CN119092556A - Photosensitive component, camera module, preparation method thereof, and electronic device - Google Patents
Photosensitive component, camera module, preparation method thereof, and electronic device Download PDFInfo
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- CN119092556A CN119092556A CN202411563337.3A CN202411563337A CN119092556A CN 119092556 A CN119092556 A CN 119092556A CN 202411563337 A CN202411563337 A CN 202411563337A CN 119092556 A CN119092556 A CN 119092556A
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- circuit board
- lens
- photosensitive
- supporting
- photosensitive component
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 230000008093 supporting effect Effects 0.000 claims abstract description 161
- 239000002184 metal Substances 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
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- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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Abstract
The invention relates to a photosensitive assembly, a camera module, a preparation method of the camera module and electronic equipment, which can provide a mounting surface with high flatness, so that the optical axis of an optical lens is not easy to incline relative to the photosensitive surface of a photosensitive chip, and the imaging quality is improved. The photosensitive assembly comprises a circuit board, a photosensitive chip and a metal substrate, wherein the photosensitive chip is connected to the circuit board in a communication mode, the metal substrate comprises a first supporting part and a second supporting part extending upwards from the first supporting part, the first supporting part is arranged on the lower surface of the circuit board, the second supporting part is positioned on the outer side of the photosensitive chip, a lens mounting surface is arranged on the top of the second supporting part, and the lens mounting surface is higher than the upper surface of the circuit board and is used for mounting a lens module.
Description
Technical Field
The invention relates to the technical field of imaging, in particular to a photosensitive assembly, a camera module, a preparation method of the camera module and electronic equipment.
Background
With the progress and development of technology, electronic devices with camera functions are increasingly moving toward high performance and light and thin, and camera modules are one of the core configurations of electronic products, which necessarily requires adjustment of suitability in terms of performance and size, that is, in the process of the technological innovation, each component in the camera module needs to make corresponding changes in terms of performance and size.
For example, electronic devices such as mobile phones have higher and higher requirements on imaging quality of the camera module, and higher integration of functions of the camera module. In the prior art, the camera module generally comprises a lens module and a photosensitive assembly which are assembled together, wherein one assembly mode is to mount the lens module on a molding base or a small lens frame of the photosensitive assembly, but the shoulder height of the module is increased, and the other assembly mode is to directly mount the lens module on the top surface of a circuit board of the photosensitive assembly so as to reduce the shoulder height of the module.
However, since the top layer of the circuit board is usually paved with ink, and the coating amount of the ink is in tolerance when the ink is coated, and the circuit board is deformed and/or warped when the adhesive is cured and shrunk, so that the top surface of the circuit board is uneven, when the lens module is attached to the top surface of the circuit board, the uneven top surface of the circuit board can cause the lens module to be attached to be askew, that is, the optical axis of the optical lens in the lens module is inclined relative to the photosensitive surface of the photosensitive chip in the photosensitive assembly, thereby affecting the imaging quality.
Disclosure of Invention
The invention provides a photosensitive assembly, an imaging module, a preparation method thereof and electronic equipment, which can provide a mounting surface with high flatness, so that the optical axis of an optical lens is not easy to incline relative to the photosensitive surface of a photosensitive chip, and the imaging quality is improved.
To achieve at least one of the above or other advantages and objects of the invention, there is provided a photosensitive assembly including:
A circuit board;
a photosensitive chip communicably connected to the circuit board, and
The metal substrate comprises a first supporting part and a second supporting part extending upwards from the first supporting part, wherein the first supporting part is arranged on the lower surface of the circuit board, the second supporting part is positioned on the outer side of the photosensitive chip, a lens mounting surface is arranged on the top of the second supporting part, and the lens mounting surface is higher than the upper surface of the circuit board and is used for mounting a lens module.
The photosensitive assembly provided by the application not only can strengthen the circuit board through the first supporting part of the metal substrate to reduce deformation or warping of the circuit board, but also can provide a lens mounting surface with higher flatness through the second supporting part of the metal substrate for mounting the lens module without being influenced by the deformation or warping of the circuit board, so that the lens optical axis in the lens module is not easy to incline relative to the photosensitive surface of the photosensitive chip, thereby improving the imaging quality and meeting the high-performance requirement of the camera shooting module.
According to one embodiment of the application, the circuit board comprises a circuit board main body and a connector electrically connected with the circuit board main body, wherein the connector is positioned at a first side edge part of the circuit board main body, and the second supporting part is away from the first side edge part.
So set up, because the said connector is usually used for connecting with external power supply structure, all circuits on the said circuit board need to be led out to the connector from the first side portion with the circuit, the application is through keeping the said second support portion clear of the said first side portion, in order to reserve more space to lay the circuit on the said circuit board main body.
According to an embodiment of the present application, the circuit board main body has a second side portion and a third side portion at both ends of the first side portion, respectively, the second side portion is provided with an electrical connection structure coupled with the photosensitive chip, and the connector is arranged adjacent to the second side portion in an extending direction of the first side portion.
By arranging the connector at the side adjacent to the electric connection structure, the bending of the circuit can be reduced, so that the wiring length is shortened, and the circuit design of the circuit board is simplified.
According to one embodiment of the application, the second supporting part comprises a second sub-part protruding from the first supporting part, and the second sub-part corresponds to the third side edge part of the circuit board main body.
In this way, since the third side portion is farthest from the connector, the electrical connection structure of the third side portion coupled to the photosensitive chip can be reduced, and the electrical connection structure of the circuit board main body coupled to the photosensitive chip can be allowed to be disposed more on the other side portions of the circuit board main body than the third side portion, so that the bending of the circuit can be further reduced, and the wiring length can be shortened.
According to one embodiment of the application, the second supporting part further comprises a first sub-part protruding from the first supporting part, and the first sub-part corresponds to the second side edge part of the circuit board main body.
By the arrangement, the second supporting parts can be distributed more dispersedly, so that the supporting effect of the second supporting parts on the lens module is balanced, and the lens module is not easy to skew an optical axis due to unbalanced supporting force.
According to an embodiment of the application, the number of first sub-portions is smaller than the number of second sub-portions, and/or the cross-sectional area of the first sub-portions is smaller than the cross-sectional area of the second sub-portions.
By the arrangement, the differential design of the second supporting part on the second side edge part and the third side edge part can be realized, and more circuit design space can be reserved on the second side edge part.
According to one embodiment of the application, the first and second sub-portions are triangularly distributed over the first support portion.
By the arrangement, the lens module supporting device and the lens module supporting method can enable the supporting effect of the second supporting part on the lens module to be more balanced and stable, and prevent the lens module from being inclined.
According to one embodiment of the application, the number of the second sub-portions is at least two, and in the extension direction of the third side portion, the cross-sectional area of the second sub-portion adjacent to the first side portion is smaller than the cross-sectional area of the second sub-portion distant from the first side portion.
According to one embodiment of the application, the first side portion corresponds to one short side of the photosensitive chip, and the second side portion and the third side portion correspond to two long sides of the photosensitive chip, respectively.
By the arrangement, the photosensitive assembly can enable the circuit arrangement design of the circuit board to be more excellent.
According to one embodiment of the application, at least two second supporting parts are arranged at intervals, wherein at least one second supporting part corresponds to the corner of the circuit board main body.
By the arrangement, the space of the circuit board main body at the corner is larger than that at the side edge, so that the corner of the circuit board main body is easier to have enough space for arranging the second supporting part.
According to one embodiment of the application, the circuit board is provided with a through hole, and the second supporting part penetrates through the through hole from bottom to top.
So set up, the metal base plate need not outwards stretch out the circuit board main part just can provide the higher lens installation face of roughness for this camera lens module, helps reducing the circumference size of module, satisfies the miniaturized demand of camera module.
According to one embodiment of the application, the cross-sectional area of the through hole takes a value between 5.76 and 9 times the cross-sectional area of the second support.
Through the arrangement, the alignment difficulty of the circuit board and the metal substrate in the transverse direction can be increased due to the design of the through holes, but the alignment difficulty between the second supporting part and the through holes can be reduced by arranging the dimensional proportion relation between the cross section area of the through holes and the cross section area of the second supporting part, so that the assembly efficiency is improved.
According to one embodiment of the present application, the second supporting portion is located at the periphery of the circuit board.
According to an embodiment of the present application, the second supporting portion is a columnar boss or a bar-shaped boss extending along an edge of the circuit board.
By the arrangement, the surface area of the lens mounting surface can be reduced by the design of the columnar boss, and the lens mounting surface with higher flatness can be processed more easily.
According to one embodiment of the present application, the circuit board further has a receiving hole corresponding to the photosensitive chip, and the photosensitive chip is attached to the metal substrate through the receiving hole.
The photosensitive assembly provided by the application can overlap the space between the photosensitive chip and the circuit board in the height direction, so that the photosensitive assembly can be thinned, more importantly, the mounting surfaces of the lens module and the photosensitive chip are provided by the metal substrate, and compared with the mounting of the lens module and the photosensitive chip on different components respectively, the assembly inclination caused by the tolerance of the different components during processing and assembly can be reduced, and the assembly quality of the camera module is improved.
According to one embodiment of the application, the metal substrate further comprises a third supporting part extending upwards from the first supporting part, a chip mounting surface positioned in the accommodating hole is arranged at the top of the third supporting part, and the photosensitive chip is attached to the chip mounting surface.
By extending the third supporting portion upwards from the first supporting portion, the third supporting portion can be thickened, and the photosensitive chip is not easy to deform.
According to another aspect of the present application, there is further provided an image capturing module including:
a photosensitive assembly according to any of the above, and
And the lens module is arranged on the second supporting part of the metal substrate in the photosensitive assembly.
According to one embodiment of the application, the lens module comprises a lens base attached to the second supporting part and an optical lens arranged on the lens base and positioned in a photosensitive path of the photosensitive assembly, wherein the lens base is provided with a convex part matched with the second supporting part, and the lower surface of the convex part is fixedly adhered to the upper surface of the second supporting part.
According to one embodiment of the application, the lens module comprises a lens base which is fixedly adhered to the second supporting part and an optical lens which is arranged on the lens base and is positioned in a photosensitive path of the photosensitive assembly, wherein the lens base is provided with a groove matched with the second supporting part, and the second supporting parts are inserted into the groove and are fixedly adhered to each other.
The transverse relative position between the lens module and the photosensitive component can be limited by the insertion fit of the groove and the second supporting part, so that the assembly efficiency is improved on the premise of ensuring the assembly precision.
According to an embodiment of the application, the gap between the upper surface of the second support portion and the bottom of the groove is smaller than the gap between the side surface of the second support portion and the wall of the groove.
With the arrangement, the camera module can reduce the adhesive between the bottom of the groove and the upper surface of the second supporting part as much as possible, thereby being beneficial to reducing the shrinkage degree of the adhesive after curing and preventing the lens module from tilting due to the anisotropy of the shrinkage degree of the adhesive.
According to another aspect of the present application, there is further provided an electronic apparatus including:
An apparatus body, and
The camera module of any one of the above, wherein the camera module is assembled to the device body.
According to another aspect of the present application, the present application further provides a method for manufacturing an image capturing module, including the steps of:
Providing a photosensitive assembly, wherein the photosensitive assembly comprises a circuit board and a metal substrate stacked below the circuit board, the circuit board is provided with a containing hole and a first area which is positioned at the periphery of the containing hole and provided with a through hole, the metal substrate comprises a first supporting part corresponding to the containing hole and a second supporting part which extends upwards from the first supporting part and passes through the through hole, and the top surface of the second supporting part is higher than the upper surface of the circuit board to be used as a lens mounting surface;
Filling an adhesive in a gap between the hole wall of the through hole and the peripheral wall of the second supporting part and curing the adhesive so as to bond and fix the circuit board to the metal substrate;
providing a lens module having a second region corresponding to the first region of the circuit board, and
And coating an adhesive on the first area, the second area and/or the lens mounting surface and curing to adhere and fix the lens module to the photosensitive assembly.
According to another aspect of the present application, the present application further provides a method for manufacturing an image capturing module, including the steps of:
Providing a photosensitive assembly and a lens module, wherein the photosensitive assembly comprises a circuit board and a metal substrate stacked under the circuit board, the circuit board is provided with a containing hole and a first area which is positioned at the periphery of the containing hole and provided with a through hole, the metal substrate comprises a first supporting part corresponding to the containing hole and a second supporting part which extends upwards from the first supporting part and passes through the through hole, the top surface of the second supporting part is higher than the upper surface of the circuit board to be used as a lens mounting surface, the lens module is provided with a second area corresponding to the first area of the circuit board, and
And applying and curing an adhesive to gaps among the first area, the second area, the lens mounting surface and/or the hole wall of the through hole and the peripheral wall of the second supporting part so as to adhesively fix the lens module to the photosensitive assembly.
Drawings
Fig. 1 is a schematic perspective view of an image capturing module according to an embodiment of the present invention;
fig. 2 shows an exploded view of the camera module according to the above embodiment of the present invention;
fig. 3 shows a schematic cross-sectional view of an image capturing module according to the above embodiment of the present invention;
fig. 4 shows an example of a photosensitive member in the image pickup module according to the above-described embodiment of the present invention;
FIG. 5 illustrates an exploded view of a photosensitive assembly according to the above-described examples of the present invention;
Fig. 6 shows a modified example of the image pickup module according to the above embodiment of the present invention;
FIG. 7 shows a first variant of the photosensitive assembly in the camera module according to the above-described embodiment of the present invention;
FIG. 8 shows a second variant of the photosensitive assembly in the camera module according to the above-described embodiment of the present invention;
Fig. 9 shows an application example of the photosensitive member in the image pickup module according to the above-described embodiment of the present application;
Fig. 10 shows one example of the states of the metal substrate and the wiring board in the image pickup module according to the above embodiment of the present application;
fig. 11 shows another state example of the metal substrate and the wiring board in the image pickup module according to the above embodiment of the present application;
FIG. 12 is a flow chart of a method of manufacturing an image capturing module according to an embodiment of the present application;
fig. 13 shows a modified example of the manufacturing method of the image pickup module according to the above embodiment of the present application.
Description of main reference numerals:
1. The camera module comprises a camera module body, a 10, a photosensitive assembly, 11, a circuit board, 1101, a through hole, 1102, a containing hole, 111, a circuit board main body, 1111, a first side part, 1112, a second side part, 1113, a third side part, 1114, a fourth side part, 112, a connector, 12, a photosensitive chip, 13, a metal substrate, 131, a first supporting part, 132, a second supporting part, 1320, a lens mounting surface, 1321, a first sub-part, 1322, a second sub-part, 133, a third supporting part, 1330, a chip mounting surface, 14, a molded body, 15, a filter, 20, a lens module, 21, a lens base, 211, a convex part, 212, a groove, 22 and an optical lens.
The foregoing general description of the invention will be described in further detail with reference to the drawings and detailed description.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It is noted that when an element is referred to as being "mounted to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.
Considering that the conventional camera module generally mounts the lens module on the circuit board or the color filter bracket, the flatness of the circuit board or the color filter bracket is insufficient, so that the optical axis of the optical lens in the lens module is inclined relative to the photosensitive surface of the photosensitive chip in the photosensitive component, thereby affecting the imaging quality. Therefore, the application provides a photosensitive assembly which can provide a mounting surface with high flatness for a lens module, so that the optical axis of an optical lens is not easy to incline relative to the photosensitive surface of a photosensitive chip, and the imaging quality is improved.
Specifically, referring to fig. 1 to 11, an embodiment of the present application further provides an electronic device, which may include a device body and an image capturing module 1 mounted to the device body, so as to collect image information for the device body through the image capturing module 1. It is to be understood that the electronic device referred to in the present application may be implemented as, but is not limited to, a smart phone, a smart watch, a tablet or notebook, etc.
More specifically, as shown in fig. 1 to 5, the image capturing module 1 may include a photosensitive assembly 10 and a lens module 20. The photosensitive assembly 10 comprises a circuit board 11, a photosensitive chip 12 and a metal substrate 13, wherein the photosensitive chip 12 is communicatively connected to the circuit board 11, the metal substrate 13 comprises a first supporting part 131 and a second supporting part 132 extending upwards from the first supporting part 131, the first supporting part 131 is arranged on the lower surface of the circuit board 11, the second supporting part 132 is positioned on the outer side of the photosensitive chip 12, a lens mounting surface 1320 is arranged on the top of the second supporting part 132, and the lens mounting surface 1320 is higher than the upper surface of the circuit board 11 and is used for mounting the lens module 20. In other words, the lens module 20 is mounted on the second supporting portion 132 of the metal substrate 13 in the photosensitive assembly 10, so that the lens module 20 is located in the photosensitive path of the photosensitive assembly 10, and it is ensured that the external light passes through the lens module 20 and is then received by the photosensitive chip 12 for imaging.
It should be noted that, as shown in fig. 2 and 3, the photosensitive assembly 10 of the present application not only can reinforce the circuit board 11 through the first supporting portion 131 of the metal substrate 13 to reduce deformation or warpage of the circuit board 11, but also can provide the lens mounting surface 1320 with high flatness through the second supporting portion 132 of the metal substrate 13 to mount the lens module 20 without being affected by deformation or warpage of the circuit board 11, so as to ensure that the lens optical axis in the lens module 20 is not easily inclined relative to the photosensitive surface of the photosensitive chip 12, thereby improving the imaging quality, so as to meet the high performance requirement of the camera module 1.
In other words, since the conventional circuit board has a tolerance in terms of the coating amount of the surface ink during coating, the warpage of the metal substrate 13 such as a steel plate is greater than 30um, and the warpage of the provided lens mounting surface 1320 is smaller than 20um, the metal substrate 13 of the present application is used as a supporting base of the circuit board 11 to reinforce the circuit board 11 and is used as a mounting base of the lens module 20 to provide the lens mounting surface 1320 with high flatness, so that the lens optical axis of the lens module 20 is substantially perpendicular to the light sensitive surface of the light sensitive chip 12, which is convenient for reducing the assembly difficulty and realizing efficient production.
As shown in fig. 4 and 5, the circuit board 11 may include a circuit board body 111 and a connector 112 electrically connected to the circuit board body 111, wherein the connector 112 is located at a first side 1111 of the circuit board body 111, and the second support 132 is away from the first side 1111. Thus, although more circuits are generally required to be disposed on the first side 1111 of the circuit board main body 111 corresponding to the connector 112, the second supporting portion 132 of the present application can avoid the first side 1111, so as to reserve more space on the first side 1111 of the circuit board main body 111 to dispose the circuits, thereby reducing the difficulty of circuit layout. It is understood that the circuit board body 111 mentioned in the present application may be implemented as, but not limited to, a hard board such as a PCB board or a ceramic board or a flexible board such as an FPC board, and the connector 112 mentioned in the present application may be communicatively connected to the circuit board body through, but not limited to, the flexible board.
Optionally, as shown in fig. 4 and 5, the circuit board main body 111 further has a second side portion 1112 and a third side portion 1113 arranged opposite to each other, and a fourth side portion 1114 opposite to the first side portion 1111, the second side portion 1112 and the third side portion 1113 respectively engaging with both ends of the first side portion 1111, and likewise, the second side portion 1112 and the third side portion 1113 respectively engaging with both ends of the fourth side portion 1114. In addition, the photosensitive chip 12 of the present application is generally rectangular, the first side 1111 corresponds to one short side of the photosensitive chip 12, such that the connector 112 is located outside the short side of the photosensitive chip 12 to be electrically connected to an external device, and the second side 1112 and the third side 1113 correspond to two short sides of the photosensitive chip 12, respectively.
In other words, the circuit board main body 111 has a second side portion 1112 and a third side portion 1113 respectively located at both ends of the first side portion 1111, the second side portion 1112 is provided with an electrical connection structure coupled with the photosensitive chip 12, and the connector 112 is disposed adjacent to the second side portion 1112 in the extending direction of the first side portion 1111. It will be appreciated that the photosensitive chip 12 of the present application is generally rectangular, and the long side and the short side thereof correspond to the length and the width of the camera module 1, respectively, while the first side 1111 provided with the connector 112 corresponds to the short side of the photosensitive chip 12, so as to avoid the increase of the width of the camera module 1, ensure that the camera module 1 has a smaller width, and thus realize the narrow width design of the camera module. Of course, in other examples of the present application, the first side 1111 may also correspond to a long side of the photosensitive chip 12, which will not be described in detail herein.
It should be noted that, in the present application, the "the photo-sensing chip 12 is communicatively connected to the circuit board 11" is to electrically connect the photo-sensing chip 12 and the circuit board 11. The application is not limited to the electrical connection mode between the photosensitive chip 12 and the circuit board 11, and can be wire bonding or flip-chip bonding. Illustratively, as shown in fig. 9, the second side portion 1112 is provided with a first pad, and the long side of the photosensitive chip 12 corresponding to the second side portion 1112 is provided with a second pad, and the first pad and the second pad are electrically connected by a gold wire. In addition, the connector 112 is disposed adjacent to the second side edge portion 1112 in the extending direction of the first side edge portion 1111, that is, the connector 112 is disposed offset to one side in the width direction of the photosensitive member, so that the bending of the circuit can be reduced, the wiring length can be shortened, and the circuit design of the circuit board can be simplified.
In addition, as shown in fig. 9, the present application may provide an electrical connection structure connected to the photosensitive chip 12 on the other side portions of the circuit board main body 111 except the second side portion 1112 according to actual requirements. The first side 1111 of the circuit board main body 111 is provided with an optimal electrical connection structure to be connected to the photosensitive chip 12, and then the second side 1112, the fourth side 1114, and finally the third side 1113, in view of reducing circuit bending and shortening the wiring length. In one embodiment of the present application, the first side 1111, the second side 1112 and the fourth side 1114 of the main body of the circuit board 11 are respectively provided with an electrical connection structure connected to the photosensitive chip 12, and the third side 1113 of the main body 111 of the circuit board is provided with a surface mount component such as a capacitor, a resistor, etc., so that more wiring space can be reserved for the first side 1111, the second side 1112 and the fourth side 1114 of the main body 111 of the circuit board, so that the electronic design of the circuit board 11 is more reasonable and the performance of the photosensitive assembly is improved.
Alternatively, as shown in fig. 2 to 5, the second supporting portion 132 includes a first sub-portion 1321 and a second sub-portion 1322 protruding from the first supporting portion 131 at intervals, the first sub-portion 1321 corresponds to the second side portion 1112 of the circuit board main body 111, and the second sub-portion 1322 corresponds to the third side portion 1113 of the circuit board main body 111, so that the second supporting portion 132 can well avoid the connector 112, so that more space layout circuits are reserved at the first side portion 1111 of the circuit board main body 111.
Alternatively, as shown in fig. 4 and 5, the second side portion 1112 and the third side portion 1113 respectively correspond to two long sides of the photosensitive chip 12, such that the first sub-portion 1321 and the second sub-portion 1322 are respectively located outside the two long sides of the photosensitive chip 12, not only can avoid the connector 112, but also can support the lens module 20 from opposite sides of the photosensitive chip 12, such that the lens module 20 spans the photosensitive chip 12 to be stably supported, and the inclination of the optical axis of the lens module 20 due to uneven stress is reduced. It is understood that, in other examples of the present application, the second supporting portion 132 of the present application may further include a third sub-portion disposed at a position corresponding to the other short side of the photosensitive chip 12, that is, the third sub-portion corresponds to the fourth side portion 1114 of the circuit board main body 111, so as to further improve the supporting stability of the lens module 20.
Optionally, as shown in fig. 4 and 5, the number of the first sub-portions 1321 is less than the number of the second sub-portions 1322. In this way, since the connector 112 is disposed on the first side portion 1111 and adjacent to the second side portion 1112, the present application provides pads by controlling the number of the first sub-portions 1321 to be smaller than the number of the second sub-portions 1322 so that the second side portion 1112 of the circuit board main body 111 reserves more space, and electronic components such as a capacitor and a resistor are surface mount components to be mounted to the pads so that the second side portion 1112 has more circuits so as to shorten the overall wiring path of the circuit board 11. It is understood that in other embodiments, the cross-sectional area of the first sub-portion 1321 may be smaller than the cross-sectional area of the second sub-portion 1322, which is not described in detail herein.
Alternatively, as shown in fig. 3 to 5, the first sub-portion 1321 and the second sub-portion 1322 are each implemented as a columnar boss. It will be appreciated that since the smaller the upper surface area of the boss, the easier it is for the surface to be flattened, the columnar boss referred to in the present application generally has a smaller upper surface area, and can provide a lens mounting surface 1320 with higher flatness so as to ensure that the lens optical axis in the lens module 20 does not tilt with respect to the light sensing surface of the light sensing chip 12.
Preferably, as shown in fig. 5, the first sub-portion 1321 and the second sub-portion 1322 are arranged in a triangular shape on the first supporting portion 131, that is, the second side portion 1112 of the circuit board main body 111 is arranged with one cylindrical boss, and the third side portion 1113 of the circuit board main body 111 is arranged with two cylindrical bosses at intervals, so that the second supporting portion 132 can apply a more uniform supporting force to the lens module 20 to prevent the lens module 20 from being skewed.
More preferably, as shown in fig. 2, 5 and 9, the first sub-portion 1321 is located in the middle region of the second side portion 1112, and two second sub-portions 1322 are located in the two end regions of the third side portion 1113, so that three columnar bosses can be relatively dispersed, ensuring that the plurality of lens mounting surfaces 1320 can be relatively uniformly distributed, and that the geometric centers of the plurality of bosses are located closer to the center of gravity of the lens module 20 in the lateral direction, so as to better support the lens module 20 and prevent the lens module 20 from being skewed. It is understood that the first sub-portion 1321 may also be located on the second side portion 1112 at an end region remote from the connector 112 or the first side portion 1111. In addition, as shown in fig. 9, the second sub-portion 1322 is disposed at the end area of the third side portion 1113, that is, the second supporting portion 132 corresponds to the corner of the circuit board main body 111, because the space at the corner of the circuit board main body 111 is larger than the space at the side, so that it is easier to have enough space at the corner of the circuit board main body 111 to arrange the second supporting portion 132.
It is noted that the cross-sectional area of the second sub-portion 1322 at an end region of the third side portion 1113 that is remote from the first side portion 1111 may be larger than the cross-sectional area of the second sub-portion 1322 at an end region of the third side portion 1113 that is close to the first side portion 1111, so that more wiring space is reserved at an end region of the third side portion 1113 that is close to the first side portion 1111.
In addition, in the above example of the present application, as shown in fig. 3 and 5, the wiring board 11 has a through hole 1101 opened in the wiring board main body 111 and corresponding to the second supporting portion 132, and the second supporting portion 132 penetrates the through hole 1101 from bottom to top to support the lens module 20. In this way, the metal substrate 13 can provide the lens module 20 with the lens mounting surface 1320 with high flatness without extending out of the circuit board main body 111, which is helpful for reducing the circumferential dimension of the module and meeting the miniaturization requirement of the camera module 1.
Optionally, the cross-sectional area of the through hole 1101 is between 5.76 and 9 times that of the second supporting portion 132, which helps to reduce the alignment difficulty between the second supporting portion 132 and the through hole 1101, so as to improve the assembly efficiency. It can be understood that, when the first sub-portion 1321 and the second sub-portion 1322 of the second supporting portion 132 are both cylindrical bosses, the through hole 1101 is implemented as a circular hole through which the cylindrical boss passes, and at this time, the diameter of the through hole 1101 is between 2.4 times and 3 times the diameter of the cylindrical boss. For example, if the diameter of the columnar boss is 0.5mm, the opening diameter of the through hole 1101 is between 1.2mm and 1.5 mm.
In addition, as shown in fig. 3 and 5, the circuit board 11 may further have a receiving hole 1102 opened in the circuit board main body 111 and corresponding to the photosensitive chip 12, and the photosensitive chip 12 is attached to the metal substrate 13 through the receiving hole 1102, so as to avoid the deformation or warpage of the circuit board 11 from adversely affecting the photosensitive chip 12, and help to ensure the flatness of the photosensitive chip 12, and meanwhile, the metal substrate 13 is also beneficial to radiating the heat generated by the photosensitive chip 12, so as to enhance the overall heat dissipation performance of the camera module 1.
Optionally, as shown in fig. 3 and 5, the metal substrate 13 further includes a third supporting portion 133 extending upward from the first supporting portion 131, wherein a chip mounting surface 1330 is disposed at a top of the third supporting portion 133 and is located in the receiving hole 1102, and the photosensitive chip 12 is attached to the chip mounting surface 1330. In this way, the metal substrate 13 of the present application can not only provide the chip mounting surface 1330 with high flatness through the top of the third supporting portion 133, ensure that the chip mounting surface 1330 is parallel to the lens mounting surface 1320, so that the lens optical axis of the lens module 20 is as perpendicular as possible to the light sensing surface of the light sensing chip 12, but also raise the light sensing chip 12 by means of the third supporting portion 133, so that the light sensing surface of the light sensing chip 12 is substantially level or slightly higher than the upper surface of the circuit board 11, which is not only beneficial to gold-wire bonding between the light sensing chip 12 and the circuit board 11, but also can avoid the circuit board 11 from affecting the light sensing chip 12 to receive image light.
It will be appreciated that in one example of the present application, the chip mounting surface 1330 may be lower than the lens mounting surface 1320 as shown in fig. 10, or in another example of the present application, the chip mounting surface 1330 may be flush with the lens mounting surface 1320 as much as the machining tolerance allows.
It should be noted that, as shown in fig. 2 to 5, the photosensitive assembly 10 may further include, but is not limited to, a molding body 14 and a filter 15, wherein the molding body 14 is located at an inner area of the second supporting portion 132, the molding body 14 is formed at a connection portion between the circuit board 11 and the photosensitive chip 12, and the filter 15 is mounted on the molding body 14 to cover a light sensing surface of the photosensitive chip 12, so that the image light emitted from the lens module 20 is filtered by the filter 15 and then received by the light sensing surface of the photosensitive chip 12, so as to filter stray light and improve imaging quality. It will be appreciated that the molded body 14 mentioned in the present application may be replaced by a prefabricated bracket, or may be omitted, and the optical filter 15 may be directly mounted on the circuit board 11, which is not described in detail in the present application.
Further, according to the above-described embodiment of the present application, as shown in fig. 1 to 3, the lens module 20 in the image capturing module 1 may include a lens base 21 attached to the second supporting portion 132 and an optical lens 22 disposed on the lens base 21 and located in the photosensitive path of the photosensitive assembly 10.
Alternatively, in one example of the present application, as shown in fig. 3, the lens base 21 is provided with a convex portion 211 that is engaged with the second supporting portion 132, and a lower surface of the convex portion 211 is adhesively fixed to an upper surface of the second supporting portion 132. In this way, the surface area of the convex portion 211 is smaller and is more easily processed to be flatter than the bottom surface of the lens base 21 as the surface of the lens module 20 mated with the photosensitive assembly 10, so that the processing and assembling difficulty is reduced. Preferably, the lower surface area of the protrusion 211 is larger than the upper surface area of the second supporting part 132 in order to reduce alignment difficulty.
Alternatively, in a modified example of the present application, as shown in fig. 6, the lens base 21 is provided with a groove 212 that mates with the second support 132, and the second support 132 is inserted into the groove 212 and is adhered to each other. In this way, the groove 212 of the lens base 21 of the present application can be in plug-in fit with the second supporting portion 132, so as to limit the transverse relative position between the lens module 20 and the photosensitive assembly 10, so that the assembly efficiency is improved on the premise of ensuring the assembly precision.
Preferably, as shown in fig. 6, a gap between the upper surface of the second supporting part 132 and the bottom of the groove 212 is smaller than a gap between the side surface of the second supporting part 132 and the wall of the groove 212, so as to reduce the adhesive between the bottom of the groove 212 and the upper surface of the second supporting part 132 as much as possible, helping to reduce the shrinkage degree of the adhesive after curing, and preventing the lens module 20 from tilting due to the anisotropy of the shrinkage degree of the adhesive.
It should be noted that, in the photosensitive assembly 10 of the above embodiment of the present application, the first sub-portion 1321 and the second sub-portion 1322 of the second supporting portion 132 are each implemented as a column-shaped boss, but in other embodiments of the present application, the first sub-portion 1321 and/or the second sub-portion 1322 may be implemented as other shaped bosses such as a bar-shaped boss.
Illustratively, in the first modified embodiment of the photosensitive assembly 10 of the present application, as shown in fig. 7, the second side portion 1112 of the circuit board main body 111 is disposed with a first sub-portion 1321, the third side portion 1113 of the circuit board main body 111 is disposed with a second sub-portion 1322, the first sub-portion 1321 is implemented as a column-shaped boss located at a middle region of the second side portion 1112, and the second sub-portion 1322 is implemented as a bar-shaped boss extending along the third side portion 1113 such that the column-shaped boss corresponds to a middle portion of the bar-shaped boss, i.e., the first sub-portion 1321 and the second sub-portion 1322 are triangularly distributed on the first supporting portion 131, still enabling a geometric center of boss to be located directly under a center of gravity of the lens module 20 so as to uniformly support the lens module 20.
In addition, in the second variant embodiment of the photosensitive assembly 10 of the present application, as shown in fig. 8, the second supporting portion 132 may be located at the periphery of the circuit board 11, and still effectively support the lens module 20 without forming an opening in the circuit board main body 111. It is understood that the periphery of the circuit board 11 referred to in the present application refers to a position outside the edge of the circuit board 11, and the circuit board 11 may have a flat edge, or may have a notch edge, where the second supporting portion 132 may be located inside the edge notch of the circuit board 11.
Alternatively, as shown in fig. 8, the second supporting portion 132 is implemented as a bar-shaped boss extending along the edge of the circuit board 11, and still can smoothly support the lens module 20. It can be appreciated that, in other examples of the present application, the second supporting portion 132 may also be implemented as a plurality of columnar bosses located at the periphery of the circuit board 11, without forming through holes on the circuit board main body 111, so that the difficulty in aligning the circuit board 11 and the metal substrate 13 in the lateral direction can be reduced, which is not described in detail herein.
For example, as shown in fig. 8, the strip-shaped boss extends along the second side portion 1112, the fourth side portion 1114 and the third side portion 1113 of the circuit board main body 111 to form a U-shaped boss opening toward the first side portion 1111, so as to better support the lens module 20 while avoiding the connector 112 and prevent the lens module 20 from being skewed. It is understood that the fourth side 1114 corresponds to another short side of the photo-sensing chip 12, and is located on two opposite sides of the photo-sensing chip 12 with respect to the first side 1111.
According to another aspect of the present application, an embodiment of the present application further provides a method for manufacturing an image capturing module, wherein the image capturing module 1 may include a photosensitive assembly 10 and a lens module 20. The photosensitive assembly 10 includes a circuit board 11, a photosensitive chip 12, and a metal substrate 13 stacked under the circuit board 11. The circuit board 11 has a receiving hole 1102 and a first region located at the periphery of the receiving hole 1102 and provided with a through hole 1101. The metal substrate 13 includes a first supporting portion 131 corresponding to the accommodation hole 1102 and a second supporting portion 132 extending upward from the first supporting portion 131 and passing through the through hole 1101, and a top surface of the second supporting portion 132 is higher than an upper surface of the circuit board 11 to serve as a lens mounting surface 1320. The bottom of the lens module 20 has a second area corresponding to the first area of the circuit board 11.
As shown in fig. 12, the method for manufacturing the camera module may include the steps of:
S110, providing a photosensitive assembly 10, wherein the photosensitive assembly 10 comprises a circuit board 11 and a metal substrate 13 stacked under the circuit board 11, the circuit board 11 has a receiving hole 1102 and a first area located at the periphery of the receiving hole 1102 and provided with a through hole 1101, the metal substrate 13 comprises a first supporting portion 131 corresponding to the receiving hole 1102 and a second supporting portion 132 extending upward from the first supporting portion 131 and passing through the through hole 1101, and the top surface of the second supporting portion 132 is higher than the upper surface of the circuit board 11 to serve as a lens mounting surface 1320;
S120, filling the gap between the wall of the through hole 1101 and the peripheral wall of the second supporting portion 132 with an adhesive and curing the gap to adhesively fix the circuit board 11 to the metal substrate 13;
s130, providing a lens module 20, wherein the lens module 20 has a second area corresponding to the first area of the circuit board 11, and
And S140, applying an adhesive to the first area, the second area and/or the lens mounting surface 1320 and curing to adhesively fix the lens module 20 to the photosensitive assembly 10.
It is noted that in the above step S110 of the present application, the metal substrate 13 is mounted under the circuit board 11, wherein the second supporting portion 132 of the metal substrate 13 is disposed through the through hole 1101 from bottom to top, and the lens mounting surface 1320 of the metal substrate 13 is higher than the upper surface of the circuit board 11.
In addition, in the method for manufacturing an image capturing module according to the above embodiment of the present application, the relative positions of the circuit board 11 and the metal substrate 13 in the photosensitive assembly 10 are fixed first, so as to reduce the positional deviation of the metal substrate 13 caused by the stress generated by the curing of the adhesive during the assembly of the lens module 20 and the photosensitive assembly 10 in the above step S140, so that the lens mounting surface 1320 is not easy to relatively move with respect to the second area of the lens module 20, and the alignment between the photosensitive assembly 10 and the lens module 20 is ensured to be more accurate.
It should be noted that, in a modified example of the present application, as shown in fig. 13, the method for preparing the camera module may also include the steps of:
S210 providing a photosensitive assembly 10 and a lens module 20, wherein the photosensitive assembly 10 comprises a circuit board 11 and a metal substrate 13 overlapped under the circuit board 11, the circuit board 11 has a receiving hole 1102 and a first region arranged at the periphery of the receiving hole 1102 and provided with a through hole 1101, the metal substrate 13 comprises a first supporting part 131 corresponding to the receiving hole 1102 and a second supporting part 132 extending upwards from the first supporting part 131 and passing through the through hole 1101, the top surface of the second supporting part 132 is higher than the upper surface of the circuit board 11 as a lens mounting surface 1320, wherein the lens module 20 has a second region corresponding to the first region of the circuit board 11, and
And S220, applying and curing an adhesive to the gaps between the first region, the second region, the lens mounting surface 1320 and/or the wall of the through hole 1101 and the peripheral wall of the second supporting portion 132 to adhesively fix the lens module 20 to the photosensitive assembly 10.
In this way, in the method for manufacturing the camera module according to the second example of the present application, the relative positions of the circuit board 11 and the metal substrate 13 in the photosensitive assembly 10 are fixed and the assembly of the photosensitive assembly 10 and the lens module 20 are integrated in the same assembly process, so that the simplified transfer process and the overall assembly process can be shortened, and the assembly efficiency can be improved. It will be appreciated that the method of manufacturing the camera module in the second example of the present application may increase the risk of positional displacement of the lens mounting surface 1320 relative to the second area of the lens module 20, but may use an auxiliary positioning structure to improve the risk of positional displacement.
It should be noted that the mounting manner of the photosensitive chip 12 in the photosensitive assembly 10 may be implemented by firstly mounting the photosensitive chip 12 on the third supporting portion 133 of the metal substrate 13, then mounting the metal substrate 13 and the circuit board 11 together, and finally electrically connecting the photosensitive chip 12 and the circuit board 11 through metal leads, or by firstly mounting the metal substrate 13 and the circuit board 11 together, then mounting the photosensitive chip 12 on the third supporting portion 133 of the metal substrate 13, and finally electrically connecting the photosensitive chip 12 and the circuit board 11 through metal leads.
Further, since the thinner the adhesive between the lens mounting surface 1320 and the second region of the lens module 20, the less likely the inclination of the assembly of the photosensitive assembly 10 and the lens module 20 will occur, when the photosensitive assembly 10 and the lens module 20 are assembled together, the gap between the lens mounting surface 1320 and the second region of the lens module 20 in the parallel optical axis direction can be reduced by pressurizing so that more adhesive is likely to be pressed around the lens mounting surface 1320 as shown in fig. 6, or the thickness of the adhesive applied to the lens mounting surface 1320 is thinner than the thickness of the adhesive around the lens mounting surface 1320 as shown in fig. 6 when the adhesive is applied before the photosensitive assembly 10 and the lens module 20 are adhered, or the adhesive needs to be applied around the lens mounting surface 1320 to enclose the connection portion where the lens mounting surface 1320 is located as shown in fig. 3 when the adhesive is applied before the photosensitive assembly 10 and the lens module 20 are adhered together.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (23)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202411563337.3A CN119092556A (en) | 2024-11-05 | 2024-11-05 | Photosensitive component, camera module, preparation method thereof, and electronic device |
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| CN202411563337.3A CN119092556A (en) | 2024-11-05 | 2024-11-05 | Photosensitive component, camera module, preparation method thereof, and electronic device |
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