CN119017305B - Plate positioning clamp and clamping method thereof - Google Patents
Plate positioning clamp and clamping method thereof Download PDFInfo
- Publication number
- CN119017305B CN119017305B CN202411518941.4A CN202411518941A CN119017305B CN 119017305 B CN119017305 B CN 119017305B CN 202411518941 A CN202411518941 A CN 202411518941A CN 119017305 B CN119017305 B CN 119017305B
- Authority
- CN
- China
- Prior art keywords
- plate
- movable
- carrier plate
- fixed
- movable carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 103
- 238000001179 sorption measurement Methods 0.000 claims abstract description 63
- 238000003825 pressing Methods 0.000 claims description 62
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 230000008569 process Effects 0.000 abstract description 31
- 230000000694 effects Effects 0.000 abstract description 12
- 239000012467 final product Substances 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 30
- 239000010959 steel Substances 0.000 description 30
- 229910000679 solder Inorganic materials 0.000 description 24
- 238000012545 processing Methods 0.000 description 21
- 238000007639 printing Methods 0.000 description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 6
- 230000001680 brushing effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/16—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
本发明公开一种板件定位夹具及其夹持方法，涉及夹具的技术领域，该板件定位夹具包括固定载板、活动载板，活动载板以及固定载板间形成板件的夹持空间，活动载板可通过活动机构在靠近和远离固定载板的方向上往复活动，实现对夹持空间大小的调节，并且，固定载板以及活动载板的上表面分别均布设置有多组吸附结构，消除板件与相关部件间不利于提升工艺精度的误差间隙，实现最终工艺效果的提升，该夹具还包括测距仪，测距仪设置于夹持空间的上方，用于获取其与位于夹持空间内的板件之间的距离数据，让施加在板件上的夹持力得到统一，从而让该板件定位夹具能够满足更高的工艺需求，实现最终成品质量的提升。
The present invention discloses a plate positioning fixture and a clamping method thereof, and relates to the technical field of fixtures. The plate positioning fixture comprises a fixed carrier plate and a movable carrier plate. A clamping space for the plate is formed between the movable carrier plate and the fixed carrier plate. The movable carrier plate can reciprocate in a direction approaching and away from the fixed carrier plate through a movable mechanism to adjust the size of the clamping space. In addition, a plurality of adsorption structures are evenly distributed on the upper surfaces of the fixed carrier plate and the movable carrier plate, respectively, to eliminate error gaps between the plate and related components that are not conducive to improving process accuracy, thereby improving the final process effect. The fixture also comprises a rangefinder, which is arranged above the clamping space and is used to obtain distance data between the rangefinder and the plate located in the clamping space, so that the clamping force applied to the plate is unified, thereby enabling the plate positioning fixture to meet higher process requirements and improve the quality of the final product.
Description
Technical Field
The invention relates to the technical field of clamps, in particular to a plate positioning clamp and a clamping method thereof.
Background
The plate clamp is a tool for supporting a plate, can firmly support the plate and prevent the plate from moving or deforming in the processing or assembling process, so that the processing precision and the product quality are improved, if the clamping force of the clamp is overlarge, the pressure generated on the surface of the plate can cause the plate to deform and arch to influence the effect of a related process, and if the clamping effect of the clamp is poor, the plate can possibly have the conditions of position deviation, even movement and the like in the corresponding process, so that the process precision is reduced or even damaged.
Therefore, the clamping force of the clamp is particularly important for the plate processing, but the clamping force of the clamp is generally controlled manually or fixed through presetting at present, and for plates with certain processing errors or different size types, the clamping force of the clamp floats more, so that the process precision of the plates is uneven, the quality of a final finished product is affected, and the processing requirement of the high-end product at present is difficult to meet.
Disclosure of Invention
The embodiment of the invention aims to provide a plate positioning clamp and a clamping method thereof, which can solve the problems in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme:
In a first aspect, there is provided a panel positioning jig comprising:
Fixed carrier plate
The movable carrier plate and the inner side surface of the fixed carrier plate are opposite and are arranged at intervals so as to form a clamping space of a plate therebetween, and the movable carrier plate can reciprocate in the direction of approaching and separating from the fixed carrier plate through a movable mechanism to realize the adjustment of the size of the clamping space;
a plurality of groups of adsorption structures are uniformly distributed on the upper surface of the fixed carrier plate and the upper surface of the movable carrier plate respectively;
the distance meter is arranged above the clamping space and used for acquiring distance data between the distance meter and the plate positioned in the clamping space;
the movable carrier plate is movably arranged on the first support plate through the movable mechanism;
the movable mechanism is provided with a first fixed end and a first driving end, and is respectively connected with the first supporting plate and the movable carrier plate through the first fixed end and the first driving end;
The movable mechanism is arranged as an air cylinder, the air cylinder is positioned between the first supporting plate and the movable carrier plate, and a piston rod of the air cylinder is connected with the movable carrier plate through an auxiliary moving plate;
a clearance groove is formed in one side of the movable carrier plate, at least part of the movable auxiliary plate is movably positioned in the clearance groove, and the groove wall of the clearance groove is in guide fit with the movable auxiliary plate through a first guide mechanism;
a second guide mechanism is arranged between the first support plate and the movable carrier plate, and the number of the second guide mechanisms is at least two;
At least two second guide mechanisms are arranged at intervals along the length direction of the movable carrier plate and are respectively connected with the first support plate and the movable carrier plate;
the device also comprises a pressing plate mechanism which is movably arranged on the fixed carrier plate and/or the movable carrier plate, and the pressing plate mechanism is provided with a pressing plate position and a release position;
when the pressing plate mechanism is at the pressing plate position, the pressing plate mechanism at least partially protrudes out of the inner side surface of the fixed carrier plate and/or the movable carrier plate, and when the pressing plate mechanism is at the releasing position, the pressing plate mechanism is retracted into the inner side surface of the fixed carrier plate and/or the movable carrier plate.
As an optional implementation manner, multiple groups of adsorption structures on the fixed carrier plate are arranged at intervals along the extending direction of the inner side surface of the fixed carrier plate, and multiple groups of adsorption structures on the movable carrier plate are arranged at intervals along the extending direction of the inner side surface of the movable carrier plate;
Each group of adsorption structures comprises a plurality of vacuum adsorption holes, each group of adsorption structures is positioned in the adsorption structure of the fixed carrier plate, the plurality of vacuum adsorption holes are distributed at intervals from the outer side to the inner side of the upper surface of the fixed carrier plate, and each group of adsorption structures is positioned in the adsorption structure of the movable carrier plate, and the plurality of vacuum adsorption holes are distributed at intervals from the outer side to the inner side of the upper surface of the movable carrier plate.
As an alternative embodiment, further comprising:
The jacking mechanism is positioned between the fixed carrier plate and the movable carrier plate and can do lifting movement below the clamping space.
As an optional implementation manner, the fixed carrier plate is provided with a first movable port penetrating through the upper surface and the lower surface of the fixed carrier plate, and the inner side surface of the fixed carrier plate is also provided with a first telescopic port communicated with the first movable port;
The pressing plate mechanism comprises a first pressing plate assembly, the first pressing plate assembly comprises a first pressing plate driving device and a first pressing plate body, the first pressing plate driving device is arranged on the lower side of the fixed carrier plate, the first pressing plate driving device is provided with a second fixed end and a second driving end, the second fixed end is relatively fixed with the fixed carrier plate, the first pressing plate body is arranged on the second driving end and is positioned in the first movable opening, and the height of the upper surface of the first pressing plate body is smaller than or equal to that of the upper surface of the fixed carrier plate;
The second driving end is used for moving relative to the second fixing end so as to drive the first pressing plate body to extend out of the inner side surface of the fixed carrier plate or retract into the first movable opening through the first telescopic opening.
As an optional implementation manner, the movable carrier plate is provided with a second movable port penetrating through the upper surface and the lower surface of the movable carrier plate, and the inner side surface of the movable carrier plate is also provided with a second telescopic port communicated with the second movable port;
the pressing plate mechanism comprises a second pressing plate assembly, the second pressing plate assembly comprises a second pressing plate driving device and a second pressing plate body, the second pressing plate driving device is arranged on the lower side of the movable carrier plate, the second pressing plate driving device is provided with a third fixed end and a third driving end, the third fixed end is relatively fixed with the movable carrier plate, the second pressing plate body is arranged at the third driving end and is positioned in the second movable opening, and the height of the upper surface of the second pressing plate body is smaller than or equal to that of the upper surface of the movable carrier plate;
the third driving end is used for moving relative to the third fixing end so as to drive the second pressing plate body to extend out of the inner side surface of the movable carrier plate or retract into the second movable opening through the second telescopic opening.
In a second aspect, there is provided a board clamping method applied to the board positioning jig according to the first aspect, the board clamping method including the steps of:
S10, acquiring distance data between the plate and a plate in a clamping space through a range finder;
s20, judging whether the plate in the clamping space is arched or not according to the distance data;
s30, adjusting the clamping force applied to the plate by the movable carrier plate by adopting a proportional servo valve according to the judging result.
The plate positioning fixture has the beneficial effects that in the state of clamping the plate through the matching of the movable carrier plate and the fixed carrier plate, the relevant parts which need to be matched with the plate for processing are adsorbed and fixed on the fixed carrier plate and the movable carrier plate through the adsorption structures respectively uniformly distributed on the fixed carrier plate and the movable carrier plate, and the plate and the relevant parts take the positioning fixture as positioning references, so that the positioning precision of the plate and the relevant parts is provided, the error gap between the plate and the relevant parts which is not beneficial to the improvement of the process precision is eliminated, and the improvement of the final process effect is realized;
And under the state of carrying out the centre gripping to the plate through movable carrier plate and fixed carrier plate, the distancer accessible obtains its mode of the distance data with the plate and judges whether the plate is in the state of arching to adjust the clamping force that applys to the plate through movable carrier plate according to the judgement result, when guaranteeing that plate department is stabilized the centre gripping, avoid the clamping force too big and lead to the plate to arch and influence the condition of relevant technology precision, let the clamping force of applying on the plate obtain unification, thereby let this plate positioning fixture can satisfy higher technology demand, realize the promotion of final finished product quality.
Drawings
The invention is described in further detail below with reference to the drawings and examples.
Fig. 1 is a schematic diagram of a plate positioning fixture according to an embodiment of the present invention (omitting a PCB board);
FIG. 2 is a second schematic diagram of a plate positioning fixture according to an embodiment of the present invention (omitting a PCB and a range finder);
FIG. 3 is a third schematic view of a plate positioning fixture according to an embodiment of the present invention (omitting a range finder);
FIG. 4 is a side view of a panel positioning jig according to an embodiment of the present invention;
FIG. 5 is an exploded view of a panel positioning jig according to an embodiment of the present invention;
fig. 6 is a schematic view of the bottom structure of the plate positioning fixture according to the embodiment of the invention (the first support plate is omitted);
FIG. 7 is a cross-sectional view of a panel positioning jig according to an embodiment of the present invention;
fig. 8 is a flowchart of a method for clamping a board according to an embodiment of the invention.
10, A fixed carrier plate, 11, a first identification plate, 111, a first identification hole, 12, a first movable port, 121, a first telescopic port, 13, a second support plate, 20, a movable carrier plate, 21, a movable mechanism, 211, a first fixed end, 212, a first driving end, 22, a first support plate, 23, an auxiliary plate, 231, a guide port, 24, a position avoidance groove, 25, a first guide mechanism, 251, a guide rod, 26, a second guide mechanism, 27, a second identification plate, 271, a second identification hole, 28, a second movable port, 281, a second telescopic port, 30, a clamping space, 40, an adsorption structure, 41, a vacuum adsorption hole, 50, a range finder, 60, a pressing plate mechanism, 61, a first pressing plate assembly, 611, a first pressing plate driving device, 6111, a second fixed end, 6112, a second driving end, 612, a first pressing plate body, 62, a second pressing plate assembly, 621, a second pressing plate driving device, 6211, a third fixed end, 6212, a third pressing plate body and a third pressing plate body.
Detailed Description
In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "secured" and "fixed" are to be construed broadly, as for example, they may be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through intermediaries, or in communication between two elements or in interaction relationship between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The panel clamp is a tool for supporting a panel, which can firmly support the panel, prevent it from moving or deforming during processing or assembly, thereby improving processing accuracy and product quality.
In the related process flow, if the clamping force applied by the clamp to the plate is too large, the surface of the plate generates larger pressure, and the pressure can possibly cause deformation or deformation of the plate, so that the plate can arch on the clamp and the like, the matching precision between the plate and other processing parts is affected, and the related process effect is reduced. If the clamping force applied by the clamp to the plate is insufficient, the plate may move or slip due to vibration, external force interference or equipment precision problem in the corresponding process, resulting in reduced process precision or even damaged results.
Therefore, the clamping force of the clamp is particularly important for the plate process, and when the clamp is used for clamping the plate, the clamping force is reasonably adjusted according to the factors such as the material, the shape, the size and the processing requirement of the plate, so as to ensure the processing quality, the workpiece performance, the service life of the clamp and the operation safety. However, the clamping force of the existing clamp is generally controlled manually or fixed through presetting, and for plates with certain machining errors or different sizes, the clamping force is greatly floated, so that the process precision of the plates is uneven, the quality of the final finished product is affected, and the existing machining requirements for high-end products are difficult to meet.
In view of this, this embodiment provides a panel positioning fixture, it makes the clamp force that the fixture applyed to the panel can be adjusted according to the centre gripping condition of panel through optimizing the adjustment to the anchor clamps structure to, this panel positioning fixture still accessible sets up the adsorption structure and together stabilizes on the anchor clamps with the processing part that the panel cooperated processing, makes the positioning accuracy between panel and the processing part improved, solves the problem that panel technology level is lower.
In this embodiment, a solder paste printer is taken as an example, and the solder paste printer is a front end device of an SMT (surface mount technology) wire-finishing device, where the device is used to print solder paste or uniformly onto corresponding pads of a PCB (printed circuit board), so as to provide accurate solder paste coating for subsequent bonding and reflow soldering processes, and ensure that electronic components can be accurately and firmly soldered on the PCB.
The main function of the plate positioning clamp in the solder paste printer is to clamp and fix the PCB, so that the PCB is kept stable in the printing process, and poor printing caused by movement or deformation is prevented. In the actual operation process of the solder paste printer, the plate clamp fixes the PCB on the workbench through the plate positioning clamp, so that the PCB is accurately aligned with the steel mesh (the processing part), and then the scraper of the solder paste printer leaks solder paste onto the bonding pad of the PCB through the steel mesh.
As known from the background art, in the solder paste printing process, the clamping force of the PCB clamp has a significant influence on the effect of solder paste printing, when the clamping force is too large, the PCB may be deformed due to the excessive pressure, and such deformation may not only lead to the positional deviation of the bonding pad, but also affect the printing precision and consistency of the solder paste, and may also lead to the formation of a gap between the steel mesh and the PCB, resulting in the change of the positioning reference identified by the image acquisition unit, and affecting the uniformity and accuracy of final brushing tin. When the clamping force is too small, the PCB may be loosened due to the pressure of the scraper or the steel mesh in the printing process, and the loosening may cause the printing position of the solder paste to deviate, thereby affecting the printing quality.
It should be understood that the sheet material described in this embodiment refers to a planar, sheet-like material having a thickness and area, which may be metallic, non-metallic or composite, for various structural, decorative or functional purposes.
Referring to fig. 2-6 of the drawings, the plate positioning fixture includes a fixed carrier plate 10 and a movable carrier plate 20. The fixed carrier 10 is used in a manner of being relatively fixed with the related equipment (such as the solder paste printing equipment), and a connection structure with higher rigidity can be adopted between the fixed carrier 10 and the related equipment because of the relatively fixed relationship between the fixed carrier 10 and the related equipment, so that the connection strength between the fixed carrier 10 and the related equipment is higher, and the positioning accuracy of the fixed carrier 10 on the related equipment is higher because of the higher stability of the fixed carrier 10, so that the fixed carrier 10 can be used as a positioning reference of the plate in the positioning and clamping process. The movable carrier plate 20 is opposite to the fixed carrier plate 10 and is arranged at intervals, the inner side surface of the movable carrier plate 20 is opposite to the inner side surface of the fixed carrier plate 10 to form a clamping space 30 capable of accommodating corresponding plates, in order to facilitate more comprehensive understanding of the scheme, the inner side surfaces of the fixed carrier plate 10 and the movable carrier plate 20 are defined as clamping parts, the movable carrier plate 20 can reciprocate in the directions close to and far away from the fixed carrier plate 10 through the movable mechanism 21, and the effect of adjusting the size of the clamping space 30 by matching the clamping parts on the two carrier plates is achieved. The fixed carrier plate 10 and the movable carrier plate 20 are clamped on two opposite sides of the corresponding plate through the clamping parts respectively formed, or the plate is released, so that the plate can be positioned, clamped and fixed in the clamping space 30 for the subsequent processing process flow, or released after the corresponding process flow is finished, so that the plate can be conveyed to the next station.
It can be understood that the structure of the clamping portion of the fixed carrier plate 10 and the structure of the clamping portion of the movable carrier plate 20 may be determined according to the structure of two opposite sides of the plate to be clamped, and the structure of the clamping portion is not strictly limited or required in this embodiment, for example, when two opposite sides of the plate to be clamped by the clamping portion are two parallel planes, the two clamping portions may be adaptively set to two parallel clamping planes, so as to increase the contact area of the clamping portion on the side of the plate, and ensure that the plate can be stably clamped by the positioning fixture.
On the basis of the above-mentioned improvement of the positioning accuracy by the second support plate 13, the movable carrier plate 20 can contact with one side surface of the plate and push the plate to the fixed carrier plate 10, so that when the other side surface of the fixed carrier plate 10 abuts against the inner side surface (clamping part) of the fixed carrier plate 10, the positioning accuracy of the plate on the related equipment is improved while the plate can be clamped and fixed by the plate positioning clamp by using the fixed carrier plate 10 as the positioning reference.
On the basis of the above structure, the upper surfaces of the fixed carrier plate 10 and the movable carrier plate 20 are respectively and uniformly provided with a plurality of groups of adsorption structures 40, the adsorption structures 40 are used for adsorbing and fixing the processing components which need to be matched with the plate in the clamping space 30 on the plate positioning fixture, specifically, after the plate is fixedly clamped in the clamping area, the processing components can move above the clamping space 30 in a direction close to the plate positioning space and finally are placed on the fixed carrier plate 10 and the movable carrier plate 20, and are adsorbed and fixed by the adsorption structures 40 on the fixed carrier plate 10 and the movable carrier plate 20 respectively.
For easy understanding, the upper surfaces of the fixed carrier plate 10 and the movable carrier plate 20 are defined as supporting parts, the fixed carrier plate 10 and the movable carrier plate 20 are consistent, the clamping parts are adjacent to the fixed phase and are arranged at an angle, and the fixed carrier plate 10 and the movable carrier plate 20 are used for providing the carrying positions of the steel mesh, so that the fixed carrier plate 10 and the movable carrier plate 20 can serve as clamping parts of the plate, and can also serve as supporting bases of the steel mesh. In this way, in the state that the plate is clamped and fixed, the upper side surface of the plate is basically flush with the supporting parts of the fixed carrier plate 10 and the movable carrier plate 20, in this way, in the state that the steel mesh is placed on the supporting parts of the fixed carrier plate 10 and the movable carrier plate 20, the plate and the steel mesh can take the positioning clamp as the positioning reference, and the lower side surface of the steel mesh can be in a state that the lower side surface of the steel mesh is close enough to or even mutually attached to the upper side surface of the plate, so that the error gap between the plate and the steel mesh, which is unfavorable for improving the process precision, is eliminated, and the positioning precision between the plate and the steel mesh is provided, and the improvement of the final process effect is realized.
In this embodiment, the plurality of groups of adsorption structures 40 are uniformly arranged on the upper surfaces of the fixed carrier plate 10 and the movable carrier plate 20, so that the contact area between the fixed carrier plate 10, the movable carrier plate 20 and the adsorbed steel mesh can be maximized, the adsorption force applied by the plate positioning fixture to the steel mesh is uniform in size and distribution, and the positioning precision between the steel mesh and the PCB board is ensured.
It should be understood that the adsorption structure 40 disposed on the fixed carrier plate 10 and the movable carrier plate 20 may be, but is not limited to, vacuum adsorption (such as vacuum adsorption holes 41), magnetic adsorption (such as magnets or electromagnets), electrostatic adsorption (such as using electrostatic effect to attach the steel mesh to the supporting portion), adhesive adsorption (such as adhesive material or adsorption pad).
It should be noted that, in the embodiment of the adsorption structure 40 using the vacuum adsorption holes 41, one end of each vacuum adsorption hole 41 is respectively connected to the upper surfaces (supporting portions) of the fixed carrier plate 10 and the movable carrier plate 20, the other end of each vacuum adsorption hole is selectively penetrated through the lower surfaces or any side surfaces of the fixed carrier plate 10 and the movable carrier plate 20 according to the design requirement of the positioning fixture, and the other end of each vacuum adsorption hole 41 is connected with a vacuum source outside the plate positioning fixture. It should be noted that, in order to avoid interference between the vacuum source (or the pipe between the vacuum source and the vacuum suction hole 41) and the PCB board, the other end of the vacuum suction hole 41 should avoid penetration to the inner sides of the fixed carrier plate 10 and the movable carrier plate 20.
Based on the above technical solution, it should be further noted that the plate positioning fixture further includes a distance meter 50, where the distance meter 50 is specifically configured to measure a distance between two objects, and in this embodiment, the distance meter 50 may, but is not limited to, use a laser distance meter 50, an ultrasonic distance meter 50, and an infrared distance meter 50.
The range finder 50 is specifically disposed above the clamping space 30, and is configured to obtain distance data between the range finder and a board located in the clamping space 30, determine whether the PCB board is arched in a state clamped by the board positioning fixture according to a change of the distance data, and control a clamping force applied to the PCB board by the movable carrier 20 according to a determination result, so as to ensure that the PCB board can be stably clamped without deformation caused by excessive clamping force, and ensure that the PCB board and the steel mesh are in a relatively stable state, and both positioning accuracy and machining accuracy can be improved.
Meanwhile, since the clamping force of the movable carrier plate 20 applied to the PCB board is determined according to the distance data collected by the distance meter 50, the clamping force of the movable carrier plate 20 applied to the board can be changed according to the size and type of the board, or the deformation coefficient and the size error, so that the clamping effect is unified, and the board positioning fixture can meet higher process requirements, and the quality of the final product is improved.
With reference to fig. 2-7, the board positioning fixture further includes a first support plate 22, where the first support plate 22 is used to support the movable carrier plate 20, and the movable carrier plate 20 is movably mounted on the first support plate 22 through a movable mechanism 21, so that the first support plate 22 can provide a corresponding mounting position for mounting the movable carrier plate 20 on a related device (such as the above-mentioned solder paste printing device), so that the movable carrier plate 20 can be movably disposed on the solder paste printing device, and the fixed carrier plate 10 can be directly mounted on the solder paste printing device on the related device because the movable carrier plate is not required to be disposed in a movable form.
Further, the movable mechanism 21 has a first fixed end 211 and a first driving end 212, the first driving end 212 can reciprocate along a preset direction relative to the first fixed end 211, the movable mechanism 21 is specifically connected to the first support plate 22 through the first fixed end 211, so that the first fixed end 211 can be relatively fixed with the solder paste printing device through the first support plate 22, and the movable carrier 20 is disposed at the first driving end 212, so that the movable carrier 20 can be driven by the first driving end 212 to move along the preset direction together during the movement of the first driving end 212 relative to the first fixed end 211.
It can be understood that the first driving end 212 is a power source for implementing reciprocating movement and positioning of the movable mechanism 21 in this example, and the first driving end 212 can drive a component connected with the movable carrier 20 along a preset direction under the action of the power source, by adopting the above arrangement mode, the movable carrier 20 can be stably mounted on the first supporting plate 22, meanwhile, the structure between the first supporting plate 22 and the movable carrier 20 is simple and compact, no other complex connection and matching structure is provided, and only the movable mechanism 21 and the guiding mechanism described in the following are connected, so that the matching precision between the movable carrier 20 and the first supporting plate 22 can be improved, and the stability and precision of the plate positioning fixture can be further improved in the clamping process or in the clamping state by reducing the movement error of the movable carrier 20 as much as possible on the basis of ensuring the positioning precision of the fixed carrier 10.
In an embodiment, the movable mechanism 21 is configured as an air cylinder, and the design of the air cylinder has the characteristics of compact structure and easy installation and maintenance, which is beneficial to the arrangement between the movable carrier plate 20 and the first support plate 22, and is convenient for the installation of the movable carrier plate 20 and the first support plate 22, and meanwhile, the distance between the movable carrier plate 20 and the first support plate 22 can be reduced, so that the space area occupied by the plate positioning fixture on the solder paste printing device is controlled, and the vibration generated by the movable carrier plate 20 during the movement relative to the first support plate 22 is reduced, thereby improving the control precision of the movable carrier plate 20. Although the positioning accuracy of the air cylinder may not be as high as that of the electric actuator, the air cylinder can still meet the control and adjustment of the clamping force of the movable carrier 20, and the air cylinder can meet the requirement of the movable carrier 20 on the control of the clamping force on the basis of effectively controlling the cost of the movable mechanism 21. In addition, the movement stroke of the air cylinder is larger, so that the plate positioning clamp can be suitable for more PCBs of different sizes and types when the air cylinder is applied between the movable carrier plate 20 and the first support plate 22, and the universality of the clamp is improved.
It can be understood that the first fixed end 211 of the movable mechanism 21 is configured as a cylinder body of the cylinder, and the first driving end 212 is configured as a piston rod of the cylinder, and the movement direction of the piston rod determines the movement direction of the movable carrier plate 20, so that the piston rod of the cylinder in the present embodiment extends from one end of the cylinder body to a direction approaching or separating from the fixed carrier plate 10, so that when the piston rod can be connected to the movable carrier plate 20, the movable carrier plate 20 is driven to reciprocate in a direction approaching or separating from the fixed carrier plate 10.
The cylinder body of the air cylinder is specifically disposed between the first support plate 22 and the movable support plate 20, so that the movable support plate 20 and the first support plate 22 provide protection for the air cylinder to a certain extent, and the compactness of the structure among the movable support plate 20, the movable mechanism 21 and the first support plate 22 can be improved. Because the cylinder can only move along the preset direction, the piston rod cannot be directly connected with the movable carrier 20 (if the cylinder is directly connected with the piston rod, the movable carrier 20 can only be driven to lift), and the cylinder body and the piston rod are parallel to the first support plate 22 and the movable carrier 20, and are connected with the movable carrier 20 through the auxiliary moving plate 23, generally, due to the characteristics of the plate processing technology, the outer side surfaces of the auxiliary moving plate 23 are perpendicular to the front side surfaces and the rear side surfaces of the movable carrier 20, and thus the auxiliary moving plate 23 can be arranged perpendicular to the piston rod and the movable carrier 20. The movable plate 23 may be disposed perpendicular to the movable carrier 20, so that the piston rod is perpendicular to the front side and/or the rear side of the movable carrier 23, and the movable plate 23 may be connected to the piston rod through the front side and/or the rear side of the movable carrier 23, and of course, the piston rod may also be connected to the movable carrier 23 through a penetrating manner, and may respectively drive the movable carrier 23 to move in the front-rear direction through limiting mechanisms (such as nuts shown in fig. 5) disposed on the front and rear sides of the movable carrier 23, and the movable carrier 20 may be mounted on the lower surface of the movable carrier 20 through the outer side thereof, so as to reduce the difficulty of assembly floating between the movable carrier 20 and the cylinder, and improve the assembly precision.
In the above embodiment, the position of the fixed carrier plate 10 corresponding to the position provided with the moving plate 23 is further provided with the avoiding groove 24, the avoiding groove 24 penetrates through the upper and lower sides of the fixed carrier plate 10, the notch of the avoiding groove 24 is provided on the edge of the fixed carrier plate 10, and at least part of the moving plate 23 is movably located in the avoiding groove 24, so that the part of the moving plate 23 located in the avoiding groove 24 can be arranged opposite to the groove wall of the avoiding groove 24 (also can be understood as the edge of the fixed carrier plate 10), so as to provide corresponding installation space for the guiding mechanism described later, and ensure that the plate positioning fixture has compact structure.
In the above embodiment, since the clearance between the first support plate 22 and the movable carrier plate 20 is small, the clearance groove 24 for accommodating part of the movable carrier plate 23 is formed in the fixed carrier plate 10, interference between the movable carrier plate 23 and the fixed carrier plate 10 can be avoided, and the guiding accuracy of the movable mechanism 21 can be improved by further providing a guiding structure between the groove wall of the clearance groove 24 and the movable carrier plate 23 due to the low guiding accuracy of the cylinder itself.
Further, the groove wall of the avoidance groove 24 is in guiding engagement with the auxiliary moving plate 23 by the first guiding mechanism 25, the first guiding mechanism 25 may be configured as a guiding rod 251 disposed between the auxiliary moving plate 23 and the groove wall of the avoidance groove 24, as shown in fig. 5, when the guiding rod 251 is disposed on the groove wall of the avoidance groove 24, the guiding rod 251 is disposed parallel to the piston rod of the cylinder, and a guiding opening 231 matched with the guiding rod 251 may be disposed on the auxiliary moving plate 23.
Of course, the structure of the first guide mechanism 25 is not limited to this, and the first guide mechanism 25 can also implement the guide to the moving direction of the movable carrier 20 through other guide structures such as the cooperation of the guide groove and the guide block, which are beneficial to improving the stability of the air cylinder, but obviously, the implementation of the cooperation of the guide rod 251 and the guide opening 231 is more beneficial to controlling the cost of the plate positioning fixture.
In this embodiment, in order to improve the versatility of the board positioning fixture, the fixed carrier plate 10 and the movable carrier plate 20 are configured to have a long-bar-like plate structure, so that the movable carrier plate 20 will bring a large burden to the movable mechanism 21 relative to the movement of the fixed carrier plate 10, and the movable carrier plate 20 will also tilt on the first support plate 22, which affects the clamping effect of the PCB board. Therefore, in one embodiment, in order to improve the stability of the movement between the first support plate 22 and the movable carrier 20, at least two movable mechanisms 21 are provided, and at least two movable mechanisms 21 are spaced apart along the length direction of the plate, so as to ensure that the driving force acting on the movable carrier 20 is more uniform, and the stability of the movable carrier 20 is improved.
Of course, in other embodiments, the movable mechanism 21 may also, but is not limited to, use an electric drive (e.g., a motor), a hydraulic drive, and other pneumatic drives.
In an embodiment, referring to fig. 2-6, in order to further improve stability of the movable carrier 20 during movement relative to the first support plate 22, a second guide mechanism 26 is further disposed between the first support plate 22 and the movable carrier 20, and at least two second guide mechanisms 26 are arranged at intervals along the length direction of the movable carrier 20 and are respectively connected to the first support plate 22 and the movable carrier 20.
In an embodiment, the second guiding mechanism 26 may be disposed near opposite ends of the first supporting plate 22 and the movable supporting plate 20, respectively, so as to enlarge the guiding range of the second guiding mechanism 26 to the movable supporting plate 20 to the maximum extent and reduce the inclination of the movable supporting plate 20 relative to the first supporting plate 22;
In another embodiment, the second guiding mechanisms 26 and the movable mechanisms 21 may be alternately arranged along the length direction, so that the movable carrier 20 can be uniformly guided and supported by the second guiding mechanisms 26 along the length direction, and the connection area between the movable carrier 20 and the first supporting plate 22 can be further increased by combining the above-mentioned embodiment of arranging the first guiding mechanisms 25 on the basis of the movable mechanisms 21, so that the movable carrier 20 can be clamped on the PCB board more stably by improving the movement positioning precision of the movable carrier 20 on the solder paste printing apparatus through the first supporting plate 22 while improving the matching stability between the two.
It will be appreciated that, in order to save space occupied by the second guide structure and improve the structural compactness of the panel positioning jig, the second guide mechanism 26 is disposed between the gap of the first support plate 22 and the movable carrier plate 20 in correspondence with the movable mechanism 21. In this example, since the second guide mechanism 26 does not need to be integrally provided with the movable mechanism 21 and other related components, the second guide mechanism 26 has a wider layout space between the movable carrier 20 and the first support plate 22, and thus the second guide mechanism 26 may be a guide structure with higher guide stability, but may be, but not limited to, a linear guide or the like.
With continued reference to fig. 1-5, as a specific embodiment of the adsorption structure 40, the plurality of groups of adsorption structures 40 on the fixed carrier plate 10 are arranged at intervals along the extending direction of the inner side surface of the fixed carrier plate 10, and the plurality of groups of adsorption structures 40 on the movable carrier plate 20 are arranged at intervals along the extending direction of the inner side surface of the movable carrier plate 20, so that the two opposite sides of the steel mesh can be stably adsorbed on the supporting parts of the fixed carrier plate 10 and the movable carrier plate 20 in a state of being carried on the two, and the whole steel mesh cannot have the problems of warping, bulging and the like due to the uniformly distributed relation of the adsorption structures 40 along the length direction, so that the PCB board can be uniformly attached to the steel mesh, thereby being beneficial to the subsequent solder paste printing process.
Specifically, each set of suction structures 40 includes a plurality of vacuum suction holes 41. Each group is located in the adsorption structure 40 of the fixed carrier 10, and a plurality of vacuum adsorption holes 41 are arranged at intervals from the outer side to the inner side of the upper surface of the fixed carrier 10. And, each group is located in the adsorption structure 40 of the movable carrier 20, and the plurality of vacuum adsorption holes 41 are arranged at intervals from the outer side to the inner side of the upper surface of the movable carrier 20. Through the above arrangement, the adsorption structure 40 can provide stable adsorption force in the length direction or the width direction of the fixed carrier plate 10 and the movable carrier plate 20, and the adsorption area of the plate positioning fixture and the steel mesh is increased as much as possible in the limited support area, so that the adsorption stability of the steel mesh on the fixed carrier plate 10 and the movable carrier plate 20 is higher, and the steel mesh can still maintain a relatively stable matching relationship with the fixed carrier plate 10 and the movable carrier plate 20 even if the steel mesh is propped by the PCB.
In one embodiment, the distance between any adsorption structure 40 on the fixed carrier 10 and the inner side plate edge of the fixed carrier 10 is set to be greater than the distance between the adsorption structure 40 on the movable carrier 20 and the inner side plate edge of the movable carrier 20. So reduce the processing degree of difficulty of adsorption structure 40 on fixed carrier plate 10 and movable carrier plate 20 on guaranteeing to have stronger adsorption affinity to the steel mesh to, because above-mentioned vacuum adsorption hole 41 is used for the one end setting that is connected with the vacuum source in fixed carrier plate 10 and movable carrier plate 20 outer panel edge department, consequently, set up vacuum adsorption hole 41 as the mode that is close to the carrier plate outside, can reduce the burden of vacuum source, improve the adsorption capacity of vacuum adsorption hole 41.
In an embodiment, referring to fig. 1 to 5, a first marking hole 111 is formed on the upper surface of the fixed carrier 10, and the first marking hole 111 is disposed near the inner side of the fixed carrier 10. And, the upper surface of the movable carrier 20 is provided with a second identification hole 271, and the second identification hole 271 is arranged close to the inner side of the movable carrier 20. The first identification holes 111 on the fixed carrier plate 10 and the second identification holes 271 on the movable carrier plate 20 may be provided in plurality, and the first identification holes 111 and the second identification holes 271 are used for positioning and identifying by an image acquisition unit (such as a camera) in a plate positioning fixture, so that the image acquisition unit can further determine the relative positions of the PCB and the plate positioning fixture by identifying Mark points (positioning points or reference points) on the PCB under the condition that the plate positioning fixture clamps the PCB, thereby improving the accuracy of the subsequent steel mesh in preventing and brushing tin.
As can be appreciated from the above embodiments, the fixed carrier 10 and the movable carrier 20 have a strip structure, in an embodiment, in order to ensure that the positioning accuracy of the fixed carrier 10 and the movable carrier 20 can meet the clamping requirement of the PCB, the fixed carrier 10 is configured to include first identification plates 11 located at opposite ends of the body of the fixed carrier 10, the first identification holes 111 are formed in the first identification plates 11, and the movable carrier 20 is configured to include second identification plates 27 located at opposite ends of the body of the movable carrier 20. The first identification plate 11 and the second identification plate 27 respectively set the fixed carrier plate 10 and the movable carrier plate 20 to be of a partially split structure, so that the processing difficulty of the carrier plate can be reduced, the space for subsequent assembly and debugging is improved, and the risk of precision reduction of the plate positioning clamp along with the time is reduced.
In an embodiment, the first identification hole 111 and the second identification hole 271 can be respectively formed in the first identification plate 11 and the second identification plate 27, so that the difficulty in machining the body of the fixed carrier plate 10 and the body of the movable carrier plate 20 can be reduced by machining the identification holes on the identification plates. Of course, in some embodiments, the first identification hole 111 and the second identification hole 271 may be disposed on the body of the fixed carrier plate 10 and the body of the movable carrier plate 20, respectively, or the first identification hole 111 may be disposed on the body of the fixed carrier plate 10 and the first identification plate 11 at the same time, and the second identification hole 271 may be disposed on the body of the movable carrier plate 20 and the second identification plate 27 at the same time, so that the image capturing unit can identify and position the identification holes with corresponding pitches according to the plates with different types and sizes.
In one embodiment, as shown in fig. 2-7, the plate positioning fixture further includes a platen mechanism 60, where the platen mechanism 60 is movably disposed on the fixed carrier 10 and/or the movable carrier 20, and the platen mechanism 60 has a platen position and a release position. When the pressing plate mechanism 60 is at the pressing plate position, the pressing plate mechanism 60 protrudes out of the inner side surface of the fixed carrier plate 10 and/or the movable carrier plate 20 at least partially, so that the pressing plate mechanism 60 protruding out of the inner side surface of the fixed carrier plate 10 and/or the inner side surface of the movable carrier plate 20 can be positioned in the clamping space 30 to restrict the height position of the plate in the clamping space 30, when the PCB moves upwards below the clamping space 30, the upper surface of the PCB can be propped against the pressing plate mechanism 60 at the pressing plate position to ensure that the height position of the PCB meets the subsequent tin brushing requirement and further clamps and fixes the PCB, and when the pressing plate mechanism 60 is at the release position, the pressing plate mechanism 60 is retracted into the inner side surface of the fixed carrier plate 10 and/or the movable carrier plate 20 to release the PCB positioned in the clamping space 30, so that the PCB can move away from the corresponding station relative to the plate positioning clamp or enter the clamping space 30 from the previous station.
The existence of the pressing plate mechanism 60 can enable the height position of the PCB to be restrained before the PCB is clamped and fixed, enable the height position of the PCB on the plate positioning clamp to meet the matching requirement with a steel mesh, and enable the subsequent tin brushing operation to be more stable.
Based on the above embodiment, the plate positioning fixture further includes a lifting mechanism (not shown), which is located between the fixed carrier plate 10 and the movable carrier plate 20 and can perform lifting movement under the clamping space 30.
In the practical application scene, the PCB is transported to the jacking mechanism from the last station equipment and is supported by the jacking mechanism, so that the jacking mechanism can drive the PCB to move up and down in the direction of approaching or separating from the clamping space 30 in the moving direction, and can drive the PCB to enter or leave the clamping space 30. Under the cooperation of the pressing plate mechanism 60, before the lifting mechanism drives the PCB to lift up from the outside of the clamping space 30 to the clamping space 30, the pressing plate mechanism 60 can be switched from the release position to the pressing plate position, so that when the PCB is lifted up by the lifting mechanism, the height position of the PCB can be limited by the pressing plate mechanism 60, the situation that the lifting mechanism excessively lifts up the PCB is avoided, and the final position of the PCB is ensured to meet the requirement of subsequent tin brushing.
Specifically, taking the above embodiment as an example, the process of clamping and fixing the PCB board by the board positioning fixture of this embodiment is as follows:
The PCB board is carried to solder paste conveying equipment from last station equipment of solder paste printing equipment through the transfer chain and is located the below of plate positioning fixture, afterwards, the PCB board rises, get into in the centre gripping space 30 from centre gripping space 30 below, the lift of movable carrier plate 20 and fixed carrier plate 10 is greater than the width dimension of PCB board this moment, and let clamp plate mechanism 60 switch over to the clamp plate position from the release position, make the PCB board can support in clamp plate mechanism 60 and be restrained its high position by clamp plate mechanism 60 during rising, finally, movable carrier plate 20 moves towards being close to fixed carrier plate 10, in order to support the PCB board to the position of supporting fixed carrier plate 10, let movable carrier plate 20 can press from the PCB board of clamp with fixed carrier plate 10 cooperation.
The image acquisition unit determines the relative position of the PCB and the plate positioning fixture by identifying the first identification hole 111, the second identification hole 271 and Mark points on the PCB, and places the steel mesh at the position corresponding to the PCB according to the corresponding position information, and adsorbs and fixes the steel mesh through the adsorption structure 40 arranged on the fixed carrier plate 10 and the movable carrier plate 20, waiting for the proceeding of the subsequent tin brushing process.
Referring to fig. 2-7, in order to ensure that the existence of the pressing plate mechanism 60 does not cause excessive redundancy in the structure of the plate positioning fixture, in this embodiment, the fixed carrier plate 10 is provided with a first movable opening 12 penetrating through the upper and lower surfaces thereof, and the inner side surface of the fixed carrier plate 10 is further provided with a first telescopic opening 121 communicating with the first movable opening 12. The platen mechanism 60 includes a first platen assembly 61, the first platen assembly 61 includes a first platen driving device 611 and a first platen body 612, the first platen driving device 611 is disposed at the lower side of the fixed carrier 10, the first platen driving device 611 has a second fixed end 6111 and a second driving end 6112, the second fixed end 6111 is relatively fixed to the fixed carrier 10, the first platen body 612 is disposed at the second driving end 6112 and is located in the first movable opening 12, and the second driving end 6112 is used for moving relative to the second fixed end 6111 to drive the first platen body 612 to extend out of the inner side surface of the fixed carrier 10 through the first telescopic opening 121 or retract into the first movable opening 12.
The height of the upper surface of the first pressing plate body 612 is less than or equal to the height of the upper surface of the fixed carrier plate 10, so as to avoid the steel mesh from being arched due to interference of the first pressing plate when being supported by the fixed carrier plate 10 and the movable carrier plate 20.
In an embodiment, the fixed carrier 10 is further provided with a sink structure on the peripheral side of the first movable opening 12, so that the first platen assembly 61 can be partially disposed in the sink, and by combining the first movable opening 12, the first platen body 612 can save the space occupied by the first platen assembly 61 on the fixed carrier 10 by using the thickness dimension of the fixed carrier 10, thereby meeting the design requirement of the fixed carrier 10 for the compactness of the structure.
In an embodiment, in order to enable the fixed carrier plate 10 to be stably mounted on the solder paste printing apparatus, a second support plate 13 is further disposed on the lower surface of the fixed carrier plate 10, and the second fixing end 6111 of the first platen driving device 611 can be fixedly connected with the second support plate 13 while the fixed carrier plate 10 can be mounted on the solder paste printing apparatus through the second support plate 13.
In keeping with the fixed carrier plate 10, the movable carrier plate 20 is provided with a second movable opening 28 penetrating through the upper and lower surfaces thereof, and the inner side surface of the movable carrier plate 20 is also provided with a second telescopic opening 281 communicating with the second movable opening 28. Correspondingly, the platen mechanism 60 includes a second platen assembly 62, the second platen assembly 62 includes a second platen driving device 621 and a second platen body 622, the second platen driving device 621 is disposed at the lower side of the movable carrier 20, while in the above embodiment provided with the first support plate 22, the second platen driving device 621 is located between the movable carrier 20 and the first support plate 22, the second platen driving device 621 has a third fixed end 6211 and a third driving end 6212, the third fixed end 6211 is relatively fixed to the movable carrier 20, the second platen body 622 is disposed at the third driving end 6212 and is located in the second movable opening 28, and the third driving end 6212 is used for moving relative to the third fixed end 6211 to drive the second platen body 622 to extend out of the inner side surface of the movable carrier 20 through the second telescopic opening 281 or retract into the second movable opening 28.
And, as such, the height of the upper surface of the second platen body 622 is less than or equal to the height of the upper surface of the movable carrier 20.
As shown in fig. 1 to 8, the present embodiment further provides a board clamping method, which is applied to the board positioning fixture as described above, and specifically, the board clamping method includes the steps of:
S10, acquiring distance data between the plate and the plate in the clamping space 30 through a distance meter 50;
s20, judging whether the plate in the clamping space 30 is arched or not according to the distance data;
and S30, adjusting the clamping force applied to the plate by the movable carrier plate 20 by adopting the proportional servo valve according to the judging result.
In the step S30, if the determination result is yes, the clamping force applied to the plate by the movable carrier 20 is reduced through the proportional servo valve;
if the judgment result is negative, the clamping force applied to the plate by the movable carrier plate 20 is increased through the proportional servo valve until the judgment result is positive, and then the clamping force applied to the plate by the movable carrier plate 20 is reduced through the proportional servo valve until the re-judgment result is negative. The state may be repeated all the time, or if the state is judged again, the control of the movable carrier 20 may be stopped by the proportional servo valve, and the movable carrier 20 may be stopped in the current state.
In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are merely for convenience of description and to simplify the operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.
In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411518941.4A CN119017305B (en) | 2024-10-29 | 2024-10-29 | Plate positioning clamp and clamping method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411518941.4A CN119017305B (en) | 2024-10-29 | 2024-10-29 | Plate positioning clamp and clamping method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119017305A CN119017305A (en) | 2024-11-26 |
| CN119017305B true CN119017305B (en) | 2025-01-21 |
Family
ID=93534140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411518941.4A Active CN119017305B (en) | 2024-10-29 | 2024-10-29 | Plate positioning clamp and clamping method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119017305B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109087884A (en) * | 2018-10-15 | 2018-12-25 | 安徽宏实自动化装备有限公司 | A kind of chucking device for IC package processing procedure |
| CN209946312U (en) * | 2019-03-07 | 2020-01-14 | 深圳市迅科达智能科技有限公司 | Universal structure of flat test equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2604384B (en) * | 2021-03-04 | 2024-12-25 | Jaguar Land Rover Ltd | Clamping plates for battery manufacture |
| CN215720043U (en) * | 2021-07-20 | 2022-02-01 | 日达智造科技(如皋)有限公司 | Assembling jig |
| CN217283632U (en) * | 2022-02-07 | 2022-08-23 | 深圳市鸿泰精密线路有限公司 | Positioning jig for processing circuit board patches |
-
2024
- 2024-10-29 CN CN202411518941.4A patent/CN119017305B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109087884A (en) * | 2018-10-15 | 2018-12-25 | 安徽宏实自动化装备有限公司 | A kind of chucking device for IC package processing procedure |
| CN209946312U (en) * | 2019-03-07 | 2020-01-14 | 深圳市迅科达智能科技有限公司 | Universal structure of flat test equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119017305A (en) | 2024-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3527374B1 (en) | Screen printer | |
| JP2009143110A (en) | Screen printing machine | |
| WO2019138569A1 (en) | Backup block and screen-printing machine | |
| CN110370803A (en) | A kind of pcb board jet printer and pcb board spray printing production line | |
| CN118742003A (en) | Continuous flexible light strip placement machine | |
| CN108698399B (en) | Screen printing machine | |
| CN119017305B (en) | Plate positioning clamp and clamping method thereof | |
| JP2009154354A (en) | Screen printing apparatus, screen printing method, substrate holding apparatus, and substrate holding method | |
| EP1228676B1 (en) | Method and apparatus for holding a printed circuit board in a precise position during processing | |
| JP6086435B2 (en) | PCB clamp device | |
| JP3284189B2 (en) | Screen printing equipment | |
| JP3284188B2 (en) | Screen printing equipment | |
| JPS6284871A (en) | Screen printing machine for print board | |
| WO2019234791A1 (en) | Screen printing machine | |
| JP3888442B2 (en) | Screen printing apparatus and screen printing method | |
| JP4774605B2 (en) | Screen printing device | |
| JP3313322B2 (en) | Screen printing equipment | |
| CN220722556U (en) | Truss CCD positioning clamping mechanism | |
| CN222655644U (en) | Metal sheet laminating machine | |
| CN219812313U (en) | Mounting mechanism and patch equipment | |
| US20250001753A1 (en) | Stencil printer | |
| CN218964497U (en) | Automatic adjusting mechanism for substrate welding | |
| CN223160260U (en) | A pre-processing equipment for high-precision SMT laser processing production line | |
| JP2013159022A (en) | Screen printer | |
| CN217671808U (en) | Ink-jet action platform of flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |