CN119212260A - A method for processing rigid-flexible composite board and a rigid-flexible composite board structure - Google Patents
A method for processing rigid-flexible composite board and a rigid-flexible composite board structure Download PDFInfo
- Publication number
- CN119212260A CN119212260A CN202411227514.0A CN202411227514A CN119212260A CN 119212260 A CN119212260 A CN 119212260A CN 202411227514 A CN202411227514 A CN 202411227514A CN 119212260 A CN119212260 A CN 119212260A
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- Prior art keywords
- circuit board
- rigid
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- prepreg
- copper foil
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Links
- 238000000034 method Methods 0.000 title claims description 51
- 239000002131 composite material Substances 0.000 title 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000011889 copper foil Substances 0.000 claims abstract description 48
- 238000010030 laminating Methods 0.000 claims abstract description 24
- 238000003672 processing method Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims description 39
- 238000009713 electroplating Methods 0.000 claims description 34
- 238000007747 plating Methods 0.000 claims description 26
- 238000005553 drilling Methods 0.000 claims description 21
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 13
- 239000012459 cleaning agent Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000003814 drug Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a processing method and a jointed board structure of a rigid-flex printed board, wherein the processing method comprises the steps of providing a circuit board main body, providing a plurality of circuit board areas which are arranged in an array mode, wherein each circuit board area comprises a flexible area and a rigid-flex combined area, a bonding area is arranged between two adjacent circuit board areas, laminating a prepreg on the circuit board main body, wherein the prepreg is provided with a plurality of windowing areas which are arranged in an array mode, the positions of the windowing areas are arranged in a one-to-one correspondence mode with the positions of the flexible areas, laminating a copper foil on the prepreg, bonding the copper foil with the rigid-flex combined area and the bonding area through the prepreg, and laminating by using a laminating machine. The windowing area of the prepreg is optimized from a plurality of circuit board areas which are correspondingly arranged in the whole windowing to a plurality of circuit board areas which are correspondingly arranged in a single opening, so that the copper foil increases the bonding area of the copper foil, and the copper foil is prevented from being cracked due to overlarge stress born by the local area.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing processes, in particular to a rigid-flex printed circuit board jointed board processing method and a rigid-flex printed circuit board jointed board structure.
Background
Along with the development of miniaturization, light weight and multifunction of electronic products, the design of rigid-flex boards is increasingly complex, and the requirements on lamination processes are also increasing. In the lamination process, the prepreg (Prepreg) is used as a bonding material, and the performance of the prepreg directly influences the bonding strength between the FPC and the PCB and the overall stability of the circuit board. The prepreg fenestration design is an important step in the lamination process to avoid stress concentrations caused by material expansion or contraction during lamination, thereby protecting the internal circuitry from damage.
In the existing rigid-flex printed board splicing and laminating process, the size of the prepreg windowing opening needs to be adjusted according to the specific design of the circuit board. However, in actual production, prepreg fenestration openings are often set too large. In this case, the pressure generated during lamination is liable to directly act on the copper foil of the outer layer through the large opening, resulting in the copper foil being subjected to excessive stress in a local area to cause fracturing.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a processing method of the rigid-flex printed circuit board jointed board, which can prevent the copper foil from being cracked due to overlarge stress born by a local area by optimizing the design of the opening of the prepreg.
The invention also provides a rigid-flex printed circuit board jointed board structure adopting the rigid-flex printed circuit board jointed board processing method.
According to an embodiment of the first aspect of the present invention, the processing method of the rigid-flex printed circuit board jigsaw includes the following steps:
providing a circuit board main body, wherein the circuit board main body is provided with a plurality of circuit board areas which are arranged in an array, the circuit board areas comprise flexible areas and rigid-flexible combination areas, and a bonding area is arranged between two adjacent circuit board areas;
laminating a prepreg on the circuit board main body, wherein the prepreg is provided with a plurality of windowing areas which are arranged in an array manner, and the positions of the windowing areas are arranged in one-to-one correspondence with the positions of the flexible areas;
Laminating a copper foil on the prepreg, wherein the copper foil is bonded with the rigid-flex bonding area and the bonding area through the prepreg, and
Laminating, namely laminating the processed spliced circuit board main body, the prepreg and the copper foil according to a design sequence by using a laminating machine.
According to the processing method of the rigid-flex printed circuit board jointed board, the processing method has the advantages that the windowing area of the prepreg is optimized from a plurality of circuit board areas which are correspondingly arranged in a whole windowing mode to a plurality of circuit board areas which are correspondingly arranged in a single opening mode, the copper foil can be bonded on the bonding area between two adjacent circuit board areas through the prepreg, the bonding area of the copper foil is increased, meanwhile, the prepreg can be used for supporting, and further, in the lamination processing process, the copper foil is prevented from being cracked due to overlarge stress born in local areas. Finally, in the subsequent wet processes such as electroplating process, cleaning process and the like, the liquid medicine and the like can be prevented from penetrating into the circuit board from the position where the copper foil is fractured.
According to some embodiments of the present invention, the step of laminating a copper foil on the prepreg further includes a step of windowing, wherein the step of windowing is performed on the prepreg by using a numerical control machine tool, so as to obtain the windowing region.
According to some embodiments of the invention, the step of laminating further comprises the step of:
drilling, fixing the circuit board on a workbench of a drilling machine, starting the drilling machine, drilling according to a preset hole position, and
Electroplating, and depositing a layer of metal on the surface of the circuit board.
According to some embodiments of the invention, the plating includes full plate plating, pattern plating, and hole wall plating.
According to some embodiments of the invention, the step of electroplating is followed by the step of removing plating resist ink used to protect the electroless plated areas during the electroplating process.
According to some embodiments of the invention, the method further comprises the following processing steps:
circuit manufacturing, namely forming a required circuit pattern on the copper foil;
Printing solder resist ink, coating a layer of solder resist ink on the circuit board, and
And (3) silk-screen printing a circuit board, and printing mark information on the circuit board.
According to a second aspect of the present invention, the flex-rigid board structure is manufactured by using the processing method of the flex-rigid board structure according to any one of the first aspect, and the flex-rigid board structure includes the circuit board main body, the circuit board, the prepreg and the copper foil, and the circuit board is arranged in an array in the circuit board area of the circuit board main body.
According to the at least beneficial effects of the embodiment of the first aspect, the rigid-flex printed circuit board jointed board structure manufactured by the rigid-flex printed circuit board jointed board processing method according to any one of the embodiments of the first aspect has a good board surface structure, and the copper foil has good flatness and no cracks, is convenient to smoothly carry out in subsequent wet processes such as electroplating process and cleaning process, and can reduce the occurrence of circuit board waste reporting.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of a prior art rigid-flex board imposition structure related to the present invention;
Fig. 2 is a schematic view of a jointed board structure of a flex-rigid board according to a second aspect of the present invention.
Reference numerals:
The circuit board comprises a circuit board main body 1, a circuit board area 2, a flexible area 3, a rigid-flexible combination area 4, an adhesive area 5 and a windowing area 6.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1 to 2, according to a first aspect of the present invention, a method for processing a flex-rigid board panel includes providing a circuit board main body 1, wherein the circuit board main body 1 has a plurality of circuit board areas 2 arranged in an array, the circuit board areas 2 include a flexible area 3 and a flex-rigid area 4, a bonding area 5 is provided between two adjacent circuit board areas 2, a prepreg (not shown) is laminated on the circuit board main body 1, the prepreg has a plurality of window areas 6 arranged in an array, the positions of the window areas 6 are arranged in a one-to-one correspondence to the positions of the flexible area 3, a copper foil (not shown) is laminated on the prepreg, the copper foil is bonded to the flex-rigid area 4 and the bonding area 5 through the prepreg, and the laminating process is performed by using a laminating machine after the processed circuit board main body 1, the prepreg and the copper foil are stacked in a design order.
Specifically, the invention provides a processing method of a rigid-flex printed circuit board jointed board, which comprises the following specific steps of realizing efficient and accurate processing of the rigid-flex printed circuit board jointed board. First, a circuit board main body 1 is provided. The circuit board body 1 has a plurality of circuit board regions 2 arranged in an array, and each circuit board region 2 includes a flexible region 3 and a rigid-flex bonding region 4. These areas are pre-divided according to the design requirements of the product. In particular, a bonding area 5 is arranged between two adjacent circuit board areas 2 at intervals, so that a good bonding effect is realized by the jointed structure of the copper foil on the circuit board main body 1 in the subsequent processing step. Next, a prepreg is laminated on the wiring board main body 1. The prepreg is also provided with a plurality of windowing areas 6 which are arranged in an array, and the positions of the windowing areas 6 are arranged in a one-to-one correspondence with the positions of the flexible areas 3 on the circuit board main body 1. The fenestration area 6 is designed to protect the flexible area 3 from unnecessary pressure or heat during lamination. Then, a copper foil is laminated on the prepreg. The copper foil is bonded to the rigid-flex bonding area 4 and the bonding area 5 on the circuit board main body 1 through the prepreg. The copper foil is laminated in order to form a conductive layer in a subsequent lamination process while forming a good electrical connection with a corresponding region on the circuit board main body 1. Finally, a lamination process is performed. The processed boards (including the circuit board body 1, the prepreg and the copper foil) are stacked in the designed order and laminated by a laminating machine. In the lamination process, the copper foil, the prepreg and the circuit board main body 1 are tightly adhered together by controlling parameters such as temperature, pressure, time and the like, so that the required rigid-flex board structure is formed. In summary, the processing method of the rigid-flex printed circuit board jointed board realizes high-efficiency and accurate processing of the rigid-flex printed circuit board jointed board by accurately controlling each processing step. The method not only improves production efficiency, but also ensures quality and performance of the product.
Therefore, it can be understood that the processing method of the rigid-flex printed circuit board jointed board at least has the following beneficial effects that the windowing area 6 of the prepreg is optimized from a plurality of circuit board areas 2 which are correspondingly arranged in a whole windowing mode to a plurality of circuit board areas 2 which are correspondingly arranged in a single opening mode, so that copper foil can be bonded on the bonding area 5 between two adjacent circuit board areas 2 through the prepreg, the bonding area of the copper foil is increased, meanwhile, the supporting can be carried out through the prepreg, and further, the copper foil is prevented from being subjected to excessive stress in a local area to cause fracturing in the lamination processing process. Finally, in the subsequent wet processes such as electroplating process, cleaning process and the like, the liquid medicine and the like can be prevented from penetrating into the circuit board from the position where the copper foil is fractured.
Referring to fig. 2, in some embodiments of the present invention, the step of laminating a copper foil on the prepreg further includes a step of windowing, wherein the prepreg is windowed by using a numerically-controlled machine tool to obtain a windowed area 6. Specifically, this step is to perform precise windowing on the prepreg by using a numerical control machine tool, thereby obtaining a desired windowing region 6. In actual operation, firstly, the prepreg is ensured to be in a stable and flat state, then, the prepreg is windowed according to a preset windowing pattern and size by utilizing the accurate control function of a numerical control machine tool, for example, the windowing area 6 covering the whole row of circuit board areas 2 in the prior art can be divided into 9 windowing areas 6 with the length of 955 microns and the width of 801 microns, and the positions of the windowing areas 6 are arranged in one-to-one correspondence with the positions of the circuit board jointed board structures on the circuit board main body 1 so as to protect the flexible areas 3 of the circuit board areas 2. In this process, the numerically controlled machine tool will accurately remove some of the material from the prepreg to form the desired fenestration area 6 while ensuring the integrity and stability of the surrounding material. Through the windowing treatment step, convenience can be effectively provided for subsequent lamination of the copper foil on the prepreg, good combination between the copper foil and the prepreg is ensured, and the processing quality and performance of the rigid-flex printed circuit board are further improved. Meanwhile, the step also shows the exquisite process and high accuracy of the processing method in detail processing.
In some embodiments of the present invention, the step of laminating further comprises the steps of drilling holes, fixing the circuit board to a table of a drilling machine, starting the drilling machine to drill holes according to preset hole positions, and electroplating to deposit a layer of metal on the surface of the circuit board. After the lamination process is completed, a drilling step is first performed. In this step, the wiring board that has undergone the lamination process needs to be fixed on the table of the drilling machine. The circuit board is ensured to be stable and free from shaking during fixing, so that the drilling precision is ensured. And then starting the drilling machine, and drilling according to the preset hole position. The rotating speed and the feeding speed of the drilling machine are controlled in the drilling process, so that the drilled hole is accurate in position and proper in aperture, and unnecessary damage to the circuit board is avoided. After drilling is completed, an electroplating step is performed next. In this step, a layer of metal needs to be deposited on the surface of the wiring board. First, a plating solution and a plating apparatus are prepared. Then, the circuit board is immersed in the electroplating solution, and the power supply is switched on, so that metal ions in the electroplating solution are deposited on the surface of the circuit board under the action of an electric field. In the electroplating process, the concentration, the temperature and the electroplating time of the electroplating liquid are controlled to ensure that the deposited metal layer is uniform and compact and well combined with the surface of the circuit board.
Specifically, in some embodiments of the present invention, plating may include whole plate plating, pattern plating, and hole wall plating. In the electroplating step, for the purpose of comprehensiveness and fineness of electroplating, three links of whole plate electroplating, pattern electroplating and hole wall electroplating are specifically included. The whole board is electroplated, which is to form a uniform metal layer on the whole surface of the circuit board. The circuit board subjected to drilling treatment is completely immersed in the electroplating liquid, and metal ions can be ensured to be uniformly deposited on each part of the circuit board by controlling the electroplating time and the current intensity, so that a metal layer with moderate thickness and uniform distribution is formed. Pattern plating, which is a step for forming a specific circuit pattern on a wiring board. And masking the parts which do not need to be electroplated by adopting a masking technology, and only exposing the parts which need to form a circuit. Then, the wiring board is immersed in the plating solution again to perform partial plating. By precisely controlling the plating time and the current intensity, a clear and accurate circuit pattern can be formed on the exposed portion. Electroplating the hole wall, wherein the step is to deposit a layer of metal on the hole wall formed after drilling so as to enhance the binding force and conductivity between the hole wall and the circuit board. And placing the drilled circuit board in a special electroplating device, so that the electroplating solution can fully contact the hole wall. By controlling the electroplating time and the current intensity, a uniform and compact metal layer can be formed on the hole wall, thereby effectively improving the quality and performance of the hole wall.
In some embodiments of the invention, the step of electroplating is followed by the step of removing plating-resistant ink used to protect the electroless plated areas during the electroplating process. After the electroplating step is performed, an important subsequent step is also required to remove the plating-resistant ink used to protect the electroless plated areas during the electroplating process. In order to protect the electroless plated areas on the circuit board from metal deposition during the plating process, a layer of plating resist ink is applied to these areas. After electroplating, the ink layer has completed its life and needs to be removed thoroughly to ensure the neatness of the circuit board and the smooth proceeding of the subsequent process.
The step of removing the plating-resistant ink generally includes preparing a cleaning device by selecting a proper cleaning device and cleaning agent to ensure that the cleaning process does not damage the circuit board. And (3) cleaning the circuit board, namely placing the electroplated circuit board into cleaning equipment, and cleaning the electroplated ink by using a cleaning agent. The temperature, concentration and cleaning time of the cleaning agent are controlled during the cleaning process to ensure that the ink can be thoroughly removed. And drying, namely taking out the circuit board after cleaning is finished, and drying to remove residual cleaning agent and water. Checking and repairing, namely checking the cleaned circuit board to ensure that all electroplating-resistant ink is removed completely. If the residual or damaged part is found, the repair is performed in time.
In some embodiments of the invention, the method further comprises the steps of producing the circuit, forming a required circuit pattern on the copper foil, printing solder resist ink, coating a layer of solder resist ink on the circuit board, and silk-screen printing the circuit board to print marking information on the circuit board. The processing method of the rigid-flex printed circuit board jointed board according to the embodiment further comprises the following key processing steps besides the steps described above, so as to ensure the integrity and the functionality of the circuit board.
First, the circuit manufacturing step is performed. In this step, a desired wiring pattern needs to be formed on the copper foil. This is typically achieved by photolithographic and etching techniques. Specifically, a layer of photoresist is coated on a copper foil, and then a circuit pattern is transferred to the photoresist using a photolithography machine. Then, the copper foil portions not protected by the photoresist are removed by an etching process, thereby forming a desired circuit pattern on the copper foil. The next step is to print a solder resist ink. In this step, a layer of solder resist ink is applied to the wiring board. The main function of the solder resist ink is to protect the circuit pattern on the circuit board from the erosion of the external environment and to prevent solder from flowing to the non-soldered area during soldering. When the solder resist ink is applied, it is necessary to ensure that the ink uniformly covers the surface of the circuit board and that there are no defects such as bubbles, cracks, and the like. And finally, a circuit board silk screen printing step. In this step, it is necessary to print marking information such as a date of manufacture, a manufacturer's logo, a circuit board model, etc. on the circuit board. This is typically achieved by screen printing techniques. Specifically, a screen plate containing the required marking information is first manufactured, and then ink is printed on a circuit board through the screen plate. The amount of ink and the printing pressure need to be controlled during the printing process to ensure the definition and accuracy of the marking information.
Referring to fig. 2, a flex-rigid board jigsaw structure according to a second aspect of the present invention, which is manufactured by the processing method of the flex-rigid board jigsaw according to any one of the embodiments of the first aspect, includes a circuit board main body 1, a circuit board jigsaw, a prepreg, and a copper foil, and the circuit board jigsaw is arranged in an array in a circuit board area 2 of the circuit board main body 1. According to at least the beneficial effects of the embodiment of the first aspect, it is known that the processing method of the flex-rigid board according to any one of the embodiments of the first aspect is adopted to manufacture the flex-rigid board structure, which has a good board surface structure, good copper foil flatness and no crack, and is convenient for smooth proceeding in subsequent wet processes such as electroplating process, cleaning process and the like, so that the occurrence of circuit board waste reporting condition can be reduced.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (7)
1. The processing method of the rigid-flex printed circuit board jointed board is characterized by comprising the following steps of:
providing a circuit board main body, wherein the circuit board main body is provided with a plurality of circuit board areas which are arranged in an array, the circuit board areas comprise flexible areas and rigid-flexible combination areas, and a bonding area is arranged between two adjacent circuit board areas;
laminating a prepreg on the circuit board main body, wherein the prepreg is provided with a plurality of windowing areas which are arranged in an array manner, and the positions of the windowing areas are arranged in one-to-one correspondence with the positions of the flexible areas;
Laminating a copper foil on the prepreg, wherein the copper foil is bonded with the rigid-flex bonding area and the bonding area through the prepreg, and
Laminating, namely laminating the processed spliced circuit board main body, the prepreg and the copper foil according to a design sequence by using a laminating machine.
2. The method for processing a rigid-flex printed board jigsaw as set forth in claim 1, wherein said step of laminating a copper foil on said prepreg further includes a windowing process of windowing said prepreg with a numerically controlled machine tool to obtain said windowing region.
3. The method for processing a flexible-rigid board panel according to claim 1, wherein the step of laminating further comprises the steps of:
drilling, fixing the circuit board on a workbench of a drilling machine, starting the drilling machine, drilling according to a preset hole position, and
Electroplating, and depositing a layer of metal on the surface of the circuit board.
4. The method of claim 3, wherein the plating comprises plating the whole board, pattern plating and hole wall plating.
5. The method of claim 3, wherein the step of electroplating further comprises removing plating-resistant ink outside the plating area during the electroplating process.
6. The method for processing the rigid-flex printed circuit board jointed board according to claim 1, further comprising the following processing steps:
circuit manufacturing, namely forming a required circuit pattern on the copper foil;
Printing solder resist ink, coating a layer of solder resist ink on the circuit board, and
And (3) silk-screen printing a circuit board, and printing mark information on the circuit board.
7. The flex-rigid board jointed board structure is characterized by being manufactured by adopting the flex-rigid board jointed board processing method according to any one of claims 1 to 6, and comprises a circuit board main body, circuit board jointed boards, prepregs and copper foils, wherein the circuit board jointed boards are arranged in an array manner in the circuit board area of the circuit board main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411227514.0A CN119212260A (en) | 2024-09-03 | 2024-09-03 | A method for processing rigid-flexible composite board and a rigid-flexible composite board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411227514.0A CN119212260A (en) | 2024-09-03 | 2024-09-03 | A method for processing rigid-flexible composite board and a rigid-flexible composite board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119212260A true CN119212260A (en) | 2024-12-27 |
Family
ID=94051562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411227514.0A Pending CN119212260A (en) | 2024-09-03 | 2024-09-03 | A method for processing rigid-flexible composite board and a rigid-flexible composite board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119212260A (en) |
-
2024
- 2024-09-03 CN CN202411227514.0A patent/CN119212260A/en active Pending
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