CN119199209B - A bimetallic structure probe - Google Patents
A bimetallic structure probe Download PDFInfo
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- CN119199209B CN119199209B CN202411707209.1A CN202411707209A CN119199209B CN 119199209 B CN119199209 B CN 119199209B CN 202411707209 A CN202411707209 A CN 202411707209A CN 119199209 B CN119199209 B CN 119199209B
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- 239000000523 sample Substances 0.000 title claims abstract description 153
- 239000002184 metal Substances 0.000 claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 238000001514 detection method Methods 0.000 claims abstract description 71
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims abstract description 7
- 238000003490 calendering Methods 0.000 claims abstract description 4
- 150000002739 metals Chemical class 0.000 claims abstract description 4
- 238000003860 storage Methods 0.000 claims description 26
- 238000009434 installation Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000013459 approach Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- LAHWLEDBADHJGA-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 LAHWLEDBADHJGA-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
本申请公开了一种双金属结构探针，属于芯片检测技术领域。主要包括探针机构，该探针机构具有PCB板，所述PCB板上安装有探针座，所述探针座上开设有多组安装槽；探针组，所述探针组包括：第一金属探针，所述第一金属探针的一端突出所述探针座的表面并形成弧形部，所述弧形部上设置有检测头；所述第一金属探针的弧形部上设置有弧形的长槽，所述长槽内设置有第二金属探针，所述第一金属探针及所述第二金属探针采用热膨胀系数不同的金属用特殊压延工艺制成带料。本申请的一种双金属结构探针，通过移动触摸传感器到达指定位置，以检测是否与第一金属探针的检测头接触，并根据感应结果判断第一金属探针的检测头是否磨损或变形。
The present application discloses a bimetallic structure probe, which belongs to the field of chip detection technology. It mainly includes a probe mechanism, which has a PCB board, a probe seat is installed on the PCB board, and a plurality of mounting grooves are provided on the probe seat; a probe group, which includes: a first metal probe, one end of the first metal probe protrudes from the surface of the probe seat and forms an arc-shaped portion, and a detection head is provided on the arc-shaped portion; an arc-shaped long groove is provided on the arc-shaped portion of the first metal probe, and a second metal probe is provided in the long groove, and the first metal probe and the second metal probe are made of metals with different thermal expansion coefficients using a special calendering process to form strips. A bimetallic structure probe of the present application detects whether it is in contact with the detection head of the first metal probe by moving the touch sensor to a specified position, and judges whether the detection head of the first metal probe is worn or deformed according to the sensing result.
Description
Technical Field
The application relates to the technical field of chip detection, in particular to a bimetal structure probe.
Background
The probe is usually in a very fine metal needle structure, and in the chip production process, the detection probe can contact with pins or internal test points of the chip to transfer electric signals so as to detect whether the chip can work normally, for example, whether input and output signals of the chip accord with expectations or not, and whether a circuit has a short circuit or an open circuit or other problems;
In chip detection, a probe is usually arranged on a test fixture (also called a test seat), the test seat is a key component for connecting a chip and test equipment in chip test, the test seat is matched with Automatic Test Equipment (ATE), the ATE can send various excitation signals and transmit the excitation signals to the chip through the probe, and meanwhile, the probe receives signals fed back by the chip, so that functions, performance parameters and the like of the chip are detected, and a plurality of key indexes such as whether the logic function of the chip is correct, whether the running speed reaches the standard or not are detected;
When the existing probe and the integrated chip on the test seat are in contact detection, the probe is moved to the corresponding contact point of the chip through an external auxiliary device, then a certain contact pressure is applied to the probe, and then the test device sends a signal to the chip through the probe so as to detect the electrical characteristics of the chip, however, the external device is needed for the contact of the probe and the integrated chip, the performance of the chip and the probe can be influenced by factors such as environment and static electricity when the probe and the chip are in a connection state for a long time after the detection, the quick response is difficult to realize, the flexibility of the test is reduced, and meanwhile, the existing probe cannot meet the test requirements of different connection states when the probe is needed to be realized at different temperatures, so that the problem is solved by providing a bimetal structure probe.
It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and, therefore, it may contain information that does not constitute prior art.
Disclosure of Invention
Based on the problems in the prior art, the application aims to provide a bimetal structure probe so as to realize the test requirements of different connection states of chips at different temperatures, and simultaneously realize deformation or abrasion detection of a detection head of a first metal probe so as to ensure accurate connection when the probe is contacted with an integrated chip.
The technical scheme includes that the probe mechanism comprises a PCB, a plurality of groups of mounting grooves are formed in the PCB, the probe seat is mounted on the PCB, the probe group is mounted in the mounting grooves and comprises a first metal probe, one end of the first metal probe protrudes out of the surface of the probe seat to form an arc-shaped portion, a detection head is arranged on the arc-shaped portion, an arc-shaped long groove is formed in one surface, away from the detection head, of the arc-shaped portion of the first metal probe, a second metal probe is arranged in the long groove, and the first metal probe and the second metal probe are manufactured into a belt material by a special calendaring process through metals with different thermal expansion coefficients.
Further, a plurality of groups of detection mechanisms are arranged on the probe seat, each detection mechanism comprises a mounting plate arranged on two sides of the probe seat, each mounting plate is provided with an open slot, a sliding block is slidably arranged in each open slot, a first spring is arranged on the side face of each sliding block, and the other end of each first spring is connected with the top end of the inner wall of each open slot;
The two sets of sliding blocks are connected and provided with supporting plates, vertical plates are arranged on the supporting plates, storage bins are arranged on the vertical plates in a penetrating mode, the storage bins are of hollow structures, two sets of bin gates are hinged to openings of the storage bins, one set of bin gates are provided with touch sensors, one end of each probe base is provided with a first cylinder, and telescopic ends of the first cylinders are connected with the sliding blocks
Further, a third cylinder is arranged on two sides of the storage bin, a hinge joint is arranged on a telescopic shaft of the third cylinder, two groups of connecting plates are hinged on the hinge joint, and one end of each connecting plate is movably connected with the side end of the bin door.
Further, a fixing seat is arranged in the storage bin and provided with a T-shaped sliding groove, two groups of clamping plate seats are slidably arranged in the T-shaped sliding groove, a second spring is connected between the clamping plate seats and the inner wall of the storage bin, a clamping head sleeve is clamped between the two groups of clamping plate seats, and the clamping head sleeve and the first metal probe are made of the same metal material.
Further, the upper end and the lower end of the inner wall of the chuck sleeve are movably inserted with buckling rods, one end of each buckling rod is provided with a hemispherical convex block, the first metal probe is provided with a groove matched with the convex block, the buckling rods are movably sleeved with third springs, one ends of the third springs are connected with the inner wall of the chuck sleeve, and the other ends of the third springs are connected with the convex blocks.
Further, a connecting seat is arranged on one surface, far away from the supporting plate, of the sliding block, a square groove matched with the width of the connecting seat is formed in the bottom surface of the mounting plate, a control plate is arranged at one end of the connecting seat, and the control plate is provided with a first slideway which is vertically arranged;
The side-mounting type detector comprises a detector seat, wherein a mounting seat is arranged on the side surface of the detector seat, a control rod is hinged to the mounting seat, a control ball is arranged at one end of the control rod, the control ball is an elastic ball, the control ball is positioned in a first slide way in a default state, a second slide way is communicated with the first slide way, and the bottom position of the second slide way is lower than that of the first slide way.
Further, a third slide way is arranged on the second slide way in a communicated mode, the bottom of the third slide way is lower than that of the second slide way, a first step is arranged between the third slide way and the second slide way, a first vertex is arranged at the communication position of the third slide way and the second slide way, and the first vertex is located in the third slide way.
Further, a fourth slideway is communicated with the third slideway, the bottom of the fourth slideway is lower than that of the third slideway, and a second step is arranged between the fourth slideway and the third slideway;
The third slide way is communicated with the fifth slide way, the bottom height of the fifth slide way is lower than that of the fourth slide way, a third step is arranged between the fourth slide way and the fifth slide way, a second vertex is arranged at the communication position of the fourth slide way and the fifth slide way, the second vertex is positioned on the fifth slide way, and the heights of the second vertex and the first vertex are different.
Further, install the second cylinder on the control panel, the dog is installed to the flexible end of second cylinder, the upper surface of dog is the incline condition, the third slide with the fifth slide transition forms smoothness, the dog is suitable for along with the flexible end of second cylinder goes up and down, in order with form between the third slide and supply the stay point that the control ball stopped or form and supply the sixth slide that the control ball passed through, stay point department is in the side position of dog simultaneously and is provided with the second switch.
Further, the elastic force of the third spring is larger than that of the second spring.
The bimetal structure probe provided by the application has the beneficial effects that through the arrangement of the probe mechanism and the detection mechanism, the touch sensor is moved to a designated position to detect whether the bimetal structure probe contacts with the detection head of the first metal probe, and whether the detection head of the first metal probe is worn or deformed is judged according to the induction result, so that the detection head of the first metal probe is provided with the clamping sleeve, and the connection point of the first metal probe and the integrated chip is tightly contacted.
In addition to the objects, features and advantages described above, the present application has other objects, features and advantages. The present application will be described in further detail with reference to the drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
FIG. 1 is a schematic view of a probe with a bimetal structure according to the present application;
FIG. 2 is a schematic view of a part of the structure of FIG. 1;
FIG. 3 is a schematic view of the probe mechanism of FIG. 1;
FIG. 4 is a schematic diagram of the detection mechanism in FIG. 2;
FIG. 5 is an enlarged schematic view of area A of FIG. 4;
FIG. 6 is an enlarged schematic view of area B of FIG. 4;
FIG. 7 is an enlarged schematic view of region C of FIG. 5;
FIG. 8 is a schematic view of the bottom structure of the control panel of FIG. 6;
wherein, each reference sign in the figure:
1. The device comprises a probe mechanism, 101, a PCB, 102, a probe seat, 103, a mounting groove, 104, a first metal probe, 105, a second metal probe, 106, a detection head, 107, a long groove, 108 and a groove;
201. 202, tin balls;
3. The device comprises a detection mechanism, 301, a mounting plate, 302, a sliding block, 303, a first spring, 304, an extension rod, 305, a first cylinder, 306, a supporting plate, 307, a vertical plate, 308, a control plate, 309, a connecting seat, 310, a mounting seat, 311, a control rod, 312, a first slideway, 313, a second slideway, 314, a first vertex, 315, a third slideway, 316, a fourth slideway, 317, a second vertex, 318, a fifth slideway, 319, a second cylinder, 320, a stop block, 321, a sixth slideway, 322, a storage bin, 323, a bin door, 324, a touch sensor, 325, a third cylinder, 326, a hinge joint, 327, a connecting plate, 328, a fixing seat, 329, a clamping plate seat, 330, a second spring, 331, a clamping head sleeve, 332, a buckling rod, 333, a third spring, 334 and a bump.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
In order to test a chip in a high temperature environment to test the chip to realize different connection states at different temperatures, as shown in fig. 1-3, the application provides a bimetal structure probe, which comprises a probe mechanism 1, wherein the probe mechanism 1 is used for performing performance test on an integrated chip 201, and it is noted that a solder ball 202 is arranged on the integrated chip 201, and the solder ball 202 is suitable for contacting with the probe mechanism 1 and forming electric connection;
The probe mechanism 1 comprises a PCB 101, wherein a probe seat 102 is fixedly arranged on the PCB 101, a plurality of groups of mounting grooves 103 are formed in the probe seat 102, and probe groups are arranged in the mounting grooves 103;
The probe set comprises a first metal probe 104 fixedly installed in a mounting groove 103, one end of the first metal probe 104 protrudes out of the surface of a probe seat 102 and forms an arc-shaped part, a detection head 106 is arranged on the arc-shaped part, and the detection head 106 is suitable for being contacted with a solder ball 202 on an integrated chip 201 so as to form a conducting circuit, so that the performance of the integrated chip 201 is detected;
Meanwhile, an arc-shaped long groove 107 is arranged on one surface of the arc-shaped part of the first metal probe 104, which is far away from the detection head 106, and a second metal probe 105 is arranged in the long groove 107, wherein the first metal probe 104 and the second metal probe 105 are made into a strip material by adopting a special calendaring process by adopting metals with different thermal expansion coefficients, and the thermal expansion coefficient of the second metal probe 105 is larger than that of the first metal probe 104;
When the integrated chip 201 is detected, the probe mechanism 1 and the integrated chip 201 are both in a closed environment to control the temperature of the first metal probe 104 and the second metal probe 105;
in summary, when the integrated chip 201 needs to be tested in a high-temperature environment, the external lifting device drives the integrated chip 201 to move above the probe set, so that the solder ball 202 on the integrated chip 201 is located at one side of the first metal probe 104, at this time, the system is in a normal temperature state, and the detection head 106 on the first metal probe 104 is not contacted with the solder ball 202, thereby realizing an open circuit state in the normal temperature state;
Then, the probe group is heated to a specified temperature through an external heating device, so that when the temperature is gradually increased, the first metal probe 104 is bent due to larger thermal deformation of the second metal probe 105, and the detection head 106 is contacted with the solder ball 202 on the integrated chip 201, so that conduction is realized, current transmission is realized, signals are transmitted in a loop, and the integrated chip 201 is tested at a high temperature;
After the test is completed, the separation of the test head 106 and the solder balls 202 can be achieved by reducing the temperature.
In the second embodiment, the probes on the test probe seat 102 are frequently electrified in close contact with the solder balls 202 on the chip under the control of temperature, however, under the long-time test operation, the part of the probe detection head 106 is easy to wear and even bend seriously;
In order to detect the state of the detection head 106, as shown in fig. 4 to 6, a plurality of groups of detection mechanisms 3 are mounted on the probe holder 102, the detection mechanisms 3 are used for detecting the first metal probes 104 used for a long time, and the detection mechanisms 3 comprise mounting plates 301 fixedly mounted on two sides of the probe holder 102, and the mounting plates 301 are provided with open slots (not shown in the drawings);
A sliding block 302 is slidably installed in the opening groove, a first spring 303 is fixedly installed on the side surface of the sliding block 302, the other end of the first spring 303 is connected with the top end of the inner wall of the opening groove, the first spring 303 is suitable for limiting the position of the sliding block 302 in the opening groove, an extending rod 304 is fixedly installed on the side surface of the sliding block 302, the extending rod 304 sequentially penetrates through the first spring 303 and the mounting plate 301, and the extending rod 304 is suitable for linearly limiting the extension of the first spring 303;
Meanwhile, a supporting plate 306 is connected and installed between two groups of sliding blocks 302, a vertical plate 307 is fixedly installed on the supporting plate 306, a storage bin 322 is penetratingly installed on the vertical plate 307, the storage bin 322 is of a hollow structure, two groups of bin gates 323 are hinged at the opening of the storage bin 322, a touch sensor 324 is fixedly installed on one group of bin gates 323, and a device for detecting whether an object is contacted with the touch sensor 324 is mainly realized through a mechanical structure or electronic induction;
and a first cylinder 305 is fixedly installed at one end of the probe seat 102, the telescopic end of the first cylinder 305 is connected with the slide block 302, the first cylinder 305 is suitable for pushing the slide block 302 to move in the opening groove and pressing the first spring 303, so as to be suitable for driving the storage bin 322 on the vertical plate 307 to gradually approach the detection head 106, and in the initial state, the two groups of bin gates 323 are in the closed state, so that when the bin gates 323 approach the detection head 106, the touch sensor 324 contacts with the detection head 106 to detect the position of the detection head 106, and further judge whether the detection head 106 is worn in the multiple detection processes:
When the detecting head 106 can contact with the touch sensor 324 in the free state, it is indicated that the detecting head 106 can contact with the solder ball 202 to conduct electricity during detection, and then the detecting head 106 is judged to be in a qualified state, and when the detecting head 106 cannot contact with the touch sensor 324 in the free state, it is indicated that the detecting head 106 cannot contact with the solder ball 202 to conduct electricity during detection, and then the detecting head 106 is judged to be in a disqualified state, namely, the detecting head 106 is judged to be in a worn state, and at the moment, the detecting head 106 needs to be replaced;
in order to automatically process the worn detection head 106 to solve the problem of affecting the detection accuracy when the detection head 106 is worn or deformed, with continued reference to fig. 4 to 6, a third cylinder 325 is fixedly installed at both sides of the storage bin 322, while a hinge 326 is fixedly installed on a telescopic shaft of the third cylinder 325, and two sets of connection plates 327 are hinged on the hinge 326, one end of the connection plates 327 is movably connected with the side ends of the bin gates 323, the third cylinder 325 is adapted to drive the two sets of bin gates 323 away from each other in an extended state to open the opening of the storage bin 322, and the third cylinder 325 is adapted to drive the two sets of bin gates 323 to be close to each other in a contracted state to close the opening of the storage bin 322;
As shown in fig. 5-7, a fixing seat 328 is fixedly installed in the bin 322, the fixing seat 328 has a T-shaped chute (not shown), two sets of clamping plate seats 329 are slidably installed in the T-shaped chute, a second spring 330 is connected between the clamping plate seats 329 and the inner wall of the bin 322, the two sets of clamping plate seats 329 are suitable for being mutually close under the action of the second spring 330, and a clamping sleeve 331 is clamped between the two sets of clamping plate seats 329, the clamping sleeve 331 and the first metal probe 104 are made of the same metal material so as to ensure the electrical connection between the first metal probe 104 and the integrated chip 201;
A buckling rod 332 is movably inserted into the upper end and the lower end of the inner wall of the chuck sleeve 331, one end of the buckling rod 332 is provided with a hemispherical protruding block 334, meanwhile, a groove 108 (as shown in fig. 2) matched with the protruding block 334 is formed in the first metal probe 104, a third spring 333 is movably sleeved on the buckling rod 332, one end of the third spring 333 is connected with the inner wall of the chuck sleeve 331, the other end of the third spring 333 is connected with the protruding block 334, and the two groups of protruding blocks 334 are suitable for being mutually close under the action of the third spring 333;
note that, the elastic force of the third spring 333 is greater than that of the second spring 330;
When the touch sensor 324 detects that the detection head 106 is in a wearing state, the third air cylinder 325 is controlled to extend so as to enable the two groups of bin gates 323 to be opened, the chuck sleeve 331 faces the detection head 106 at the moment, and is driven by the first air cylinder 305 so as to enable the chuck sleeve 331 to be gradually close to the detection head 106 of the first metal probe 104, and when the telescopic end of the first air cylinder 305 reaches a limit position, the chuck sleeve 331 is completely sleeved on the detection head 106 at the moment, and the protruding block 334 in the inner cavity of the chuck sleeve 331 is fastened in the groove 108 under the action of the third spring 333, and when the third air cylinder 325 is reset, the chuck sleeve 331 is still sleeved on the detection head 106 so as to enable the detection head 106 to be put into use again;
In order to automatically control the above-mentioned inspection process and the repair process of the inspection head 106, as shown in fig. 6 and 8, a connection seat 309 is fixedly installed on one surface of the slider 302 far from the supporting plate 306, a square groove (not shown in the figure) with a width adapted to that of the connection seat 309 is formed on the bottom surface of the mounting plate 301, a control board 308 is fixedly installed on one end of the connection seat 309, the control board 308 has a first slide way 312 which is vertically formed, an installation seat 310 is fixedly installed on the side surface of the probe seat 102, a control rod 311 is hinged on the installation seat 310, one end of the control rod 311 has a control ball which is an elastic ball, and the control ball is in the first slide way 312 in a default state;
and a second slideway 313 is communicated with the first slideway 312, and the bottom of the second slideway 313 is lower than that of the first slideway 312, so that when the control ball slides into the second slideway 313 from the first slideway 312, the control ball cannot return to the first slideway 312 from the second slideway 313;
A third slideway 315 is communicated with the second slideway 313, the bottom of the third slideway 315 is lower than the bottom of the second slideway 313, and a first step is arranged between the third slideway 315 and the second slideway 313, so that after a control ball slides into the third slideway 315 from the second slideway 313, the control ball cannot return to the second slideway 313 from the third slideway 315, and a first vertex 314 is arranged at the communication part of the third slideway 315 and the second slideway 313, and the first vertex 314 is positioned in the third slideway 315;
It should be noted that, in the default state, when the first cylinder 305 drives the slider 302 to move to the designated stroke, that is, when the control ball slides and abuts against the first vertex 314, the touch sensor 324 on the storage bin 322 just contacts the detection head 106 of the first metal probe 104;
When the integrated chip 201 is detected, the first cylinder 305 is started to push the sliding block 302, the sliding block 302 drives the vertical plate 307 to move and simultaneously extrudes the first spring 303, the vertical plate 307 synchronously drives the touch sensor 324 on the storage bin 322 to approach the detection head 106 of the first metal probe 104, meanwhile, the control ball synchronously slides into the second slide way 313 from the first slide way 312, and when the telescopic end of the first cylinder 305 reaches a specified stroke, the control ball abuts against the first vertex 314, and at the moment, the touch sensor 324 on the storage bin 322 approaches the detection head 106 of the first metal probe 104 and detects whether the touch sensor 324 contacts with the detection head 106 of the first metal probe 104 to judge whether the storage bin is deformed or worn;
A fourth slide way 316 is communicated with the third slide way 315, the bottom of the fourth slide way 316 is lower than the bottom of the third slide way 315, and a second step (not shown) is arranged between the fourth slide way 316 and the third slide way 315, so that when the control ball slides into the fourth slide way 316 from the third slide way 315, the control ball cannot return to the third slide way 315 from the fourth slide way 316;
And a fifth slide way 318 is communicated with the fourth slide way 316, the bottom of the fifth slide way 318 is lower than the bottom of the fourth slide way 316, and a third step (not shown) is arranged between the fourth slide way 316 and the fifth slide way 318, so that when the control ball slides into the fifth slide way 318 from the fourth slide way 316, the control ball cannot return to the fourth slide way 316 from the fifth slide way 318, a second vertex 317 is arranged at the communication position between the fourth slide way 316 and the fifth slide way 318, the second vertex 317 is positioned in the fifth slide way 318, and the height of the second vertex 317 is different from the height of the first vertex 314;
As shown in fig. 6 to 8, a second cylinder 319 is fixedly installed on the control board 308, a stop block 320 is fixedly installed at the telescopic end of the second cylinder 319, the upper surface of the stop block 320 is in an inclined state, so that the third slide rail 315 and the fifth slide rail 318 are in transition and smooth, the stop block 320 is suitable for lifting along with the telescopic end of the second cylinder 319, a stop point (not shown in the figure) for stopping a control ball or a sixth slide rail 321 (shown in fig. 6) for passing the control ball is suitable for being formed between the stop block 320 and the third cylinder 325 is controlled to be in an activated state by a second switch (not shown in the figure) at the stop point, namely, at the side surface position of the stop block 320;
In a default state, the second cylinder 319 is in a closed state, so that the stopper 320 is not lifted to form a sixth slide 321;
Therefore, when the first cylinder 305 is started to drive the touch sensor 324 to approach the detection head 106 of the first metal probe 104 and detect whether the touch sensor is in contact with the detection head 106 of the first metal probe 104 to determine whether the touch sensor 324 is deformed or worn, when the touch sensor 324 senses that the detection head 106 of the first metal probe 104 does not have wear, the slider 302 is driven by the first spring 303 to reset the vertical plate 307 along with the reset of the first cylinder 305, the vertical plate 307 drives the touch sensor 324 to be far away from the detection head 106 of the first metal probe 104, at the moment, the control ball synchronously slides into the third slide 315 from the first vertex 314 and slides into the sixth slide 321 from the third slide 315, finally slides into the fifth slide 318 and returns to the first slide 312 from the sixth slide 321, at the moment, the detection of the detection head 106 of the first metal probe 104 is completed, so that the first metal probe 104 is prevented from being used for multiple times, the detection head 106 of the first metal probe 104 is worn or deformed, and the detection accuracy is reduced;
When the touch sensor 324 does not sense, it is indicated that the detecting head 106 of the first metal probe 104 is worn or deformed at this time, the touch sensor 324 sends a signal to the second cylinder 319, and drives the stop block 320 to move upwards through the second cylinder 319 to form a stopping point, so that along with the reset of the first cylinder 305, the slide block 302 drives the vertical plate 307 to reset under the action of the first spring 303, the vertical plate 307 drives the touch sensor 324 to move away from the detecting head 106 of the first metal probe 104, at this time, the control ball synchronously slides into the third slide way 315 from the first vertex 314, slides into the position of the stopping point from the third slide way 315, and presses the second switch, at this time, the third cylinder 325 is synchronously started, and the telescopic end of the third cylinder 325 stretches out and drives one ends of the two groups of bin gates 323 to move away from each other, i.e. one end of the bin 322 is in an open state;
And a first switch (not shown) is disposed in the first slide 312, and the first switch is used to control the third cylinder 325 and the second cylinder 319 to be in a closed state;
Then, the first cylinder 305 is started again to drive the vertical plate 307 to move and squeeze the first spring 303 again, at this moment, the control ball slides into the fourth slideway 316 through the stay point, and along with the first cylinder 305 reaching the limit stroke, the control ball gradually approaches and abuts against the second vertex 317, at this moment, the vertical plate 307 synchronously drives the storage bin 322 in the open state to approach the detection head 106 of the first metal probe 104, when the control ball completely abuts against the second vertex 317, at this moment, the clamp sleeve 331 is sleeved on the detection head 106 of the first metal probe 104, and at the same time, the clamp sleeve 331 is clamped in the groove 108 under the action of the third spring 333 through the bump 334, so as to fix the clamp sleeve 331 on the detection head 106 of the first metal probe 104;
Along with the reset of the first cylinder 305, the vertical plate 307 drives the storage bin 322 to gradually move away from the first metal probe 104 under the action of the first spring 303, at this time, the control ball synchronously slides into the fifth slide way 318 from the second vertex 317, then slides into the first slide way 312 from the fifth slide way 318, and presses the first switch, so as to control the third cylinder 325 and the second cylinder 319 to reset, so that the bin gate 323 is closed, and meanwhile, the sixth slide way 321 is opened, so as to restore the initial state;
Therefore, the touch sensor 324 is moved to reach a designated position to detect whether the touch sensor contacts with the detection head 106 of the first metal probe 104, and the detection head 106 of the first metal probe 104 is judged to be worn or deformed according to the sensing result, so that the detection head 106 of the first metal probe 104 is provided with the clamping head sleeve 331, the connection point of the first metal probe 104 and the integrated chip 201 is tightly contacted, the transmission current is a signal in a loop, the integrated chip 201 is tested at a high temperature, and the contact effect of the connection point of the first metal probe 104 and the integrated chip 201 is prevented from being influenced by the wear or deformation, and the testing accuracy is further influenced.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (7)
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| KR20090086037A (en) * | 2008-02-05 | 2009-08-10 | 야마이치덴키 가부시키가이샤 | Probe unit |
| CN115638720A (en) * | 2022-10-08 | 2023-01-24 | 之江实验室 | A kind of probe structure flexible tactile sensor and its preparation method |
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| CA2203405C (en) * | 1994-10-24 | 2009-04-28 | Andrew L. Pearlman | Impedance imaging devices and multi-element probe |
| KR100678480B1 (en) * | 2005-07-25 | 2007-02-02 | 삼성전자주식회사 | Probe card, test device having this probe card, and test method using this test device |
| KR100962130B1 (en) * | 2008-06-05 | 2010-06-10 | (주)유비프리시젼 | Direct contact probe card |
| CN101676733A (en) * | 2008-09-17 | 2010-03-24 | 汉民测试系统科技股份有限公司 | Structure of integrated circuit test probe card |
| CN208654208U (en) * | 2018-08-16 | 2019-03-26 | 惠州铭奥自动化科技有限公司 | DIP4 arranges the electrical testing of foot product and increases double probe structures |
| CN213750274U (en) * | 2020-06-24 | 2021-07-20 | 甘肃奇雅科技有限公司 | Detection clamp for automatic electric leakage detection table |
| CN217820521U (en) * | 2022-06-29 | 2022-11-15 | 上海晟衡检测技术有限公司 | Probe base |
| CN218885992U (en) * | 2022-12-27 | 2023-04-18 | 深圳市新威尔电子有限公司 | Lithium battery large-current probe test equipment |
| CN220671590U (en) * | 2023-08-29 | 2024-03-26 | 安徽得壹能源科技有限公司 | Detection device for probe plate of needle bed |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090086037A (en) * | 2008-02-05 | 2009-08-10 | 야마이치덴키 가부시키가이샤 | Probe unit |
| CN115638720A (en) * | 2022-10-08 | 2023-01-24 | 之江实验室 | A kind of probe structure flexible tactile sensor and its preparation method |
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