lower toothed plate 242 are meshed with the gear 243, at this time, the rotating ring 25 continues to rotate, because the guide rod 132 and the guide post 133 are moved upwards together, in the rotating process, the rotating ring 25 does not contact with the V-shaped groove 1311 formed on the upper surface of the adjusting block 131 any more, in the rotating process of the rotating ring 25, the lower toothed plate 242 contacts with the gear 243 when the lower toothed plate 242 passes through the positioning member 12, and then drives the pressing plate 123 to rotate around the axis of the connecting rod 122 when the lower toothed plate 242 contacts with the gear 243, the circuit board rotates together with the positioning member 12, after the lower toothed plate 242 is separated from the gear 243, the pressing plate 123 swings under the action of the counterweight plate 1231 until the original state is restored, in the process, the etching liquid can be helped to uniformly distribute in the etching tank body, and the surface of the etching plate can be further broken, and the reaction layer can be further improved, and the reaction layer can be further formed, and the reaction layer can be further broken, and the surface can be further etched, and the reaction layer can be further etched. After the circuit board meets the etching requirement, the external manipulator is utilized to pick up and move to the outside of the etching tank body 1 from the top of the circuit board, the next step is carried out, the rotating part 2 is lowered in the process to restore to the initial state, the distance between the pressing plate 123 and the limiting plate 11 is increased by utilizing the matching relation between the guide post 133 and the V-shaped groove 1311, the manipulator is convenient to grasp, the surface of the circuit board is not worn, and the process is consistent with the feeding process of the circuit board.
In summary, the circuit board has the following advantages when etching the inside of the etching chamber body 1:
the advantage one, etching bath body 1 inside is provided with multiunit limiting plate 11 and setting element 12, can carry out diversified spacing with the circuit board in the space that limiting plate 11 and setting element 12 middle pressure plate 123 and counter weight plate 1231 enclose, and the mutually independent is placed inside etching bath body 1 by stability between the circuit board, and two surfaces of circuit board all are with etching liquid phase, and etching effect is good.
When the circuit board is placed downwards, the rotating part 2 drives the guide post 133 to rotate, so that the guide post is matched with the V-shaped groove 1311 above the adjusting block 131, the pressing plate 123 is pulled to enlarge the distance between the guide post and the limiting plate 11, the downward placing process of the circuit board is smoother, abrasion is avoided, the rotating part 2 continues to rotate, the placed circuit board is wrapped between the pressing plate 123 and the limiting plate 11, and the positioning of the circuit board is completed.
The three advantages are that when the adjusting piece 13 moves the position of the pressing plate 123, the self unfolding angle of the clamping block 125 can be adjusted, when the gap between the pressing plate 123 and the limiting plate 11 is maximum, the clamping block 125 is in a contracted state, when the pressing plate 123 and the limiting plate 11 are not used for positioning and clamping a circuit board, the circuit board is prevented from tilting and slumping outside the positioning piece 12 due to no support, when the distance between the pressing plate 123 and the limiting plate 11 is minimum, the clamping block 125 is not attached to the outer surface of the fixed plate 121, and is in an unfolding state under the action of the torsion spring 126 in the clamping block 125, the pressing plate 123 and the limiting plate 11 limit the position of the circuit board, and the clamping block 125 in the unfolding state can be used for contacting the circuit board with etching liquid to the greatest extent in the etching process, so that the etching uniformity is ensured, and the production quality of the circuit board is improved. Meanwhile, the bottom ends of the adjacent surfaces of the two clamping blocks 125 are designed to be cambered surfaces, so that the circuit board can be prevented from falling out of the positioning piece 12 when being inclined even in an unfolding state.
Fourth, the rotation part 2 is in the rotation process, the guide post 133 passes through the V-shaped groove 1311, after the retraction and clamping of the pressing plate 123 are completed, the upper toothed plate 241 is engaged with the gear 243, the circuit board rotates simultaneously with the pressing plate 123 and the counterweight plate 1231, after the upper toothed plate 241 is separated from the gear 243, the upper toothed plate 241 swings back and forth under the action of the counterweight plate 1231 to restore the initial state, so as to eliminate the bubbles or liquid films possibly generated on the surface of the circuit board, especially on the positions of small holes, slits and the like due to the action of surface tension, and avoid the problems of uneven etching and poor etching effect of the circuit board caused by the fact that etching liquid cannot contact with the surface of the circuit board due to the obstruction of the bubbles or the liquid films.
The rotary part 2 has the advantages that the rotary part 2 can be lifted up and down, when the whole rotary part 2 is arranged below and the upper toothed plate 241 can be meshed with the gear 243, the rotary action can be utilized to complete the clamping and loosening actions required by the circuit board feeding and discharging pressing plate 123, when the whole rotary part 2 is arranged above and the lower toothed plate 242 can be meshed with the gear 243, the rotary action can be utilized to complete the back and forth swinging of the circuit board in the etching process, the uniform distribution of etching liquid in the etching tank body 1 is facilitated, a stagnation layer formed by reactants on the surface of the circuit board in the etching process can be broken, the scouring of the etching liquid on the surface of the circuit board is improved, and the etching reaction is further promoted.
Although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the foregoing embodiments may be modified or equivalents may be substituted for some of the features thereof, and that the modification or substitution does not depart from the spirit and scope of the embodiments.

Claims (7)

1.一种MiniLED电路板浸入式蚀刻系统,其特征在于,包括:1. A MiniLED circuit board immersion etching system, comprising: 蚀刻槽本体(1),所述蚀刻槽本体(1)的内壁底部固定连接有限位板(11),且该蚀刻槽本体(1)的内壁底部还设置有可与限位板(11)配合固定外部电路板的定位件(12);An etching tank body (1), wherein the bottom of the inner wall of the etching tank body (1) is fixedly connected to a limiting plate (11), and the bottom of the inner wall of the etching tank body (1) is also provided with a positioning piece (12) that can cooperate with the limiting plate (11) to fix an external circuit board; 其中,所述定位件(12)包括固定板(121),所述固定板(121)的下表面与蚀刻槽本体(1)的内壁底部固定连接,所述固定板(121)通过开设在其内部的槽孔滑动连接有连接杆(122),所述连接杆(122)靠近限位板(11)的一端固定连接有抵压板(123),所述固定板(121)与抵压板(123)的相邻面之间连接有耐腐蚀弹簧(124),且该耐腐蚀弹簧(124)套设在连接杆(122)的圆周外表面;The positioning member (12) comprises a fixing plate (121), the lower surface of the fixing plate (121) is fixedly connected to the bottom of the inner wall of the etching tank body (1), the fixing plate (121) is slidably connected to a connecting rod (122) via a slot hole provided inside the fixing plate (121), one end of the connecting rod (122) close to the limiting plate (11) is fixedly connected to a pressing plate (123), a corrosion-resistant spring (124) is connected between adjacent surfaces of the fixing plate (121) and the pressing plate (123), and the corrosion-resistant spring (124) is sleeved on the circumferential outer surface of the connecting rod (122); 其中,所述抵压板(123)的外表面设置有可用于调整自身位置的调节件(13)。Wherein, the outer surface of the pressing plate (123) is provided with an adjusting member (13) which can be used to adjust its position. 2.根据权利要求1所述的一种MiniLED电路板浸入式蚀刻系统,其特征在于:还包括转动部(2),所述转动部(2)包括提升杆(21),所述蚀刻槽本体(1)的圆周内表面开设有滑槽,所述提升杆(21)通过设置在其圆周外表面的滑动座(22)与滑槽滑动连接,所述提升杆(21)的下表面固定连接有弧形板(23),所述弧形板(23)的一侧设置有传动件(24)。2. A MiniLED circuit board immersion etching system according to claim 1, characterized in that it also includes a rotating part (2), the rotating part (2) includes a lifting rod (21), a sliding groove is provided on the circumferential inner surface of the etching tank body (1), the lifting rod (21) is slidably connected to the sliding groove through a sliding seat (22) arranged on the circumferential outer surface of the lifting rod (21), an arc plate (23) is fixedly connected to the lower surface of the lifting rod (21), and a transmission member (24) is arranged on one side of the arc plate (23). 3.根据权利要求2所述的一种MiniLED电路板浸入式蚀刻系统,其特征在于:所述抵压板(123)的内部通过转轴转动连接有夹持块(125),且该转轴圆周外表面套设有与夹持块(125)内部相连接的扭簧(126),所述夹持块(125)设置有两个并以连接杆(122)为中心对称分布。3. A MiniLED circuit board immersion etching system according to claim 2, characterized in that: the interior of the pressure plate (123) is rotatably connected to a clamping block (125) via a rotating shaft, and a torsion spring (126) connected to the interior of the clamping block (125) is sleeved on the outer surface of the rotating shaft, and two clamping blocks (125) are provided and are symmetrically distributed with the connecting rod (122) as the center. 4.根据权利要求3所述的一种MiniLED电路板浸入式蚀刻系统,其特征在于:所述调节件(13)包括调节块(131),所述调节块(131)的外表面与抵压板(123)远离限位板(11)的一侧固定连接,所述调节块(131)的上表面开设有V型槽(1311),所述弧形板(23)的上表面固定连接有导向杆(132),所述导向杆(132)的下表面固定连接有导向柱(133)。4. A MiniLED circuit board immersion etching system according to claim 3, characterized in that: the adjusting member (13) comprises an adjusting block (131), the outer surface of the adjusting block (131) is fixedly connected to the side of the pressure plate (123) away from the limiting plate (11), the upper surface of the adjusting block (131) is provided with a V-shaped groove (1311), the upper surface of the arc plate (23) is fixedly connected to a guide rod (132), and the lower surface of the guide rod (132) is fixedly connected to a guide column (133). 5.根据权利要求4所述的一种MiniLED电路板浸入式蚀刻系统,其特征在于:所述抵压板(123)的下表面固定连接有可用于承托外部电路板的配重板(1231),两个所述夹持块(125)的相邻面均采用弧面设计。5. A MiniLED circuit board immersion etching system according to claim 4, characterized in that: a counterweight plate (1231) for supporting an external circuit board is fixedly connected to the lower surface of the pressure plate (123), and adjacent surfaces of the two clamping blocks (125) are both designed with curved surfaces. 6.根据权利要求4所述的一种MiniLED电路板浸入式蚀刻系统,其特征在于:所述传动件(24)包括上齿板(241)、下齿板(242),所述上齿板(241)、下齿板(242)的外表面均与弧形板(23)靠近固定板(121)的一侧固定连接,所述连接杆(122)靠近弧形板(23)的一端固定连接有齿轮(243),所述上齿板(241)、下齿板(242)呈交错分布。6. A MiniLED circuit board immersion etching system according to claim 4, characterized in that: the transmission member (24) comprises an upper tooth plate (241) and a lower tooth plate (242), the outer surfaces of the upper tooth plate (241) and the lower tooth plate (242) are fixedly connected to a side of the arc plate (23) close to the fixed plate (121), the end of the connecting rod (122) close to the arc plate (23) is fixedly connected with a gear (243), and the upper tooth plate (241) and the lower tooth plate (242) are staggered. 7.根据权利要求2所述的一种MiniLED电路板浸入式蚀刻系统,其特征在于:所述提升杆(21)设置有四个并以蚀刻槽本体(1)的中心轴圆周阵列分布,四个所述提升杆(21)的上表面均固定连接有转动环(25)。7. A MiniLED circuit board immersion etching system according to claim 2, characterized in that: four lifting rods (21) are provided and distributed in a circular array around the central axis of the etching tank body (1), and the upper surfaces of the four lifting rods (21) are fixedly connected to a rotating ring (25).
CN202411732731.5A 2024-11-29 2024-11-29 A MiniLED circuit board immersion etching system Pending CN119233546A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120081862A1 (en) * 2010-10-05 2012-04-05 Inventec Corporation Structure for fixing circuit board
CN213462520U (en) * 2020-11-25 2021-06-15 惠州市永隆电路有限公司 Special fixture for PCB etching
CN219322680U (en) * 2022-11-01 2023-07-07 临沂睿控电子科技有限公司 Printed circuit board etching device with drying mechanism
CN220173506U (en) * 2023-06-27 2023-12-12 四川龙裕天凌电子科技有限公司 Protection device for etching circuit board
CN118804488A (en) * 2024-07-19 2024-10-18 江苏广谦电子有限公司 A PCB circuit board etching processing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120081862A1 (en) * 2010-10-05 2012-04-05 Inventec Corporation Structure for fixing circuit board
CN213462520U (en) * 2020-11-25 2021-06-15 惠州市永隆电路有限公司 Special fixture for PCB etching
CN219322680U (en) * 2022-11-01 2023-07-07 临沂睿控电子科技有限公司 Printed circuit board etching device with drying mechanism
CN220173506U (en) * 2023-06-27 2023-12-12 四川龙裕天凌电子科技有限公司 Protection device for etching circuit board
CN118804488A (en) * 2024-07-19 2024-10-18 江苏广谦电子有限公司 A PCB circuit board etching processing device

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