CN119124414B - Pressure sensing structure and pressure touch device - Google Patents
Pressure sensing structure and pressure touch device Download PDFInfo
- Publication number
- CN119124414B CN119124414B CN202411278077.5A CN202411278077A CN119124414B CN 119124414 B CN119124414 B CN 119124414B CN 202411278077 A CN202411278077 A CN 202411278077A CN 119124414 B CN119124414 B CN 119124414B
- Authority
- CN
- China
- Prior art keywords
- pressure sensing
- pressure
- arc
- film
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/1623—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of pressure sensitive conductors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
本发明属于压力传感技术领域，公开了一种压力传感结构及压力触控装置。该压力传感装置包括框架结构、压力传感组件以及承压板。其中压力传感组件由弧形弹片以及贴合在弹片下曲面的FPC压力传感薄膜组成，FPC压力传感薄膜印刷有低电阻率的电极以及高电阻率的半导体导电薄膜。当承压板受到外部压力作用时，弧形弹片在压力作用下发生形变使FPC上电极与半导体部分接触形成回路，并且随着压力增大接触部分被短路导致回路电阻减小，从而通过电阻值的变化反应压力大小。本发明提出的压力传感结构具有灵敏且线性的信号响应，具有良好的稳定性，并且具有多方向力检测的能力。
The present invention belongs to the field of pressure sensing technology, and discloses a pressure sensing structure and a pressure touch device. The pressure sensing device includes a frame structure, a pressure sensing component and a pressure-bearing plate. The pressure sensing component is composed of an arc-shaped spring piece and an FPC pressure sensing film attached to the lower curved surface of the spring piece, and the FPC pressure sensing film is printed with a low-resistivity electrode and a high-resistivity semiconductor conductive film. When the pressure-bearing plate is subjected to external pressure, the arc-shaped spring piece deforms under the pressure to make the electrode on the FPC contact with the semiconductor part to form a loop, and as the pressure increases, the contact part is short-circuited, resulting in a decrease in the loop resistance, thereby reflecting the pressure through changes in the resistance value. The pressure sensing structure proposed by the present invention has a sensitive and linear signal response, good stability, and the ability to detect multi-directional forces.
Description
Technical Field
The invention relates to the technical field of pressure sensing, in particular to a pressure sensing structure and a touch device applying the same.
Background
With the development of consumer electronics and engineering control fields, pressure sensing technology is becoming more and more widely used in related products and industrial equipment. The main function of the pressure sensing technology is to accurately sense the information such as the magnitude, the direction and the position of the applied force and help the system to identify the pressure information, so that different pressure response strategies are formulated, and the electronic equipment can realize multiple functions.
The existing pressure sensing device uses various pressure sensing devices for pressure detection, including MEMS pressure sensors, flexible pressure sensors (resistance type, capacitance type and piezoelectric type), resistance strain gauges, optical fiber sensors and the like, and the sensors realize the detection of the pressure based on different sensing principles and have wide application in the fields of consumer electronics, medical appliances, industrial control and the like. However, the above-described pressure sensor has the following drawbacks, which limit the utility of such sensing techniques. The MEMS sensor is not suitable for portable sensing equipment due to large volume, the flexible sensor is difficult to realize the trade-off between sensitivity and measuring range, the durability of the MEMS sensor is obviously insufficient compared with other sensors, the change range of a resistance strain gauge signal is small, the MEMS sensor is difficult to be used in a high-precision pressure detection scene, and the optical fiber sensor needs an additional reading system, so that the complexity of a sensing system is increased.
For the above reasons, existing pressure sensing schemes still have shortcomings in terms of structural size, sensing performance, durability, etc., and developing a pressure sensing device that has high performance, is easy to implement, and is stable and durable remains a challenge.
Disclosure of Invention
In order to solve the defects and shortcomings in the prior art, the invention provides a pressure sensing structure and a pressure touch device applying the same.
The pressure sensing structure comprises an arc-shaped elastic sheet and a pressure sensing assembly arranged on the outer surface of the arc-shaped elastic sheet, wherein one point on the arc-shaped elastic sheet is a fixed point.
The arc-shaped elastic sheet is made of stainless steel and the like, is prepared by a bending or stamping process, has good elasticity, can deform under the action of pressure, and can recover to an original state after the pressure is removed;
The electrode is a strip electrode;
The first section of the film is arranged on the outer surface of the arc-shaped elastic sheet along the length direction of the arc-shaped elastic sheet;
The semiconductor conductive film is positioned on the surface of the first section of the film, and the electrode is positioned on the surface of the second section of the film.
The semiconductor conductive film has high resistivity, the strip electrode has low resistivity, two ends of the two parts are led out through a lead, and a gap exists between the two parts;
The semiconductor conductive film corresponds to the electrode, and the shape of the semiconductor conductive film and the shape of the electrode may be the same.
And setting a point or a region on the arc-shaped elastic sheet as a fixed point or a fixed region for fixing the arc-shaped elastic sheet, wherein the semiconductor conductive film is not contacted with the electrode in the initial state. When pressure is applied to one end of the arc-shaped elastic sheet, the semiconductor conductive film and the electrode are close to each other, and as the pressure is increased, the semiconductor conductive film is in contact with the electrode, and the contact area of the semiconductor conductive film and the electrode is increased.
When pressure is applied to one end of the arc-shaped elastic sheet, the arc-shaped elastic sheet with radian is compressed downwards to deform, and the FPC sensor deforms along with the sheet, so that the semiconductor conductive film is contacted with one end of the electrode, the electrode and the semiconductor conductive film form a communication loop, and the resistance value is the largest. Along with the further bending of the arc-shaped elastic sheet with the further increase of the pressure, the contact area between the semiconductor conductive film and the electrode is increased under the extrusion action of the arc-shaped structure, so that the contacted part is short-circuited, at the moment, the effective length between the electrode and the semiconductor conductive film is shortened, and the resistance value of the loop is reduced. Therefore, the pressure sensing structure reflects the pressure through the change of the resistance signal, and the pressure detection is realized.
Further, the electrode part can be formed by preparing electrode materials such as copper, silver, conductive silver paste and the like at one end of the film through copper coating, screen printing and other processes;
The semiconductor conductive film can be obtained by printing semiconductor ink on the other end of the film in a screen printing, knife coating, spraying and other modes, and a gap exists between the electrode and the semiconductor conductive film. And the resistivity of the semiconductor ink is far greater than that of the electrode material, so that the resistance of the semiconductor conductive film is far greater than that of the electrode at the other end.
Furthermore, the pressure sensing structure further comprises a first flat plate, one end of the arc-shaped elastic sheet is connected with the upper surface of the first flat plate, the other end of the arc-shaped elastic sheet is a free end, the second section of the film is arranged on the upper surface of the first flat plate, and the electrode on the second section of the film corresponds to the semiconductor conductive film in position.
Further, the first section of the film and the second section of the film are connected through a bending part. And the integrated forming is convenient.
Further, the free end of the arc-shaped elastic sheet is also connected with a second flat plate, and the second flat plate is parallel to the first flat plate. When pressure is applied to the pressure sensing structure, the pressure can be directly applied to the second flat surface, which is equivalent to increasing the pressure surface capable of applying the pressure.
The pressure sensing structure can be manufactured by sticking the FPC sensing assembly on the arc-shaped elastic sheet and bending the FPC sensing assembly, and the structure and the process are simpler while the consistent pressure sensing performance is maintained;
The pressure sensing structure further comprises a bottom plate, when the arc-shaped elastic sheet is fixed, the middle point of the arc-shaped elastic sheet is fixedly connected with the upper surface of the bottom plate, the two ends of the arc-shaped elastic sheet are free ends, the second section of the thin film is arranged on the upper surface of the flat plate, and the positions of the electrodes on the second section of the thin film and the semiconductor conductive thin film correspond to each other. The pressure sensing assemblies are symmetrically arranged;
Furthermore, the pressure sensing structure further comprises a bearing plate, two free ends of the arc-shaped elastic sheet are connected with second flat plates, the second flat plates are parallel to the bottom plate, and the bearing plate is located on the upper surfaces of the two second flat plates. The bearing plate is detachably connected with the pressure sensing structure.
Further, a cylinder body is vertically arranged on the bottom plate, the arc-shaped elastic sheet and the pressure sensing assembly are both positioned in the cylinder body, and the section of the bearing plate is similar to the section of the cylinder body and smaller than the section of the cylinder body.
The area of the bearing plate is slightly smaller than the section of the cylinder body, so that the bearing plate can longitudinally move and deflect in the cylinder body. The bearing plate is in butt joint or magnetic adsorption's detachable connection with pressure sensing structure top.
The pressure sensing structure is provided with two pressure sensing assemblies which can be assembled in an electronic equipment mounting groove or on the surface of a touch object. The cylinder is used for protecting the integral structure of the pressure touch device, and the pressure sensing assembly and the bearing plate can longitudinally move along the structural frame.
Because the pressure sensing components are arranged at the two ends of the sensing structure, the two ends of the sensing structure can generate electric signals changing along with the pressure effect, the sensing structure can simultaneously measure the resistance change of the two ends and calculate the acting position of the pressure on the bearing plate, thereby realizing the pressure and position detection.
The invention further provides a pressure touch device based on the pressure sensing structure, which comprises a bottom plate, a cylinder body, a pressure bearing plate and a plurality of pressure sensing structures, wherein the cylinder body and the plurality of pressure sensing structures are respectively arranged on the surface of the bottom plate and are respectively positioned in the cylinder body, the pressure bearing plate is positioned on the upper surfaces of the plurality of pressure sensing structures and is connected with the upper surfaces of two flat plates of the pressure sensing assembly, and the section of the pressure bearing plate is similar to the section of the cylinder body and smaller than the section of the cylinder body.
One pressure sensing structure is a pressure sensing unit, so that a single pressure sensing structure can only realize pressure detection. However, a plurality of the sensing structures can be mutually combined to realize a more specific pressure sensing function, for example, two pressure sensing structures are oppositely arranged on a straight line, the formed double-sensing unit array can realize pressure magnitude and single-axis direction detection, three or more sensing structures are arranged in an annular array, and the formed multi-sensing unit array can realize pressure magnitude and plane arbitrary direction detection, so that the pressure sensing device has higher flexibility and scene adaptability.
Compared with the prior art, the pressure sensing structure and the pressure touch device provided by the invention have the following beneficial effects:
The pressure sensing device has the characteristics of simple and light structure, can be used for various portable equipment, has high sensitivity and good linearity in a pressure sensing mode realized by adopting a resistance short circuit mode, avoids the zero drift influence of a sensing structure due to the fact that two conductive areas are mutually separated in an initial state, has good elasticity in an arc-shaped structure sheet, can be restored to an original state after being deformed for many times, greatly prolongs the service life of a sensing device, is more durable than a flexible sensor, can select different moduli, can change the pressure deformation characteristic of the sensing structure by adopting a mode of adjusting the thickness of the arc-shaped sheet, and therefore can customize the sensitivity and the measuring range of the pressure sensing device, and (5) can realize the detection function of single-point acting force and multi-directional force in a multi-sensor mode, can be designed and assembled according to application scenes, and has higher flexibility.
Drawings
The technical scheme of the embodiment of the invention is further described in detail through the drawings and the embodiments.
FIG. 1 is a schematic view of a pressure sensing structure in accordance with a first embodiment of the present invention;
FIG. 2 is a schematic view of a pressure sensing structure in a first embodiment;
FIG. 3 is a lead out view of a pressure sensing assembly of the present invention;
FIG. 4 is a schematic view of a pressure sensing structure in a third embodiment;
fig. 5 is a schematic diagram of a pressure touch apparatus in a fourth embodiment;
wherein, 11, arc shrapnel; 12, a first flat plate, 13, a second flat plate;
2. the pressure sensing assembly comprises a pressure sensing assembly, a first section of a film, a second section of the film, a bending part, a semiconductor conductive film, 25 and an electrode, wherein the bending part is arranged at the bottom of the film;
3. 31, bottom plate, 32, cylinder;
4. And a bearing plate.
Detailed Description
In order to more clearly illustrate the technical solution and advantages of the present application, the present application will be further described in detail with reference to the following examples and the accompanying drawings. It is to be understood that the drawings described herein are only for illustration of some of the embodiments of the present application and are not intended as a definition of the limits of the application.
Example 1
As shown in FIG. 1, the pressure sensing structure of the invention comprises an arc-shaped elastic sheet 11 and an FPC pressure sensing assembly 2 arranged on the outer surface of the arc-shaped elastic sheet 11, wherein the surface facing the center of the arc-shaped elastic sheet 11 is set as the inner surface of the arc-shaped elastic sheet 11, and the other side is set as the outer surface of the arc-shaped elastic sheet 11.
The FPC pressure sensing assembly 2 comprises a first film section 21, a second film section 22, a semiconductor conductive film 24 and an electrode 25;
The semiconductor conductive film 24 is positioned on the surface of the first section 21 of the film, and the electrode 25 is positioned on the second section 22 of the film, wherein the shape of the semiconductor conductive film 24 is the same as that of the electrode 25 and the positions are opposite;
the first section 21 of the film is arranged on the outer surface of the arc-shaped elastic sheet 11 along the length direction of the arc-shaped elastic sheet 11;
the first film section 21 is PI or PET film as the same material as the second film section 22.
One end of the arc-shaped elastic sheet 11 is fixed on a plane, the second section 22 of the film is also fixed on the plane, and the semiconductor conductive film 24 is opposite to the electrode 25;
The semiconductor conductive film 24 and the electrode 25 are respectively connected with a lead-out end which is connected to a reading circuit, when the pressure sensor is used, the free end moves downwards under the action of pressure, the arc-shaped elastic sheet 11 drives the film first section 21 and the semiconductor conductive film 24 to move downwards, when the pressure is increased to a certain extent, one end of the semiconductor conductive film 24 close to a plane is firstly contacted with the electrode 25, the semiconductor conductive film 24 and the electrode 25 form a communication loop, the pressure is further increased, the contact area of the semiconductor conductive film 24 and the electrode 25 is further increased, the resistance of the loop is further reduced until the contact area of the semiconductor conductive film 24 and the electrode 25 is not changed any more, and the maximum measuring range of the pressure measurement is reached.
Example two
As shown in fig. 2, the pressure sensing structure in this embodiment is formed by adding a first flat plate 12 and a second flat plate 13 to the pressure sensing structure in the first embodiment, and the first section 21 of the film and the second section 22 of the film are connected by a bending portion 23.
One end of the arc-shaped elastic sheet 11 is connected with the upper surface of the first flat plate 12, the other end of the arc-shaped elastic sheet 11 is a free end and is connected with the second flat plate 13, the first flat plate 12 is parallel to the second flat plate 13, and the bending part 23 is positioned at an included angle part at the joint of the arc-shaped elastic sheet 11 and the first flat plate 12.
The first film section 21, the second film section 22, and the bent portion 23 are each PI film or PET film.
The preparation process of the FPC pressure sensing film structure comprises the steps of printing a strip-shaped electrode 25 and a semiconductor conductive film 24 on a PI film with the thickness of 0.05mm, leaving a space between the electrode 25 and the semiconductor conductive film 24, and leading out two ends of the electrode 25 and the semiconductor conductive film 24 from a lead respectively, as shown in figure 3.
The electrode 25 can be prepared by printing conductive silver paste on a PI film through a screen printing screen plate with the number of 300-400 meshes in a screen printing mode, and heating the PI film for 30min at 80-100 ℃ to obtain the strip silver paste electrode 25.
The semiconductor conductive film 24 can be prepared by printing semiconductor conductive ink on the other end of the PI film printed with the electrode 25 through a screen printing plate with the number of 300-350 meshes in a screen printing mode, and heating the PI film for 2 hours at 80-100 ℃ to obtain the semiconductor conductive film 24.
Preferably, the semiconductor conductive ink can be one or more conductive particles of carbon black, graphene, carbon nano tube or metal powder, and the semiconductor ink is obtained by dispersing and mixing the conductive particles with a flexible resin solution and a corresponding curing agent. Such inks have certain conductivity properties but have a resistivity much higher than the electrode material.
The pressure sensing structure in this embodiment can be manufactured by bending the arc-shaped elastic sheet 11 and the FPC pressure sensor after being attached, and the two end parts are kept straight.
In the initial state, the electrode 25 of the FPC sensing assembly is not contacted with the semiconductor conductive film 24, the upper end of the elastic sheet is bent downwards under the action of pressure, so that the FPC semiconductor conductive film 24 is contacted with one end of the electrode 25, and the contact area is increased along with the increase of the pressure, so that the circuit resistance is reduced due to the short circuit of the contact part, and the magnitude of the pressure is reflected.
Example III
As shown in fig. 4, the pressure sensing structure comprises a detachable bearing plate 4, an arc-shaped elastic sheet 11, a frame structure 3 and two FPC pressure sensing assemblies 2 arranged on the outer surface of the arc-shaped elastic sheet 11, wherein the surface facing the center of the arc-shaped elastic sheet 11 is set to be the inner surface of the arc-shaped elastic sheet 11, and the other side is set to be the outer surface of the arc-shaped elastic sheet 11.
The frame structure 3 is of a structure with one end open, and comprises a bottom plate 31 and a cylinder 32, the interface of the cylinder 32 is round or square, the arc-shaped elastic sheet 11 and the two FPC pressure sensing assemblies 2 are both positioned in the frame structure 3, the middle point of the arc-shaped elastic sheet 11 is fixedly connected with the upper surface of the bottom plate 31, the two ends of the arc-shaped elastic sheet 11 are both free ends, one end of the cylinder 32 is connected with the upper surface of the bottom plate 31, and the arc-shaped elastic sheet 11 and the two FPC pressure sensing assemblies 2 are both positioned in an area surrounded by the cylinder 32. Specifically, the arc-shaped elastic sheet 11 is connected with the bottom plate 31 by gluing.
The FPC pressure sensing assembly 2 comprises a first film section 21, a second film section 22, a semiconductor conductive film 24 and an electrode 25, wherein the first film section 21 and the second film section 22 are connected through a bending part 23, and the first film section 21, the second film section 22 and the bending part 23 can be integrally formed during manufacturing.
The semiconductor conductive film 24 is positioned on the surface of the first section 21 of the film, and the electrode 25 is positioned on the surface of the second section 22 of the film, wherein the shape of the semiconductor conductive film 24 is opposite to that of the electrode 25 and the shape can be the same;
the two FPC pressure sensing assemblies 2 are identical in structure, the two FPC pressure sensing assemblies 2 are symmetrically arranged, the first section 21 of the film is arranged on the outer surface of the arc-shaped elastic sheet 11 along the length direction of the arc-shaped elastic sheet 11, and the second section 22 of the film is arranged on the surface of the bottom plate 31.
The FPC pressure sensing assembly 2 further comprises two second flat plates 13 connected with two free ends of the arc-shaped elastic sheet 11, and the second flat plates 13 are parallel to the bottom plate 31.
The bearing plate 4 is positioned on the surface of the pressure sensing component 2 and is connected with the pressure sensing component through magnetic adsorption, and relative sliding can be generated between the lower surface of the bearing plate 4 and the second plate 13;
Specifically, the arc-shaped elastic sheet 11 is a stainless steel sheet with the thickness of 0.1-0.3 mm, which is obtained by punching through an arc-shaped die, and is fixed on the bottom plate 31 of the frame structure 3 through a welding mode. The elasticity of the arc-shaped elastic sheet 11 is related to the material and the thickness, and the greater the modulus is, the thicker the thickness is, the more difficult the sheet is to deform, so that the stress deformation characteristics of the sensing structure can be changed by changing the material and the thickness of the sheet, and the pressure detection performance of the pressure sensing device can be further changed.
The working principle based on the pressure sensing structure is that leads at two ends of the PFC sensor are connected to a reading circuit, in an initial state, the electrode 25 is not contacted with the semiconductor conductive film 24 in fig. 3, so that the circuit can be regarded as open circuit, when pressure acts on the pressure bearing plate 4, the arc-shaped elastic sheet 11 deforms under the action of the extrusion force, and the included angle formed by the arc-shaped elastic sheet 11 and the bottom plate 31 of the frame structure 3 is reduced. When the pressure is increased to a certain degree, the electrode 25 near the bending part 23 is contacted with the semiconductor conductive film 24, a communication loop is formed between the electrode 25 and the semiconductor conductive film 24, but the loop is longest, so that the measured resistance value is larger, the pressure value can be recorded as trigger pressure, the contact area between the electrode 25 and the semiconductor conductive film 24 is increased under the extrusion of the arc-shaped structure as the pressure is further increased, so that the short circuit is caused by the contact area, the loop resistance is reduced, when the pressure is further increased, the electrode 25 is completely attached to the semiconductor conductive film 24, the loop is completely covered by a short circuit unit, the loop resistance reaches the minimum value, and the pressure value is the maximum range of the pressure detection of the pressure sensing unit.
When the pressure on the pressure bearing plate 4 is removed, the arc-shaped elastic sheet 11 is restored to the initial state under the elastic action, and in the process, the contact area of the electrode 25 and the semiconductor is gradually reduced to be separated, and at the moment, the electric signal output by the pressure sensing structure also restores the initial value under the non-pressure action. In summary, the output resistance value of the pressure sensing structure decreases with increasing pressure, so that the applied pressure information can be reflected.
Furthermore, the pressure sensing structure can also realize the detection of the action point of the pressure on the pressure bearing plate 4 in a specific mode that the pressure bearing member can vertically move and incline in the frame structure 3 because the width of the pressure bearing member is slightly smaller than that of the inner groove of the frame structure 3. Specifically, when pressure acts on the midpoint of the bearing plate 4, the deformation amplitude of the left and right elastic sheets of the pressure sensing structure is the same, so that the moving distance of the two FPC pressure sensing assemblies 2 stuck on the arc-shaped elastic sheet 11 is the same, and therefore the extrusion area between the upper electrodes 25 of the two FPC pressure sensing assemblies and the semiconductor conductive film 24 is the same, at the moment, the two FPC pressure sensing assemblies 2 have the same or similar resistance change, when pressure acts on one end of the bearing plate 4, the elastic sheet shape of the one end is changed greatly, so that the resistance change amplitude of the one end FPC sensor is larger, the resistance change amplitude of the other end elastic sheet is smaller, and therefore, the resistance change amplitude is smaller, and the acting point of the pressure on the bearing plate 4 can be calculated through the ratio of the resistance change quantity DeltaR 1 and DeltaR 2 of the two FPC pressure sensing assemblies 2. In summary, in the pressure sensing structure according to the first embodiment, under the combined action of the pressure sensing units at two ends, the detection of the pressure and the action position can be realized.
Example IV
As shown in fig. 5, in this embodiment, a pressure touch device is designed based on the pressure sensing structure in the second embodiment, and the pressure sensing structure in the second embodiment is only one pressure sensing unit, so that the detection of the pressure action position cannot be realized.
The bottom surface of the pressure sensing unit can be connected to the surface of the electronic equipment for fixation by welding, gluing and the like.
The pressure touch device provided by the embodiment comprises a bearing plate 4, a frame structure 3 and a plurality of pressure sensing structures, wherein the plurality of pressure sensing structures are arranged in the frame structure 3, and the bearing plate 4 is arranged on the upper surface of the pressure sensing structure;
The frame structure 3 comprises a bottom plate 31 and a cylinder body 32, wherein the cylinder body 32 is provided with openings at two ends, one end of the cylinder body 32 is fixedly connected with the bottom plate 31, the pressure sensing structures are uniformly arranged on the same circumference, and the pressure sensing structures are fixed on the bottom plate 31 in an adhesive mode. The cylinder 32 protects the internal pressure sensing structures while allowing the top bearing plate 4 to move longitudinally along the cylinder 32 under pressure. Magnetic force adsorption is adopted between the bearing plate 4 and the pressure sensing structures. The number of the pressure sensing structures in this embodiment is four.
The four pressure sensing structures can realize pressure detection and pressure action position detection, and the specific implementation mode is that when pressure acts on the center position of the top bearing plate 4, the arc-shaped elastic sheets 11 of the four pressure sensing structures show the same deformation amplitude, so that the four FPC pressure sensing films are extruded, a communication loop formed between the upper film electrode 25 and the semiconductor conductive film 24 has the same or similar resistance signals, the process is consistent with that of the corresponding part in the third embodiment, when the pressure acts on the edge position of the bearing plate 4, the pressure sensing structures near the pressure action points bear larger deformation, the deformation of the sensing structures far away from the pressure action points is smaller, and therefore the FPC pressure sensing film resistance close to the pressure action points is smaller, and the position of the pressure action points can be determined by calculating the mutual ratio between the resistance signal change amounts DeltaR 1、ΔR2、ΔR3 and DeltaR 4 of the four pressure sensing structures.
Further, a flexible contact can be stuck to the top bearing plate 4 of the touch device, and the bearing plate 4 can be driven to slide up and down and incline by pressing, nudging and other operations on the contact, so that the magnitude and the direction of the acting force are detected through the cooperation of the four pressure sensing units, and the detection of any direction of the plane force is realized.
The above is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement or the like made in the specific embodiments according to the ideas provided in the present application should be included in the scope of protection of the present application, insofar as they are within the spirit and principle of the present application.
Claims (8)
1. The pressure sensing structure is characterized by comprising an arc-shaped elastic sheet (11) and a pressure sensing assembly (2) arranged on the outer surface of the arc-shaped elastic sheet (11);
The pressure sensing assembly (2) comprises a first section (21) of a film, a second section (22) of the film, a semiconductor conductive film (24) and an electrode (25);
the first section (21) of the film is arranged on the outer surface of the arc-shaped elastic sheet (11) along the length direction of the arc-shaped elastic sheet (11);
The semiconductor conductive film (24) is positioned on the surface of the first section (21) of the film, and the electrode (25) is positioned on the second section (22) of the film, and the positions of the semiconductor conductive film (24) and the electrode (25) correspond to each other;
The pressure sensing structure further comprises a first plate (12);
One end of the arc-shaped elastic sheet (11) is connected with the upper surface of the first flat plate (12), and the other end of the arc-shaped elastic sheet (11) is a free end;
The second section (22) of the film is arranged on the upper surface of the first flat plate (12), and the electrode (25) on the second section (22) of the film corresponds to the position of the semiconductor conductive film (24);
The first section (21) of the film and the second section (22) of the film are connected by a bending part (23).
2. The pressure sensing structure according to claim 1, wherein a second flat plate (13) is further connected to the free end of the arc-shaped spring plate (11), and the second flat plate (13) is parallel to the first flat plate (12).
3. A pressure sensing arrangement according to claim 1, further comprising a base plate (31);
The middle point of the arc-shaped elastic sheet (11) is fixedly connected with the upper surface of the bottom plate (31), and both ends of the arc-shaped elastic sheet (11) are free ends
The second section (22) of the film is arranged on the upper surface of the flat plate, and the electrode (25) on the second section (22) of the film corresponds to the position of the semiconductor conductive film (24).
4. A pressure sensing arrangement according to claim 3, characterized in that there are two pressure sensing members (2) and that the two pressure sensing members (2) are symmetrically arranged.
5. A pressure sensing arrangement according to claim 4, further comprising a pressure bearing plate (4);
two free ends of the arc-shaped elastic sheet (11) are connected with a second flat plate (13), and the second flat plate (13) is parallel to the bottom plate (31);
the bearing plates (4) are positioned on the upper surfaces of the two second plates (13).
6. The pressure sensing structure according to claim 5, wherein the bottom plate (31) is provided with a cylinder (32), and the arc-shaped elastic sheet (11) and the pressure sensing assembly (2) are both positioned in the cylinder (32);
the cross section of the bearing plate (4) is similar to the cross section of the cylinder (32) and smaller than the cross section of the cylinder (32).
7. A pressure touch device based on the pressure sensing structure according to claim 2, characterized by a bottom plate (31), a cylinder (32), a bearing plate (4) and a plurality of pressure sensing structures;
The cylinder body (32) and the pressure sensing structures are arranged on the surface of the bottom plate (31), and the pressure sensing structures are positioned in the cylinder body (32);
The bearing plate (4) is positioned on the upper surfaces of the pressure sensing structures and connected with the upper surfaces of the second flat plates of the pressure sensing assemblies (2), and the section of the bearing plate (4) is similar to the section of the cylinder body (32) and smaller than the section of the cylinder body (32).
8. The pressure touch apparatus of claim 7 wherein the plurality of pressure sensing structures are uniformly distributed on the same circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411278077.5A CN119124414B (en) | 2024-09-12 | 2024-09-12 | Pressure sensing structure and pressure touch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411278077.5A CN119124414B (en) | 2024-09-12 | 2024-09-12 | Pressure sensing structure and pressure touch device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119124414A CN119124414A (en) | 2024-12-13 |
| CN119124414B true CN119124414B (en) | 2025-06-24 |
Family
ID=93751465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411278077.5A Active CN119124414B (en) | 2024-09-12 | 2024-09-12 | Pressure sensing structure and pressure touch device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119124414B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019065515A1 (en) * | 2017-09-27 | 2019-04-04 | キヤノン化成株式会社 | Pressure-sensitive sensor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008180670A (en) * | 2007-01-26 | 2008-08-07 | Matsushita Electric Ind Co Ltd | Dynamic quantity sensor |
| KR102081892B1 (en) * | 2013-09-05 | 2020-02-26 | 삼성전자주식회사 | Resistive pressure sensor including piezo-resistive electrode |
| CN106197772B (en) * | 2016-07-06 | 2020-01-03 | 无锡第六元素电子薄膜科技有限公司 | Flexible pressure sensor and preparation method thereof |
| CN106197774B (en) * | 2016-07-20 | 2019-08-09 | 上海交通大学 | Flexible piezoresistive tactile sensor array and preparation method thereof |
| CN212059194U (en) * | 2020-06-10 | 2020-12-01 | 东莞市中图半导体科技有限公司 | Micro-deformation pressure sensor and device |
-
2024
- 2024-09-12 CN CN202411278077.5A patent/CN119124414B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019065515A1 (en) * | 2017-09-27 | 2019-04-04 | キヤノン化成株式会社 | Pressure-sensitive sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119124414A (en) | 2024-12-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3919748B2 (en) | Position sensor containing elastomeric material | |
| CN108318059B (en) | Paper-based sensor and preparation method thereof | |
| CN106197772B (en) | Flexible pressure sensor and preparation method thereof | |
| CN108604149A (en) | The production method of pressure sensor, electronic equipment and the pressure sensor | |
| CN113125055A (en) | Piezoresistive and capacitive fused three-dimensional flexible touch sensor | |
| US20210356340A1 (en) | Strain sensor | |
| CN114270157B (en) | Force sensing device, force sensing method and equipment | |
| CA1036832A (en) | Pressure sensitive capacitance sensing element | |
| CN119124414B (en) | Pressure sensing structure and pressure touch device | |
| US7353713B2 (en) | Flexible apparatus and method to enhance capacitive force sensing | |
| CN111721963A (en) | A wind speed sensor and wind speed detection device | |
| CN211373491U (en) | Displacement sensor | |
| CN205562090U (en) | Pressure sensor | |
| CN207730350U (en) | A kind of fexible film pressure sensor | |
| US7921728B2 (en) | Flexible apparatus and method to enhance capacitive force sensing | |
| CN113242965B (en) | Pressure sensor and electronic terminal | |
| CN209299316U (en) | A kind of mobile phone camera | |
| CN116760258B (en) | Strain sensing VCM elastic sheet, driving assembly, camera module and electronic equipment | |
| CN218916617U (en) | Pressure sensor and pressure sensor system | |
| CN212458408U (en) | Resistance displacement sensor | |
| CN212391154U (en) | Pressure sensing device and electronic equipment | |
| CN111198053B (en) | Pressure sensor and pressure sensor design method | |
| CN114354027A (en) | Bionic flea capacitive flexible pressure touch sensor, sensing system and electronic skin | |
| CN114923518A (en) | Based on magnetostrictive-resistance composite sensor | |
| CN209946194U (en) | Wind speed sensor and wind speed detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |