CN119093904A - A duplexer device based on inductive coupling - Google Patents
A duplexer device based on inductive coupling Download PDFInfo
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- CN119093904A CN119093904A CN202411183109.3A CN202411183109A CN119093904A CN 119093904 A CN119093904 A CN 119093904A CN 202411183109 A CN202411183109 A CN 202411183109A CN 119093904 A CN119093904 A CN 119093904A
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- 230000008878 coupling Effects 0.000 title claims abstract description 24
- 238000010168 coupling process Methods 0.000 title claims abstract description 24
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 24
- 230000001939 inductive effect Effects 0.000 title claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims abstract description 35
- 238000002955 isolation Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000010897 surface acoustic wave method Methods 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 238000003780 insertion Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000001629 suppression Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000001808 coupling effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
本发明公开了一种基于电感耦合的双工器装置，涉及半导体技术领域，包括基板、发送滤波器和接收滤波器，发送滤波器和接收滤波器设置于基板上，发送滤波器包括并联臂谐振器以及串联臂谐振器；并联臂谐振器包括谐振器P11、电感器LP1和谐振器组，谐振器组的一端连接在串联臂谐振器中相邻臂谐振器的连接节点上、另一端通过电感器LP1连接到谐振器P11的一端后接地，谐振器P11的另一端连接到串联臂谐振器中另外相邻臂谐振器的连接节点上，谐振器P11与电感器Lp1形成耦合回路，以提高发送滤波器和接收滤波器之间的隔离度；配置在栅格阵列封装电极的电感器Lp1会对发送用端子T2和接收用端子T3之间的插入损耗产生增益，从而影响到隔离度特性。
The invention discloses a duplexer device based on inductive coupling, which relates to the field of semiconductor technology and comprises a substrate, a transmission filter and a reception filter. The transmission filter and the reception filter are arranged on the substrate, and the transmission filter comprises a parallel arm resonator and a series arm resonator; the parallel arm resonator comprises a resonator P11, an inductor LP1 and a resonator group, one end of the resonator group is connected to a connection node of adjacent arm resonators in the series arm resonator, and the other end is connected to one end of the resonator P11 through the inductor LP1 and then grounded, the other end of the resonator P11 is connected to a connection node of another adjacent arm resonator in the series arm resonator, and the resonator P11 forms a coupling loop with the inductor Lp1 to improve the isolation between the transmission filter and the reception filter; the inductor Lp1 arranged on the grid array packaging electrode will generate a gain on the insertion loss between the transmission terminal T2 and the reception terminal T3, thereby affecting the isolation characteristic.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a duplexer device based on inductive coupling.
Background
In recent years, in communication devices such as smart phones, smart wear, and the like, widespread use of a duplexer has been achieved. For example, a duplexer separates a transmission signal and a reception signal according to frequency using a surface acoustic wave filter (SAW (Surface Acoustic Wave) filter) or the like. A duplexer is often used for mobile devices such as a smart phone, and thus miniaturization is also one of the demands.
On the other hand, when filters having two frequency bands different from each other are brought close to each other due to miniaturization, the influence of a signal passing through the filter on the other side may occur, and therefore, it is necessary to improve isolation characteristics between the filters while the entire device is miniaturized.
The existing scheme has the defects that an inductor device connected to the ground is connected to the outside of a filter to improve isolation, an external inductor outside the filter is needed to improve isolation of a duplexer by a parallel arm resonator of a transmitting end filter, electrode coupling is not formed inside the filter, isolation gain effect is not obvious, and an external SMT inductor or a substrate winding inductor is needed to be connected, so that miniaturization is difficult to implement or cost of the filter is increased.
Disclosure of Invention
Based on the technical problems in the background technology, the invention provides a duplexer device based on inductive coupling, which improves the isolation between a transmitting filter and a receiving filter.
The invention provides a duplexer device based on inductive coupling, which comprises a substrate, a transmitting filter and a receiving filter, wherein the transmitting filter and the receiving filter are arranged on the substrate, and the transmitting filter comprises a parallel arm resonator and a series arm resonator;
the parallel arm resonator includes a resonator P11, an inductor LP1, and a resonator group, one end of the resonator group is connected to a connection node of an adjacent arm resonator in the series arm resonator, the other end is connected to one end of the resonator P11 through the inductor LP1 and then grounded, the other end of the resonator P11 is connected to a connection node of another adjacent arm resonator in the series arm resonator, and the resonator P11 and the inductor LP1 form a coupling loop to improve isolation between the transmission filter and the reception filter.
Further, the substrate comprises a metal layer and a grid array packaging electrode for loop routing, the inductor LP1 is configured on a copper electrode of the grid array packaging electrode, and the metal layer is connected with the ground through the inductor LP 1.
Further, the metal layer includes a ground pattern Gp1 and a ground pattern Gp2, and both ends of the inductor LP1 are connected to the ground pattern Gp1 and the ground pattern Gp2, respectively, to implement grounding.
Further, the resonator group includes a resonator P12, a resonator P13, and a resonator P14, and the series arm resonator includes a resonator S11, a resonator S12, a resonator S13, and a resonator S14;
After the resonator S11, the resonator S12, the resonator S13, and the resonator S14 are sequentially connected in series, one end of the resonator S11 is connected to the antenna terminal T1 via the second inductor Lant, and one end of the resonator S14 is connected to the transmission terminal T2;
one end of the resonator P11 is connected to the connection node of the resonator S11 and the resonator S12, the other end is connected to the ground pattern Gp1, one end of the resonator P12 is connected to the connection node of the resonator S12 and the resonator S13, the other end is connected to the ground pattern Gp2, one end of the resonator P13 is connected to the connection node of the resonator S13 and the resonator S14, the other end is connected to the ground pattern Gp2, one end of the resonator P14 is connected to the connection node of the resonator S14 and the transmission terminal T2, and the other end is connected to the ground pattern Gp2.
Further, the receiving filter includes a surface acoustic wave resonator S15, a surface acoustic wave resonator S16, an elastic wave filter, and an elastic wave filter;
The acoustic wave filter and the one end of the acoustic wave filter after being arranged in parallel are connected to one end of the acoustic surface wave resonator S15, the other end after being connected in parallel is connected to one end of the acoustic surface wave resonator S16, the other end of the acoustic surface wave resonator S15 is connected to the antenna terminal T1, and the other end of the acoustic surface wave resonator S16 is connected to the receiving terminal T3.
Further, the receiving filter further includes a resonator P15 and a resonator P16, wherein one end of the resonator P15 is connected to a connection node between the surface acoustic wave resonator S15 and the elastic wave filter, and the other end is grounded, and one end of the resonator P16 is connected to a connection node between the surface acoustic wave resonator S16 and the receiving terminal T3, and the other end is grounded.
The duplexer device based on the inductive coupling has the advantages that the inductor Lp1 arranged on the grid array packaging electrode can generate gain on insertion loss between the transmitting terminal T2 and the receiving terminal T3 so as to influence isolation property, and after the optimal inductance value of the inductor Lp is determined, the metal environment of the grid array packaging electrode is adjusted so as to improve coupling attenuation property outside a passband, thereby improving isolation property.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic layout of a grid array package electrode;
FIG. 3 is a graph of isolation characteristics without inductor coupling;
fig. 4 is an isolation characteristic diagram with an inductor coupling, which is the coupling between the inductor Lp1 and the resonator P11;
FIG. 5 is a gain diagram with suppression and isolation by inductor coupling;
wherein, 10-antenna, 20-substrate, 110-transmit filter, 120-receive filter, 121-elastic wave filter, 1232 elastic wave filter.
Detailed Description
In the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit or scope of the invention, which is therefore not limited to the specific embodiments disclosed below.
In the present embodiment, in order to improve the isolation between the transmission filter 110 and the reception filter 120, the transmission filter 110 has a first passband (the present embodiment is set to 703 to 733 mhz), the reception filter 120 has a second passband (the present embodiment is set to 758 to 788 mhz), and the transmission filter 110 is a ladder filter connected between the antenna terminal T1 and the transmission terminal T2, and the transmission signal received at the transmission terminal T2 is filtered by the ladder filter and outputted from the antenna terminal T1. The transmission filter unit 110 includes parallel arm resonators P11 to P14 and series arm resonators S11 to S14 connected in series between the antenna terminal T1 and the transmission terminal T2. The reception filter 120 is a filter connected between the reception terminal T3 and the antenna terminal T1, and the reception filter 120 includes a surface acoustic wave resonator S15, a resonator P15, longitudinally coupled resonator type acoustic wave filters 121 and 122, and another surface acoustic wave resonator S16 and a resonator P16, thereby forming a reception filter 120. The method comprises the following steps:
As shown in fig. 1 to 5, the present invention provides a duplexer device based on inductive coupling, which comprises a substrate 20, a transmitting filter 110 and a receiving filter 120, wherein the transmitting filter 110 and the receiving filter 120 are disposed on the substrate 20, the transmitting filter 110 comprises a parallel-arm resonator and a series-arm resonator, the parallel-arm resonator comprises a resonator P11, an inductor LP1 and a resonator group, one end of the resonator group is connected to a connection node of adjacent arm resonators in the series-arm resonator, the other end of the resonator group is connected to one end of the resonator P11 through the inductor LP1 and then is grounded, the other end of the resonator P11 is connected to a connection node of other adjacent arm resonators in the series-arm resonator, and the resonator P11 and the inductor LP1 form a coupling loop so as to improve isolation between the transmitting filter 110 and the receiving filter 120.
The substrate comprises a metal layer and a grid array packaging electrode for loop routing, the inductor LP1 is configured on a copper electrode of the grid array packaging electrode, and the metal layer is connected with the ground through the inductor LP 1. The antenna terminal T1, the transmission terminal T2, and the reception terminal T3 are provided on copper electrodes of the land grid array package layer, and the other ground electrodes are provided on the other copper electrodes of the land grid array package layer. The inductor Lp1 disposed in the land grid array package electrode generates a gain in insertion loss between the transmission terminal T2 and the reception terminal T3, thereby affecting the isolation characteristic. Therefore, after the optimal inductance value of the inductor Lp is determined, the metal environment of the grid array package electrode is adjusted, so that the coupling attenuation characteristic outside the pass band can be improved, and the isolation characteristic is improved, wherein the metal environment of the grid array package electrode specifically refers to the inductor Lp and other grid array electrodes connected with the GP1 and the GP2 shown in FIG. 2, and the adjustment modes are the winding mode, the winding length, the width of the electrodes and the like of the inductor Lp.
Preferably, the metal layer includes a ground pattern Gp1 and a ground pattern Gp2, and both ends of the inductor LP1 are connected to the ground pattern Gp1 and the ground pattern Gp2, respectively, to implement grounding. It will be appreciated that grid array packaging is a packaging technique that places chips or components in a grid array and connects the chips through metal connectors, which provides higher connection density, reduces signal propagation delay, and improves overall reliability of the system. In the present embodiment, as shown in fig. 2, the wiring of the grid array package electrode is composed of a plurality of metal connectors (metal layers) and the inductor Lp1, and the present embodiment is not limited to the wiring method shown in fig. 2, and may be configured in other ways as long as the wiring can be inductively coupled with the input side resonator P11 in the inductor Lp 1.
In the present embodiment, as a preferable mode, the resonator group includes a resonator P12, a resonator P13, and a resonator P14, the series arm resonator includes a resonator S11, a resonator S12, a resonator S13, and a resonator S14, one end of the resonator S11 is connected to the antenna terminal T1 via the second inductor Lant after the resonator S11, the resonator S12, the resonator S13, and the resonator S14 are sequentially connected in series, one end of the resonator S14 is connected to the transmission terminal T2, one end of the resonator P11 is connected to the connection node of the resonator S11 and the resonator S12, the other end is connected to the ground pattern Gp1, one end of the resonator P12 is connected to the connection node of the resonator S12 and the resonator S13, the other end is connected to the ground pattern Gp2, one end of the resonator P13 is connected to the connection node of the resonator S13 and the other end is connected to the ground pattern Gp2, and one end of the resonator P14 is connected to the connection node of the transmission terminal T2.
The parallel arm resonator of the transmission filter 110 is connected to the ground by the ground pattern GP1 and the ground pattern GP2 of the electrodes encapsulated in the grid array. The ground pattern Gp1 and the ground pattern Gp2 in the land grid array package electrode are connected to the ground through the inductor pattern Lp 1. Thus, from the antenna port T1, the resonator P11 of the transmission filter 110 is connected to the ground pattern Gp1 and directly connected to the ground. The resonator P12, the resonator P13, and the resonator P14 are connected to the ground pattern Gp2, respectively, and are connected to the inductor pattern Gp1 through the inductor Lp1, and then are grounded.
Accordingly, the inductor Lp1 and the resonator P11 form a coupling loop, so that the grounding effect of the resonators P12, P13 and P14 is enhanced, and a gain is generated for the transmission loss between the transmission terminal T2 and the reception terminal T3, so that the isolation characteristics between filters can be improved.
In the present embodiment, the reception filter 120 preferably functions as a reception filter capable of receiving a reception signal in the frequency Band (Band 1) used by the transmission filter 110. The reception filter 120 includes a surface acoustic wave resonator S15, a surface acoustic wave resonator S16, a surface acoustic wave filter 121, and a surface acoustic wave filter 122, one end of the surface acoustic wave filter 121 and one end of the surface acoustic wave filter 122 which are disposed in parallel are connected to one end of the surface acoustic wave resonator S15, the other end of the surface acoustic wave filter after being connected in parallel to one end of the surface acoustic wave resonator S16, the other end of the surface acoustic wave resonator S15 is connected to an antenna terminal T1, the antenna terminal T1 is connected to the antenna 10, the other end of the surface acoustic wave resonator S16 is connected to a reception terminal T3, the reception filter 120 further includes a resonator P15 and a resonator P16, one end of the resonator P15 is connected to a connection node between the surface acoustic wave resonator S15 and the surface acoustic wave filter 121, the other end is grounded, and one end of the resonator P16 is connected to a connection node between the surface acoustic wave resonator S16 and the reception terminal T3, and the other end is grounded.
The number and connection of the series-arm resonators and the parallel-arm resonators in the transmission filter 110 are not limited to those shown in fig. 1, and may be appropriately selected according to the passband used.
In the duplexer device of the present embodiment, experiments were performed, and fig. 3 and 4 are compared, and by the coupling action between the resonator P11 and the inductor Lp1, suppression in the vicinity of 758 to 788mhz, which is the suppression band of the shared receiving filter 110, is improved. That is, when the inductor Lp1 is present, there is a significant difference in the isolation between the transmission filter 110 and the reception filter 120. This difference results from the electromagnetic coupling between the inductor Lp1 and the resonator P11, so that the isolation between the transmitting port T2 and the receiving port T3 results from not only the suppression of the transmitting filter in the receiving filter band, but also a part of the signal attenuation results from the electromagnetic action of the inductor Lp1, and thus the present embodiment can improve the isolation characteristic of the receiving side passband (Rx band) by inductively coupling the resonator P11 on the antenna end T1 side with the polarized inductor Lp 1. Meanwhile, as is clear from fig. 5, when there is an inductor Lp1, the electromagnetic coupling between the inductor Lp1 and the resonator P11 produces a suppressed and isolated gain. Therefore, the present embodiment can exert a coupling effect between the inductor and the electrode, so that the transmission filter 110 has a gain effect at the suppression end of the passband of the reception filter 120, and the insertion loss between the transmission terminal T2 and the reception terminal T3 is greatly reduced.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411183109.3A CN119093904A (en) | 2024-08-27 | 2024-08-27 | A duplexer device based on inductive coupling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411183109.3A CN119093904A (en) | 2024-08-27 | 2024-08-27 | A duplexer device based on inductive coupling |
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| Publication Number | Publication Date |
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| CN119093904A true CN119093904A (en) | 2024-12-06 |
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| CN202411183109.3A Pending CN119093904A (en) | 2024-08-27 | 2024-08-27 | A duplexer device based on inductive coupling |
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| CN (1) | CN119093904A (en) |
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- 2024-08-27 CN CN202411183109.3A patent/CN119093904A/en active Pending
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