CN119155905A

CN119155905A - PCB positioning device and solder paste printing equipment

Info

Publication number: CN119155905A
Application number: CN202411621723.3A
Authority: CN
Inventors: 于久宝; 戚家鸿; 江敏; 陈万群; 王正根
Original assignee: Maiwei Technology Zhuhai Co ltd
Current assignee: Maiwei Technology Zhuhai Co ltd
Priority date: 2024-11-14
Filing date: 2024-11-14
Publication date: 2024-12-17

Abstract

The invention discloses a PCB positioning device and solder paste printing equipment, and relates to the technical field of circuit board production. The first lifting mechanism can do lifting motion relative to the base, the second lifting mechanism is located above the first lifting mechanism and can do lifting motion relative to the first lifting mechanism, the object placing table for placing the PCB is further arranged on the upper portion of the second lifting mechanism, the positioning clamp is located above the second lifting mechanism, the positioning clamp is provided with a clamping space of the PCB, and the object placing table can move in a direction close to and far away from the clamping space under the driving of the second lifting mechanism. The two sections of lifting mechanisms respectively lift the PCB to the highest position of the clamping position of the positioning clamp and the height of the printing position, so that the upper surface of the positioning clamp and the printing surface of the PCB can be completely contacted with the lower surface of the steel mesh, the printing content is ensured not to be lost, the printing quality is good, and the final technological effect is improved.

Description

PCB positioning device and solder paste printing equipment

Technical Field

The invention relates to the technical field of circuit board production, in particular to a PCB positioning device and solder paste printing equipment.

Background

The solder paste printer is front-end equipment of SMT (surface mounting technology) whole line equipment, wherein the equipment is used for uniformly printing solder paste onto corresponding bonding pads of a PCB (printed circuit board), providing accurate solder paste coating for subsequent paster and reflow soldering processes, ensuring that electronic elements can be accurately and firmly welded on the PCB, and in the process, the PCB is supported on the solder paste printer through a positioning fixture, and the PCB is prevented from moving or deforming in the processing process.

However, due to the fact that certain deviation exists in the initial clamping position between each PCB and the positioning clamp, certain dimensional errors exist among the PCBs, and the like, the relative positions between the PCBs and the positioning clamp and between the PCBs and the printing steel mesh are difficult to keep consistent, and the PCBs also have certain buckling deformation due to the fact that the clamping force applied by the positioning clamp is too large, the PCBs cannot form good surface contact relation with the printing steel mesh, so that the final solder paste printing effect is affected, the problems of uneven printing, poor precision and the like are solved, and the processing requirements of high-end products at present are difficult to meet.

Disclosure of Invention

The embodiment of the invention aims to provide a PCB positioning device and solder paste printing equipment, which can solve the problems in the prior art.

In order to achieve the above purpose, the invention adopts the following technical scheme:

In a first aspect, a PCB board positioning apparatus is provided, comprising:

The first lifting mechanism is arranged on the base station of the PCB positioning device and can do lifting motion along the Z-axis direction relative to the base station, and

The second lifting mechanism is arranged on the first lifting mechanism and is positioned above the first lifting mechanism, the second lifting mechanism can do lifting motion along the Z-axis direction relative to the first lifting mechanism, and a placement table for placing a PCB is further arranged on the upper part of the second lifting mechanism;

The positioning clamp is positioned above the second lifting mechanism, a clamping space of the PCB is formed in the positioning clamp, and the object placing table can move in a direction approaching to and away from the clamping space under the driving of the second lifting mechanism.

As an alternative embodiment, the first lifting mechanism includes:

The supporting bottom plate is movably arranged on the base station;

the first screw rod pair is arranged between the base table and the supporting bottom plate, so that the supporting bottom plate is in transmission connection with the base table through the first screw rod pair;

the first driving mechanism is provided with a first fixed end and a first driving end, the first fixed end is installed on the supporting bottom plate or the base station, and the first driving mechanism is in driving connection and matching with the first screw rod pair through the first driving end.

As an alternative embodiment, the first screw pair includes:

The first lead screws are arranged in a plurality, the first lead screws are uniformly distributed in the edge area of the supporting bottom plate, at least one first lead screw is in driving connection with the first driving end, and each first lead screw can be synchronously and rotatably arranged between the supporting bottom plate and the base station;

The number of the first nuts is consistent with that of the first lead screws, and each first nut is in transmission fit with each first lead screw;

each first nut is fixedly connected with the supporting bottom plate, the first lead screw is axially fixed on the base, or each first nut is fixedly connected with the base, and the first lead screw is axially fixed on the supporting bottom plate.

As an alternative embodiment, the second lifting mechanism includes:

the supporting top plate is movably arranged above the first lifting mechanism;

the second screw rod pair is arranged between the first lifting mechanism and the supporting top plate, so that the supporting top plate is in transmission connection with the first lifting mechanism through the second screw rod pair;

the second driving mechanism is provided with a second fixed end and a second driving end, the second fixed end is arranged on the first lifting mechanism or the supporting top plate, and the second driving mechanism is in driving connection and matching with the second screw rod pair through the second driving end.

As an alternative embodiment, the second screw pair includes:

The second lead screws are arranged in a plurality, the second lead screws are uniformly distributed in the edge area of the supporting top plate, at least one second lead screw is in driving connection with the second driving end, and each second lead screw can be synchronously and rotatably arranged between the supporting top plate and the first lifting mechanism;

The number of the second nuts is consistent with that of the second lead screws, and each second nut is in transmission fit with each second lead screw;

each second nut is fixedly connected with the supporting top plate, the second lead screw is axially fixed on the first lifting mechanism, or each second nut is fixedly connected with the first lifting mechanism, and the second lead screw is axially fixed on the supporting top plate.

As an optional implementation manner, a guide rod is further arranged between the base station, the first lifting mechanism and the second lifting mechanism, one of the base station, the first lifting mechanism and the second lifting mechanism is fixedly connected with the guide rod in the axial direction, and the other two are movably connected with the guide rod.

As an alternative embodiment, the positioning jig includes:

a fixed carrier plate fixedly arranged on the first lifting mechanism, and

The movable carrier plate is movably arranged on the first lifting mechanism, the inner side surfaces of the movable carrier plate and the fixed carrier plate are opposite and are arranged at intervals so as to form the clamping space between the movable carrier plate and the fixed carrier plate, and the movable carrier plate can reciprocate in the direction of approaching to and separating from the fixed carrier plate to realize the adjustment of the size of the clamping space;

The pressing plate mechanism is movably arranged on the fixed carrier plate and/or the movable carrier plate and is provided with a pressing plate position and a release position, and when the pressing plate mechanism is positioned at the pressing plate position, the pressing plate mechanism at least partially protrudes out of the inner side surface of the fixed carrier plate and/or the movable carrier plate;

The upper surface of fixed support plate the activity support plate equipartition is provided with multiunit adsorption structure respectively.

As an alternative embodiment, the base station includes:

An X-axis adjusting mechanism;

the Y-axis adjusting mechanism can be arranged on the X-axis adjusting mechanism in a reciprocating manner along the X-axis direction;

the T-axis adjusting mechanism can be arranged on the Y-axis adjusting mechanism in a reciprocating mode along the Y-axis direction, and the first lifting mechanism can be arranged on the T-axis adjusting mechanism in a rotating mode around the Z-axis.

As an alternative embodiment, the T-axis adjusting mechanism includes:

The adjusting base is rotatably arranged on the Y-axis adjusting mechanism around the axis of rotation of the Z-axis;

The third driving mechanism is provided with a third fixed end and a third driving end, the third driving end can do linear motion relative to the third fixed end, the third fixed end is installed on the Y-axis adjusting mechanism, and the third driving end is connected with the adjusting base through a movable assembly, so that the third driving end can drive the adjusting base to rotate positively or reversely through the movable assembly when reciprocating along the linear direction.

In a second aspect, there is provided a solder paste printing apparatus comprising:

the PCB positioning apparatus of the first aspect;

The image acquisition unit is arranged above the clamping space and is used for acquiring image data of the PCB and the positioning clamp in the clamping space;

The range finder is arranged above the clamping space and used for acquiring distance data between the range finder and the PCB in the clamping space.

The PCB can enter the clamping space formed by the positioning clamp under the action of the second lifting mechanism, the PCB is adjusted to the clamping position meeting the requirement of subsequent solder paste printing with the positioning clamp before being attached to the printed steel mesh, the positioning precision of the PCB is improved, the situations that the PCB cannot form a surface contact relation with the printed steel mesh due to warpage deformation of the PCB and the existence of a step difference between the PCB and the positioning clamp are reduced, and the final technological effect is improved;

The PCB board can further perform lifting movement under the action of the first lifting mechanism on the basis of realizing accurate positioning with the positioning clamp through the second lifting mechanism, so that the product printing surface of the PCB board and the lower surface of the printed steel mesh form a surface contact relationship, the gap between the product printing surface and the steel mesh is eliminated, and the printed content (solder paste) is ensured not to be lost and the good printing quality is ensured;

The first lifting mechanism and the second lifting mechanism can also adaptively adjust the clamping position of the PCB on the positioning clamp and the relative position of the PCB and the printing steel mesh according to different PCB sizes and types, so that the condition that the PCB type is replaced and re-debugging is needed is avoided, the operation difficulty of the solder paste printing equipment is reduced, and meanwhile, the operation efficiency of solder paste printing of the PCB is improved.

Drawings

The invention is described in further detail below with reference to the drawings and examples.

FIG. 1 is a schematic diagram of a solder paste printing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a solder paste printing apparatus according to a second embodiment of the present invention;

FIG. 3 is an exploded view of a solder paste printing apparatus according to an embodiment of the present invention;

FIG. 4 is a second exploded view of a solder paste printing apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating the cooperation between a base and an adjusting base according to an embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating the cooperation between a base and a first screw pair according to an embodiment of the present invention;

FIG. 7 is a schematic diagram illustrating cooperation between a base and a first lifting mechanism according to an embodiment of the present invention;

fig. 8 is a schematic diagram of cooperation of the base, the first lifting mechanism and the second screw pair according to the embodiment of the invention;

fig. 9 is a schematic diagram of cooperation of the base, the first lifting mechanism and the second lifting mechanism according to an embodiment of the present invention.

10, A first lifting mechanism; 11, a supporting bottom plate, 111, a supporting plate, 12, a first screw pair, 121, a first screw, 13, a first driving mechanism, 131, a first fixed end, 132, a first driving end, 20, a second lifting mechanism, 21, a supporting top plate, 22, a second screw pair, 221, a second screw, 23, a second driving mechanism, 231, a second fixed end, 232, a second driving end, 30, a placing table, 40, a positioning clamp, 41, a fixed carrier plate, 42, a movable carrier plate, 43, a pressing plate mechanism, 44, an adsorption structure, 45, a gantry support frame, 46, a spacing adjusting structure, 47, a spacing adjusting motor, 48, an adjusting screw, 50, a base station, 51, an X-axis adjusting mechanism, 511, an X-axis bottom plate, 512, an X-axis screw pair, 513, an X-axis guide rail, 52, a Y-axis adjusting mechanism, 521, a Y-axis bottom plate, 522, a Y-axis top plate, 5221, a round platform structure, 523, a Y-axis screw pair, 524, a Y-axis guide rail, 53, a T-axis adjusting mechanism, 531, an adjusting base, 5311, a rotary groove, 5321, a third fixing end 5321, 5322, a third driving end, a 5322, a distance measuring device, a guide unit, a 60, a movable guide unit, and a guide unit.

Detailed Description

In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.

In the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "secured" and "fixed" are to be construed broadly, as for example, they may be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through intermediaries, or in communication between two elements or in interaction relationship between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The solder paste printer is front-end equipment of SMT (surface mounting technology) whole-line equipment, and is one of main stream equipment in SMT industry, and the equipment is used for uniformly printing solder paste or red glue onto corresponding bonding pads of a PCB (printed circuit board), so as to provide accurate solder paste coating for subsequent bonding and reflow soldering processes and ensure that electronic elements can be accurately and firmly soldered on the PCB.

Specifically, the PCB to be printed is conveyed to be fixed on a printing positioning table by a CV conveying line (Conveyor Line), is fixed on a solder paste printer in an auxiliary mode by a corresponding clamp, and then solder paste or red glue is subjected to screen printing on corresponding bonding pads of the PCB by a scraper of the printer.

However, according to the background art, as a certain deviation exists in the initial clamping position between each PCB and the positioning clamp, the clamping positions of the positioning clamp when the PCB to be printed is clamped each time are different, so that the relative positions between the PCB and the printed steel mesh are difficult to keep consistent, and the accuracy of solder paste printing is affected. And, also because can have certain size error between the PCB board, the clamp force that positioning fixture produced to the PCB board also has the difference when the different PCB boards of centre gripping, the PCB board can appear warp the problem of deformation because of the clamp force that positioning fixture applyed to it is too big, and the clamp force is too little then can let the PCB board appear the condition of position deviation during printing technology, lead to PCB board and printing steel mesh unable formation accurate counterpoint to influence final solder paste printing effect, appear printing inequality, lack scheduling problem, be difficult to satisfy the processing demand to high-end product at present.

In view of this, this embodiment provides a PCB board positioner, and this positioner makes the relative position of PCB board and positioning fixture and the relative position of PCB board and printing steel mesh all can be adjusted respectively through adopting two segmentation elevating system to solve the lower problem of PCB board solder paste printing quality.

Referring to fig. 1-4 and fig. 6-9 of the drawings, the PCB positioning device includes a first lifting mechanism 10 and a second lifting mechanism 20. The first lifting mechanism 10 is disposed on a base 50 of the PCB positioning device, and the base 50 can be understood as a supporting base of the PCB positioning device, so as to stably support the PCB positioning device on the solder paste printing apparatus. In a different embodiment, the base 50 and the first lifting mechanism 10 may be fixed relatively in other directions except for the Z axis, or the base 50 may drive the first lifting mechanism 10 to move in other directions except for the Z axis movement degree of freedom of the first lifting mechanism 10.

The first elevating mechanism 10 is provided in this embodiment to be movable up and down in the Z-axis direction with respect to the base 50. The first lifting mechanism 10 is used as a basic lifting part of the PCB positioning device and is used for integrally providing a lifting function in the Z-axis direction for the positioning device, and in the practical application scene of the solder paste printing device, the first lifting mechanism 10 can lift the PCB or a bearing platform thereof carried on the PCB positioning device to a certain height, so that a printing surface formed on the upper surface of the PCB can be attached to the lower surface of a printing steel mesh, and the subsequent tin brushing operation is facilitated.

On the basis of the above, the second lifting mechanism 20 is disposed above the first lifting mechanism 10, that is, the second lifting mechanism 20 is located on a side of the first lifting mechanism 10 away from the base 50 along the Z-axis direction. In this embodiment, the upper portion of the second lifting mechanism 20 is provided with a placement table 30 for placing a PCB, and the placement table 30 can be provided with a corresponding placement surface according to the type of the PCB structure to be placed actually, so as to ensure that the PCB can be stably placed on the placement table in an initial state. The second lifting mechanism 20 is disposed above the first lifting mechanism 10, so that the second lifting mechanism 20 can lift along with the lifting of the first lifting mechanism 10 in the Z-axis direction, so that the first lifting mechanism 10 can drive the PCB board to move between a printing position (attaching the printing steel mesh) and a standby position (away from the printing steel mesh) by driving the second lifting mechanism 20 to lift.

Further, the second lifting mechanism 20 can perform independent lifting motion along the Z-axis direction on the first lifting mechanism 10 relative to the first lifting mechanism 10, so as to drive the object placing table 30 to lift, so that the object placing table 30 has two sections of lifting degrees of freedom on the PCB positioning device, and the PCB has higher degree of freedom of adjustment under the condition that the PCB is placed on the object placing table 30, so that the PCB positioning device can meet different positioning operation requirements.

In addition, referring to fig. 1 to 4 of the specification, the PCB positioning device includes a positioning fixture 40 while being provided with a first lifting mechanism 10 and a second lifting mechanism 20, and the positioning fixture 40 has a main function of clamping and fixing the PCB on the second lifting mechanism 20, so that the PCB is stable in the printing process, and the PCB and the printed steel mesh are accurately aligned, so as to prevent poor printing caused by movement or deformation. In the embodiment, the positioning fixture 40 is located above the second lifting mechanism 20, and the positioning fixture 40 forms a clamping space for the PCB, in the practical application scenario, the positioning fixture 40 can actively adjust the size of the clamping space according to whether the positioning fixture needs to clamp the PCB or not, the size of the PCB, and the like, and the positioning fixture 40 cannot lift along with the lifting of the second lifting mechanism 20, so as to ensure that the second lifting mechanism 20 can move along the Z-axis direction in a direction approaching to and separating from the clamping space in the process of driving the second lifting mechanism 30 to perform lifting movement.

The following is a brief description of the operation flow of the PCB positioning device in the solder paste printing apparatus according to the above embodiment:

s10, conveying the PCB from a last equipment station to a placing table 30 under the conveying of a conveying mechanism (the CV conveying line) and placing the PCB on the placing table 30, wherein the PCB is positioned at a position far away from a clamping space and a printing steel mesh to be attached;

S20, the second lifting mechanism 20 drives the object placing table 30 to lift, so that the PCB moves towards the clamping space direction, and stops continuously lifting when the PCB moves to a position which can be accurately clamped by the positioning clamp 40, and clamping force is applied to the PCB through the positioning clamp 40, so that the PCB can be stably clamped and fixed on the object placing table 30 by the positioning clamp 40;

S30, the first lifting mechanism 10 drives the second lifting mechanism 20 to lift, and the positioning clamp 40 moves synchronously with the second lifting mechanism 20 (can be realized by arranging the positioning clamp 40 on the first lifting mechanism 10), so that the PCB moves from the standby position to the printing position under the constraint of the object placing table 30 and the positioning clamp 40 and is attached to the corresponding printing steel mesh;

and S40, finally, the solder paste or the red glue is printed on the bonding pads corresponding to the PCB through the printing steel mesh by the solder paste printing equipment through the scraper.

According to the above provided operation procedure, it can be understood that the PCB positioning device can respectively realize the precise alignment between the PCB and the positioning fixture 40 and the precise alignment between the PCB and the printing steel mesh through the first lifting mechanism 10 and the second lifting mechanism 20, so as to clamp and fix the fixture in the printing preparation and lift the fixture to the printing position, the clamping force applied by the positioning fixture 40 to the PCB and the height of the second lifting mechanism 20 for lifting the placement table 30 can be determined according to the actual situation of the PCB to be printed, thereby determining the clamping position and the clamping force of the PCB on the positioning fixture 40 before the PCB is attached to the printing steel mesh, and avoiding the gap problem generated in the attaching process. The first lifting mechanism 10 and the second lifting mechanism 20 can also adaptively adjust the clamping position of the PCB on the positioning fixture 40 and the relative position of the PCB and the printed steel mesh according to different PCB sizes and types, so that the condition that the PCB type is replaced and re-debugging is needed is avoided, and the operation difficulty of the solder paste printing equipment is reduced, and meanwhile, the operation efficiency of solder paste printing of the PCB is also improved. That is, in the practical application scenario, the lifting of the two sections of Z axes respectively lifts the PCB to the highest position of the clamping position of the positioning fixture 40 and the height of the printing position, so as to eliminate the step difference between the PCB and the positioning fixture 40, ensure that the upper surface of the positioning fixture 40 and the printing surface of the PCB can be completely contacted with the lower surface of the steel mesh, thereby eliminating the gap between the printing surface of the product and the steel mesh, ensuring that the printing content is not lost and the printing quality is good, and realizing the improvement of the final process effect.

In addition to the above embodiment, at least one specific configuration of the first elevating mechanism 10 and the second elevating mechanism 20 is also provided in this embodiment.

Referring to fig. 1-4 and fig. 6-7 of the drawings, the first lifting mechanism 10 includes a supporting base plate 11, a first screw pair 12 and a first driving mechanism 13. The support base plate 11 serves as a support base for the first elevating mechanism 10 on the base 50, and is preferably made of a material having high rigidity (such as metal or alloy) to ensure stability and durability thereof. The support base plate 11 provides a sufficient planar area for mounting and supporting the first screw pair 12 and the second elevating mechanism 20. The first screw pair 12 is disposed between the base 50 and the supporting base plate 11, and the supporting base plate 11 is in transmission connection with the base 50 through the first screw pair 12. The first driving mechanism 13 has a first fixed end 131 and a first driving end 132, the first driving end 132 can move relative to the first fixed end 131, the first fixed end 131 is mounted on the supporting base plate 11 or the base 50, and the first driving mechanism 13 is in driving connection with the first screw pair 12 through the first driving end 132.

When the first lifting mechanism 10 needs to perform lifting movement, the first driving mechanism 13 (such as a motor or other driving device) is started, so that the first driving end 132 moves relative to the first fixed end 131 (the supporting base plate 11 or the base 50) based on the supporting base plate 11 or the base 50, thereby driving the first screw pair 12 to move, and further pushing the supporting base plate 11 to lift or descend along the axial direction of the first screw pair 12. It can be appreciated that the first lifting mechanism 10 adopts the first screw pair 12 as a transmission mechanism for driving the supporting base plate 11, especially the ball screw pair, so that the supporting base plate 11 and the base station 50 can have higher transmission efficiency, and meanwhile, the screw pair has excellent positioning precision and self-locking property, so that the supporting base plate 11 can accurately drive the PCB board to stably attach to the lower surface of the printing steel mesh, and can be kept stable under different position states without the action of the first driving mechanism 13, and a self-locking device is not required to be additionally added, thereby ensuring the operation precision during solder paste printing.

In addition, since the adjusting range of the screw pair depends on the length of the screw and the travel of the nut, the first screw pair 12 also has excellent adjustable performance, and in the process of driving different types of PCBs, the PCB positioning device can drive the supporting bottom plate 11 to lift to the corresponding position through the first screw pair 12 according to actual conditions, so that the first lifting mechanism 10 can adapt to PCBs with different sizes and shapes, and different processing requirements are met.

In order to further improve the transmission stability between the supporting base plate 11 and the base 50, the first screw pair 12 of the present embodiment is specifically implemented by adopting the following scheme, please continue to refer to fig. 3-7, and the first screw pair 12 includes:

The first lead screws 121 are arranged in a plurality, the first lead screws 121 are uniformly distributed in the edge area of the supporting bottom plate 11, the edge area of the supporting bottom plate 11 refers to the peripheral area of the PCB, the first lead screws 121 are uniformly distributed in the edge area of the supporting bottom plate 11, the supporting bottom plate 11 can be more effectively supported and fixed on the base 50, and shaking or offset phenomenon of the supporting bottom plate 11 in the lifting motion process of the first lead screw pair 12 relative to the base 50 is reduced. In addition, the layout mode is favorable for dispersing the stress points of the first screw pair 12 on the supporting bottom plate 11, and each first screw 121 more uniformly transmits power to the supporting bottom plate 11, so that errors caused by uneven stress are reduced, the errors are more uniform and stable, and the structural stability of the whole system is improved.

At least one of the plurality of first lead screws 121 is in driving engagement with the first driving end 132, and each first lead screw 121 is synchronously rotatably disposed between the supporting base plate 11 and the base 50, so that the first lead screws 121 can be synchronously rotated under the drive of the first driving mechanism 13. Specifically, the definition that the plurality of first lead screws 121 are synchronously connected can be understood that at least one of the plurality of first lead screws 121 is driven by the first driving mechanism 13 to perform coordinated movement according to a predetermined synchronous proportion or the same speed and position, so that each first lead screw 121 can perform corresponding functions and actions between the base 50 and the supporting base plate 11 at the same time, and drive the supporting base plate 11 to stably lift.

The first lead screws 121 may be connected in a synchronous motion by using transmission members such as a timing belt, a chain, and a gear, but the present embodiment is not limited to this.

For example, the four first screws 121 in this embodiment are disposed at four corners of the supporting base plate 11, and the four first screws 121 are rotated in the same direction in a synchronous belt encircling manner. While, according to the embodiment in which the first fixed end 131 may be provided at the support base plate 11 or the base 50, taking the first driving mechanism 13 as an example, the first fixed end 131 is defined as a stator (housing) of the motor, and the first driving end 132 is defined as an output shaft of the motor. The motor can be mounted on the supporting base plate 11 or the base 50 through its stator, and the output shaft is coaxially connected with at least one first screw 121, or the driving of the first screw 121 is realized through the transmission connection of transmission components such as synchronous belt, chain, gear, etc., in this example, one side of the supporting base plate 11 extends outwards to form a supporting plate 111 protruding from the base 50, the first driving mechanism 13 is mounted on the supporting plate 111 through its first fixing end 131, and its first driving end 132 is in transmission connection with one of the first screws 121 through the synchronous belt, so as to save the space occupied by the PCB positioning device in the height direction, and improve the structural compactness of the device.

In the case that the first screw pair 12 includes a plurality of first screws 121, the first screw pair 12 should further include a number of first nuts (not shown) corresponding to the first screws 121, and each first screw 121 is provided with a first nut in driving engagement with the first nut so that the first nut moves axially relative to the first screw 121 when the first screw 121 rotates.

In the following, this embodiment provides two types of arrangement of the first nut in the first screw pair 12 according to the above description:

1. Each first nut is fixedly connected to the support base plate 11, and the first screw rod 121 is axially fixed to the base 50. In this embodiment, when the first screw rod 121 is driven by the first driving mechanism 13, a transmission relationship occurs between the first screw rod 121 and the first nut, and the first nut moves in the direction of the rotation axis of the first screw rod 121 due to the relationship that the first screw rod 121 is rotatably and axially fixed to the base 50, thereby driving the support base plate 11 to make a lifting movement in the axial direction of the first screw rod 121.

2. Each first nut is fixedly connected to the base 50, and the first screw rod 121 is axially fixed to the support base plate 11. In this embodiment, when the first screw rod 121 is driven by the first driving mechanism 13, the first screw rod 121 moves up and down in the axial direction of the first nut due to the fixing relationship of the first nut to the base 50, so that the supporting base plate 11 is driven to move up and down by the movement of the first screw rod 121 relative to the first nut.

With continued reference to fig. 3-9, the second lifting mechanism 20 may refer to the above-provided structure of the first lifting mechanism 10, and specifically includes a supporting top plate 21, a second screw pair 22 and a second mechanism. Wherein the supporting top plate 21 serves as a supporting base of the second elevating mechanism 20 on the first elevating mechanism 10, which is provided with a sufficient planar area so that the placing table 30 can be stably placed on the supporting top plate 21. The supporting top plate 21 is movably disposed above the first lifting mechanism 10, so as to drive the object placing table 30 to lift by lifting relative to the first lifting mechanism 10. In the embodiment in which the first lifting mechanism 10 includes the support base plate 11, the first screw pair 12, and the first driving mechanism 13, the support top plate 21 is movably disposed above the support base plate 11. The second screw pair 22 is disposed between the first elevating mechanism 10 and the support top plate 21, so that the support top plate 21 is in transmission connection with the first elevating mechanism 10 through the second screw pair 22. The second driving mechanism 23 has a second fixed end 231 and a second driving end 232, the second fixed end 231 is mounted on the first lifting mechanism 10 or the supporting top plate 21, and the second driving mechanism 23 is in driving connection with the second screw pair 22 through the second driving end 232.

It will be appreciated that the structure of the second lifting platform on the first lifting platform is similar to that of the first lifting platform on the base 50, and the supporting top plate 21 is driven by the screw pair, so as to ensure that the second lifting mechanism 20 can realize accurate alignment of the PCB board and the positioning fixture 40 when the object placing table 30 is driven to lift.

With continued reference to fig. 8-9, similar in construction to the first lead screw assembly 12, the second lead screw assembly 22 includes:

The second lead screws 221 are provided with a plurality of second lead screws 221, the plurality of second lead screws 221 are uniformly distributed in the edge area of the supporting top plate 21, at least one second lead screw 221 is in driving connection with the second driving end 232, and each second lead screw 221 can be synchronously and rotatably arranged between the supporting top plate 21 and the first lifting mechanism 10.

Second nuts (not shown) corresponding to the number of the second lead screws 221 are arranged on each second lead screw 221 in a driving fit with the second lead screw 221, so that each second nut can move axially relative to the second lead screw 221 under the condition that the corresponding second lead screw 221 rotates.

Illustratively, the second screws 221 of the present embodiment are four, the four second screws 221 are respectively disposed at four corners of the supporting top plate 21, and the four second screws 221 realize synchronous and equidirectional rotation by means of a synchronous belt. While, according to the embodiment in which the second fixed end 231 may be disposed on the first elevating mechanism 10 (the supporting base plate 11) or the supporting top plate 21, taking the second driving mechanism 23 as an example, the second fixed end 231 is defined as a stator (a housing) of the motor, and the second driving end 232 is defined as an output shaft of the motor. The motor can drive the second screw 221 by means of the stator being mounted on the supporting bottom plate 11 or the supporting top plate 21, and by means of the output shaft being coaxially connected with at least one second screw 221, or by means of the driving connection of driving components such as a synchronous belt, a chain, a gear, etc., in this example, one side of the supporting bottom plate 11 extends outwards to form a supporting plate 111 protruding from the base 50, the second driving mechanism 23 is mounted on the supporting plate 111 by means of the second fixing end 231 thereof, and the second driving end 232 is connected with one of the second screws 221 by means of the synchronous belt, so as to save the space occupied by the PCB positioning device in the height direction, and improve the structural compactness of the device.

As is clear from the foregoing, in this embodiment, both the first driving mechanism 13 and the second driving mechanism 23 may be disposed on the supporting base plate 11, so that both the first driving mechanism 13 and the second driving mechanism 23 may be disposed on the supporting base plate 11 together by using the position of the supporting plate 111 disposed on the supporting base plate 11, so as to avoid the situation that the mounting positions of the first driving mechanism 13 and the second driving mechanism 23 are reserved on the base 50 and the supporting top plate 21, respectively, and to reduce the assembly difficulty of the PCB positioning device and simplify the structure of the positioning device.

In the following, according to the above, the present embodiment provides two types of arrangement of the second nut in the second screw pair 22:

1. Each second nut is fixedly connected to the support top plate 21, and the second screw 221 is axially fixed to the first elevating mechanism 10. In this embodiment, when the second screw rod 221 is driven by the second driving mechanism 23, a transmission relationship occurs between the second screw rod 221 and the second nut, and the second nut moves in the direction of the rotation axis of the second screw rod 221 due to the relationship in which the second screw rod 221 is rotatably and axially fixed to the first elevating mechanism 10 (the support base plate 11), thereby elevating the support top plate 21 in the axial direction of the second screw rod 221.

2. Each second nut is fixedly connected to the first elevating mechanism 10, and the second screw 221 is axially fixed to the support top plate 21. In this embodiment, when the second screw 221 is driven by the second driving mechanism 23, the second screw 221 moves up and down in the axial direction of the second nut due to the relationship that the second nut is fixed to the first elevating mechanism 10 (the support base plate 11), so that the support top plate 21 is moved up and down by the movement of the second screw 221 relative to the second nut.

In addition to any of the above embodiments, since the lifting direction of the first lifting mechanism 10 relative to the base 50 is the same as the lifting direction of the second lifting mechanism 20 relative to the first lifting mechanism 10, and the first lifting mechanism 10 is located above the base 50, and the second lifting mechanism 20 is located above the first lifting mechanism 10, a guiding mechanism may be commonly used among the base 50, the first lifting mechanism 10, and the second lifting mechanism 20 to guide the lifting motion therebetween. Specifically, a guide rod 60 is provided between the base 50, the first elevating mechanism 10, and the second elevating mechanism 20, one of the base 50, the first elevating mechanism 10, and the second elevating mechanism 20 is fixedly connected to the guide rod 60 in the axial direction, and the other two are movably connected to the guide rod 60.

In the embodiment in which the first lifting mechanism 10 includes the supporting bottom plate 11 and the second lifting mechanism 20 includes the supporting top plate 21, the base 50, the supporting bottom plate 11 and the supporting top plate 21 are provided with guiding holes for the guiding rod 60 to pass through, one guiding hole of the three guiding holes is fixedly connected with the guiding rod 60, and the guiding holes of the other two guiding holes are movably sleeved on the guiding rod 60.

The base 50, the first lifting mechanism 10 and the second lifting mechanism 20 all guide lifting motions between any two adjacent two through the guide rods 60, mutually independent guide structures are not required to be arranged between the base 50 and the first lifting mechanism 10 and between the first lifting mechanism 10 and the second lifting mechanism 20, the number and complexity of the guide structures in the PCB positioning device are reduced, the integral structure is simplified, and the device is beneficial to manufacturing and mounting of equipment and reduces the difficulty of maintenance and maintenance. In this way, the movement paths of the first elevating mechanism 10 and the second elevating mechanism 20 can be ensured to be uniform, and the elevating accuracy between the three can be effectively improved. In addition, the existence of the guide rod 60 increases the supporting point of the first lifting mechanism 10 on the base 50 and the supporting pad of the second lifting mechanism 20 on the first lifting mechanism 10, so that the lifting process of the two is more stable, and particularly under the condition of large lifting height or large load, the common guide rod 60 can remarkably reduce shaking and deflection generated during the lifting process, and the overall stability of the system is improved.

In one embodiment, the four guide rods 60 are disposed, and the four guide plates are respectively connected to the four corners of the base 50, the supporting bottom 11 and the supporting top 21 in a penetrating manner, so as to maximize the supporting performance and the guiding performance of the guide rods 60 on the first lifting mechanism 10 and the second lifting mechanism 20.

It will be appreciated that in the embodiment in which the first elevating mechanism 10 and the second elevating mechanism 20 respectively adopt the first screw pair 12 and the second screw pair 22 to drive the supporting bottom plate 11 and the supporting top plate 21 to elevate, the first screw pair 12 and the second screw pair 22 naturally also have good supporting formation and guiding performance, but by providing the guide bars 60 on the base 50, the first elevating mechanism 10 and the second elevating mechanism 20, the radial acting force acting on the first screw pair 12 and the second screw pair 22 can be effectively reduced, and the service lives of the first screw pair 12 and the second screw pair 22 can be prolonged on the basis of improving the guiding accuracy and the stability.

In addition, it should be noted that, in the embodiment in which the first screw pair 12 is only engaged with the first screw 121 and the second screw pair 22 is only engaged with the second screw 221, the guiding rod 60 can also restrict the rotational degrees of freedom of the supporting base plate 11 and the base plate 50 in the direction around the Z axis, and the rotational degrees of freedom of the supporting top plate 21 and the supporting base plate 11 in the direction around the Z axis, so as to avoid the situation that the first screw 121 and the second screw 221 drive the supporting base plate 11 and the supporting top plate 21 to rotate during rotation, and thus lifting cannot be achieved.

Referring to fig. 1-4, in an embodiment, the positioning fixture 40 includes a fixed carrier 41 and a movable carrier 42. The fixed carrier 41 is fixedly disposed on one of the first lifting mechanism 10 and the base 50, the movable carrier 42 is movably disposed on one of the first lifting mechanism 10 and the base 50, and inner sides of the movable carrier 42 and the fixed carrier 41 are opposite and spaced to form a clamping space therebetween, and the movable carrier 42 can reciprocate in a direction approaching and separating from the fixed carrier 41, so as to adjust the size of the clamping space.

The fixed carrier 41 and the movable carrier 42 are disposed on the first lifting mechanism 10, so that the positioning fixture 40 can move synchronously with the second lifting mechanism 20 in the process of driving the second lifting mechanism 20 to move up and down by the first lifting mechanism 10, thereby ensuring the stability of the PCB board placed on the second lifting mechanism 20 (the placement table 30).

Of course, in the above-described other embodiments, the positioning jig 40 may be movably disposed outside the first elevating mechanism 10 by other driving mechanisms to achieve the effect of elevating synchronously with the first elevating mechanism 10, but it is obvious that in the manner of disposing the positioning jig 40 in the first elevating mechanism 10, the positioning jig 40 and the second elevating mechanism 20 can have higher positioning accuracy, and the relative heights of both can be determined by the first elevating mechanism 10, so that the synchronous adjustment process of two sets of mutually independent mechanisms is not required.

It can be understood that, because the fixed carrier 41 and the first lifting mechanism 10 are relatively fixed, the fixed carrier 41 and the first lifting mechanism 10 can adopt a connection structure with higher rigidity, so that the connection strength of the fixed carrier 41 and the first lifting mechanism 10 is higher, and because the stability of the fixed carrier 41 is higher, the positioning accuracy of the fixed carrier 41 on the first lifting mechanism 10 is also higher, so that the fixed carrier 41 can be used as a positioning reference of the PCB in the positioning and clamping process, in the clamping process of the PCB, the movable carrier 42 can stably support the other side of the PCB on the fixed carrier 41 by supporting and pushing one side of the PCB, so that the positioning accuracy of the PCB in the clamping space is improved, and the clamping force of the PCB is controlled by the movable carrier 42.

In an embodiment, the upper surfaces of the fixed carrier 41 and the movable carrier 42 are also uniformly provided with a plurality of groups of adsorption structures 44 respectively, the adsorption structures 44 are used for adsorbing and fixing the printed steel mesh which needs to be overlapped with the PCB board in the clamping space on the positioning clamp 40, specifically, after the PCB board is lifted to a position suitable for being clamped by the positioning clamp 40 by the object placing table 30, the positioning clamp 40 can stably clamp the PCB board on the object placing table 30 through the fixed carrier 41 and the movable carrier 42, the printed steel mesh can move in a direction close to the PCB board above the clamping space and finally be placed on the fixed carrier 41 and the movable carrier 42, and is adsorbed and fixed by the adsorption structures 44 on the fixed carrier 41 and the movable carrier 42 respectively, and the PCB board and the printed steel mesh are all used as positioning references through the positioning clamp 40, so that the problem of positioning errors caused by excessive material of parts can be effectively avoided, the stability in the attaching process of the PCB board and the printed steel mesh can be effectively reduced.

Preferably, in this embodiment, the plurality of groups of adsorption structures 44 are uniformly arranged on the upper surfaces of the fixed carrier 41 and the movable carrier 42, so that the contact area between the fixed carrier 41 and the movable carrier 42 and the adsorbed steel mesh can be maximized, the adsorption force applied by the positioning fixture 40 to the printed steel mesh is uniform, and the positioning precision between the printed steel mesh and the PCB board is ensured.

It should be understood that the adsorption structure 44 disposed on the fixed carrier 41 and the movable carrier 42 may be, but is not limited to, vacuum adsorption (such as vacuum adsorption holes), magnetic adsorption (such as magnets or electromagnets), electrostatic adsorption (such as using electrostatic effect to attach the steel mesh to the supporting portion), adhesive adsorption (such as adhesive material or adsorption pad).

In addition to the above structural form, the positioning fixture 40 further includes a pressing plate mechanism 43, where the pressing plate mechanism 43 is movably disposed on the fixed carrier 41 and/or the movable carrier 42, and the pressing plate mechanism 43 has a pressing plate position and a release position. When the pressing plate mechanism 43 is at the pressing plate position, the pressing plate mechanism 43 at least partially protrudes out of the inner side surface of the fixed carrier plate 41 and/or the movable carrier plate 42, so that the pressing plate mechanism 43 protruding out of the inner side surface of the fixed carrier plate 41 and the inner side surface of the movable carrier plate 42 can be located in the clamping space to restrict the height position of the PCB located in the clamping space, when the PCB is lifted upwards under the clamping space, the upper surface of the PCB can be finally abutted against the pressing plate mechanism 43 located at the pressing plate position, the height position of the PCB is ensured to meet the subsequent tin brushing requirement, and the PCB is further clamped and fixed. When the pressing plate mechanism 43 is at the release position, the pressing plate mechanism 43 is retracted into the inner side surface of the fixed carrier 41 and/or the movable carrier 42 to release the PCB located in the clamping space, so that the PCB can move relative to the positioning fixture 40 to disengage from the corresponding station or enter the clamping space from the previous station.

In this example, the movable carrier plate 42 and the fixed carrier plate 41 are respectively mounted on the first lifting mechanism 10 (supporting bottom plate 11) through a gantry supporting frame 45, wherein the gantry supporting frame 45 for supporting the movable carrier plate 42 is movably connected with the first lifting mechanism 10 through a spacing adjusting structure 46 (such as a guide rail and a guide block), a spacing adjusting motor 47 is disposed on the first lifting mechanism 10, an output shaft of the spacing adjusting motor 47 is provided with an adjusting screw 48, and the adjusting screw 48 is in driving connection with the gantry supporting frame 45 for supporting the movable carrier plate 42 through an adjusting nut (not shown) so as to drive the adjusting screw 48 to move along a direction guided by the spacing adjusting structure 46 in a manner of driving the adjusting screw 48 to rotate, thereby achieving the purpose of moving the movable carrier plate 42 towards or away from the fixed carrier plate 41.

In this example, in order to make the adjustment stability of the movable carrier plate 42 and the fixed carrier plate 41 higher, the opposite ends of the gantry supporting frame 45 are both provided with adjusting screws 48, the distance adjusting motor 47 is connected with one of the adjusting screws 48, and the two adjusting screws 48 can be in synchronous transmission connection through transmission structures such as synchronous belts.

S20, the second lifting mechanism 20 drives the object placing table 30 to lift, so that the PCB moves towards the clamping space direction, the second lifting mechanism 20 stops moving when the upper surface of the PCB is propped against the pressing plate mechanism 43, and then the movable carrier plate 42 in the positioning clamp 40 moves towards the direction close to the fixed carrier plate 41, so that the clamping force is applied to the PCB, and the PCB can be stably clamped and fixed on the object placing table 30 by the positioning clamp 40;

It can be seen that the existence of the pressing plate mechanism 43 can restrict the height position of the PCB before the PCB is clamped and fixed, so that the height position of the PCB on the positioning fixture 40 can meet the matching requirement with the steel mesh (on the position flush or near flush with the upper surfaces of the fixed carrier 41 and the movable carrier 42), and when the printed steel mesh is loaded on the subsequent fixed carrier 41 and the movable carrier 42, the printed surface of the PCB can better achieve the bonding with the lower surface of the printed steel mesh, and the final tin brushing effect is improved.

From the foregoing, it will be appreciated that the base 50 is an important component of the PCB board positioning apparatus, and provides a stable supporting base for the first lifting mechanism 10 and the second lifting mechanism 20, and in some embodiments, the base 50 may be a supporting structure for fixedly mounting the first lifting mechanism 10 on the solder paste printing apparatus, and in this embodiment, the base 50 may be further configured to adjust the position of the first lifting mechanism 10 (and the second lifting mechanism 20) in the horizontal direction, so that the PCB board positioning apparatus can adjust the position of the PCB board in the horizontal direction when the PCB board is placed on the placement table 30, thereby achieving the effect on the PCB board in the Z-axis direction (vertical direction) with respect to the printed steel net.

Of course, in other embodiments, the solder paste printing apparatus may also achieve the above object by adjusting the position of the printed steel mesh in the horizontal direction.

Taking the embodiment in which the base 50 is configured to be able to adjust the position of the first lifting mechanism 10 as an example, referring to fig. 1 to 5 of the specification, the base 50 of this embodiment includes an X-axis adjusting mechanism for adjusting the position of the first lifting mechanism 10 in the X-axis direction, a Y-axis adjusting mechanism for adjusting the position of the first lifting mechanism 10 in the Y-axis direction, and a T-axis adjusting mechanism 53 for adjusting the position of the first lifting mechanism 10 in the Z-axis direction.

It should be understood that the X-axis direction and the Y-axis direction in this embodiment are two directions perpendicular to each other in the horizontal plane rectangular coordinate system of the first lifting mechanism 10, and in colloquially speaking, in the case of the placement table 30 in which the PCB board is placed on the second lifting mechanism 20, the X-axis adjusting mechanism 51 and the Y-axis adjusting mechanism 52 are used to adjust the positions of the PCB board in the length direction and the width direction thereof, respectively. The direction about the axis Z in the present embodiment refers to a direction of rotation on a plane formed by the X axis and the Y axis, wherein the axis Z is perpendicular to the horizontal plane, so as to adjust the plane rotation angle of the PCB board when the PCB board is placed on the placement table 30.

In theory, the order of setting the three adjusting mechanisms is not specifically defined or required, but for example, in this embodiment, the Y-axis adjusting mechanism 52 may be provided on the X-axis adjusting mechanism 51 so that the Y-axis adjusting mechanism 52 can reciprocate in the X-axis direction under the action of the X-axis adjusting mechanism 51, the T-axis adjusting mechanism 53 may be provided on the Y-axis adjusting mechanism 52 so that the T-axis adjusting mechanism 53 can reciprocate in the Y-axis direction under the action of the Y-axis adjusting mechanism 52, and the first elevating mechanism 10 may be provided on the T-axis adjusting mechanism 53 so that the first elevating mechanism 10 can also realize movement adjustment in the X-axis direction and the Y-axis direction by the X-axis adjusting mechanism 51 and the Y-axis adjusting mechanism 52, respectively or simultaneously, on the basis of rotation about the Z-axis direction under the action of the T-axis adjusting mechanism 53.

It is understood that the X-axis adjusting mechanism 51 and the Y-axis adjusting mechanism 52 according to the present embodiment may adopt a linear motion structure relatively common in the mechanical field, such as, but not limited to, a linear guide structure, a screw driving structure, a rack and pinion structure, an air-floating or magnetic-floating structure, etc. The T-axis adjusting mechanism 53 may employ a relatively common rotation structure in the mechanical field, such as but not limited to a universal turntable structure, a magnetic base structure, a gear transmission structure, etc.

In the present embodiment, the X-axis adjusting mechanism 51 and the Y-axis adjusting mechanism 52 each adopt a screw structure with high transmission accuracy and stability to adjust the X-axis and the Y-axis, respectively. As shown in fig. 1-5, the X-axis adjusting mechanism 51 includes an X-axis bottom plate 511 and an X-axis screw pair 512, wherein the X-axis screw pair 512 is disposed between the Y-axis adjusting mechanism 52 and the X-axis bottom plate 511, and pushes the Y-axis adjusting mechanism 52 to move along the X-axis direction under the action of the X-axis screw pair 512. The Y-axis adjusting mechanism 52 includes a Y-axis bottom plate 521, a Y-axis top plate 522, and a Y-axis screw pair 523, the Y-axis bottom plate 521 is located above the X-axis bottom plate 511, the X-axis screw pair 512 is connected to the X-axis bottom plate 511 and the Y-axis bottom plate 521, the Y-axis bottom plate 521 is slidably disposed on the X-axis bottom plate 511 through an X-axis guide rail 513 extending along the X-axis direction, the Y-axis top plate 522 is slidably disposed on the Y-axis bottom plate 521 through a Y-axis guide rail 524 extending along the Y-axis direction, the Y-axis screw pair 523 is disposed between the Y-axis bottom plate 521 and the Y-axis top plate 522 for driving the Y-axis top plate 522 to move relative to the Y-axis bottom plate 521 along the Y-axis direction, and the T-axis adjusting mechanism 53 is rotatably disposed on the Y-axis top plate 522 about the Z-axis. The T-axis adjusting mechanism 53 includes an adjusting base 531 and a third driving mechanism 532, where the adjusting base 531 is rotatably disposed on the Y-axis adjusting mechanism 52 around the axis of rotation of the Z-axis, in the embodiment of the Y-axis adjusting mechanism 52 including the Y-axis bottom plate 521 and the Y-axis top plate 522, the Y-axis top plate 522 is convexly provided with a circular truncated cone structure 5221, and the adjusting base 531 is correspondingly provided with a rotating slot 5311 with a structure matching the circular truncated cone structure 5221, and the adjusting base 531 is rotatably disposed on the circular truncated cone structure 5221 through the rotating slot 5311, so that the adjusting base 531 can rotate around the axis direction of the Z-axis under the mutual constraint of the rotating slot 5311 and the circular truncated cone structure 5221. The third driving mechanism 532 has a third fixed end 5321 and a third driving end 5322, the third driving end 5322 can make a linear motion relative to the third fixed end 5321, and the motion track of the third driving end 5322 relative to the third fixed end 5321 is staggered with the rotation axis of the adjusting base 531, the third fixed end 5321 is mounted on the Y-axis adjusting mechanism 52 (Y-axis top plate 522), and the third driving end 5322 is connected to the adjusting base 531 through a movable component 533, so that when the third driving end 5322 reciprocates along the linear direction, the adjusting base 531 can be driven to rotate forward or reversely along the tangential direction of the adjusting base 531 (circular truncated cone structure 5221) through the movable component 533.

According to the embodiment, through the structure, the forward rotation adjustment and the reverse rotation adjustment of the adjustment base 531 in the direction around the Z-axis are realized, the requirements of fine accurate adjustment of the adjustment base 531 in the forward rotation direction and the square brick direction can be met, the structural layout is more compact, and a relatively large-size driving motor, a speed reducer and other structures are not required to be arranged between the T-axis adjusting mechanism 53 and the Y-axis adjusting mechanism 52, so that the PCB positioning device is favorably applied to solder paste printing equipment.

It should be noted that, because the moving direction of the third driving mechanism 532 is different from the interaction direction of the adjusting base 531, the distance between the third driving end 5322 and the adjusting base 531 will change during the movement of the adjusting base 531 driven by the third driving mechanism 532, so that the movable assembly 533 is required to be additionally arranged between the third driving end 5322 and the adjusting base 531 in the present embodiment, so as to compensate the position change between the third driving end 5322 and the adjusting base 531 correspondingly, and ensure that a stable driving connection relationship between the third driving end 5322 and the adjusting base 531 is maintained.

In the present embodiment, the third driving mechanism 532 may be provided as, but not limited to, a screw pair, a linear motor, or the like. The movable component 533 may be a spring, rubber, or other component with a certain deformation and restoring property.

In an embodiment, a solder paste printing apparatus is further provided, which includes an image capturing unit 70 (such as a camera) and a range finder 80, besides the PCB positioning device described in any one of the above embodiments, where the image capturing unit 70 and the range finder 80 are disposed above the placement table 30 at intervals along the Z-axis direction, and specifically, both are located above the clamping space. In a state that the object placing table 30 is placed with the PCB and the PCB is clamped and fixed by the positioning fixture 40, the image collecting unit 70 is configured to obtain image data of the PCB and the positioning fixture 40 located in the clamping space, specifically, after the image collecting unit 70 obtains the image data of the PCB and the positioning fixture 40, the solder paste printing apparatus obtains the Mark point (positioning point or datum point) on the PCB and the position of the Mark point on the positioning fixture 40 through an algorithm, and determines the specific clamping position of the PCB on the positioning fixture 40 by calculating the relative positions of the Mark point and the Mark point, so that the solder paste printing apparatus can adjust the position of the PCB and the printing steel mesh by adjusting the position of the printing steel mesh or adjusting the position of the PCB through the base 50 as described above, thereby meeting the subsequent bonding printing requirement. The rangefinder 80 in this embodiment may, but is not limited to, use a laser rangefinder, an ultrasonic rangefinder, and an infrared rangefinder, and is configured to obtain distance data between the rangefinder and a PCB board located in a clamping space, determine whether the PCB board is arched in a state clamped by the positioning fixture 40 according to a change of the distance data, and control a clamping force applied to the PCB board by the positioning fixture 40 (the movable carrier 42) according to a determination result, so as to ensure that the PCB board can be stably clamped, and avoid deformation caused by excessive clamping force, and ensure that the PCB board and a printed steel mesh are in a relatively stable state, so that both positioning accuracy and machining accuracy can be improved.

Meanwhile, since the clamping force applied by the positioning clamp 40 to the PCB board is determined according to the distance data collected by the distance meter 80, the clamping force applied by the positioning clamp 40 to the board can be changed according to the size and type of the board, or the change of deformation coefficient and size error, so that the clamping effect is unified, the board positioning clamp 40 can meet higher process requirements, and the quality of the final product is improved.

The embodiment also provides a positioning method of a PCB according to the solder paste printing device, and the positioning method of the PCB comprises the following steps:

s10, acquiring distance data between the PCB and the PCB in the clamping space through a range finder 80;

S20, judging whether the PCB in the clamping space is arched or not according to the distance data;

and S30, adjusting the clamping force applied to the plate by the movable carrier plate 42 by adopting a proportional servo valve according to the judging result.

In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are merely for convenience of description and to simplify the operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.

In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.

The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims

1. A PCB board positioning device, characterized in that it comprises:

A first lifting mechanism (10) is arranged on a base (50) of the PCB board positioning device, and the first lifting mechanism (10) can perform lifting movement relative to the base (50) along a Z-axis direction; and

A second lifting mechanism (20) is arranged on the first lifting mechanism (10) and is located above the first lifting mechanism (10); the second lifting mechanism (20) can perform lifting movement along the Z-axis direction relative to the first lifting mechanism (10); and a storage platform (30) for placing a PCB board is also arranged on the upper part of the second lifting mechanism (20);

The positioning fixture (40) is located above the second lifting mechanism (20), and the positioning fixture (40) forms a clamping space for the PCB board. The storage platform (30) can move towards and away from the clamping space under the drive of the second lifting mechanism (20).

2. The PCB board positioning device according to claim 1, characterized in that the first lifting mechanism (10) comprises:

A supporting base plate (11) movably disposed on the base (50);

A first screw pair (12) is arranged between the base (50) and the supporting base plate (11), so that the supporting base plate (11) is transmission-connected to the base (50) through the first screw pair (12);

The first driving mechanism (13) comprises a first fixed end (131) and a first driving end (132), wherein the first fixed end (131) is mounted on the supporting base plate (11) or the base (50), and the first driving mechanism (13) is drivingly connected and matched with the first screw pair (12) via the first driving end (132).

3. The PCB board positioning device according to claim 2, characterized in that the first screw pair (12) comprises:

A first lead screw (121), wherein the first lead screw (121) is provided in a plurality, and the plurality of first lead screws (121) are evenly distributed in the edge area of the support base plate (11), at least one first lead screw (121) is drivingly engaged with the first driving end (132), and each first lead screw (121) is synchronously rotatably provided between the support base plate (11) and the base (50);

first nuts, the number of which is consistent with the number of the first lead screws (121), and each of the first nuts is respectively in transmission cooperation with each of the first lead screws (121);

Each of the first nuts is fixedly connected to the supporting base plate (11), and the first lead screw (121) is axially fixed to the base (50); or each of the first nuts is fixedly connected to the base (50), and the first lead screw (121) is axially fixed to the supporting base plate (11).

4. The PCB board positioning device according to claim 1, characterized in that the second lifting mechanism (20) comprises:

A supporting top plate (21) movably disposed above the first lifting mechanism (10);

a second screw pair (22) disposed between the first lifting mechanism (10) and the supporting top plate (21), so that the supporting top plate (21) is transmission-connected to the first lifting mechanism (10) through the second screw pair (22);

The second driving mechanism (23) comprises a second fixed end (231) and a second driving end (232), wherein the second fixed end (231) is mounted on the first lifting mechanism (10) or the supporting top plate (21), and the second driving mechanism (23) is drivingly connected and matched with the second screw pair (22) via the second driving end (232).

5. The PCB board positioning device according to claim 4, characterized in that the second lead screw pair (22) comprises:

a second lead screw (221), wherein the second lead screw (221) is provided in a plurality, and the plurality of second lead screws (221) are evenly distributed in the edge area of the support top plate (21), at least one second lead screw (221) is drivingly engaged with the second driving end (232), and each second lead screw (221) is synchronously rotatably provided between the support top plate (21) and the first lifting mechanism (10);

second nuts, the number of the second nuts being consistent with the number of the second lead screws (221), and each of the second nuts being respectively in transmission cooperation with each of the second lead screws (221);

Each of the second nuts is fixedly connected to the support top plate (21), and the second lead screw (221) is axially fixed to the first lifting mechanism (10); or each of the second nuts is fixedly connected to the first lifting mechanism (10), and the second lead screw (221) is axially fixed to the support top plate (21).

6. The PCB board positioning device according to claim 1 is characterized in that a guide rod (60) is further arranged between the base (50), the first lifting mechanism (10) and the second lifting mechanism (20), and one of the base (50), the first lifting mechanism (10) and the second lifting mechanism (20) is axially fixedly connected to the guide rod (60), and the other two are movably connected to the guide rod (60).

7. The PCB board positioning device according to claim 1, characterized in that the positioning fixture (40) comprises:

A fixed carrier plate (41) fixedly disposed on the first lifting mechanism (10); and

A movable carrier plate (42) is movably arranged on the first lifting mechanism (10); the inner side surfaces of the movable carrier plate (42) and the fixed carrier plate (41) are arranged opposite to each other and spaced apart to form the clamping space therebetween; the movable carrier plate (42) can reciprocate in a direction approaching and moving away from the fixed carrier plate (41) to adjust the size of the clamping space;

A pressing plate mechanism (43) is movably arranged on the fixed carrier plate (41) and/or the movable carrier plate (42), and the pressing plate mechanism (43) has a pressing plate position and a releasing position; when the pressing plate mechanism (43) is in the pressing plate position, the pressing plate mechanism (43) at least partially protrudes from the inner side surface of the fixed carrier plate (41) and/or the movable carrier plate (42); when the pressing plate mechanism (43) is in the releasing position, the pressing plate mechanism (43) is retracted into the inner side surface of the fixed carrier plate (41) and/or the movable carrier plate (42);

Multiple groups of adsorption structures (44) are evenly distributed on the upper surfaces of the fixed carrier plate (41) and the movable carrier plate (42).

8. The PCB board positioning device according to any one of claims 1 to 5, characterized in that the base (50) comprises:

X-axis adjustment mechanism (51);

A Y-axis adjustment mechanism (52) is arranged on the X-axis adjustment mechanism (51) so as to be reciprocatingly movable along the X-axis direction;

The T-axis adjustment mechanism (53) is arranged on the Y-axis adjustment mechanism (52) so as to be reciprocating along the Y-axis direction, and the first lifting mechanism (10) is arranged on the T-axis adjustment mechanism (53) so as to be rotatable around the Z-axis.

9. The PCB board positioning device according to claim 8, characterized in that the T-axis adjustment mechanism (53) comprises:

An adjustment base (531) is rotatably arranged on the Y-axis adjustment mechanism (52) around the Z-axis;

The third driving mechanism (532) comprises a third fixed end (5321) and a third driving end (5322), wherein the third driving end (5322) can perform linear motion relative to the third fixed end (5321), the third fixed end (5321) is mounted on the Y-axis adjustment mechanism (52), and the third driving end (5322) is connected to the adjustment base (531) via a movable component (533), so that the third driving end (5322) can drive the adjustment base (531) to rotate forward or reversely via the movable component (533) when reciprocating in a linear direction.

10. A solder paste printing device, characterized in that it comprises:

A PCB board positioning device as claimed in any one of claims 1 to 9;

An image acquisition unit (70) is arranged above the clamping space and is used to acquire image data of the PCB board and the positioning fixture (40) located in the clamping space;

A distance meter (80) is arranged above the clamping space and is used to obtain distance data between the distance meter and the PCB board located in the clamping space.