CN119081597A - Silicone-modified acrylic pressure-sensitive adhesive, pressure-sensitive adhesive tape and preparation method thereof - Google Patents
Silicone-modified acrylic pressure-sensitive adhesive, pressure-sensitive adhesive tape and preparation method thereof Download PDFInfo
- Publication number
- CN119081597A CN119081597A CN202411434009.3A CN202411434009A CN119081597A CN 119081597 A CN119081597 A CN 119081597A CN 202411434009 A CN202411434009 A CN 202411434009A CN 119081597 A CN119081597 A CN 119081597A
- Authority
- CN
- China
- Prior art keywords
- sensitive adhesive
- modified acrylic
- silicon
- acrylic pressure
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 97
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 87
- 229920001971 elastomer Polymers 0.000 claims abstract description 34
- 239000000806 elastomer Substances 0.000 claims abstract description 33
- 229920005549 butyl rubber Polymers 0.000 claims abstract description 30
- 239000000178 monomer Substances 0.000 claims description 43
- 229910052710 silicon Inorganic materials 0.000 claims description 36
- 239000010703 silicon Substances 0.000 claims description 36
- -1 silane modified acrylic ester Chemical class 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 16
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical group CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 15
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- 239000003999 initiator Substances 0.000 claims description 13
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 claims description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- GRWFGVWFFZKLTI-UHFFFAOYSA-N α-pinene Chemical compound CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 claims description 12
- 229910000077 silane Inorganic materials 0.000 claims description 11
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 11
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 10
- 239000000839 emulsion Substances 0.000 claims description 9
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 150000003505 terpenes Chemical class 0.000 claims description 8
- 235000007586 terpenes Nutrition 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- GRWFGVWFFZKLTI-IUCAKERBSA-N 1S,5S-(-)-alpha-Pinene Natural products CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 claims description 6
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 6
- 239000003431 cross linking reagent Substances 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000008096 xylene Substances 0.000 claims description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 3
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 claims description 3
- CTLDFURRFMJGON-UHFFFAOYSA-N dimethoxy-methyl-(3-piperazin-1-ylpropyl)silane Chemical group CO[Si](C)(OC)CCCN1CCNCC1 CTLDFURRFMJGON-UHFFFAOYSA-N 0.000 claims description 3
- 238000000746 purification Methods 0.000 claims description 3
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 claims description 2
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229920005555 halobutyl Polymers 0.000 claims description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 2
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 claims description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000002390 adhesive tape Substances 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000003139 buffering effect Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 230000035939 shock Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- MBNZWTSAAPQLKH-UHFFFAOYSA-N [SiH3]N1CCNCC1 Chemical compound [SiH3]N1CCNCC1 MBNZWTSAAPQLKH-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000006261 foam material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229920006112 polar polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- 229910003872 O—Si Inorganic materials 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920005557 bromobutyl Polymers 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004440 column chromatography Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920006113 non-polar polymer Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2451/00—Presence of graft polymer
- C09J2451/003—Presence of graft polymer in the primer coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
Abstract
本发明公开一种硅改性丙烯酸压敏胶、压敏胶带及其制备方法，压敏胶带包括胶带主体和设置于胶带主体两面的离型膜层，胶带主体包括依次设置的第一硅改性丙烯酸压敏胶层、第一底涂层、丁基橡胶弹性体层、第二底涂层和第二硅改性丙烯酸压敏胶层，底涂层直接涂布于丁基橡胶弹性体层上，硅改性丙烯酸压敏胶层通过涂布于丁基橡胶弹性体层上的底涂层进行黏着叠加，底涂层与丁基橡胶弹性体层的附着力比较好，可以作为硅改性丙烯酸压敏胶层与丁基橡胶弹性体层的连接中介，整体较薄，具有优秀的粘合强度、减震效果和冲击吸收性能，抗冲击缓冲能力强。The invention discloses a silicon-modified acrylic pressure-sensitive adhesive, a pressure-sensitive adhesive tape and a preparation method thereof. The pressure-sensitive adhesive tape comprises an adhesive tape body and release film layers arranged on both sides of the adhesive tape body. The adhesive tape body comprises a first silicon-modified acrylic pressure-sensitive adhesive layer, a first primer layer, a butyl rubber elastomer layer, a second primer layer and a second silicon-modified acrylic pressure-sensitive adhesive layer arranged in sequence. The primer layer is directly coated on the butyl rubber elastomer layer. The silicon-modified acrylic pressure-sensitive adhesive layer is adhered and superimposed by the primer layer coated on the butyl rubber elastomer layer. The primer layer has good adhesion to the butyl rubber elastomer layer and can serve as a connecting medium between the silicon-modified acrylic pressure-sensitive adhesive layer and the butyl rubber elastomer layer. The overall thickness is relatively thin, and the adhesive strength, shock absorption effect and impact absorption performance are excellent, and the impact resistance and buffering ability are strong.
Description
Technical Field
The invention relates to the field of pressure-sensitive adhesive tapes, in particular to a silicon-modified acrylic pressure-sensitive adhesive, a pressure-sensitive adhesive tape and a preparation method thereof.
Background
Because 0LED has numerous advantages, 0LED technology has wider application range than LCD technology, and can be extended to the fields of electronic products, business, transportation, industrial control and medical. Along with the development of technology, people cannot leave electronic display devices such as mobile phones and computers, and the electronic devices are easy to collide and fall in the using process, so that a layer of buffer material foam is required to be adhered below an OLED frame of a screen of the electronic devices to absorb the impact of the outside on the electronic devices. The traditional foam materials are classified into PU foam, PE foam, PP foam, EVA foam and the like, the impact absorbing capacity of the foam materials is general, a certain thickness is required to achieve better buffering performance, the market demand at present is towards ultrathin and high buffering performance development, and therefore, the development of a thin type buffering material with high impact absorbing performance is a future trend. In addition, the traditional single foam is required to be matched with a grid double faced adhesive tape, a PI adhesive tape and a metal supporting adhesive tape to form a buffer layer synchronously, so that a buffer effect is achieved, the thickness of a product is increased, and the cost of the product is increased.
Disclosure of Invention
In order to solve the technical problems, the invention provides a silicon-modified acrylic pressure-sensitive adhesive, a pressure-sensitive adhesive tape and a preparation method thereof, wherein the pressure-sensitive adhesive tape prepared from the silicon-modified acrylic pressure-sensitive adhesive mainly comprises a first silicon-modified acrylic pressure-sensitive adhesive layer, a first base coat, a butyl rubber elastomer layer, a second base coat and a second silicon-modified acrylic pressure-sensitive adhesive layer, is thinner in whole, has excellent damping effect and impact absorption performance, and has strong impact resistance and buffering capacity.
The aim of the invention is achieved by the following technical scheme:
the invention provides a silicon modified acrylic pressure-sensitive adhesive which comprises the following raw materials of hard monomers, soft monomers, functional monomers, an initiator, a first solvent and a curing cross-linking agent;
The soft monomer accounts for 65-90% of the total mass of the monomer, the hard monomer accounts for 9-25% of the total mass of the monomer, the functional monomer accounts for 1-10% of the total mass of the monomer, the initiator is 0.5-2% of the total mass of the monomer, the curing cross-linking agent is 1-3% of the total mass of the monomer, and the ratio of the solvent to the total mass of the monomer is 1:1;
The soft monomer is a mixture of at least one of 2- (2-Ethoxyethoxy) Ethyl Acrylate (EEA) and 2-hydroxyethyl acrylate (HEA) and decyl acrylate (OA), butyl Acrylate (BA), 2-ethylhexyl acrylate (EHA) and 2-hydroxypropyl acrylate (HPA), wherein the 2- (2-ethoxyethoxy) ethyl acrylate accounts for 30-60% of the total mass of the soft monomer, and the 2-hydroxyethyl acrylate (HEA) accounts for 8-15% of the total mass of the soft monomer;
The hard monomer is a mixture of alpha-pinene methacrylate and Methyl Methacrylate (MMA) and/or Methyl Acrylate (MA), and the alpha-pinene methacrylate accounts for 10-20% of the total mass of the hard monomer;
The functional monomer is silane modified acrylic ester;
The initiator is at least one of benzoyl peroxide, azodiisobutyronitrile, azodiisoheptonitrile, dimethyl azodiisobutyrate, benzoyl tert-butyl peroxide and methyl ethyl ketone peroxide;
The curing cross-linking agent is at least one of hexamethylene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, tetramethyl m-xylylene diisocyanate and toluene diisocyanate;
the first solvent is ethyl acetate, xylene or toluene.
Further, the silane-modified acrylate is prepared by the following method:
At room temperature, diethylene glycol diacrylate or tetraethylene glycol diacrylate is placed in a reaction vessel, 3-mercaptopropyl trimethoxy silane is slowly added dropwise, after being stirred and mixed uniformly, a catalyst is added, and after reaction, the silane modified acrylate is prepared by purification;
The mol ratio of the diethylene glycol diacrylate or the tetraethylene glycol diacrylate to the (3-mercaptopropyl) trimethoxysilane is 1:1;
The addition amount of the catalyst is 0.5-0.6% of the total mass of diethylene glycol diacrylate or tetraethylene glycol diacrylate and (3-mercaptopropyl) trimethoxysilane.
Secondly, the invention provides a preparation method of the silicon modified acrylic pressure-sensitive adhesive, which comprises the following steps:
Mixing and stirring the hard monomer, the soft monomer and the functional monomer according to the formula amount uniformly to form a pre-emulsion;
placing 10% of the pre-emulsion, 25-35% of the initiator and 40-60% of the first solvent in a reaction vessel, heating to 70-90 ℃ and stirring for 0.5-1 h, slowly dripping 90% of the pre-emulsion, 65-75% of the initiator and the rest of the first solvent, continuing stirring for 3-5 h after dripping, cooling to below 40 ℃, adding the crosslinking curing agent, and continuing stirring for 0.3-1 h to obtain the silicon modified acrylic pressure-sensitive adhesive.
The pressure-sensitive adhesive tape comprises a tape main body and release film layers arranged on two sides of the tape main body, and is characterized in that the tape main body comprises a first silicon modified acrylic pressure-sensitive adhesive layer, a first bottom coating, a butyl rubber elastomer layer, a second bottom coating and a second silicon modified acrylic pressure-sensitive adhesive layer which are sequentially arranged;
the first silicon-modified acrylic pressure-sensitive adhesive layer and the second silicon-modified acrylic pressure-sensitive adhesive layer are both prepared from the silicon-modified acrylic pressure-sensitive adhesive or the silicon-modified acrylic pressure-sensitive adhesive prepared by the preparation method;
the thickness of the first silicon modified acrylic pressure sensitive adhesive layer and the thickness of the second silicon modified acrylic pressure sensitive adhesive layer are 20-30 mu m;
The thickness of the first bottom coating and the second bottom coating is 0.5-5 mu m;
the thickness of the butyl rubber elastomer layer is 30-40 mu m.
Further, the first primer layer and the second primer layer are both made of primer, and the primer comprises the following raw material components in parts by weight: 80-100 parts of maleic anhydride grafted SEBS (SEBS-g-MAH), 10-30 parts of rosin resin, 10-20 parts of terpene phenol resin, 2-5 parts of silane coupling agent and 150-200 parts of second solvent;
the silane coupling agent is gamma-piperazinyl propyl methyl dimethoxy silane;
the softening point of the rosin resin is 130-160 ℃;
the softening point of the terpene phenol resin is 80-100 ℃;
the grafting rate of the maleic anhydride grafted SEBS is 1.5-1.6%;
the second solvent is xylene or toluene.
Further, the primer is prepared by the following method:
Mixing maleic anhydride grafted SEBS, rosin resin and a second solvent, dissolving by using a high-speed shearing dispersing machine, adding terpene phenol resin, continuing high-speed shearing dispersion, then adding a silane coupling agent, and uniformly mixing by using high-speed dispersion to obtain the primer.
Further, the butyl rubber elastomer layer is selected from one of halogenated butyl rubber elastomer, sulfonated butyl rubber elastomer, maleic anhydride modified butyl rubber elastomer and ternary butyl rubber elastomer, and has a tensile strength of 15-25 MPa, an elongation of 400-700% and a density of 0.6-0.9 g/cm 3.
Fourth, the invention provides a preparation method of the pressure-sensitive adhesive tape, comprising the following steps:
(1) Coating a primer on two sides of a butyl rubber elastomer, drying for 2 min-3 min in an environment of 80-120 ℃, and standing for 7-10 days at normal temperature or curing for 24-48 h in an environment of 60-80 ℃ to respectively form a first primer layer and a second primer layer;
(2) And coating a silicon modified acrylic pressure-sensitive adhesive on the first base coat and the second base coat, drying at 80-130 ℃ for 2-3 min to form a first silicon modified acrylic pressure-sensitive adhesive layer and a second silicon modified acrylic pressure-sensitive adhesive layer respectively, arranging release films on the outer sides of the first silicon modified acrylic pressure-sensitive adhesive layer and the second silicon modified acrylic pressure-sensitive adhesive layer, and standing for 7-10 days at normal temperature or curing for 24-48 h at 60-80 ℃ to obtain the impact-resistant buffer type double-sided pressure-sensitive adhesive tape.
In the silicon modified acrylic pressure sensitive adhesive of the invention, 2- (2-Ethoxyethoxy) Ethyl Acrylate (EEA) contains ethylene glycol side chains, the ethylene glycol side chains consist of hydrophilic (-C-O-) and hydrophobic (-C-C-) chain segments, and due to the high flexibility, polarity and chain length, a unique spiral or coiled structure is formed, EEA-based acrylic PSA has increased chain entanglement due to the flexibility of the ethylene glycol chains, and a tightly packed structure is formed between acrylic PSA chains. Meanwhile, the interaction between chains is enhanced due to the physical crosslinking of the secondary bonding (hydrogen bond formed by oxygen atoms) between oxygen atom chains in the ethylene glycol side chain, so that the EEA-based acrylic acid PSA is easy to intertwine, thereby forming a higher gel fraction of the PSA and having excellent adhesiveness. Therefore, the pressure-sensitive adhesive has better elasticity, can recover quickly in strain change and shows good recovery rate and recovery characteristic by introducing the physical crosslinking formed by chain entanglement and secondary bonding of the ethylene glycol side chain improvement.
Silicon compounds have better mechanical and thermal properties than organic materials composed of carbon, and furthermore, si-O-Si bond angles of 140℃to 180℃are higher than C-O-C bond angles of 110℃and therefore have a very high flexibility. The acrylic acid PSA of the invention also introduces silane acrylic ester containing ethylene glycol chain as a functional monomer, and introduces silane groups at the end to compensate the low cohesive force and the modulus at high temperature of the acrylic acid PSA, so as to adjust the peel strength and rheological property thereof, and effectively improve the cohesive force and the adhesive property of the acrylic acid PSA. The silane acrylates have a relatively high free volume due to the presence of ethylene glycol chains (- (CH 2CH2 O) -), silane fatty chains (-CH 2 -) and bulky terminal silane groups. The physical crosslinking of silane groups in the silane acrylate improves cohesive force, and the physical crosslinking of glycol chains in the silane acrylate is carried out through polymer entanglement, so that the silane groups are large in volume and have excellent heat resistance. These factors further improve the elasticity, heat resistance and mechanical properties of acrylic PSAs, which achieve stable viscoelastic behavior even at high temperatures.
The invention adopts the mixture of alpha-pinene methacrylate and Methyl Methacrylate (MMA) and/or Methyl Acrylate (MA) as a hard segment, improves the glass transition temperature of the adhesive, and ensures that the adhesive can still keep better viscosity at higher temperature, thereby enhancing the heat resistance and chemical resistance of the adhesive. The presence of the hard segment enables the acrylic pressure sensitive adhesive to maintain good stability and adhesion effect when facing high temperature environments or chemicals.
According to the adhesive tape, the primer is coated on the surface of the butyl rubber elastomer layer, so that the binding force between the glue and the substrate layer is improved. The SEBS in the primer is a selective hydrogenation product of SBS, and the butadiene part in the polymer main chain is hydrogenated and converted into an ethylene/butylene saturated elastomer, so that the SEBS macromolecular main chain does not contain unsaturated double bonds, and therefore, compared with SBS and SIS, the SEBS has more stable characteristics besides excellent rubber elasticity, and has higher thermal stability and lower embrittlement temperature. However, the molecular chain of the polymer does not contain polar groups and reactive functional groups, so that the compatibility between SEBS and polar polymers is poor according to the similar principle of compatibility. The invention adopts maleic anhydride grafted SEBS (SEBS-g-MAH), and utilizes unsaturated double bond contained in maleic anhydride molecule to improve compatibility between nonpolar polymer and polar polymer and improve adhesion between different materials. The piperazinyl silane coupling agent added in the primer is piperazinyl silane, the piperazinyl silane has two active amino groups, so that the adhesion can be promoted, meanwhile, the softness and smoothness of the primer polymer are improved, and the bonding property is improved by combining rosin resin and terpene phenol resin in the primer.
The pressure-sensitive adhesive tape comprises a first release film layer, a first silicon modified acrylic acid pressure-sensitive adhesive layer, a first bottom coating layer, a butyl rubber elastomer layer, a second bottom coating layer, a second silicon modified acrylic acid pressure-sensitive adhesive layer and a second release film layer, wherein the release film layer is arranged outside the silicon rubber pressure-sensitive adhesive layer and is used for release stripping and plays a role in protection, the bottom coating layer is directly coated on the butyl rubber elastomer layer, the silicon modified acrylic acid pressure-sensitive adhesive layer is adhered and overlapped with the butyl rubber elastomer layer through coating on the bottom coating layer, the adhesion force between the bottom coating layer and the butyl rubber elastomer layer is good, the silicon modified acrylic acid pressure-sensitive adhesive layer can be used as a connecting medium between the silicon modified acrylic acid pressure-sensitive adhesive layer and the butyl rubber elastomer layer, the silicon modified acrylic acid pressure-sensitive adhesive layer has excellent adhesive strength, tensile strength and elasticity, and the butyl rubber elastomer layer has excellent damping performance, and the shock resistance and buffering effect are guaranteed.
Detailed Description
For a further understanding of the present invention, preferred embodiments of the invention are described below in conjunction with the examples, but it should be understood that these descriptions are merely intended to illustrate further features and advantages of the invention, and are not limiting of the claims of the invention.
The experimental methods used in the following examples are conventional methods unless otherwise specified, and materials, reagents, etc. used, unless otherwise specified, are commercially available.
Example 1
(1) Preparing a primer:
100 parts by weight of SEBS-g-MAH (grafting ratio of 1.57%), 30 parts by weight of rosin resin and 150 parts by weight of xylene are mixed, dissolved by a high-speed shearing dispersing machine, 15 parts by weight of terpene phenol resin and 30 parts by weight of xylene are added, high-speed shearing dispersion is continued, then 3 parts by weight of gamma-piperazinyl propyl methyl dimethoxy silane is added, and the primer is prepared by uniformly mixing by high-speed dispersion for standby.
(2) Preparation of silicon modified acrylic pressure sensitive adhesive
At room temperature, 10 parts by weight of diethylene glycol diacrylate is placed in a reaction vessel, 9.2 parts by weight of (3-mercaptopropyl) trimethoxy silane is slowly added dropwise, after being stirred and mixed uniformly, 0.1 part by weight of hexylamine catalyst is added, stirring and reacting are carried out for 4 hours at room temperature, and silane modified acrylate is prepared for standby application through column chromatography purification.
1 Part by weight of azodiisobutyronitrile is dissolved in 20 parts by weight of ethyl acetate to form an initiator solution for later use;
Uniformly mixing and stirring 40 parts by weight of 2- (2-Ethoxyethoxy) Ethyl Acrylate (EEA), 10 parts by weight of 2-hydroxyethyl acrylate (HEA), 10 parts by weight of decyl acrylate (OA), 10 parts by weight of Butyl Acrylate (BA) and 10 parts by weight of 2-ethylhexyl acrylate (EHA), 2 parts by weight of alpha-pinene methacrylate, 13 parts by weight of Methyl Methacrylate (MMA) and 5 parts by weight of silane modified acrylate to form a pre-emulsion;
Placing 10 parts by weight of pre-emulsion, 6 parts by weight of initiator solution and 50 parts by weight of ethyl acetate into a reaction vessel, heating to 80 ℃ and stirring for 0.5h, slowly dripping 90 parts by weight of pre-emulsion, 15 parts by weight of initiator solution and 30 parts by weight of ethyl acetate, heating to 85 ℃ after dripping, continuously stirring for reacting for 5h, cooling to below 40 ℃, adding 2 parts by weight of diphenylmethane diisocyanate, stirring and dispersing for 0.5h, and controlling the stirring speed in the whole process to 800r/min to obtain the silicon modified acrylic acid pressure-sensitive adhesive.
(3) Preparation of impact-resistant buffer type double-sided pressure-sensitive adhesive tape
A brominated butyl rubber elastomer with the thickness of 50 mu m is selected as a butyl rubber elastomer layer, the tensile strength is 20MPa, the elongation is 500%, and the density is 0.81g/cm 3;
The two sides of the butyl rubber elastomer are coated with a primer, and the butyl rubber elastomer is placed in an environment of 100 ℃ and dried for 150 seconds, and is placed for 8 days at normal temperature to form a first primer layer with the thickness of 2.5 mu m and a second primer layer with the thickness of 2.5 mu m respectively;
And coating a silicon-modified acrylic pressure-sensitive adhesive on the first base coat and the second base coat, drying for 3min in an environment of 120 ℃ to form a first silicon-modified acrylic pressure-sensitive adhesive layer with a thickness of 30 mu m and a second silicon-modified acrylic pressure-sensitive adhesive layer with a thickness of 30 mu m respectively, arranging a release film with a thickness of 100 mu m outside the first silicon-modified acrylic pressure-sensitive adhesive layer and the second silicon-modified acrylic pressure-sensitive adhesive layer, and curing for 48h in an environment of 60 ℃ to obtain the impact-resistant buffer type double-sided pressure-sensitive adhesive tape. It should be noted that the thicknesses of the first silicon modified acrylic pressure sensitive adhesive layer and the second silicon modified acrylic pressure sensitive adhesive layer may be the same or different, in this embodiment, the thicknesses of the first silicon modified acrylic pressure sensitive adhesive layer and the second silicon modified acrylic pressure sensitive adhesive layer are the same, and in other embodiments, the thicknesses of the first silicon modified acrylic pressure sensitive adhesive layer and the second silicon modified acrylic pressure sensitive adhesive layer may be different.
The preparation methods of example 2, example 3 and comparative examples 1 to 4 are identical to those of example 1, except for the raw material components and the component contents. The specific raw material components and the component contents are shown in table 1.
TABLE 1
Performance tests were conducted on the impact-buffered double-sided pressure-sensitive adhesive tapes prepared in examples 1 to 3 and comparative examples 1 to 4, and the test data are shown in table 2.
Testing 180-degree stripping force of the pressure-sensitive adhesive tape at normal temperature by referring to standard GB/T2792-2014;
Testing the adhesion holding force of the pressure-sensitive adhesive tape at normal temperature by referring to the standard GB/T4851-2014;
testing the initial adhesion of the pressure-sensitive adhesive tape at normal temperature by referring to the standard GB/T4852-2002;
testing the elastic modulus of the pressure-sensitive adhesive tape at normal temperature by referring to standard GB/T1040-2006;
Testing the buffer rate of the pressure-sensitive adhesive tape with reference to standard GB/T6670-2008;
Aging test, namely aging for 240 hours in an RH experiment box with the temperature of 85 ℃ plus or minus 2 ℃ and the humidity of 85% RH plus or minus 2%, and then carrying out appearance test.
TABLE 2
| Test item | Example 1 | Example 2 | Example 3 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 |
| Thickness- | 115 | 115 | 114 | 115 | 115 | 115 | 115 | 115 |
| Initial ball stick (#) | 20 | 19 | 20 | 18 | 16 | 14 | 19 | 18 |
| Peel force (180 °)/gf | 3413 | 3230 | 3318 | 1890 | 1715 | 1627 | 2812 | 2303 |
| Adhesive force 72H displacement (mm) | 0 | 0 | 0 | 3 | 3 | 4 | 1 | 3 |
| Elastic modulus GPa | 1.4 | 1.3 | 1.3 | 0.9 | 1.0 | 0.8 | 1.2 | 1.1 |
| Buffer ratio (%) | 59.3 | 50.2 | 59.8 | 43.7 | 40.4 | 42.6 | 46.6 | 47.9 |
| Burn-in test | No change | No change | No change | Bulge and bulge | Bulge and bulge | No change | No change | Bulge and bulge |
Those skilled in the art can also make appropriate changes and modifications to the above-described embodiments in light of the above disclosure. Therefore, the invention is not limited to the specific embodiments disclosed and described above, but some modifications and changes of the invention should be also included in the scope of the claims of the invention. In addition, although specific terms are used in the present specification, these terms are for convenience of description only and do not limit the present invention in any way.
Claims (10)
1. A silicon modified acrylic pressure-sensitive adhesive is characterized by comprising the following raw materials of hard monomers, soft monomers, functional monomers, an initiator, a first solvent and a curing cross-linking agent;
The soft monomer accounts for 65-90% of the total mass of the monomer, the hard monomer accounts for 9-25% of the total mass of the monomer, the functional monomer accounts for 1-10% of the total mass of the monomer, the initiator is 0.5-2% of the total mass of the monomer, the curing cross-linking agent is 1-3% of the total mass of the monomer, and the ratio of the solvent to the total mass of the monomer is 1:1;
The soft monomer is a mixture of 2- (2-ethoxyethoxy) ethyl acrylate and at least one of 2-hydroxyethyl acrylate, decyl acrylate, butyl acrylate, 2-ethylhexyl acrylate and 2-hydroxypropyl acrylate, wherein the 2- (2-ethoxyethoxy) ethyl acrylate accounts for 30-60% of the total mass of the soft monomer, and the 2-hydroxyethyl acrylate accounts for 8-15% of the total mass of the soft monomer;
The hard monomer is a mixture of alpha-pinene methacrylate and methyl methacrylate and/or methyl acrylate, and the alpha-pinene methacrylate accounts for 10-20% of the total mass of the hard monomer;
the functional monomer is silane modified acrylic ester.
2. The silicon-modified acrylic pressure-sensitive adhesive according to claim 1, wherein:
The initiator is at least one of benzoyl peroxide, azodiisobutyronitrile, azodiisoheptonitrile, dimethyl azodiisobutyrate, benzoyl tert-butyl peroxide and methyl ethyl ketone peroxide;
The curing cross-linking agent is at least one of hexamethylene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, tetramethyl m-xylylene diisocyanate and toluene diisocyanate;
the first solvent is ethyl acetate, xylene or toluene.
3. The silicon-modified acrylic pressure-sensitive adhesive according to claim 1, wherein the silane-modified acrylate is prepared by:
At room temperature, diethylene glycol diacrylate or tetraethylene glycol diacrylate is placed in a reaction vessel, 3-mercaptopropyl trimethoxy silane is slowly added dropwise, after being stirred and mixed uniformly, a catalyst is added, and after reaction, the silane modified acrylate is prepared by purification;
The mol ratio of the diethylene glycol diacrylate or the tetraethylene glycol diacrylate to the (3-mercaptopropyl) trimethoxysilane is 1:1;
the addition amount of the catalyst is 0.5-0.6% of the total mass of diethylene glycol diacrylate or tetraethylene glycol diacrylate and (3-mercaptopropyl) trimethoxysilane.
4. A method for preparing the silicon-modified acrylic pressure-sensitive adhesive according to claim 1, comprising the steps of:
Mixing and stirring the hard monomer, the soft monomer and the functional monomer according to the formula amount uniformly to form a pre-emulsion;
placing 10% of the pre-emulsion, 25-35% of the initiator and 40-60% of the first solvent in a reaction vessel, heating to 70-90 ℃ and stirring for 0.5-1 h, slowly dripping 90% of the pre-emulsion, 65-75% of the initiator and the rest of the first solvent, continuing stirring for 3-5 h after dripping, cooling to below 40 ℃, adding the crosslinking curing agent, and continuing stirring for 0.3-1 h to obtain the silicon modified acrylic pressure-sensitive adhesive.
5. The pressure-sensitive adhesive tape comprises a tape main body and release film layers arranged on two sides of the tape main body, and is characterized in that the tape main body comprises a first silicon modified acrylic pressure-sensitive adhesive layer, a first base coat, a butyl rubber elastomer layer, a second base coat and a second silicon modified acrylic pressure-sensitive adhesive layer which are sequentially arranged;
the first silicon-modified acrylic pressure-sensitive adhesive layer and the second silicon-modified acrylic pressure-sensitive adhesive layer are prepared from the silicon-modified acrylic pressure-sensitive adhesive of claim 1 or the silicon-modified acrylic pressure-sensitive adhesive prepared by the preparation method of claim 4;
the thickness of the first silicon modified acrylic pressure sensitive adhesive layer and the thickness of the second silicon modified acrylic pressure sensitive adhesive layer are 20-30 mu m;
The thickness of the first bottom coating and the second bottom coating is 0.5-5 mu m;
the thickness of the butyl rubber elastomer layer is 50-100 mu m.
6. The pressure-sensitive adhesive tape according to claim 5, wherein the first primer layer and the second primer layer are each made of a primer, and the primer comprises, by weight, 80 to 100 parts of maleic anhydride grafted SEBS, 10 to 30 parts of rosin resin, 10 to 20 parts of terpene phenol resin, 2 to 5 parts of silane coupling agent, and 150 to 200 parts of second solvent.
7. The pressure-sensitive adhesive tape according to claim 6, wherein:
the silane coupling agent is gamma-piperazinyl propyl methyl dimethoxy silane;
the softening point of the rosin resin is 130-160 ℃;
the softening point of the terpene phenol resin is 80-100 ℃;
the grafting rate of the maleic anhydride grafted SEBS is 1.5-1.6%;
the second solvent is xylene or toluene.
8. The pressure-sensitive adhesive tape according to claim 6, wherein the primer is prepared by:
Mixing maleic anhydride grafted SEBS, rosin resin and a second solvent, dissolving by using a high-speed shearing dispersing machine, adding terpene phenol resin, continuing high-speed shearing dispersion, then adding a silane coupling agent, and uniformly mixing by using high-speed dispersion to obtain the primer.
9. The pressure-sensitive adhesive tape according to claim 5, wherein the butyl rubber elastomer layer is one selected from the group consisting of halogenated butyl rubber elastomer, sulfonated butyl rubber elastomer, maleic anhydride-modified butyl rubber elastomer, and ternary butyl rubber elastomer, and has a tensile strength of 15 to 25MPa, an elongation of 400 to 700, and a density of 0.6 to 0.9g/cm 3.
10. A method for producing a pressure-sensitive adhesive tape as claimed in claim 5, comprising the steps of:
(1) Coating a primer on two sides of the butyl rubber elastomer to form a first primer layer and a second primer layer respectively;
(2) Coating a silicon-modified acrylic pressure-sensitive adhesive on the first base coat and the second base coat, and curing to form a first silicon-modified acrylic pressure-sensitive adhesive layer and a second silicon-modified acrylic pressure-sensitive adhesive layer respectively;
(3) And arranging release films on the outer sides of the first silicon modified acrylic pressure-sensitive adhesive layer and the second silicon modified acrylic pressure-sensitive adhesive layer to obtain the pressure-sensitive adhesive tape.
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| KR102315705B1 (en) * | 2020-06-17 | 2021-10-21 | 주식회사 켐코 | Manufacturing method of adhesive composition with improved heat-resistance |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103237657A (en) * | 2010-12-06 | 2013-08-07 | 柯尼卡美能达株式会社 | Gas-barrier film, method for producing gas-barrier film, and electronic device |
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| CN111518482A (en) * | 2020-05-06 | 2020-08-11 | 广东弘擎电子材料科技有限公司 | High-performance acrylic acid foaming body adhesive tape and preparation method thereof |
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