CN119222386B - Pneumatic on-off back suction integrated valve for quantitative gluing of semiconductor and working method thereof - Google Patents

Abstract

The invention belongs to the technical field of valves, and in particular relates to a pneumatic on-off back suction integrated valve for semiconductor quantitative gluing and a working method thereof, wherein the pneumatic on-off back suction integrated valve for semiconductor quantitative gluing comprises a valve body, a back suction diaphragm and an on-off diaphragm, wherein a flow passage is arranged in the valve body; the pneumatic on-off and back-sucking integrated valve for quantitatively gluing the semiconductor is characterized in that a cavity is arranged below the lower piston, the on-off diaphragm descends to open the flow passage while the lower piston descends to squeeze gas in the cavity below the lower piston into the annular cavity below the on-off diaphragm, so that the on-off diaphragm is buffered, and the impact force received is reduced.

Description

Pneumatic on-off back suction integrated valve for quantitative gluing of semiconductor and working method thereof

Technical Field

The invention belongs to the technical field of valves, and particularly relates to a lifting valve, in particular to a pneumatic on-off suction integrated valve for quantitatively gluing semiconductors and a working method thereof.

Background

Wet cleaning refers to cleaning a wafer with a chemical solution to remove some metal impurities, and prevent the impurities from causing problems in a high temperature process, affecting the operation of process equipment and the yield after production.

After the wet cleaning of the wafer is completed, in order to prevent excessive chemical solution from dripping, a back suction valve is needed to suck back the chemical solution to prevent pollution.

In the related art, when the existing back suction valve is opened, the conveyed liquid can instantaneously enter the flow channel and impact on the on-off diaphragm, so that the on-off diaphragm can be subjected to a large impact force and is easy to damage.

Therefore, how to solve the technical problem that the on-off diaphragm is easily damaged by impact force at the moment of opening is needed to be solved by the person skilled in the art.

Disclosure of Invention

The embodiment of the disclosure at least provides a pneumatic on-off back suction integrated valve for semiconductor quantitative gluing and a working method thereof.

According to the embodiment of the disclosure, a pneumatic on-off and on-off integrated valve for quantitative gluing of a semiconductor is provided, and the pneumatic on-off and on-off integrated valve comprises a valve body, a lower cavity bottom plate, a cylinder body and an upper piston, wherein a flow channel is formed in the valve body, a back-sucking diaphragm and an on-off diaphragm are respectively arranged above and below the flow channel, the lower cavity bottom plate is connected with the lower end part of the valve body, a lower piston connected with the on-off diaphragm is arranged in the lower cavity bottom plate, the lower piston drives the on-off diaphragm to ascend through elasticity so as to intercept the flow channel, the cylinder body is connected with the upper end part of the valve body, and the upper piston connected with the back-sucking diaphragm is arranged in the upper piston, drives the back-sucking diaphragm to descend through the increase of air pressure and makes the back-sucking diaphragm descend to open the flow channel after the back-sucking diaphragm, and the on-off diaphragm is pushed into an annular cavity below the on-off diaphragm at the moment of opening the flow channel, and the impact force of liquid on the on-off diaphragm at the moment of opening the flow channel is buffered.

In an alternative implementation mode, a guide cylinder is arranged in a bottom plate of the lower cavity, the lower end portion of the lower piston is inserted into the guide cylinder, a first spring used for propping against the lower piston is sleeved on the periphery of the guide cylinder, so that an extrusion cavity is reserved between the lower end portion of the lower piston and the cylinder bottom of the guide cylinder, an air passage which is communicated with the annular cavity and the extrusion cavity is formed in the lower piston, and the lower piston descends to extrude gas in the extrusion cavity into the annular cavity at the moment of opening of the flow passage.

In an alternative implementation mode, a sliding block is arranged in the air passage, a compression chamber is formed in the sliding block, an air inlet communicated with the compression chamber is formed in one side of the compression chamber, an air outlet is formed in the top of the compression chamber, at the moment of opening of a runner, the lower piston descends to compress air in the compression chamber, the sliding block is pushed to retreat to a first threshold value through pressure increase, and the air outlet is communicated with the annular chamber, namely the annular chamber is inflated.

In an alternative embodiment, the air passage is provided with a first air outlet, the bottom of the compression chamber is provided with a second air outlet, in the process of opening the flow passage, the lower piston continuously pressurizes the air in the compression chamber, the sliding block is pushed to retreat to a second threshold value through pressure increase, the second air outlet is communicated with the first air outlet to release pressure, in the process of opening the flow passage, when the on-off diaphragm is broken, the lower piston continuously pressurizes the air in the compression chamber, and the sliding block is pushed to retreat to be maintained at the first threshold value through pressure increase so as to prevent the lower piston from descending.

In an alternative embodiment, the lower surface of the sliding block is provided with a stop block which retreats along with the sliding block, and the stop block extends out of the lower piston from the first exhaust port, wherein when the sliding block retreats to a first threshold value, the stop block is positioned right above the guide cylinder, and when the sliding block retreats to a second threshold value, the stop block is positioned in dislocation with the guide cylinder.

In an alternative embodiment, the width of the first exhaust port is larger than that of the second exhaust port, the stop block moves synchronously along the sliding block in the first exhaust port in the sliding block retreating process, a second spring for pushing the sliding block to reset is arranged in the air passage, a limit protrusion is arranged on the upper surface of the sliding block, and a limit groove matched with the limit protrusion is arranged on the inner wall of the air passage.

In an alternative embodiment, the lower piston is in clearance fit with the guide cylinder, so that the extrusion chamber is restored to normal pressure after the lower piston drives the on-off diaphragm to ascend to intercept the flow channel.

In an alternative embodiment, the suck-back membrane 12 is located between the cylinder body 2 and the valve body 1 and is sealed firmly through a clamping groove barb on the side edge, the press fit seal is realized between the lower cavity bottom plate 3 of the on-off membrane 13 and the valve body 1 through the cooperation of the Z-shaped side edge and the sealing ring, and the suck-back membrane 12 and the on-off membrane 13 both adopt a double-cone coupling structure.

In an optional implementation mode, an annular retainer ring is arranged in the cylinder body and is located above the back suction diaphragm, an inclined surface is arranged on the side, facing the back suction diaphragm, of the annular retainer ring, when the back suction diaphragm ascends, the back suction diaphragm abuts against the inclined surface, the middle portion of the back suction diaphragm is arc-shaped and is bent towards the side, facing the annular retainer ring, of the back suction diaphragm, the middle portion of the back suction diaphragm comprises a first arc section, a second arc section and a third arc section which are sequentially connected, the outer end portion of the first arc section is connected with a lifting column of the back suction diaphragm, and the outer end portion of the third arc section is connected with a clamping groove barb on the side edge of the back suction diaphragm.

According to the working method of the pneumatic on-off and back-suction integrated valve for quantitative gluing of the semiconductor, the on-off diaphragm is driven to ascend by the lower piston to intercept the runner, the back-suction diaphragm is driven to descend by the upper piston to push the on-off diaphragm to open the intercepting runner, gas below the lower piston is extruded into the annular cavity below the on-off diaphragm through the descent of the on-off diaphragm to buffer the impact force of liquid on the on-off diaphragm at the moment of opening the runner, the lower piston descends to pressurize the gas in the extrusion cavity at the moment of opening the runner, the sliding block is pushed to retreat to a first threshold through pressure increase, the gas outlet is communicated with the annular cavity, namely the annular cavity is inflated, the lower piston continuously pressurizes the gas in the extrusion cavity in the process of opening the runner, the sliding block is pushed to retreat to a second threshold through pressure increase, the second gas outlet is communicated with the first gas outlet in the process of opening the runner, and when the on-off diaphragm is broken, the gas in the lower piston continuously pressurizes the extrusion cavity to retreat to be maintained at the first threshold through pressure increase to prevent the descent of the piston.

The pneumatic on-off back suction integrated valve for the quantitative gluing of the semiconductor and the working method thereof have the advantages that the chamber is arranged below the lower piston, the lower piston descends to squeeze gas in the chamber below the lower piston into the annular chamber below the on-off diaphragm while the on-off diaphragm descends to open the flow passage, and therefore the on-off diaphragm is buffered, and the impact force is reduced.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a pneumatic on-off suck-back integrated valve for quantitatively gluing a semiconductor in a flow channel closing state according to an embodiment of the present disclosure;

Fig. 2 is a schematic structural diagram of a pneumatic on-off suck-back integrated valve for quantitatively gluing a semiconductor in a flow channel opening state according to an embodiment of the present disclosure;

Fig. 3 is a schematic structural diagram of a lower cavity bottom plate according to an embodiment of the disclosure;

FIG. 4 is a schematic view of a lower piston according to an embodiment of the present disclosure;

FIG. 5 is a schematic view of a stopper and guide cylinder according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of an annular retainer ring according to an embodiment of the present disclosure.

In the figure:

The valve comprises a valve body 1, a flow channel 11, a back suction diaphragm 12, a first arc section 121, a second arc section 122, a third arc section 123, a clamping groove barb 124, a lifting column 125, an on-off diaphragm 13, an annular chamber 131, a Z-shaped side 132 and a sealing ring 133;

a cylinder block 2, an upper piston 21, an upper space 211, a third spring 212, and an annular retainer ring 22;

The lower chamber bottom plate 3, the lower piston 31, the air passage 311, the first exhaust port 312, the limit groove 313, the second spring 314, the guide cylinder 32, the extrusion chamber 321, the first spring 33;

The sliding block 4, the compression chamber 41, the air inlet 42, the air outlet 43, the second air outlet 44, the stop block 45 and the limit projection 46.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. In addition, in the drawings, the thickness of the parts may be exaggerated or reduced for effective description of technical contents.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

As shown in fig. 1 and 2, at least one embodiment provides a pneumatic on-off and back-suction integrated valve for quantitatively gluing semiconductors, which comprises a valve body 1, a lower cavity bottom plate 3, a cylinder body 2, an upper piston 21 and an upper piston 21, wherein a flow channel 11 is formed in the valve body 1, a back-suction membrane 12 and an on-off membrane 13 are respectively arranged above and below the flow channel 11, the lower cavity bottom plate 3 is connected with the lower end part of the valve body 1, a lower piston 31 connected with the on-off membrane 13 is arranged in the lower cavity bottom plate, the lower piston 31 drives the on-off membrane 13 to ascend through elasticity so as to intercept the flow channel 11, the upper piston 21 is connected with the upper end part of the valve body 1, and the upper piston 21 drives the back-suction membrane 12 to descend through the increase of air pressure and is enabled to descend to open the flow channel 11 after the upper piston 21 is propped against the on-off membrane 13.

Specifically, the back suction diaphragm 12 is pressed between the valve body 1 and the cylinder body 2, the on-off diaphragm 13 is pressed between the valve body 1 and the lower cavity bottom plate 3, when the runner 11 needs to be opened, the upper space 211 of the upper piston 21 in the cylinder body 2 is inflated and pressurized, so that the upper piston 21 descends to drive the back suction diaphragm 12 to push the on-off diaphragm 13 to descend so as to open the runner 11, when the runner 11 needs to be closed, the third spring 212 below the upper piston 21 drives the upper piston 21 to ascend, so that the back suction diaphragm 12 is driven to reset, namely, the on-off diaphragm 13 closes the runner 11, and meanwhile, the back suction diaphragm 12 continues to ascend for a certain distance after being separated from the on-off diaphragm 13, so that the runner 11 below the on-off diaphragm 13 generates negative pressure so as to prevent backflow.

The inventor researches show that at the moment when the on-off diaphragm 13 opens the flow channel 11, the conveyed liquid can instantaneously enter the flow channel 11 and impact on the on-off diaphragm 13, so that the on-off diaphragm 13 can receive a large impact force.

Therefore, in order to solve the technical problem found by the inventor in testing the pneumatic on-off suck-back integrated valve, as shown in fig. 3, the embodiment provides a solution for the problem, specifically, a chamber is arranged below the lower piston 31, and the lower piston 31 descends to squeeze the gas in the chamber below the lower piston 31 into the annular chamber 131 below the on-off diaphragm 13 while the on-off diaphragm 13 descends to open the flow channel 11, so that the on-off diaphragm 13 is buffered, and the impact force is reduced.

Specifically, a guide cylinder 32 is disposed in the bottom plate 3 of the lower cavity, the lower end of the lower piston 31 is inserted into the guide cylinder 32, a first spring 33 for supporting the lower piston 31 is sleeved on the periphery of the guide cylinder 32, so that a compression chamber 321 is remained between the lower end of the lower piston 31 and the bottom of the guide cylinder 32, wherein an air passage 311 for communicating the annular chamber 131 with the compression chamber 321 is formed in the lower piston 31, and the lower piston 31 descends to compress air in the compression chamber 321 into the annular chamber 131 at the moment when the flow passage 11 is opened.

Further, after solving the above-mentioned problems, the inventor has found that, in a further testing process of the pneumatic on-off suck-back integrated valve, when the lower piston 31 is continuously lowered, the gas in the extrusion chamber 321 is continuously filled into the annular chamber 131 to continuously increase the pressure therein, but when the pressure in the annular chamber 131 is large, the on-off diaphragm 13 is mutually pulled by the gas below and the liquid above, so as to accelerate the damage of the on-off diaphragm 13.

Accordingly, in order to solve the above-described problems, as shown in fig. 4, in the present embodiment, a slider 4 is provided in the inside of the air passage 311, the air passage 311 is opened by the slider 4 to inflate the pressing chamber 321 to the annular chamber 131, and at the same time, when the air pressure in the annular chamber 131 exceeds a threshold value, the pressure release port of the air passage 311 is opened by the slider 4 to prevent the annular chamber 131 from being overpressurized.

Specifically, the sliding block 4 is provided with a compression chamber 41, one side of the compression chamber 41 is provided with an air inlet 42, the air inlet 42 is communicated with the extrusion chamber 321 through an air passage 311, the top of the compression chamber 41 is provided with an air outlet 43, when the flow passage 11 is not opened, the air outlet 43 is blocked, when the flow passage 11 is opened, the lower piston 31 descends to compress the air in the extrusion chamber 321, the sliding block 4 is pushed to retreat to a first threshold value through the pressure increase, and at the moment, the air outlet 43 is communicated with the annular chamber 131, namely, the annular chamber 131 is inflated.

Specifically, the air passage 311 is provided with a first air outlet 312, the bottom of the pressure-receiving chamber 41 is provided with a second air outlet 44, when the air pressure in the annular chamber 131 does not exceed a threshold value, the second air outlet 44 is blocked, in the process of opening the flow passage 11, the lower piston 31 continuously pressurizes the air in the extrusion chamber 321, the sliding block 4 is pushed to retreat by the pressure increase, when the air pressure in the annular chamber 131 exceeds the threshold value, the sliding block 4 retreats to a second threshold value, and at the moment, the second air outlet 44 is communicated with the first air outlet 312 to release the pressure.

After solving the above technical problems, the inventor has further tested and found that a third technical problem is that the on-off diaphragm 13 is damaged, and the damage does not generate leakage of liquid when the valve is not opened, so that the on-off diaphragm is difficult to find in advance.

Therefore, in order to solve the above-mentioned problem, as shown in fig. 4 and 5, in the present embodiment, by providing a stopper 45 that moves along with the slider 4, the stopper 45 is released only when the pressure in the pressing chamber 321 approaches the threshold value, so that the lower piston 31 can be lowered to the maximum depth.

Specifically, in the process of opening the flow channel 11, when the on-off diaphragm 13 is broken, the air pressure in the annular chamber 131 will not exceed the threshold value due to air leakage, so the sliding block 4 will only retract to the first threshold value at most, and cannot retract to the second threshold value (the first threshold value is smaller than the second threshold value), at this time, the stop block 45 will not release the limit, and the lower piston 31 cannot descend to the maximum depth.

Specifically, the lower surface of the sliding block 4 is provided with a stop block 45 which retreats along with the sliding block 4, and the stop block 45 extends out of the lower piston 31 from the first exhaust port 312, wherein when the sliding block 4 retreats to a first threshold value, the stop block 45 is positioned right above the guide cylinder 32, and when the sliding block 4 retreats to a second threshold value, the stop block 45 is positioned in dislocation with the guide cylinder 32.

In some embodiments, the width of the first exhaust port 312 is greater than the width of the second exhaust port 44, wherein the stop 45 moves synchronously with the slider 4 within the first exhaust port 312 during the retraction of the slider 4.

In some embodiments, a second spring 314 for pushing the slider 4 to return is provided in the air passage 311, a limit protrusion 46 is provided on the upper surface of the slider 4, and a limit groove 313 adapted to the limit protrusion 46 is provided on the inner wall of the air passage 311.

In some embodiments, the lower piston 31 is in clearance fit with the guide cylinder 32, so that the extrusion chamber 321 is restored to normal pressure after the lower piston 31 drives the on-off diaphragm 13 to ascend to intercept the flow channel 11.

As shown in fig. 1, in some embodiments, the suck-back diaphragm 12 is located between the cylinder block 2 and the valve body 1 and is hard sealed by side bayonet barbs 124.

In some embodiments, as shown in fig. 3, the pressing seal is realized by matching the zigzag side 132 with the sealing ring 133 between the lower cavity bottom plate 3 of the on-off diaphragm 13 and the valve body 1, and both the back suction diaphragm 12 and the on-off diaphragm 13 adopt a double-cone coupling structure.

In the embodiment, the Z-shaped side 132 of the on-off diaphragm 13 and the pre-pressing of the sealing ring 133 can ensure the pressing sealing of three direction surfaces and play a role in multi-seal, and the back suction diaphragm 12 and the on-off diaphragm 13 both adopt a double-cone coupling structure, so that the service life of the center is ensured to be coaxial, and the separation of stroke difference is ensured to be independent.

As shown in fig. 6, in some embodiments, an annular retainer ring 22 is disposed in the cylinder block 2, the annular retainer ring 22 is located above the suck-back diaphragm 12, wherein an inclined surface 221 is disposed on the side of the annular retainer ring 22 facing the suck-back diaphragm 12, and the suck-back diaphragm 12 abuts against the inclined surface 221 when the suck-back diaphragm 12 is lifted.

In the present embodiment, when the back suction diaphragm 12 is lifted, in order to prevent the liquid from pulling on the back suction diaphragm 12, the back suction diaphragm 12 is pushed against the back suction diaphragm 12 by the annular retainer ring 22 during the lifting process, so that the pulling force of the liquid on the back suction diaphragm 12 is reduced.

In some embodiments, the sealing structure of the on-off diaphragm 13 and the valve body 1 adopts an inclined plane and sharp angle design, so that when the flow channel 11 is cut off, the pressure in the inlet direction cannot shift the on-off diaphragm 13, and the sealing performance and the service life are ensured.

In some embodiments, the cylinder body 2 and the lower cavity bottom plate 3 are both provided with negative pressure preventing holes, so that when the volume of the cavity changes, the internal pressure can be regulated, and the suck-back precision can be effectively ensured.

In some embodiments, the middle part of the back suction diaphragm 12 is arc-shaped and is bent towards the side of the annular retainer ring 22, the middle part of the back suction diaphragm 12 comprises a first arc section 121, a second arc section 122 and a third arc section 123 which are sequentially connected, the outer end part of the first arc section 121 is connected with a lifting column 125 of the back suction diaphragm 12, and the outer end part of the third arc section 123 is connected with a clamping groove barb 124 on the side edge of the back suction diaphragm 12.

In this embodiment, when the flow channel 11 is closed, the lifting column 125 is lifted, at this time, the lifting column 125 drives the first arc segment 121 and the second arc segment 122 to extend upwards, and when the flow channel 11 is closed, the lifting column 125 continues to lift, drives the first arc segment 121 and the second arc segment 122 to extend continuously, so that a siphon negative pressure is formed in a region where the flow channel 11 is communicated with the outlet, and meanwhile, the first arc segment 121, the second arc segment 122 and the third arc segment 123 are supported in a triangular shape, so that the arcs cannot deform reversely when the siphon negative pressure is formed, and the space of the negative pressure chamber is effectively ensured.

At least one embodiment also provides a working method of the pneumatic on-off and back-suction integrated valve for quantitatively gluing semiconductors, which comprises the steps of driving the on-off diaphragm 13 to ascend through the lower piston 31 to intercept the runner 11, driving the back-suction diaphragm 12 to descend through the upper piston 21 to push the on-off diaphragm 13 to open the intercepting runner 11, pushing gas below the lower piston 31 into the annular chamber 131 below the on-off diaphragm 13 through the descending of the on-off diaphragm 13 to buffer the impact force of liquid on the on-off diaphragm 13 when the runner 11 is opened, pushing the sliding block 4 to retreat to a first threshold value through pressure increase when the runner 11 is opened, enabling the gas outlet 43 to be communicated with the annular chamber 131, namely inflating the annular chamber 131, continuously pushing the sliding block 4 to retreat to a second threshold value through pressure increase in the lower piston 31 to enable the second gas outlet 44 to be communicated with the first gas outlet 312, and continuously pushing the sliding block 31 to retreat to the first threshold value through pressure increase when the on-off diaphragm 13 is opened, and continuously pushing the sliding block 31 to retreat to keep the sliding block 4 after the pressure increase in the sliding block 31 to keep the pressure in the first threshold value when the runner 11 is opened.

The specific structure and implementation process of the pneumatic on-off suck-back integrated valve for quantitative semiconductor gluing are referred to the related discussion in the above embodiments, and are not repeated here.

In summary, according to the pneumatic on-off suction integrated valve for quantitatively gluing semiconductors and the working method thereof, a chamber is arranged below the lower piston 31, the lower piston 31 descends to squeeze gas in the chamber below the lower piston 31 into the annular chamber 131 below the on-off diaphragm 13 while the on-off diaphragm 13 descends to open the flow channel 11, so that the on-off diaphragm 13 is buffered, and the impact force is reduced.

In this context, when it is mentioned that a first component is located on a second component, this may mean that the first component may be formed directly on the second component, or that a third component may be interposed between the first component and the second component.

In this document, when an element or layer is referred to as being "on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it can be directly on, engaged, connected, attached, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a similar fashion (e.g., "between" pairs "directly between," "adjacent" pairs "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example embodiments of the present disclosure will be described in more detail herein with reference to the accompanying drawings. As used herein, expressions such as "at least one of a..once more, modify an entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b and c" should be understood to include a only a, b only, c only, both a and b, both a and c, both b and c, or all of a, b and c.

The terminology used herein is for the purpose of describing particular example configurations only and is not intended to be limiting. As used herein, the singular articles "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein should not be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. Additional or alternative steps may be employed.

As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that a particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included within more than one embodiment of the disclosure, such that the phrases are not necessarily referring to the same embodiment. As used herein, the terms "exemplary," "exemplary," and the like are used for purposes of illustration, example, or description. Any embodiment, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments, aspects, or designs. Rather, use of the terms "example," "exemplary," and the like are intended to present concepts in a concrete fashion.

In describing embodiments of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Moreover, terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed above could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms, such as "inner," "outer," "lower," "upper," and the like, may be used herein to facilitate the description of one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the discussion above, the terms "about," "approximately," "substantially," and the like, when used to describe a value, mean a variation of +/-10% of the value, unless otherwise indicated.

With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.

Claims (8)

1. A pneumatic break-make suck-back integrative valve for semiconductor ration rubber coating, characterized by comprising:

A valve body (1) is provided with a flow channel (11), and a back suction membrane (12) and an on-off membrane (13) are respectively arranged above and below the flow channel (11);

The lower cavity bottom plate (3) is connected with the lower end part of the valve body (1), and a lower piston (31) connected with the on-off diaphragm (13) is arranged in the lower cavity bottom plate, and the lower piston (31) drives the on-off diaphragm (13) to ascend through elasticity so as to intercept the flow channel (11);

A cylinder block (2) connected with the upper end of the valve body (1) and internally provided with an upper piston (21) connected with the back suction diaphragm (12), wherein the upper piston (21) drives the back suction diaphragm (12) to descend through the increase of air pressure and make the back suction diaphragm (12) to descend to open a flow passage (11) after being propped against the on-off diaphragm (13), wherein

At the moment when the runner (11) is opened, the on-off diaphragm (13) drives the lower piston (31) to descend, and gas below the lower piston (31) is extruded into the annular chamber (131) below the on-off diaphragm (13) to buffer the impact force of liquid on the on-off diaphragm (13) at the moment when the runner (11) is opened;

a guide cylinder (32) is arranged in the lower cavity bottom plate (3);

the lower end part of the lower piston (31) is inserted into the guide cylinder (32), and the periphery of the guide cylinder (32) is sleeved with a first spring (33) for propping against the lower piston (31) so as to leave a squeezing chamber (321) between the lower end part of the lower piston (31) and the cylinder bottom of the guide cylinder (32), wherein

An air passage (311) which is communicated with the annular chamber (131) and the extrusion chamber (321) is formed in the lower piston (31), and the lower piston (31) descends to extrude the air in the extrusion chamber (321) into the annular chamber (131) at the moment when the flow passage (11) is opened;

a sliding block (4) is arranged in the air passage (311);

The sliding block (4) is provided with a pressure-bearing cavity (41), one side of the pressure-bearing cavity (41) is provided with an air inlet (42) communicated with the extrusion cavity (321), and the top of the pressure-bearing cavity (41) is provided with an air outlet (43);

At the moment when the runner (11) is opened, the lower piston (31) descends to pressurize the gas in the extrusion chamber (321), and the sliding block (4) is pushed to retreat to a first threshold value by the increase of pressure, so that the gas outlet (43) is communicated with the annular chamber (131), namely, the annular chamber (131) is inflated.

2. A pneumatic on-off suck-back integrated valve for semiconductor quantitative glue coating as claimed in claim 1, wherein,

The air passage (311) is provided with a first air outlet (312), and the bottom of the pressure-receiving chamber (41) is provided with a second air outlet (44);

In the process of opening the flow passage (11), the lower piston (31) continuously pressurizes the gas in the extrusion chamber (321), and the sliding block (4) is pushed to retreat to a second threshold value through the pressure increase, so that the second exhaust port (44) is communicated with the first exhaust port (312) to release pressure;

When the on-off diaphragm (13) is broken in the process of opening the flow passage (11), the lower piston (31) continuously pressurizes the gas in the extrusion chamber (321), and the sliding block (4) is pushed to retreat by the increase of the pressure to be maintained at a first threshold value so as to prevent the lower piston (31) from descending.

3. A pneumatic on-off suck-back integrated valve for semiconductor quantitative glue coating as claimed in claim 2, wherein,

The lower surface of the sliding block (4) is provided with a stop block (45) which retreats along with the sliding block (4), and the stop block (45) extends out of the lower piston (31) from the first exhaust port (312), wherein

When the sliding block (4) retreats to a first threshold value, the stop block (45) is positioned right above the guide cylinder (32);

when the sliding block (4) retreats to a second threshold value, the stop block (45) is positioned in dislocation with the guide cylinder (32).

4. A pneumatic on-off suck-back integrated valve for semiconductor quantitative glue coating as claimed in claim 3, wherein,

The width of the first exhaust port (312) is larger than the width of the second exhaust port (44), wherein

During the backward movement of the sliding block (4), the stop block (45) moves synchronously along with the sliding block (4) in the first exhaust port (312);

a second spring (314) for pushing the sliding block (4) to reset is arranged in the air passage (311);

The upper surface of sliding block (4) is provided with spacing protruding (46), the inner wall of air flue (311) is provided with spacing recess (313) with spacing protruding (46) adaptation.

5. The pneumatic on-off back suction integrated valve for semiconductor quantitative glue coating according to claim 4, wherein,

The lower piston (31) is in clearance fit with the guide cylinder (32) so that the extrusion chamber (321) is restored to normal pressure after the lower piston (31) drives the on-off diaphragm (13) to ascend to intercept the flow channel (11).

6. A pneumatic on-off suck-back integrated valve for semiconductor quantitative glue coating as claimed in claim 1, wherein,

The back suction diaphragm (12) is positioned between the cylinder body (2) and the valve body (1) and is sealed firmly through a clamping groove barb (124) at the side edge;

The on-off diaphragm (13) is positioned between the lower cavity bottom plate (3) and the valve body (1), and press fit sealing is realized through the matching of the Z-shaped side edges (132) and the sealing rings (133);

The back suction membrane (12) and the on-off membrane (13) are both in double-cone coupling structures.

7. A pneumatic on-off suck-back integrated valve for semiconductor quantitative glue coating as claimed in claim 1, wherein,

An annular check ring (22) is arranged in the cylinder body (2), and the annular check ring (22) is positioned above the back suction diaphragm (12), wherein

The annular retainer ring (22) is provided with an inclined surface (221) towards the side of the back suction diaphragm (12), and when the back suction diaphragm (12) ascends, the back suction diaphragm (12) is propped against the inclined surface (221);

the middle part of the back suction diaphragm (12) is arc-shaped and is bent towards the side of the annular check ring (22);

The middle part of the back suction diaphragm (12) comprises a first arc section (121), a second arc section (122) and a third arc section (123) which are sequentially connected;

The outer end of the first arc section (121) is connected with a lifting column (125) of the back suction membrane (12), and the outer end of the third arc section (123) is connected with a clamping groove barb (124) on the side edge of the back suction membrane (12).

8. A method of operating a pneumatic on-off suck-back integrated valve for semiconductor dosing glue as claimed in claim 2, comprising:

The on-off diaphragm (13) is driven to ascend by the lower piston (31) so as to cut off the flow channel (11);

the upper piston (21) drives the back suction diaphragm (12) to descend so as to push the on-off diaphragm (13) to open the cutoff flow channel (11);

the gas below the lower piston (31) is extruded into the annular cavity (131) below the on-off diaphragm (13) through the descending of the on-off diaphragm (13) so as to buffer the impact force of the instant liquid on the on-off diaphragm (13) when the flow channel (11) is opened;

at the moment when the runner (11) is opened, the lower piston (31) descends to pressurize the gas in the extrusion chamber (321), and the sliding block (4) is pushed to retreat to a first threshold value by the increase of pressure, so that the gas outlet (43) is communicated with the annular chamber (131), namely, the annular chamber (131) is inflated;

In the process of opening the flow passage (11), the lower piston (31) continuously pressurizes the gas in the extrusion chamber (321), and the sliding block (4) is pushed to retreat to a second threshold value through the pressure increase, so that the second exhaust port (44) is communicated with the first exhaust port (312) to release pressure;

When the on-off diaphragm (13) is broken in the process of opening the flow passage (11), the lower piston (31) continuously pressurizes the gas in the extrusion chamber (321), and the sliding block (4) is pushed to retreat by the increase of the pressure to be maintained at a first threshold value so as to prevent the lower piston (31) from descending.