CN119153191A - Printed circuit board integrated with magnetic inductor and manufacturing method thereof - Google Patents
Printed circuit board integrated with magnetic inductor and manufacturing method thereof Download PDFInfo
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- CN119153191A CN119153191A CN202411649041.3A CN202411649041A CN119153191A CN 119153191 A CN119153191 A CN 119153191A CN 202411649041 A CN202411649041 A CN 202411649041A CN 119153191 A CN119153191 A CN 119153191A
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 75
- 239000010949 copper Substances 0.000 claims abstract description 75
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- 238000004804 winding Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 22
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a printed circuit board of an integrated magnetic inductor and a manufacturing method thereof, wherein the printed circuit board comprises a substrate, a magnetic core and an inductance winding, wherein the substrate is provided with a cavity, the magnetic core is embedded in the cavity and provided with a plurality of through holes, the inductance winding comprises copper columns with the number corresponding to that of the through holes, each copper column penetrates through one through hole, two ends of each copper column are respectively provided with a first circuit layer and a second circuit layer, the first circuit layer of each copper column is connected with the first circuit layer of one adjacent copper column through inductance copper, and the second circuit layer of each copper column is connected with the second circuit layer of the other adjacent copper column through inductance copper. The printed circuit board of the integrated magnetic inductor and the manufacturing method thereof simultaneously manufacture and assemble the magnetic core and the printed circuit board, save the surface area of the printed circuit board and enable the printed circuit board to be more integrated, and effectively reduce the direct current resistance value of the whole device and improve the inductance efficiency by adopting a method of embedding copper columns.
Description
Technical Field
The invention relates to the technical field of electronic manufacturing, in particular to a printed circuit board integrated with a magnetic inductor and a manufacturing method thereof.
Background
With the rapid development of electronic devices such as mobile devices and wearable devices towards miniaturization, high performance and integration of multifunctional modules, the requirements on the integration level and performance of Printed Circuit Boards (PCBs) are increasingly increasing.
The inductor plays a vital role in a circuit, including energy storage, filtering, impedance matching, signal coupling, electromagnetic interference suppression and the like, is widely applied to the fields of power management, communication, signal processing and the like, and is an indispensable element in electronic equipment. The traditional discrete inductor has larger volume, which seriously hinders the further miniaturization and high integration development of the PCB.
Thus, integrated inductor technology has grown and developed rapidly. The integrated inductance technology has the advantages that the inductance element is directly constructed on the PCB, so that the loss of signals in the transmission process is reduced due to the fact that a signal transmission path is shortened, the influence of parasitic parameters on circuit performance is reduced, the connection of welding points and external leads is reduced, the reliability and durability of products can be remarkably improved, the fault risk caused by poor welding or loose external connection is reduced, the number of discrete inductance elements and the welding points are reduced, the generation of electronic wastes is further reduced, and the green sustainable development is facilitated. In conclusion, the integrated inductance technology has important application value and wide development prospect.
The current PCB integrated inductance technology mainly comprises the steps of embedding an annular magnetic core in a substrate, arranging a through hole and a winding around the magnetic core, and constructing a winding to cover the magnetic core structure inductance, wherein the thickness of copper on the wall of the through hole in the structure is limited, so that the inductance efficiency in a power supply module is lower.
Disclosure of Invention
The invention mainly aims to provide a printed circuit board of an integrated magnetic inductor and a manufacturing method thereof, which are used for solving the problem that the integrated inductor technology in the prior art has poor effect when being applied to the printed circuit board.
In order to achieve the above object, at least one embodiment of the present invention provides a printed circuit board integrated with a magnetic inductor, the printed circuit board comprising:
A substrate, a magnetic core and an inductance winding, wherein,
The substrate is provided with a cavity, the magnetic core is embedded in the cavity and provided with a plurality of through holes, the inductance winding comprises copper columns corresponding to the through holes in number, each copper column penetrates through one through hole, the two ends of each copper column are respectively provided with a first circuit layer and a second circuit layer, the first circuit layer of each copper column is connected with the first circuit layer of one adjacent copper column through inductance copper, and the second circuit layer of each copper column is connected with the second circuit layer of the other adjacent copper column through inductance copper.
For example, in a printed circuit board provided in at least one embodiment of the present application, a plurality of through holes are arranged in a plurality of rows in parallel on the magnetic core, with at least two through holes per row.
For example, in a printed circuit board provided in at least one embodiment of the present application, the magnetic core is configured as a semi-cured composite resin magnetic film after thermal press curing, the semi-cured composite resin magnetic film including a resin and magnetic particles, the magnetic particles being dispersed in the resin.
For example, in a printed circuit board provided by at least one embodiment of the present application, the magnetic particles of the magnetic core range from 20% to 80% by mass.
For example, in a printed circuit board provided by at least one embodiment of the present application, the magnetic particles of the magnetic core have an average particle diameter ranging from 0.1 μm to 20 μm.
For example, in the printed circuit board provided in at least one embodiment of the present application, the magnetic particles of the magnetic core are at least one of ferrite particles, magnetic metal particles, and magnetic alloy particles.
For example, in the printed circuit board provided in at least one embodiment of the present application, an insulating layer is formed on the surface of the magnetic particles of the magnetic core.
In another aspect, at least one embodiment of the present application also provides a method for manufacturing a printed circuit board of an integrated magnetic inductor, the method comprising:
milling a cavity from the substrate;
Drilling a through hole from the semi-cured composite resin magnetic film, and cutting according to the outline of the cavity to obtain a semi-cured magnetic core;
Placing a copper column in a through hole of the semi-cured magnetic core, assembling the semi-cured magnetic core in the cavity, and performing hot pressing after overlapping to obtain a circuit board substrate;
And forming an inductance winding on the circuit board base material according to the circuit board base material to obtain the printed circuit board.
For example, in a method for manufacturing a printed circuit board according to at least one embodiment of the present application, the forming an inductance winding on the circuit board substrate according to the circuit board substrate to obtain the printed circuit board includes:
Removing the surface residual glue of each copper column and the circuit board substrate, so that all copper columns are exposed out of the upper surface and the lower surface, and keeping the heights consistent;
and etching inductive copper to connect copper columns adjacent to the upper surface and the lower surface of the circuit board substrate, and forming an inductive winding on the circuit board substrate to obtain the printed circuit board.
For example, in the method for manufacturing a printed circuit board according to at least one embodiment of the present application, after the inductor winding is formed on the circuit board substrate according to the circuit board substrate, the method further includes:
And an inductance online monitoring device is adopted to be connected with an inductance winding of the printed circuit board and modify the inductance value online.
Compared with the prior art, any embodiment of the invention has at least the following beneficial effects:
The application provides an integrated inductor multilayer printed circuit board which comprises a substrate, a magnetic core and an inductor winding, wherein the substrate is provided with a cavity, the magnetic core is embedded in the cavity and provided with a plurality of through holes, the inductor winding comprises copper columns corresponding to the number of the through holes, each copper column penetrates through one through hole, two ends of each copper column are respectively provided with a first circuit layer and a second circuit layer, the first circuit layer of each copper column is connected with the first circuit layer of one adjacent copper column through inductance copper, and the second circuit layer of each copper column is connected with the second circuit layer of the other adjacent copper column through inductance copper. In the printed circuit board, the upper layer and the lower layer of the inductance device are conducted in a manner of embedding the copper columns to form the inductance winding, so that the direct-current resistance value of the whole device can be effectively reduced, and the inductance device has higher inductance efficiency in actual use. On the other hand, the processing technology can be flexibly adjusted by the combined assembly mode of the substrate and the magnetic core, no extra processing step is needed, the surface area of the printed circuit board is saved, and the printed circuit board is miniaturized and planarized.
Drawings
FIG. 1 is a schematic diagram of a printed circuit board integrated core inductor according to an embodiment of the present application;
FIG. 2 is a schematic view of a substrate according to an embodiment of the application;
FIG. 3 is a schematic diagram of a magnetic core according to an embodiment of the present application;
Fig. 4 is a schematic structural diagram of an inductor winding according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a printed circuit board integrated core inductor according to another embodiment of the present application;
FIG. 6 is a schematic cross-sectional view of a printed circuit board integrated core inductor according to an embodiment of the present application;
fig. 7 is a schematic diagram of a printed circuit board integrated core inductor according to another embodiment of the present application.
The drawing shows 10 parts of a substrate, 101 parts of a cavity, 20 parts of a magnetic core, 201 parts of a through hole, 202 parts of a semi-cured composite resin magnetic film, 30 parts of an inductance winding, 301 parts of a copper column, 302 parts of a first circuit layer, 303 parts of a second circuit layer.
The achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms "first," "second," "third," and the like in this disclosure are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, rear) in embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular pose (as shown in the drawings), and if the particular pose changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The current technology of integrated inductance of PCB (printed circuit board) mainly adopts the method that an annular magnetic core material is embedded in advance in a PCB substrate, then a via hole is arranged around the magnetic core and a winding is formed through the via hole, thereby forming a structure that the winding wraps the magnetic core. However, this structure has several key problems, firstly, the thickness of copper layer on the walls of the via hole is limited due to the limitation of the PCB manufacturing process. This results in a higher Direct Current Resistance (DCR) of the winding, which is not ideally a low direct current resistance, but a higher direct current resistance increases the energy loss of the inductive element during operation, thus reducing the overall efficiency, especially in high frequency switching power supply modules. Secondly, the process of constructing the winding involves a complex manufacturing process, which not only increases the production cost, but also puts high precision requirements on process control. Small deviations may lead to non-uniformities between windings, which in turn affect the performance of the final inductor. Third, the manufacturing process is limited, and the inductance (inductance) of the inductance device manufactured at present often has a larger tolerance range. This means that there may be significant performance differences between inductors of the same model, which may not be accommodated for applications where the inductance is critical.
Based on the above-mentioned problems, the present application provides a technical solution for improving and optimizing the application of integrated inductance technology in PCB manufacturing, and particularly referring to fig. 1 to 7, which are related structural diagrams of embodiments of a printed circuit board of an integrated magnetic inductor provided by the present application, and in at least one embodiment, referring to fig. 1, the printed circuit board of the integrated magnetic inductor includes a substrate 10, a magnetic core 20 and an inductance winding 30, and is assembled in a mutually matched manner.
Referring to fig. 2 to 6, the substrate 10 is configured with a cavity 101, the magnetic core 20 may be embedded in the cavity 101 and provided with a plurality of through holes 201, the inductance winding 30 includes copper pillars 301 corresponding to the number of through holes 201, each copper pillar 301 passes through one through hole 201 and is respectively configured with a first circuit layer 302 and a second circuit layer 303 at two ends, the first circuit layer 302 of each copper pillar 301 is connected with the first circuit layer 302 of an adjacent copper pillar 301 through inductance copper, and the second circuit layer 303 of each copper pillar 301 is connected with the second circuit layer 303 of an adjacent copper pillar 301 through inductance copper.
In this embodiment, the printed circuit board may be made as a rigid circuit board, a flexible circuit board, and a rigid-flex printed circuit board, which is not limited in the embodiment of the present application.
Specifically, the number of windings of the inductor winding 30 of the printed circuit board formed by the inductor copper may be one or more, and may be specifically set according to practical application requirements. It is understood that each inductor winding 30 may be, but is not limited to, a portion of one turn of inductor winding 30, such as a half turn, or a complete one, two, three, etc. turn. The more turns of the inductor winding 30, the larger the inductance under other conditions, and thus the number of turns of the inductor winding 30 may be designed according to the application scenario, the inductance to be achieved, and the like, which is not particularly limited in the embodiment of the present application.
In some embodiments, the substrate 10 may be made of one of epoxy, polyimide, polyphenylene oxide, polytetrafluoroethylene, and the like. It is understood that the performance of the integrated inductor of the circuit board can be improved by selecting a suitable resin material according to the physical and chemical characteristics of different materials and the environment in which the circuit board is used.
The magnetic core 20 in this embodiment refers to the semi-cured composite resin magnetic film 202 after being cured by hot pressing. The magnetic core 20 is disposed in the cavity 101 of the substrate 10, and a plurality of through holes 201 are disposed in the magnetic core 20 for accommodating the copper pillars 301, and in addition, the upper surface of the magnetic core 20 is flush with the upper surface of the substrate 10, and the lower surface of the magnetic core 20 is flush with the lower surface of the substrate 10, so that the printed board maintains a planar effect.
Specifically, the semi-cured composite resin magnetic film 202 includes a resin, magnetic particles, a solvent, a curing agent, and the like, in which the magnetic particles are dispersed. The use of the semi-cured composite resin magnetic film 202 can increase the inductance value of the printed circuit board integrated inductor and improve its energy storage capability. The semi-cured composite resin magnetic film 202 is formed by uniformly dispersing magnetic particles in a resin solution formed by mixing a resin, a solvent, a curing agent, and the like to form a magnetic slurry, coating the magnetic slurry into a uniform film, and gelling the magnetic slurry. The semi-cured composite resin magnetic film 202 is subjected to heat press curing to obtain a finished product, namely the magnetic core 20.
Alternatively, the mass fraction of magnetic particles in core 20 ranges from 20% to 80%. When the mass fraction of the magnetic particles of the magnetic core 20 is less than 20%, the performance improvement effect of the magnetic core 20 on the integrated inductor is less obvious, and the manufacturing cost is increased, and when the mass fraction of the magnetic particles of the magnetic core 20 is more than 80%, the adhesion between the magnetic core 20 and the base material and the copper pillar 301 is reduced, and the mechanical stability of the integrated inductor is affected.
Alternatively, the average particle diameter D of the magnetic particles of the semi-cured composite resin magnetic film 202 is in the range of 0.1 μm to 20 μm, and when the average particle diameter of the magnetic particles is less than 0.1 μm, the manufacturing difficulty and manufacturing cost of the magnetic particles are increased, and the cost of the magnetic core 20 is increased. When the average particle diameter of the magnetic particles is larger than 20. Mu.m, there is a possibility that short circuits may occur between the lines having a smaller pitch.
In some embodiments, the magnetic particles are selected from at least one of ferrite particles, magnetic metal particles, and magnetic alloy particles.
In particular, soft magnetic particles may also be used as the magnetic particles. The soft magnetic has high magnetic permeability, low remanence, low coercivity, low magnetic resistance, small hysteresis loss and easy magnetization.
In the above embodiment, the ferrite particles have better electrical insulation and lower loss, and the magnetic metal particles or magnetic alloy particles have higher magnetic permeability and magnetic saturation induction strength. Thus, ferrite particles may be selected as magnetic particles when a better electrical insulation and lower loss of the magnetic glue layer is required, and magnetic metal particles or magnetic alloy particles may be selected as magnetic particles when a higher magnetic permeability and magnetic saturation induction strength of the magnetic glue layer are required.
Optionally, the ferrite particles comprise at least one of MnZn ferrite, niZn ferrite, and the like.
Optionally, the magnetic metal particles comprise at least one of iron, cobalt, nickel, and the like.
Optionally, the magnetic alloy particles comprise at least one of an iron-based crystalline alloy, an iron-based amorphous alloy, a cobalt-based amorphous alloy, and the like.
Further, the iron-based crystalline alloy includes at least one of a FeNi alloy, a FeCo alloy, a FeAl alloy, a fesai alloy, a FeNiMo alloy, a FeC alloy, and the like.
Further, the iron-based amorphous alloy includes at least one of FeSiB alloy, feB alloy, feNiPB alloy, feNiMoB alloy, and the like.
Further, the cobalt-based amorphous alloy includes at least one of CoFeSiB alloy, coFeCrSiB alloy, coNiFeSiB alloy, and the like.
Among the above-listed various magnetic alloy particles, cobalt-based amorphous alloys have higher magnetic permeability than iron-based crystalline alloys and iron-based amorphous alloys, and therefore, when higher magnetic permeability is required for the magnetic glue layer, at least one of cobalt-based amorphous alloys may be used for the magnetic particles. Compared with cobalt-based amorphous alloy, the iron-based crystalline alloy and the iron-based amorphous alloy have higher saturation magnetic characteristics, and when the magnetic adhesive layer requires higher saturation magnetic characteristics, the magnetic particles can be at least one of the iron-based crystalline alloy and the iron-based amorphous alloy. Compared with the iron-based crystalline alloy, the iron-based amorphous alloy and the cobalt-based amorphous alloy have lower coercive force, and when the magnetic adhesive layer requires lower coercive force, the iron-based amorphous alloy and the cobalt-based amorphous alloy can be selected as the magnetic particles.
In some embodiments, the magnetic particles have an insulating layer on the surface, and the insulating layer can block direct contact between the magnetic particles, so as to increase the resistivity of the magnetic core 20, improve the eddy current loss, and further improve the performance of the integrated inductor of the circuit board.
For example, a layer of silicon dioxide may be coated on the surface of the magnetic particles to form an insulating layer.
For another example, the magnetic particles may be passivated with phosphoric acid to form a non-conductive passivation layer on the surface of the magnetic particles.
Or a layer of resin may be adsorbed on the surface of the magnetic particles to increase the insulating properties thereof.
In some embodiments, the plurality of through holes 201 of the printed circuit board of the present application may also be arranged in a plurality of parallel rows on the magnetic core 20, with at least two through holes 201 per row.
Referring to fig. 7, in another implementation form of a printed circuit board of an integrated magnetic inductor, in the printed circuit board, through holes 201 are arranged side by side to form a plurality of groups, and the number of through holes 201 in each row is 4, by winding an inductor coil, an inductor element with better performance and stronger energy storage capacity than that in fig. 1 or fig. 5 can be formed, and this structural form can be adjusted according to actual needs, and the specific number of through holes 201 is not limited.
In the printed circuit board provided by the embodiment, the upper layer circuit and the lower layer circuit of the inductance device are conducted in a manner of embedding the copper columns to form the inductance winding, so that the direct-current resistance value of the whole device can be effectively reduced, and the inductance winding has higher inductance efficiency in actual use. The magnetic core is embedded into the cavity in the substrate, so that the processing technology can be flexibly adjusted, extra processing steps are not needed, the surface area of the printed circuit board is saved, the printed circuit board is miniaturized and planarized, and the stability and durability of the structure can be improved, especially when external impact or vibration is applied. This also helps to maintain the stability of the electrical characteristics of the inductor under various environmental conditions.
In addition, possibly, by reasonably arranging the positions of the copper columns and the through holes, the magnetic field distribution can be optimized, and the interference to peripheral circuits can be reduced.
In another aspect, at least one embodiment of the present application further provides a method for manufacturing a printed circuit board integrated with a magnetic inductor, for manufacturing a printed circuit board as described above, the method comprising:
Milling a substrate to form a cavity, drilling a through hole in the semi-cured composite resin magnetic film, cutting according to the outline of the cavity to obtain a semi-cured magnetic core, placing a copper column in the through hole of the semi-cured magnetic core, assembling the semi-cured magnetic core in the cavity, overlapping, and then performing hot pressing to obtain a circuit board substrate, and forming an inductance winding on the circuit board substrate according to the circuit board substrate to obtain the printed circuit board.
In some embodiments, mechanical drilling or laser drilling is used to form cavities, vias, for example, laser cutting may be used as desired to form cavities, vias, etc.
In some embodiments, the size of the semi-solidified magnetic core is equal to or slightly smaller than the size of the cavity, and the diameter of the copper column is equal to or slightly smaller than the diameter of the through hole, preferably, the size of the semi-solidified magnetic core is equal to the size of the cavity, and when the diameter of the copper column is equal to the diameter of the through hole, the semi-solidified magnetic core has higher matching property, can improve mechanical strength and improve product stability.
It should be noted that, in the method for manufacturing a printed circuit board provided in the above embodiment, a person skilled in the art can understand and achieve the objective according to the conventional processing technology of the existing PCB board, for example, the pattern processing, the etching step, etc. may be required. On the other hand, the printed circuit board is realized in an assembly mode, so that the components such as the substrate, the magnetic core and the copper column can be simultaneously and pre-processed, and the respective sequences are not limited by the demonstration of the embodiment.
Further, the method for forming the inductance winding on the circuit board substrate through the inductance copper according to the circuit board substrate comprises the steps of removing residual glue on the surface of each copper column and the surface of the circuit board substrate, enabling all copper columns to be exposed out of the upper surface and the lower surface and keeping the height consistent, and forming the inductance winding on the circuit board substrate through etching the inductance copper to connect the copper columns adjacent to the upper surface and the lower surface of the circuit board substrate, so that the printed circuit board is obtained.
In some embodiments, in order to grind away the copper pillars and the residual glue on the surface of the resin substrate, all the copper pillars are exposed out of the upper surface and the lower surface, the surface of the substrate is kept flat, and the heights of the copper pillars are consistent, and the method can be specifically realized by adopting a mechanical grinding mode, and specific steps can include but are not limited to mechanical coarse grinding, mechanical fine grinding and surface polishing.
In some embodiments, after the printed circuit board is obtained according to the circuit board substrate, the method further comprises the steps of connecting an inductance online monitoring device with an inductance winding of the printed circuit board and online modifying an inductance value. In order to realize the on-line modification of the inductance value, the inductance on-line monitoring device is connected with an inductance winding to monitor the inductance value in real time, and then the redundant magnetic core is removed through laser modification to achieve the target inductance value, so that the manufactured inductance has higher precision, and the inductance on-line monitoring device mainly comprises inductance measuring equipment, a test bench and a test cable, wherein the inductance measuring equipment can be an impedance analyzer, a vector network analyzer, an LCR (inductance control register) instrument and the like.
After the printed circuit board is obtained, the conventional corresponding process operations of solder resist, character printing, electroless nickel plating, molding, finished product detection and the like can be performed.
The embodiments of the invention have been described in detail above, but they are merely examples, and the invention is not limited to the above-described embodiments. It will be apparent to those skilled in the art that any equivalent modifications or substitutions to this invention are within the scope of the invention, and therefore, all equivalent changes and modifications, improvements, etc. that do not depart from the spirit and scope of the principles of the invention are intended to be covered by this invention.
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202411649041.3A CN119153191A (en) | 2024-11-19 | 2024-11-19 | Printed circuit board integrated with magnetic inductor and manufacturing method thereof |
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| CN202411649041.3A CN119153191A (en) | 2024-11-19 | 2024-11-19 | Printed circuit board integrated with magnetic inductor and manufacturing method thereof |
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| CN103327750A (en) * | 2013-06-03 | 2013-09-25 | 东莞生益电子有限公司 | Method for manufacturing inductor-buried type printed circuit board and circuit board manufactured through method |
| CN205194482U (en) * | 2014-08-14 | 2016-04-27 | 株式会社村田制作所 | Embedded magnetic element device |
| CN111292950A (en) * | 2019-12-30 | 2020-06-16 | 电子科技大学 | Manufacturing method and inductance of an embedded magnetic core miniaturized three-dimensional inductor |
| CN220651781U (en) * | 2023-04-27 | 2024-03-22 | 日月光半导体制造股份有限公司 | an inductor coil |
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2024
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327750A (en) * | 2013-06-03 | 2013-09-25 | 东莞生益电子有限公司 | Method for manufacturing inductor-buried type printed circuit board and circuit board manufactured through method |
| CN205194482U (en) * | 2014-08-14 | 2016-04-27 | 株式会社村田制作所 | Embedded magnetic element device |
| CN111292950A (en) * | 2019-12-30 | 2020-06-16 | 电子科技大学 | Manufacturing method and inductance of an embedded magnetic core miniaturized three-dimensional inductor |
| CN220651781U (en) * | 2023-04-27 | 2024-03-22 | 日月光半导体制造股份有限公司 | an inductor coil |
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