CN119172972A - An electronic device with triple liquid cooling cycle - Google Patents

Abstract

The invention discloses an electronic device with triple liquid cooling circulation, which comprises a first closed shell, a circuit motherboard and a liquid cooling heat dissipation module, wherein the first closed shell is provided with a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, the circuit motherboard is arranged in the first closed shell and is electrically connected with a first heating element, the liquid cooling heat dissipation module is coupled to the first heating element and comprises a first vapor cavity element and a second closed shell, the second closed shell is provided with a second heat exchange cavity, a third liquid inlet and a third liquid outlet, wherein the first heat exchange cavity, the first liquid inlet and the first liquid outlet form a first flow channel for circulating a first cooling liquid, the second heat exchange cavity, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for circulating a second cooling liquid, and the inside of the first vapor cavity element forms a third flow channel for circulating a third cooling liquid in a two-phase flow mode.

Description

Electronic device with triple liquid cooling circulation

Technical Field

The present invention relates to an electronic device, and more particularly, to an electronic device with triple liquid cooling circulation. The device integrates the functions of two-phase flow circulation of a Vapor Chamber (Vapor Chamber), cooling liquid circulation of a Cold Plate (Cold Plate), cooling liquid circulation of Immersion (Immersion) and the like. When the liquid inlet and the liquid outlet of the electronic device are connected with two external cooling liquid circulation systems, heat generated by various electronic elements in the electronic device can be effectively transferred out of the electronic device.

Background

The conventional server liquid cooling technology of data center mainly includes Cold Plate (Cold Plate) liquid cooling technology and Immersion (Immersion) liquid cooling technology.

The cold plate type liquid cooling heat dissipation is to install a cold plate heat dissipation module on a high-power chip (such as a central processing unit (Central Processing Unit, CPU), a graphic processing unit (Graphics Processing Unit, GPU) and an artificial intelligence (ARTIFICIAL INTELLIGENCE, AI) chip) on a circuit motherboard in a server, and then to connect circulating cooling liquid to a water inlet and a water outlet of the cold plate heat dissipation module. The micro flow channel in the water cooling plate is used for carrying out heat exchange with the wafer, and the heated hot water is taken away from the water cooling plate, so that the aim of reducing the temperature of the wafer is fulfilled. However, there are some problems with this cold plate type liquid cooling heat dissipation technique. First, the water cooling plate type liquid cooling heat dissipation module using the micro flow channel as heat dissipation has an upper limit of heat dissipation power, which cannot meet the trend demand of increasing heat design power (TDP) of high-power chips. In the prior art, when the power of a single chip reaches more than 500W, the surface of the water cooling plate has the limit of heat dissipation. Second, the heat generated by the high power chip can be dissipated by the heat dissipation module, and other electronic heating elements are also arranged in the server. However, these electronic heating elements are currently only cooled by a fan. But the heat discharged by the fan is discharged into the room of the data center, thereby causing the room temperature in the room to rise. Therefore, air conditioning is also required to reduce the indoor temperature in the machine room, so that the reduction of the overall PUE (Power Usage Effectiveness, PUE) value of the data center is also faced with a bottleneck.

The immersion liquid cooling technology is to immerse the whole circuit motherboard and the electronic heating element of the server in the non-conductive liquid directly, and to conduct the heat energy generated during the operation of the server to the cooling liquid directly. Conventional immersion liquid cooling techniques can be classified into the following two types according to the operation principle. The first, single-phase immersion liquid cooling technique operates by immersing a heat source into a thermally conductive dielectric liquid tank, and synthesizing an electrically non-conductive liquid from a hydrocarbon compound having a high boiling point and a low viscosity. The second two-phase immersion liquid cooling technology is operated by immersing the heat source into low-viscosity non-conductive cooling liquid, taking away heat generated by the heat source through direct contact between the cooling liquid and the heat source and liquid circulation, transferring the heat from the liquid pool to the space outside the pool due to the low-temperature boiling process of the liquid, and cooling and condensing the vapor again to flow back to the cooling liquid pool through heat exchange, such as a condenser tube, so as to achieve the purpose of heat dissipation by continuous circulation. However, the cooling liquid (i.e., fluorocarbon) used in conventional two-phase immersion liquid cooling systems is an artificial hazardous chemical. If the vapor of the fluorocarbon is vaporized during the heat dissipation of the system, it may be dispersed by air, which may further cause corrosion and pollution in personnel or in the environment or equipment.

Furthermore, with advances in technology and consumer demand, the performance requirements of the electronic product chip are also increasing, for example, the power of a single chip such as data center server has reached 500W or 700W, and even there is a demand for high-power chip product design with power exceeding 1,000W in the future. Under normal circumstances, the conventional power utilization efficiency (Power Usage Effectiveness, PUE) is used as a standard for measuring the energy saving and power saving of the computing data center. The lower the PUE value, the less power is consumed, and the ideal PUE value is 1 (i.e., 100% of the electrical energy is converted into computer power for use). However, in practical applications, the conventional server generates a large amount of heat energy during the operation (calculation) and the chip is overheated or even burned out if there is no good heat dissipation system. Therefore, for the shortage of the prior art and the future development of more high-power chips, a cooling system with higher efficiency for heat dissipation is required to be designed, so that the PUE value approaches to 1, thereby reducing the electricity cost and simultaneously providing a heat dissipation device with environmental protection requirements.

Disclosure of Invention

The present invention is directed to an electronic device with triple liquid cooling circulation, which can realize different layersThe heat exchange and heat transfer of the server can achieve better heat dissipation and electricity saving effects, and the server can be manufactured into an independent electronic device with the functions of cooling plates and immersed liquid cooling heat dissipation. When the liquid inlet and the liquid outlet of the server are connected with external circulating cooling liquid, heat generated by all electronic elements in the server can be efficiently transferred and discharged outside a server cabinet, and even transferred and discharged outside a data center for centralized processing and effective application, so that the heat dissipation efficiency of the whole server is effectively improved, and the PUE value of the whole data center is reduced, and the conventional problems are solved.

In order to achieve the above object, the present invention discloses an electronic device with triple liquid cooling circulation, which is characterized by comprising:

The first closed shell is provided with a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, and the first liquid inlet and the first liquid outlet are respectively communicated with the first heat exchange cavity;

a circuit motherboard disposed in the first sealed housing and located in the first heat exchange cavity and electrically connected with a first heating element, and

The liquid cooling heat dissipation module is coupled to the first heating element and comprises a second closed shell and a first vapor cavity element, the second closed shell is provided with a second heat exchange cavity, a third liquid inlet and a third liquid outlet, the third liquid inlet and the third liquid outlet are respectively communicated with the second liquid inlet and the second liquid outlet, the first vapor cavity element is arranged in the second heat exchange cavity, and the first vapor cavity element is provided with a heat absorption end and a condensation end;

The first heat exchange cavity, the first liquid inlet and the first liquid outlet form a first flow channel for circulating a first cooling liquid, the second heat exchange cavity, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for circulating a second cooling liquid, a third flow channel is formed in the first vapor cavity element for circulating a third cooling liquid, the heat absorbing end of the first vapor cavity element is clung to the first heating element, and the condensing end of the first vapor cavity element is immersed in the second cooling liquid.

The first enclosure is a enclosure conforming to 1u size, the electronic device may be disposed in a combined cabinet frame, and the electronic device may be a server or a communication device.

The first heating element is arranged on the circuit sub-board, and the circuit sub-board, the first heating element and the liquid cooling heat dissipation module form an electronic component with a heat dissipation function.

The liquid cooling heat dissipation module comprises a copper upper cover and a copper lower cover, wherein the copper lower cover is provided with a first area and a second area which are opposite to the copper upper cover, the first area is provided with a first lower surface, the second area is provided with a second lower surface and a second upper surface, when the copper upper cover is jointed with the first area of the copper lower cover, the first vapor cavity element is formed, the first lower surface of the first area is used for contacting the first heat generation element, and the second lower surface of the second area is used for contacting the second heat generation element.

The electronic component further comprises a half-open shell connected to the copper lower cover to form the second closed shell and the second heat exchange cavity, wherein the second heat exchange cavity is used for accommodating the copper upper cover and the second upper surface of the second area, and the third liquid inlet and the third liquid outlet are arranged on the half-open shell.

The electronic component further comprises a two-dimensional temperature-equalizing plate element formed in the second area of the copper lower cover and provided with a second vapor chamber and a temperature-equalizing plate lower surface, wherein the temperature-equalizing plate lower surface is used for contacting the second heating element.

The two-dimensional temperature-equalizing plate element comprises a flat plate, wherein the second area is opposite to the second area of the copper lower cover, the second area is provided with a lower cover cavity, and when the flat plate is jointed with the second area of the copper lower cover, the lower cover cavity forms the second vapor chamber.

The copper upper cover comprises a substrate and a pipe body, wherein the substrate is provided with a substrate cavity, an opening and an upper outer surface, the pipe body is provided with a pipe body cavity, the pipe body is arranged on the upper outer surface and positioned on the opening and protrudes outwards from the upper outer surface, and when the copper upper cover is jointed with the first area of the copper lower cover, the pipe body cavity and the substrate cavity form an air cavity of the first steam cavity element.

The first cooling liquid is a non-conductive single-phase cooling liquid or a non-conductive double-phase cooling liquid, the second cooling liquid is water or a mixed liquid of water and alcohols, and the third cooling liquid is pure water.

The first flow passage is formed by a first communicating pipe for communicating the first liquid inlet, the first heat exchange cavity and the first liquid outlet, and the second flow passage is formed by a second communicating pipe for communicating the second liquid inlet, the third liquid inlet, the second heat exchange cavity, the third liquid outlet and the second liquid outlet, and the third flow passage is formed by two-phase flow circulation inside the first vapor cavity element.

In summary, the present invention provides an electronic device with triple liquid cooling circulation, which uses triple liquid cooling circulation (Liquid Cooling Cycle) contained in the electronic device to make different layersThe heat exchange and heat transfer of the heat exchanger can achieve better heat dissipation and power saving effects. Compared with the prior art, the invention has the advantages that the first and the second closed shells are simultaneously provided with triple liquid cooling circulation in the electronic device, wherein one group of liquid cooling circulation of two-phase flow corresponds to the vapor cavity, can directly perform heat exchange and heat transfer on the first heating element (main heat source) and quickly transfer the heat energy of the heat absorbing end to the condensing end through phase change, the other group of liquid cooling circulation corresponds to the second closed shell, performs heat exchange and heat transfer on the vapor cavity and the cooling liquid in the second heat exchange cavity, and the other group of liquid cooling circulation corresponds to the first closed shell, is arranged on the whole circuit motherboard, and performs heat exchange and heat transfer on the heating element (secondary heat source) on the circuit motherboard. Therefore, when the invention is applied to the electronic device, the triple liquid cooling circulation is equal to the simultaneous provision of three overlapped heat exchange systems, and the layered liquid cooling circulation radiates heat from inside to outside, so that the heat transfer and radiation efficiency of the electronic device can be greatly improved. In summary, the electronic device with triple liquid cooling circulation of the present invention uses three layers of liquid cooling circulation to effectively exchange and transfer heat generated by the main heat source and the secondary heat source, so as to achieve a better heat dissipation effect, and not only can greatly increase the heat dissipation efficiency of the electronic device to make the PUE value approach 1, but also can achieve the purpose of saving the use cost of the cooling liquid.

Drawings

FIG. 1 is a cross-sectional view of an electronic device with triple liquid cooling circulation according to an embodiment of the invention.

Fig. 2 shows a top view according to fig. 1.

FIG. 3 is a schematic diagram of an electronic device with triple liquid cooling cycle according to another embodiment of the present invention.

Fig. 4 shows a cross-sectional view of an electronic assembly according to another embodiment of the invention.

Fig. 5 shows a cross-section of the first vapour chamber element according to fig. 4.

Fig. 6 shows an enlarged view of the area B according to fig. 5.

Fig. 7 shows a cross-sectional view of a first vapor chamber element in accordance with another embodiment of the invention.

Fig. 8 shows an enlarged view of the area B according to fig. 7.

Fig. 9 shows a cross-section of the first vapour chamber element according to fig. 1.

Detailed Description

In order that the advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It should be noted that these embodiments are merely representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. are not meant to limit the present invention or the corresponding embodiments. In the drawings, each element is shown in a relative position and is not drawn to actual scale, and the step numbers of the present invention merely distinguish between different steps and do not represent the sequence of steps.

Referring to fig. 1, fig. 1 is a cross-sectional view of an electronic device with triple liquid cooling circulation according to an embodiment of the invention. As shown in fig. 1, the present invention provides an electronic device 1 with triple liquid cooling circulation, which includes a first enclosure 10, a circuit motherboard 20, and a liquid cooling module 30. The first closed casing 10 has a first heat exchange chamber 101, a first liquid inlet 1011, a first liquid outlet 1012, a second liquid inlet 1013, and a second liquid outlet 1014, and the first liquid inlet 1011 and the first liquid outlet 1012 are respectively communicated with the first heat exchange chamber 101. The circuit motherboard 20 is disposed in the first enclosure 10 and located in the first heat exchange cavity 101, and the circuit motherboard 20 is electrically connected to the first heating element 201. The liquid cooling heat dissipation module 30 is coupled to the first heat generating element 201 and includes a second closed housing 301 and a first vapor chamber element 302, the second closed housing 301 has a second heat exchanging cavity 3011, a third liquid inlet 3012 and a third liquid outlet 3013, the third liquid inlet 3012 and the third liquid outlet 3013 are respectively communicated with the second liquid inlet 1013 and the second liquid outlet 1014, and the first vapor chamber element 302 is disposed in the second closed housing 301 and can be in contact with the cooling liquid in the second heat exchanging cavity 3011 for heat exchanging. The first heat exchange cavity 101, the first liquid inlet 1011 and the first liquid outlet 1012 form a first flow channel 111 for the first cooling liquid to circulate. The second heat exchange cavity 3011, the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014, and the third liquid outlet 3013 form a second flow channel 112 for circulating the second cooling liquid. A third flow passage 113 is formed inside the first vapor chamber element 302 for the third cooling liquid to flow in a two-phase flow cycle. In addition, the heat absorbing end 60 of the first vapor chamber element 302 is in close proximity to the first heat generating element 201, and the condensing end 70 of the first vapor chamber element 302 is immersed in the second cooling liquid.

The principle of operation of the third flow channel 113 will be described in detail below. Referring to fig. 1 again, as shown in fig. 1, the cooling liquid in the third flow channel 113 flows in a capillary structure disposed inside the first vapor chamber 302. In practice, when the heat absorption end of the first vapor chamber 302 receives heat energy from the first heat generating element 201, the cooling liquid in the third flow channel 113 changes to a gaseous state due to the heat energy absorption, and flows upward toward the inside of the first vapor chamber 302 in fig. 1. Then, the cooling liquid is changed from the gas phase to the liquid phase at the condensation end 70, and then flows back to the heat absorption end 60 by the capillary phenomenon of the capillary structure along the downward arrow in the first vapor chamber 302 in fig. 1, so as to form a two-phase flow cycle.

Referring next to fig. 1 and 2, fig. 2 shows a top view according to fig. 1. As shown in fig. 2, the first liquid inlet 1011 and the first liquid outlet 1012 form a first flow channel 111, and the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014, and the third liquid outlet 3013 form a second flow channel 112. The positions can be clearly seen from the top view, wherein the pumps 401 are respectively arranged in the first flow channel 111 and the second flow channel 112 to flow the cooling liquid in the first flow channel 111 and the second flow channel 112 into the liquid inlet and the liquid outlet, so that the first heat exchange cavity 101 and the second heat exchange cavity 3011 have better heat exchange efficiency. Note that the cooling liquid in the third flow channel 113 circulates in the first vapor chamber 302 between the heat absorbing end 60 and the condensing end 70 (as shown in fig. 1). In practice, the first flow channel 111 is formed by a first communication pipe 1110 for communicating with the first liquid inlet 1011, the first heat exchange chamber 101 and the first liquid outlet 1012, and the second flow channel 112 is formed by a second communication pipe 1120 for communicating with the second liquid inlet 1013, the third liquid inlet 3012, the second heat exchange chamber 3011, the third liquid outlet 3013 and the second liquid outlet 1014.

The positions of the first liquid inlet 1011, the first liquid outlet 1012, the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014 and the third liquid outlet 3013 shown in fig. 2 are not limited thereto, and can be designed according to the actual server requirements. In addition, in practice, the first enclosure 10 of the electronic device 1 with triple liquid cooling circulation of the present invention has a size that meets the 1u size specification of the enclosure in the server, and may be disposed in the cabinet frame of the server, but the size specification is not limited thereto, and may be a 2u size enclosure or a cabinet size of the server designed according to individual requirements, and meanwhile, the invention is not limited to being applied in the server, and any electronic device, communication device and vehicle device may be used.

The electronic device 1 with triple liquid cooling circulation of the present invention is applicable to a common specification (i.e. a group of circuit mother boards are only matched with one main heat source), and when two main heat sources (or more) are arranged on the circuit mother boards, the electronic device with triple liquid cooling circulation of the present invention is also applicable. Referring to fig. 3, fig. 3 is a schematic diagram of an electronic device with triple liquid cooling circulation according to another embodiment of the invention. As shown in fig. 3, when two sets of main heat sources (not shown) are provided, the second heat exchange cavities 3011 and 3011' may be disposed on the two sets of main heat sources, and the second flow channel 112' is formed through the second liquid inlet 1013, the third liquid inlet 3012, the second heat exchange cavity 3011, the third liquid outlet 3013, the fourth liquid inlet 3014, the second heat exchange cavity 3011', the fourth liquid outlet 3015 and the second liquid outlet 1014 for the second cooling liquid to circulate.

In practice, the first cooling liquid is a non-conductive single-phase cooling liquid or a non-conductive double-phase cooling liquid, the second cooling liquid is water or a mixture of water and alcohols, and the third cooling liquid is pure water, but the material of the cooling liquid is not limited thereto. It should be noted that, since water has a relatively high vaporization latent heat, the heat generated by the first heating element 201 can be quickly and efficiently taken away, and the first heat exchange cavity 101 and the second heat exchange cavities 3011 and 3011' are filled with the first cooling liquid and the second cooling liquid, respectively, and the absorbed heat can be taken away through circulation. The first enclosure 10 may be welded to the bottom plate 114 by welding, so that the first heat exchange cavity 101 has better sealing performance, and the first cooling liquid is prevented from leaking, but the bonding method is not limited thereto.

In addition to the first heating element being directly disposed on the circuit motherboard, the first heating element may be mounted on the circuit motherboard by slot bonding, and referring to fig. 4, fig. 4 is a cross-sectional view of an electronic component according to another embodiment of the invention. As shown in fig. 4, an electronic device with triple liquid cooling circulation according to another embodiment of the invention further includes a circuit sub-board 21 and is electrically connected to a circuit motherboard (not shown), the first heating element 201 is disposed on the circuit sub-board 21, and the circuit sub-board 21, the first heating element 201 and the liquid cooling module 30 form an electronic component 50 with a heat dissipation function. In practice, the circuit board 21 may be configured as a board-like slot disposed on a circuit motherboard (not shown).

In addition to the higher power primary heat source, a lower power secondary heat source may also be provided adjacent to the primary heat source, as will be described in more detail below with respect to the first vapor chamber element 302 that may be used for both primary and secondary heat sources to dissipate heat. With continued reference to fig. 4, the circuit sub-board 21 further includes a second heating element 211, the liquid cooling module 30 includes a copper upper cover 311 and a copper lower cover 312, the copper lower cover 312 has a first area a and a second area B opposite to the copper upper cover 311, the first area a has a first lower surface 313, and the second area B has a second lower surface 315 and a second upper surface 316. When the copper upper cover 311 is bonded to the copper lower cover 312, the first vapor chamber 302 is formed, wherein the first lower surface 313 of the first region a is configured to contact the first heating element 201, and the second lower surface 315 of the second region B is configured to contact the second heating element 211. In one embodiment, the first vapor chamber element 302 is a three-dimensional structure, or may be a two-dimensional structure.

The electronic component 50 further includes a half-open housing 320 connected to the copper lower cover 312 to form a second closed housing 301 and a second heat exchange cavity 3011, wherein the second heat exchange cavity 3011 is configured to receive the copper upper cover 311 and the second upper surface 316 of the second area B, and the third liquid inlet 3012 and the third liquid outlet 3013 are disposed on the half-open housing 320. In practice, the first heating element 201 is a main heat source (e.g. high power cpu chip, graphics chip, AI chip, IGBT chip), and the second heating element 211 is a secondary heat source with lower power (e.g. passive element, memory). In fig. 4, the electronic component 50 may also be mounted in fig. 1 to form an electronic device with triple liquid cooling circulation, please refer to fig. 4 and fig. 1 together, because the main heat source with a lower temperature is considered due to the actual heat generation of the secondary heat source, if the first area a is disposed beside the third liquid inlet 3012, when the temperature of the second cooling liquid raised by the heat taken away from the first heating element 201 of the first area a is far greater than the temperature of the second heating element 211, the second area B cannot effectively dissipate heat, and the temperature of the second heating element 211 may be raised. Therefore, the second region B of the first vapor chamber 302 is disposed close to the third liquid inlet 3012, but the flow direction of the second cooling liquid is not limited thereto.

The electronic component 50 of the electronic device with triple liquid cooling circulation of the present invention further includes a two-dimensional temperature-equalizing plate element 330, and the two-dimensional temperature-equalizing plate element 330 can dissipate heat for some secondary heat sources with relatively high power. The method for arranging the two-dimensional temperature uniformity plate member 330 will be further described below.

Referring to fig. 4, 5 and 6, fig. 5 shows a cross-sectional view of the first vapor chamber component according to fig. 4. Fig. 6 shows an enlarged view of the area B according to fig. 5. As shown in fig. 4 and 5, the two-dimensional temperature uniformity plate element 330 is formed in a second area B of the copper lower cover 312, and the second area B can dissipate heat for the second heating element 211. Referring further to fig. 5 and 6, as shown in fig. 6, the two-dimensional temperature uniformity plate 330 includes a flat plate 3302, and the second region B has a lower cover cavity 3303 with respect to the second region B of the copper lower cover 312, wherein the lower cover cavity 3303 forms a second vapor cavity 3304 when the flat plate 3302 is bonded to the second region B of the copper lower cover 312. Also, in the present embodiment, the flat lower surface 3305 of the flat plate 3302 is configured to contact the second heat-generating element 211, and thus, the flat lower surface 3305 of the flat plate 3302 is coplanar with the second lower surface 315 of the copper lower cover 312 in the present embodiment.

In addition to the flat plate 3302 being disposed in the copper bottom cover 312 in the manner described above, another aspect of the flat plate 3302 being disposed in the copper bottom cover 312 is described below. Referring to fig. 7 and 8, fig. 7 is a cross-sectional view of a first vapor chamber component according to another embodiment of the invention. Fig. 8 shows an enlarged view of the area B according to fig. 7. As shown in fig. 7 and 8, when the flat plate 3302 is joined to the second region B', the lower cover cavity 3303 forms a second vapor cavity 3304 and the flat plate 3302 is joined to the second upper surface 316. At this time, the lower surface 3301 of the temperature equalizing plate is used to contact the second heating element 211.

Referring to fig. 9, fig. 9 shows a cross-sectional view of the first vapor chamber component according to fig. 1. As shown in fig. 9, the grooves 317 can be milled by a computer numerical control (Computer Numerical Control, CNC) machine, the grooves 317 are located in the first region a and the second region B of the copper bottom cover 312, and the grooves 317 can be processed for the number and the height of the first heating element (not shown) and the second heating element (not shown) respectively, so that the depth of the grooves 317 can be more matched with the heights of the first heating element (not shown) and the second heating element to conduct heat more efficiently. Note that, in fig. 9, the flat plate 3302 of the two-dimensional temperature-equalizing plate 330 is also disposed in the second upper surface 316, wherein the manner of disposing the flat plate 3302 is substantially the same as that of the previous embodiment, and thus, a description thereof will not be repeated.

Referring to fig. 9 again, as shown in fig. 9, the copper top cover 311 includes a substrate 3110 and a tube body 3111, the substrate 3110 has a substrate cavity 3112, an opening (not shown) and an upper outer surface (not shown), the tube body 3111 has a tube body cavity 3113, and the tube body 3111 is disposed on the upper outer surface of the substrate 3110 and located above the opening and protrudes outwards from the upper outer surface (i.e. the shape shown in fig. 9). When the copper upper lid 311 is bonded to the first region a of the copper lower lid 312, the tube cavity 3113 and the substrate cavity 3112 form the air cavity 314 of the first vapor chamber element 302. In practice, the tube 3111 may be formed into an integrally formed tube 3111 by continuously stamping and stretching the length of the copper top cover 311 from a metal plate, and the shape of the tube 3111 may be, but is not limited to, a cylinder, a rectangular cylinder, an elliptic cylinder, and a cone.

Next, the tube body 3111 further has a top 3114, and the top 3114 has a nozzle sealing structure 3115, the nozzle sealing structure 3115 being formed by a liquid nozzle provided in advance on the top 3114, through which a third cooling liquid is injected into the first vapor chamber 302, and sealing the liquid nozzle. In practical applications, the liquid injection port may be sealed by welding or the like. In addition, in the present embodiment, the sprue sealing structure 3115 and the liquid sprue are both located at the top end 3114 of the tube 3111, but the application is not limited thereto, and the sprue sealing structure 3115 and the liquid sprue may be located at any position on the tube 3111. Except for this, the processing of the first vapor chamber 302 (i.e. fig. 5 and 7) in other embodiments of the invention is the same as that described above, and will not be repeated here.

In summary, the present invention provides an electronic device with triple liquid cooling circulation, which first changes the phase of the third cooling liquid in the capillary structure of the heat absorption area in the vapor chamber by the heat generated by the high-power density device through the phase change of the two-phase flow circulation of the third flow channel in the vapor chamber, and transfers the heat energy efficiently, and then exchanges heat with the second cooling liquid flowing in the second heat exchange chamber in the second flow channel. The heat generated by the secondary heat source with lower power on the other circuit mother board and the residual heat which cannot be taken away by the liquid cooling heat dissipation module are circularly taken away by the non-conductive first cooling liquid in the first heat exchange cavity through the first flow channel, so that the electronic device has a better heat dissipation effect. Compared with the prior art, the electronic device with triple liquid cooling circulation integrates a circuit motherboard, all heating elements and a heat dissipation system to form the electronic device with the liquid cooling heat dissipation function. The device can be a server or a communication switch, and can be directly stacked and inserted into a cabinet for installation in practical application, and the heat dissipation function of the electronic device can be achieved by respectively connecting an external cooling liquid circulation system. The invention provides an electronic device with triple liquid cooling circulation, which can save the cost of using cooling liquid and greatly increase the heat dissipation efficiency of the electronic device.

From the foregoing detailed description of the preferred embodiments, it is intended to more clearly describe the nature and spirit of the invention, but not to limit the scope of the invention by the above disclosed preferred embodiments. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the invention as defined by the appended claims. The scope of the invention as claimed should therefore be accorded the broadest interpretation based upon the foregoing description so as to encompass all such modifications and equivalent arrangements.

Claims (10)

1. An electronic device with triple liquid cooling cycle, characterized by comprising: A first closed shell having a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, wherein the first liquid inlet and the first liquid outlet are respectively connected to the first heat exchange cavity; A motherboard is disposed in the first closed shell and located in the first heat exchange cavity, and the motherboard is electrically connected to a first heating element; and A liquid cooling heat dissipation module is coupled to the first heating element and includes a second closed shell and a first steam chamber element, the second closed shell has a second heat exchange cavity, a third liquid inlet and a third liquid outlet, the third liquid inlet and the third liquid outlet are respectively connected to the second liquid inlet and the second liquid outlet, and the first steam chamber element is arranged in the second heat exchange cavity, and the first steam chamber element has a heat absorption end and a condensation end; Among them, the first heat exchange chamber, the first liquid inlet and the first liquid outlet form a first flow channel for a first coolant to circulate, the second heat exchange chamber, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for a second coolant to circulate, a third flow channel is formed inside the first steam chamber element for a third coolant to flow in a two-phase flow circulation form, the heat absorption end of the first steam chamber element is closely attached to the first heating element, and the condensation end of the first steam chamber element is immersed in the second coolant. 2. An electronic device with a triple liquid cooling cycle as described in claim 1, characterized in that the first closed shell is a closed shell that meets the 1u size specification, the electronic device can be placed in a modular cabinet frame, and the electronic device can be a server or a communication equipment. 3. An electronic device with a triple liquid cooling cycle as described in claim 1 is characterized in that it also includes a circuit daughter board electrically connected to the circuit mother board, the first heating element is arranged on the circuit daughter board, and the circuit daughter board, the first heating element and the liquid cooling heat dissipation module form an electronic component with heat dissipation function. 4. An electronic device with a triple liquid cooling cycle as described in claim 3, characterized in that a second heating element is further provided on the circuit board, and the liquid cooling heat dissipation module includes a copper upper cover and a copper lower cover, the copper lower cover has a first area and a second area relative to the copper upper cover, the first area has a first lower surface, the second area has a second lower surface and a second upper surface, when the copper upper cover is joined to the first area of the copper lower cover, the first vapor chamber element is formed, the first lower surface of the first area is used to contact the first heating element, and the second lower surface of the second area is used to contact the second heating element. 5. An electronic device with a triple liquid cooling cycle as described in claim 4, characterized in that the electronic component further includes a half-open shell connected to the copper lower cover to form the second closed shell and the second heat exchange cavity, the second heat exchange cavity is used to accommodate the copper upper cover and the second upper surface of the second area, and the third liquid inlet and the third liquid outlet are arranged on the half-open shell. 6. An electronic device with a triple liquid cooling cycle as described in claim 5, characterized in that the electronic component further includes a two-dimensional temperature averaging element formed in the second area of the copper lower cover and having a second vapor cavity and a temperature averaging lower surface, and the temperature averaging lower surface is used to contact the second heating element. 7. An electronic device with a triple liquid cooling cycle as described in claim 6, characterized in that the two-dimensional temperature equalizing plate element includes a flat plate, and relative to the second area of the copper lower cover, the second area has a lower cover cavity, and when the flat plate is joined to the second area of the copper lower cover, the lower cover cavity forms the second vapor chamber. 8. An electronic device with a triple liquid cooling cycle as described in claim 4, characterized in that the copper upper cover includes a substrate and a tube body, the substrate has a substrate cavity, an opening and an upper outer surface, the tube body has a tube body cavity, the tube body is arranged on the upper outer surface and is located above the opening and protrudes outward from the upper outer surface, when the copper upper cover is joined to the first area of the copper lower cover, the tube body cavity and the substrate cavity form an air cavity of the first vapor chamber element. 9. An electronic device with a triple liquid cooling cycle as described in claim 1, characterized in that the first coolant is a non-conductive single-phase cooling liquid or a non-conductive two-phase cooling liquid, and the second coolant is water or a mixture of water and alcohol, and the third coolant is pure water. 10. An electronic device with a triple liquid cooling cycle as described in claim 1, characterized in that the first flow channel is formed by a first connecting tube connecting the first liquid inlet, the first heat exchange chamber and the first liquid outlet, and the second flow channel is formed by a second connecting tube connecting the second liquid inlet, the third liquid inlet, the second heat exchange chamber, the third liquid outlet and the second liquid outlet, and the third flow channel is formed by a two-phase flow circulation inside the first vapor chamber element.