CN119056678B - Glue amount distribution compensation method and compensation system thereof - Google Patents
Glue amount distribution compensation method and compensation system thereof Download PDFInfo
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- CN119056678B CN119056678B CN202411570775.2A CN202411570775A CN119056678B CN 119056678 B CN119056678 B CN 119056678B CN 202411570775 A CN202411570775 A CN 202411570775A CN 119056678 B CN119056678 B CN 119056678B
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- 239000003292 glue Substances 0.000 title claims abstract description 364
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000009826 distribution Methods 0.000 title claims abstract description 26
- 238000004364 calculation method Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 7
- 230000000630 rising effect Effects 0.000 claims description 6
- 238000003860 storage Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- Application Of Or Painting With Fluid Materials (AREA)
Abstract
本发明涉及自动点胶技术领域，尤其涉及一种胶量分配补偿方法及其补偿系统。胶量分配补偿方法包括：设置点胶阀的工作参数，工作参数包括：点胶阀的通道号、工作模式、点胶固定参数和点胶可调参数；获取工件的标准胶高，基于工作参数和标准胶高，设置多个通道号的阀参数，每个通道号的阀参数包括多个胶高区间和胶高区间对应的出胶量；获取工件点胶槽的实际高度和当前点胶次数；将工件点胶槽的实际高度与多个胶高区间比较，得到工件点胶槽的实际高度所在胶高区间，根据当前胶高区间得到对应的通道号，对点胶阀的通道号切换，得到所在胶高区间对应的出胶量，根据当前点胶次数判定是否进行胶量分配补偿。本发明点胶精度高、效率快，提高了工件良品率。
The present invention relates to the field of automatic glue dispensing technology, and in particular to a glue amount distribution compensation method and a compensation system thereof. The glue amount distribution compensation method comprises: setting the working parameters of the glue dispensing valve, the working parameters comprising: the channel number of the glue dispensing valve, the working mode, the fixed parameters of glue dispensing and the adjustable parameters of glue dispensing; obtaining the standard glue height of the workpiece, and setting the valve parameters of multiple channel numbers based on the working parameters and the standard glue height, the valve parameters of each channel number comprising multiple glue height intervals and the glue output corresponding to the glue height interval; obtaining the actual height of the workpiece glue dispensing groove and the current number of glue dispensing; comparing the actual height of the workpiece glue dispensing groove with the multiple glue height intervals, obtaining the glue height interval where the actual height of the workpiece glue dispensing groove is located, obtaining the corresponding channel number according to the current glue height interval, switching the channel number of the glue dispensing valve, obtaining the glue output corresponding to the glue height interval, and determining whether to perform glue amount distribution compensation according to the current number of glue dispensing. The present invention has high dispensing accuracy and high efficiency, and improves the workpiece yield rate.
Description
Technical Field
The invention relates to the technical field of automatic dispensing, in particular to a dispensing compensation method and a dispensing compensation system for glue quantity.
Background
In industrial production, dispensing machines are used in many places, such as integrated circuits, semiconductor packages, printed circuit boards, color liquid crystal displays, electronic components for electronic components, and automotive parts.
In the dispensing process, the same workpieces on the dispensing machine can be sequentially subjected to dispensing operation, but the same workpieces can have different depths of the dispensing grooves due to errors of the workpieces, as shown in fig. 1, and further, the dispensing amount is also different to a certain extent. The depth of each workpiece dispensing groove can be measured through laser height measurement before the conventional dispensing operation, and the dispensing quantity of the dispensing valve is manually adjusted according to the measured dispensing groove depth, so that the dispensing quantity in the dispensing groove can meet the process requirements, the operation is complex, and the manual operation precision is low. And when dispensing, the long-term use of the dispensing valve can lead to a certain amount of glue to be left in the valve, the glue outlet amount of the dispensing valve can become more, the dispensing precision is lowered along with the glue outlet amount, the yield of workpieces is reduced, and the dispensing valve is generally used after manually discharging glue, washing the valve and readjusting the valve parameters so as to improve the dispensing precision, but the dispensing efficiency is slow.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art.
Therefore, the glue dispensing compensation method and the glue dispensing compensation system provided by the invention have the advantages that the glue dispensing precision is high, the efficiency is high, and the yield of workpieces is improved.
According to the glue amount distribution compensation method provided by the embodiment of the invention, the method comprises the following steps:
S1, setting working parameters of a dispensing valve, wherein the working parameters comprise a channel number, a working mode, a dispensing fixing parameter and a dispensing adjustable parameter of the dispensing valve;
S2, acquiring standard glue height of a workpiece, and setting valve parameters of a plurality of channel numbers of the dispensing valve based on the working parameters and the standard glue height, wherein the valve parameters of each channel number comprise a plurality of glue height sections and glue outlet quantity Wn corresponding to the glue height sections;
S3, acquiring the actual height of the workpiece dispensing groove and the current dispensing times;
S4, comparing the actual height of the workpiece dispensing groove with a plurality of glue height sections to obtain a glue height section where the actual height of the workpiece dispensing groove is located, obtaining a corresponding channel number according to the current glue height section, switching the channel number of a dispensing valve to obtain a glue outlet amount Wn corresponding to the glue height section, and judging whether glue amount distribution compensation is carried out according to the current dispensing times;
if the current dispensing times are within the preset value, controlling a dispensing valve to dispense the workpiece dispensing groove based on the dispensing quantity Wn corresponding to the dispensing height interval;
If the current dispensing times are not within the preset value, weighing the single-point glue quantity of the dispensing valve to obtain a single-point glue quantity value W Single sheet , adjusting the dispensing adjustable parameter according to the single-point glue quantity value W Single sheet based on the dispensing fixed parameter under the condition that the glue quantity Wn corresponding to the glue high section is unchanged, and controlling the dispensing valve to dispense the glue to the workpiece dispensing groove according to the adjusted dispensing adjustable parameter and the glue quantity Wn corresponding to the glue high section.
The glue dispensing compensation method has the advantages that when the depth of the glue dispensing grooves is different due to the errors of the workpieces, the channel numbers can be automatically switched according to the actual heights of the workpiece glue dispensing grooves during glue dispensing by setting the valve parameters of the multiple channel numbers of the glue dispensing valves, the glue dispensing valves are controlled to perform glue dispensing on the glue dispensing positions of the workpieces based on the glue outlet amount of the switched channel numbers, and the glue dispensing accuracy is high, the operation is simple and the degree of automation is high when the depth of the glue dispensing grooves of the same workpieces is different, so that the glue dispensing amount can meet the technological requirements (as the height after filling) is the same. In addition, in the automatic dispensing process, dispensing quantity distribution compensation can be automatically carried out on dispensing based on dispensing times, the dispensing quantity is corrected, the situation that dispensing precision is low due to the fact that a certain amount of glue is left in a valve after long-term use is avoided, and dispensing precision and dispensing efficiency are further improved.
According to one embodiment of the present invention, the step S2 specifically includes the following steps:
Obtaining the standard glue height to obtain a standard total glue amount W Total (S) ;
Obtaining a standard glue outlet frequency P 0 of the glue dispensing valve based on the glue dispensing fixed parameters and the glue dispensing adjustable parameters, wherein the glue dispensing fixed parameters comprise valve opening time T K, rising time T S, delay time T D and falling time T X, and the glue dispensing adjustable parameters comprise compensation delay time T D';
Calculating a standard single-point glue quantity W 0 according to the number N of glue outlet points of a preset glue dispensing valve;
setting the number of channel numbers, the minimum glue height, the glue height step distance and the glue quantity step distance;
Automatically setting the glue height sections according to the standard glue height, the channel number, the minimum glue height and the glue height step distance, wherein each channel number corresponds to one glue height section;
And automatically setting the glue outlet quantity Wn corresponding to each glue height region according to the glue height region, the glue quantity step distance, the standard total glue quantity W Total (S) , the standard glue outlet frequency P 0 and the standard single-point glue quantity W 0.
According to one embodiment of the invention, the standard dispensing frequency P 0 of the dispensing valve has a calculation formula of P0=1000/T;
wherein T is the glue outlet time, t=t K+TS+TD+TX;
According to one embodiment of the present invention, in step S4, controlling the dispensing valve to dispense the workpiece dispensing slot based on the dispensing amount Wn corresponding to the located glue height interval includes:
according to the glue outlet quantity Wn corresponding to the glue height zone and the standard glue outlet quantity, calculating the glue outlet frequency Pn corresponding to the glue quantity Wn, wherein the calculation formula is as follows:
Pn=(Wn/W0）*P0;
Since the valve opening time T K, the rising time T S and the falling time T X are all dispensing fixed parameters, the dispensing frequency Pn corresponding to the dispensing quantity Wn is known, and the delay time T D corresponding to the dispensing quantity Wn is calculated;
And obtaining delay time T D corresponding to the glue outlet amount, and dispensing the workpiece glue dispensing groove by the glue dispensing valve based on delay time T D corresponding to the glue outlet amount.
According to one embodiment of the present invention, in step S4, adjusting the dispensing adjustable parameter specifically includes:
The method comprises the steps of obtaining a single-point glue value W Single sheet , a standard glue outlet frequency P 0 and a standard single-point glue value W 0, and calculating expected glue outlet frequency P it is desirable to of a dispensing valve under the single-point glue value W Single sheet , wherein the calculation formula is as follows:
P it is desirable to =W0*P0/W Single sheet ;
The calculation formula of the glue outlet time T' to be compensated according to the calculated expected glue outlet frequency P it is desirable to is as follows:
T’=1000/P it is desirable to ;
calculating a compensation delay time T D 'based on the glue outlet time T' to be compensated, wherein the calculation formula is as follows:
TD'=T'-TK+TS+TX;
And realizing glue quantity distribution compensation through the compensation delay time T D'.
According to one embodiment of the invention, the actual height of the workpiece dispensing slot is obtained through a ranging sensor.
According to one embodiment of the invention, the counter counts each dispensing, and the dispensing times are counted.
According to one embodiment of the invention, the modes of operation include a point mode and a line mode.
According to one embodiment of the invention, the channel number is automatically switched through the IO communication protocol.
A system according to an embodiment of the present invention employing the glue dispensing compensation method as described above, the system comprising:
The first parameter setting module is configured to set working parameters of the dispensing valve, wherein the working parameters comprise a channel number, a working mode, a dispensing fixed parameter and a dispensing adjustable parameter of the dispensing valve;
the second parameter setting module is configured to acquire standard glue height of a workpiece, and set valve parameters of a plurality of channel numbers of the dispensing valve based on the working parameters and the standard glue height, wherein the valve parameters of each channel number comprise a plurality of glue height sections and glue outlet quantity Wn corresponding to the glue height sections;
The acquisition module is configured to acquire the actual height of the workpiece dispensing groove and the current dispensing times;
The control processing module is configured to compare the actual height of the workpiece dispensing groove with a plurality of glue height sections to obtain a glue height section where the actual height of the workpiece dispensing groove is located, obtain a corresponding channel number according to the current glue height section, switch the channel number of the dispensing valve to obtain a corresponding glue outlet Wn of the glue height section, and judge whether to perform glue quantity distribution compensation according to the current dispensing times;
if the current dispensing times are within the preset value, controlling a dispensing valve to dispense the workpiece dispensing groove based on the dispensing quantity Wn corresponding to the dispensing height interval;
If the current dispensing times are not within the preset value, weighing the single-point glue quantity of the dispensing valve to obtain a single-point glue quantity value W Single sheet , adjusting the dispensing adjustable parameter according to the single-point glue quantity value W Single sheet based on the dispensing fixed parameter under the condition that the glue quantity Wn corresponding to the glue high section is unchanged, and controlling the dispensing valve to dispense the glue to the workpiece dispensing groove according to the adjusted dispensing adjustable parameter and the glue quantity Wn corresponding to the glue high section.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of a prior art dispensing slot with different depths.
Fig. 2 is a flow chart of a method according to a first embodiment of the invention.
Fig. 3 is a schematic diagram of an operation parameter setting according to a first embodiment of the present invention.
Fig. 4 is a schematic diagram of a valve channel parameter setting according to a first embodiment of the present invention.
Fig. 5 is a schematic diagram of a system structure according to a second embodiment of the present invention.
Fig. 6 is a schematic diagram of a computer device according to a third embodiment of the present invention.
In the figure, 200 parts of a first parameter setting module, 201 parts of a second parameter setting module, 202 parts of an acquisition module, 203 parts of a control processing module, 10 parts of computer equipment, 1002 parts of a processor, 1004 parts of a memory, 1006 parts of a transmission device.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Embodiment 1. The embodiment of the application provides a glue amount distribution compensation method, as shown in fig. 2, comprising the following steps:
s1, setting working parameters of the dispensing valve, wherein the working parameters comprise a channel number, a working mode, a dispensing fixing parameter and a dispensing adjustable parameter of the dispensing valve, and the working parameters are shown in the figure 3.
S2, acquiring standard glue height of the workpiece, setting valve parameters of a plurality of channel numbers of the dispensing valve based on the working parameters and the standard glue height, wherein the valve parameters of each channel number comprise a plurality of glue height sections and glue outlet quantity Wn corresponding to the glue height sections.
S3, acquiring the actual height of the workpiece dispensing groove and the current dispensing times, for example, acquiring the actual height of the workpiece dispensing groove through a distance measuring sensor, counting each dispensing time through a counter, and counting the dispensing times. Ranging sensors include, but are not limited to, laser rangefinders or radar range sensors.
S4, comparing the actual height of the workpiece dispensing groove with a plurality of glue height sections to obtain a glue height section of the workpiece dispensing groove, obtaining a corresponding channel number according to the current glue height section, switching the channel number of the dispensing valve to obtain a glue outlet Wn corresponding to the glue height section, and judging whether to perform glue quantity distribution compensation according to the current glue dispensing times;
If the current dispensing times are within the preset value, controlling a dispensing valve to dispense the workpiece dispensing groove based on the dispensing quantity Wn corresponding to the dispensing height interval;
If the current dispensing times are not within the preset value, the single-point glue quantity of the dispensing valve is weighed to obtain a single-point glue quantity value W Single sheet , the dispensing adjustable parameter is adjusted according to the single-point glue quantity value W Single sheet based on the dispensing fixed parameter under the condition that the glue outlet quantity Wn corresponding to the glue high section is unchanged, and the dispensing valve is controlled to dispense the workpiece dispensing groove according to the adjusted dispensing adjustable parameter and the glue outlet quantity Wn corresponding to the glue high section.
In practical applications, the shape of the dispensing slot includes, but is not limited to, square, U-shaped, and V-shaped.
In this embodiment, referring to fig. 4, step S2 specifically includes the following steps:
And obtaining the standard glue height to obtain the standard total glue amount W Total (S) .
Based on the dispensing fixed parameters and the dispensing adjustable parameters, the standard dispensing frequency P 0 of the dispensing valve is obtained, wherein the dispensing fixed parameters comprise valve opening time T K, rising time T S, delay time T D and falling time T X, the dispensing adjustable parameters comprise compensation delay time T D', and in practical application, the delay time is smaller in initial setting so as to facilitate dispensing compensation of the glue amount and realize normal dispensing operation. Further, the standard dispensing frequency P 0 of the dispensing valve has a calculation formula of P0=1000/T, T is dispensing time, and T=T K+TS+TD+TX.
And calculating the standard single-point glue quantity W 0 according to the preset glue outlet point number N of the glue dispensing valve.
Setting the number of channel numbers, the minimum glue height, the glue height step distance and the glue quantity step distance.
And automatically setting a glue height section according to the standard glue height, the number of channel numbers, the minimum glue height and the glue height step distance, wherein each channel number corresponds to one glue height section.
And automatically setting the glue outlet quantity Wn corresponding to each glue height region according to the glue height region, the glue quantity step distance, the standard total glue quantity W Total (S) , the standard glue outlet frequency P 0 and the standard single-point glue quantity W 0.
It should be noted that, the valve parameter of one channel number is a glue height section corresponding to a standard glue height, and the glue outlet amount corresponding to the glue height section is a standard total glue amount, so that the number of the channel numbers can be 3-10, but not only limited, the number of the channel numbers supports expansion, the number of the channel numbers can be set according to the difference of the point glue groove depths, and when the difference of the point glue groove depths is large, the number of the set channel numbers is larger.
In the dispensing process, the single-point dispensing quantity of dispensing of the dispensing valve is the same, the dispensing time is the same, the dispensing frequency of the dispensing valve is controlled based on the dispensing quantity Wn corresponding to the dispensing high section, the dispensing quantity Wn is controlled, and when the depths of the dispensing grooves of a plurality of identical workpieces are different, the dispensing quantity can meet the process requirements. Specifically, in step S4, controlling the dispensing valve to dispense the workpiece dispensing slot based on the dispensing amount Wn corresponding to the dispensing height interval includes:
according to the glue outlet quantity Wn corresponding to the glue height zone and the standard glue outlet quantity, calculating the glue outlet frequency Pn corresponding to the glue quantity Wn, wherein the calculation formula is as follows:
Pn=(Wn/W0）*P0;
Since the valve opening time T K, the rising time T S and the falling time T X are all dispensing fixed parameters, the dispensing frequency Pn corresponding to the dispensing quantity Wn is known, and the delay time T D corresponding to the dispensing quantity Wn is calculated;
The delay time T D corresponding to the glue outlet amount is obtained, and the glue dispensing valve is used for dispensing glue to the workpiece glue dispensing groove based on the delay time T D corresponding to the glue outlet amount, namely in practical application, the glue outlet frequency of the glue dispensing valve needs to be adjusted through the delay time T D.
In step S4, the adjusting the dispensing adjustable parameters specifically includes:
The method comprises the steps of obtaining a single-point glue value W Single sheet , a standard glue outlet frequency P 0 and a standard single-point glue value W 0, and calculating expected glue outlet frequency P it is desirable to of a dispensing valve under the single-point glue value W Single sheet , wherein the calculation formula is as follows:
P it is desirable to =W0*P0/W Single sheet ;
The calculation formula of the glue outlet time T' to be compensated according to the calculated expected glue outlet frequency P it is desirable to is as follows:
T’=1000/P it is desirable to ;
calculating a compensation delay time T D 'based on the glue outlet time T' to be compensated, wherein the calculation formula is as follows:
TD'=T'-TK+TS+TX;
And realizing glue quantity distribution compensation through the compensation delay time T D'.
In this embodiment, the channel number is automatically switched through the IO communication protocol, so that the problems of low reliability and low efficiency of the parameter setting of the channel number in the existing serial port communication mode are avoided, and the operation efficiency and reliability of the time point of frequently switching the channel number in the operation process are improved.
In summary, according to the glue dispensing compensation method of the invention, when the depths of the glue dispensing grooves are different due to the errors of the workpieces, the channel numbers can be automatically switched according to the actual heights of the glue dispensing grooves of the workpieces during glue dispensing by setting the valve parameters of the multiple channel numbers of the glue dispensing valves, the glue dispensing valves are controlled to dispense glue at the glue dispensing positions of the workpieces based on the glue outlet amount of the switched channel numbers, and the glue amount can meet the process requirements (as the filled height) when the depths of the glue dispensing grooves of the same workpieces are different. In addition, in the automatic dispensing process, dispensing quantity distribution compensation can be automatically carried out on dispensing based on dispensing times, the dispensing quantity is corrected, the situation that dispensing precision is low due to the fact that a certain amount of glue is left in a valve after long-term use is avoided, and dispensing precision and dispensing efficiency are further improved.
Embodiment 2. Based on the same inventive concept as one of the glue dispensing compensation methods in the previous embodiments, the embodiment of the present application provides a glue dispensing compensation system, which adopts the above glue dispensing compensation method, as shown in fig. 5, and the system includes:
the first parameter setting module 200 is configured to set working parameters of the dispensing valve, wherein the working parameters comprise a channel number, a working mode, a dispensing fixing parameter and a dispensing adjustable parameter of the dispensing valve;
A second parameter setting module 201, configured to obtain a standard glue height of the workpiece, and set valve parameters of a plurality of channel numbers of the dispensing valve based on the working parameter and the standard glue height, where the valve parameters of each channel number include a plurality of glue height regions and a glue outlet amount Wn corresponding to the glue height regions;
an obtaining module 202 configured to obtain an actual height of the workpiece dispensing slot and a current number of dispensing times;
The control processing module 203 is configured to compare the actual height of the workpiece dispensing slot with a plurality of glue height sections to obtain a glue height section where the actual height of the workpiece dispensing slot is located, obtain a corresponding channel number according to the current glue height section, switch the channel number of the dispensing valve to obtain a corresponding glue outlet amount Wn of the glue height section where the channel number of the dispensing valve is located, and judge whether to perform glue amount distribution compensation according to the current dispensing times;
If the current dispensing times are within the preset value, controlling a dispensing valve to dispense the workpiece dispensing groove based on the dispensing quantity Wn corresponding to the dispensing height interval;
If the current dispensing times are not within the preset value, the single-point glue quantity of the dispensing valve is weighed to obtain a single-point glue quantity value W Single sheet , the dispensing adjustable parameter is adjusted according to the single-point glue quantity value W Single sheet based on the dispensing fixed parameter under the condition that the glue outlet quantity Wn corresponding to the glue high section is unchanged, and the dispensing valve is controlled to dispense the workpiece dispensing groove according to the adjusted dispensing adjustable parameter and the glue outlet quantity Wn corresponding to the glue high section.
In practical application, the first parameter setting module, the second parameter setting module and the acquisition module can be separately set or integrated on a carrier, such as a computer for industrial control.
The foregoing various modifications and specific examples of the glue dispensing compensation method in the first embodiment of fig. 2 are equally applicable to a glue dispensing compensation font of this embodiment, and the foregoing detailed description of the glue dispensing compensation method will make it clear to those skilled in the art that the implementation method of a glue dispensing compensation system of this embodiment is not described in detail herein for brevity of description.
Embodiment 3. The embodiment of the present application provides a computer device, which includes a processor and a memory, where at least one instruction or at least one program is stored in the memory, and the at least one instruction or the at least one program is loaded and executed by the processor to implement a glue dispensing compensation method as provided in the above method embodiment.
Fig. 6 shows a schematic hardware structure of a device for implementing the method for compensating for dispensing glue according to the embodiment of the present application, where the device may participate in forming or including an apparatus or a system according to the embodiment of the present application. As shown in fig. 6, the computer device 10 may include one or more processors 1002 (the processors may include, but are not limited to, processing means such as a microprocessor MCU or a programmable logic device FPGA), memory 1004 for storing data, and transmission means 1006 for communication functions. Among other things, a display, an input/output interface (I/O interface), a Universal Serial Bus (USB) port (which may be included as one of the ports of the I/O interface), a network interface, a power supply, and/or a camera may be included. It will be appreciated by those of ordinary skill in the art that the configuration shown in fig. 6 is merely illustrative and is not intended to limit the configuration of the electronic device described above. For example, computer device 10 may also include more or fewer components than shown in FIG. 6, or have a different configuration than shown in FIG. 6.
It should be noted that the one or more processors and/or other data processing circuits described above may be referred to herein generally as "data processing circuits. The data processing circuit may be embodied in whole or in part in software, hardware, firmware, or any other combination. Furthermore, the data processing circuitry may be a single stand-alone processing module, or incorporated in whole or in part into any of the other elements in the computer device 10 (or mobile device). As referred to in embodiments of the application, the data processing circuit acts as a processor control (e.g., selection of the path of the variable resistor termination connected to the interface).
The memory 1004 may be used to store software programs and modules of application software, such as a program instruction/data storage device corresponding to a method for compensating glue dispensing in the embodiment of the present application, and the processor executes the software programs and modules stored in the memory 1004 to perform various functional applications and data processing, that is, implement a method as described above. Memory 1004 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, memory 1004 may further include memory located remotely from the processor, which may be connected to computer device 10 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The transmission means 1006 is for receiving or transmitting data via a network. Specific examples of the network described above may include a wireless network provided by a communications provider of the computer device 10. In one example, the transmission means 1006 includes a network adapter (Network Interface Controller, NIC) that can be connected to other network devices via a base station to communicate with the internet. In one example, the transmission device 1006 may be a Radio Frequency (RF) module for communicating with the internet wirelessly.
The display may be, for example, a touch screen type Liquid Crystal Display (LCD) that may enable a user to interact with a user interface of the computer device 10 (or mobile device).
Embodiment 4. The present application further provides a computer readable storage medium, where the computer readable storage medium may be configured in a server to store at least one instruction or at least one program related to a method for implementing the glue dispensing compensation method in the method embodiment, where the at least one instruction or the at least one program is loaded and executed by the processor to implement a glue dispensing compensation method provided in the method embodiment.
Alternatively, in this embodiment, the storage medium may be located in at least one network server among a plurality of network servers of the computer network. Alternatively, in the present embodiment, the storage medium may include, but is not limited to, a U disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a removable hard disk, a magnetic disk, or an optical disk, etc. various media that can store program codes.
Embodiment 5 the present application also provides a computer program product or computer program comprising computer instructions stored on a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer readable storage medium and executes the computer instructions to cause the computer device to perform a method of glue dispensing compensation as provided in the various alternative embodiments described above.
It should be noted that the sequence of the embodiments of the present application is only for description, and does not represent the advantages and disadvantages of the embodiments. And the foregoing description has been directed to specific embodiments of this application. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
The embodiments of the present application are described in a progressive manner, and the same and similar parts of the embodiments are all referred to each other, and each embodiment is mainly described in the differences from the other embodiments. In particular, for apparatus, devices and storage medium embodiments, the description is relatively simple as it is substantially similar to method embodiments, with reference to the description of method embodiments in part.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program for instructing relevant hardware, where the program may be stored in a computer readable storage medium, and the storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined as the scope of the claims.
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