CN119069408B - Wafer positioning system, method and device applied to semiconductor manufacturing process - Google Patents
Wafer positioning system, method and device applied to semiconductor manufacturing process Download PDFInfo
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Abstract
本申请提供了一种应用于半导体制造过程中的晶圆的定位系统、方法和装置，在本申请中，设置有三个光电传感器，并且，二维坐标系也是根据三个光电传感器的位置设定的，三个光电传感器距离原点的距离是相等的，在将晶圆放置到晶圆承载圆盘上后，可以通过三个光电传感器确定出晶圆边缘与二维坐标系X轴和Y轴相交的点，从而确定出晶圆当前的圆心，由于晶圆的豁口被光电传感器检测到时，会是检测到的光电传感器与豁口之间的距离明显大于其他传感器到晶圆边缘的距离，利用这一原理可以确定出豁口所在位置，从而可以得到偏移量和偏转角度，进而可以对晶圆抓取机械臂进行定位修正，通过本申请有利于提高半导体的成品率。
The present application provides a wafer positioning system, method and device for use in a semiconductor manufacturing process. In the present application, three photoelectric sensors are provided, and a two-dimensional coordinate system is also set according to the positions of the three photoelectric sensors. The three photoelectric sensors are equidistant from the origin. After the wafer is placed on a wafer carrying disc, the three photoelectric sensors can be used to determine the point where the wafer edge intersects the X-axis and Y-axis of the two-dimensional coordinate system, thereby determining the current center of the wafer. When a notch in the wafer is detected by a photoelectric sensor, the distance between the detected photoelectric sensor and the notch is significantly greater than the distance from other sensors to the wafer edge. This principle can be used to determine the location of the notch, thereby obtaining an offset and a deflection angle, and then the wafer grabbing robot arm can be positioned and corrected. The present application is beneficial for improving the yield of semiconductors.
Description
Technical Field
The present application relates to the field of semiconductor technology, and in particular, to a system, a method and a device for positioning a wafer in a semiconductor manufacturing process.
Background
In the flow of semiconductor manufacturing, precise positioning of wafers is a critical element. The accuracy and stability of this link directly affects the quality and yield of the final semiconductor product. Wafers are typically transported and placed by automated handling equipment, such as overhead travelling crane systems, however, slight rotation and positional misalignment of the wafers during transport may occur due to various factors during operation, such as mechanical vibration, load imbalance, or operational errors. Such movement may result in a change in orientation of the locating notch on the wafer, thereby making subsequent processing steps inaccurate in alignment, and even resulting in damage to the wafer during processing or incorrect completion of packaging, thereby significantly reducing the yield of the semiconductor.
At present, although various wafer handling and positioning devices exist in the market, the problems of insufficient positioning precision, poor stability or poor adaptability are generally faced. Particularly, under the background that the diameter of a wafer is continuously increased and the integration level is continuously improved, the requirements on positioning accuracy are increasingly strict, and the requirements on higher standards are difficult to meet by the existing technical means. Therefore, a positioning method for ensuring accurate alignment of wafers is sought, which becomes a key technical subject for improving the quality of semiconductor products.
Disclosure of Invention
In view of the above, the embodiments of the present application provide a system, a method and a device for positioning a wafer in a semiconductor manufacturing process, so as to improve the yield of semiconductors.
In a first aspect, an embodiment of the present application provides a positioning system applied to a wafer in a semiconductor manufacturing process, where the positioning system includes a positioning device and a wafer grabbing mechanical arm, where the positioning device includes a first photosensor, a second photosensor, a third photosensor, a wafer carrying disc, a servo motor and a processor, where the servo motor is used to drive the wafer carrying disc to rotate, where a position connection line of the second photosensor and the third photosensor is perpendicular to an X axis in a three-axis coordinate system corresponding to the wafer grabbing mechanical arm, where the third photosensor is located on a side close to a center line of the wafer grabbing mechanical arm, where the first photosensor is located on a center line of the second photosensor and the third photosensor, where coordinates of the first photosensor are (X1, 0), coordinates of the second photosensor are (0, Y1), coordinates of the third photosensor are (Y1, Y1), and coordinates of the wafer carrying disc are located on a two-dimensional coordinate system constructed by taking a center line of the center line as an origin, where the first photosensor is located on a two-dimensional coordinate system, where the coordinates of the second photosensor are (X1, Y1 and the wafer carrying disc are located on a wafer carrying disc and the same radius as a radius of the wafer carrying disc, and the wafer carrying on a radius of the wafer carrying disc is placed on a high order to be equal to the wafer carrying radius of the wafer carrying disc, and the processor is respectively in communication connection with the first photoelectric sensor, the second photoelectric sensor, the third photoelectric sensor, the servo motor and the wafer grabbing mechanical arm, wherein the first photoelectric sensor is used for measuring the distance between an edge point on an X axis of a two-dimensional coordinate system and the first photoelectric sensor on one side of the wafer, which is close to the first photoelectric sensor, the second photoelectric sensor is used for measuring the distance between an edge point on a Y axis of the two-dimensional coordinate system and the second photoelectric sensor on one side of the wafer, which is close to the second photoelectric sensor, and the third photoelectric sensor is used for measuring the distance between an edge point on the Y axis of the two-dimensional coordinate system and the third photoelectric sensor on one side of the wafer, which is close to the third photoelectric sensor.
Optionally, the wafer bearing disc is provided with a plurality of negative pressure holes, the negative pressure holes are communicated with a negative pressure system, and the negative pressure system adsorbs the wafer placed on the wafer bearing disc through the negative pressure holes.
Optionally, the processor is a programmable logic controller.
In a second aspect, an embodiment of the present application provides a positioning method applied to a wafer in a semiconductor manufacturing process, the positioning method being applied to the positioning system according to any one of the first aspects, the positioning method running in the processor, the positioning method comprising:
After the wafer grabbing mechanical arm places the wafer on the wafer carrying disc, a first distance d1 from the edge of the wafer measured by the first photoelectric sensor, a second distance d2 from the edge of the wafer measured by the second photoelectric sensor and a third distance d3 from the edge of the wafer measured by the third photoelectric sensor are obtained;
Determining a first coordinate (X1-d 1, 0) of a first edge point on an X-axis of the two-dimensional coordinate system on a side of the wafer near the first photosensor when the wafer is in an initial state of the wafer-carrying disk according to the first distance d1, and determining a second coordinate (0, Y1-d 2) of a second edge point on a Y-axis of the two-dimensional coordinate system on a side of the wafer near the second photosensor when the wafer is in an initial state of the wafer-carrying disk according to the second distance d2, and determining a third coordinate (0, - (Y1-d 3)) of a third edge point on a-Y-axis of the two-dimensional coordinate system on a side of the wafer near the third photosensor according to the third distance d 3;
calculating initial center coordinates of the wafer on the two-dimensional coordinate system according to the following formula ,):
;
;
Determining whether the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system according to the following target formula:
;
Wherein, The wafer is carried with the rotation angle of the disc whenWhen the target formulas are unequal, determining that the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system;
calculating the rotation angle of the wafer carrying disc according to the following formula When the wafer is in the two-dimensional coordinate system, the center coordinates of the target:
;
;
And calculating the vector from the center coordinates of the target to the positioning notch according to the following formula:
;
wherein d4 is the rotation angle of the wafer carrying disc When the third photoelectric sensor measures a fourth distance from the edge of the wafer;
determining the rotation angle of the wafer carrying disc as follows When the vector isCosine included angle between the two-dimensional coordinate system and Y axis:
;
Wherein, A unit vector of a Y axis of the two-dimensional coordinate system;
Controlling the wafer grabbing mechanical arm to be within the range of the locating coordinates ,,Z,a,b,) Positioning and grabbing the wafer;
wherein, the placement coordinates of the wafer grabbing mechanical arm are as follows ,,Z,a,b,)。
Optionally, the wafer bearing disc is provided with a plurality of negative pressure holes, the negative pressure holes are communicated with a negative pressure system, and the negative pressure system adsorbs the wafer placed on the wafer bearing disc through the negative pressure holes.
Optionally, the processor is communicatively connected to the negative pressure system, the method further comprising:
When the wafer grabbing mechanical arm places a wafer on the wafer bearing disc, controlling the negative pressure system to generate negative pressure;
And when the wafer grabbing mechanical arm grabs the wafer on the wafer bearing disc, controlling the negative pressure system to close the negative pressure.
Optionally, the processor is a programmable logic controller.
In a third aspect, an embodiment of the present application provides a positioning device applied to a wafer in a semiconductor manufacturing process, where the positioning device is applied to the processor of the positioning system according to any one of the first aspects, and the positioning device includes:
The acquisition unit is used for acquiring a first distance d1 to the edge of the wafer measured by the first photoelectric sensor, a second distance d2 to the edge of the wafer measured by the second photoelectric sensor and a third distance d3 to the edge of the wafer measured by the third photoelectric sensor after the wafer is placed on the wafer carrying disc by the wafer grabbing mechanical arm;
A determining unit configured to determine, according to the first distance d1, a first coordinate (X1-d 1, 0) of a first edge point on an X-axis of the two-dimensional coordinate system in a side of the wafer near the first photosensor when the wafer is in an initial state of the wafer carrying disk, and determine, according to the second distance d2, a second coordinate (0, Y1-d 2) of a second edge point on a Y-axis of the two-dimensional coordinate system in a side of the wafer near the second photosensor when the wafer is in an initial state of the wafer carrying disk, and determine, according to the third distance d3, a third coordinate (0, - (Y1-d 3)) of a third edge point on a-Y-axis of the two-dimensional coordinate system in a side of the wafer near the third photosensor when the wafer is in an initial state of the wafer carrying disk;
a first calculation unit for calculating initial center coordinates of the wafer on the two-dimensional coordinate system according to the following formula ,):
;
;
The judging unit is used for determining whether the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system according to the following target formula:
;
Wherein, The wafer is carried with the rotation angle of the disc whenWhen the target formulas are unequal, determining that the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system;
a second calculating unit for calculating the rotation angle of the wafer carrying disc according to the following formula When the wafer is in the two-dimensional coordinate system, the center coordinates of the target:
;
;
The third calculation unit is used for calculating the vector from the center coordinates of the target to the positioning notch according to the following formula:
;
wherein d4 is the rotation angle of the wafer carrying disc When the third photoelectric sensor measures a fourth distance from the edge of the wafer;
a fourth calculation unit for determining the rotation angle of the wafer carrying disc as follows When the vector isCosine included angle between the two-dimensional coordinate system and Y axis:
;
Wherein, A unit vector of a Y axis of the two-dimensional coordinate system;
the first control unit is used for controlling the wafer grabbing mechanical arm to be within the range of the locating coordinates ,,Z,a,b,) Positioning and grabbing the wafer;
wherein, the placement coordinates of the wafer grabbing mechanical arm are as follows ,,Z,a,b,)。
Optionally, the wafer bearing disc is provided with a plurality of negative pressure holes, the negative pressure holes are communicated with a negative pressure system, and the negative pressure system adsorbs the wafer placed on the wafer bearing disc through the negative pressure holes.
Optionally, the processor is communicatively connected to the negative pressure system, and the apparatus further comprises:
The wafer grabbing mechanical arm is used for grabbing the wafer on the wafer bearing disc, the second control unit is used for controlling the negative pressure system to generate negative pressure after the wafer grabbing mechanical arm places the wafer on the wafer bearing disc, and the negative pressure system is controlled to be closed when the wafer grabbing mechanical arm grabs the wafer on the wafer bearing disc.
The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:
In the application, three photoelectric sensors are arranged, the two-dimensional coordinate system is also set according to the positions of the three photoelectric sensors, the distances between the three photoelectric sensors and the origin are equal, after a wafer is placed on a wafer bearing disc, the points where the edge of the wafer intersects with the X axis and the Y axis of the two-dimensional coordinate system can be determined through the three photoelectric sensors, so that the current circle center of the wafer is determined, and when the opening of the wafer is detected by the photoelectric sensors, the distance between the detected photoelectric sensors and the opening is obviously larger than the distances between other sensors and the edge of the wafer, and the position of the opening can be determined by utilizing the principle, so that the offset and the deflection angle can be obtained, and further, the wafer grabbing mechanical arm can be positioned and corrected, so that the wafer grabbing mechanical arm can position and grab the wafer by using corrected data, and the position and the angle of the wafer entering the next process are relatively accurate, thereby being beneficial to improving the yield of semiconductors.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a wafer positioning system for use in a semiconductor manufacturing process according to an embodiment of the present application;
Fig. 2 is a flowchart of a wafer positioning method applied in a semiconductor manufacturing process according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a positioning device for a wafer in a semiconductor manufacturing process according to an embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
Fig. 1 is a schematic diagram of a positioning system for a wafer in a semiconductor manufacturing process according to an embodiment of the present application, where, as shown in fig. 1, the positioning system includes a positioning device and a wafer grabbing mechanical arm, and the positioning device includes: the first photoelectric sensor, the second photoelectric sensor, the third photoelectric sensor, the wafer carrying disc, a servo motor (not shown in figure 1) and a processor (not shown in figure 1), wherein the servo motor is used for driving the wafer carrying disc to rotate, the position connecting line of the second photoelectric sensor and the third photoelectric sensor is perpendicular to an X axis in a three-axis coordinate system corresponding to the wafer grabbing mechanical arm, the third photoelectric sensor is positioned at one side close to the wafer grabbing mechanical arm, the first photoelectric sensor is positioned on the central line of the second photoelectric sensor and the third photoelectric sensor, in a two-dimensional coordinate system which is constructed by taking the central line as the X axis and taking the midpoint of the second photoelectric sensor and the third photoelectric sensor as an origin, the coordinates of the first photoelectric sensor are (X1, 0), the coordinates of the second photoelectric sensor are (0, Y1), the coordinates of the third photoelectric sensor are (0, -Y1), the values corresponding to X1, Y1 and-Y1 are equal and larger than the radius R of the wafer, the origin of the two-dimensional coordinate system is overlapped with the circle center of the wafer bearing disc, the heights of the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor are equal to the height of the wafer placed on the wafer bearing disc, the wafer grabbing mechanical arm is used for placing the wafer conveyed by the conveying guide rail of the upstream process on the wafer bearing disc, and the processor is respectively in communication connection with the first photoelectric sensor, the second photoelectric sensor, the third photoelectric sensor, the servo motor and the wafer grabbing mechanical arm, wherein the first photoelectric sensor is used for measuring the distance between an edge point on an X axis of a two-dimensional coordinate system and the first photoelectric sensor on one side of the wafer, which is close to the first photoelectric sensor, the second photoelectric sensor is used for measuring the distance between an edge point on a Y axis of the two-dimensional coordinate system and the second photoelectric sensor on one side of the wafer, which is close to the second photoelectric sensor, and the third photoelectric sensor is used for measuring the distance between an edge point on the Y axis of the two-dimensional coordinate system and the third photoelectric sensor on one side of the wafer, which is close to the third photoelectric sensor.
Specifically, as shown in fig. 1, the positioning device includes a wafer bearing disc, the area of the wafer bearing disc is smaller than that of the wafer, the wafer bearing disc is used for placing the wafer, so that the positioning device positions the wafer to determine the offset and the offset angle of the circle center of the wafer, three photoelectric sensors are arranged around the wafer bearing disc, namely, a first photoelectric sensor, a second photoelectric sensor and a third photoelectric sensor, wherein the third photoelectric sensor is arranged at one side close to the wafer grabbing mechanical arm, the connecting line of the arrangement positions of the second photoelectric sensor and the third photoelectric sensor is perpendicular to the X axis in the three-axis coordinate system corresponding to the wafer grabbing mechanical arm, and the first photoelectric sensor is arranged on the central line of the second photoelectric sensor and the third photoelectric sensor, namely: the second and third photoelectric sensors are arranged on the Y axis of the two-dimensional coordinate system, the first photoelectric sensor is arranged on the X axis of the two-dimensional coordinate system, the distances between the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor and the origin of the two-dimensional coordinate system are equal, the distances are larger than the radius R of the wafer, the origins of the two-dimensional coordinate system are overlapped with the circle center of the wafer carrying disc, namely, the distances between the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor and the circle center of the wafer carrying disc are equal, namely, the coordinates of the position of the first photoelectric sensor in the two-dimensional coordinate system are (X1, 0), the coordinates of the position of the second photoelectric sensor in the two-dimensional coordinate system are (0, Y1), the coordinates of the position of the third photoelectric sensor in the two-dimensional coordinate system are (0, -Y1), the corresponding values of X1, Y1 and-Y1 are equal and larger than the radius R of the wafer, the heights of the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor are equal to the heights of the wafer placed on the wafer bearing disc, so that light rays emitted by any photoelectric sensor can be reflected back after being irradiated on the edge of the wafer, and related data are acquired.
The servo motor can drive the wafer bearing disc to rotate, and the photoelectric sensor can acquire the coordinates of the intersection point of the edge of the wafer and the two-dimensional coordinate system through rotation, so that the movement track of the circle center of the wafer is calculated, whether the positioning opening of the wafer is currently positioned in the negative direction of the Y axis of the two-dimensional coordinate system is detected, and therefore the offset and the offset angle of the circle center of the wafer are determined when the positioning opening of the wafer is currently positioned in the negative direction of the Y axis of the two-dimensional coordinate system.
When it is required to be described, the setting position of the servo motor and the connection manner with the wafer carrying disc may be set according to the type and rotation manner of the servo motor, which is not particularly limited herein.
Before the wafer is transferred from the previous process to the next process, the wafer is required to be placed on a wafer carrying disc through a wafer grabbing mechanical arm to be positioned, then the wafer is placed at the starting position of the next process according to the positioned coordinates, and is transported through the crown block system, before the wafer is positioned, the grabbing positions of the wafer grabbing mechanical arm are (0, z, a, b, 0) in sequence, the offset distance of the wafer grabbing mechanical arm on the X axis is 0, the offset distance of the wafer grabbing mechanical arm on the Y axis is 0 when the wafer grabbing mechanical arm grabs the wafer, the up-down distance of the wafer grabbing mechanical arm relative to the wafer carrying platform is z, the rotation angle of the wafer grabbing mechanical arm along the X axis in the three-axis coordinate system is a, the rotation angle of the wafer grabbing mechanical arm along the Y axis in the three-axis coordinate system is b, and the rotation angle of the wafer grabbing mechanical arm C axis is 0.
The positioning device also comprises a processor, any photoelectric sensor can send acquired data to the processor, so that the processor can control whether the servo motor continues to rotate or not through the acquired data, and send a control instruction to the wafer grabbing mechanical arm so as to control the wafer grabbing mechanical arm to grab a wafer according to the positioned coordinates, further, after the wafer is placed on the wafer bearing disc, the processor controls the servo motor to rotate and acquires data acquired by the photoelectric sensor according to a preset period, and when the processor calculates that the positioning notch of the wafer is positioned in the negative direction of the Y axis of the two-dimensional coordinate system, the servo motor is controlled to stop rotating, and a control instruction is sent to the wafer grabbing mechanical arm so as to control the wafer grabbing mechanical arm to grab the wafer according to the positioned coordinates. As shown in fig. 1, the processor may communicate with the wafer grabbing mechanical arm through a communication line, so as to ensure the instantaneity and accuracy of the communication.
In one possible embodiment, the wafer carrying disc is provided with a plurality of negative pressure holes, and the negative pressure holes are communicated with a negative pressure system, and the negative pressure system adsorbs the wafer placed on the wafer carrying disc through the negative pressure holes.
Specifically, the negative pressure system can generate negative pressure to the wafer placed on the wafer carrying disc through the negative pressure hole, so that the wafer is adsorbed on the wafer carrying disc, the wafer is placed to move or even fall when the wafer carrying disc rotates, the negative pressure system can provide negative pressure of more than 0.6Mpa, the negative pressure system can generate negative pressure when the wafer is arranged on the wafer carrying disc, the negative pressure can also be generated in real time, and the size and the working mode of the negative pressure specifically provided by the negative pressure system can be set according to actual needs, so that the negative pressure is not specifically limited.
In one possible embodiment, the processor is a programmable logic controller, wherein the programmable logic controller may be specifically of the Siemens1200 series.
Fig. 2 is a flowchart of a positioning method for a wafer in a semiconductor manufacturing process according to an embodiment of the present application, where the positioning method is applied to the positioning system shown in fig. 1, and the positioning method is run in a processor, and as shown in fig. 2, the positioning method includes the following steps:
step 201, after the wafer grabbing mechanical arm places the wafer on the wafer carrying disc, a first distance d1 to the edge of the wafer measured by the first photoelectric sensor, a second distance d2 to the edge of the wafer measured by the second photoelectric sensor, and a third distance d3 to the edge of the wafer measured by the third photoelectric sensor are obtained.
Step 202, determining, according to the first distance d1, a first coordinate (X1-d 1, 0) of a first edge point on an X-axis of the two-dimensional coordinate system on a side of the wafer near the first photosensor when the wafer is in an initial state of the wafer carrying disk, and determining, according to the second distance d2, a second coordinate (0, Y1-d 2) of a second edge point on a Y-axis of the two-dimensional coordinate system on a side of the wafer near the second photosensor when the wafer is in an initial state of the wafer carrying disk, and determining, according to the third distance d3, a third coordinate (0, - (Y1-d 3)) of a third edge point on a-Y-axis of the two-dimensional coordinate system on a side of the wafer near the third photosensor when the wafer is in an initial state of the wafer carrying disk.
Step 203, calculating the initial center coordinates of the wafer on the two-dimensional coordinate system according to the following formula,):
;
(Equation I)
Step 204, determining whether the positioning notch of the wafer is currently located on the Y axis of the two-dimensional coordinate system according to the following target formula:
;
Wherein, The wafer is carried with the rotation angle of the disc whenAnd when the target formulas are unequal, determining that the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system.
Step 205, calculating the rotation angle of the wafer carrying disc according to the following formula IIWhen the wafer is in the two-dimensional coordinate system, the center coordinates of the target:
;
(equation II)
Step 206, calculating a vector from the center coordinates of the target to the positioning notch according to the following formula III:
(equation III)
Wherein d4 is the rotation angle of the wafer carrying discAnd the fourth distance to the edge of the wafer measured by the third photoelectric sensor.
Step 207, determining that the rotation angle of the wafer carrying disc is according to the following formula fourWhen the vector isCosine included angle between the two-dimensional coordinate system and Y axis:
(equation IV)
Wherein, Is a unit vector of the Y axis of the two-dimensional coordinate system.
Step 208, controlling the wafer grabbing mechanical arm to achieve the following positioning coordinates,,Z,a,b,) Positioning and grabbing the wafer;
wherein, the placement coordinates of the wafer grabbing mechanical arm are as follows ,,Z,a,b,)。
Specifically, as shown in fig. 2, after the wafer is grasped by the wafer grasping mechanical arm, the wafer needs to be placed on the wafer carrying disc, and at this time, the placement coordinate of the wafer grasping mechanical arm is @, which is shown as @,,Z,a,b,) After the wafer is placed on the wafer carrying disc, the offset and the rotation amount of the wafer relative to the standard position (namely, the circle center of the wafer is overlapped with the circle center of the wafer carrying disc, the positioning opening of the wafer is positioned in the Y-axis negative direction of the two-dimensional coordinate system) are unknown, when the initial state of the wafer on the wafer carrying disc is obtained through three photoelectric sensors, the distance between the edge of the wafer and each photoelectric sensor is obtained, because the distance between the three photoelectric sensors and the origin of the two-dimensional coordinate system is known, and the distance between each photoelectric sensor and the edge corresponding to the wafer can also be obtained through the three photoelectric sensors, so that the coordinate of the intersection point of the edge of the wafer and the two-dimensional coordinate system in the initial state of the wafer on the wafer carrying disc can be obtained, then the wafer center coordinate (namely, the initial circle center coordinate) relative to the two-dimensional coordinate system in the initial state of the wafer on the wafer carrying disc can be respectively determined through the first formula, the servo motor can determine the distance between the edge of the wafer and the Y-axis negative coordinate system in the three-dimensional coordinate system in the rotating process, and the third angle relative to the initial state of the two-dimensional coordinate system in the three-dimensional direction d can be determined during the rotating process(I.e., the rotation angle of the wafer-carrying disk), then a third distance d3 and the rotation angleWhen the target formula is brought into, the determined third distance d3 is larger relative to other positions of the wafer when the positioning notch of the wafer is positioned in the negative Y-axis direction of the two-dimensional coordinate system, so that the target formula is not established any more, when the target formula is not established any more, the positioning notch of the wafer at the moment can be determined to be positioned in the negative Y-axis direction of the two-dimensional coordinate system, and then the corresponding rotation angle at the moment is set asThe second formula is carried in, the coordinate (namely, the target circle center coordinate) of the wafer center at the moment when the positioning opening of the wafer is positioned in the Y-axis negative direction of the two-dimensional coordinate system can be determined, after the target circle center coordinate is obtained, the target circle center coordinate is carried in the third formula, when the positioning opening of the wafer is positioned in the Y-axis negative direction of the two-dimensional coordinate system, the vector of the target circle center coordinate to the positioning opening is determined, and then the vector is carried in the fourth formula, and the cosine included angle is determinedAt this time, the center coordinates of the target circle represent the offset and the cosine included angle represent the rotation, then the placement coordinates of the wafer grabbing mechanical arm are adjusted through the offset and the rotation, and the adjusted coordinates are used as grabbing coordinates to grab the wafer, so that after the wafer grabbing mechanical arm grabs the wafer according to the adjusted grabbing coordinates, the offset and the rotation of the wafer can be eliminated when the wafer is placed on the next process, and the yield of the semiconductor is provided.
Wherein, Cosine angleIs vector quantityThe included angle between the two-dimensional coordinate system and the Y axis of the two-dimensional coordinate system is converted to obtain the following result:
After obtaining After the value of (2), it can be determined thatSpecific values of (3).
On the basis of the positioning system, the application also provides a set of corresponding positioning method, after corresponding data are acquired through the positioning system, the processor positions the wafer by utilizing the acquired data, so that the wafer grabbing mechanical arm grabs the wafer by the new positioning data, and the wafer grabbing mechanical arm can eliminate offset and rotation when the wafer is placed on the next process, thereby providing the yield of semiconductors.
In one possible embodiment, the wafer carrying disc is provided with a plurality of negative pressure holes, and the negative pressure holes are communicated with a negative pressure system, and the negative pressure system adsorbs the wafer placed on the wafer carrying disc through the negative pressure holes.
In one possible embodiment, the processor is communicatively connected to the negative pressure system, the method further comprising:
When the wafer grabbing mechanical arm places a wafer on the wafer bearing disc, controlling the negative pressure system to generate negative pressure;
And when the wafer grabbing mechanical arm grabs the wafer on the wafer bearing disc, controlling the negative pressure system to close the negative pressure.
In one possible implementation, the processor is a programmable logic controller.
Fig. 3 is a schematic structural diagram of a positioning device for a wafer in a semiconductor manufacturing process according to an embodiment of the present application, where the positioning device is applied to the processor of the positioning system shown in fig. 1, and as shown in fig. 3, the positioning device includes:
an obtaining unit 31, configured to obtain, after the wafer grabbing mechanical arm places the wafer on the wafer carrying disc, a first distance d1 to the edge of the wafer measured by the first photoelectric sensor, a second distance d2 to the edge of the wafer measured by the second photoelectric sensor, and a third distance d3 to the edge of the wafer measured by the third photoelectric sensor;
A determining unit 32 configured to determine, according to the first distance d1, a first coordinate (X1-d 1, 0) of a first edge point on an X-axis of the two-dimensional coordinate system on a side of the wafer near the first photosensor when the wafer is in an initial state of the wafer carrying disk, and determine, according to the second distance d2, a second coordinate (0, Y1-d 2) of a second edge point on a Y-axis of the two-dimensional coordinate system on a side of the wafer near the second photosensor when the wafer is in an initial state of the wafer carrying disk, and determine, according to the third distance d3, a third coordinate (0, - (Y1-d 3)) of a third edge point on a-Y-axis of the two-dimensional coordinate system on a side of the wafer near the third photosensor when the wafer is in an initial state of the wafer carrying disk;
a first calculation unit 33 for calculating initial center coordinates of the wafer on the two-dimensional coordinate system according to the following formula ,):
;
;
The judging unit 34 determines whether the positioning notch of the wafer is currently located on the Y axis of the two-dimensional coordinate system according to the following target formula:
;
Wherein, The wafer is carried with the rotation angle of the disc whenWhen the target formulas are unequal, determining that the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system;
A second calculating unit 35 for calculating the rotation angle of the wafer carrying disc according to the following formula When the wafer is in the two-dimensional coordinate system, the center coordinates of the target:
;
;
the third calculating unit 36 is configured to calculate a vector from the center coordinates of the target to the positioning gap according to the following formula:
;
wherein d4 is the rotation angle of the wafer carrying disc When the third photoelectric sensor measures a fourth distance from the edge of the wafer;
a fourth calculating unit 37 for determining the rotation angle of the wafer carrying disc as follows When the vector isCosine included angle between the two-dimensional coordinate system and Y axis:
;
Wherein, A unit vector of a Y axis of the two-dimensional coordinate system;
A first control unit 38 for controlling the wafer gripping robot to adjust the positioning coordinates to be% ,,Z,a,b,) Positioning and grabbing the wafer;
wherein, the placement coordinates of the wafer grabbing mechanical arm are as follows ,,Z,a,b,)。
In one possible embodiment, the wafer carrying disc is provided with a plurality of negative pressure holes, and the negative pressure holes are communicated with a negative pressure system, and the negative pressure system adsorbs the wafer placed on the wafer carrying disc through the negative pressure holes.
In one possible embodiment, the processor is communicatively connected to the negative pressure system, the apparatus further comprising:
The wafer grabbing mechanical arm is used for grabbing the wafer on the wafer bearing disc, the second control unit is used for controlling the negative pressure system to generate negative pressure after the wafer grabbing mechanical arm places the wafer on the wafer bearing disc, and the negative pressure system is controlled to be closed when the wafer grabbing mechanical arm grabs the wafer on the wafer bearing disc.
The relevant principles with respect to fig. 3 may be explained with reference to the correlations in fig. 1 and 2, and will not be explained in detail here.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments provided in the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. The storage medium includes a U disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, an optical disk, or other various media capable of storing program codes.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined in one figure, no further definition or explanation of that in the following figures is necessary, and furthermore, the terms "first," "second," "third," etc. are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
It should be noted that the foregoing embodiments are merely illustrative embodiments of the present application, and not restrictive, and the scope of the application is not limited to the embodiments, and although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that any modification, variation or substitution of some of the technical features of the embodiments may be made within the technical scope of the present application disclosed in the present application, and the spirit, the scope and the scope of the technical aspects of the embodiments do not deviate from the spirit and scope of the technical aspects of the embodiments. Are intended to be encompassed within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (4)
1. A positioning method applied to a wafer in a semiconductor manufacturing process is characterized in that the positioning method is applied to a positioning system, the positioning system comprises a positioning device and a wafer grabbing mechanical arm, the positioning device comprises a first photoelectric sensor, a second photoelectric sensor, a third photoelectric sensor, a wafer bearing disc, a servo motor and a processor, the servo motor is used for driving the wafer bearing disc to rotate, a position connecting line of the second photoelectric sensor and the third photoelectric sensor is perpendicular to an X axis in a triaxial coordinate system corresponding to the wafer grabbing mechanical arm, the third photoelectric sensor is positioned on one side close to the wafer grabbing mechanical arm, the first photoelectric sensor is positioned on a central line of the second photoelectric sensor and the third photoelectric sensor, in a two-dimensional coordinate system constructed by taking the central line as an X axis and taking the midpoint of the second photoelectric sensor and the third photoelectric sensor as an origin, the coordinates of the first photoelectric sensor are (X1 and 0), the coordinates of the second photoelectric sensor are (0 and Y1), the coordinates of the third photoelectric sensor are perpendicular to an X axis in a three-dimensional coordinate system corresponding to the wafer bearing disc, the wafer bearing disc is placed on a wafer bearing disc with a radius of the X1 and the wafer bearing disc, the wafer bearing disc is placed on a wafer bearing disc with a radius of the same value as the radius of the wafer bearing disc, and the wafer bearing disc is placed on a wafer bearing disc is 1, and a transport rail for gripping the wafer on the wafer carrying disc to a downstream process after positioning is completed, the processor being in communication connection with the first photosensor, the second photosensor, the third photosensor, the servo motor and the wafer gripping robot arm, respectively, the first photosensor being for measuring a distance between an edge point on an X-axis of the two-dimensional coordinate system and the first photosensor in a side of the wafer near the first photosensor, the second photosensor being for measuring a distance between an edge point on a Y-axis of the two-dimensional coordinate system and the second photosensor in a side of the wafer near the second photosensor, the third photosensor being for measuring a distance between an edge point on a Y-axis of the two-dimensional coordinate system and the third photosensor in a side of the wafer near the third photosensor, the positioning method running in the processor, the positioning method comprising:
After the wafer grabbing mechanical arm places the wafer on the wafer carrying disc, a first distance d1 from the edge of the wafer measured by the first photoelectric sensor, a second distance d2 from the edge of the wafer measured by the second photoelectric sensor and a third distance d3 from the edge of the wafer measured by the third photoelectric sensor are obtained;
Determining a first coordinate (X1-d 1, 0) of a first edge point on an X-axis of the two-dimensional coordinate system on a side of the wafer near the first photosensor when the wafer is in an initial state of the wafer-carrying disk according to the first distance d1, and determining a second coordinate (0, Y1-d 2) of a second edge point on a Y-axis of the two-dimensional coordinate system on a side of the wafer near the second photosensor when the wafer is in an initial state of the wafer-carrying disk according to the second distance d2, and determining a third coordinate (0, - (Y1-d 3)) of a third edge point on a-Y-axis of the two-dimensional coordinate system on a side of the wafer near the third photosensor according to the third distance d 3;
calculating initial center coordinates of the wafer on the two-dimensional coordinate system according to the following formula ,):
;
;
Determining whether the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system according to the following target formula:
;
Wherein, The wafer is carried with the rotation angle of the disc whenWhen the target formulas are unequal, determining that the positioning notch of the wafer is currently positioned on the Y axis of the two-dimensional coordinate system;
calculating the rotation angle of the wafer carrying disc according to the following formula When the wafer is in the two-dimensional coordinate system, the center coordinates of the target:
;
;
And calculating the vector from the center coordinates of the target to the positioning notch according to the following formula:
;
wherein d4 is the rotation angle of the wafer carrying disc When the third photoelectric sensor measures a fourth distance from the edge of the wafer;
determining the rotation angle of the wafer carrying disc as follows When the vector isCosine included angle between the two-dimensional coordinate system and Y axis:
;
Wherein, A unit vector of a Y axis of the two-dimensional coordinate system;
Controlling the wafer grabbing mechanical arm to be within the range of the locating coordinates ,,Z,a,b,) The wafer is positioned and grabbed, wherein,An offset distance on the X axis when the wafer grabbing mechanical arm grabs the wafer,Z is the vertical distance between the wafer grabbing mechanical arm and the wafer carrying platform, a is the rotation angle of the wafer grabbing mechanical arm along the X axis in the three-axis coordinate system, b is the rotation angle of the wafer grabbing mechanical arm along the Y axis in the three-axis coordinate system,The rotation angle of the C axis of the wafer grabbing mechanical arm is set;
wherein, the placement coordinates of the wafer grabbing mechanical arm are as follows ,,Z,a,b,)。
2. The positioning method of claim 1, wherein the wafer carrier disk is provided with a plurality of negative pressure holes, the negative pressure holes being in communication with a negative pressure system that adsorbs wafers placed on the wafer carrier disk through the negative pressure holes.
3. The positioning method of claim 2 wherein the processor is communicatively coupled to the negative pressure system, the method further comprising:
When the wafer grabbing mechanical arm places a wafer on the wafer bearing disc, controlling the negative pressure system to generate negative pressure;
And when the wafer grabbing mechanical arm grabs the wafer on the wafer bearing disc, controlling the negative pressure system to close the negative pressure.
4. The positioning method of claim 1 wherein said processor is a programmable logic controller.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002246444A (en) * | 2001-02-20 | 2002-08-30 | Matsushita Electric Ind Co Ltd | Wafer position detection method and wafer position detection device |
| JP2021180337A (en) * | 2020-09-18 | 2021-11-18 | 東京エレクトロン株式会社 | Bonding apparatus, bonding system, bonding method, and computer storage medium |
| CN221826075U (en) * | 2024-01-17 | 2024-10-11 | 湖北江城芯片中试服务有限公司 | Wafer inspection equipment, robotic arms and semiconductor equipment |
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| JP3180357B2 (en) * | 1990-04-06 | 2001-06-25 | 株式会社ニコン | Apparatus and method for positioning circular substrate |
| CN103811387B (en) * | 2012-11-08 | 2016-12-21 | 沈阳新松机器人自动化股份有限公司 | Wafer pre-alignment method and device |
| CN117747518A (en) * | 2022-09-14 | 2024-03-22 | 盛美半导体设备(上海)股份有限公司 | Wafer centering adjusting device and adjusting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002246444A (en) * | 2001-02-20 | 2002-08-30 | Matsushita Electric Ind Co Ltd | Wafer position detection method and wafer position detection device |
| JP2021180337A (en) * | 2020-09-18 | 2021-11-18 | 東京エレクトロン株式会社 | Bonding apparatus, bonding system, bonding method, and computer storage medium |
| CN221826075U (en) * | 2024-01-17 | 2024-10-11 | 湖北江城芯片中试服务有限公司 | Wafer inspection equipment, robotic arms and semiconductor equipment |
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