CN119043513A - Temperature sensor - Google Patents
Temperature sensor Download PDFInfo
- Publication number
- CN119043513A CN119043513A CN202411321503.9A CN202411321503A CN119043513A CN 119043513 A CN119043513 A CN 119043513A CN 202411321503 A CN202411321503 A CN 202411321503A CN 119043513 A CN119043513 A CN 119043513A
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- CN
- China
- Prior art keywords
- ring wire
- temperature sensor
- wire
- limiting
- outer ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 claims description 13
- 239000011261 inert gas Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims 2
- 238000005259 measurement Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 15
- 238000007789 sealing Methods 0.000 description 8
- 238000009529 body temperature measurement Methods 0.000 description 3
- 229910000629 Rh alloy Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920006221 acetate fiber Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The application belongs to the technical field of precise measurement, and particularly discloses a temperature sensor which comprises an insulated middle framework, an inner ring wire and an outer ring wire, wherein the middle framework is hollow and cylindrical, the outer ring wire is spirally wound on the outer wall of the middle framework, the coils of the spiral part of the outer ring wire are not contacted with each other, the inner ring wire is spirally attached to the inner wall of the middle framework, the coils of the spiral part of the inner ring wire are not contacted with each other, two tail ends of the inner ring wire are respectively led out from the end part and the bottom of the middle framework, the two tail ends of the outer ring wire are respectively led out from the end part and the bottom of the middle framework, the tail ends of the inner ring wire led out from the end part and the tail ends of the outer ring wire are Y-shaped forked, and the tail ends of the inner ring wire led out from the bottom are connected with the tail ends of the outer ring wire. The application provides a temperature sensor which is small in size and easy to process.
Description
Technical Field
The application belongs to the technical field of precision measurement, and particularly relates to a temperature sensor.
Background
A temperature sensor refers to a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is a core part of the temperature measuring instrument and has various varieties.
However, the temperature sensor in the related art has a large volume, so that the temperature sensor cannot adapt to more scenes, and if the volume is reduced, the processing is complex and the processing cost is high.
Therefore, how to provide a temperature sensor that is small and easy to process is a problem to be solved.
Disclosure of Invention
Aiming at the defects of the prior art, the application aims to provide a temperature sensor, which aims to solve the problem of larger volume of the temperature sensor in the related art.
To achieve the above object, the present application provides a temperature sensor comprising:
an insulated middle skeleton, an inner ring wire and an outer ring wire;
The middle framework is hollow and cylindrical, the outer ring wires are spirally wound on the outer wall of the middle framework, the coils of the spiral parts of the outer ring wires are not contacted with each other, the inner ring wires are spirally attached to the inner wall of the middle framework, and the coils of the spiral parts of the inner ring wires are not contacted with each other;
the two ends of the inner ring wire are respectively led out from the end part and the bottom of the middle framework, the two ends of the outer ring wire are respectively led out from the end part and the bottom of the middle framework, the end of the inner ring wire led out from the end part and the end of the outer ring wire are Y-shaped forked, and the end of the inner ring wire led out from the bottom is connected with the end of the outer ring wire.
Compared with the prior art, the technical scheme of the application mainly comprises two spiral wires and an insulating framework between the wires, and has the advantages of small volume, simple processing and easy realization.
In some embodiments, the temperature sensor further comprises an outer envelope, wherein a sealed inert gas filled receiving space is provided inside the outer envelope, and the insulated intermediate frame, the spiral portion and the non-Y-shaped bifurcated end of the inner ring wire, and the spiral portion and the non-Y-shaped bifurcated end of the outer ring wire are all located in the receiving space, and the Y-shaped bifurcated end of the inner ring wire and the Y-shaped bifurcated end of the outer ring wire are led out from the end of the outer envelope.
Compared with the prior art, the temperature sensor has the advantages that the service life and the measurement accuracy of the temperature sensor can be improved because the components are packaged in the sealed space filled with inert gas.
In some embodiments, the inner and outer ring conductors are the same material.
In some embodiments, the inner wall of the middle skeleton is provided with first limit structures, and gaps between the first limit structures are used for accommodating the inner ring wires, or the inner wall of the middle skeleton is provided with spiral limit grooves for accommodating the inner ring wires.
In some embodiments, the first limit structure is a limit post or limit table or limit cone or limit tab or limit ball or limit hemisphere.
In some embodiments, the outer wall of the middle skeleton is provided with a second limiting structure, and gaps between the second limiting structures are used for accommodating the outer ring wires, or the outer wall of the middle skeleton is provided with a spiral limiting groove for accommodating the outer ring wires.
In some embodiments, the second limit structure is a limit post or limit table or limit cone or limit tab or limit ball or limit hemisphere.
In some embodiments, the intermediate framework is a multi-lobed, modular structure, consisting of multiple lobes of equal size.
In some embodiments, the temperature sensor further comprises an end cap disposed at the end;
The end sealing cover is provided with a through hole, and the Y-shaped forked tail end of the inner ring wire is led out from the through hole on the end sealing cover.
In some embodiments, the temperature sensor further comprises a bottom cover disposed at the bottom;
the bottom sealing cover is provided with a through hole, and the non-Y-shaped forked end of the inner ring wire is led out from the through hole on the bottom sealing cover and is connected with the non-Y-shaped forked end of the outer ring wire.
In general, compared with the prior art, the above technical solution conceived by the present application mainly has the following technical advantages:
1. The volume is small;
2. the processing is simple, the cost is low, and the implementation is easy;
3. since each component is packaged in a closed space filled with inert gas, the service life and measurement accuracy of the temperature sensor can be improved.
Drawings
In order to more clearly illustrate the application or the technical solutions in the related art, the following description will briefly explain the drawings used in the embodiments or the related art description, and it is obvious that the drawings in the following description are some embodiments of the application, and other drawings can be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic diagram of a temperature sensor according to the present application;
FIG. 2 is a schematic diagram of an inner ring wire according to an embodiment of the present application;
FIG. 3 is a schematic view of an outer ring wire according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a temperature sensor according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a second embodiment of a temperature sensor;
FIG. 6 is a schematic diagram of a temperature sensor according to an embodiment of the present application;
FIG. 7 is a third schematic diagram of a temperature sensor according to an embodiment of the present application;
fig. 8 is a schematic diagram of an intermediate skeleton provided in an embodiment of the present application.
The same reference numbers are used throughout the drawings to reference like elements or structures, wherein:
1-inner ring wire, 2-outer ring wire, 3-end cover, 4-middle frame, 5-bottom cover, 6-outer cover, 1-inner ring wire end point, 1-2-inner ring wire end point two, 2-1-outer ring wire end point one, 2-outer ring wire end point two.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Fig. 1 is a schematic structural diagram of a temperature sensor provided by the present application, as shown in fig. 1, the temperature sensor includes:
an insulated middle skeleton 4, an inner ring wire 1, and an outer ring wire 2;
the middle framework 4 is hollow and cylindrical, the outer ring wire 2 is spirally wound on the outer wall of the middle framework 4, the coils of the spiral part of the outer ring wire 2 are not contacted with each other, the inner ring wire 1 is spirally attached to the inner wall of the middle framework 4, and the coils of the spiral part of the inner ring wire 1 are not contacted with each other;
The two ends of the inner ring wire 1 are respectively led out from the end part and the bottom of the middle framework 4, the two ends of the outer ring wire 2 are respectively led out from the end part and the bottom of the middle framework 4, the end of the inner ring wire 1 led out from the end part and the end of the outer ring wire 2 are Y-shaped forked, and the end of the inner ring wire 1 led out from the bottom is connected with the end of the outer ring wire 2.
Specifically, in order to realize insulation of the middle frame 4, an insulating material may be used as a material of the middle frame 4, for example, quartz, asbestos, mica, glass, ceramic, tetrafluoroethylene, or other materials that can resist high temperature may be selected under the condition that the temperature of the measured medium may be greater than 180 degrees celsius or any other suitable scene, for example, paper fiber, acetate fiber, or polyamide with a lower melting point may be selected under the condition that the temperature of the measured medium is generally room temperature or any other suitable scene, and it is noted that the above is merely an example of the material for manufacturing the middle frame 4, but is not limited to the material for manufacturing the middle frame 4, and any material that can realize insulation may be selected as the middle frame 4.
In some alternative embodiments, fig. 2 is a schematic diagram of an inner ring wire provided in the embodiment of the present application, as shown in fig. 2, the inner ring wire 1 is spiral, and one side end of the inner ring wire 1 is bifurcated into a Y-shape, which is respectively an end point 1-1 and an end point 1-2; the middle framework 4 can be sleeved outside the inner ring wire 1, the external connection surface of the spiral part of the inner ring wire 1 can be overlapped or attached to the inner wall of the middle framework 4, or the external connection surface of the spiral part of the inner ring wire 1 and the inner wall of the middle framework 4 can be nearly overlapped, or the shape or the relative position between the external connection surface and the inner wall of the middle framework 4 is not limited, only one side end of the inner ring wire 1 is required to be Y-shaped to be branched and led out from the end part of the middle framework 4, the other side end of the inner ring wire 1 is required to be Y-shaped to be branched and led out from the bottom of the middle framework 4, and the inner ring wire 1 and the middle framework 4 can be kept unchanged relative position by a limiting structure;
In some alternative embodiments, fig. 3 is a schematic diagram of the outer ring wire provided by the embodiment of the application, as shown in fig. 3, the outer ring wire 2 is spirally wound along the outer wall of the middle skeleton 4, one side end of the outer ring wire 2 is bifurcated into a Y shape, which is respectively an end point 2-1 and an end point 2-2, the inscribed surface of the spiral part of the outer ring wire 2 can be overlapped or attached to the outer wall of the middle skeleton 4, or nearly overlapped, or the shape or the relative position between the circumscribed surface of the spiral part of the outer ring wire 2 and the outer wall of the middle skeleton 4 is not limited, only the Y-shaped bifurcation is required to be realized at one side end of the outer ring wire 2 and led out from the end of the middle skeleton 4, the other side end of the inner ring wire 1 is bifurcated into a non-Y shape and led out from the bottom of the middle skeleton 4, and the relative position of the outer ring wire 2 and the middle skeleton 4 can be fixed by a limiting structure.
Fig. 4 is a schematic diagram of a temperature sensor provided by an embodiment of the present application, fig. 5 is a schematic diagram of a second temperature sensor provided by an embodiment of the present application, wherein the end of an inner ring wire 1 and the end of an outer ring wire 2 led out from the end are Y-shaped and branched as shown in fig. 4, and the end of the inner ring wire 1 led out from the bottom is connected to the end of the outer ring wire 2 as shown in fig. 5.
Fig. 6 is a schematic diagram of a temperature sensor according to an embodiment of the present application, as shown in fig. 6, by predicting a function of a temperature value T with respect to a resistance value R in advance, the temperature sensor may be disposed in a medium to be measured during actual measurement, the resistance value R of an acquisition resistor may be measured, and a target temperature value T may be measured by the function of the temperature value T with respect to the resistance value R.
Specifically, the output value of the current value I of the dc power supply between the terminal 1-2 and the terminal 2-2 may be preset by a worker, may be a fixed value, or may be set or adjusted by the worker according to the requirement, and the resistance value R may be obtained by collecting the feedback voltage value V between the terminal 1-1 and the terminal 2-1 according to the formula r=v/I, thereby obtaining the corresponding target temperature value T.
Compared with the prior art, the technical scheme of the application mainly comprises two spiral wires and an insulating framework between the wires, and has the advantages of small volume, simple processing and easy realization.
In some embodiments, fig. 7 is a schematic diagram of a temperature sensor according to the third embodiment of the present application, as shown in fig. 7, the temperature sensor further includes an outer envelope 6, and as shown in fig. 5 and 7, a sealed space filled with inert gas is provided inside the outer envelope 6, the insulated middle skeleton 4, the spiral portion and the non-Y-shaped bifurcated end of the inner lead 1, and the spiral portion and the non-Y-shaped bifurcated end of the outer lead 2 are all located in the space, and the Y-shaped bifurcated end of the inner lead 1 and the Y-shaped bifurcated end of the outer lead 2 are led out from the end of the outer envelope.
Alternatively, the outer envelope 6 is assembled in a sealed chamber filled with inert gas when it is packaged with other components, so that the inside of the sensor is filled with inert gas. The inert gas has extremely low chemical reactivity, so that the working environment of the sensor is extremely purified, the damage of humidity, corrosive gas and other mechanical devices to the temperature sensor can be reduced, in addition, the influence of temperature fluctuation on a measurement result can be reduced due to low heat conductivity of the inert gas, and electromagnetic interference can be reduced due to non-conduction of the inert gas. Thereby guaranteeing the service life and the measurement accuracy of the sensor.
Compared with the prior art, the temperature sensor has the advantages that the service life and the measurement accuracy of the temperature sensor can be improved because the components are packaged in the sealed space filled with inert gas.
In some embodiments, the inner ring wire 1 and the outer ring wire 2 are the same material.
Specifically, the inner ring wire 1 and the outer ring wire 2 may each be made of a filament material such as a fine platinum wire or a platinum-rhodium alloy.
In some embodiments, in order to adapt to various temperature measurement situations, the materials of the inner ring wire 1 and the outer ring wire 2 may be adjusted, for example, for a temperature measurement situation requiring higher precision, a fine wire material such as a fine platinum wire or a platinum-rhodium alloy may be used, for example, for an ultra-high temperature measurement situation, a material such as graphene may be used, and it should be noted that the materials of the inner ring wire 1 and the outer ring wire 2 may be set by a worker according to the needs, which is not limited in the embodiment of the present application.
In some embodiments, the inner wall of the middle frame 4 is provided with a first limiting structure, and gaps between the first limiting structures are used for accommodating the inner ring wire 1, or the inner wall of the middle frame 4 is provided with a spiral limiting groove for accommodating the inner ring wire 1.
In some embodiments, the first limit structure is a limit post or limit table or limit cone or limit tab or limit ball or limit hemisphere.
For example, a spiral limit groove is formed in the inner wall of the middle framework 4, two ends of the groove are led out from the end and the bottom of the middle framework, the inner ring lead 1 can be just clamped into the spiral limit groove to be fixed, and spirally bent along the spiral limit groove, Y-shaped bifurcations are led out from the end of the middle framework 4 along the spiral limit groove, non-Y-shaped bifurcations ends (namely common I-shaped ends) are led out from the bottom of the middle framework 4 along the spiral limit groove, and gaps formed by other limit structures are similarly formed and are not repeated herein.
In some embodiments, the outer wall of the middle skeleton 4 is provided with a second limiting structure, and gaps between the second limiting structures are used for accommodating the outer ring wire 2, or the outer wall of the middle skeleton 4 is provided with a spiral limiting groove for accommodating the outer ring wire 2.
In some embodiments, the second limit structure is a limit post or limit table or limit cone or limit tab or limit ball or limit hemisphere.
For example, the outer wall of the middle framework 4 is provided with a spiral limit groove, two ends of the groove are led out from the end and the bottom of the middle framework, the outer ring wire 2 can be just clamped into the spiral limit groove to be fixed, and is spirally bent and wound along the spiral limit groove, Y-shaped bifurcations are led out from the end of the middle framework 4 along the spiral limit groove, non-Y-shaped bifurcations ends (namely common I-shaped ends) are led out from the bottom of the middle framework 4 along the spiral limit groove, and gaps formed by other limit structures are similarly arranged and are not repeated herein.
In some embodiments, the intermediate framework 4 is a multi-lobed, modular structure, consisting of multiple lobes of equal size.
Fig. 8 is a schematic diagram of an intermediate skeleton provided in an embodiment of the present application, as shown in fig. 8, for example, the intermediate skeleton may be composed of 3 pieces of the same size.
In some embodiments, the temperature sensor further comprises an end cap 3 provided at the end;
the end cover 3 is provided with a through hole, and the Y-shaped bifurcation end of the inner ring lead 1 is led out from the through hole on the end cover 3.
In some embodiments, the temperature sensor further comprises a bottom cover 5 disposed at the bottom;
The bottom sealing cover 5 is provided with a through hole, and the non-Y-shaped forked end (namely the common I-shaped end) of the inner ring wire 1 is led out from the through hole on the bottom sealing cover 5 and is connected with the non-Y-shaped forked end (namely the common I-shaped end) of the outer ring wire 2.
Specifically, the inner ring wire 1 is matched with a limit structure such as a spiral limit groove or a limit table (such as a boss) of the inner wall of the middle framework 4, the end points 1-1 and 1-2 are led out through a through hole in the end cover 3, the non-Y-shaped bifurcation end (namely a common I-shaped end) is led out through a through hole in the bottom cover 5, the outer ring wire 2 is matched with a limit structure such as a spiral limit groove or a limit table (such as a boss) of the outer wall of the middle framework 4, and the end points 2-1 and 2 are led out through a through hole in the end cover 3, and the non-Y-shaped bifurcation end (namely a common I-shaped end) is led out through a through hole in the bottom cover 5 and is welded and communicated with the inner ring wire 1. The bottom sealing cover 4 and the end sealing cover 3 are provided with grooves, the middle framework 4 is inserted from two ends of the middle framework 4 respectively, and the grooves are matched with the middle framework 4 to clamp and fix the middle framework 4.
In general, compared with the prior art, the above technical solution conceived by the present application mainly has the following technical advantages:
1. The volume is small;
2. the processing is simple, the cost is low, and the implementation is easy;
3. since each component is packaged in a closed space filled with inert gas, the service life and measurement accuracy of the temperature sensor can be improved.
In describing embodiments of the present application, it should be noted that the term "coupled" should be interpreted broadly, unless explicitly stated or limited otherwise, and for example, the term "coupled" may be either detachably coupled or non-detachably coupled, or may be directly coupled or indirectly coupled via an intermediate medium. References to orientation terms, such as "top," "bottom," "inner," "outer," etc., in the embodiments of the present application are merely with reference to the orientation of the drawings, and thus, the use of orientation terms is intended to better and more clearly describe and understand the embodiments of the present application, rather than to indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the embodiments of the present application.
The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411321503.9A CN119043513A (en) | 2024-09-23 | 2024-09-23 | Temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411321503.9A CN119043513A (en) | 2024-09-23 | 2024-09-23 | Temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119043513A true CN119043513A (en) | 2024-11-29 |
Family
ID=93586609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411321503.9A Pending CN119043513A (en) | 2024-09-23 | 2024-09-23 | Temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119043513A (en) |
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2024
- 2024-09-23 CN CN202411321503.9A patent/CN119043513A/en active Pending
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