CN118922799A - Information processing device and circuit module - Google Patents

Abstract

An information processing device and a circuit module are provided, which have a heat dissipation structure suitable for miniaturization of the information processing device and excellent in heat dissipation capability. The information processing device of the present technology comprises a first substrate, a second substrate, a connecting portion, an electronic component and a working fluid. The second substrate is opposite to the first substrate. The connecting portion is arranged between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and seals the space between the first substrate and the second substrate. The electronic component is mounted on the first substrate or the second substrate and is located in the space. The working fluid is sealed in the space and evaporated by the heat generated by the electronic component.

Description

Information processing device and circuit module

Technical Field

The present technology relates to an information processing device and a circuit module with a heat dissipation structure.

Background Art

As the computing speed and communication speed of information processing devices such as smartphones increase, the heat generated by built-in electronic components tends to increase, and thus an improvement in heat dissipation capability is sought. For example, Patent Document 1 discloses a mobile phone terminal having a Peltier element and a heat sink.

Patent Document 1: Japanese Patent Application Publication No. 2010-171180.

In recent years, as information processing devices have become smaller, the internal space of the housing has decreased. Therefore, as described in Patent Document 1, it is difficult to mount a large-sized heat dissipation component on the information processing device.

Summary of the invention

In view of the above circumstances, an object of the present technology is to provide an information processing device and a circuit module having a heat dissipation structure that is suitable for miniaturization of the information processing device and has excellent heat dissipation capability.

In order to achieve the above-mentioned object, an information processing device according to one aspect of the present technology includes a first substrate, a second substrate, a connection portion, an electronic component, and a working liquid.

The second substrate is opposite to the first substrate.

The connection portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and seals a space between the first substrate and the second substrate.

The electronic component is mounted on the first substrate or the second substrate and is located in the space.

The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.

The electronic component may be an IC (Integrated Circuit).

The boiling point of the working fluid may be 80° C. or higher and 120° C. or lower.

The working fluid may also be an insulating liquid.

The working fluid may also be pure water.

The above working fluid may also be mineral oil.

The information processing device may further include an insulating layer covering an inner peripheral surface of the space and a surface of the electronic component.

The connecting portion may be an interposer.

The connection portion may also be welded to the first substrate and the second substrate.

In order to achieve the above-mentioned object, a circuit module according to one aspect of the present technology includes a first substrate, a second substrate, a connection portion, an electronic component, and a working fluid.

The second substrate is opposite to the first substrate.

The connection portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and seals a space between the first substrate and the second substrate.

The electronic component is mounted on the first substrate or the second substrate and is located in the space.

The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an information processing device according to an embodiment of the present technology.

FIG. 2 is a cross-sectional view of a circuit module of the heat dissipation structure 1 included in the information processing device.

FIG. 3 is a top view of the circuit module.

FIG. 4 is a schematic diagram showing the operation of the above-mentioned circuit module.

FIG. 5 is a schematic diagram showing the operation of the above-mentioned circuit module.

FIG. 6 is a cross-sectional view of a circuit module according to a comparative example.

FIG. 7 is a cross-sectional view of a circuit module of the heat dissipation structure 1 included in the information processing device.

FIG. 8 is a cross-sectional view of a circuit module of the heat dissipation structure 2 included in the information processing device.

FIG. 9 is a cross-sectional view of a circuit module according to a comparative example.

FIG. 10 is a cross-sectional view of a circuit module of the heat dissipation structure 2 included in the information processing device.

FIG. 11 is a cross-sectional view of a circuit module of the heat dissipation structure 3 included in the information processing device.

FIG. 12 is a cross-sectional view of a circuit module according to a comparative example.

DETAILED DESCRIPTION

An information processing device according to an embodiment of the present technology will be described.

1 is a perspective view of an information processing device 100 according to the present embodiment. As shown in the figure, the information processing device 100 is a smart phone, and includes a display panel 110 and a housing 120. Hereinafter, the surface on the display panel 110 side of the information processing device 100 is referred to as a front surface 100a, and the surface on the side opposite to the display panel 110 is referred to as a back surface 100b.

[Heat dissipation structure of information processing device 1]

Fig. 2 is a cross-sectional view of a circuit module 150 provided in the information processing device 100, and Fig. 3 is a top view of the circuit module 150. As shown in these figures, the circuit module 150 includes a first substrate 151, a second substrate 152, a connecting portion 153, an electronic component 154, and a working fluid 155. In Fig. 3, the second substrate 152 and the working fluid 155 are not shown.

The first substrate 151 is a circuit substrate on which various components are mounted, such as a glass epoxy substrate. The first substrate 151 is arranged opposite to the second substrate 152, and has a first main surface 151a on the second substrate 152 side and a second main surface 151b on the side opposite to the second substrate 152. The first substrate 151 has a planar shape corresponding to the arrangement of components in the information processing device 100, such as the planar shape shown in FIG. 3.

The second substrate 152 is a circuit substrate for mounting various components, such as a glass epoxy substrate. The second substrate 152 is arranged opposite to the first substrate 151, and has a third main surface 152a on the first substrate 151 side and a fourth main surface 152b on the side opposite to the first substrate 151. The second substrate 152 has a planar shape corresponding to the arrangement of components in the information processing device 100, for example, the same planar shape as the first substrate 151 shown in FIG.

The connecting portion 153 physically and electrically connects the first substrate 151 and the second substrate 152. As the connecting portion 153, an interposer can be used. As shown in FIG. 3, the connecting portion 153 has an annular shape, and as shown in FIG. 2, is arranged between the first substrate 151 and the second substrate 152. The connecting portion 153 is bonded to the first principal surface 151a and the third principal surface 152a to seal the space between the first substrate 151 and the second substrate 152. Hereinafter, the space surrounded by the first substrate 151, the second substrate 152 and the connecting portion 153 is set as a sealed space R. In addition, the surface of the connecting portion 153 on the sealed space R side is set as a side surface 153a.

The connection portion 153 is provided with wiring, and the wiring contacts the electrodes provided on the first main surface 151a and the third main surface 152a, thereby electrically connecting the first substrate 151 and the second substrate 152. The connection portion 153 and the first substrate 151 and the second substrate 152 may be joined by any method as long as the sealed space R can be sealed and they can be electrically connected, for example, welding.

The electronic component 154 is mounted on the first main surface 151a and is located in the sealed space R. The electronic component 154 is any electronic component including a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a SoC (System on a Chip) or other IC (Integrated Circuit). The electronic component 154 generates heat through operations such as calculation processing, and the highest temperature at which the electronic component 154 can operate normally is set as the heating temperature. The heating temperature is generally above 80°C and below 120°C. The electronic component 154 may be installed in multiples on the first main surface 151a as shown in FIG. 3, or only one may be installed. In addition, one or more electronic components 154 may be installed on the third main surface 152a.

The working liquid 155 is sealed in the sealed space R to dissipate heat from the circuit module 150. The working liquid 155 is a liquid that evaporates due to the heat generated by the electronic component 154. That is, the working liquid 155 is a liquid having a boiling point below the heat generation temperature of the electronic component 154, specifically, a liquid having a boiling point of 80° C. to 120° C. The working liquid 155 is preferably an insulating liquid, such as pure water or mineral oil.

The circuit module 150 has the above-described structure. The first substrate 151 and the second substrate 152 are arranged so that one is on the front surface 100a side of the information processing device 100 and the other is on the back surface 100b side, but both may be on the front surface 100a side.

The operation of the circuit module 150 will be described. FIG4 and FIG5 are schematic diagrams showing the operation of the circuit module 150. When the temperature of the electronic component 154 exceeds the boiling point of the working fluid 155 due to the operation of the electronic component 154, the working fluid 155 evaporates. At this time, the working fluid 155 takes heat from the electronic component 154 as indicated by the arrow in FIG4, and the electronic component 154 is cooled.

The evaporated working liquid 155 is cooled when it contacts the third main surface 152a and the side surface 153a, and as shown in FIG5, the liquid returns to the third main surface 152a and the side surface 153a. At this time, the heat of the working liquid 155 is dissipated from the second substrate 152 as shown by the arrows. Thereafter, the working liquid 155 circulates between the liquid and the gas by repeating the above-mentioned actions, and continuously cools the electronic component 154.

The circuit module 150 operates as described above. As the working fluid 155 circulates between the liquid and the gas as described above, the sealed space R functions as a heat pipe, and the electronic component 154 can be efficiently cooled, so the circuit module 150 is excellent in heat dissipation. In addition, the structure of connecting two substrates using an interposer is suitable for miniaturization of the information processing device, but the circuit module 150 uses this structure as a heat dissipation structure. Since no heat dissipation structure is provided separately, the circuit module 150 is suitable for miniaturization of the information processing device 100.

FIG6 is a schematic diagram showing the structure of a circuit module 250 of a comparative example. As shown in the figure, the circuit module 250 includes a first substrate 251, a second substrate 252, a connection portion 253, an electronic component 254, and a heat dissipation gel 255. In order to utilize this structure to dissipate the heat of the electronic component 254 from the second substrate 252, in the manufacturing process, as shown by the arrow, it is necessary to press the second substrate 252 toward the first substrate 251 so that the heat dissipation gel 255 is in close contact with the second substrate 252. However, the burden on the equipment is large in the process of pressing the second substrate 252. On the other hand, in the structure of the circuit module 150, it is sufficient to inject the working fluid 155 into the internal space R without load, and the burden on the equipment is small.

The circuit module 150 may also include an insulating layer. FIG. 7 is a cross-sectional view of the circuit module 150 including the insulating layer 156. As shown in the figure, the insulating layer 156 covers the inner peripheral surface of the sealed space R, that is, the first main surface 151a, the third main surface 152a, the side surface 153a, and the surface of the electronic component 154. The insulating layer 156 is made of, for example, fluororesin. By providing the insulating layer 156, the working fluid 155 is prevented from contacting each part, so that a short circuit caused by the working fluid 155 does not occur, and a conductive liquid can be used as the working fluid 155. On the other hand, when an insulating liquid is used as the working fluid 155, the insulating layer 156 may not be provided.

[Heat dissipation structure of information processing device 2]

8 is a cross-sectional view of a circuit module 160 included in the information processing device 100. As shown in the figure, the circuit module 160 includes a substrate 161, an electronic component 162, a thermally conductive gel 163, a shield 164, a frame 165, and a thermally conductive sheet 166. As shown in FIG8 , the circuit module 160 can be arranged on the back side of the display panel 110 in the information processing device 100.

The substrate 161 is a circuit substrate on which various components are mounted, such as a printed wiring board. The electronic component 162 is any electronic component mounted on the substrate 161 and includes a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a SoC (System on a Chip), or other ICs (Integrated Circuits).

The thermally conductive gel 163 is disposed between the electronic component 162 and the shield 164 to transfer the heat of the electronic component 162 to the shield 164. The shield 164 covers the electronic component 162 to shield the radio waves emitted from the electronic component 162 and the radio waves incident from the outside to the electronic component 162. The shield 164 is made of metal such as aluminum.

The frame 165 is a component of the housing 120 of the information processing device 100, and is sometimes referred to as a cover main. The frame 165 is made of a metal such as aluminum and has an opening 165a. The heat conducting sheet 166 transfers heat along the sheet surface. The heat conducting sheet 166 is made of a material with high thermal conductivity such as graphite. As shown in FIG. 8 , the shielding member 164 is in contact with the heat conducting sheet 166 via the opening 165a. Hereinafter, the thickness of the circuit module 160 is set to be a thickness D1.

In the circuit module 160, when the electronic component 162 generates heat due to the operation of the electronic component 162, the heat of the electronic component 162 is transferred to the shield 164 via the thermally conductive gel 163, and then transferred from the shield 164 to the thermally conductive sheet 166. The heat is then transferred from the thermally conductive sheet 166 to the frame 165, and then dissipated from the thermally conductive sheet 166 and the frame 165.

FIG9 is a schematic diagram showing the structure of a circuit module 260 of a comparative example. As shown in the figure, the circuit module 260 includes a substrate 261, an electronic component 262, a first thermally conductive gel 263, a shield 264, a second thermally conductive gel 265, a frame 266, and a thermally conductive sheet 267. As shown in FIG9, the circuit module 260 can be arranged on the back side of the display panel 210. The electronic component 262 mounted on the substrate 261 is bonded to the shield 264 via the first thermally conductive gel 263. In the circuit module 260, no opening is provided in the frame 266, and the shield 264 is bonded to the frame 266 via the second thermally conductive gel 265. Hereinafter, the thickness of the circuit module 260 is referred to as thickness D2.

In this structure, when the electronic component 262 generates heat due to the operation of the electronic component 262, the heat of the electronic component 262 is transferred to the shield 264 via the first thermally conductive gel 263, and is transferred to the frame 266 via the second thermally conductive gel 265. The heat is then transferred from the frame 266 to the thermally conductive sheet 267, and is dissipated from the frame 266 and the thermally conductive sheet 267.

When comparing the circuit module 160 with the circuit module 260, in the circuit module 160, the frame 165 is provided with an opening 165a, and the shielding member 164 directly contacts the heat conducting sheet 166. Therefore, compared with the circuit module 260, the thickness of the frame 266 is reduced, and the thickness D1 is smaller than the thickness D2. Therefore, the circuit module 160 can be made thinner while maintaining the heat dissipation performance.

In addition, the circuit module 160 can also be configured as follows. FIG. 10 is a cross-sectional view of a circuit module 160 having another configuration. As shown in the figure, the circuit module 160 can also include a first thermally conductive gel 167 and a second thermally conductive gel 168 instead of the thermally conductive gel 163. The first thermally conductive gel 167 is disposed between the electronic component 162 and the shield 164, and the second thermally conductive gel 168 is disposed between the shield 164 and the thermally conductive sheet 166. In this configuration as well, the thickness of the frame 266 is reduced relative to the circuit module 260, so that the circuit module 160 can be made thinner and lighter.

[Heat dissipation structure of information processing device 3]

11 is a cross-sectional view of a circuit module 170 included in the information processing device 100. As shown in the figure, the circuit module 170 includes a substrate 171, an electronic component 172, a frame 173, a carbon nanotube component 174, and a heat conductive sheet 175. The circuit module 170 can be arranged on the back surface 100b (see FIG. 1 ) side in the information processing device 100.

The substrate 171 is a circuit substrate on which various components are mounted, such as a printed wiring substrate. The electronic component 172 is any electronic component mounted on the substrate 171 and includes a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a SoC (System on a Chip) or other ICs (Integrated Circuits). The frame 173 is a component constituting the housing 120 of the information processing device 100 and is made of resin.

The carbon nanotube component 174 is a component composed of multiple layers of carbon nanotubes and has rubber-like elasticity. As shown in FIG. 11 , the carbon nanotube component 174 has a convex shape protruding toward the electronic component 172. In addition, the shape of the carbon nanotube component 174 is not limited to this, and it can also be a flat plate. The carbon nanotube component 174 is joined to the frame 173 by insert molding. In addition, the carbon nanotube component 174 can also be joined to the frame 173 by an adhesive or the like.

The heat conducting sheet 175 transfers heat along the sheet surface. The heat conducting sheet 175 is made of a material with high thermal conductivity such as graphite. In the circuit module 170, the substrate 171 is fixed in a state of being pressed against the frame 173, and the electronic component 172 is pressed against the carbon nanotube component 174. The carbon nanotube component 174 has rubber-like elasticity, so it is tightly attached to the electronic component 172 while being slightly deformed.

In the circuit module 170 , when the electronic component 172 generates heat due to the operation of the electronic component 172 , the heat of the electronic component 172 is transferred to the heat conductive sheet 175 via the carbon nanotube member 174 , and is dissipated from the heat conductive sheet 175 .

FIG12 is a schematic diagram showing the structure of a circuit module 270 of a comparative example. As shown in the figure, the circuit module 270 includes a substrate 271, an electronic component 272, a frame 273, a metal component 274, a thermally conductive gel 275, and a thermally conductive sheet 276. The metal component 274 is joined to the frame 273 by insert molding or the like. The thermally conductive gel 275 is disposed between the electronic component 272 and the metal component 274 to transfer the heat of the electronic component 272 to the metal component 274.

In the circuit module 270, in order to fully transfer the heat of the electronic component 272 to the metal component 274, it is necessary to arrange the thermal conductive gel 275 between the electronic component 272 and the metal component 274. On the other hand, in the circuit module 170, the carbon nanotube component 174 is used, so that the heat of the electronic component 172 can be directly transferred to the carbon nanotube component 174, and there is no need to arrange the thermal conductive gel or the like therebetween. Therefore, the circuit module 170 is excellent in productivity and has high heat dissipation.

[About information processing devices]

The information processing device 100 may include at least one of the above-mentioned “heat dissipation structure 1 ”, “heat dissipation structure 2 ”, and “heat dissipation structure 3 ”. The information processing device 100 is not limited to a smartphone, and various information processing devices may be adopted.

[About this disclosure]

The effects described in the present disclosure are merely illustrative and are not limited thereto. In addition, other effects may also exist. The description of the above-mentioned multiple effects does not mean that these effects must be exerted simultaneously. It means that at least any one of the above-mentioned effects can be obtained according to conditions, etc., and it is also possible to exert effects not described in the present disclosure. In addition, at least two of the characteristic parts described in the present disclosure may be combined.

Furthermore, the present technology can adopt the following structures.

(1)

An information processing device, comprising:

a first substrate;

A second substrate, opposite to the first substrate;

A connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and seals the space between the first substrate and the second substrate;

an electronic component mounted on the first substrate or the second substrate and located in the space; and

The working fluid is sealed in the space and evaporates due to heat generated by the electronic components.

(2)

The information processing device according to (1) above, wherein:

The above-mentioned electronic component is an IC (Integrated Circuit).

(3)

The information processing device according to (1) or (2) above, wherein:

The boiling point of the working fluid is 80° C. or higher and 120° C. or lower.

(4) An information processing device according to any one of (1) to (3) above, wherein:

The above working fluid is an insulating liquid.

(5)

The information processing device according to any one of (1) to (4) above, wherein:

The above working fluid is pure water.

(6)

The information processing device according to any one of (1) to (4) above, wherein:

The above working fluid is mineral oil.

(7)

The information processing device according to any one of (1) to (6) above, wherein:

An insulating layer is further provided, the insulating layer covering the inner peripheral surface of the space and the surface of the electronic component.

(8)

The information processing device according to any one of (1) to (7) above, wherein:

The connecting portion is an interposer.

(9)

The information processing device according to any one of (1) to (8) above, wherein:

The connecting portion is welded to the first substrate and the second substrate.

The connecting portion is welded to the first substrate and the second substrate.

(10)

A circuit module, comprising:

a first substrate;

A second substrate, opposite to the first substrate;

A connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and seals the space between the first substrate and the second substrate;

an electronic component mounted on the first substrate or the second substrate and located in the space; and

The working fluid is sealed in the space and evaporates due to heat generated by the electronic components.

Description of Reference Numerals

100…information processing device; 110…display panel; 120…housing; 150, 160, 170…circuit module; 151…first substrate; 152…second substrate; 153…connecting portion; 154, 162, 172…electronic component; 155…working fluid; 161, 171…substrate; 163…thermal conductive gel; 164…shielding member; 165, 173…frame; 166, 175…thermal conductive sheet; 167…first thermal conductive gel; 168…second thermal conductive gel; 174…carbon nanotube component.

Claims (10)

1. An information processing device, comprising: a first substrate; a second substrate, opposite to the first substrate; a connecting portion, disposed between the first substrate and the second substrate, electrically connecting the first substrate and the second substrate and sealing a space between the first substrate and the second substrate; an electronic component mounted on the first substrate or the second substrate and located in the space; and The working fluid is sealed in the space and evaporates due to heat generated by the electronic component. 2. The information processing device according to claim 1, wherein: The electronic component is an IC (Integrated Circuit). 3. The information processing device according to claim 1, wherein: The working fluid has a boiling point of 80° C. or higher and 120° C. or lower. 4. The information processing device according to claim 1, wherein: The working fluid is an insulating liquid. 5. The information processing device according to claim 4, wherein: The working fluid is pure water. 6. The information processing device according to claim 4, wherein: The working fluid is mineral oil. 7. The information processing device according to claim 1, wherein: The information processing device further includes an insulating layer covering an inner peripheral surface of the space and a surface of the electronic component. 8. The information processing device according to claim 1, wherein: The connecting portion is an interposer. 9. The information processing device according to claim 1, wherein: The connecting portion is welded to the first substrate and the second substrate. 10. A circuit module, comprising: a first substrate; a second substrate, opposite to the first substrate; a connecting portion, disposed between the first substrate and the second substrate, electrically connecting the first substrate and the second substrate and sealing a space between the first substrate and the second substrate; an electronic component mounted on the first substrate or the second substrate and located in the space; and The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.