CN119095411A - Display module - Google Patents
Display module Download PDFInfo
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- CN119095411A CN119095411A CN202411186744.7A CN202411186744A CN119095411A CN 119095411 A CN119095411 A CN 119095411A CN 202411186744 A CN202411186744 A CN 202411186744A CN 119095411 A CN119095411 A CN 119095411A
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- plate
- display panel
- display
- bent
- frame
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The display module comprises a display panel and a plurality of circuit elements, wherein the display panel comprises a display side and a back side, the display side is opposite to the back side, the display panel further comprises a display area and a frame area, the frame area surrounds at least one side periphery of the display area, the frame area on at least one side of the display panel is bent to the back side of the display panel to form a bent frame, the circuit elements are located on the back side of the display panel and are electrically connected with the display panel, the display module further comprises a heat dissipation supporting structure which is located on one side, away from the display side, of the circuit elements and the bent frame, the heat dissipation supporting structure comprises a metal plate, or the heat dissipation supporting structure comprises an injection molding plate and a metal coating, the metal coating at least covers one side surface, close to the display panel, of the injection molding plate, the heat dissipation supporting structure comprises a first part and a second part, the first part and the second part are integrally formed or movably connected, the orthographic projection of the first part on the display panel is located in the area where the bent frame is located, and the orthographic projection of the second part on the display panel is located in the area where the circuit elements are located.
Description
Technical Field
The invention belongs to the field of display, and particularly relates to a display module.
Background
An OLED (Organic Light-Emitting Diode) display screen receives a lot of attention because of its advantages of self-luminescence, low power consumption, light and thin, flexibility, gorgeous color, high contrast, and fast response speed.
Disclosure of Invention
The invention provides a display module, which comprises a display panel and a plurality of circuit elements,
The display panel includes a display side and a back side, the display side and the back side being opposite;
The display panel also comprises a display area and a frame area, the frame area surrounds at least one side periphery of the display area, the frame area on at least one side of the display panel is bent to the back side of the display area to form a bent frame,
The circuit elements are positioned on the back side of the display panel and are electrically connected with the display panel,
The heat dissipation support structure is positioned on one side of the circuit element and the bending frame, which is away from the display side,
The heat dissipation supporting structure comprises a metal plate, or comprises an injection molding plate and a metal coating, wherein the metal coating at least covers one side surface of the injection molding plate, which is close to the display panel;
The heat dissipation supporting structure comprises a first part and a second part which are integrally formed or movably connected,
The front projection of the first part on the display panel is positioned in the area where the bending frame is positioned, the front projection of the second part on the display panel is positioned in the area where the circuit element is positioned,
The first portion is not in contact with the bending frame, or the first portion is in contact with the bending frame, and the first portion forms elastic support for the bending frame.
In some embodiments, the first portion comprises an arcuate panel,
The cambered surface plate is bent in a direction away from the display panel,
The distance between the cambered surface plate and the display panel is gradually increased along the direction that the bending frame is far away from the display area;
the cambered surface plate is not contacted with the bending frame.
In some embodiments, the second portion includes a body plate and a connecting plate, the body plate and the connecting plate being connected,
The connecting plate is located at one end of the body plate near the first portion,
The cross section of the connecting plate along the direction perpendicular to the plate surface comprises a wedge shape, and the thickness of the connecting plate is gradually reduced along the direction away from the main body plate;
The first part comprises a plane plate, the plane plate is positioned on one side of the connecting plate, which is far away from the display panel, the plane plate is partially overlapped with the connecting plate, and the plane plate is detachably connected with the connecting plate at an overlapped position;
The plane plate is not contacted with the bending frame.
In some embodiments, the display device further comprises a cover plate covering the display side of the display panel, and the cover plate covers the whole display panel,
The first portion comprises a curved plate and,
The curved plate is curved in a direction approaching the display panel, and the extending end of the curved plate is contacted with one side surface of the cover plate approaching the display panel;
the curved plate is not contacted with the bending frame.
In some embodiments, the curved panel comprises an arcuate panel or a corrugated panel.
In some embodiments, the curved panel includes a plurality of first cavities,
The first plurality of cavities are spaced apart,
The first concave cavity is recessed towards one side of the curved plate away from the display panel;
A plurality of openings are further formed in the curved plate, and the openings are distributed at intervals.
In some embodiments, the first portion comprises an open annular plate, the plate surface of which is curved to form an open-ended annular shape,
The open annular plate is curved in a direction approaching the display panel,
The opening of the open annular plate is positioned at one end of the first part close to the second part;
And one side plate surface of the opening annular plate, which is close to the bending frame, is contacted with the bending frame.
In some embodiments, the first portion comprises an open annular plate, the plate surface of which is curved to form an open-ended annular shape,
The open annular plate is curved in a direction away from the display panel,
The opening of the open annular plate is positioned at one end of the first part close to the second part;
And one side plate surface of the opening annular plate, which is close to the bending frame, is contacted with the bending frame.
In some embodiments, the first portion comprises a plate of unitary construction, an orthographic projection of the first portion on the display panel overlies the bent bezel,
Or the first part comprises a plate of a frame structure, and the orthographic projection of the first part on the display panel covers a partial area of the bending frame.
In some embodiments, the second portion comprises a plate of unitary construction, an orthographic projection of the second portion on the display panel covering the plurality of circuit elements;
the second part comprises a plurality of second concave cavities, the second concave cavities are concave towards the direction away from the display panel,
The circuit element is positioned in the second concave cavity;
or the second portion comprises a plate of a frame structure, and an orthographic projection of the second portion on the display panel does not overlap with the circuit element.
In some embodiments, a removable adhesive is provided at the connection location of the first and second portions to removably connect the first and second portions;
Or an elastic member is arranged at the connecting position of the first part and the second part so as to elastically connect the first part and the second part;
or a rotating piece is arranged at the connecting position of the first part and the second part, so that the first part and the second part can rotate relatively and are connected.
In some embodiments, the display panel further comprises a reinforcing adhesive layer, wherein the reinforcing adhesive layer is positioned on the display side of the display panel and is bent from the display side of the display panel to the back side of the display panel, and the reinforcing adhesive layer covers the bending frame;
The distance between the plane of one end of the first part far away from the second part and the plane of one end of the bending frame far away from the display area is 0.3-0.8 mm;
The distance between the orthographic projection of the edge of one end of the first part far away from the second part on the plane of the display panel and the orthographic projection of the edge of one end of the bending frame far away from the display area on the plane of the display panel is 0-0.5 mm;
The distance range between the orthographic projection of the edge of the first part, which is close to the second part, on the display panel and the orthographic projection of the edge of the reinforcing adhesive layer, which is positioned on the back side of the display panel, on the display panel is 1-2 mm.
In some embodiments, the distance between the curved panel and the bent frame ranges from 0.2mm or more;
And an external force buffer layer is further arranged on one side, away from the bending frame, of the curved plate.
In some embodiments, the depth of the first concave cavity ranges from 0.1 mm to 0.3mm;
the area of the opening is 5 multiplied by 5 to 10 multiplied by 10mm 2.
In some embodiments, a thermally conductive coating and/or an external force buffer layer is also included,
The heat conducting coating and/or the external force buffer layer is/are arranged at least in the area of the outer side plate surface of the opening annular plate, which is contacted with the bending frame,
The external force buffer layer and the heat conduction coating are sequentially far away from the outer side plate surface of the opening annular plate to be overlapped, and the heat conduction coating is contacted with the bending frame.
In some embodiments, the buffer part is filled in the area formed by surrounding the open annular plate, and the buffer part is in contact with the inner side plate surface of the open annular plate.
The display module has the beneficial effects that the heat dissipation supporting structure is arranged on one side, away from the display panel, of the circuit element and the bending frame, and the heat dissipation supporting structure adopts the metal plate or the injection molding plate coated with the metal coating, so that on one hand, the heat dissipation supporting structure can play a good role in heat conduction, heat dissipation and electromagnetic interference shielding on the circuit element, on the other hand, the heat dissipation supporting structure is hard in material and firm in appearance, and can form good physical protection on the circuit element and the bending frame, and on the other hand, compared with the heat dissipation film compounded by the multilayer materials in the related art, the heat dissipation supporting structure is single in material, does not need a die cutting process in the preparation process, is simple in preparation process, high in preparation yield, greatly reduced in material cost and preparation cost, and simple in structure.
Drawings
FIG. 1 is a schematic diagram showing a multi-layer structure of a heat dissipation film according to the related art;
FIG. 2a is a schematic top view illustrating a structure of a back side of a display module according to an embodiment of the invention;
FIG. 2b is a schematic side view of the display module of FIG. 2 a;
FIG. 2c is a schematic perspective view of the display module of FIG. 2 a;
FIG. 2d is an assembly schematic diagram of the heat dissipation supporting structure of the display module of FIG. 2 a;
FIG. 3a is a schematic top view illustrating a structure of a back side of another display module according to an embodiment of the invention;
FIG. 3b is a schematic side view of the display module of FIG. 3 a;
FIG. 3c is a schematic view showing a different arrangement of the removable adhesive between the first portion and the second portion of the display module of FIG. 3 a;
FIG. 3d is a schematic perspective view of the display module of FIG. 3 a;
FIG. 3e is a schematic view of the display module of FIG. 3a with the first portion removed during assembly;
FIG. 4a is a schematic side view illustrating a structure of a display module according to another embodiment of the invention;
fig. 4b is a schematic structural diagram of a first portion of a display module according to another embodiment of the invention;
fig. 4c is a schematic perspective view of another display module according to an embodiment of the invention;
fig. 4d is a schematic structural diagram of a first portion of a display module according to another embodiment of the invention;
fig. 4e is a schematic perspective view of another display module according to an embodiment of the invention;
FIG. 5a is a schematic side view illustrating a display module according to another embodiment of the invention;
FIG. 5b is a schematic side view illustrating a display module according to another embodiment of the invention;
FIG. 5c is a schematic view illustrating a film arrangement between a first portion of an open annular plate and a bent frame according to an embodiment of the present invention;
FIG. 6a is a schematic side view illustrating a display module according to another embodiment of the invention;
FIG. 6b is a schematic illustration of the heat dissipating support structure of FIG. 6a attached to the back side of the display panel;
FIG. 7a is a schematic top view illustrating a structure of a back side of a display module according to another embodiment of the invention;
Fig. 7b is a physical diagram of the heat dissipation supporting structure of the display module in fig. 7 a.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, a display module of the present invention is described in further detail below with reference to the accompanying drawings and the detailed description.
In the related art, a heat dissipation film is required to be attached to the back side of the OLED display screen opposite to the display side so as to dissipate heat of the circuit element located on the back side, and meanwhile, in order to reduce the width of the binding layer frame region of the OLED display screen, the binding side frame region of the OLED display screen is bent to the back side of the OLED display screen, and the heat dissipation film is required to form physical protection for the bent binding side frame region and the circuit element so as to prevent line damage caused by external force on the bent binding side frame region and the circuit element. As shown in fig. 1, the heat dissipation film is a multi-layer structure and mainly comprises three functional layers, namely copper foil (conductive and endothermic), mylar (insulating) and wave absorbing material (electromagnetic shielding), wherein the mylar, the wave absorbing material and the copper foil are sequentially stacked, and the mylar is closest to the circuit element.
The heat dissipation film in the related art has the following disadvantages:
Firstly, the whole heat dissipation film is softer, and the physical protection to circuit elements, particularly to the bound side frame area after bending is weaker or does not have a physical protection function. If the circuit element needs to be glued on the side edge which is not covered by the heat dissipation film to form a fence, the protection of the circuit element is realized, and the support is added to the binding side frame area after bending for protection.
And the heat dissipation film is formed by compounding multiple layers of materials, the material cost is high, the structure is complex, the die cutting is needed in the lamination process of each composite material layer, the die cutting is needed after the multiple layers of materials are compounded, and the die cutting yield is low.
Thirdly, the copper foil is thinner, the heat absorption effect is general, and the cooling requirement of the electronic product with high performance and high utilization rate can not be well met.
In order to solve the above-mentioned problems, an embodiment of the present invention provides a display module, as shown in fig. 2 a-2 d, 3 a-3 e, 4 a-4 e, 5 a-5 c, 6 a-6 b and 7 a-7 b, including a display panel 1 and a plurality of circuit elements 2, wherein the display panel 1 includes a display side 100 and a back side 101, and the display side 100 is opposite to the back side 101; the display panel 1 further comprises a display area 102 and a frame area, the frame area surrounds at least one side periphery of the display area 102, the frame area on at least one side of the display panel 1 is bent to the back side 101 of the display panel 1 to form a bent frame 103, a plurality of circuit elements 2 are located on the back side of the display panel 1 and are electrically connected with the display panel 1, the display panel further comprises a heat dissipation supporting structure 3, the heat dissipation supporting structure 3 is located on one side, away from the display side 100, of the circuit elements 2 and the bent frame 103, the heat dissipation supporting structure 3 comprises a metal plate or comprises an injection molding plate and a metal coating, the metal coating at least covers one side surface, close to the display panel, of the injection molding plate, the heat dissipation supporting structure 3 comprises a first part 31 and a second part 32, the first part 31 and the second part 32 are integrally formed or movably connected, the orthographic projection of the first part 31 on the display panel 1 is located in the area where the bent frame 103 is located, the orthographic projection of the second part 32 on the display panel 1 is located in the area where the circuit elements 2 are located, the first part 31 is not contacted with the bent frame 103 or the first part 31 is contacted with the bent frame 103, and the first part 31 forms elastic supporting bending for the frame 103.
The circuit elements 2 include circuit elements located on the bending frame 103 of the back side 101 of the display panel 1 and circuit elements located in other areas (such as on a peripheral circuit board) of the back side 101 of the display panel 1. The circuit element 2 is a driving chip, a resistor, a capacitor, or the like. The display panel 1 includes a flexible substrate and pixel circuits and light emitting elements sequentially stacked on one side of the flexible substrate. The light emitting element includes an organic electroluminescent element, that is, an OLED element.
In this embodiment, the heat dissipation supporting structure 3 may be formed by bending a single metal sheet, or may be an injection molding plate with a metal layer on the surface, and the metal may be copper or aluminum with good heat conduction effect, and the material of the injection molding plate includes polyethylene terephthalate, acryl resin, polycarbonate or foam. The metal sheet metal or the metal layer plated on the surface of the injection molding board has good heat conduction, heat dissipation and electromagnetic interference (electromagnetic interference, EMI) shielding effects on one hand, on the other hand, the metal sheet metal or the metal layer plated on the surface of the injection molding board is hard in material and firm in appearance, and can form good physical protection on the circuit element 2 and the bending frame 103, and on the other hand, compared with a heat dissipation film compounded by multiple layers of materials in the prior art, the metal sheet metal or the metal layer plated on the surface of the injection molding board in the embodiment is single in material, does not need a die cutting process in the preparation process, and has the advantages of simple preparation process, high preparation yield, greatly reduced material cost and preparation cost and simple structure.
The heat dissipation supporting structure 3 is arranged on one side, away from the display panel 1, of the circuit element 2 and the bending frame 103, and the heat dissipation supporting structure 3 is made of a metal plate or an injection molding plate coated with a metal coating, so that on one hand, the heat dissipation supporting structure 3 can play a good role in heat conduction, heat dissipation and electromagnetic interference shielding on the circuit element 2, on the other hand, the heat dissipation supporting structure 3 is hard in material and firm in appearance, and can form good physical protection on the circuit element 2 and the bending frame 103, and on the other hand, compared with a heat dissipation film compounded by multiple layers of materials in the related art, the heat dissipation supporting structure 3 is single in material, does not need a die cutting process in the preparation process, is simple in preparation process, high in preparation yield, greatly reduced in material cost and preparation cost, and simple in structure.
In some embodiments, as shown in fig. 2a, 2b, 2c and 2d, the first portion 31 includes an arc panel, the arc panel is curved away from the display panel 1, and the distance between the arc panel and the display panel 1 increases gradually along the direction of the bending border 103 away from the display area 102, and the arc panel is not in contact with the bending border 103.
In some embodiments, the first portion 31 comprises a plate of full-face structure, and the front projection of the first portion 31 on the display panel 1 covers the bending border 103.
In some embodiments, the second portion 32 comprises a plate of unitary construction, the orthographic projection of the second portion 32 on the display panel 1 covering the plurality of circuit elements 2, the second portion 32 comprising a plurality of second cavities 320, the second cavities 320 being recessed away from the display panel 1, the circuit elements 2 being located in the second cavities 320.
In some embodiments, as shown in fig. 2 a-2 d, the first portion 31 and the second portion 32 are integrally formed.
In this embodiment, as shown in fig. 2a to 2d, the first portion 31 forms a warpage structure relative to the second portion 32, the second cavity 320 forms a protection cover for accommodating the protection circuit element 2, the warpage structure and the protection cover are made of hard materials, have a firm shape, can form good physical protection for the circuit element 2 and the bending frame 103, and can perform good heat conduction, heat dissipation and electromagnetic interference shielding effects for the circuit element 2 and the bending frame 103.
In some embodiments, as shown in fig. 2a to 2d, the display module further includes a reinforcing adhesive layer 4, which is located on the display side 100 of the display panel 1, and is bent from the display side 100 of the display panel 1 to the back side 101 thereof, wherein the reinforcing adhesive layer 4 covers the bent frame 103, a distance h between a plane of an end of the first portion 31, which is far from the second portion 32, and a plane of an end of the bent frame 103, which is far from the display area 102, ranges from 0.3 mm to 0.8mm, a distance a between an orthographic projection of an end edge of the first portion 31, which is far from the second portion 32, on the plane of the display panel 1, and an orthographic projection of an end edge of the bent frame 103, which is far from the display area 102, on the plane of the display panel 1 ranges from 1 to 0.5mm, and a distance b between an orthographic projection of an end edge of the first portion 31, which is near to the second portion 32, on the display panel 1, on the back side 101 of the display panel 4, on the display panel 1 ranges from 1 to 2mm.
The size ranges of the distance h and the distance a are beneficial to avoiding the compression of the first portion 31 by the external force, so as to avoid the deformation of the first portion 31 under the action of the external force to compress the bending frame 103. The size range of the distance b is advantageous for avoiding the risk of the first portion 31 adhering to the reinforcing glue layer 4.
In this embodiment, as shown in fig. 2d, the assembly scheme of the heat dissipation supporting structure 3 and the display panel 1 is that a side surface of the heat dissipation supporting structure 3, which is used for being attached to the back side 101 of the display panel 1, is glued, and the heat dissipation supporting structure 3 is absorbed by the attaching device and attached to the back side 101 of the display panel 1.
In some embodiments, unlike the display modules shown in fig. 2a to 2d, the second portion 32 includes a main body plate 321 and a connecting plate 322, where the main body plate 321 is connected to the connecting plate 322, the connecting plate 322 is located at one end of the main body plate 321 near the first portion 31, the cross-sectional shape of the connecting plate 322 perpendicular to the plate surface includes a wedge shape, and the thickness of the connecting plate 322 is gradually reduced in a direction away from the main body plate 321, the first portion 31 includes a plane plate located on a side of the connecting plate 322 facing away from the display panel 1, the plane plate partially overlaps the connecting plate 322, the plane plate is detachably connected to the connecting plate 322 at the overlapping position, and the plane plate is not in contact with the bending frame 103.
Wherein, the upper surface of the wedge-shaped connecting plate 322 facing away from the display panel 1 is adhered with a plane plate. The flat plate is used for protecting the bending frame 103 from being pressed by external force so as to prevent the circuit of the bending frame 103 from being pressed and damaged. The flat plate may be made of metal plate, injection molding plate, polyethylene terephthalate (PET) plate, acrylic resin plate, polycarbonate plate, foam, etc.
In this embodiment, the planar plate is removable from the connecting plate 322. When the display module assembly is performed, the flat plate and the connecting plate 322 are assembled in a fitting way, and the flat plate can protect the bending frame 103, so that the bending frame 103 is prevented from being physically pressed, and cracks of the bending frame 103 are avoided. As shown in fig. 3e, when the whole machine is assembled (i.e. the display module is assembled to form the display device), the flat panel is removed from the connecting plate 322, and only the second portion 32 is reserved, so that the flat panel cannot be accommodated in the casing of the whole machine, which is beneficial to the assembly of the whole machine. Of course, if the plane plate can be accommodated in the shell of the whole machine, the plane plate can be not detached.
In some embodiments, as shown in fig. 3c, a detachable adhesive is provided at the connection location of the first portion 31 and the second portion 32, so that the first portion 31 and the second portion 32 are detachably connected.
In some embodiments, as shown in fig. 3c, the detachable adhesive between the flat panel and the connecting plate 322 is provided by four methods, namely, firstly, using AB glue or weak glue to attach the flat panel to the connecting plate 322. The adhesiveness of the AB glue or the weak glue is selected to be 10-30 gf/inch, so that the plane plate can be conveniently torn off from the connecting plate 322.
And secondly, the plane plate is attached and connected with the connecting plate 322 by adopting glue with a gradual change type glue attaching area. When the flat panel is torn off from the connecting plate 322, the tearing area of the gradual change type rubberizing area is small, and the tearing area is large, so that the flat panel is convenient to tear off from the connecting plate 322.
Thirdly, the planar plate is bonded and connected with the connecting plate 322 by adopting sectional bonding glue. The sectional type laminating adhesive ensures that each piece of adhesive is easy to tear. The sectional type laminating adhesive can be torn off along the left-right direction and also can be torn off along the front-back direction.
And fourthly, adopting UV (ultraviolet) glue reducing glue to attach and connect the plane plate with the connecting plate 322. When the whole machine is assembled, the plane plate can be torn off after UV light irradiates UV glue reducing glue.
In this embodiment, other structures and distance arrangements of the display modules in fig. 3a to 3e are the same as those of the display modules in fig. 2a to 2d, and will not be described again.
In some embodiments, as shown in fig. 3d, the distance h1 of the planar plate from the reinforcing adhesive layer 4 may also be 0.5mm or more. The distance c between the orthographic projection of the edge of one end, close to the flat plate, of the connecting plate 322 on the display panel 1 and the orthographic projection of the edge of one end, located at the back side 101 of the display panel 1, of the reinforcing adhesive layer 4 on the display panel 1 ranges from 1 to 2mm.
In some embodiments, as shown in fig. 4a to 4e, the display module further includes a cover plate 5 covering the display side 100 of the display panel 1, and the cover plate 5 covers the entire display panel 1, the first portion 31 includes a curved plate, the curved plate is bent toward the direction close to the display panel 1, an extending end of the curved plate is in contact with a side surface of the cover plate 5 close to the display panel 1, and the curved plate is not in contact with the bending border 103.
In some embodiments, the distance d between the curved plate and the bending frame 103 is more than 0.2mm, and an external force buffer layer 6 is further arranged on one side of the curved plate away from the bending frame 103.
Wherein the curved panel is flared at least 0.2mm relative to the bent rim 103. The thickness of the first portion 31 may be thicker than that of the second portion 32, or an external force buffer layer 6 (such as a buffer foam) may be added on a side of the curved plate facing away from the bending frame 103, so as to buffer impact of external force, thereby enhancing the capability of the first portion 31 against compression of external force.
In some embodiments, as shown in fig. 4 a-4 c, the curved panel comprises an arc panel. As shown in fig. 4d to 4e, the curved plate includes a corrugated plate. If the curved plate is configured as a wave-shaped fold, the impact resistance of the first portion 31 against external forces can be enhanced as well. The optimal process of the corrugated plate is stamping forming through metal sheet metal, and injection molding can be performed.
In some embodiments, as shown in fig. 4b to 4e, the curved plate includes a plurality of first cavities 310, the plurality of first cavities 310 are distributed at intervals, the first cavities 310 are recessed toward a side of the curved plate away from the display panel 1, and a plurality of openings 311 are further formed in the curved plate, and the plurality of openings 311 are distributed at intervals.
In some embodiments, the depth of the first cavity 310 ranges from 0.1 mm to 0.3mm, and the area of the opening 311 ranges from 5×5mm to 10×10mm 2.
The first cavity 310 mainly plays a role of reinforcement, and may be distributed in a plurality at one end of the first portion 31 away from the second portion 32. The opening 311 is convenient for checking defects of the bending frame 103 (such as bending cracks, foreign matters in the bending frame area, bending deformation of the bending frame area, etc.), and the opening 311 can dissipate heat, so that heat generated during display of the display panel 1 can flow through the opening 311. The size of the opening 311 can ensure the bad inspection requirement of the bending frame 103 and avoid the false press bending of the bending frame 103 by fingers through the opening 311.
In some embodiments, other structural arrangements of the display modules in fig. 4a to 4e are the same as those of the display modules in fig. 2a to 2d, and will not be repeated here.
In some embodiments, as shown in fig. 5a to 5c, the first portion 31 includes an open annular plate, the plate surface of the open annular plate is bent to form an annular shape with one open end, the open annular plate is bent towards the direction close to the display panel 1, the opening of the open annular plate is located at one end of the first portion 31 close to the second portion 32, and the plate surface of one side of the open annular plate close to the bending frame 103 is in contact with the bending frame 103. The open annular plate can avoid the first portion 31 from damaging the bending frame 103 when the first portion 31 is attached to the bending frame 103.
In some embodiments, as shown in fig. 6a and 6b, the first portion 31 includes an open annular plate, the plate surface of the open annular plate is bent to form a ring shape with one end open, the open annular plate is bent in a direction away from the display panel 1, the opening of the open annular plate is located at one end of the first portion 31 near the second portion 32, and the plate surface of one side of the open annular plate near the bending frame 103 is in contact with the bending frame 103. The open annular plate can avoid the first portion 31 from damaging the bending frame 103 when the first portion 31 is attached to the bending frame 103.
In some embodiments, as shown in fig. 5c, the display module further includes a heat-conducting coating 7 and/or an external force buffer layer 6, where the heat-conducting coating 7 and/or the external force buffer layer 6 are at least disposed on an area of the outer side surface of the open annular plate, where the area is in contact with the bending frame 103, the heat-conducting coating 7 and the external force buffer layer 6 are sequentially stacked away from the outer side surface of the open annular plate, and the heat-conducting coating 7 is in contact with the bending frame 103. The heat-conducting coating 7 can absorb heat generated by the bending frame 103. The heat-conducting coating 7 can be made of metal materials with good heat-conducting property, such as copper or aluminum. The external force buffer layer 6 can avoid the first portion 31 from damaging the bending frame 103 when the first portion 31 is attached to the bending frame 103. The external force buffer layer 6 can be formed by injection molding liquid silica gel.
In some embodiments, as shown in fig. 5b, the display module further includes a buffer portion 8 filled in an area surrounded by the open annular plate, and the buffer portion 8 contacts with an inner side plate surface of the open annular plate. The buffer portion 8 can avoid the first portion 31 from damaging the bending frame 103 when the first portion 31 is attached to the bending frame 103. The buffer part 8 can adopt buffer foam.
In this embodiment, as shown in fig. 5a to 5c and fig. 6a to 6b, the first portion 31 forms a curled structure at the position of the bending frame 103. The curled structure can avoid the first portion 31 from damaging the bending frame 103 when the first portion 31 is attached to the bending frame 103. The display module further comprises a reinforcing adhesive layer 4, which is positioned on the display side 100 of the display panel 1, and is bent from the display side 100 of the display panel 1 to the back side 101 thereof, wherein the reinforcing adhesive layer 4 covers the bending frame 103. When the first portion 31 is attached to the bending frame 103, a side plate surface of the first portion 31, which is close to the bending frame 103, is in contact with the reinforcing adhesive layer 4.
In some embodiments, as shown in fig. 6b, when the first portion 31 is attached to the bending frame 103, the first portion 31 is located between the bending frame 103 and the circuit element 2, and the first portion 31 is not in contact with the reinforcing adhesive layer 4, and the first portion 31 of the curled structure is pressed directly above the bending frame 103 and in contact with the reinforcing adhesive layer 4.
In some embodiments, an elastic member is disposed at the connection position of the first portion 31 and the second portion 32, so that the first portion 31 and the second portion 32 are elastically connected, for example, spring steel with elasticity is adopted at the connection position of the first portion 31 and the second portion 32, so that the first portion 31 can move towards the side of the bending frame 103 relative to the second portion 32 when the first portion 31 is pressed right above the bending frame 103, and finally, the first portion 31 is contacted with the reinforcing adhesive layer 4.
In some embodiments, a rotational member is provided at the connection position of the first portion 31 and the second portion 32 so that the first portion 31 and the second portion 32 can be rotated and connected with each other. If the connection position of the first portion 31 and the second portion 32 adopts a rotating shaft structure, the first portion 31 can rotate towards the bending frame 103 side relative to the second portion 32 when the first portion 31 is pressed right above the bending frame 103, and finally the first portion 31 is contacted with the reinforcing adhesive layer 4.
In some embodiments, other structural arrangements of the display modules in fig. 5a to 5c and fig. 6a to 6b are the same as those of the display modules in fig. 2a to 2d, and will not be described again.
In some embodiments, as shown in fig. 7a and 7b, unlike the display module in the above embodiments, the first portion 31 includes a plate of a frame structure, and the front projection of the first portion 31 on the display panel 1 covers a partial area of the bending border 103.
In some embodiments, the front projection of the first portion 31 on the display panel 1 covers at least an end region of the bending border 103 away from the end of the display area 102. By the arrangement, the first portion 31 can be ensured to form good physical protection on the bending frame 103, and the physical protection effect of the first portion 31 on the bending frame 103 is improved.
In some embodiments, as shown in fig. 7a and 7b, the second portion 32 comprises a plate of frame structure, and the orthographic projection of the second portion 32 on the display panel 1 does not overlap with the circuit element 2. I.e. the plates of the frame structure are located in the peripheral area surrounding the circuit elements 2 or in the area between the circuit elements 2.
In this embodiment, as shown in fig. 7a and 7b, the heat dissipation supporting structure 3 is built in a frame form in the area where the circuit element 2 is located and the area where the bending frame 103 is located. The heat dissipation support structure 3 adopts a frame-type structure, so that a great amount of materials and space can be saved, and the material cost and the preparation cost are further saved.
According to the display module provided by the embodiment of the invention, the heat dissipation supporting structure is arranged on one side of the circuit element and the bending frame, which is far away from the display panel, and the heat dissipation supporting structure adopts the metal plate or the injection molding plate coated with the metal coating, so that on one hand, the heat dissipation supporting structure can play a good role in heat conduction, heat dissipation and electromagnetic interference shielding on the circuit element, on the other hand, the heat dissipation supporting structure is hard in material and firm in appearance, and can form good physical protection on the circuit element and the bending frame, and on the other hand, compared with the heat dissipation film compounded by the multilayer materials in the related art, the heat dissipation supporting structure is single in material, does not need a die cutting process in the preparation process, is simple in preparation process, high in preparation yield, greatly reduced in material cost and preparation cost, and simple in structure.
The display module can be any product or component with a display function, such as an OLED panel, an OLED television, electronic paper, a mobile phone, a tablet personal computer, a notebook computer, a display, a notebook computer, a digital photo frame, a navigator and the like.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (16)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411186744.7A CN119095411A (en) | 2024-08-27 | 2024-08-27 | Display module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411186744.7A CN119095411A (en) | 2024-08-27 | 2024-08-27 | Display module |
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| CN119095411A true CN119095411A (en) | 2024-12-06 |
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| CN202411186744.7A Pending CN119095411A (en) | 2024-08-27 | 2024-08-27 | Display module |
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| CN (1) | CN119095411A (en) |
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