CN119060797A - A kind of pickling liquid for glass wafer carrier blank and its preparation method and equipment - Google Patents
A kind of pickling liquid for glass wafer carrier blank and its preparation method and equipment Download PDFInfo
- Publication number
- CN119060797A CN119060797A CN202411175594.XA CN202411175594A CN119060797A CN 119060797 A CN119060797 A CN 119060797A CN 202411175594 A CN202411175594 A CN 202411175594A CN 119060797 A CN119060797 A CN 119060797A
- Authority
- CN
- China
- Prior art keywords
- stirring
- parts
- solution
- liquid
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005554 pickling Methods 0.000 title claims abstract description 64
- 239000011521 glass Substances 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000007788 liquid Substances 0.000 title claims description 89
- 238000003756 stirring Methods 0.000 claims abstract description 64
- 239000000654 additive Substances 0.000 claims abstract description 52
- 230000000996 additive effect Effects 0.000 claims abstract description 44
- 239000002105 nanoparticle Substances 0.000 claims abstract description 32
- 229920000642 polymer Polymers 0.000 claims abstract description 30
- 238000001914 filtration Methods 0.000 claims abstract description 25
- 238000004140 cleaning Methods 0.000 claims abstract description 24
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 38
- 230000007797 corrosion Effects 0.000 claims description 26
- 238000005260 corrosion Methods 0.000 claims description 26
- 239000003112 inhibitor Substances 0.000 claims description 22
- 239000002738 chelating agent Substances 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 19
- 239000004094 surface-active agent Substances 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 239000008367 deionised water Substances 0.000 claims description 18
- 229910021641 deionized water Inorganic materials 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 8
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 239000013618 particulate matter Substances 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 239000003344 environmental pollutant Substances 0.000 abstract description 7
- 231100000719 pollutant Toxicity 0.000 abstract description 7
- 239000006260 foam Substances 0.000 abstract description 4
- 229910021645 metal ion Inorganic materials 0.000 description 8
- 239000012459 cleaning agent Substances 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- BWVAOONFBYYRHY-UHFFFAOYSA-N [4-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=C(CO)C=C1 BWVAOONFBYYRHY-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention relates to the technical field of wafer pickling, and discloses a wafer glass slide blank pickling solution, a preparation method and equipment thereof, wherein the wafer glass slide blank pickling solution comprises the following components: the defoaming agent prevents a large amount of foam from being generated in the stirring and filtering processes, influences the operation efficiency and the quality of the pickling solution, the nanoparticle additive penetrates into micro gaps and pits on the surface of the wafer, is tightly combined with pollutants, and is used for cleaning the wafer glass slide blank to enhance the cleaning capability of the pickling solution and matching with the high polymer additive to adjust the viscosity of the solution, thereby improving the cleaning effect or protecting the surface of the wafer glass slide.
Description
Technical Field
The invention relates to the technical field of wafer pickling, in particular to a wafer glass slide blank pickling solution, and a preparation method and equipment thereof.
Background
A wafer glass carrier blank, commonly referred to simply as a wafer, is a substrate material used to support circuit patterns in semiconductor manufacturing. Such materials are typically made of high purity silicon or other semiconductor materials and are precision machined to maintain extremely high flatness and finish. Acid cleaning plays a critical role in semiconductor manufacturing and during the preparation, transportation and storage of wafer glass slide blanks, the surfaces may be contaminated with various contaminants such as dust, grease, metal ions, etc. These contaminants, if not removed in time, can seriously affect yield and product quality of subsequent semiconductor manufacturing processes. The acid washing can effectively remove various pollutants on the surface of the wafer glass slide blank by utilizing the strong corrosiveness of the acid liquid, so that the cleanliness of the surface of the wafer is ensured.
The prior Chinese patent (CN 106753836A) discloses a wafer back surface cleaning liquid which is prepared from the following raw materials, by weight, 11-22 parts of hydrogen peroxide, 15-19 parts of triethanolamine, 2-7 parts of a chelating agent, 100-220 parts of pure water, 16-20 parts of acetic acid, 12-15 parts of citric acid, 9-10 parts of formic acid, 25-30 parts of benzyl alcohol and 17-23 parts of terephthalyl alcohol. The invention has the advantages of simple preparation method, low production cost, no pollution to the environment, and capability of effectively removing dirt on the back of the wafer without damaging the wafer.
The cleaning liquid in the technical scheme is difficult to permeate into the micro gaps and the pits on the surface of the wafer in the use process, is tightly combined with pollutants, and is used for cleaning the wafer glass slide blank, so that the cleaning effect can not meet the use requirement.
Disclosure of Invention
The invention aims to provide a wafer glass slide blank pickling solution, and a preparation method and equipment thereof, so as to solve the problems in the background technology.
The wafer glass slide blank pickling solution comprises, by weight, 50-100 parts of hydrofluoric acid, 50-100 parts of a corrosion inhibitor, 5-30 parts of a surfactant, 5-30 parts of a chelating agent, 50-200 parts of deionized water, 10-20 parts of a defoaming agent, 5-10 parts of a nanoparticle additive and 5-10 parts of a high polymer additive.
Preferably, the nanoparticle additive is any one of nano alumina particles, nano zirconia particles or carbon nanotube particles.
Preferably, the polymer additive is any one of polystyrene polymer nanoparticles or polymethyl methacrylate polymer nanoparticles.
The preparation method of the wafer glass slide blank pickling solution comprises the following steps:
s1, preparing raw materials, namely preparing raw materials of hydrofluoric acid, a corrosion inhibitor, a surfactant, a chelating agent, deionized water, a defoaming agent, a nanoparticle additive and a high-molecular polymer additive according to the formula requirement;
S2, preparing a solution, mixing hydrofluoric acid, a surfactant, a chelating agent, deionized water and a defoaming agent in a proper container according to a certain proportion, and fully and uniformly stirring;
s3, adjusting the pH value, and adding a corrosion inhibitor to adjust the pH value of the solution according to the cleaning requirement;
S4, filtering, namely filtering the prepared pickling solution through a filter to remove impurities and particulate matters in the pickling solution;
s5, adding the raw materials for the second time, adding the nanoparticle additive and the high polymer additive into the solution, mixing, and fully and uniformly stirring;
and S6, storing, namely storing the prepared pickling solution in a storage barrel for sealing and storing.
Preferably, in S3, when the pH value is adjusted, the pH meter is first used to measure the initial pH value of the solution, and according to the measurement result and the formula requirement, a proper amount of corrosion inhibitor is slowly added, and stirring is continued and the pH value is measured until the target value is reached.
Preferably, in the process of adding the raw materials for the second time, the nano particle additive and the high polymer additive are added for a small amount of times, so that the additive added in the last time is ensured to be uniformly dispersed in the solution, and then the next time of adding and stirring is performed.
The utility model provides a device, includes the frame, be equipped with stirring district and the filtration district of intercommunication each other in the frame, still be equipped with liquid flow control device and liquid flow transfer device between stirring district and the filtration district, liquid flow control device is used for controlling the liquid flow break-make between stirring district and the filtration district, and liquid flow transfer device is used for transporting the liquid flow after the filtration district to the stirring district.
Preferably, a first table top and a second table top are arranged on the frame, a stirrer and a stirring cylinder are arranged in the stirring area, the stirring cylinder is arranged between the first table top and the second table top, a lifting table is further arranged between the stirring cylinder and the first table top, the stirrer is arranged on the lifting table, the top of the first table top is provided with a lifter, the shaft extension end of the lifter penetrates downwards through the first table top and is fixedly connected with the lifting table, a yielding hole matched with the stirrer is formed in the first table top, the lifter is arranged around the yielding hole, the shaft extension end of the stirrer penetrates downwards through the lifting table to be connected with a stirring shaft, the stirring shaft extends into the stirring cylinder and is uniformly provided with blades, a filter disc is arranged in the filtering area, an opening of the filter disc faces upwards, a filtering membrane is arranged in the filter disc, the bottom of the stirring cylinder is fixedly connected with a valve body, the valve body is fixedly connected with the frame through a support, one side of the top of the stirring cylinder is provided with a circulating port, the bottom end of the filter disc is further connected with a liquid outlet, and the liquid flow transferring device is used for transferring liquid flow from the liquid outlet to the circulating port.
The liquid flow transferring device comprises a storage station and a pickling pump, wherein the storage station is a piston cavity, a piston head is arranged in the piston cavity, a piston rod is inserted into one end of the piston cavity, one end of the piston rod is fixedly connected with the piston head, a reset spring is sleeved on the piston rod positioned in the piston cavity, a liquid inlet hole and a liquid outlet hole are formed in the other end of the piston cavity at the same time, an inlet end of the pickling pump is connected with the liquid outlet through a first guide pipe, an outlet end of the pickling pump is connected with the liquid inlet hole through a second guide pipe, the liquid outlet hole is connected with a circulating port through a third guide pipe, a one-way valve consistent with the liquid flow direction is arranged on the liquid inlet hole, and a control valve is arranged on the liquid outlet hole.
Preferably, the inlet end and the outlet end of the valve body are respectively provided with a threaded joint, the bottom end of the stirring cylinder is provided with a first threaded groove connected with the corresponding threaded joint, and the opening of the filter disc is provided with a second threaded groove connected with the corresponding threaded joint.
Compared with the prior art, the invention has the beneficial effects that:
The invention removes metal ions and oxides on the surface of the wafer glass slide by hydrofluoric acid in the wafer glass slide blank pickling solution. The corrosion inhibitor regulates the pH value of the solution, reduces the corrosion of hydrofluoric acid on the wafer glass slide, improves the cleaning effect, and the surfactant reduces the surface tension of the solution, enhances the wettability and permeability of the solution on the surface of the wafer glass slide, combines the chelating agent and metal ions to form a stable complex, helps to remove metal pollutants, takes deionized water as a solvent, ensures no impurity and ion interference in the pickling solution, prevents a large amount of foam from being generated in the stirring and filtering process, influences the operation efficiency and the quality of the pickling solution, and the nanoparticle additive is deeply penetrated into micro gaps and depressions on the surface of the wafer to be tightly combined with the pollutants so as to clean and enhance the cleaning capability of the pickling solution to the wafer glass slide blank and match with the polymer additive for regulating the viscosity of the solution, thereby improving the cleaning effect or protecting the surface of the wafer glass slide.
Drawings
FIG. 1 is a flow chart of a pickling solution preparation method provided by an embodiment of the invention;
FIG. 2 is a perspective view of an apparatus provided by an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an apparatus provided by an embodiment of the present invention;
FIG. 4 is an enlarged schematic view of the structure shown at A in FIG. 3;
fig. 5 is a schematic diagram of an embodiment of the present invention.
The figure shows that the device comprises a frame 1, a first table top 2, a yielding hole 201, a second table top 3, a lifting table 4, a valve body 5, a valve body 501, a first thread groove 502, a second thread groove 6, a pickling pump 7, a lifter 8, a stirrer 9, a stirring cylinder 901, a circulation port 10, a stirring shaft 11, blades 12, a piston cavity 1201, a liquid inlet hole 1202, a liquid outlet hole 13, a first guide pipe 14, a second guide pipe 15, a third guide pipe 16, a piston head 17, a piston rod 18, a return spring 19, a control valve 20, a one-way valve 21, a filter disc 2101, a liquid outlet 22 and a filter membrane.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
The first embodiment of the invention provides a technical scheme that the wafer glass slide blank pickling solution comprises hydrofluoric acid, a corrosion inhibitor, a surfactant, a chelating agent, deionized water, a defoaming agent, a nanoparticle additive and a high polymer additive.
Hydrofluoric acid is one of the most commonly used acidic components for wafer cleaning, particularly for glass or wafer surface oxides, because of its ability to dissolve silicate-based oxides, and corrosion inhibitors are important additives in cleaning agents for slowing down the rate of corrosion of acid or other corrosive components to the wafer glass slide blank substrate. Common corrosion inhibitors include organic amines, sodium hydroxide, potassium hydroxide and other alkaline substances. The surface active agent can improve the cleaning effect of the cleaning agent, so that dirt is easier to fall off from the surface of the wafer glass slide blank. They typically include anionic surfactants, nonionic surfactants, and the like. The surfactant can reduce the surface tension of the liquid, so that the cleaning agent can more easily permeate into gaps between dirt and the surface of the wafer, and the dirt stripping is accelerated.
Chelating agents are mainly used to remove metal ions from the wafer surface. They are capable of forming stable complexes with metal ions, thereby preventing redeposition of metal ions on the wafer surface or formation of new contaminants. Chelating agents play a critical role in the wafer cleaning process because they can significantly improve the thoroughness and efficiency of the cleaning. Deionized water is typically used as the solvent portion of the cleaning agent to dilute the acidic components, corrosion inhibitors, surfactants, and chelating agents, and to aid in the removal of dirt from the wafer surface. The deionized water has the characteristics of high purity and low conductivity, and can reduce the influence of impurities and ions in the cleaning agent on the surface of the wafer.
The nano particles have extremely high specific surface area and surface activity, and can remarkably improve the permeability and adsorption capacity of the cleaning agent. They can penetrate into the tiny gaps of the wafer surface and bind tightly with the contaminants, thereby removing the contaminants from the wafer surface more easily.
The high molecular polymer can form a stable colloid system in the cleaning agent through a long chain structure and special functional groups. These colloidal particles can adsorb and encapsulate contaminants on the wafer surface to form larger particles that are easier to clean. In addition, the high polymer also has lubricating effect, so that friction and damage on the surface of the wafer in the cleaning process are reduced.
The second embodiment of the invention provides a technical scheme that the wafer glass slide blank pickling solution comprises, by weight, 50-100 parts of hydrofluoric acid, 50-100 parts of a corrosion inhibitor, 5-30 parts of a surfactant, 5-30 parts of a chelating agent, 50-200 parts of deionized water, 10-20 parts of a defoaming agent, 5-10 parts of a nanoparticle additive and 5-10 parts of a high polymer additive.
The invention provides a technical scheme that the wafer glass slide blank pickling solution comprises, by weight, 50 parts of hydrofluoric acid, 50 parts of a corrosion inhibitor, 5 parts of a surfactant, 5 parts of a chelating agent, 50 parts of deionized water, 10 parts of a defoaming agent, 5 parts of a nanoparticle additive and 5 parts of a high polymer additive. In this embodiment, the nanoparticle additive is a nano alumina particle, and the polymer additive is a polystyrene polymer nanoparticle.
The invention provides a technical scheme that the wafer glass slide blank pickling solution comprises, by weight, 100 parts of hydrofluoric acid, 100 parts of a corrosion inhibitor, 30 parts of a surfactant, 30 parts of a chelating agent, 200 parts of deionized water, 20 parts of a defoaming agent, 10 parts of a nanoparticle additive and 10 parts of a high polymer additive. In this embodiment, the nanoparticle additive is a nano zirconia particle, and the polymer additive is a polystyrene polymer nanoparticle.
The invention provides a technical scheme that the wafer glass slide blank pickling solution comprises, by weight, 75 parts of hydrofluoric acid, 75 parts of corrosion inhibitors, 15 parts of surfactants, 15 parts of chelating agents, 120 parts of deionized water, 15 parts of defoamers, 7 parts of nanoparticle additives and 7 parts of high-molecular polymer additives. In this embodiment, the nanoparticle additive is carbon nanotube particles, and the polymer additive is polymethyl methacrylate polymer nanoparticles.
The preparation method of the wafer glass slide blank pickling solution comprises the following steps:
S1, preparing raw materials, namely preparing raw materials of hydrofluoric acid, a corrosion inhibitor, a surfactant, a chelating agent, deionized water, a defoaming agent, a nanoparticle additive and a high-molecular polymer additive according to the formula requirement, ensuring that all raw materials for preparing pickling solution meet the requirements to ensure the quality and performance of a final product, ensuring that all raw materials are analytically pure or higher in purity to avoid impurity introduction, checking whether the packaging of the raw materials is intact, and checking whether a label is clear to confirm the identity and the validity period of the label;
Preparing solution, mixing hydrofluoric acid, surfactant, chelating agent, deionized water and defoaming agent according to a certain proportion in a proper container, and fully and uniformly stirring, adding deionized water as a basic solvent in a proper container such as a container made of glass or polytetrafluoroethylene, sequentially adding hydrofluoric acid, surfactant, chelating agent and defoaming agent according to the formula requirement, and fully and uniformly stirring by using a stirrer until all raw materials are completely dissolved and uniformly mixed to form uniform pickling solution, wherein the stirring speed is moderate so as to avoid excessive foam or splashing solution, and the temperature is controlled in the mixing process so as to avoid the change of the properties of the raw materials caused by overhigh or overlow temperature;
S3, adjusting the pH value, namely adding a corrosion inhibitor according to the cleaning requirement to adjust the pH value of the solution, firstly using a pH meter to measure the initial pH value of the solution, slowly adding a proper amount of the corrosion inhibitor according to the measurement result and the formula requirement, continuously stirring and measuring the pH value until the pH value reaches a target value, wherein the target pH value is determined according to the specific cleaning requirement and the material of a wafer glass slide, and the adding amount of the corrosion inhibitor is accurately controlled to avoid the problem caused by excessive or insufficient;
S4, filtering the prepared pickling solution through a filter to remove impurities and particulate matters, filtering the prepared pickling solution through the filter, checking the blocking condition of the filter periodically, and replacing or cleaning the filter in time, wherein the pore diameter of the filter is determined according to the size of the impurity particles, and the proper flow rate is kept in the filtering process to avoid the blocking of the filter or the splashing of the solution;
S5, adding the raw materials for the second time, adding the nanoparticle additive and the high polymer additive into the solution, mixing, and fully and uniformly stirring; in the process of adding the raw materials for the second time, a small amount of the added nanoparticle additive and the high polymer additive are obtained for many times, so that the additive added in the last time is ensured to be uniformly dispersed in the solution, and then the next time of adding and stirring is carried out;
and S6, storing, namely storing the prepared pickling solution in a storage barrel for sealing and storing.
And removing metal ions and oxides on the surface of the wafer glass slide by hydrofluoric acid in the wafer glass slide blank pickling solution. The corrosion inhibitor regulates the pH value of the solution, reduces the corrosion of hydrofluoric acid on the wafer glass slide, improves the cleaning effect, and the surfactant reduces the surface tension of the solution, enhances the wettability and permeability of the solution on the surface of the wafer glass slide, combines the chelating agent and metal ions to form a stable complex, helps to remove metal pollutants, takes deionized water as a solvent, ensures no impurity and ion interference in the pickling solution, prevents a large amount of foam from being generated in the stirring and filtering process, influences the operation efficiency and the quality of the pickling solution, and the nanoparticle additive is deeply penetrated into micro gaps and depressions on the surface of the wafer to be tightly combined with the pollutants so as to clean and enhance the cleaning capability of the pickling solution to the wafer glass slide blank and match with the polymer additive for regulating the viscosity of the solution, thereby improving the cleaning effect or protecting the surface of the wafer glass slide.
In addition, this scheme still provides a equipment for according to above-mentioned preparation method preparation wafer glass slide glass blank pickling solution, as shown in fig. 2, this equipment mainly includes frame 1, is equipped with stirring district and the filtration district of mutual intercommunication on the frame 1, still is equipped with liquid flow controlling means and liquid flow transfer device between stirring district and the filtration district, and liquid flow controlling means is used for controlling the liquid flow break-make between stirring district and the filtration district, and liquid flow transfer device is used for transporting the liquid flow after the filtration district to the stirring district.
Specifically, be equipped with first mesa 2 and second mesa 3 on the frame 1, be equipped with agitator 8 and churn 9 in the stirring district, churn 9 establishes between first mesa 2 and second mesa 3, still be equipped with elevating platform 4 between churn 9 and the first mesa 2, agitator 8 installs on elevating platform 4, riser 7 is installed at the top of first mesa 2, riser 7 of this embodiment can adopt electric telescopic handle, the shaft extension end of riser 7 pierces through first mesa 2 downwards and elevating platform 4 fixed connection, offer on the first mesa 2 with agitator 8 complex hole 201 of stepping down, step down the hole 201 and offer in the center of first mesa 2, riser 7 is equipped with four sets of and establishes around stepping down the hole 201, the shaft extension end of agitator 8 pierces through elevating platform 4 downwards and connects a (mixing) shaft 10, the (mixing) shaft 10 stretches into in the churn 9 and evenly be equipped with blade 11 on the (mixing) shaft 10, the height of agitator 8 can be controlled through riser 7, then adjust the degree of depth that (mixing) shaft 10 is located in churn 9, improve the stirring effect of pickling solution.
Further, as shown in fig. 3, a filter disc 21 is arranged in the filter area, an opening of the filter disc 21 faces upwards, a filter membrane 22 is arranged in the filter disc 21, a valve body 5 is fixedly connected to the bottom end of the stirring cylinder 9, the valve body 5 is fixedly connected with the frame 1 through a support, the filter disc 21 is arranged at the bottom end of the valve body 5, a circulation port 901 is arranged on one side of the top of the stirring cylinder 9, a liquid outlet 2101 is further connected to the bottom end of the filter disc 21, and a liquid flow transferring device is used for transferring liquid flow from the liquid outlet 2101 to the circulation port 901.
Specifically, as shown in fig. 4, the liquid flow transferring device in this embodiment includes a storage station and a pickling pump 6, the storage station is a piston cavity 12, a piston head 16 is disposed in the piston cavity 12, a piston rod 17 is inserted into one end of the piston cavity 12, one end of the piston rod 17 is fixedly connected with the piston head 16, a return spring 18 is sleeved on the piston rod 17 located in the piston cavity 12, the other end of the piston cavity 12 is simultaneously provided with a liquid inlet 1201 and a liquid outlet 1202, an inlet end of the pickling pump 6 is connected with the liquid outlet 2101 through a first guide pipe 13, an outlet end of the pickling pump 6 is connected with the liquid inlet 1201 through a second guide pipe 14, the liquid outlet 1202 is connected with the circulation port 901 through a third guide pipe 15, a check valve 20 consistent with the liquid flow direction is disposed on the liquid inlet 1201, and a control valve 19 is disposed on the liquid outlet 1202, wherein the control valve 19 can be a manual valve or an automatic valve.
After the pickling solution is uniformly stirred, the valve body 5 is opened to enable the liquid flow of the stirring cylinder 9 to enter the filter disc 21, the pickling pump 6 is started again, the liquid flow is pumped into the storage station by the pickling pump 6, namely, the liquid flow passes through the one-way valve 20 of the liquid inlet 1201 to reach the inside of the piston cavity 12, at the moment, the control valve 19 in the liquid outlet 1202 is opened, the liquid flow in the piston cavity 12 is pumped into the stirring cylinder 9 again under the action of the piston head 16, so that the raw materials are conveniently added for the second time, and the starting driver can stir the liquid flow again at the moment, and the valve body 5 is kept in an open state, so that the liquid flow can be filtered for the second time, the above actions are repeated, and the liquid flow can be filtered for a plurality of times until the requirement is met.
When the stirred and filtered liquid needs to be taken out, only the control valve 19 in the liquid outlet hole 1202 is required to be closed, when the pickling pump 6 pumps the liquid flow into the piston cavity 12, the reset spring 18 is compressed along with the expansion of the volume of the liquid flow so as to drive the piston head 16 to move until the liquid flow is completely pumped into the piston cavity 12, at this time, by taking down the liquid inlet hole 1201 or the guide pipes on the liquid inlet hole 1201 and the liquid outlet hole 1202, the storage barrel is placed, the control valve 19 is slowly opened, and the liquid flow flows into the storage barrel from the liquid outlet hole 1202 because the reset spring 18 drives the piston head 16 to squeeze one side of the liquid flow.
The equipment for preparing the pickling solution in this scheme is nimble, can carry out the filtration of a lot of pickling solution and dismantle washing and equipment and use easily, through dismantling the storage station, can keep the pickling solution in the storage station, conveniently transport.
In this embodiment, the circulation port 901, the liquid outlet 2101, the liquid inlet 1201 and the liquid outlet 1202 are provided with tube heads connected with the guide tubes in a plugging manner, and the first guide tube 13, the second guide tube 14 and the third guide tube 15 are all corrosion-resistant hoses.
As shown in fig. 5, the inlet and outlet ends of the valve body 5 of the present embodiment are respectively provided with a threaded joint, the bottom end of the stirring cylinder 9 is provided with a first threaded groove 501 connected with the corresponding threaded joint, and the opening of the filter disc 21 is provided with a second threaded groove 502 connected with the corresponding threaded joint.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411175594.XA CN119060797A (en) | 2024-08-26 | 2024-08-26 | A kind of pickling liquid for glass wafer carrier blank and its preparation method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411175594.XA CN119060797A (en) | 2024-08-26 | 2024-08-26 | A kind of pickling liquid for glass wafer carrier blank and its preparation method and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119060797A true CN119060797A (en) | 2024-12-03 |
Family
ID=93643929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411175594.XA Pending CN119060797A (en) | 2024-08-26 | 2024-08-26 | A kind of pickling liquid for glass wafer carrier blank and its preparation method and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119060797A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200734075A (en) * | 2005-12-30 | 2007-09-16 | Lam Res Corp | Method for removing contamination from a substrate and for making a cleaning solution |
| CN116814341A (en) * | 2023-06-30 | 2023-09-29 | 上海新阳半导体材料股份有限公司 | Preparation method of alkaline cleaning liquid |
-
2024
- 2024-08-26 CN CN202411175594.XA patent/CN119060797A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200734075A (en) * | 2005-12-30 | 2007-09-16 | Lam Res Corp | Method for removing contamination from a substrate and for making a cleaning solution |
| CN116814341A (en) * | 2023-06-30 | 2023-09-29 | 上海新阳半导体材料股份有限公司 | Preparation method of alkaline cleaning liquid |
Non-Patent Citations (1)
| Title |
|---|
| 中国科学院固体物理研究所纳米材料和纳米技术应用发展中心: "纳米材料及其应用", 中国高新技术企业, no. 03, 25 August 1999 (1999-08-25), pages 7 - 10 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102304444B (en) | Environmental-protection water-base cleaning agent for solar-grade silicon wafers | |
| CN101351540A (en) | Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions | |
| TWI422440B (en) | Cleaning method and system | |
| CN106423994A (en) | Automatic cleaning and drying device of photovoltaic solar wafers | |
| CN101476131A (en) | Foamless low temperature degreasing agent | |
| CN115160934A (en) | Super-hydrophilic large-size silicon fine polishing solution and preparation and application methods thereof | |
| KR101956388B1 (en) | Cleaning solution composition for sapphire wafer | |
| CN117153765B (en) | Wafer rotary spraying cleaning device | |
| CN119060797A (en) | A kind of pickling liquid for glass wafer carrier blank and its preparation method and equipment | |
| CN101255386B (en) | Cleaning solution for chemical mechanical polishing of semiconductor silicon wafers | |
| CN113667546A (en) | Cleaning agent composition used after silicon wafer processing | |
| KR101425608B1 (en) | A normal temperature defat agent applicable in normal temperature and a defat method using the same | |
| CN102580956B (en) | Equipment and method for cleaning the inner wall of a capillary stainless steel tube | |
| CN106190615A (en) | Semiconductor silicon wafer cleaning solution and production method | |
| CN115740601B (en) | Metal part cutting device for machining | |
| CN103882444A (en) | Cleaning fluid and its application | |
| CN202037138U (en) | Coating washing spray device | |
| JP5721606B2 (en) | Etching solution pretreatment method, silicon substrate etching method, silicon substrate etching apparatus | |
| CN109666410A (en) | Sapphire polishing liquid additive and its preparation method and application | |
| JP2005142301A (en) | High-pressure processing method and apparatus thereof | |
| CN101289640A (en) | Cleaning agent for wafer polishing | |
| CN102299051A (en) | A method and device for drying microelectronic devices | |
| CN222931444U (en) | A fully automatic material frame trough cleaning machine | |
| CN105567445A (en) | Mechanical polishing cleaning liquid for semiconductor silicon wafers and preparing method thereof | |
| CN116144427A (en) | Preparation and application of filter plate cleaning agent for ceramic filter for mineral processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |