CN119233062A

CN119233062A - Shell, camera module, assembly method and electronic equipment

Info

Publication number: CN119233062A
Application number: CN202411745231.5A
Authority: CN
Inventors: 王明珠; 王海涛; 俞丝丝; 陈双佳; 翁宇萍; 干狄威; 岑丽清; 何林锋
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2024-07-31
Filing date: 2024-11-29
Publication date: 2024-12-31
Also published as: CN119629464A; CN119277178A

Abstract

The application provides a shell, a camera module, an assembling method and electronic equipment, wherein the shell of the camera module comprises a cover part, a side wall part and a side wall part, wherein the cover part is suitable for covering at least part of the internal structure of the camera module and is provided with a light inlet, the side wall part is formed around the outer periphery of the cover part, the shell is integrally formed by metal materials to integrate the functions of a shell and a bracket, and an avoidance area is arranged on the side wall part in a region far away from the light inlet and is suitable for avoiding pins of a circuit board of the camera module and other circuit components of the camera module. According to the application, the shell is integrally formed, and the avoidance area is arranged on the shell, so that the pins and the circuit board of the photosensitive assembly are conveniently welded through the avoidance area, thereby forming conductive connection and reducing the risk of causing stain.

Description

Shell, camera module, assembly method and electronic equipment

Technical Field

The present application relates to the field of camera modules, and more particularly, to a housing, a camera module, an assembling method, and an electronic device.

Background

Camera modules are an indispensable part of mobile electronic devices, and as camera module technology advances, user demands for camera modules become more and more refined, and higher demands are generated. The development of camera products not only needs to meet the requirement of high performance, but also needs to meet the requirements of miniaturization, portability and compactness. The internal space of electronic devices such as mobile phones and tablet computers is more and more compact, and the space for accommodating the camera module is very limited, so that the size of the camera module is more and more required.

The camera module generally includes a lens and a photosensitive assembly, and an incident light beam passes through the lens to reach the photosensitive assembly, where it is imaged. The lens and photosensitive assembly are typically mounted to a base, forming part of an imaging module. The periscope type camera module or the long-focus camera module further comprises a prism, and the direction of at least one light beam can be turned for folding the light path to realize long-focus shooting.

The camera module further comprises a shell and a support, wherein the shell is assembled on the outer side of the base or above the base of the photosensitive assembly so as to cover at least part of the inner structure of the base, the support is further installed on the outer side of the shell, in general, the shell plays a role in covering the inner structure of the camera module, and the support is assembled on the outer side of the shell and is suitable for being fixed with electronic equipment. The bracket is usually provided with positioning holes, and screws are screwed and fixed after aligning with corresponding positioning holes on the electronic equipment, so that the camera module is assembled to the electronic equipment.

When the camera module is assembled, the housing needs to be assembled to the base of the camera module, and then the bracket is assembled outside the housing, so that the assembly process is more, the calibration process is more, and the assembly gaps among the devices are more easy to interfere or accumulate tolerance.

Further, since the bracket and the housing are separate two parts, when the bracket is assembled to the periphery of the housing, glue needs to be provided between the bracket and the housing to cure. Meanwhile, the optical lens and the motor component are further assembled in the shell, and glue is often used for curing. Because shrink after glue solidification, can pull the shell and lead to its production deformation to influence the nature or the position of the part of the module of making a video recording in the shell, also probably pull the support and lead to its deformation, and then influence the performance, the production yield of module and complete machine end of making a video recording. Meanwhile, the glue consumption is increased, the glue spreading area is increased, the problems of glue cracking, glue overflow and the like are easy to occur, and the problem of reliability of the camera module can be caused.

In addition, there is accommodation relation between shell and the support, has overlap in the space, and shell and support all possess certain thickness, and this overlap adds the equipment clearance accumulation of reserving in order to avoid interfering, can further increase the size of making a video recording the module. The miniaturization requirement of the current camera module and the internal space of the electronic equipment are more and more compact, and reasonable compression and management of the size of the camera module are also very important.

Disclosure of Invention

An advantage of the present application is to provide a housing, a camera module, an assembling method, and an electronic apparatus, in which the housing of the camera module is directly fixed to a semi-finished product of the camera module, so as to eliminate an assembling gap between a bracket and a housing.

An advantage of the present application is to provide a housing, a camera module, an assembling method, and an electronic device, and to provide a miniaturized housing structure, which improves the integration level of the camera module, and achieves miniaturization.

An advantage of the present application is to provide a housing, a camera module, an assembling method, and an electronic apparatus, in which a bracket and a housing of the camera module are integrally formed to omit an assembling gap between the bracket and the housing.

The application has the advantages that the shell, the camera module, the assembling method and the electronic equipment are provided, the bracket and the shell of the camera module are integrally formed, the bracket is provided with the avoidance area so as to avoid the connection area between the pins of the circuit component and the circuit board in the camera module, the shell is arranged to cover the base to form a closed space, the optical system is positioned in the closed space, the pins exposed in the avoidance area and the circuit board of the photosensitive component are welded, and foreign matters generated by welding cannot enter the inside to cause stain risks and influence the imaging of the camera module.

An advantage of the present application is to provide a housing, an image capturing module, an assembling method, and an electronic apparatus, in which a bracket of the image capturing module is integrated with a housing, the bracket is integrated with a housing sidewall of the housing, at least a portion of the housing sidewall of the housing can be omitted, a thickness of the housing sidewall of the housing is reduced in size of the image capturing module, and a size of the image capturing module is reduced.

An advantage of the present application is to provide a housing, a camera module, an assembling method, and an electronic apparatus, in which a bracket and a housing of the camera module are integrated, and the weight of the camera module is reduced.

The application has the advantages that the shell, the camera module, the assembly method and the electronic equipment are provided, the bracket and the shell of the camera module are integrally formed, the glue coating fixing step between the bracket and the shell is omitted, and the process is simplified.

The application has the advantages that the shell, the camera module, the assembly method and the electronic equipment are provided, the bracket and the shell of the camera module are integrally formed, glue is not required to be coated and fixed between the bracket and the shell, and the glue cracking risk is reduced.

The application has the advantages that the shell, the camera module, the assembling method and the electronic equipment are provided, the bracket and the shell of the camera module are integrally formed, and the coverage of the accommodating space of the camera module and the installation of the camera module in the electronic equipment are realized through the same component time, so that the number of parts of the camera module is reduced, and the manufacturing cost is reduced.

An advantage of the present application is to provide a housing, a camera module, an assembling method, and an electronic apparatus, in which a bracket and a housing of the camera module are integrated, materials used are reduced, and production cost is reduced.

The application has the advantages that the shell, the camera module, the assembly method and the electronic equipment are provided, the bracket and the shell of the camera module are integrally formed, the process is simplified, the assembly tolerance is reduced, and the yield of the camera module is improved.

Drawings

Fig. 1 is a schematic view of an image capturing module according to a preferred embodiment of the present application.

Fig. 2 is a schematic diagram of the camera module according to a preferred embodiment of the present application with the housing and other parts separated.

Fig. 3 is a schematic view of a housing of an image capturing module according to a preferred embodiment of the present application.

Fig. 4 is a bottom view of a housing of the camera module according to a preferred embodiment of the present application.

Fig. 5 is a schematic view of the camera module according to a preferred embodiment of the application with the housing removed.

Fig. 6 is a schematic view of the relief area at the second sidewall portion in accordance with a preferred embodiment of the present application.

Fig. 7 is a schematic view of the relief area at the third sidewall portion at another view angle according to a preferred embodiment of the present application.

Fig. 8 is a schematic view of a positioning hole arrangement position in an implementation of a preferred embodiment of the present application.

Fig. 9 is a schematic view of a positioning hole arrangement position in another implementation of a preferred embodiment of the present application.

Fig. 10 is a schematic view of another view of the housing of the camera module according to a preferred embodiment of the present application.

In the figure, 1, an image pickup module, 10, a housing, 100, a mounting opening, 11, a housing, 12, a bracket, 101, a cover part, 102, a side wall part, 103, a mounting structure, 104, a light inlet, 105, a light outlet, 106, an inner surface, 107, an outer surface, 108, a space, 111, a housing cover wall, 112, a housing side wall, 113, a bending part, 121, a first side wall part, 122, a second side wall part, 123, a third side wall part, 124, a fourth side wall part, 1000, a housing cover space, 1001, an inner side surface, 1101, a first side surface, 1120, a combination hole, 1121, a first housing side wall, 1122, a second housing side wall, 1123, a third housing side wall, 1201, a second side surface, 1202, a dodging area, 1203, a dodging area connecting part, 1204, a clamping hole, 20, a base, 200, a housing space, 201, an outer peripheral side surface, 202, a light through hole, 203, a mounting space, 204, a mounting seat, 2041, a mounting support leg, 205, a bending part, a buckle, 30, a lens assembly, 40, a light path assembly, a 40, a connecting plate, 41, a circuit board, a 50, a semi-finished product assembly, a circuit assembly, a 50, a camera module, a connector, a 50, and an image pickup assembly are shown.

Detailed Description

The invention will be further described with reference to the drawings and examples.

The conception, specific structure, and technical effects produced by the present invention will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present invention. It is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present invention based on the embodiments of the present invention. In addition, all the coupling/connection relationships referred to in the patent are not direct connection of the single-finger members, but rather, it means that a better coupling structure can be formed by adding or subtracting coupling aids depending on the specific implementation. The technical features in the invention can be interactively combined on the premise of no contradiction and conflict.

The present application will be further described with reference to the following specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

In the description of the present application, it should be noted that, for the azimuth words such as terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present application and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present application that the device or element referred to must have a specific azimuth configuration and operation.

It should be noted that the terms "first," "second," and the like in the description and in the claims are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

The terms "comprises" and "comprising," along with any variations thereof, in the description and claims of the present application are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.

It is noted that, as used in the present application, the terms "substantially," "about," and the like are used as terms of approximation of a table, not as terms of degree of the table, and are intended to illustrate inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through intermediaries, or connected in communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification and the appended claims, the singular forms "a," "an," and "the" are intended to cover the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

[ Camera Module ]

Referring to fig. 1 and 2 of the drawings, the present application provides a camera module 1, the camera module 1 includes a housing 10 and a semi-finished camera module 70, the semi-finished camera module 70 further includes a base 20, a lens assembly 30 and a photosensitive assembly 40, the lens assembly 30 is mounted in a receiving space 200 of the base 20, and the photosensitive assembly 40 is fixed with the base 20. The housing 10 is disposed at least partially around the base 20 to cover the lens assembly 30 disposed in the accommodating space 200.

The housing 10 and the base 20 may be connected by gluing, welding, interference fit, snap connection, mechanical connection, threading, hinging, etc., and in one alternative embodiment, the housing 10 and the base 20 are connected by gluing.

The housing 10 includes a shell 11 and a bracket 12. In some alternative embodiments, the shell 11 and the bracket 12 are integrally formed to form a unitary body.

The base 20 has a light-passing opening 202, the outgoing side of the lens assembly 30 faces the light-passing opening 202, the photosensitive assembly 40 is mounted on the base 20, the photosensitive assembly 40 faces the light-passing opening 202, and is located on the outgoing side of the lens assembly 30, and the light beam outgoing from the lens assembly 30 reaches the photosensitive assembly 40 for imaging.

Further, the semi-finished product 70 of the camera module 1 may further include a lens driving component for driving the lens assembly 30 to move, so as to achieve focus adjustment, and achieve the purpose of auto-focusing and/or zooming. The lens driving assembly includes a first driving unit mounted to the base 20 and a second driving unit mounted to the lens assembly 30, the first driving unit and the second lens driving unit interacting to drive the lens assembly 30 to move relative to the base 20.

In one embodiment of the driving form of the present application, the lens driving assembly is implemented as a voice coil motor type driving, one of the first driving unit and the second lens driving unit is implemented as a magnet, and the other is implemented as a coil. In other embodiments of the drive form of the present application, the lens drive assembly is implemented as a piezo motor drive, SMA (Shape Memory Alloys, shape memory alloy) drive, stepper motor, or other drive form.

For the purpose of convenience of description, the height or thickness direction of the camera module is defined as the Z axis, and the height direction of the camera module is the thickness direction of the electronic device on which the camera module is mounted. The two directions of the transverse direction and the longitudinal direction which are perpendicular to the height direction of the camera module are respectively defined as an X axis and a Y axis.

The camera module comprises a vertical camera module, a periscope camera module, other types of long-focus camera modules and other types of various forms.

In one embodiment of the present application, the camera module 1 is implemented as a periscope camera module. The semi-finished camera module 70 of the camera module 1 may further include a light path turning component 50, where the light path turning component 50 is disposed in the accommodating space 200 of the base 20, and an exit side of the light path turning component 50 faces an incident side of the lens component 30. The light path turning component 50 turns the incident light, and then passes through the lens component 30 to reach the photosensitive component 40 for imaging.

The light path turning component 50 turns the light beam incident along the first direction (Z axis) of the height direction to exit along the direction toward the photosensitive component 40. The optical path turning member 50 and the lens member 30 are disposed in order along a propagation direction (second direction Y axis) of the light beam from the light incident side to the light emitting side.

The semi-finished camera module 70 of the camera module 1 may further include an optical path turning driving component for driving the optical path turning component 50 to move, so as to implement at least one direction movement of the optical path turning component 50. Illustratively, the optical path turning driving component drives the optical path turning component 50 to rotate around a transverse direction (a third direction X axis) to realize a nodding motion and correct the position of the optical path turning component 50 to realize an anti-shake motion, the optical path turning driving component drives the optical path turning component 50 to rotate around a height direction (a first direction Z axis) to realize a shaking motion and correct the position of the optical path turning component 50 to realize an anti-shake motion, the optical path turning driving component drives the optical path turning component 50 to rotate around a beam propagation direction (a second direction Y axis) to correct the position of the optical path turning component 50 to realize an anti-shake motion, the optical path turning driving component drives the optical path turning component 50 to move along the beam propagation direction (a second direction Y axis) to realize a focus adjustment motion, and the optical path turning driving component drives the optical path turning component 50 to realize one or more directions of rotation or movement to realize an anti-shake and/or focusing adjustment motion.

The foregoing examples illustrate examples in which the optical path turning member 50 is disposed on the incident side of the lens assembly 30, and in other periscopic camera modules, the optical path turning member 50 is disposed between the lens assembly 30 and the photosensitive assembly 40 to turn the direction of the light beam at least once after the light beam exits the lens assembly 30 and before the light beam enters the photosensitive assembly 40.

In other periscope type camera modules, a plurality of the optical path turning components 50 are included, wherein at least one of the optical path turning components can be arranged in front of the incident side of the lens component 30 to turn the direction of the light beam at least once before the light beam is incident on the lens component 30, and at least one of the optical path turning components can be arranged between the lens component 30 and the photosensitive component 40 to turn the direction of the light beam at least once after the light beam is emitted from the lens component 30 and before the light beam is incident on the photosensitive component 40.

In other periscope type camera modules, other lenses may be disposed before the incident side of the optical path turning component 50, so that the light beam passes through the lenses before entering the optical path turning component 50.

In addition, each of the optical path turning members 50 may perform one or more turning of the direction of the optical beam, which is not limited in the present application.

The optical path turning driving assembly includes a first optical path turning driving unit and a second optical path turning driving unit, the first optical path turning driving unit is disposed on the base 20, the second optical path turning driving unit is disposed on the optical path turning assembly 50, and the first optical path turning driving unit and the second optical path turning driving unit interact to drive the optical path turning assembly 50 to move.

In one embodiment of the driving form of the present application, the optical path turning driving unit is implemented as a voice coil motor type driving, one of the first optical path turning driving unit and the second optical path turning driving unit is implemented as a magnet, and the other is implemented as a coil.

In other embodiments of the drive form of the present application, the optical path turning drive assembly is implemented as a piezoelectric motor drive, SMA (Shape Memory Alloys, shape memory alloy) drive, stepper motor, or other drive form.

The lens driving component and the light path turning driving component can adopt the same driving mode or different driving modes.

[ Shell 10 ]

Referring to fig. 1 to 8 of the drawings, the housing 11 and the bracket 12 of the case 10 are integrally formed as one piece. That is to say the housing 10 is an integrally formed part. The housing 11 is adapted to cover the base 20 to cover at least a portion of the internal structure of the semi-finished product 70, and the housing 11 is provided with a light inlet 104, the bracket 12 has at least four side wall portions for surrounding at least a portion of the periphery of the semi-finished product 70 and is connected to the housing 11, and the thickness of the bracket 12 is not less than the thickness of the housing 11, so that the camera module and the electronic device can be mounted, and the camera module is fixed to the electronic device. In an alternative embodiment of the application, the housing 10 has a shell that primarily serves to control stray light and top surface coverage, the support 12 has a peripheral protection, and the minimum thickness of the support 12 is embodied to be no less than the minimum thickness of the shell. Further, it may be implemented that the material covered by the minimum thickness of the housing is different from the material covered by the corresponding material covered by the bracket 12, and the minimum thickness of the bracket 12 is not smaller than the minimum thickness of the housing. The shell 10 of the application adopts an integrated design, integrates the functions of the shell and the bracket 12 of the camera module in the prior art, reduces the number of parts, simplifies the assembly process, improves the production efficiency, saves part of the size, and is beneficial to the miniaturization of the camera module.

Hereinafter, the unnumbered housing and bracket refer to the prior art housing and bracket, and the numbered housing 11 and bracket 12 refer to the housing 11 and bracket 12 of the present application.

At least one side wall of the support 12 is provided with an avoidance area 1202, and the avoidance area 1202 corresponds to a conducting area of the lead 61 of the circuit assembly 60 and the circuit board 41 of the photosensitive assembly 40. After the housing 10 is installed, at least partial areas of the base 20, the lens assembly 30 and the photosensitive assembly 40 are covered to form a closed space, so that the optical system and the driving system are located in the closed space, and the pins 61 exposed in the avoiding area 1202 and the circuit board 41 of the photosensitive assembly 40 are welded to form a conductive connection, so that the risk of dirt generated by welding entering the interior is reduced, and the yield image of module assembly is reduced.

In one embodiment of the production of the housing 10 according to the application, the outer shell 11 of the housing 10 and the carrier 12 are integrally formed, i.e. the outer shell 11 and the carrier 12 are integrally formed from the same material, wherein the material may be a high-strength plastic material or a metallic material.

In one embodiment of the manufacturing of the housing 10 of the present application, the case 11 and the bracket 12 are made of the same metal material, and the housing 10 is integrally formed using a metal material molding process. Among the molding processes that may be employed include, but are not limited to, integral die casting, metal forging, metal stamping, powder metallurgy, metal injection molding (MIM, metal Injection Molding), drawing, secondary drawing, and the like. Among them, the metal materials that can be used include, but are not limited to, steel-containing materials, aluminum alloys, phosphor bronze, titanium alloys, iron-based materials, zinc alloys, magnesium alloys, tin-based alloys, copper alloys, and the like. The steel-containing material may be, but is not limited to, stainless steel, SPCC (STEEL PLATE Cold-rolled carbon steel sheet), or the like.

In an alternative embodiment of the present application, the housing 11 and the bracket 12 are made of an aluminum alloy material, and the housing 10 is integrally formed by integrally die casting an aluminum alloy. The weight reduction effect is achieved by adopting aluminum alloy integrated die casting, such as aluminum magnesium alloy and the like, and the weight of the shell 10 and the camera module is reduced by utilizing the light weight characteristic of the material. The aluminum alloy material has good comprehensive performance, high strength and good toughness, and the shell 10 produced by the method has good mechanical strength, thereby being beneficial to improving the reliability of the shell 10 and the camera module. And by adopting an integrated design, the same part is allowed to integrate multiple functions, the functionality and integration degree of the parts are improved, the machining and assembling steps are reduced, and the production cost is reduced.

The wall thickness of the traditional shell 11 is about 0.2mm, the shell 11 and the bracket 12 are integrally formed, the wall thickness of the shell 11 can be saved on one side in the transverse direction and the longitudinal direction of the camera module, namely, the size of the camera module is reduced by 0.2mm, and the camera module can provide more design space when the transverse size and the longitudinal size of the camera module are reduced, and devices such as a motor, a lens and the like are further enlarged.

The above data are merely for illustrating the advantages of the integrated design of the housing 10 according to the present application, and the dimensions that can be saved are different according to the design of the camera module, more dimensions can be saved, and possibly less dimensions can be saved, but the dimensions of the wall thickness of the housing in the prior art can be at least reduced on the basis of the integrated design.

In addition, the integrated die casting technology can manufacture parts with complex shapes and fine details, can accurately control the sizes of the parts, reduces the subsequent processing requirements, improves the dimensional accuracy, and can mold a plurality of parts at one time to improve the production efficiency.

In other examples of the present application, the housing 10 of the present application may be manufactured by integral die casting using other materials such as zinc alloy, magnesium alloy, tin-based alloy, and copper alloy.

In one embodiment of the manufacturing of the housing 10 of the present application, the shell 11 and the bracket 12 may be made of different metal materials and the different metal materials are bonded together to integrally form the housing 10. Among them, the metal materials that can be used include, but are not limited to, steel-containing materials, aluminum alloys, phosphor bronze, titanium alloys, iron-based materials, and the like. Further, a suitable metal material can be selected in terms of comprehensive cost, weight saving, mechanical strength, corrosion resistance, and the like.

Taking the case 11 as a stainless steel material and the bracket 12 as an aluminum alloy material as an example, the stainless steel and the aluminum alloy can be integrally formed by a casting process. For example, a proper mould is designed, then two metals are poured into the mould according to a certain proportion and sequence, the metals are fused at high temperature, and the two metals are cooled to form an integrated part. Or the stainless steel and the aluminum alloy are connected together by using a welding technology, and the welding technology such as argon arc welding or laser welding can be adopted to ensure the strength and the quality of welding. Alternatively, the housing 11 made of stainless steel is first formed by punching, and when the aluminum alloy for forming the bracket 12 is cast, the housing 11 may be placed in a mold as a stainless steel insert, and then cast, so that the aluminum alloy and the stainless steel are mechanically or metallurgically bonded to obtain the housing 10.

The foregoing describes embodiments in which the housing 10 is integrally formed from a metallic material. In other embodiments of the present application, the housing 10 may be integrally formed from a non-metallic material.

It should be understood that "integrally formed" as used herein refers to forming a single component, such as the housing 10 as a single component, rather than being limited to a single molding during manufacture, and may be formed in one or more times to provide the integrally formed housing 10 of the present application.

Next, the construction of the housing 10 of the present application will be specifically described.

The housing 10 comprises a cover portion 101 and a side wall portion 102, wherein the cover portion 101 is adapted to cover at least a part of the internal structure of the semi-finished camera module 70, the side wall portion 102 is adapted to surround at least a part of the periphery of the base 20, and is provided with the light inlet 104, and the cover portion 101 is distributed along a plane where a diameter of the light inlet 104 is located or a plane where a diameter of the light inlet 104 is located, i.e. extends along a horizontal direction, and the side wall portion 102 is bent from an outer periphery of the cover portion 101 and extends along a height direction (a first direction Z axis) or a substantially height direction (a first direction Z axis) from a view point of the drawing. Referring to fig. 1-5, it will be appreciated that the side wall portion 102 surrounds the outer periphery of the base 20, and the cover portion 101 is a top surface of the housing 10 on or about the plane of the diameter of the light inlet 104, and covers a top opening formed by the base 20 and the side surface portion.

The cover portion 101 and the sidewall portion 102 together define a housing cover space 1000 of the housing 10, the housing 10 further having a mounting opening 100, the housing cover space 1000 communicating with an external space through the mounting opening 100, the housing 10 being covered by the base 20 through the mounting opening 100, the base 20 being accommodated in the housing cover space 1000. Wherein the mounting opening 100 is defined circumferentially by the bracket 12. Specifically, the bracket 12 defines a lower end of the housing 10 (i.e., an end portion near a main board side of the electronic device), and the case 11 defines an upper end of the housing 10 (i.e., an end portion near a light-passing hole side of the electronic device). The housing 11 extends from the upper end of the housing 10 to the stand 12, and the lower end of the housing 10 is defined by the stand 12.

The cover portion 101 has a thickness H1 along a height direction (a first direction Z axis), the sidewall portion 102 has a thickness H2 along a direction (a third direction X axis) or along a longitudinal direction (a second direction Y axis), and the thickness H1 is smaller than the thickness H2, so that a dimension of the camera module in the height direction (the first direction Z axis) is as small as possible, so as to reduce a height of the camera module, and the camera module can be adapted to a smaller thickness of an electronic device, thereby meeting a requirement of miniaturization of the camera module. In some alternative embodiments, the thickness of the cover portion 101 at any location does not exceed the thickness of the sidewall portion 102 at any location. Since the cover portion 101 mainly serves to cover the internal structure of the camera module, the thickness of the cover portion 101 is only required to ensure that the cover portion 101 can be molded, so that H1 can be as small as possible while ensuring strength, so as to reduce the size of the camera module. The sidewall portion 102 has a certain thickness to secure its mechanical strength. In some alternative embodiments, the thickness H1 is implemented as a minimum thickness of the cover portion 101 and the thickness H2 is implemented as a minimum thickness of the sidewall portion 102.

The side wall portion 102 is sleeved outside the base 20. Further, in some examples of the application, at least a portion of the bottom of the sidewall portion 102 is flush with at least a portion of the bottom of the base 20. Alternatively, the lower end surface of the side wall portion 102 has a flush portion of the lower end surface of the base 20 to bias positioning of the housing 10 for installation on the base 20, improving the assembly accuracy in the height direction (first direction Z axis). In other examples of the application, at least a portion of the bottom of the sidewall portion 102 projects further downward relative to the bottom of the base 20.

Referring to fig. 8, the side wall portion 102 is provided with a mounting structure 103, specifically, the mounting structure 103 is disposed outside the stand 12, and is adapted to mount the camera module to the electronic device and/or is adapted to fix the camera module and other camera modules to form a multi-camera module. Wherein the mounting structure 103 and the avoiding area 1202 are disposed at different positions of the bracket 12 to avoid each other. Further, the mounting structure 103 and the avoiding area 1202 are disposed at different positions of the side wall portion 102 of the bracket 12 in the projection direction, defined as the projection direction in a plan view in the height direction (first direction Z-axis). The above-mentioned design can avoid this mounting structure 103 to influence the equipment process of dodging district 1202, and the dislocation dodges the setting simultaneously and can further optimize the risk that dodges the whole structural strength of casing 10 that district 1202 leads to and decline.

The cover portion 101, the side wall portion 102 and the mounting structure 103 are integrally formed using a metal material molding process to integrate the functions of the housing 11 and the bracket 12.

In one embodiment of the present application, the housing 10 is mounted on the base 20 of one camera module to form a housing 11 of the camera module, and in one embodiment of the present application, the housing 10 is mounted on the bases 20 of a plurality of camera modules, that is, the housing cover 1000 can accommodate a plurality of camera modules to form a housing 11 of a plurality of camera modules. That is, the housing 11 and the bracket 12 of the single camera module may be integrally designed, and the housing 11 and the bracket 12 of the multi-camera module may be integrally designed.

The mounting structure 103 includes a positioning portion formed to protrude outward from an outer surface of the side wall portion 102, and a positioning hole opened in the positioning portion to form a through hole. The positioning hole is aligned with the mounting hole on the electronic device, and then the positioning hole is fixed by a fixing piece (such as a screw), so that the camera module is fixed to the electronic device. Similarly, the alignment of the alignment holes with the alignment holes of the brackets 12 of the other camera modules may be fixed so that the camera modules are connected with the other camera modules.

In other examples, the mounting structure 103 may also be a snap-fit structure, and the electronic device is positioned and snapped 205 secured. In other examples, the camera module and the corresponding position of the electronic device may be fastened and fixed by glue. In other examples, other suitable means of fixation may also be implemented.

Because the casing 10 is made of metal material, if the camera module is fixed to the electronic device by adopting a mode of matching the fixing piece and the positioning hole, scraps are not easy to rub when the metal material is matched with the fixing piece, and foreign matters are avoided.

The housing 10 further has an optical inlet 104, and an incident light beam enters the camera module 1 and/or the semi-finished camera module 70 from the optical inlet 104 and passes through the lens assembly 30. In some examples, the housing 10 also has a light exit 105, and the light beam exits the light exit 105 to the photosensitive assembly 40 to image the photosensitive assembly 40. The lens assembly 30 is mounted between the light inlet 104 and the light outlet 105, and the light outlet 105 is located between the lens assembly 30 and the photosensitive assembly 40. Further, the light path turning component 50 is located between the light transmission paths of the light inlet 104 and the light outlet 105, and before the light beam reaches the photosensitive component 40, the light beam can be turned by the light path turning component 50 to realize light path folding.

The housing 10 has an inner surface 106 and an outer surface 107, the inner surface 106 facing the inner structure of the camera module, the outer surface 107 facing the outside of the camera module, an inner connection structure being formed between the inner surface 106 and the inner structure of the camera module, and an inner and outer connection structure being formed between the outer surface 107 and the outer structure of the camera module. When the housing 10 is fixed to the base 20, the inner surface 106 and the base 20 form the inner connection structure so that the camera module is formed as a whole, and when the housing 10 is fixed to the electronic device, the outer surface 107 and the electronic device form the outer connection structure so that the camera module is mounted to the electronic device. Therefore, the camera module is matched and positioned at the position of the electronic equipment through the inner surface and the outer surface of the shell 10, so that the accuracy of assembly and positioning is improved.

The inner surface 106 is defined by the inner surface of the housing 11 and the inner surface of the bracket 12, and the outer surface 107 is defined by the outer surface of the housing 11 and the outer surface of the bracket 12.

In some examples, the inner surface 106 provides at least one bonding surface for mating with the base 20 for bonding to secure the housing 10 and the base 20. Further, the bonding surface may be formed at a portion of the inner surface 106 located at the sidewall portion 102.

Next, the specific configuration of the housing 11 and the bracket 12 included in the case 10 is further described.

The housing 11 comprises a housing cover wall 111, which housing cover wall 111 forms the aforementioned cover part 101, adapted to cover the receiving space 200 of the base 20. The light inlet 104 is formed in the housing cover wall 111 and faces the direction of light incidence.

In one embodiment of the present application, the housing 11 further includes a housing sidewall 112, the housing sidewall 112 being disposed around the housing cover wall 111. Specifically, the housing cover wall 111 extends along a plane where the diameter of the light entrance 104 is located, or substantially along a plane where the diameter of the light entrance 104 is located, and the housing sidewall 112 extends in the height direction (the first direction Z axis) after being bent from the outer periphery of the housing cover wall 111.

The holder 12 and the housing 11 are stacked in the height direction (first direction Z axis). Specifically, at least a portion of the housing sidewall 112 extends toward the bracket 12 and is coupled to the bracket 12.

Further, the bracket 12 and the housing sidewall 112 are stacked in the height direction so as not to overlap with the housing sidewall 112, thereby avoiding an increase in the thickness of the housing sidewall 112 at the bracket 12, i.e., without an increase in the thickness of the housing sidewall 112 over the length of the bracket 12 in the height direction.

In order to ensure that the bracket 12 and the housing side wall 112 of the housing 11 are disposed in a stacked manner in the height direction (first direction Z-axis) and do not overlap, a junction of the bracket 12 and the housing 11 is formed between the top of the bracket 12 and the bottom of the housing side wall 112 of the housing 11, with the top of the bracket 12 facing the housing cover wall 111 side. A bending part 113 is formed between the shell cover wall 111 and the shell side wall 112, and the thicknesses of the shell cover wall 111 and the shell side wall 112 are close to or the same as each other, so that the bending part 113 is in smooth transition, and the molding difficulty is reduced. Further, the thickness of the housing sidewall 112 is less than the thickness of the bracket 12, reducing the wall thickness of a portion of the sidewall portion 102 of the housing 10, which is beneficial for reducing the weight of the housing 10.

In another embodiment of the present application, the top of the bracket 12 is formed at the outer periphery of the housing cover wall 111 of the housing 11, that is, the housing 11 does not have the housing side wall 112. Compared to the prior art, the thickness of the stacked arrangement of the housing side walls 112 of the housing 11 is omitted at the support 12.

Therefore, when the housing 11 and the bracket 12 are integrally formed into the case 10, the overlapping portion of the bracket 12 and the housing 11 may omit the thickness of the housing 11, or the bracket 12 and the housing 11 may be stacked in the height direction (first direction Z axis), saving the thickness of the housing 11 in the lateral and longitudinal dimensions. Further, since the housing 11 and the bracket 12 are integrally formed, the use of the case 10 omits the process of assembling the bracket 12 to the housing and also omits the painting between the bracket 12 and the housing, compared to the separate bracket 12 and housing in the prior art.

That is, the integrated housing 10 is beneficial to reducing the size, especially the lateral and/or longitudinal dimensions, of the camera module in terms of size, the integrated housing 10 simplifies assembly process and improves production efficiency in terms of assembly, and the integrated housing 10 omits painting glue in terms of reliability, thereby avoiding reliability risks caused by the glue, such as but not limited to bracket falling, glue cracking, bracket deformation, housing deformation, etc.

Specifically, regarding the reliability risk of glue, the glue crack of the glue may cause the glue to break or fail, which may cause the structure originally connected by the glue to lose stability, reduce the strength, rigidity, durability, etc. of the connection structure. If the camera module is assembled on the electronic device, after the bracket and the electronic device are fixed, the connection structure between the bracket and the housing 11 fails, so that the camera module may be loosened, displaced, etc., resulting in performance degradation or even failure of the camera module. By using the integrated shell 10 of the application, the functions of the shell 11 and the bracket 12 of the camera module are realized, the painting glue between the bracket and the shell 11 is omitted, the risk points of the camera module can be reduced, and the reliability of the camera module is improved.

Further, glue drawing between the bracket and the shell 11 is omitted, glue selection and verification, glue position selection and verification, glue amount (such as total glue amount, glue width, glue length, glue thickness and the like) verification, tool fixture manufacturing and verification of glue drawing procedures, glue coating and curing time and the like can be omitted, and the problem that glue infiltration influences appearance is also eliminated. Therefore, the painting glue between the bracket and the shell 11 is omitted, the working procedures and engineering such as production, assembly and the like can be saved, the production efficiency and the production yield of the camera module are improved, and the appearance yield of the camera module can be improved.

In addition, in the camera module of the prior art, the shell 11 and the bracket are pulled due to the influence of shrinkage rate after the glue is cured, and the shell 11 is relatively thin, which can lead to the shell 11 being pulled and deformed, and the shell 11 is arranged on the outer side of the base 20, and the shell 11 being pulled and deformed may lead to the deformation of the base 20 due to stress, thereby affecting the shape of the accommodating space of the base 20, the position and/or shape of the component in the accommodating space, and the like, and affecting the performance and reliability of the camera module. Therefore, after the glue is drawn between the bracket and the shell 11, the problem of deformation caused by solidification and shrinkage of the glue is avoided, assembly tolerance is reduced, and the yield of finished products is improved.

In the aspect of assembly, firstly, the assembly process is simplified, the twice assembly of the shell and the bracket in the prior art is optimized to be one-time assembly of the shell 10, the glue setting and the glue curing process are omitted, and the assembly tolerance is reduced. In addition, the integration of the housing 11 and the bracket 12 can optimize the eccentricity problem of the camera module caused by the assembly of the bracket in the prior art.

Specifically, in the camera module of the prior art, an assembly gap is formed between the bracket and the housing 11, which can cause the housing 11 to deviate from the base 20 with the camera module and the internal structure thereof in the bracket, so that the light passing hole formed in the housing 11 deviates from the bracket. Therefore, when the bracket is assembled to the housing 11, the light passing hole of the camera module may have been shifted, and after the camera module is assembled to the electronic device, the shifting situation may be more serious, which results in shifting the light passing hole of the electronic device and the light passing hole of the camera module, so as to generate the eccentric problem of the camera module. And the relative position between the bracket and the shell 11 can be influenced by the glue between the bracket and the shell 11, so that the offset problem between the light-passing hole and the bracket is aggravated, and the offset problem between the light-passing hole of the final electronic equipment and the light-passing hole of the camera module is more serious.

The shell 10 of the application adopts the integrated design of the shell 11 and the bracket 12, the light inlet 104 of the shell 11 is fixed at the position of the shell 10, and the relative position between the light inlet 104 and the bracket 12 is kept unchanged, so that the offset problem of the shell 11 and the bracket in the camera module in the prior art is avoided. That is, the relative position between the light inlet 104 of the housing 10 and the mounting structure 103 remains unchanged. Therefore, when the camera module is mounted to the electronic device, the alignment of the light inlet 104 of the camera module and the light passing hole of the electronic device can be realized through the accurate alignment of the mounting structure 103 and the electronic device, so that the eccentric problem of the camera module caused by the offset of the light inlet 104 is avoided, and the assembly yield of the camera module is improved. Further, the assembly eccentricity problem of the camera module can be controlled by controlling the manufacturing tolerance of the distance between the light inlet 104 and the mounting structure 103, and the assembly eccentricity problem of the camera module can be controlled by controlling the manufacturing tolerance of the distance between the light inlet 104 and the bracket 12.

It can be appreciated that, according to the design requirement of the camera module, certain surface treatment can be performed on the housing 10 and the shell 11, including but not limited to electroplating, laser engraving, black coating, spraying, screen printing, film plating, etc., so as to meet the requirements of optical performance, magnetic shielding, stray light improvement, structural reinforcement, service life prolongation, etc. For example, a surface treatment such as laser etching, blackening, etc. may be performed on a specific area of the surface of the housing cover wall 111 for flare improvement.

The support 12 is sleeved on the outer side of the base 20, and surrounds the base 20 for a circle to form a protection structure outside the camera module, so as to provide physical protection for the camera module and prevent damage caused by falling, impact or other external forces. The bracket 12 is used for fixing the specific position of the camera module in the electronic device, so as to ensure the accuracy of the relative position of the camera module and other components, thereby ensuring the accuracy and stability of image capturing. The camera module may generate heat during operation, and the bracket 12 may assist in heat dissipation, so as to help the camera module to work at a proper temperature, thereby prolonging the service life. The support 12 can enhance the structural stability of the camera module. In some possible embodiments, the support 12 may provide a degree of electromagnetic shielding to prevent electromagnetic interference from affecting the imaging quality.

In some examples, the bracket 12 is formed around the periphery of the semi-finished camera module 70, and includes a first side wall 121, a second side wall 122, a third side wall 123, and a fourth side wall 124 on different sides, where the first side wall 121, the second side wall 122, the third side wall 123, and the fourth side wall 124 surround the semi-finished camera module 70 and are combined to form the bracket 12. From the view point of the drawing, the first side wall portion 121 and the third side wall portion 123 extend in a longitudinal direction (the second direction Y axis), are opposite to each other in a lateral direction (the third direction X axis), the second side wall portion 122 and the fourth side wall portion 124 extend in a lateral direction (the third direction X axis), are opposite to each other in a longitudinal direction (the second direction Y axis) of the light beam propagation direction, and the fourth side wall portion 124 is located on the light emitting side of the image pickup module. The first side wall 121, the second side wall 122, the third side wall 123 and the fourth side wall 124 have heights extending in the height direction (the first direction Z axis), and form the bracket 12.

The specific shape of the bracket 12 may be determined according to the design requirement of the camera module and the adaptation requirement of the electronic device.

In other examples of the application, the bracket 12 is formed non-circumferentially. The bracket 12 has at least one opening provided on three sides of the housing 11. Further, in some examples, the position of the opening and the position of the photosensitive assembly 40 are adapted. In some examples, the location of the opening and the location of the photosensitive assembly 40 are different.

The shape of the bracket 12 may be a frame, an L-shape, a U-shape, a "mouth" shape, etc.

In one embodiment of the manufacturing of the housing 10 of the present application, the outer shell 11 and the bracket 12 of the housing 10 are integrally formed using a metal material and a plastic material. Specifically, the housing 11 is made of a metal material, and injection molding is performed around a portion of the housing 11 to form the bracket 12, that is, the bracket 12 is molded with at least a portion of the housing sidewall 112 of the housing 11, resulting in the housing 10 being integrally formed as a single part.

More specifically, at least a portion of the housing side wall 112 of the housing 11 used for injection molding is a bonding area of the housing side wall 112 of the housing 11, the bonding area of the housing side wall 112 is injection molded to form the stand 12, and the bonding area of the housing side wall 112 of the housing 11 on different sides is injection molded to form different side wall portions of the stand 12 on different sides. The bracket 12 forms the side wall portion 102 of the housing 10 together with the remaining area of the housing side wall 112, and the housing cover wall 111 of the housing 11 forms the cover portion 101 of the housing 10.

The housing sidewall 112 of the housing 11 is provided with a coupling hole 1120, and the number of the coupling holes 1120 may be plural, penetrating the housing sidewall 112. The molding material used for molding the bracket 12 is bonded to the inner wall of the bonding hole 1120, so that the bonding strength between the two parts, that is, the connection strength between the housing 11 and the bracket 12 can be enhanced.

In one embodiment of the housing 11 of the present application, the housing side wall 112 includes a first housing side wall 1121, a second housing side wall 1122, and a third housing side wall 1123, the first housing side wall 1121, the second housing side wall 1122, and the third housing side wall 1123 being sequentially connected, formed around three sides of the housing cover wall 111. At least one or all of the first, second and third housing side walls 1121, 1122 and 1123 are provided with the coupling holes 1120, and further, a plurality of the coupling holes 1120 are provided.

In another embodiment of the housing 11 of the present application, the housing side wall 112 includes a first housing side wall 1121, a second housing side wall 1122, a third housing side wall 1123, and a fourth housing side wall, the first housing side wall 1121, the second housing side wall 1122, the third housing side wall 1123, and the fourth housing side wall being molded around the peripheral side of the housing cover wall 111. The bracket 12 is formed around the first housing side wall 1121, the second housing side wall 1122, the third housing side wall 1123, and the fourth housing side wall. At least one or all of the first, second, third and fourth housing side walls 1121, 1122, 1123 are provided with the coupling hole 1120.

As shown in fig. 9 to 10, the housing side wall 112 includes a coupling portion to which the coupling hole 1120 is provided, and after the housing 11 is molded, the bracket 12 is molded around the coupling portion such that molding material is introduced into the coupling hole 1120, the molding material is coupled with an inner wall of the coupling hole 1120, and the bracket 12 is molded together with the coupling hole 1120 at a surface of the coupling portion.

In some examples, the bracket 12 is formed on both the inner and outer sides of the housing sidewall 112. That is, a portion of the bracket 12 is formed on both the inside and outside surfaces of the housing sidewall 112. At least a portion of the housing sidewall 112 is enclosed within the bracket 12. Molding material passes through the coupling hole 1120, and the bracket 12 is molded at the inner side surface, the outer side surface of the coupling portion and the coupling hole 1120. In some examples, the bracket 12 is formed outside of the housing sidewall 112. That is, the molding material molds the bracket 12 at the bonding hole 1120 and the outer side surface of the bonding portion.

The inner side of the housing sidewall 112 faces the inner side of the housing 10, i.e. faces the inner structure of the camera module, and the outer side of the housing sidewall 112 faces the outer side of the housing 10, i.e. faces the outer space of the camera module.

From the view point of the drawing of the specification, the first housing side wall 1121 and the third housing side wall 1123 are extended in the longitudinal direction (second direction Y axis) of the light beam traveling direction, and are opposed in the lateral direction (third direction X axis). The second housing side walls 1122 are extended in the lateral direction (third direction X axis). In the example where the fourth housing side wall is provided, the second housing side wall 1122 and the fourth housing side wall are opposed in the longitudinal direction (second direction Y axis) of the light beam propagation direction.

In the case where the housing 11 has the fourth housing side wall, the bracket 12 forms the first side wall portion 121, the second side wall portion 122, the third side wall portion 123, and the fourth side wall portion 124 at the first housing side wall 1121, the second housing side wall 1122, the third housing side wall 1123, and the fourth housing side wall, respectively, such that the first housing side wall 1121, the second housing side wall 1122, the third housing side wall 1123, and the fourth housing side wall are respectively fitted into the first side wall portion 121, the second side wall portion 122, the third side wall portion 123, and the fourth side wall portion 124, forming a fitting relationship.

In an example where the fourth housing side wall does not exist in the housing 11, the bracket 12 forms the first side wall portion 121, the second side wall portion 122, and the third side wall portion 123 at the first housing side wall 1121, the second housing side wall 1122, and the third housing side wall 1123, respectively, such that the first housing side wall 1121, the second housing side wall 1122, and the third housing side wall 1123 are respectively embedded in the first side wall portion 121, the second side wall portion 122, and the third side wall portion 123, forming an embedded relationship.

The positional relationship between the housing side wall 112 of the housing 11 and the bracket 12 is specifically described. The housing 11 has a first side surface 1101, and in embodiments in which the housing 11 has the housing sidewall 112, the first side surface 1101 is formed on an inner side surface of the housing sidewall 112, facing the base 20. The bracket 12 has a second side surface 1201, and the second side surface 1201 is formed on an inner side surface of the bracket 12, facing the base 20.

In some examples, the first side surface 1101 and the second side surface 1201 are flush and aligned in a height direction (first direction Z-axis) such that the housing 10 provides a flat inner side surface 1001, the inner side surface 1001 being adapted to mate with the base 20, the base 20 providing a stepped outer peripheral side surface 201, the inner side surface 1001 and the outer peripheral side surface 201 being adapted. Further, the first side surface 1101 and the second side surface 1201 are flush to facilitate molding and demolding of the housing 10. In an integrated die-cast embodiment, the first side surface 1101 and the second side surface 1201 are flush to facilitate demolding, and facilitate simplifying mold design, improving production yield, and reducing cost.

In some examples, the first side surface 1101 and the second side surface 1201 are not flush, forming a step difference, the first side surface 1101 being further to the outside, i.e., further from the base 20, than the second side surface 1201. The gap between the first side surface 1101 and the base 20 is smaller than the gap between the second side surface 1201 and the base 20.

In some examples, the bonding surface on the inner surface 106 of the housing 10 is provided on the first side surface 1101 of the housing sidewall 112 of the housing 11 and on the second side surface 1201 of the bracket 12 for adhesively securing the housing 10 to the base 20. Further, an adhesive surface is provided only on the second side surface 1201 of the bracket 12 to ensure a relative positional fixation between the housing 10 and the internal structure of the camera module.

In one embodiment of the present application, the housing 11 is formed on one side of the first, second and third side wall portions 121, 122, 123 in the height direction (first direction Z axis). The fourth sidewall 124 and the housing 11 have a space 108 therebetween, and the space 108 is formed between the light outlet 105 and the fourth sidewall 124, is surrounded by a portion of the first sidewall 121, a portion of the fourth sidewall 124 and a portion of the third sidewall 123, and is formed at a side of the housing 11. After the camera module is assembled, the photosensitive element 40 is accommodated in the space 108. Wherein the light outlet 105 is circumferentially defined by the inner surface of the first side wall portion 121, the end of the housing cover wall 111 of the housing 11 and the inner surface of the third side wall portion 123, and communicates with the spacing space 108.

Specifically, taking the camera module as a periscope camera module as an example, the light-passing port 202 is located at the outgoing side of the lens assembly 30, and the photosensitive assembly 40 is mounted at one side of the light-passing port 202, so that the light beam can reach the photosensitive assembly 40 for imaging after passing through the lens assembly 30. The photosensitive member 40 and the base 20 are fixed to be held at one side of the light-passing port 202. After the housing 10 is mounted outside the base 20, the bracket 12 is sleeved outside the photosensitive assembly 40.

Further, the end of the base 20 defines an installation space 203 for installing the photosensitive assembly 40, and the light-transmitting opening 202 is located between the accommodating space 200 and the installation space 203. In the present embodiment of the housing 10, the photosensitive member 40 is mounted in the mounting space 203, and after the base 20 is fixed, the housing 10 is mounted outside the base 20, and the housing 10 surrounds the base 20 and the photosensitive member 40. The housing 11 of the housing 10 covers the accommodating space 200, and the photosensitive assembly 40 located in the mounting space 203 can be exposed through the spacing space 108 to avoid interference between the mounting of the housing 10 and the photosensitive assembly 40.

Specifically, the base 20 has a mounting seat 204 at the rear end in the light path direction, the light-transmitting opening 202 is formed on the mounting seat 204, the mounting space 203 is formed between the light-emitting side of the mounting seat 204 and the fourth side wall 124, and is defined by a portion of the first side wall 121, a portion of the fourth side wall 124, a portion of the third side wall 123 and the mounting seat 204, and the photosensitive assembly 40 is mounted in the mounting space 203, such that the light beam emitted from the lens assembly 30 passes through the light-transmitting opening 202 on the mounting seat 204 and reaches the photosensitive assembly 40 to form an image.

In some examples, the two sides of the mounting seat 204 extend to the inner surface of the first side wall 121 and the inner surface of the third side wall 123 respectively, and extend to the side of the housing 11 along the height direction (the first direction Z axis), that is, to the side of the housing 11 on the spacing space 108, and from the perspective of the drawing of the specification, the mounting seat 204 is perpendicular to the bottom surface of the base 20 and the light beam propagation direction, so as to separate the accommodating space 200 and the mounting space 203, so that the assembly process in the two spaces can be performed synchronously, and the assembly steps of the camera module are further simplified.

Specifically, the top of the mounting seat 204 is connected to the side of the housing 11 on the space 108 toward the side of the housing 200, i.e. there is no gap between the mounting seat 204 and the side of the housing 11, and the light inlet 104 on the cover portion 101 of the housing 10 is provided with a sealed protective film, so that the housing 200 between the housing 10 and the base 20 is a closed space to isolate the communication between the internal structure of the camera module disposed in the housing 200 and the outside, thereby reducing the risk of dirt caused by impurities and dust entering the housing 200 during the subsequent processing of assembly and welding, and avoiding the risk of affecting the imaging of the camera module.

Further, the mounting base 204 is provided with mounting legs 2041 on the side wall facing the mounting space 203, and from the perspective of fig. 5, the mounting legs 2041 on the mounting base 204 are symmetrically disposed along the transverse direction (the third direction X-axis), and a mounting groove for mounting the photosensitive assembly 40 is formed between the mounting legs 2041 and the side wall facing the mounting base 204 of the mounting space 203, so as to further simplify the positioning alignment and assembly process of the photosensitive assembly 40.

Further, the mounting leg 2041 extends towards the outer side of the base 20 to form an outer corner, and the outer corner protrudes from the outer side surface of the base 20 and abuts against a portion of the first side wall 121 or a portion of the third side wall 123 forming the space 108, so that the housing 10 can be quickly positioned and assembled on the base 20, and the problem of eccentricity of the camera module caused by assembly displacement between the housing 10 and the base 20 is avoided.

The photosensitive assembly 40 includes a photosensitive chip, a circuit board 41 and a connecting belt 42, wherein the photosensitive chip is electrically connected with the circuit board 41, one side of the circuit board 41 is connected with the connecting belt 42, the connecting belt 42 extends from the circuit board 41 and is electrically connected with the electronic device through a connector 43 at the tail end, so that the circuit board 41 is electrically connected with the electronic device, and the image capturing module is electrically connected with the electronic device. Depending on the different fitting requirements of the electronic device, the connecting strip 42 may be configured with different bending modes, so that the connector 43 at the tail end is located at the position most suitable for welding, and the electronic device is fixed. For example, but not limited to, the connection strap 42 is bent at 90 ° with respect to the circuit board 41 such that the connector 43 at the end thereof is located at the side of the camera module, i.e., at the side of the camera module in the lateral direction (the third direction X-axis) or at the side of the camera module in the height direction (the first direction Z-axis), and the connection strap 42 is bent at 180 ° with respect to the circuit board 41 such that the connector 43 at the end thereof is located at the side of the camera module 1 in the longitudinal direction (the second direction Y-axis) of the light beam propagation direction, i.e., at the side of the length direction.

Depending on the orientation of the connector 43 at the trailing end of the strap 42 relative to the bracket 12, different mounting arrangements of the housing 10 need to be considered to avoid interference with the trailing end connector 43 on the strap 42. When the rear connector 43 on the connection belt 42 is located below the holder 12, the connection belt 42 is led out from below the holder 12 such that the connector 43 at the rear thereof is closer to the electronic device than the holder 12, the housing 10 is mounted to the outside of the base 20 and the photosensitive member 40 from above without interfering with the connector 43. When the trailing connector 43 on the connecting belt 42 is located above the bracket 12, the connecting belt 42 is led out from above the bracket 12, and the housing 10 is mounted to the outside of the base 20 and the photosensitive member 40 from above downward, consideration is given to avoiding interference between the housing 10 and the connector 43.

It will be appreciated that both the upper and lower sides of the photosensitive member 40 in the height direction (the first direction Z axis) can be exposed through the spacing space 108, so that the connecting belt 42 can be led out at both the upper and lower sides. In the embodiment in which the trailing connector 43 on the connection strip 42 is located on one side of the camera module in the longitudinal direction (second direction Y axis) other than the beam propagation direction, the connection strip 42 can be led out from below to avoid interference with the assembly of the housing 10.

In one embodiment of the present application, the housing 11 is formed on top of the first side wall 121, the second side wall 122, the third side wall 123 and the fourth side wall 124, and the aforementioned space 108 is not present between the housing 11 and the fourth side wall 124. The housing 11 integrally covers the receiving space 200 of the base 20 and the installation space 203, and the connection belt 42 of the photosensitive assembly 40 can be led out from a direction opposite to the housing 11, i.e., from below, so that the connector 43 at the tail end thereof is located below, and the assembly of the housing 10 is not interfered.

The attachment position of the connecting band 42 after the tail connector 43 is positioned after the housing 10 of the present application is specifically described. In some examples, the connecting strap 42 is attached between the fourth sidewall portion 124 of the bracket 12 and the photosensitive assembly 40, or the connecting strap 42 is secured to the rear surface of the photosensitive assembly 40. The connector 43 is led out from the inside of the fourth side wall portion 124 in the upper or lower direction of the height direction (first direction Z axis). In some examples, the connection strap 42 is attached between the first side wall portion 121 or the third side wall portion 123 of the bracket 12 and the base 20, and the connector 43 at the tail end thereof may be led out from the inside of the first side wall portion 121 or the third side wall portion 123 in the height direction (first direction Z axis). In other examples, the connecting strap 42 may be attached to the bottom of the camera module such that the connector 43 at its trailing end is located at the bottom of the camera module.

In one embodiment of the present application, the connection strap 42 extends from the circuit board 41, is bent by 180 ° at a side near the bracket 12, extends from one side of the circuit board 41 to the other side from the bending position, and the bent extension surface is attached to the inner surface of the fourth side wall 124, and is bent outwards by 90 ° above through the space 108 to form a secondary bending of the connection strap 42, and extends to the connector 43 at the tail end, where the connector 43 at the tail end is located outside the fourth side wall 124.

The internal structure of the camera module is provided with some electronic elements which need to be conducted with a circuit, for example, one unit of the lens driving component and the light path turning driving component is provided with the electronic elements. The camera module further includes a circuit assembly 60 connecting the electronic component and the photosensitive assembly 40. Specifically, the circuit component 60 is disposed on the base 20, and has a lead 61 at a tail portion, the lead 61 is exposed to an outer surface of the base 20, and the circuit component 60 is soldered to the circuit board 41 in the photosensitive component 40 through the lead 61.

The split type housing 11 and the bracket 12 in the prior art are provided with four housing side walls, a certain assembly gap is formed between the inner side of the housing side wall of the housing 11 and the base 20, a certain assembly gap is formed between the outer side of the housing side wall of the housing and the bracket 12, wherein the assembly gaps of the inner side and the outer side of the housing side walls parallel to the light path are suitable for dispensing, and the assembly gaps of the inner side and the outer side of the housing side walls at the tail end of the light path correspond to the photosensitive assembly 40 arranged at the tail end of the light path and are suitable for accommodating and conducting the connecting soft board between the inner side of the camera module and the electronic equipment. Before the housing 11 and the bracket 12 are assembled on the base 20, the electronic component and the photosensitive element 40 on the base 20 are soldered, and the solder joint is connected with the flexible connection board. The connection flexible board sequentially passes through the assembly gap between the base 20 and the housing 11 and the assembly gap between the housing 11 and the bracket 12 in the assembly stage, and extends outwards to connect with an electronic device so as to conduct the camera module and the electronic device.

The application adopts the shell 11 and the support 12 which are integrally formed, the thickness of the support 12 is reserved from the thickness direction of the four side wall parts of the support 12 of the shell 10, the thickness of the shell 11 and the assembly clearance between the shell 11 and the support 12 are omitted, the glue amount required for assembling the painting glue is omitted, the assembly step is simplified, and the offset problem of the shell 11 and the support 12 and the eccentric problem of the camera module in the prior art are avoided.

In order to further simplify the assembly process of the camera module, the bracket 12 is provided with a groove-shaped avoiding area 1202 adapted to avoid the connection area between the pin 61 and the circuit board 41. The relief area 1202 is formed on the support 12 near the photosensitive assembly 40 to match the soldering of the lead 61 and the circuit board 41. It will be appreciated that the relief area 1202 is disposed on the support 12 in a projection area corresponding to the mounting space 203. Among the four side wall parts forming the bracket 12, the first side wall part 121 and the third side wall part 123 are fixed positions of the camera module, the second side wall part 122 is suitable for positioning a prism, the fourth side wall part 124 corresponds to the assembly of the photosensitive assembly 40, and the avoiding area 1202 is preferably disposed on the first side wall part 121 and/or the third side wall part 123 in combination with the functions of the side wall parts, as shown in fig. 6 and 7, the avoiding area 1202 is disposed at one end of the first side wall part 121 close to the fourth side wall part 124 and/or one end of the third side wall part 123 close to the fourth side wall part 124, so as to reduce the glue drawing area on the two side wall parts of the bracket 12, reduce the mass and glue drawing amount of the bracket 12, thereby reducing the module internal structural deformation caused by overlarge glue drawing area, especially bending the positions and paths of the lens and the focusing motor, and further avoiding the eccentric problem of the camera module.

Specifically, the avoidance area 1202 is disposed near one end of the first side wall portion 121 and/or one end of the third side wall portion 123 of the fourth side wall portion 124, or the avoidance area 1202 is disposed on the fourth side wall portion 124, that is, on the rear side of the first side wall portion 121 along the optical path direction, the rear side of the third side wall portion 123 along the optical path direction, or the fourth side wall portion 124, so as to adapt to the laying of the circuit assembly 60 and the assembling orientation of the photosensitive assembly 40 on the camera module, which are disposed on the base 20, and expose the connection area of the lead 61 and the circuit board 41, so as to avoid both.

More specifically, the relief area 1202 extends from the bottom edge of the support 12 to form a recess that does not contact the opposite bottom edge of the support 12, i.e., extends toward the junction between the housing 11 and the support 12 corresponding to a portion of the mounting space 203, and forms a recess that opens to the bottom edge of the support 12 and penetrates the support 12 from the thickness direction, i.e., forms the relief area 1202, and the relief area 1202 does not contact the housing 11 and the junction between the housing 11 and the support 12.

In some embodiments, the relief area 1202 is formed by extending opposite sides of the bottom edge of the support 12, i.e., from a portion of the top of the support 12, toward the bottom edge of the support 12.

Wherein the thickness of the cover portion 101 of the housing 10 in the height direction (first direction Z axis) and the thickness of the upper portion of the side wall portion 102 in the transverse direction (third direction X axis) or in the longitudinal direction of the light beam propagation direction (second direction Y axis) are both the thickness H1 of the housing 11, the thickness of the middle lower portion of the side wall portion 102 in the transverse direction (third direction X axis) or in the longitudinal direction of the light beam propagation direction (second direction Y axis) is the thickness H2 of the bracket 12, the thickness H1 is smaller than the thickness H2, and the mechanical strength of the housing 10 is maintained while the height of the camera module is reduced. Therefore, in order to avoid the mechanical strength of the housing 10 from being affected by the slotting on the bracket 12, the extending tail end of the avoiding area 1202 does not contact the housing 11 and the junction with the bracket 12, so as to avoid the area with the thickness H1 as much as possible, and avoid the deformation of the housing 11 caused by the forming of the avoiding area 1202 or the welding operation performed in the avoiding area 1202.

Further, the plane of the light inlet 104 of the housing 11 is perpendicular to the extending direction of the avoiding area 1202 toward the bottom edge of the bracket 12, as shown in fig. 2, the plane of the light inlet 104 is the plane of the housing cover wall 111 of the housing 11, so that the extending direction of the avoiding area 1202 toward the bottom edge of the bracket 12 is perpendicular to the plane of the housing cover wall 111.

Further, the diameter direction of the light inlet 104 of the housing 11 is perpendicular to the extending direction of the avoiding area 1202 toward the bottom edge of the bracket 12.

In some examples, the bending structure of the connection strap 42 is located in the slot of the avoidance area 1202, where the pin 61 and the circuit board 41 are disposed between a portion of the first side wall portion 121/the third side wall portion 123 and the bending structure of the connection strap 42, and the avoidance area 1202 is disposed at a tail portion of the first side wall portion 121/the third side wall portion 123 near the fourth side wall portion 124, so as to avoid the bending structures of the pin 61, the circuit board 41 and the connection strap 42 at the same time, so as to increase the welding operation space of the pin 61 and the circuit board 41.

Further describing the manufacturing process of the avoidance area 1202, the processing of the avoidance area 1202 may be achieved by adding an inlay corresponding to the avoidance area 1202 during the integral die casting process, in one embodiment of the manufacturing of the housing 10 of the present application, the housing 11 and the bracket 12 are made of the same material, for example, an aluminum alloy, and in a die for integral die casting of the aluminum alloy, an integral die with a bump inlay disposed at a corresponding position for forming the bracket 12 is customized in advance, so that the avoidance area 1202 and other structures of the housing 10 are synchronously molded.

In another embodiment of the manufacturing of the housing 10 of the present application, the shell 11 and the bracket 12 are made of different materials, and the two materials are integrally formed by a casting process. For example, a suitable mold is designed, two metals are poured into a manufacturing mode that the two metals are integrally molded or are respectively molded and then connected, and a convex insert is arranged at a corresponding position inside the molding mold of the bracket 12 in advance, so that the avoiding area 1202 on the bracket 12 is formed. In the manufacturing method of the shell 11 by punching and then taking the shell 11 as the inlay of the molding die of the shell 10, the convex inlay is arranged at the corresponding position inside the molding die of the shell 10 in advance, or the detachable convex inlay is put into the molding die of the shell 10 together with the shell 11, and then casting is performed, so as to obtain the shell 10 and the avoiding area 1202 on the bracket 12 thereof.

Referring to fig. 6-7, the relief area 1202 is disposed on the trailing side of the first sidewall portion 121 and/or the third sidewall portion 123 near the fourth sidewall portion 124, and the relief area 1202 is formed by a portion of the first sidewall portion 121/the third sidewall portion 123 along (the first direction Z-axis), a portion of the fourth sidewall portion 124 along (the first direction Z-axis), and a relief area connecting portion 1203 connecting the two. The height of the avoidance area connection portion 1203 may be determined according to the design requirement of the camera module, and the positions of the upper portion, the middle portion, the lower portion, and the like may be matched with the positions of the pins 61.

Specifically, the avoidance area connection portion 1203 extends in or substantially in the lateral direction (third direction X axis) of the image pickup module 1 and/or the longitudinal direction (second direction Y axis) of the light beam propagation direction, so that the bracket 12 maintains the integrity around the base 20 for one revolution, reducing the influence on the mechanical strength of the housing 10.

The avoidance area connection portion 1203 is linear, L-shaped, or other shapes capable of realizing corner connection. From the perspective of fig. 6 and 7, the avoidance area connection portion 1203 extends from the first side wall portion 121/the third side wall portion 123 along the longitudinal direction (the second direction Y axis) of the beam propagation direction, and bends to connect the fourth side wall portion 124 when the fourth side wall portion 124 is in the plane.

Further, the inner surface of the avoidance area connection portion 1203 or the inner surface of the avoidance area connection portion and the inner surface of the fourth side wall portion 124 form a receiving groove close to the fourth side wall portion 124, which is suitable for receiving a portion of the bending structure of the connection strap 42, and from the perspective of fig. 6, since the connection strap 42 is disposed closely to the fourth side wall portion 124 and the outermost side of the bending structure protrudes from the outer surface of the second side wall portion 122, the avoidance area connection portion 1203 bends at two sections outwards at a position corresponding to the bending structure of the connection strap 42, forming a U-shaped like groove with an opening facing the bending structure of the connection strap 42, so as to receive the top of the bending structure of the connection strap 42.

From the perspective of fig. 6-7, the housing 11 has the space 108, and the connecting strap 42 extends outward from the space 108 to connect the camera module and the electronic device. The avoidance area connection portion 1203 is located between the spacing space 108 and the avoidance area 1202, so as to separate the spacing space 108 and the avoidance area 1202, thereby avoiding the influence of the mechanical strength of the bracket 12 caused by too large space occupation ratio of the bracket 12 after communication, and preventing the deformation of the bracket 12 caused by the influence of external force in the assembly process.

In another embodiment of the present application, the housing 11 does not have the space 108, and the connection strap 42 extends from the gap between the stand 12 and the base 20 to connect the camera module and the electronic device.

In some examples, the gap between the base 20 and the fourth side wall 124 may be implemented to communicate with the relief area 1202 on the fourth side wall 124, and during the molding process, the gap and the relief area 1202 after communication may be die-cast by adding a single inlay into the molding die of the bracket 12 to simplify the hollowed-out structure on the fourth side wall 124 and the manufacturing and molding operation thereof, and to achieve the relief of the leads 61, the connection area of the circuit board 41, and the connection strap 42.

When the avoiding area 1202 is not disposed on the stand 12, the mounting structure 103 is generally disposed on four portions of the stand 12, namely, the first side wall 121, the second side wall 122, the third side wall 123 and the fourth side wall 124, respectively, and at least one mounting structure 103 is disposed on each of the first side wall 121, the second side wall 122, the third side wall 123 and the fourth side wall 124, so as to ensure a stable connection between the camera module and the electronic device. After the bracket 12 is provided with the avoidance area 1202, the setting position of the mounting structure 103 on the bracket 12 is far away from the avoidance area 1202, so that the two are prevented from being interfered with each other too close to each other, when the two are too close to each other, the stress of the mounting structure 103 during fixed mounting is likely to deform the avoidance area 1202, thereby affecting the avoidance effect, causing interference to the subsequent welding operation, and meanwhile, the hollow structure of the avoidance area 1202 can affect the mechanical strength of the mounting structure 103 and the part of the bracket 12 of the bordering part too close to each other, and even the situation that the mounting structure 103 is broken is likely to occur during the fixed mounting stage.

Specifically, when the escape area 1202 is located on the first side wall portion 121/the third side wall portion 123, the mounting structure 103 on the same side as the escape area 1202 is disposed on the first side wall portion 121/the third side wall portion 123.

More specifically, the avoidance area 1202 on the same side and the mounting structure 103 are not located in the same height direction (the first direction Z axis), so that the mounting structure 103 avoids the avoidance area 1202, and the structural strength of the avoidance area 1202 is prevented from being adversely affected by the fixed mounting operation.

Further, when the number of the mounting structures 103 is not greater than four, at least two of the mounting structures 103 are respectively disposed at two ends of a diagonal line of the bracket 12, or at least two of the mounting structures 103 are symmetrically disposed on the second side wall portion 122 and the third side wall portion 123, at least one of the mounting structures 103 is disposed on the first side wall portion 121, so that the mounting structures 103 are disposed as far away from the avoiding area 1202 as possible, and interference between the two is avoided, thereby affecting the mechanical strength of the bracket 12.

In some examples, the number of the avoidance areas 1202 is one, at least two mounting structures 103 are respectively disposed at two ends of a diagonal line of the bracket 12, as shown in fig. 8, when the avoidance area 1202 is located at a position where the first side wall portion 121 is close to the tail of the fourth side wall portion 124, one of the mounting structures 103 is disposed at a position where the first side wall portion 121 is close to the second side wall portion 122 or at a connection angle, the other is disposed at a position where the third side wall portion 123 is close to the fourth side wall portion 124 or at a connection angle, and when the avoidance area 1202 is located at a position where the third side wall portion 123 is close to the tail of the fourth side wall portion 124, one of the mounting structures 103 is disposed at a position where the second side wall portion 122 is close to the third side wall portion 123 or at a connection angle, the other is disposed at a position where the first side wall portion 121 is close to the fourth side wall portion 124.

In some examples, the number of the avoidance areas 1202 is two, and when the second side wall 122 is close to the tail of the fourth side wall 124 and the third side wall 123 is close to the tail of the fourth side wall 124, as shown in fig. 8, at least two mounting structures 103 are respectively disposed on the first side wall 121 and the third side wall 123, at least one mounting structure 103 is disposed on the first side wall 121, so as to avoid mutual interference between the mounting structures 103 and the avoidance areas 1202, so as to ensure mechanical strength of the bracket 12 and mounting stability of the camera module on the electronic device.

In some examples, at one corner of the stand 12 or at two corners on a diagonal line thereof, one of the mounting structures 103 may be disposed at two sides of each corner, so as to further enhance the mounting stability of the camera module on the electronic device.

In one embodiment of the present application, the camera module is a vertical camera module, and comprises the housing 10 and the base 20, the housing 10 includes the cover portion 101 and the side wall portion 102 with extending planes perpendicular to each other, a part of the top of the side wall portion 102 and the cover portion 101 form the housing 11 together, the other part of the side wall portion 102 forms the bracket 12, the housing 11 has a light-passing opening 202, a part of the lens assembly 30 extends from the receiving space 200 between the housing 10 and the base 20 along the opposite direction of the light path, passes through the light-passing opening 202 of the housing 11 and protrudes out of the housing 10,

A snap structure for positioning is further provided between the bracket 12 and the base 20, the positioning structure including a mating snap hole 1204 and a snap 205, as shown in fig. 6-7, the bracket 12 is provided with the snap hole 1204, and the base 20 is provided with the snap 205 to further simplify alignment and assembly between the housing 10 and the base 20. Of the four side wall portions of the bracket 12, at least three side wall portions have the catching holes 1204.

In combination with the functions of the four side wall parts of the bracket 12, the first side wall part 121 and the third side wall part 123 parallel to the light path are the positions where the camera module is fixed by dispensing, the second side wall part 122 is suitable for positioning a prism, and the fourth side wall part 124 corresponds to the assembly of the photosensitive assembly 40, therefore, it is preferable that the first side wall part 121, the second side wall part 122 and the third side wall part 123 are provided with the clamping holes 1204, the clamping holes 1204 on the first side wall part 121 and/or the third side wall part 123 cooperate with the clamping holes 1204 on the base 20 to limit the offset of the housing 10 relative to the base 20 in the longitudinal direction (the second direction Y axis) of the light beam propagation direction, and the clamping holes 1204 on the second side wall part 122 cooperate with the clamping holes 205 on the base 20 to limit the offset of the housing 10 relative to the base 20 in the transverse direction (the third direction X axis).

In some examples, the number of the fastening holes 1204 on the first side wall 121/the third side wall 123 is not less than two, and since the avoiding area 1202 is located on the same side wall, the extending area of the first side wall 121/the third side wall 123 after the avoiding area 1202 is removed is taken as the distribution area of the fastening holes 1204, and not less than two fastening holes 1204 are uniformly distributed in the distribution area or symmetrically distributed in the distribution area, so as to achieve rapid alignment and assembly between the housing 10 and the base 20.

In some examples, the clip hole 1204 can be provided on the base 20 and the catch 205 can be provided on the bracket 12.

[ Circuit Structure ]

The lens driving component and the light path turning driving component form the driving mechanism of the camera module, wherein one of the first light path turning driving unit and the second light path turning driving unit and one of the first lens driving unit and the second lens driving unit are electronic components, and the electronic components are required to be conducted with a circuit.

The driving mechanism of the camera module further comprises a position sensing component for sensing the position of the lens component 30 and/or the optical path turning component 50, so as to improve the accuracy of motion position control. The position sensing assembly is also an electronic component that needs to be in electrical communication with the circuit.

The camera module further comprises a circuit assembly 60, wherein the circuit assembly 60 is connected with the electronic component and the photosensitive assembly 40, the electronic component obtains electric energy through conductive connection of the circuit assembly 60 and the photosensitive assembly 40, and further, signals can be obtained through communication connection of the circuit assembly 60 and the photosensitive assembly 40.

In one embodiment of the present application, the circuit assembly 60 comprises a circuit board, and the aforementioned electronic components (including but not limited to the first driving lens unit, the first optical path turning driving unit, the position sensing assembly, etc.) are conductively connected to the circuit board, and the circuit board is mounted on the base 20, and the circuit board is conductively connected to the photosensitive assembly 40.

In one embodiment of the present application, the circuit assembly 60 is implemented embedded in the base 20. The circuit assembly 60 includes a plurality of mounting terminals, a plurality of branches, and a plurality of connecting terminals, wherein the mounting terminals and the connecting terminals are respectively formed at two ends of the branches, the mounting terminals are adapted to be electrically connected with the electronic component, and the connecting terminals are the pins 61 and are adapted to be electrically connected with the photosensitive assembly 40.

The base 20 may be manufactured by an insert molding process, and is injection molded around the circuit assembly 60 at least once to encapsulate the circuit assembly 60, expose the mounting terminals for mounting the electronic component, and expose the pins 61 on the outer surface of the base 20 for conductive connection with the photosensitive assembly 40.

Because the circuit assembly 60 is embedded in the base 20, the circuit assembly 60 does not occupy additional space, and the camera module is smaller in size than if it were in a stand-alone circuit configuration (e.g., using a circuit board). And the circuit connection of the camera module is designed in an embedded manner, so that the circuit structure can be protected, the assembly difficulty and the reliability difficulty brought by the exposed independent circuit structure are avoided, the assembly process is simplified, and the reliability of the camera module is improved.

[ Method of assembling ]

According to another aspect of the present application, the present application also provides an assembling method of an image capturing module for assembling the image capturing module and mounting the image capturing module to an electronic device. The method comprises the following steps:

(A) Providing a base 20, at least one circuit component 60 being disposed on the base 20;

(B) Assembling the lens assembly 30, the photosensitive assembly 40 to the base 20 to form a semi-finished product 70 of the camera module, and directing the leads 61 of the circuit assembly 60 toward the photosensitive assembly 40;

(C) Providing a housing 10 disposed on the semi-finished camera module 70, wherein the housing 10 has an avoiding area 1202 for exposing the connection area between the pins 61 of the circuit assembly 60 and the circuit board 41 of the photosensitive assembly 40;

(D) The pin 61 of the circuit assembly 60 and the photosensitive assembly 40 are conducted through the avoiding area 1202.

The step (B) further comprises the step of assembling the optical path turning member 50 to the base 20 so as to be located on the optical path of the lens member 30 and/or the photosensitive member 40.

The step (B) further comprises the step of assembling the photosensitive member 40 to the base 20 so as to be attached to the base 20 and located on the optical path of the lens member 30 and/or the optical path turning member 50.

The step (C) further includes the step of the housing 10 further including a housing 11 and a bracket 12, wherein the housing 11 has a light inlet 104, the light inlet 104 of the housing 11 corresponds to the incident side of the lens assembly 30, and the bracket 12 is fixedly connected with the base 20.

The step (C) further includes the step of integrally forming the housing 10 including the case 11 and the bracket 12, the inner surface 106 of the housing 10 being engaged with the base 20, the outer surface 107 of the housing 10 being engaged with the electronic device.

The step (C) further includes the step of integrally forming the case 10 by a metal material molding process.

The step (C) further includes the step of integrally forming the housing 10 by a plastic material molding process.

The step (C) further includes the step of forming the case 10 through an aluminum alloy integral die casting process.

The step (C) further includes the step of forming the case 10 by an insert molding process.

The step (C) further includes the step of integrally molding the housing 11 by a metal material, and injection molding around at least a portion of the housing sidewall 112 of the housing 11 to form the bracket 12.

The step (C) further includes the step of mounting the housing 10 to the base 20 through the cooperation of the inner surface of the housing 10 and the base 20.

The step (C) further comprises the step of providing a connecting medium between at least one bonding surface of the inner surface 106 of the housing 10 and the base 20 to secure the housing 10 to the base 20.

The method further includes the step of providing a circuit assembly 60, and molding around the circuit assembly 60 by an insert molding process to obtain the base 20.

The step (C) further includes the step of aligning a positioning position outside the bracket 12 of the housing 10, which corresponds to the mounting position of the positioning hole as shown in fig. 8, using a pressing bracket and mounting a fixing member outside the bracket of the position for fixing.

According to another aspect of the present application, there is provided an electronic device, wherein the camera module is adapted to be mounted to an electronic device body of the electronic device, and the camera module is electrically connected to the electronic device body.

The foregoing has outlined the basic principles, features, and advantages of the present application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made therein without departing from the spirit and scope of the application, which is defined by the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.

Claims

1. A housing of a camera module for mounting on the periphery of a semi-finished camera module, comprising:

A shell which is suitable for covering at least a part of internal structure of the semi-finished product of the camera module and is provided with at least one light inlet on the surface of the shell, and

A bracket having at least four side wall portions and adapted to surround at least a part of a peripheral side of a semi-finished product of the camera module and to be connected to the housing, and having a minimum thickness not smaller than a minimum thickness of the housing;

The circuit board of the camera module and pins of the circuit assembly of the camera module are suitable for avoiding.

2. The housing of a camera module of claim 1, further comprising:

The mounting structure is arranged on the outer side of the bracket and suitable for mounting electronic equipment, and the mounting structure and the avoidance area are arranged at different positions of the side wall part of the bracket along the projection direction.

3. The housing of a camera module of claim 1, wherein the bracket includes first, second, third, and fourth sidewall portions on different sides surrounding the camera module blank, wherein the first and third sidewall portions are disposed opposite one another, the second and fourth sidewall portions are disposed opposite one another, and the fourth sidewall portion is proximate a light exit side of the camera module blank;

Wherein the relief area is provided at one end of the first side wall portion and/or one end of the third side wall portion near the fourth side wall portion.

4. The housing of claim 1, wherein the housing comprises a housing cover wall and a housing side wall, the housing cover wall being open to the light inlet, at least a portion of the housing side wall extending toward and coupled to the bracket.

5. A housing for a camera module according to claim 3, wherein the relief area extends from a bottom edge of the bracket and is formed so as not to contact an opposite side bottom edge of the bracket.

6. The housing of claim 4, wherein the housing is constructed of a metallic material and the bracket is molded with at least a portion of a housing sidewall of the housing.

7. The housing of the camera module of claim 4, wherein the housing side walls include a first housing side wall, a second housing side wall, and a third housing side wall, the first housing side wall, the second housing side wall, and the third housing side wall being molded around three sides of the housing cover wall, at least one of the first housing side wall, the second housing side wall, and the third housing side wall being provided with a coupling hole.

8. The housing of the camera module according to claim 1, wherein a diameter direction of the light entrance of the housing is perpendicular to an extending direction of the avoidance area toward the bottom edge of the bracket.

9. The housing of a camera module of claim 1, wherein the housing and the bracket are integrally formed.

10. A camera module, comprising:

A housing as claimed in any one of claims 1 to 9, and

The base defines at least one accommodating space, and the shell is assembled on the base so as to cover at least one part of the accommodating space;

a lens assembly mounted in the accommodation space;

a circuit assembly disposed on the base, and

A photosensitive assembly held at an exit side of the lens assembly;

The connection part of the pin of the circuit assembly and the circuit board of the photosensitive assembly is exposed in the avoidance area.

11. The camera module of claim 10, wherein the exit side of the base is provided with a mounting seat adapted to mount the photosensitive assembly.

12. An assembling method of a camera module adapted to assemble the camera module and to assemble the camera module according to claim 10 to an electronic device, comprising the steps of:

(A) Providing a base, wherein at least one circuit component is arranged on the base;

(B) Assembling the lens assembly and the photosensitive assembly to the base to form a semi-finished product of the camera module, and directing pins of the circuit assembly to the photosensitive assembly;

(C) Providing a shell arranged on the semi-finished product of the camera module, wherein the shell is provided with a avoidance area corresponding to a pin of the circuit assembly;

(D) And conducting the pins of the circuit assembly and the photosensitive assembly through the avoidance area.

13. The method of assembling of claim 12, wherein step (C) further comprises the step of, the housing further comprising a shell having a light entrance, and a bracket fixedly coupled to the base, wherein the light entrance of the shell corresponds to the incident side of the lens assembly.

14. An electronic device, comprising:

The camera module of claim 10, and

An electronic device body, wherein the camera module is conductively connected to the electronic device body.