CN119153375A - Wafer processing equipment and control method thereof - Google Patents
Wafer processing equipment and control method thereof Download PDFInfo
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- CN119153375A CN119153375A CN202411648997.1A CN202411648997A CN119153375A CN 119153375 A CN119153375 A CN 119153375A CN 202411648997 A CN202411648997 A CN 202411648997A CN 119153375 A CN119153375 A CN 119153375A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides wafer processing equipment and a control method thereof, wherein the wafer processing equipment is used for processing wafers and comprises a first robot and a second robot, the first robot and the second robot are arranged opposite to each other, an accommodating space is reserved between the first robot and the second robot, a hot disc or a cold disc module is arranged in the accommodating space, a centering module is arranged in the accommodating space, a wafer box is used for storing the wafers and is arranged close to the first robot, a spin developing module is arranged close to the second robot, each module is arranged in a centralized manner, the two robots allocate process steps, the equipment productivity is improved, the length of a moving path of the first robot and the second robot is reduced, the grabbing efficiency of the first robot and the second robot is improved, the occupied area of the wafer processing equipment is reduced, the equipment layout of a production workshop is conveniently planned, and the equipment layout is more reasonable.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to wafer processing equipment and a control method thereof.
Background
In the existing photoetching process for semiconductor processing, photoresist coating process flow, photoetching process flow and developing process flow are respectively completed by photoresist coating equipment, photoetching equipment and developing equipment. With the improvement of the semiconductor processing technology level, the main market flow integrates the gumming and developing process flow on the same equipment. However, in the practical use process, the wafer processing equipment only uses one robot, the productivity bottleneck is that the robot has small productivity and large occupied area, and the space planning of a production workshop is not reasonable enough, so that the brand new wafer processing equipment is provided, the occupied area of the wafer processing equipment is reduced, and the space planning is more reasonable and necessary.
Disclosure of Invention
Therefore, the invention provides wafer processing equipment to solve the problems of small number of wafers produced per hour, small productivity and large occupied area of the wafer processing equipment.
The wafer processing equipment comprises a first robot, a second robot, a hot disc or cold disc module, a centering module, a wafer box and a spin developing module, wherein the first robot and the second robot are arranged oppositely, an accommodating space is reserved between the first robot and the second robot, the hot disc or cold disc module is used for adjusting the temperature of a wafer, the hot disc or cold disc module is arranged in the accommodating space, the centering module is arranged in the accommodating space, the wafer box is used for storing the wafer, the wafer box is arranged close to the first robot, and the spin developing module is arranged close to the second robot.
Compared with the prior art, the wafer processing equipment has the technical effects that the first robot and the second robot are oppositely arranged and mutually matched to improve the production efficiency of the wafer processing equipment, the hot plate or cold plate module and the centering module are arranged in the accommodating space, the wafer box is arranged close to the first robot, the photoresist homogenizing and developing module is arranged close to the second robot, the first robot and the second robot are convenient to grasp the wafer, meanwhile, the modules are arranged in a concentrated mode, the two robots share the processing steps, the length of the moving paths of the first robot and the second robot is reduced, the grasping efficiency of the first robot and the second robot is improved, the occupied area of the wafer processing equipment is reduced, the equipment layout of a production workshop is convenient to plan, and the equipment layout is more reasonable.
Further, the wafer box is arranged on the peripheral side of the first robot, so that the first robot can grasp wafers in the wafer box.
Compared with the prior art, the wafer box has the technical effects that the wafer box is arranged on the periphery of the first robot, the occupied area of the wafer processing equipment is reduced, and meanwhile, in the process that the first robot grabs the wafer, the two robots apportion the process steps, so that the length of the motion path of the first robot is reduced, the moving efficiency of the first robot is improved, and the processing efficiency of the wafer processing equipment is further improved.
Further, the spin developing module is disposed at a peripheral side of the second robot, so that the second robot can grasp the wafer in the spin developing module.
Compared with the prior art, the technical effect that the even gum developing module is arranged on the periphery of the second robot, so that the occupied area of the wafer processing equipment is reduced, and meanwhile, the length of the motion path of the second robot is reduced, the moving efficiency of the second robot is improved, and the processing efficiency of the wafer processing equipment is further improved.
Further, a hot plate or cold plate module is disposed proximate to the second robot.
Compared with the prior art, the technical effect that the hot tray or cold tray module is close to the second robot is achieved, the occupied area of wafer processing equipment is reduced, meanwhile, in the process of placing the wafer by the second robot, the length of the movement track of the second robot is reduced, and the movement efficiency of the second robot is improved.
Further, the centering module is arranged between the hot disc or the cold disc module and the first robot.
Compared with the prior art, the wafer processing device has the technical effects that in the wafer processing process, the first robot grabs the wafer from the wafer box, and the wafer is placed on the centering module for centering detection, the centering module is arranged close to the first robot, so that the length of the motion track of the first robot is reduced, the moving efficiency of the first robot is improved, and meanwhile, the occupied area of wafer processing equipment is reduced.
Furthermore, the invention also provides a control method of the wafer processing equipment, which comprises the steps of controlling the first robot to clamp the wafer to be processed in the wafer box and placing the wafer on the centering module, and controlling the centering module to center the wafer to be processed so as to obtain a centered wafer.
Compared with the prior art, the wafer box has the technical effects that the wafer box is used for storing wafers, the first robot clamp is used for taking the wafers to be processed in the wafer box, the wafers are placed on the centering module, the offset of the wafers is detected, the centering wafers are obtained, and the follow-up processing procedure is convenient to carry out.
Further, after the centering module is controlled to center the wafer to be processed, the control method further comprises the steps of controlling the second robot to clamp the centering wafer and place the centering wafer on the photoresist developing module, controlling the photoresist developing module to glue or develop the centering wafer to obtain a photoresist wafer or a developing wafer, wherein the photoresist wafer is obtained under the condition that the photoresist developing module is controlled to glue the centering wafer, and the developing wafer is obtained under the condition that the photoresist developing module is controlled to develop the centering wafer.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is that after the centering wafer is obtained, the surface of the wafer is required to be glued or developed, the second robot clamps the centering wafer from the centering module and places the centering wafer in the spin-coating and developing module, and the spin-coating and developing module is controlled to glue or develop the centering wafer.
Further, after the photoresist coating and developing module is controlled to coat or develop the middle wafer, the control method further comprises the steps of controlling the second robot to clamp the photoresist coating wafer or the developing wafer and place the wafer on the hot plate or the cold plate module, and controlling the hot plate or the cold plate module to heat or cool the photoresist coating wafer to obtain the dried wafer.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is that after the surface of the wafer is coated with the glue, the wafer is required to be dried, the wafer in the glue homogenizing and developing module is clamped by the second robot and placed on the hot plate or the cold plate module, and the hot plate or the cold plate module adjusts the temperature of the wafer so that the glue solution on the surface of the wafer is dried.
Further, after the hot tray or the cold tray module is controlled to heat or cool the spin-on wafer, the control method further comprises the step of controlling the first robot to clamp the dried wafer and place the wafer in the wafer box.
Compared with the prior art, the wafer drying device has the technical effects that after the wafer is dried, the wafer is clamped by the first robot and placed in the wafer box, so that the wafer is convenient for an operator to collect.
After the technical scheme of the invention is adopted, the following technical effects can be achieved:
(1) The first robot and the second robot are oppositely arranged and matched with each other so as to improve the production efficiency of the wafer processing equipment, the hot disc or cold disc module and the centering module are arranged in the accommodating space, the wafer box is arranged close to the first robot, the spin developing module is arranged close to the second robot, the first robot and the second robot are convenient to grasp the wafer, meanwhile, the modules are intensively arranged, the two robots share the process steps, the length of the moving paths of the first robot and the second robot is reduced, the grasping efficiency of the first robot and the second robot is improved, the occupied area of the wafer processing equipment is reduced, the equipment layout of a production workshop is conveniently planned, and the equipment layout is more reasonable;
(2) The wafer box is arranged on the periphery of the first robot, so that the occupied area of the wafer processing equipment is reduced, and meanwhile, in the process of grabbing the wafer by the first robot, the two robots share the process steps, so that the length of a motion path of the first robot is reduced, the moving efficiency of the first robot is improved, and the processing efficiency of the wafer processing equipment is further improved;
(3) The spin developing module is arranged on the periphery of the second robot, so that the occupied area of the wafer processing equipment is reduced, and meanwhile, the length of the motion path of the second robot is also reduced, and therefore the moving efficiency of the second robot is improved, and the processing efficiency of the wafer processing equipment is further improved.
Drawings
Fig. 1 is a schematic diagram of a first layout of a wafer processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a second layout of a wafer processing apparatus;
FIG. 3 is a third layout schematic of a wafer processing apparatus;
Fig. 4 is a flow chart of a control method.
Reference numerals illustrate:
100 parts of wafer processing equipment, 110 parts of first robots, 120 parts of second robots, 130 parts of hot disc or cold disc modules, 140 parts of centering modules, 150 parts of wafer cassettes and 160 parts of spin coating and developing modules.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The present invention provides a wafer processing apparatus 100. As shown in FIG. 1, the wafer processing apparatus 100 is used for processing a wafer, and the wafer processing apparatus 100 includes a first robot 110, a second robot 120, a hot or cold plate module 130, a centering module 140, a wafer cassette 150, and a spin coater module 160. The first robot 110 and the second robot 120 are arranged opposite to each other, an accommodating space 101 is reserved between the first robot 110 and the second robot 120, a hot disc or cold disc module 130 is used for adjusting the temperature of the wafer, the hot disc or cold disc module 130 and a centering module 140 are arranged in the accommodating space 101, a wafer box 150 is used for storing the wafer, the wafer box 150 is arranged close to the first robot 110, and a spin developing module 160 is arranged close to the second robot 120.
Specifically, as shown in fig. 1, the first robot 110 and the second robot 120 are oppositely disposed, in the prior art, one robot is disposed on the processing device to perform grabbing movement, so that the arrangement not only aggravates the load of the robot, but also reduces the production efficiency of the wafer processing device, so that the wafer processing device 100 provided by the invention is provided with two robots, and the first robot 110 and the second robot 120 are mutually matched, so that the overload of one robot is avoided, and the working efficiency of the wafer processing device 100 is ensured. The space between the first robot 110 and the second robot 120 is the accommodating space, and in the wafer processing process, the first robot 110 and the second robot 120 can grasp the wafers in the hot tray or cold tray module 130 and the centering module 140, so that the hot tray or cold tray module 130 and the centering module 140 are arranged in the accommodating space, the length of the motion track of the first robot 110 and the length of the motion track of the second robot 120 can be greatly reduced, the moving speed of the first robot 110 and the moving speed of the second robot 120 are improved, the wafer box 150 is arranged close to the first robot 110, the spin developing module 160 is arranged close to the second robot 120, the length of the motion track of the first robot 110 and the length of the motion track of the second robot 120 are also reduced, and the two robots share the processing steps, so that the load of the robots is reduced. The modules of the wafer processing apparatus 100 are compactly arranged to reduce the floor space of the wafer processing apparatus 100, so that the space planning of the production shop is more reasonable.
For example, cassette 150 is disposed on a peripheral side of first robot 110 such that first robot 110 is capable of gripping wafers within cassette 150.
For example, as shown in fig. 1, the wafer cassette 150 is disposed on a peripheral side of the first robot 110, so that the first robot 110 can grasp the wafers stored in the wafer cassette 150, and meanwhile, the wafer cassette 150 is arranged in a line, so that the space occupied by the wafer processing apparatus 100 is reduced.
Preferably, as shown in fig. 2, cassette 150 may also be disposed around first robot 110, also reducing the space occupied by wafer processing apparatus 100.
Specifically, the spin coater module 160 is disposed on a peripheral side of the second robot 120, so that the second robot 120 can grasp the wafer in the spin coater module 160.
Specifically, the spin developing module 160 is provided with a plurality of spin developing modules, as shown in fig. 1, and the spin developing module 160 is provided with three columns, each column is provided with two spin developing modules, and meanwhile, as shown in fig. 2, the spin developing module 160 may also be disposed around the second robot 120, so as to reduce the length of the motion track of the second robot 120, shorten the motion time of the second robot 120, and thereby improve the production efficiency of the wafer processing apparatus 100.
The spin developing module 160 may be a spin module or a developing module, and may be set according to actual production requirements.
For example, a hot or cold plate module 130 is disposed proximate to the second robot 120.
For example, as shown in fig. 1, the hot tray or cold tray module 130 is disposed close to the second robot 120, and in the process of processing a wafer, the glue on the surface of the wafer needs to be dried after the wafer is glued, so that the hot tray or cold tray module 130 needs to be disposed on the wafer processing apparatus 100 to dry the glue on the surface of the wafer, and in the process of moving the wafer, the second robot 120 is required to grasp the wafer and place the wafer on the hot tray or cold tray module 130, so that the hot tray or cold tray module 130 is disposed close to the second robot 120, thereby reducing the moving distance of the second robot 120, reducing the occupied area of the wafer processing apparatus 100, and simultaneously shortening the moving time of the second robot 120, so as to improve the processing efficiency of the wafer processing apparatus 100.
It is additionally noted that the hot tray or cold tray module 130 is provided in plurality to enable drying of a plurality of wafers at the same time.
For example, the centering module 140 is provided between the hot or cold plate module 130 and the first robot 110.
For example, as shown in fig. 1, the centering module 140 is disposed between the hot tray or cold tray module 130 and the first robot 110, and during the wafer processing, the first robot 110 grabs the wafer from the wafer box 150, and places the wafer on the centering module 140 for centering detection, and the centering module 140 is disposed close to the first robot 110, so that the length of the motion track of the first robot 110 is reduced, the movement efficiency of the first robot 110 is improved, and meanwhile, the floor area of the wafer processing apparatus 100 is also reduced.
The size of the wafer processing device 100 provided by the application is 1100mm x 190 mm x 2200mm, the size of the device in the prior art is 1100mm x 1500mm, and the occupied area of the existing device is 1.1 times that of the wafer processing device 100 provided by the application, so that compared with the existing device, the occupied area of the wafer processing device 100 provided by the application is reduced, and meanwhile, the wafer processing device 100 provided by the application adopts cooperative cooperation of two robots, compared with the existing device, the wafer processing device 100 provided by the application only uses one robot for grabbing movement, reduces the load of the robot in the operation process, improves the production efficiency of the wafer processing device 100, and greatly improves the productivity of the wafer processing device 100.
The wafer processing apparatus 100 may also adopt the layout shown in fig. 3, where the first robot 110 grabs a wafer to be processed in a wafer box, and places the wafer to be processed in the centering module 140, the centering module 140 centers the wafer to be processed to obtain a centering wafer, the second robot 120 grabs the centering wafer and places the centering wafer in the photoresist developing module 160, and controls the photoresist developing module to glue or develop the centering wafer, so as to obtain a photoresist wafer or a developing wafer, the second robot 120 grabs the photoresist wafer or the developing wafer, places the photoresist wafer or the developing wafer in the hot tray module, dries the photoresist solution or the developing solution on the surface of the wafer, and places the photoresist wafer or the developing wafer in the cold tray module for cooling, and finally grabs the cooled photoresist wafer or the developing wafer by the first robot 110, and places the photoresist wafer or the developing wafer back into the wafer box 150 for collection by an operator.
Or the first robot 110 grabs the wafer to be processed in the wafer box 150, places the wafer in the centering module 140 for centering so as to obtain a centering wafer, the first robot 110 grabs the centering wafer, places the centering wafer in the hot plate module for drying so as to obtain a dried wafer, then the first robot 110 grabs the dried wafer and places the dried wafer in the cold plate module so as to obtain a cooled dried wafer, the second robot 120 grabs the cooled dried wafer and places the cooled dried wafer in the spin-coating developing module 160 so as to obtain a spin-coating wafer or a developing wafer, the second robot 120 grabs the spin-coating wafer or the developing wafer and places the spin-coating wafer or the developing wafer in the hot plate module, after the temperature is raised in the hot plate module, the second robot 120 grabs the spin-coating wafer or the developing wafer after the temperature is raised, places the spin-coating wafer in the cold plate module for cooling, and finally the spin-coating wafer or the developing wafer after the first robot 110 grabs the spin-coating wafer and places the spin-coating wafer in the wafer into the wafer box 150 for collection by operators.
The number of hot tray modules and cold tray modules is set according to actual production requirements, and is not limited herein.
The invention also provides a control method of the wafer processing equipment, as shown in fig. 4, the control method comprises the following steps:
S100, controlling a first robot to clamp a wafer to be processed in the wafer box and placing the wafer on a centering module;
S200, controlling the centering module to center the wafer to be processed so as to obtain a centered wafer;
s300, controlling a second robot to clamp and pick the centering wafer, and placing the centering wafer on a spin developing module;
s400, controlling a photoresist uniformizing and developing module to carry out photoresist coating or developing on the middle wafer so as to obtain a photoresist uniformizing wafer or a developing wafer;
S500, controlling a second robot to clamp a spin wafer or a developing wafer, and placing the spin wafer or the developing wafer on a hot plate or a cold plate module;
S600, controlling a hot plate or cold plate module to heat or cool the spin-coating wafer or the developing wafer so as to obtain a dried wafer;
s700, controlling a first robot to clamp and take the dried wafer, and placing the wafer in a wafer box;
Specifically, during the processing of the wafer, the wafer to be processed is stored in the wafer box, the wafer to be processed is grasped by the first robot and placed on the centering module for centering, so as to obtain a centering wafer, then the centering wafer in the centering module is grasped by the second robot, the centering wafer is placed in the spin-coating and developing module for coating or developing, the spin-coating wafer is obtained under the condition that the centering wafer is coated by the spin-coating and developing wafer, the developing wafer is obtained under the condition that the spin-coating and developing wafer is developed, the spin-coating wafer or the developing wafer is placed on the hot disc or the cold disc module, the glue solution on the surface of the wafer is dried, so as to obtain a drying wafer, and finally, the first robot grasps the drying wafer and places the drying wafer back into the wafer box, and waits for the recovery of an operator.
It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present invention, and not for limiting the same, and although the present invention has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the technical solution described in the above-mentioned embodiments may be modified or some technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiments of the present invention.
Claims (9)
1. Wafer processing apparatus, characterized in that the wafer processing apparatus (100) is for processing a wafer, the wafer processing apparatus (100) comprising:
a first robot (110);
A second robot (120), wherein the first robot (110) and the second robot (120) are disposed opposite to each other, and an accommodation space is provided between the first robot (110) and the second robot (120);
A hot or cold plate module (130), wherein the hot or cold plate module (130) is used for adjusting the temperature of the wafer, and the hot or cold plate module (130) is arranged in the accommodating space;
A centering module (140), wherein the centering module (140) is arranged in the accommodating space, and the first robot (110) and the second robot (120) can take and place the wafers from the hot disc or cold disc module (130) and the centering module (140);
a cassette (150), the cassette (150) being configured to store wafers, the cassette (150) being disposed proximate to the first robot (110);
And the spin developing module (160) is arranged close to the second robot (120).
2. The wafer processing apparatus of claim 1, wherein the cassette (150) is provided on a peripheral side of the first robot (110) such that the first robot (110) can grasp wafers in the cassette (150).
3. The wafer processing apparatus according to claim 1, wherein the spin developing module (160) is provided on a peripheral side of the second robot (120) so that the second robot (120) can grasp a wafer in the spin developing module (160).
4. Wafer processing apparatus according to claim 1, characterized in that the hot or cold plate module (130) is arranged close to the second robot (120).
5. The wafer processing apparatus according to claim 4, wherein the centering module (140) is provided between the hot or cold plate module (130) and the first robot (110).
6. A control method of a wafer processing apparatus, characterized in that the control method controls the wafer processing apparatus according to any one of claims 1 to 5, the control method comprising:
controlling the first robot to clamp the wafer to be processed in the wafer box and placing the wafer on the centering module;
And controlling the centering module to center the wafer to be processed so as to obtain a centering wafer.
7. The control method of claim 6, wherein after the centering module is controlled to center the wafer to be processed, the control method further comprises:
Controlling the second robot to clamp the centering wafer and place the centering wafer on the spin-coating developing module;
The photoresist homogenizing and developing module is controlled to glue or develop the middle wafer so as to obtain a photoresist homogenizing wafer or a developing wafer;
The photoresist homogenizing and developing module is controlled to glue the middle wafer, so that the photoresist homogenizing wafer is obtained;
and under the condition that the photoresist uniformizing and developing module is controlled to develop the middle wafer, the developing wafer is obtained.
8. The control method according to claim 7, wherein after the controlling the spin developing module to glue or develop the intermediate wafer, the control method further comprises:
controlling the second robot to clamp the spin wafer or the developing wafer, and placing the spin wafer or the developing wafer on the hot tray or the cold tray module;
And controlling the hot disc or cold disc module to heat or cool the spin-coating wafer or the developing wafer so as to obtain a dried wafer.
9. The control method according to claim 8, wherein after the controlling the hot plate or the cold plate module to heat or cool the spin wafer, the control method further comprises:
and controlling the first robot to clamp the dried wafer and place the dried wafer in the wafer box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411648997.1A CN119153375A (en) | 2024-11-19 | 2024-11-19 | Wafer processing equipment and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411648997.1A CN119153375A (en) | 2024-11-19 | 2024-11-19 | Wafer processing equipment and control method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1904730A (en) * | 2005-07-27 | 2007-01-31 | 沈阳芯源先进半导体技术有限公司 | Structure of gluing developing apparatus and chip transmission process |
| CN118480851A (en) * | 2024-05-31 | 2024-08-13 | 沈阳超夷微电子设备有限公司 | Wafer electroplating equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1904730A (en) * | 2005-07-27 | 2007-01-31 | 沈阳芯源先进半导体技术有限公司 | Structure of gluing developing apparatus and chip transmission process |
| CN118480851A (en) * | 2024-05-31 | 2024-08-13 | 沈阳超夷微电子设备有限公司 | Wafer electroplating equipment |
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